RESIN-SEALED IN-VEHICLE ELECTRONIC CONTROL DEVICE
By integrating through holes or cut-out portions in the connector housing for continuous resin filling, the device addresses thermal expansion issues, ensuring secure and cost-effective fixation of the housing and resin, enhancing durability and resistance to environmental stresses.
Patent Information
- Application Number
- DE112019001686
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2018-07-05
- Filing Date
- 2019-06-11
- Publication Date
- 2025-07-31
- Estimated Expiration
- 2039-06-11
AI Technical Summary
The thermal expansion mismatch between the connector housing and sealing resin in existing resin-sealed in-vehicle electronic control devices leads to peeling and separation at their interface during cooling, compromising the secure fastening of these components.
The resin-sealed in-vehicle electronic control device employs a connector housing with through holes or cut-out portions designed to allow continuous filling by a sealing resin, ensuring balanced stress distribution and secure fixation without additional elements, using materials with compatible thermal expansion coefficients.
This configuration securely fastens the connector housing and sealing resin, maintaining a stable connection over time while reducing manufacturing costs and enhancing resistance to vibration and shock.
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Abstract
Description
Technical area
[0001] The present invention relates to a resin-sealed in-vehicle electronic control device. Technical background
[0002] Regarding an electronic control unit mounted in a passenger compartment of a vehicle, such as an engine control unit or an automatic transmission control unit, the installation location has changed so that the electronic control unit is installed in an engine compartment, on an engine, in a transmission, or the like, and the electronic control unit itself has been downsized. Accordingly, the heat generation rate per unit volume increases, so it is exposed to higher temperature environments, and the requirements for vibration and shock resistance are increasing.
[0003] To meet such requirements, for example, a technique is disclosed in which a connector housing connecting a circuit board on which an electronic component is mounted to an external terminal is integrally sealed with a resin (see, for example, PTL 1). According to such a technique, since the circuit board and the like are sealed with the resin, there is an advantageous effect of heat resistance, vibration resistance, and shock resistance. PTL 2 describes a connector with at least one metal contact that is connected to an electronic component located on a circuit board encapsulated with ceramic or resin. The circuit board and the connector are electrically connected via a metal wire or a flexible cable. The electrical connection can be sealed by integral overmolding with a resin material with low thermal expansion and moisture absorption, thus simultaneously sealing the connection surface of the connector with the circuit board and the electronic components. PTL 3 describes a method for manufacturing a housing module in which a connector and a circuit board are bonded and integrated with a molded resin.
[0004] PTL 4 describes an electrical control unit exposed to high temperatures, such as engine control units in a vehicle or automatic transmission controllers. This is encapsulated with resin. List of citationsPatent literature PTL 1: WO 2005 / 004563 A PTL 2: JP 2004 / 111435 A PTL 3: JP 2010 / 98097 A PTL 4: JP 2019 / 41010 A Summary of the inventionTechnical problem
[0005] However, in the prior art described above, the thermal expansion of a resin used for a connector housing is greatly different from that of a sealing resin. As a result, there is a concern that the connector housing and the sealing resin may peel off at an interface therebetween during cooling after molding, and may separate from each other according to the progress of the peeling.
[0006] Based on the circumstances described above, it is an object of the present invention to provide a resin-sealed in-vehicle electronic control device having a simple configuration for securely fixing the connector housing and the sealing resin. Solution to the problem
[0007] The present invention is defined by the appended claims. In the following, portions of the description and drawings that refer to prior embodiments and do not necessarily include all features for implementing embodiments of the claimed invention are to be understood as not representing embodiments of the invention, but rather as examples that facilitate understanding of embodiments of the invention.
