Method for installing an image sensor in a camera

Abstract

An image sensor mounted on a printed circuit board is installed in a camera. A holder comprises a first rail with a first printed circuit board and a second rail with a second printed circuit board, and the holder is fixed to a lens mount of the camera. The holder can be attached to imperviously hold the image sensor, and the image sensor can be elastically supported while impervious. A gripper grasps the image sensor near the holder and aligns it to an oriented position relative to the lens mount. The image sensor can be moved into the oriented position after an image has been directed to the image sensor to generate a processed image for determining relative orientation.The printed image sensor board is soldered or glued to the first and / or second printed circuit board in such a way that the holder holds the image sensor securely, so that the holder is immovable in its aligned position.

Description

BACKGROUND OF THE INVENTION 1. Field of the invention

[0001] The present invention relates to image sensor technology and in particular to a method for installing an image sensor in a camera. 2. Description of the state of the art

[0002] Digital cameras have a lens in front of an image sensor. The lens is typically mounted on a lens mount, and the image sensor is attached to the lens mount. Correctly focused images are obtained from the image sensor when the image sensor is properly aligned with the lens. The alignment of the image sensor ensures that the lens and the image sensor are parallel to each other and at a predefined distance. Typically, the image sensor is also rotatably aligned with the lens mount so that the top and bottom surfaces of the image sensor and the lens mount lie in the same plane.

[0003] Image sensor alignment is typically achieved by manufacturing various components within their specified tolerances. However, the combination of multiple manufacturing tolerances associated with several assembled components limits the precision with which image sensor alignment can be achieved.

[0004] Some cameras contain one or more threaded screws with coil springs for adjusting the position of an image sensor relative to the lens mount. However, a combination of screws and springs is mechanically complex, cumbersome to adjust manually, limited in precision by the thread size of the screws, and prone to misalignment over time.

[0005] Some cameras use shims of varying thicknesses to adjust the position of the image sensor relative to the lens mount. However, the use of shims limits the number of fixed positions to the available shim thicknesses, selecting the appropriate thickness is cumbersome, and maintaining a large inventory of shims of different thicknesses increases costs.

[0006] To ensure the proper functioning of electronic components in digital cameras, various forms of cooling and other thermal management techniques are employed. These techniques include the use of heat sinks in a suitable arrangement with the electronic components. However, the conventional use of heat sinks can cause the electronic circuits inside a digital camera to become misshapen.

[0007] From JP 2007 - 4 068 A, a method is known for soldering a printed circuit board (PCB) to a metal support element. This requires a large amount of heat over a prolonged period. Such higher heat energy over a longer period leads to a greater risk of heat damage to the PCB and its components. This negatively impacts the longevity and reliability of sensitive electronic components, especially if a PCB has to be soldered and desoldered multiple times during its service life (e.g., for repairs, maintenance, modifications, etc.).

[0008] From DE 11 2010 005 629 B4, a method is known by which a base substrate (for example, a printed circuit board) with a gasket can be glued, welded, or soldered to a metal mounting post. However, welding or soldering the base substrate with the elastic gasket to the mounting post, when the elastic gasket is located between the base substrate and a lens holder subassembly, carries the significant risk that the elastic gasket will be destroyed due to the high heat, or carries the significant risk that the elastic gasket must be made of a special and / or expensive material that can withstand the high heat during welding or soldering.

[0009] From DE 102014019007 A1 a camera system with a modular printed circuit board arrangement is known in which a standardized family of parts is provided in order to minimize the risk of malfunctions and reduce the cost of manufacturing the camera system.

[0010] One object of the invention is to remedy the aforementioned defects.

[0011] The problem is solved according to the invention by the characterizing part of claim 1. SUMMARY

[0012] The above shortcomings can be overcome by providing a camera according to one aspect of the invention. The camera comprises: (a) a lens mount; (b) an image sensor for capturing images; and (c) a mount for holding the image sensor, wherein the mount is configured such that it can be actuated to hold the image sensor captive, so that the image sensor is movable relative to the lens mount in the direction of an aligned position of the image sensor, and is configured such that it can be actuated to hold the image sensor firmly in the aligned position, so that the image sensor is not movable relative to the lens mount.

[0013] The holder can be operated to securely hold the image sensor when the image sensor is not attached to the holder, and to secure the image sensor when the image sensor is attached to the holder. The holder can be detachably attached to the lens mount. The image sensor can be detachably attached to the holder. The image sensor can be detachably attached to the holder by soldering. The image sensor can be detachably attached to the holder by adhesive. The camera can also have a holder for elastic support of the image sensor when the image sensor is held detachably by the holder. The holder can be made of an elastic material. The holder can seal the image sensor against the ingress of dust. The holder can be made of a foam material. The holder can be made of a rubber material.The holder can comprise a first and a second rail, which can be detachably attached to the lens mount on opposite sides of the lens mount. The holder can be operated to provide an electrical ground path between the image sensor and the lens mount. The electrical ground path can be dimensioned to allow for soldering when the image sensor is held securely by the holder. The image sensor can be moved into an aligned position relative to the lens mount when it is held captive by the holder. The image sensor can be robotically moved into the aligned position.

[0014] According to a further aspect of the invention, a camera is provided. The camera comprises: (a) a detection device for capturing images; (b) a lens holding device for directing light to the detection device; and (c) a holding device for holding the detection device, wherein the holding device is configured such that it can be actuated to hold the detection device captive, so that the detection device is movable relative to the lens holding device, and is configured such that it can be actuated to hold the detection device in place, so that the detection device is immovable relative to the lens holding device.

[0015] The camera may also include a support device for elastically supporting the detection device if the detection device is held captive by the holding device.

[0016] According to a further aspect of the invention, a camera is provided. The camera comprises: (a) a lens mount; (b) an image sensor for capturing images; and (c) a holder for holding the image sensor, wherein the holder is capable of holding the image sensor securely, such that the image sensor is immovable in an aligned position relative to the lens mount after the image sensor has been aligned by gripping it.

[0017] The holder can be detachably attached to the lens mount. The image sensor can be detachably attached to the holder. The image sensor can be detachably attached to the holder by soldering. The image sensor can be detachably attached to the holder by adhesive. The holder can hold the image sensor permanently, allowing it to move relative to the lens mount when the image sensor is permanently attached and not fixed to the holder. The holder can be designed to hold the image sensor firmly in the aligned position when the image sensor is attached to the holder. The camera can also have a mount for elastically supporting the image sensor when the image sensor is permanently attached to the mount. The mount can be made of an elastic material. The mount can be made of a foam material. The mount can seal the image sensor against the ingress of dust.The mount can include a dust seal to protect the image sensor from dust ingress when the sensor is held by the mount. The dust seal can be made of an elastic material or a foam material. The mount can be a single piece. The mount can include a first and a second rail that can be detachably attached to the lens mount on opposite sides of the lens mount. The first and second rails can each contain a first or second printed circuit board. The image sensor can be attached to a printed circuit board. The image sensor can be soldered to the mount. The solder can extend between the printed circuit board and one or both of the first and second printed circuit boards. The printed circuit board can have a thickness chosen such that the solder thickness is less than or equal to 0.5 mm.The holder can be operated to provide an electrical ground path between the image sensor and the lens mount. This ground path can be dimensioned to allow soldering when the image sensor is held by the holder. The image sensor can be moved into an aligned position relative to the lens mount when gripped. The image sensor can also be moved into the aligned position robotically. The holder can securely hold the image sensor when it is not attached, and it can also secure the image sensor when it is attached. The dust seal can be operated to provide elastic support for the image sensor when it is securely held by the holder.

[0018] According to a further aspect of the invention, a camera is provided. The camera comprises: (a) a detection device for capturing images; (b) a lens holding device for directing light towards the detection device; and (c) a holding device for holding the detection device, wherein the holding device is configured such that it can be actuated to hold the detection device securely, so that the detection device is immobile relative to the lens holding device after the detection device has been aligned by gripping the detection device when the detection device is movable near the holding device.

[0019] According to a further aspect of the invention, a method for installing an image sensor in a camera is provided. The method comprises: (a) placing the image sensor on a lens mount of the camera; (b) attaching a holder to the lens mount to securely hold the image sensor in place, so that the image sensor is movable relative to the lens mount; (c) aligning the image sensor on the lens mount; and (d) securing the image sensor to the holder to hold it firmly in place, so that the image sensor is immovable relative to the lens mount.