[0008] In this specification, the term "external terminal" refers to a terminal of a device other than the resin-sealed in-vehicle electronic control device, which is to be electrically connected to a metal terminal provided in the connector housing. Furthermore, the term "substantially "L" shape" is a concept that includes, for example, a substantially "T" shape in which the substantially "L" shape is partially incorporated. Advantageous effects of the invention
[0009] According to the present invention, a resin-sealed in-vehicle electronic control device having a simple configuration for securely fixing a connector housing and a sealing resin can be provided. Brief description of the drawings Fig. 1 is a schematic cross-sectional view illustrating a first embodiment of the present invention. Fig. 2 illustrates modified examples according to Fig. 1, where Fig. 2(a) illustrates a first modified example and Fig. 2(b) illustrates a second modified example. Fig. 3 is an enlarged schematic diagram showing a main part according to Fig. 1, where Fig. 3(a) is a projection view of a connector housing and Fig. 3(b) illustrates a connected state between the connector housing and a sealing resin. Fig. 4 is a schematic cross-sectional view showing an example of a method for forming a resin-sealed in-vehicle electronic control device according to Fig. 1, where Fig. 4(a) illustrates a state before filling the sealing resin, Fig. 4(b) illustrates a state after filling the sealing resin and Fig. 4(c) illustrates a state after releasing the mold. Fig. Fig. 5 is an enlarged schematic view illustrating a main part in a second embodiment of the present invention, wherein Fig. 5(a) is a projection view of a connector housing and Fig. 5(b) illustrates a connected state between the connector housing and a sealing resin. Fig. Fig. 6 is an enlarged schematic view illustrating a main part in a third embodiment of the present invention, wherein Fig. 6(a) is a projection view of a connector housing and Fig. 6(b) illustrates a connected state between the connector housing and a sealing resin. Fig. Fig. 7 is an enlarged schematic view showing a main part in a modified example of Fig. 6 illustrates, where Fig. 7(a) is a projection view of a connector housing and Fig. 7(b) illustrates a connected state between the connector housing and a sealing resin. Fig. Fig. 8 is an enlarged schematic view illustrating a main part in a fourth embodiment of the present invention, wherein Fig. 8(a) is a projection view of a connector housing and Fig. 8(b) illustrates a connected state between the connector housing and a sealing resin. Fig. 9 is a schematic cross-sectional view illustrating a fifth embodiment of the present invention. Description of the embodiments
[0010] The resin-sealed in-vehicle electronic control device is a resin-sealed in-vehicle electronic control device that includes a circuit board on which an electronic component is mounted, a connector housing that electrically connects the circuit board to an external terminal, and a sealing resin that fixes the connector housing to the circuit board. The connector housing has a through-hole and / or a cutout portion that enables connection between a second end surface opposite a first end surface on which the external terminal is mounted and a side surface of the connector housing adjacent to the second end surface.The sealing resin is continuous to fill at least the inside of the through-hole and / or the cut-out portion and to cover a part of an outer periphery of the connector housing and at least a part of an outer periphery of the circuit board.
[0011] In the following, first to fifth embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited only to the embodiments described based on the drawings. [First embodiment]
[0012] Fig. 1 is a schematic cross-sectional view illustrating a first embodiment of the present invention. As shown in Fig. 1, the resin-sealed in-vehicle electronic control device 1 mainly includes a circuit board 11, a connector housing 21, and a sealing resin 41.
[0013] The circuit board 11 has an electronic component mounted thereon. As shown in Fig. 1, for example, on the circuit board 11, the electronic components 111 including heat-generating electronic components such as a capacitor and a resistor are connected to both surfaces of a substrate 110 by soldering or the like, with metal terminals 31 being provided for connection to external terminals not shown. In addition, as shown in FIGS. Fig. 2(a) and Fig. 2(b), a metal base 112 for heat dissipation may be attached to the circuit board 11 via a thermally conductive spacer 113. As the metal base 112, a metal base 1121 with heat dissipation fins in Fig. 2(a), while a flat metal base 1122 in Fig. 2(b).
[0014] The connector housing 21 electrically connects the circuit board 11 to the external terminals. As shown in Fig. 1, the connector housing 21 has the metal terminals 31 in an opening c thereof, and the above-described circuit board 11 is connected to the metal terminals 31. As the connector housing 21, for example, both a surface mount type connector housing (not shown) or the like and the connector housing 21 which is a terminal pin insertion type as shown in FIGS. Fig. 2(a) and Fig. 2(b) may be applied.