[0020] Step (a) may involve supporting the image sensor with a spring-loaded mount on the lens mount. Supporting the image sensor with an elastic mount on the lens mount may involve attaching the elastic mount to the lens mount. Attaching the elastic mount to the lens mount may involve attaching the elastic mount made of an elastic material. Installing the elastic mount made of an elastic material may involve installing the elastic mount made of foam. Step (c) may involve generating an image by a pattern projector and directing the image onto the image sensor. Step (c) may involve processing the image by a camera processor connected to the image sensor to produce a processed image.Step (c) may involve determining the relative orientation of the image sensor to the lens mount based on the processed image. Determining the relative orientation of the image sensor to the lens mount based on the processed image may involve determining the relative orientation by the camera processor. Determining the relative orientation of the image sensor to the lens mount based on the processed image may involve determining the relative orientation by a second processor other than the camera processor. Step (c) may involve robotic movement of the image sensor. Robotic movement of the image sensor may involve grasping the image sensor between robotic fingers. Robotic movement of the image sensor may involve moving the image sensor to a new position calculated based on its relative orientation.

[0021] According to a further aspect of the invention, a method for installing an image sensor of a camera is provided. The method comprises: (a) attaching a holder to a lens mount of the camera, the holder being configured to be actuated to hold the image sensor; (b) grasping the image sensor near the holder by a gripper; (c) aligning the image sensor by the gripper into an aligned position relative to the lens mount; and (d) securing the image sensor to the holder to hold the image sensor firmly in place, so that the image sensor is not movable in the aligned position relative to the lens mount.

[0022] Step (a) may involve attaching the holder to hold the image sensor captive, so that the image sensor is movable relative to the lens mount. Step (a) may further involve attaching an elastic support to the lens mount to elastically support the image sensor when the image sensor is captive held by the holder. Step (b) may involve gripping the image sensor by gripping a circuit board to which the image sensor is attached. Step (c) may involve generating an image and directing the image onto the image sensor. Generating the image may involve generation by a pattern projector. Step (c) may involve generating a processed image by a camera processor in response to the image. Step (c) may involve processing the image by a camera processor connected to the image sensor to generate a processed image.Step (c) may involve determining the relative orientation of the image sensor to the lens mount in response to the processed image. Determining the relative orientation of the image sensor to the lens mount in response to the processed image may involve determining the relative orientation by the camera processor. Determining the relative orientation of the image sensor to the lens mount in response to the processed image may involve determining the relative orientation by a second processor other than the camera processor. Step (c) may involve moving the image sensor to a new position calculated in response to the relative orientation. Step (c) may involve moving the image sensor robotically. Robotic movement of the image sensor may involve grasping the image sensor between robotic fingers.The robotic movement of the image sensor may involve moving the image sensor to a new position calculated in response to the relative orientation. The method may further include attaching a lens to the lens mount. Step (c) may include determining the relative orientation as a function of the image quality of the processed image. Step (d) may include soldering the circuit board to at least one holder circuit board of the holder, if the at least one holder circuit board is attached to the lens mount. Step (d) may include gluing the circuit board to at least one holder circuit board of the holder, if the at least one holder circuit board is attached to the lens mount.Step (d) may involve soldering the circuit board to which the image sensor is attached to the first and second circuit boards of the holder, if the first and second circuit boards are attached to the lens mount on opposite sides of the lens mount. Step (d) may involve gluing the circuit board to which the image sensor is attached to the first and second circuit boards of the holder, if the first and second circuit boards are attached to the lens mount on opposite sides of the lens mount. Step (d) may further include soldering the circuit board after it has been glued in place. Step (a) may involve attaching the holder, which securely holds the image sensor, to the lens mount so that the image sensor is movable relative to the lens mount. Step (a) may involve supporting the image sensor on the lens mount by means of a spring-loaded support.Supporting the image sensor with an elastic mount on the lens mount can involve attaching the elastic mount to the lens mount. Attaching the elastic mount to the lens mount can involve attaching the elastic mount made of an elastic material. Installing the elastic mount made of an elastic material can involve installing the elastic mount made of foam.

[0023] According to a further aspect of the invention, a camera is provided. The camera comprises: (a) a first printed circuit board with a first circuit component; (b) a second printed circuit board; (c) a printed circuit board holder for holding the first and second printed circuit boards at a distance from each other and pivotably relative to each other; and (d) a housing for enclosing the first and second printed circuit boards and the printed circuit board holder, wherein the printed circuit board holder is dimensioned for attachment to the housing such that the first and second printed circuit boards are not aligned parallel to each other and the first circuit component is arranged in thermal contact with the housing.

[0024] The second printed circuit board (PCB) can contain a second circuit component. The second PCB can carry a second circuit component. The second circuit component can be thermally connected to the PCB holder if the second PCB is held by the PCB holder. The second circuit component can be thermally connected to the enclosure if the PCB holder is attached to the enclosure. The first and second circuit components can be thermally connected on opposite sides of the enclosure. The first PCB can contain a third circuit component. The first PCB can carry a third circuit component. The first and third circuit components can be located on opposite sides of the first PCB.The third circuit component can be in thermal contact with the PCB holder if the first PCB is held by the PCB holder. The first and second PCBs can be part of a single flexible printed circuit. The camera can include a backplane that is electrically connected to the first and second PCBs. Each of the first and second PCBs can be pivoted relative to the backplane. The backplane can comprise a first and a second backplane section. The camera can further include a first and a second external connector attached to the first and second backplane sections, respectively. The housing can have a first and a second opening sized to seal and receive the first and second external connectors, respectively. The PCB holder can comprise a first and a second PCB holder element.The camera may further include first and second elastic connectors for the detachable attachment of the first and second PCB holder elements to the backplane, allowing the first and second PCB holder elements to pivot relative to the backplane. The first PCB holder element may comprise a first plate and a first flange projecting from the first plate. The second PCB holder element may comprise a second plate and a second flange projecting from the second plate. The first and second plates may be detachably attached to the backplane. The first and second flanges may be dimensioned for mounting to the housing. The first and second flanges may be elastically displaceable relative to each other when the PCB holder is attached to the backplane and not to the housing.The first flange can be dimensioned for mounting to the housing on opposite sides of the housing. The first flange can have a loose-fit opening for mounting the first flange to the housing on one of the housing sides. The second flange can be dimensioned for mounting to the housing on one side of the housing. The loose-fit opening can be an open-end slot. The first and second PCB holder elements can be dimensioned to align the first and second PCBs parallel to opposite sides of the housing when the PCB holder is mounted to the housing.

[0025] According to a further aspect of the invention, a method for installing an image processing assembly of a camera with a housing is provided, the method comprising: (a) inserting the image processing assembly into the housing such that an external connection of the image processing assembly extends sealingly through an opening of the housing located at a first end of the housing; (b) displacing at least one of the first and second flanges of a printed circuit board holder of the image processing assembly relative to the other of the first and second flanges until the first and second printed circuit boards of the image processing assembly are not parallel to each other and a first circuit component supported by the first printed circuit board is brought into thermal communication with the housing; and (c) fastening the first and second flanges to the housing at a second end of the housing opposite the first end.

[0026] Step (a) may involve insertion such that a second external connection of the image processing assembly extends sealingly through a second opening in the housing located at the first end. Step (b) may involve sliding until a second circuit component, supported by the second printed circuit board, is thermally connected to the housing, so that the first and second circuit components are thermally connected on opposite sides of the housing. Step (b) may involve sliding until the first and second printed circuit boards are aligned parallel to opposite sides of the housing. Step (c) may involve securing the first flange to opposite sides of the housing, with the first flange being secured to one side of the housing via a loose-fit opening in the first flange on the housing.Step (c) may involve attaching the second flange to the housing on one side of the housing. Step (c) may involve attaching the first flange to opposite sides of the housing, with the first flange being attached to the housing via an open slot in the first flange on one of the sides.