[0015] The connector housing 21 of the resin-sealed in-vehicle electronic control device 1 has a through-hole 213 in a substantially "L" shape, which enables communication between a second end surface located opposite a first end surface on which the external terminals are mounted, and a side surface of the connector housing adjacent to the second end surface. Specifically, the through-hole 213 can be assumed to be each of a plurality of holes 213a and a corresponding one of a plurality of holes 213b communicating with each other, as shown in FIG. Fig. 3(a), the holes 213a extend from each of the first to fourth side surfaces 212a to 212d toward an opposite side surface thereof in parallel with a second end surface 211b while being opened in each of the first to fourth side surfaces 212a to 212d, while the holes 213b extend from the second end surface 211b toward a first end surface 211a in parallel with each of the first to fourth side surfaces 212a to 212d while being opened in the second end surface 211b.
[0016] Here, it is estimated that the connector housing 21 and the sealing resin 41 have a shrinkage of no more than about 1 mm. Accordingly, the through-hole 213 preferably has a size of 1 mm or more in both width and height (depth). This value differs significantly from a surface roughness of the connector housing 21, that is, from several µm to several tens of µm.
[0017] The through holes 213 in the connector housing 21 are preferably arranged so that they are vertically and horizontally symmetrical when viewed from above the second end face 211b (see a right-hand side view in Fig. 3(a)). Consequently, stress generated in each through-hole 213 can be fully balanced and the shape can be stably maintained for a long period of time.
[0018] As a method for forming the through holes 213 in the substantially "L" shape, for example, it can be assumed that when the connector housing 21 is molded by a halved mold or the like, movable pins that move in association with the mold are arranged in advance in the mold so as to correspond to the respective through holes (e.g., two movable pins / through hole for the through holes in the present embodiment), and the movable pins are pulled out from the respective holes 213a and 213b of the connector housing 21 immediately before releasing the mold.
[0019] A material for forming the connector housing 21 is not particularly limited, but the connector housing 21 is preferably formed of a material having flexibility and heat resistance to promote manufacturing and allow deformation when the external terminals are connected to the connector housing 21. Examples of preferred materials for forming the connector housing 21 include thermoplastic resins such as polybutylene terephthalate (PBT), nylon 6,6 (PA66), and polyphenylene sulfide (PPS).
[0020] The sealing resin 41 is a member that fixes the connector housing 21 to the circuit board 11. The sealing resin 41 is continuous to fill at least the inside of the through holes and to cover a part of the outer periphery of the connector housing and at least a part of the outer periphery of the circuit board. As shown in Fig. 3(b), in the present embodiment, the sealing resin 41 is formed as a single member which is continuous to fill the interior of all of the through-holes 213 in the substantially "L" shape and to cover a part of the outer periphery of the connector housing 21 and the entire outer periphery of the circuit board (not shown), thereby fixing the connector housing 21 to the circuit board 11.
[0021] A material for forming the sealing resin 41 is not particularly limited as long as the effect of the present invention is not impaired, but preferably has heat resistance, high thermal conductivity, vibration resistance, and shock resistance to promote heat dissipation from the electronic components 111 and reduce vibration or shock applied to the circuit board 11 and the connector housing 21. Examples of preferred materials for forming the sealing resin 41 include thermosetting resins such as an epoxy resin, a phenolic resin, an unsaturated polyester resin, a silicone resin, an acrylic resin, and a methacrylic resin.