[0027] According to a further aspect of the invention, a camera is provided. The camera comprises: (a) a printed circuit board with first and second circuit components arranged on opposite sides of the printed circuit board; (b) a circuit board holder for holding the printed circuit board, wherein the first circuit component is in thermal contact with the circuit board holder when the printed circuit board is held by the circuit board holder; and (c) a housing for enclosing the printed circuit board and the circuit board holder, wherein the circuit board holder is dimensioned such that it can be attached to the housing, so that the second circuit component is in thermal contact with the housing.

[0028] The printed circuit board (PCB) holder may include a plate sized for thermal communication between the first circuit component and the PCB holder. The PCB holder may also have a flange extending from the plate. The flange may be sized for mounting to the housing. The camera may further include a backplane that is electrically connected to the PCB. The backplane and the PCB holder may be detachably attached to each other. The PCB may be sized to be held between the backplane and the flange. The camera may also include a second PCB. The second PCB may include a third circuit component that is thermally connected to the PCB holder or the housing if the second PCB is held by the PCB holder and the PCB holder is mounted to the housing.The second printed circuit board (PCB) may contain a fourth circuit component. The third and fourth circuit components may be located on opposite sides of the second PCB. The fourth circuit component may be in thermal communication with the other part of the PCB holder and the housing when the second PCB is held by the PCB holder and the PCB holder is attached to the housing. The PCB holder may comprise a first and a second PCB holder element. The first PCB holder element may include the board and the flange. The second PCB holder element may include a second board dimensioned for thermal communication between one of the third and fourth circuit components and the second PCB holder. The second PCB holder may further include a second flange projecting from the second board.The second flange can be dimensioned for mounting to the housing. The second circuit board can be dimensioned to be held between the backplane and the second flange. Each of the first and second circuit board holders can be detachably attached to the backplane. The camera can further include first and second elastic connectors for detachably attaching the first and second circuit board holder elements to the backplane, respectively, so that the flange and the second flange are adjustable relative to each other when the circuit board holder is attached to the backplane and not to the housing. The camera can further include first and second elastic connectors for detachably attaching the first and second circuit board holder elements to the backplane, respectively.The second printed circuit board (PCB) mounting element on the backplane includes such that the flange and the second flange are elastically displaceable relative to each other when the PCB holder is attached to the backplane and not fixed to the housing. The flange and the second flange can be adjustable relative to each other by being displaceable relative to each other. The flange and the second flange can be adjustable relative to each other by being elastically adjustable relative to each other. The flange and the second flange can be displaceable relative to each other by being elastically displaceable relative to each other. The flange can be dimensioned so that it can be attached to the housing on a first side. The flange can extend perpendicular to the board. The second flange can be dimensioned so that it can be attached to a second side of the housing opposite the first side.The second flange can extend perpendicular to the second plate. One of the flanges and the second flange can be dimensioned to be attached to either the first or the second side of the enclosure. One of the flanges and the second flange can define an open-ended slot to receive a fastener for attaching one of the flanges and the second flange to the enclosure. The plate can extend between an upper plate edge and a lower plate edge opposite the upper plate edge. The first PCB holder can be detachably attached to the backplane at the lower plate edge. The flange can extend perpendicularly from the plate at the upper plate edge. The second plate can extend between a second upper plate edge and a second lower plate edge opposite the second upper plate edge.The second PCB mounting element can be detachably attached to the backplane at the second lower edge of the board. The second flange can extend perpendicularly from the second board at the second upper edge of the board. The flange and the second flange can be substantially parallel and adjacent to each other when the first and second PCB mounting elements are attached to the backplane. The backplane can comprise a first and a second backplane section. The camera can further comprise a first and a second external connector attached to the first and second backplane sections, respectively. The housing can have first and second openings. The first and second external connectors can be dimensioned to extend and seal through the first and second openings, respectively.

[0029] According to a further aspect of the invention, a camera is provided. The camera comprises: (a) a first printed circuit board means for carrying a first circuit component; (b) a printed circuit board holder means for holding the first printed circuit board means; and (c) a housing means for enclosing the first printed circuit board means and the printed circuit board holder means, wherein the printed circuit board holder means is dimensioned such that it can be attached to the housing so that the first circuit component is brought into thermal contact with the housing means.

[0030] The first printed circuit board assembly can include a second circuit component. The first and second circuit components can be located on opposite sides of the first printed circuit board assembly. The second circuit component can be in thermal contact with the printed circuit board support means when the first printed circuit board assembly is held by the printed circuit board support means. The camera can further comprise a second printed circuit board assembly with a second circuit component. The printed circuit board support means can be operated to hold the first and second printed circuit board components. The second circuit component can be in thermal contact with the printed circuit board support means when the second printed circuit board assembly is held by the printed circuit board support means. The first and second printed circuit board components can be part of means for the integral and flexible support of the first and second circuit components.

[0031] According to a further aspect of the invention, a camera is provided. The camera comprises: (a) a printed circuit board (PCB) mounting device for supporting the first and second circuit components, which are arranged on opposite sides of the PCB mounting device; (b) a PCB holder for holding the PCB mounting device, wherein the first circuit component is in thermal contact with the PCB holder when the PCB mounting device is held by the PCB holder; and (c) a housing device for enclosing the PCB mounting device and the PCB holder, wherein the PCB holder is dimensioned such that it can be attached to the housing device, so that the second circuit component is brought into thermal contact with the housing device.

[0032] The camera may further comprise a second printed circuit board assembly for supporting a third circuit component in thermal connection with one of the printed circuit board holders and the housing assembly, provided that the second printed circuit board assembly is held by the printed circuit board holder and the printed circuit board holder is attached to the housing assembly. The second printed circuit board assembly may contain a fourth circuit component. The third and fourth circuit components may be arranged on opposite sides of the second printed circuit board assembly. The fourth circuit component may be in thermal connection with the other of the printed circuit board holders and the housing assembly, provided that the second printed circuit board assembly is held by the printed circuit board holder and the printed circuit board holder is attached to the housing assembly.The camera may also include first and second connection means for the detachable attachment of the circuit board holder means to a back panel board.

[0033] The foregoing summary is only exemplary and is not intended to be limiting in any way. Other aspects and features of the present invention will become clear to the person skilled in the art upon review of the following description of embodiments of the invention in conjunction with the accompanying figures and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The drawings, which only illustrate exemplary embodiments of the invention: Fig. Figure 1 is a perspective view of a camera according to a first embodiment of the invention; Fig. 2 is a front view of the in Fig. 1 camera shown, which shows a lens mount; Fig. 3 is a sectional view along lines AA of Fig. 2, showing an electronic component in thermal contact with a housing; Fig. 4 is a side view of a part of the in Fig. 1 camera shown, which shows an image acquisition assembly and an image processing assembly electrically connected to each other; Fig. 5 is a perspective view of the in Fig. 4 of the part shown, which shows external connectors attached to a rear panel of the image processing assembly; Fig. 6 is a perspective view of the [unclear] in the Fig. 4 and Fig. 5 Image acquisition assembly shown from a first angle, showing the lens connection; Fig. Figure 7 is a perspective view from a second angle of the Fig. 6 image acquisition assembly shown, which shows an image sensor board held by a pair of parallel, spaced-apart rails attached to the lens mount; Fig. 8 is a perspective view of the in Fig. 7 shown image sensor board, which shows metallic pads and ground pads; Fig. 9 is a side view of the [image / image] in the Fig. 6 and Fig. 7 shown image sensor arrangement, which shows a larger image sensor attached to the image sensor board; Fig. 10 is a sectional view of the image acquisition assembly along lines AA of Fig. 2, showing a carrier that is in contact with the image sensor and serves as a dust seal; Fig. 11 is a side view of a variant of the one in the Fig. 6 and Fig. 7 image acquisition assembly shown, in which the carrier covers a smaller image sensor; Fig. 12 is a sectional view of the Fig. Variant 11 shown along the in Fig. 2 indicated lines AA, which show the carrier surrounding the smaller image sensor and acting as a dust seal; Fig. 13 is a flowchart of a procedure for installing the image sensor in the Fig. 6 and Fig. 7 Image acquisition assembly shown, which shows the step of aligning the image sensor; Fig. 14 is a flowchart of a procedure for carrying out the in Fig. 13 shown step of aligning the image sensor, which shows the step of moving the image sensor to a new position; Fig. Figure 15 is a perspective view from a first angle of the area in the Fig. 4 and Fig. Figure 5 shows the image processing assembly without the external connectors, showing two backplane sections and a spring-loaded fastening between the backplane and a PCB holder; Fig. 16 is a perspective view from a second angle of the in Fig. 15 Image processing assembly shown, which shows a slotted flange and a non-slotted flange arranged next to and parallel to each other; Fig. Figure 17 is a perspective view of a slotted element of the [unclear text] in the Fig. 15 and Fig. 16 shown circuit board holder, which shows the slotted flange that protrudes at a right angle from an adjacent board; Fig. 18 is a reverse view of the in Fig. 17 slotted elements shown from above; Fig. 19 is a top view of the area in the Fig. 17 and Fig. 18 slotted elements shown; Fig. 20 is a perspective view of an unslotted element of the in the Fig. 15 and Fig. 16 of the printed circuit board holder shown, which shows the unslotted flange extending at a right angle from a board; and Fig. 21 is a view from below of the in Fig. 20 non-slotted elements shown. DETAILED DESCRIPTION

[0035] A camera comprises: (a) a scanning device for scanning images; (b) a lens holding device for directing light to the scanning device; and (c) a holding device for holding the scanning device, wherein the holding device is configured such that it can be actuated to hold the scanning device captive so that the scanning device is movable relative to the lens holding device, and is configured such that it can be actuated to hold the scanning device in place so that the scanning device is immovable relative to the lens holding device.

[0036] The same or a different camera comprises: (a) a printed circuit board (PCB) mounting device for supporting one or more circuit components; (b) a PCB holding device for holding the PCB mounting device; and (c) an enclosure device for enclosing the PCB mounting device and the PCB holding device, wherein the PCB holding device is dimensioned to be attached to the enclosure device such that at least one of the circuit components is in thermal contact with the enclosure device. Another of the circuit components can be placed in thermal contact with the PCB holding device when the PCB mounting device is held by the PCB holding device.

[0037] With reference to Fig. Figure 1 shows the camera according to a first embodiment of the invention, generally represented by 10. The camera 10 functions to generate images by image scanning and processing. The camera 10 includes a lens mount 12 that can be attached to a housing 13. The lens mount 12 forms a flange edge 14 and includes an internal thread 15 for receiving an interchangeable lens (not shown), which is usually used in conjunction with the camera 10 to generate images. The dimensions of the thread 15 and the relative positioning of the interchangeable lens (not shown) when mounted on the lens mount 12 typically conform to an industry standard. For example, the lens mount 12 may be dimensioned for compatibility with known C-mount lenses (not shown).

[0038] The external connectors 16 and 18 facilitate the supply of electrical power to the camera 10 from an external power supply (not shown) and facilitate the transmission of images from the camera 10 to an external image receiver (not shown) for further processing and / or display. In the first embodiment, the smaller connector 16 is typically used for supplying power to the camera 10 and for general input / output signals such as operating control signals. Additionally or alternatively, the larger connector 18 can be used for supplying power to the camera 10. In the first embodiment, the larger connector 18 is typically used for streaming image data and is preferably compatible with the Ethernet family of communication technologies.

[0039] Depending on the version, camera 10 can be dustproof or dust-protected, waterproof or water-resistant, or a combination thereof. In the first version, camera 10 complies with the IP67 standard (Ingress Protection). Other protection ratings are also possible in other versions.

[0040] Referring to Fig. 2 The lens mount 12 directs the light into the interior of the camera 10, where it can be imaged.

[0041] The in Fig. Section 3 shown is along lines AA of Fig. 2. The lens mount 12 and an image sensor 20 are part of an image acquisition assembly 22, which is attached to the housing 13. An image processing assembly 24 comprises the external ports 16 and 18, which project outwards from within the housing 13.

[0042] As in Fig. As shown in Figure 3, the image acquisition assembly 22 and the image processing assembly 24 are electrically connected to each other via an electrical cable 26. In the first embodiment, the electrical cable 26 is in the form of a flexible printed circuit board. In general, however, any form of electrical connection(s) can be used in a suitable manner.

[0043] For better illustration, the following is shown in the Fig. 4 and Fig. Figure 5 shows the combination of the image acquisition unit 22 and the image processing unit 24 without the housing 13. Image scanning arrangement

[0044] Referring to the Fig. In the first embodiment, the image acquisition assembly 22, as shown in figures 2, 3, and 6 to 12, includes an optical filter 28 held by a filter holder 30. The optical filter 28 typically blocks infrared radiation, although in general any desired filtering effect can be employed appropriately. For example, the optical filter 28 may be made of flat glass (or similar material) to achieve little or no filtering effect. Other filtering effects are possible, and in some embodiments, the camera 10 does not include a filter 28. The filter holder 30 is typically planar and annular, with an inner rectangular shape ( Fig. 2) and an outer circular shape. In the first embodiment, the filter holder is attached to the lens holder 12 with two screws 32.

[0045] Between the optical filter 28 and the image sensor 20 there is a support, as shown in the Fig. 9, Fig. 10, Fig. 11 to Fig. Figure 12 shows a dust seal 34 to mechanically support the image sensor 20 before it is firmly held in the image acquisition assembly 22. As described below, in the first embodiment the dust seal 34 also advantageously seals the image sensor 20 against dust or other particulate contaminants.

[0046] In variations of embodiments, the image sensor 20 can have a variety of different sizes and shapes that can be accommodated by the image acquisition assembly 22. For example, the image sensor 20 is the Fig. 9 and Fig. 10 times larger than the one in the Fig. 11 and Fig. 12. Regarding image sensor 20 of the Fig. 9 and Fig. 10 The dust seal 34 rests against the image sensor 20 and typically touches an outer glass surface 36 of the image sensor 20. In the case of the image sensor 20, Fig. 11 and Fig. 12, however, the dust seal 34 encloses the sides of the smaller image sensor 20, as shown in cross-section in Fig. 12 can be seen. In both cases of the larger or smaller image sensor 20, the dust seal 34 can serve to bring the image sensor 20 into a starting position relative to the lens mount 12 before the image sensor 20 is aligned with the lens mount 12 and its flange edge 14.

[0047] As in the Fig. 10 and Fig. As can be seen best in Figure 12, the image sensor 20 comprises its outer surface 36 and an active area 38. The image sensor 20 is attached to one side of an image sensor board 40 (printed circuit board). An image sensor connector 42 is attached to the opposite side of the image sensor board 40 (visible in the figures). Fig. 8 and Fig. 9) The image sensor connection 42 is dimensioned such that it accommodates the electrical cable 26 ( Fig. 3 and Fig. 4) can record, which connects the output of the image sensor 20 of the image acquisition assembly 22 to an input of the image processing assembly 24.

[0048] In the first embodiment, the dust seal 34 elastically supports the image sensor 20, allowing the image sensor 20 to move within the limited boundaries described below. The dust seal 34 can be made of any suitable material, for example, an elastic material. In the first embodiment, the dust seal 34 is made of a foam material, although other materials can also be used in variants, such as a rubber material, which can be formed as molded rubber.

[0049] Before the image sensor 20 is attached, in the first embodiment the image sensor 20 is held captive by a holder, such as the one described in the Fig. The rail pair 44 shown in Figures 7 and 9 to 12 is attached to the lens mount 12 on opposite sides of the lens mount 12 and extends across each side between the mounting posts 46 ( Fig. 4, Fig. 5, Fig. 6 to Fig. 7) the lens mount 12.

[0050] As in the Fig. 6, Fig. 7, Fig. 8, Fig. 9, Fig. 10, Fig. 11 to Fig. As shown in Figure 12, the image sensor 20 is arranged between the dust seal 34 and the rails 44, with the dust seal 34 typically pressing the image sensor 20 elastically against the rails 44. If the image sensor 20 is not rigidly connected to the rails 44, then the image sensor 20 is movable against the spring-loaded or elastic dust seal 34, so that the image sensor 20 can be considered to be held captive by the pair of rails 44. In some embodiments, the mounting of the image sensor 20 need not necessarily be in the form of a pair of rails 44. For example, in some embodiments, the mounting of the image sensor 20 extends as a single flat object over the entire width and length of the lens mount 12 between the four mounting posts 46. Such a single flat object could, for example, be a single circuit board.In the first embodiment, the two rails are 44 printed circuit boards, although other suitable objects or materials can also be used in variants.