[0022] Preferably, the above-described connector housing 21 has a larger linear expansion coefficient than the sealing resin 41. By using an epoxy resin as a material for the sealing resin 41 and polybutylene terephthalate or nylon 66 as a material for the connector housing, for example, the linear expansion coefficient (about 20 × 10 -6 up to 120 × 10 -6 (1 / K)) of the connector housing 21 should be set to be larger than the linear expansion coefficient (about 15 × 10 -6 (1 / K)) of the sealing resin 41. This makes it easier for the connector housing 21 than for the sealing resin 41 to shrink at the time of cooling of the sealing resin 41 when the resin-sealed in-vehicle electronic control device 1 is manufactured, and thus the connector housing 21 and the sealing resin 41 can further firmly adhere to each other in a firm manner.
[0023] Next, a method of forming the resin-sealed in-vehicle electronic control device 1 will be described.
[0024] Fig. 4 is a schematic cross-sectional view showing an example of a method for forming the resin-sealed in-vehicle electronic control device 1 according to Fig. 1. For the resin-sealed in-vehicle electronic control device 1, first, the printed circuit board 11 to which the electronic components 111 are connected by soldering is used, and the metal terminals 31 of the connector housing 21 are connected to the printed circuit board 11 by soldering.
[0025] Then, after the circuit board 11 to which the connector housing 21 has been connected as described above has been placed between the molds 81 and 82 (see Fig. 4(a)), the molds 81 and 82 are closed and the sealing resin melted in advance is injected through a resin injection gate 83 into a space between the molds 81 and 82 (see Fig. 4(b)). Subsequently, the sealing resin 41 is cured, and then the molds 81 and 82 are opened to remove the molded product (see Fig. 4(c)), whereby the resin-sealed in-vehicle electronic control device 1 covered with the sealing resin 41 is obtained.
[0026] The thickness of the sealing resin 41 covering the outer periphery of the connector housing 21 is not particularly limited as long as the effect of the present invention is not impaired. For example, the thickness of the sealing resin 41 from a surface of the connector housing may be almost equal to the depth of the through holes.
[0027] As described above, because the resin-sealed in-vehicle electronic control device 1 has the above-described configuration, it is possible to securely fix the connector housing 21 and the sealing resin 41 to each other based on the simple configuration without adding any element. As a result, the cost of the resin-sealed in-vehicle electronic control device 1 in the vehicle can be reduced.
[0028] Additionally, in the present embodiment, the sealing resin 41 flowing into the through-hole 213 serves as one restriction point, and the metal terminal 31 penetrating the connector housing 21 and located in the sealing resin 41 serves as another restriction point. Consequently, when the resin of the connector housing shrinks between these restriction points, a tensile stress is generated in the connector housing 21 and a shrinkage stress is generated in the sealing resin 41, and these two stresses are balanced, thereby more firmly bonding the connector housing 21 and the sealing resin 41. [Second embodiment]
[0029] Fig. 5 is an enlarged schematic view illustrating a main part in a second embodiment of the present invention. The resin-sealed in-vehicle electronic control device 2 mainly includes a circuit board 11 (not shown), a connector housing 22, and a sealing resin 42. The resin-sealed in-vehicle electronic control device 2 differs from that in the first embodiment in the configurations of the connector housing 22 and the sealing resin 42. A configuration of the circuit board 11, the configurations other than the shapes of the through holes 223 of the connector housing 22 and the sealing resin 42, and a method for forming the resin-sealed in-vehicle electronic control device 2 are the same as those in the first embodiment.Consequently, the same elements are designated by the same reference numerals, and the description of the first embodiment is incorporated by reference thereto.
[0030] The connector housing 22 electrically connects the circuit board 11 to the external terminals. The connector housing 22 of the resin-sealed in-vehicle electronic control device 2 has the through-holes 223 in a substantially rectilinear shape, which enable connection between a second end surface and a side surface of the connector housing adjacent to the second end surface. As the through-hole 223, as shown in Fig. 5(a), specifically assume that each of the first to fourth side surfaces 222a to 222d has openings therein, and a second end surface 221b has a plurality of openings therein, wherein each of the openings in the first to fourth side surfaces 222a to 222d communicates with (passes through) a corresponding one of the openings in the second end surface 221b in a straight line.