[0051] In general, the image sensor holder 20 in the first embodiment can take any suitable form, provided that the image sensor holder 20 can hold the image sensor 20 securely when the image sensor 20 is not held firmly by the image sensor holder 20, and the image sensor 20 and its holder can also be firmly attached to one another so that the image sensor 20 is held firmly by the image sensor holder 20 when it is not only intended to be held securely by its holder. In embodiment variants, the image sensor holder 20 can comprise any number of components, for example, by being designed as a one-piece holder (not shown) or as a multi-piece holder such as the rail pair 44. A one-piece holder can, for example, have the form of a rectangular frame, an "I" shape, an "H" shape, or an "X" shape. A multi-piece holder can, for example, be...comprising any number of parts of any suitable shapes and sizes.

[0052] In some embodiments, the image sensor 20 can be detachably attached to the image sensor holder 20. In the first embodiment, the image sensor 20 can be detachably attached to the pair of rails 44 by soldering the image sensor 20 to the rails 44 via the image sensor board 40. When soldered, the image sensor 20 is held in place by the rails 44, so that the image sensor 20 remains in a fixed relationship to the lens holder 12 indefinitely. In variations of the fastening techniques, the image sensor 20 can, for example, be glued to the rails 44, attached to the rails 44, clipped to the rails 44 in a fixed position, or otherwise attached to the rails 44, or any combination thereof. If gluing is used, for example, an ultraviolet (UV) curing adhesive can be used.An electrical ground path can be formed between the image sensor 20 and the electrical ground by the selected mounting technology and / or by a separate electrical ground path.

[0053] Referring to the Fig. 7 and Fig. In the first embodiment, each rail 44 contains metal-lined openings 48 for receiving solder or the like. The metal-lined openings 48 are generally aligned with metallic pads 50 arranged on the image sensor board 40, so that solder can be applied to both the metallic pads 50 and the metal-lined openings 48 to firmly attach the image sensor 20 to the rails 44. In the first embodiment, the thickness of the solder used to attach the image sensor board 40 to the rails 44 is preferably not greater than 0.5 mm (0.0197 in).

[0054] In variations of the embodiment, the openings 48 need not be lined with metal, and the pads 50 need not be metallic. In some embodiments, adhesive is applied to the openings 48, whether lined with metal or not, to firmly bond the image sensor board 40 to the rails 44 on the pads 50, whether metallic or not.

[0055] In the first embodiment, the image sensor 20 is attached to the image sensor board 40, and the image sensor board 40 is soldered to the rails 44 on opposite sides of the image sensor board 40. Accordingly, the thickness of the image sensor board 40 is relevant for the positioning of the image sensor 20 relative to the lens mount 12. For optimal performance, the thickness of the image sensor board 40 can be specified differently for different image sensors 20, particularly for different image sensor housing types 20. This eliminates the need for washers when mounting the camera 10 and simultaneously allows for advantageous limitation of the solder thickness.

[0056] As in the Fig. 7 and Fig. As shown in Figure 8, in the first embodiment, the rails 44 also include electrically conductive lines 52 extending between an electrical ground connection on the mounting posts 46 and a point on the rails 44 near the image sensor board 40. The electrical lines 52 advantageously facilitate the provision of a selectable electrical ground connection between the image sensor 20 and the housing 13 by allowing the electrical connection to be established by soldering between the lines 52 and the nearby electrical ground pads 54 on the image sensor board 40. The ability to selectively ground the image sensor 20 to the housing 13 advantageously simplifies the soldering of the image sensor 20 to the rails 44.For example, the image sensor 20 can be soldered in place before electrical grounding, thus advantageously minimizing the probability of an undesirably poor solder joint and / or thermal deformation of the rails 44, which would cause misalignment of the image sensor 20 relative to the lens mount 12 and its flange edge 14. The image sensor 20 can then be electrically grounded once it is fixed in place. Typically, the image sensor connector 42 also provides electrical grounding; however, additional electrical grounding via the electrical leads 52 advantageously improves the ground current capacity, facilitates electromagnetic shielding, and provides a cooling path from the image sensor 20 to the lens connector 12.

[0057] Thus, a camera is provided comprising: (a) a lens mount; (b) an image sensor for capturing images; and (c) a holder for holding the image sensor, wherein the holder can be actuated to hold the image sensor captive so that the image sensor is movable relative to the lens mount, and can be actuated to hold the image sensor firmly so that the image sensor is immovable relative to the lens mount.

[0058] In some embodiments, the image sensor 20 is not captive held by a holder before it is fixed in place. In such embodiments, the image sensor 20 is not captive aligned while being gripped when it is near the rails 44 or another holder for the image sensor 20, and then attached to the lens mount 12, for example, by attaching the image sensor 20 to the rail pair 44. For example, the image sensor board 40 can be soldered to the rail pair 44 on the side of the rails 44 opposite the side soldered in the first embodiment. In such embodiments, the rails 44, the metal-lined openings 48, the electrical leads 52, the image sensor board 40, the metal pads 50, the grounding pads 54, and other components of the camera 10 can be varied in their respective positions and sizes and / or omitted entirely.

[0059] A camera is provided comprising: (a) a lens mount; (b) an image sensor for capturing images; and (c) a holder for holding the image sensor, wherein the holder can be actuated to hold the image sensor in place so that the image sensor is immobile relative to the lens mount after the image sensor has been aligned by grasping the image sensor when the image sensor is movable near the holder. Method for inserting the image sensor into the image acquisition assembly

[0060] Further advantageous features of the camera 10 become apparent through methods for installing the image sensor 20.

[0061] With reference to Fig. Figure 13 is an exemplary method for installing the image sensor 20, generally illustrated with Figure 56. The method 56 begins with step 58, in which the installer is instructed to position the image sensor 20. The installer can be, for example, a person, an automated system, an industrial robot, or any combination thereof. In the first embodiment, positioning the image sensor 20 typically involves placing the image sensor 20 on the lens mount 12 so that the image sensor 20 is supported by the dust seal 34. In the first embodiment, positioning the image sensor 20 on the lens mount 12 typically involves placing the image sensor board 40 on the lens mount 12 so that the image sensor 20 and / or the image sensor board 40 are supported by the dust seal 34 when the image sensor 20 is attached to the image sensor board 40.

[0062] After step 58 has been performed, step 60 instructs the installer to attach a holder for the image sensor 20. In the first embodiment, attaching the holder for the image sensor 20 typically involves attaching the rail pair 44 to the lens mount 12 to the mounting post 46. The execution of step 60 advantageously ensures that the image sensor 20 is held securely in place.

[0063] After step 60 has been performed, step 62 instructs the installer to align the image sensor 20.

[0064] With reference to Fig. 14 is an exemplary procedure for performing step 62 ( Fig. 13) generally illustrated with 64. Method 64 begins with step 66, which instructs the installer to grasp the image sensor 20. In the first embodiment, grasping the image sensor 20 typically involves the grasping of the image sensor board 40, to which the image sensor 20 is attached, by opposing fingers of an industrial robot (not shown). In general, however, any suitable method for grasping can be used. The execution of step 66 may also involve inserting the image acquisition assembly 22 into a suitable clamping device (not shown) for improved stability during the alignment process and may involve aligning various components of the clamping device relative to each other, aligning a clamping device component with the lens mounts 12 and their flange edge 14, and / or joining a clamping device component with the threads 13 of the lens mount 12.Inserting the image acquisition assembly 22 into the clamping device may include supplying electrical power to the image acquisition assembly 22 and, in particular, to the image sensor 20.

[0065] In some embodiments (not shown), where the camera 10 includes a non-interchangeable and / or non-removable lens, the lens mount 12 has no exposed threads 15 for receiving device components. For example, a non-interchangeable and / or non-removable lens may be permanently screwed onto the threads 15 during manufacturing, e.g., by using adhesive applied to the threads 15. In such embodiments, the position of the image sensor 20 is adjusted for optimal image quality by the image acquisition assembly 22 when it includes the non-interchangeable lens, rather than aligning the image sensor 20 relative to the lens mount 12 and its flange edge 14.