[0031] As a method for forming the through holes 223 in the substantially rectilinear shape, for example, it can be assumed that when the connector housing 22 is formed by a mold or the like, movable pins are arranged in advance in the mold so as to correspond to the respective through holes 223 (e.g., one movable pin / through hole for the through holes in the present embodiment), and the movable pins are pulled out from the respective holes of the connector housing 22 immediately before releasing the mold.
[0032] The sealing resin 42 is a member that fixes the connector housing 22 to the circuit board 11. The sealing resin 42 is continuous to fill at least the inside of the through holes and to cover a part of an outer periphery of the connector housing and at least a part of an outer periphery of the circuit board. As shown in Fig. 5(b), in the present embodiment, the sealing resin 42 is formed as a single member which is continuous to fill the inside of all of the through-holes 223 in the substantially rectilinear shape and to cover a part of the outer periphery of the connector housing 22 and the entire outer periphery of the circuit board 11 (not shown), thereby fixing the connector housing 22 to the circuit board 11.
[0033] Because the resin-sealed in-vehicle electronic control device 2 has the above-described configuration, it is possible to securely fix the connector housing 22 and the sealing resin 42 to each other based on the simple configuration without adding any element as described above. Furthermore, because the through-hole 223 is in a substantially rectilinear shape, the flow of the resin is less likely to spread toward the movable pins at the time of forming the connector housing 22. Consequently, the connector housing 22 can be expected to be molded more accurately. [Third Embodiment]
[0034] Fig. 6 is an enlarged schematic view illustrating a main part in a third embodiment of the present invention. As in Fig. As illustrated in Fig. 6, the resin-sealed in-vehicle electronic control device 3 mainly includes a circuit board 11 (not shown), a connector housing 23, and a sealing resin 43. The resin-sealed in-vehicle electronic control device 3 differs from that in the first embodiment in the configurations of the connector housing 23 and the sealing resin 43. A configuration of the circuit board 11, the configurations other than the shapes of the cutout portions 233 of the connector housing 23 and the sealing resin 43, and a method of forming the resin-sealed in-vehicle electronic control device 3 are the same as those in the first embodiment. Therefore, the same elements are denoted by the same reference numerals, and the description of the first embodiment will be incorporated by reference thereto.
[0035] The connector housing 23 electrically connects the circuit board 11 to the external terminals. The connector housing 23 has cutout portions 233 that enable connection between a second end surface 231b, which is opposite to a first end surface 231a on which the external terminals are mounted, and a side surface 232 of the connector housing 23, which is adjacent to the second end surface 231b. As a shape of the cutout portion 233, for example, it can be specifically assumed that each cutout portion 233 is in a rectangular shape so as to be elongated in such a direction as to become deeper from the side surface 232 to which the cutout portion 233 belongs, as viewed from above the second end surface 231b. The direction in which the cut-out part 233 becomes deeper can be seen from above the second end face 231b (see a right-side view in Fig. 6(a)), perpendicular to the side surface 232 (see Fig. 6(a)). Alternatively, a direction in which at least one of a plurality of cut-out portions 233m belonging to a same side surface 232m with respect to a second end surface 231bm becomes deeper may be different from that in which another cut-out portion 233m of the plurality of cut-out portions 233m is viewed from above the second end surface 231bm (see a right-side view in Fig. 7(a)), becomes deeper (see the cut-out sections 233m in Fig. 7(a)). Among them are those in Fig. 7(a) are more preferable in that the sealing resin and the connector housing can be more securely fixed to each other.
[0036] In addition, in the present embodiment, the cutout portions 233 may be formed, for example, by arranging projections (not shown) corresponding to the respective cutout portions 233 in a mold for forming the connector housing 23.
[0037] The sealing resin 43 is a member that fixes the connector housing 23 to the circuit board 11. The sealing resin 43 is continuous so that it fills at least the inside of the cutout portions and covers a part of an outer periphery of the connector housing and at least a part of an outer periphery of the circuit board. As shown in Fig. 6(b), in the present embodiment, the sealing resin 43 is formed as a single member that is continuous to fill the inside of all of the cut-out portions 233 and cover a part of the outer periphery of the connector housing 23 and the entire outer periphery of the circuit board 11 (not shown), thereby fixing the connector housing 23 to the circuit board 11.