[0066] After step 66 has been executed, step 68 instructs the installer to project an optical pattern onto the image sensor 20 ( Fig. 3) In the first embodiment, a pattern projector (not shown) is used for this purpose. In general, any known optical pattern can be used, and some optical patterns may facilitate the alignment of the image sensor 20 more effectively than others. For a visible-light camera 10 (e.g., for computer vision or security surveillance), the optical pattern is typically a pattern of light in the visible region of the electromagnetic spectrum. For an infrared camera 10, the optical pattern may, for example, be a light pattern in the infrared region of the electromagnetic spectrum. Other examples are conceivable within the scope of the present invention. Additionally or alternatively, the projection of the optical pattern may involve the presentation of a mechanical object to be imaged by the image sensor 20.For example, an indicator for the top (or bottom or side) of the lens mount 12 can be presented to the figure to facilitate the rotational alignment of the image sensor 20 onto the lens mount 12 and its flange edge 14.

[0067] Additionally or alternatively, in some embodiments, method 64 includes the use of a system for measuring a distance, such as the distance between the flange edge 14 and the image sensor 20 and / or its active area 38 ( Fig. 3) Such a system can include a laser-based distance sensor to direct a narrow beam of electromagnetic radiation onto the image sensor 20, which is then reflected by the image sensor 20 or a part thereof. In such embodiments, steps 68 and 70 can be performed without supplying power to the image sensor 20.

[0068] After step 68 has been executed, step 70 instructs the installer to receive image(s) of the optical pattern via the image sensor 20. In the first embodiment, receiving images of the optical pattern typically involves connecting a camera processor (not shown) to the image sensor 20 at the image sensor port 42 ( Fig. 7 and Fig. 9) and may include the display of the received image(s). Such an attached camera processor typically operates in a similar or analogous manner to the image processing assembly 24 ( Fig. 3, Fig. 4 to Fig. 5) and may be part of the device or related equipment (not shown) used to align the image sensor 20.

[0069] Once the image(s) have been received, the installer can optionally end the projection of the pattern from step 68, for example, to minimize power consumption. Switching off the pattern projector (not shown) can be part of step 70 or a separate step. Alternatively, the pattern can continue to be projected for the duration of several steps of procedure 64.

[0070] After step 70 has been executed, step 72 instructs the installer to determine whether the image sensor 20 is aligned. Typically, such a determination is performed by a computer processor (not shown) which has an associated memory circuit (not shown) in which codes for controlling operations of the computer processor are stored. In the first embodiment, the determination is typically made by calculating an error that represents a comparison between the actual image(s) received by the image sensor 20 and an expected image based on the known optical pattern from step 68. The representation of the calculated error can be in any suitable form, including scalar value(s), vector(s), matrix(s), etc.

[0071] If the installer determines in step 72 that the image sensor 20 is not properly aligned, the process continues with step 74.

[0072] Step 74 instructs the installer to calculate an expected aligned position of the image sensor 20. The calculated position is the result of determining where the image sensor 20 must be moved to compensate for the calculated error from Step 72. Typically, such a calculation of the expected aligned position is computer-implemented, as performed, for example, by the processor (not shown) of Step 72.

[0073] While in Fig. Since step 66 is shown before step 68, step 66 can generally be performed at any time before, during, or after the execution of steps 68 to 74, including the possibility of performing several steps simultaneously. Generally, step 66 is performed before the execution of a first instance of step 76. In the first embodiment, step 66 is preferably performed before the execution of step 72 to advantageously avoid the possibility of moving the image sensor 20 into an unpredictable position when it is grasped.

[0074] After step 74 has been executed, step 76 instructs the installer to move the image sensor 20 into the calculated position. In the first embodiment, the fingers of the industrial robot (not shown), which grasps the image sensor 20 according to step 66, are used to move the image sensor 20 into the calculated position for alignment with the lens mount 12.

[0075] After step 76 has been performed, the procedure returns to step 68 to confirm the alignment and / or to align further.

[0076] In general, steps 68 to 76, or parts thereof, can be repeated any number of times. In some embodiments, these steps or parts thereof are iterated such that step 76 is executed a fixed number of times, such as once, twice, or three times. In some embodiments, these steps, or a part thereof, are iterated such that step 76 is executed as many times as necessary to achieve a desired small error value. In some embodiments, an error routine (not shown) is executed if step 76 is executed very often while, in step 72, it is determined that the image sensor 20 is not sufficiently aligned. In some embodiments, an error routine (not shown) is executed if a discrepancy is detected between the measured and the expected position of the image sensor 20, for example,to alert a user to the possibility of a mechanical malfunction that prevents the image sensor 20 from reaching the expected aligned position calculated in step 74. Other combinations are possible.

[0077] If, in step 72, the installer determines that the image sensor 20 is properly aligned (i.e., within an acceptable margin of error) with the lens mount 12 and, accordingly, with the flange edge 14 or the non-interchangeable lens (not shown), then procedure 64 ends and the process returns to procedure 56 in step 78 ( Fig. 13) back.

[0078] Back to Fig. In step 78 of paragraph 13, the installer is instructed to attach the image sensor 20. In the first embodiment, attaching the image sensor 20 typically involves attaching it to each of the rails 44 by soldering the image sensor board 40 to the rails 44, while the image sensor 20 remains in its aligned position due to continued gripping by the robot fingers (not shown). The image sensor 20 is advantageously arranged within the rails 44 so that the image sensor 20 and the rails 44 can be soldered together without any soldering equipment, such as a soldering iron (not shown), or other solid materials coming into physical contact with the image sensor 20 itself or the image sensor board 40. Avoiding such physical contact with an aligned image sensor 20 advantageously minimizes the likelihood of the image sensor 20 moving out of alignment.In some embodiments, soldering is performed manually by a human installer (not shown). In other embodiments, however, soldering is performed by an automated installer, such as an industrial robot (not shown).

[0079] Once the image sensor 20 and the rails 44 are soldered or otherwise attached to each other, for example, by soldering the image sensor board 40 to the rails, the image sensor 20 is in a fixed relationship to the rails 44 and is thus held by the rails 44 so that it is aligned with the lens mount 12. With the image sensor 20 held firmly by the rails 44, the robot fingers can be removed from the image sensor 20 mount, the lens mount 12 can be removed from its fixture, and the pattern projector can adjust the projection of patterns, if desired.

[0080] After the image sensor 20 and the rails 44 are soldered together, the dust seal 34 ( Fig. 6, Fig. 7, Fig. 8, Fig. 9, Fig. 10, Fig. 11 to Fig. 12) is no longer needed to support the fixed image sensor 20, but advantageously continues to seal against dust or other contaminants that may come into contact with the outer surface 36 of the image sensor 20.

[0081] While in the first embodiment the image sensor 20 is attached to the image sensor mount 20 by soldering the image sensor board 40 to the rails 44, other arrangements and techniques for attaching the image sensor 20 to the image sensor mount 20 can also be used. In some embodiments, the image sensor board 40 is omitted or replaced by other objects or means, as would be apparent to a person with ordinary knowledge. In some embodiments, other fastening techniques such as gluing, fastening, and / or clipping can also be used.

[0082] After step 78 has been executed, procedure 56 ends.

[0083] Thus, a method for installing an image sensor of a camera is provided, comprising: (a) placing the image sensor on a lens mount of the camera; (b) attaching a holder to the lens mount to hold the image sensor captive by the holder, so that the image sensor is movable relative to the lens mount; (c) aligning the image sensor with the lens mount; and (d) securing the image sensor to the holder to hold the image sensor firmly by the holder, so that the image sensor is not movable relative to the lens mount.

[0084] In some embodiments, steps 58 and 60 of Fig. 13 Conversely, the holder of the image sensor 20, such as the rail pair 44, does not hold the image sensor 20 captive. In such embodiments, the image sensor 20 is grasped, for example, by grasping the image sensor board 40 when the image sensor 20 is attached to the image sensor board 40, at any suitable location near the holder of the image sensor 20 after the holder of the image sensor 20 has been attached. After grasping the image sensor 20 near the image sensor holder 20, the image sensor 20 can then be aligned according to step 62 for mounting according to step 78, as shown in Fig. 13 shown.