[0038] Because the resin-sealed in-vehicle electronic control device 3 has the above-described configuration, it is possible to securely fix the connector housing 23 and the sealing resin 43 to each other based on the simple configuration without adding any member as described above. [Fourth Embodiment]
[0039] Fig. 8 is an enlarged schematic view illustrating a main part in a fourth embodiment of the present invention. The resin-sealed in-vehicle electronic control device 4 mainly includes a circuit board 11 (not shown), a connector housing 24, and a sealing resin 44. The resin-sealed in-vehicle electronic control device 4 differs from that in the first embodiment in the configurations of the connector housing 24 and the sealing resin 44. A configuration of the circuit board 11, the configurations other than the shapes of the cutout portions 243 of the connector housing 24 and the sealing resin 44, and a method for forming the resin-sealed in-vehicle electronic control device 4 are the same as those in the first embodiment.Consequently, the same elements are designated by the same reference numerals, and the description of the first embodiment is incorporated by reference thereto.
[0040] The connector housing 24 electrically connects the circuit board 11 to the external terminals. The connector housing 24 has the cutout portions 243 that enable connection between a second end surface 241b, which is opposite to a first end surface 241a on which the external terminals are mounted, and a side surface 242 of the connector housing 24, which is adjacent to the second end surface 241b. Regarding a shape of the cutout portion 243, each of the cutout portions 243 is formed to have a shape in which a width of the cutout portion 243 on a side surface to which the cutout portion 243 belongs, as viewed from above the second end surface 241b (see a right-side view in Fig. 8(a)) is smaller than a maximum width in the cut-out portion 243. As the shape of the cut-out portion 243, for example, as shown in Fig. 8(a), it can be specifically assumed that the cut-out portion 243 has a width that gradually increases as viewed from above the second end surface 241b, as it is farther away from the side surface 242 to which the cut-out portion 243 belongs (a wedge shape).
[0041] In addition, in the present embodiment, the cutout portions 243 can be formed, for example, by arranging projections (not shown) corresponding to the respective cutout portions 243 in a mold for forming the connector housing 24, injecting a resin into the mold, and then drawing it out from the mold in a direction perpendicular to the second end surface 241b.
[0042] The sealing resin 44 is a member that fixes the connector housing 24 to the circuit board 11. The sealing resin 44 is continuous to fill at least the inside of the cutout portions 243 and to cover a part of an outer periphery of the connector housing 24 and at least a part of an outer periphery of the circuit board 11. As shown in Fig. 8(b), in the present embodiment, the sealing resin 44 is formed as a single member that is continuous to fill the inside of all of the cut-out portions 243 and cover a part of the outer periphery of the connector housing 24 and the entire outer periphery of the circuit board 11 (not shown), thereby fixing the connector housing 24 to the circuit board 11.
[0043] Because the resin-sealed in-vehicle electronic control device 4 has the above-described configuration, it is possible to securely fasten the connector housing 24 and the sealing resin 44 to each other based on the simple configuration without adding any element as described above. Furthermore, because the cutout portions 243 have the above-described configuration, the sealing resin 44 is difficult to leak from the cutout portions 243 even when the connector housing 24 shrinks, while the restriction points are stably maintained. Consequently, the connection between the connector housing 24 and the sealing resin 44 can be firmly maintained. [Fifth Embodiment]
[0044] Fig. 9 is a schematic cross-sectional view illustrating a fifth embodiment of the present invention. As shown in Fig. As illustrated in FIG. 9, the resin-sealed in-vehicle electronic control device 5 mainly includes a circuit board 11, a connector housing 21, a sealing resin 41, and an elastic member 55. The resin-sealed in-vehicle electronic control device 5 differs from that in the first embodiment in that the elastic member 55 is included. The configurations of the circuit board 11, the connector housing 21, and the sealing resin 41, and a method for forming the resin-sealed in-vehicle electronic control device 5 are the same as those in the first embodiment. Therefore, the same elements are denoted by the same reference numerals, and the description of the first embodiment is incorporated by reference thereto.