[0085] Thus, a method for installing an image sensor of a camera relative to a lens mount of the camera is provided, the method comprising: (a) attaching a holder operable to the lens mount for holding the image sensor; (b) grasping the image sensor near the holder by a gripper; (c) aligning the image sensor on the lens mount by the gripper; and (d) securing the image sensor to the holder such that the image sensor is immobile relative to the lens mount. Image processing module

[0086] Back to the Fig. 3, Fig. 4 to Fig. 5, the image processing assembly 24 contains electronic components 80 for processing digital images. For example, the images received by the image sensor 20 can be combined into data packets for video streaming. In some embodiments, the camera 10 can, for example, perform digital filtering of the digital images.

[0087] For better illustration in the Fig. 15 and Fig. Figure 16 shows the image processing module 24 without the external connections 16 and 18 ( Fig. 5) Various electronic components 80 are supported by one or more printed circuit boards 82, which are held by a printed circuit board holder 84.

[0088] In the first embodiment, the one or more circuit boards 82 are implemented using flexible electronics, such as a single flexible printed circuit (FPC). However, in some embodiments, all circuit boards of the camera 10 are rigid, preferably with wired connections between them as required. In variants, any suitable parts of the camera 10 can be implemented using flexible electronics. For example, in some embodiments, all circuit boards of the camera 10, including the image sensor board 40 ( Fig. 3) and the one or more printed circuit boards 82, implemented by one or more FPCs. In some embodiments, all printed circuit boards, including their connections, such as the image sensor connection 42 ( Fig. 3), and all electrical connections between the circuit boards, including the electrical cable 26 ( Fig. 3), for example, camera 10 is implemented by a single FPC.

[0089] With reference to the Fig. 3 to 5 and 15 to 16 generate at least some of the electronic components 80, which can be dissipated by heat sinks. To advantageously achieve a compact size for the camera 10, in the first embodiment the housing 13 itself acts as a heat sink. In the first embodiment, one or more external electronic components 86 are in thermal communication with the housing 13, which may include being in thermal contact with a thermal interface material, such as the one in the Fig. 3, Fig. 4, Fig. 15 and Fig. The thermal pads 81 shown in Figure 16 are arranged between each external electronic component 86 and the housing 13. In various embodiments, the thermal interface material can be, for example, thermal paste, thermal pads 81, other thermal interface materials, or any combination thereof.

[0090] With particular reference to Fig. 3 In some embodiments, the opposing, inwardly facing sides of the housing 13 are not parallel to each other, but rather angled relative to each other, so that the interior of the housing 13 has a passage or a taper. In the embodiment of Fig. 3 causes such a tapering that the distance between the opposite, inwardly facing sides of the housing 13 is greater near the image acquisition assembly 22 than at a greater distance from the image acquisition assembly 22.

[0091] As in Fig. As shown in Figure 3, in embodiments with one or more external electronic components 86 that are in thermal contact with the housing 13, these external electronic components 86 are aligned with one or more inwardly facing sides of the housing 13. In embodiments with several external electronic components 86 in thermal contact with opposite, inwardly facing sides of the housing 13, such opposite external electronic components 86 are not parallel to each other. The printed circuit boards 82 that carry such opposite external electronic components 86 are also not parallel to each other if at least the sections of such printed circuit boards 82 that carry the opposite external electronic components 86 are aligned with the opposite sides of the housing 13.Such a non-parallel arrangement of the printed circuit boards 82 advantageously facilitates the thermal contact between one or more external electronic components 86 and the housing 13.

[0092] As in Fig. Figure 3 shows embodiments in which one or more external electronic components 86 are in thermal contact with the housing 13 and are supported by one or more rigid printed circuit boards 82. In these embodiments, such rigid printed circuit boards 82 are aligned with one or more inwardly facing sides of the housing 13. In embodiments with multiple rigid printed circuit boards 82, in which each rigid printed circuit board 82 supports at least one external electronic component 86 that requires thermal contact with the housing 13, the rigid printed circuit boards 82 are not parallel to each other when their respective external electronic components 86 are in thermal contact with corresponding inwardly facing sides of the housing 13.

[0093] For further advantageous thermal management, the circuit board holder 84 in the first embodiment itself acts as a heat sink for one or more internal electronic components 88.

[0094] In general, any number of electronic components 80, supported by any number of printed circuit boards 82, can be in thermal contact with the housing 13, the printed circuit board holder 84, other heat sinks, or any combination thereof. One or both inward-facing sides of the housing 13 can be appropriately used as heat sinks for electronic components 80. Several parts of the printed circuit board holder 84 can be appropriately used as heat sinks for electronic components 80.

[0095] As in the Fig. As shown in Figures 3 to 5 and 15 to 16, the printed circuit boards 82 are held by the printed circuit board holder 84 in conjunction with a backplane 90. In the first embodiment, the backplane 90 is advantageously composed of two sections. Preferably, an external connector 16 is attached to one section of the backplane 90 and the other external connector 18 is attached to the other section of the backplane 90, thereby advantageously creating mechanical tolerances that allow the sections of the backplane 90 to move relative to each other when the connectors 16 and 18 are inserted into the housing 13. In the first embodiment, the sections of the backplane 90 are generally restricted to lying in substantially parallel planes at all times.

[0096] With reference to the Fig. 15, Fig. 16, Fig. 17, Fig. 18 to Fig. In the first embodiment, the printed circuit board holder 84 comprises a slotted element 92 with a pair of loose openings, such as the open slots 94 shown in the figures. Opposite the open slots 94 is a pair of closed openings 96 of the slotted flange 98. The slots 94 and openings 96 are dimensioned to accommodate fasteners (not shown) for attaching the slotted element 92 to the housing 13. In other embodiments, the loose-fit openings can be oversized, such as oversized round holes, closed elongated holes, open elongated holes as shown in the figures, or other large openings dimensioned to accommodate a fastener when the printed circuit board holder 84 is located in a range of different positions to allow a loose fit for the fasteners.

[0097] A connecting plate 100 extends at or nearly at a right angle to the slotted flange 98 between the slots 94 and the openings 96. The connecting plate 100 includes lateral clamps 102 and a central clamp 104 at an end furthest from the slotted flange 98. The lateral clamps 102 and the central clamp 104 serve to detachably fasten the slotted element 92 to the rear panel 90. The central clamp 104 acts in conjunction with an elastic ring 106 ( Fig. 15) for resilient fastening between the circuit board holder 84 and the backplane 90. Such an elastic fastening advantageously holds the circuit board holder 84, the backplane 90, and the circuit boards 82 together. In the first embodiment, the circuit boards 82 are held between the backplane 90 and the slotted flange 98. In the first embodiment, slots 108 are formed between the sections of the backplane 90, and recesses 110 in the slotted flange 98 facilitate holding the circuit boards 82 between the backplane 90 and the slotted flange 98.

[0098] With reference to the Fig. 20 and Fig. In the first embodiment, the circuit board holder 84 also includes an unslotted element 112 with a pair of openings 114 in an unslotted flange 116. The openings 114 are dimensioned to accommodate fastening elements (not shown) for attaching the unslotted element 112 to the housing 13. A plate 118 extends at a right angle to the unslotted flange 116. At an end furthest from the unslotted flange 116 are another pair of lateral clamps 102 and another central clamp 104, which serve to detachably fasten the unslotted element 112 to the backplate 90. The central clamp 104 of the unslotted element 112 is also supported by an elastic ring 106 ( Fig. 15) for spring-loaded fastening between the circuit board holder 84 and the back panel 90. Further circuit boards 82 are held in position between the back panel 90 and the unslotted flange 116 at further slots 108 of the back panel 90 or at recesses 110 of the unslotted flange 116.

[0099] When the printed circuit board holder 84 and the backplate 90 are attached to each other, the slotted flange 98 and the unslotted flange 116 lie next to each other and parallel to each other. The elastic connection between the printed circuit board holder 84 and the backplate 90 allows the flanges 98 and 116 to slide relative to each other, generally maintaining their parallel position. The sliding path of the flanges 98 and 116 is limited by the angle between the printed circuit board holder 84 and the backplate 90, which is permitted by the resilient connection between them. This resilient sliding relative to each other advantageously facilitates the attachment of the flanges 98 and 116 to the housing 13. In the first embodiment, the openings 114 of the unslotted part 112 preferably align with the slots 94 of the slotted part 92.The longitudinal design of the slots 94 allows the slotted flange 98 to be displaced relative to the unslotted flange 116, and it is advantageous that a fastening element (not shown) can secure an aligned slot 94 and an opening 114 to the housing 13. The relative displaceability of the flanges 98 and 116 further facilitates the attachment of the image processing assembly 24 to the housing in order to bring one or more external electronic components 86 into thermal contact with the housing 13 (see, e.g., [reference]). Fig. 3).