[0045] The elastic member 55 covers at least a part of an outwardly exposed portion at a boundary between the connector housing and the sealing resin. As shown in Fig. 9, the elastic member 55 may be specifically provided, for example, to firmly adhere to both the connector housing 21 and the sealing resin 41 and completely cover an outwardly facing portion (the outwardly exposed portion 75) of the boundary.
[0046] As a material for forming the elastic member 55, a material having excellent adhesion to the connector housing 21 and the sealing resin 41 is preferred. Examples of the elastic member 55 include low-elasticity members such as silicone rubber.
[0047] Because the resin-sealed in-vehicle electronic control device 5 has the above-described configuration, it is possible to securely fix the connector housing 21 and the sealing resin 41 to each other based on the simple configuration without adding any element as described above. Furthermore, because the boundary is covered by the elastic member 55, it is possible to improve the sealability, for example, to prevent a gap at the boundary and to prevent moisture from entering the interior of the device even when the connector housing 21 and the sealing resin 41 are peeled off. In addition, because the elastic member 55 is included, it is possible to suppress excessive concentration of stress in the through-holes 213, for example, when an external terminal is connected to the connector housing 21. As a result, it is possible to prevent the connector housing 21 from being damaged.
[0048] The present invention is not limited to the configurations of the embodiments described above, but is intended to cover all changes that fall within the spirit and scope of the invention as defined in the claims.
[0049] For example, in the above-described embodiments, it has been described that each of the resin-sealed in-vehicle electronic control devices 1 to 5 includes either the through-holes 213 or 223 or the cut-out portions 233 or 243, but the resin-sealed in-vehicle electronic control device may include both the through-holes and the cut-out portions in a mixed manner.
[0050] In addition, in the fifth embodiment, it has been described that the elastic member 55 completely covers the outwardly facing portion (outwardly exposed portion 75) at the boundary between the connector housing 21 and the sealing resin 41 in the resin-sealed in-vehicle electronic control device 5, but the elastic member 55 may partially cover the outwardly facing portion at the boundary in the resin-sealed in-vehicle electronic control device. List of reference symbols 1 to 5 resin-sealed in-vehicle electronic control devices 11 Circuit board 21 to 24 connector housings 41 to 44 sealing resin 211a to 241a first end face 211b to 241b second end face 213, 223 through hole 233, 243 cut-out section
Claims
[1] Resin-sealed in-vehicle electronic control device (1) comprising: a circuit board (11) on which an electronic component is mounted; a connector housing (21) electrically connecting the circuit board (11) to an external terminal; and a sealing resin (41) which fixes the connector housing (21) to the circuit board (11), where the connector housing (21) has a cut-out portion (243) which enables the connection between a second end face (211b) located opposite a first end face (211a) on which the external terminal is mounted and a side face of the connector housing (21) adjacent to the second end face (211b), and the sealing resin (41) is continuous to fill at least the inside of the cut-out portion (243) and to cover a part of an outer periphery of the connector housing (21) and at least a part of an outer periphery of the circuit board (11), characterized in that that the cut-out portion (243) has a shape in which a width of the cut-out portion (243) on the side surface, viewed from the second end surface (211b), is smaller than a maximum width in the cut-out portion (243). [2] The resin-sealed in-vehicle electronic control device (1) according to claim 1, wherein the connector housing (21) has a linear expansion coefficient larger than that of the sealing resin (41). [3] The resin-sealed in-vehicle electronic control device (1) according to claim 1 or 2, further comprising an elastic member covering at least a part of an externally exposed portion (75) at a boundary between the connector housing (21) and the sealing resin (41).
Citation Information
Patent Citations
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