[0100] With reference to the Fig. The slotted flange 98 extends from an inside of the housing 13 to 3 to 5 and 15 to 21 ( Fig. 3) to the opposite inner side of the housing 13, thereby advantageously providing additional support against mechanical pressure or force resulting from the external use of the terminals 16 and 18.

[0101] Still referring to the Fig. In the first embodiment, both sides of the plates 100 and 118 can be used as heat sinks for a number of the internal electronic components 88. In the first embodiment, the adjacent plate 100 of the slotted element 92 and the plate 118 of the unslotted element 112 advantageously act as heat sinks for a number of the internal electronic components 88. When assembling the image processing assembly 24 by attaching the circuit board holder 84 and the backplate 90 to each other, selected internal electronic components 88 are advantageously brought into thermal contact with the plates 100 and / or 118, for example by bringing them into thermal contact with the thermal pad 81 ( Fig. 3, Fig. 4, Fig. 15 and Fig. 16) or any other thermal interface material that is arranged between each such internal electronic component 88 and the printed circuit board holder 84.

[0102] In the first embodiment, by attaching the printed circuit board holder 84 to the housing 13, the printed circuit board holder 84 is advantageously brought into thermal contact with the housing 13, so that a cooling path is provided from the internal electronic components 88 via the printed circuit board holder 84 to the housing 13.

[0103] Thus, a camera is provided comprising: (a) a first printed circuit board carrying a first circuit component; (b) a second printed circuit board; (c) a circuit board holder for holding the first and second printed circuit boards spaced apart from each other and pivotable relative to each other; and (d) a housing for enclosing the first and second printed circuit boards and the circuit board holder, the circuit board holder being dimensioned to be attached to the housing such that the first and second printed circuit boards are not parallel to each other and the first circuit component is brought into thermal contact with the housing. Method for installing the image processing assembly into the housing

[0104] With reference to the Fig. 3, Fig. 15 and Fig. 16 The image processing assembly 24 is inserted into the housing 13 when the lens holder 12 and the image acquisition assembly 22 are not attached to the housing 13 and after the image processing assembly 24 has been fully assembled, including the possible application of thermal interface material to electronic components 80 and / or inward-facing sides of the housing interior 13.

[0105] The end of the image processing assembly 24 that is closest to the external ports 16 and 18 is first inserted into the housing 13 until the ports 16 and 18 are received through corresponding openings in the housing 13, which are dimensioned to receive the ports 16 and 18, as shown in Fig. Figure 3 shows that the camera 10 is operational in such a way that the openings of the housing 13 can be sealed when the ports 16 and 18 are connected, e.g., by inserting gaskets, sealing rings, grommets, or other sealing material (not shown). The tight sealing of the external ports 16 and 18 advantageously minimizes or prevents the ingress of dust and / or liquids, such as water, into the interior of the housing 13.

[0106] Once the external ports 16 and 18 at one end of the housing 13 are fully seated against their respective openings in the housing 13, the slotted flange 98 and the unslotted flange 116 at the other end of the housing 13 are positioned opposite the external ports 16 and 18. By sliding the unslotted flange 116 as required until its openings 114 are aligned with the corresponding threaded holes (not shown) in the housing 13, and by sliding the slotted flange 98 as required until its closed openings 96 are aligned with the corresponding threaded holes (not shown) in the housing 13, the external electronic components 86 are brought into thermal contact with one or both opposite, inward-facing sides of the housing 13. This also aligns the printed circuit boards 82 so that they run parallel to the inward-facing sides of the housing 13.In the embodiment of . Fig. 3. The opposite, inwardly facing sides of the housing 13 are not parallel to each other. Accordingly, the circuit boards 82 are not parallel to each other if they are each parallel to the opposite, inwardly facing side surfaces of the housing 13, as shown in Fig. 3 shown.

[0107] After the openings 114, the open slots 94, and the closed openings 96 are aligned, fasteners (not shown), such as screws or bolts, are used to attach the slotted flange 98 and the unslotted flange 116 to the housing 13. In some embodiments, the image processing assembly 24 can be attached before or in conjunction with the image acquisition assembly 22 or parts thereof.

[0108] Thus, a method for installing a camera image processing assembly in a housing is provided, comprising: (a) inserting the image processing assembly into the housing such that an external connection of the image processing assembly extends sealingly through an opening in the housing located at a first end of the housing; (b) displacing at least one of the first and second flanges of a printed circuit board holder of the image processing assembly relative to the other of the first and second flanges until the first and second printed circuit boards of the image processing assembly are not parallel to each other and a first circuit component supported by the first printed circuit board is brought into thermal contact with the housing; and (c) securing the first and second flanges to the housing at a second end of the housing opposite the first end.

[0109] Although embodiments of the invention have been described and illustrated, such embodiments should be considered only as examples of the invention. The invention may include variants that are not described or illustrated in detail here. Therefore, the embodiments described and illustrated here should not be considered a limitation of the invention according to the appended claims.

Claims

Method for installing an image sensor (20) of a camera (10), the method comprising: (a) attaching a bracket to a lens mount (12) of the camera (10), the bracket being configured to be actuated to hold the image sensor (20), the image sensor (20) being mounted on a printed image sensor board (40), the bracket comprising a first rail (44) with a first printed circuit board and a second rail (44) with a second printed circuit board; (b) gripping the image sensor (20) near the bracket by a gripper; (c) aligning the image sensor (20) by the gripper into an aligned position of the image sensor (20) relative to the lens mount (12);(d) Attaching the image sensor (20) to the mount, characterized in that the attachment step comprises soldering or gluing the printed image sensor board (40) to at least one of the first and second printed circuit boards to hold the image sensor (20) in place by the mount, so that the image sensor (20) is immovable in the aligned position relative to the lens mount (12) when the first and second printed circuit boards are attached to the lens mount (12). Method according to claim 1, characterized in that step (a) comprises attaching the holder to keep the image sensor (20) captive so that the image sensor (20) is movable relative to the lens holder (12). Method according to claim 2, characterized in that step (a) further comprises installing an elastic support (34) on the lens holder (12) for elastically supporting the image sensor (20) when the image sensor (20) is held captive by the holder. Method according to claim 3, characterized in that step (b) comprises gripping the image sensor (20) by gripping the printed image sensor board (40) to which the image sensor (20) is attached. Method according to claim 4, characterized in that step (c) comprises generating an image, directing the image onto the image sensor (20), generating a processed image by a camera processor of the camera (10) in response to the image, determining the relative orientation of the image sensor (20) to the lens mount (12) in response to the processed image, and moving the image sensor (20) to a new position calculated in response to the relative orientation. Method according to claim 5, characterized in that step (c) comprises determining the relative orientation by either the processor of the camera (10) or a second processor which is not the processor of the camera (10). Method according to claim 6, characterized in that step (c) comprises robotic movement of the image sensor (20). Method according to claim 5, characterized by attaching a lens to the lens holder (12), and wherein step (c) comprises determining the relative orientation in response to an image quality of the processed image. Method according to claim 4, characterized in that step (d) comprises soldering the printed image sensor board (40) to the first and second printed circuit board when the first and second printed circuit board are attached to the lens holder (12) on opposite sides of the lens holder (12). Method according to claim 4, characterized in that step (d) comprises adhering the printed image sensor board (40) to at least one of the first and second printed circuit boards, when the first and second printed circuit boards are attached to the lens holder (12) on opposite sides of the lens holder (12). Method according to claim 10, characterized in that step (d) further comprises soldering the printed image sensor board (40) to the first and second printed circuit board. Method according to claim 1, characterized in that step (d) comprises soldering the printed image sensor board (40) to the first and second printed circuit board when the first and second printed circuit board are attached to the lens holder (12). Method according to claim 1, characterized in that step (d) comprises adhering the printed image sensor board (40) to the first and second printed circuit board when the first and second printed circuit board are attached to the lens holder (12). Method according to claim 13, characterized in that step (d) further comprises soldering the printed image sensor board (40) to the first and second printed circuit board.

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