Expansion device, method for manufacturing semiconductor chips, and semiconductor chip

Abstract

An expansion device (2) comprises a clamping unit (214), an expansion ring (281) and an image sensor (215) to image a stretched state of a wafer (W1) through the expansion ring (281) at a plurality of times, from a start time St of the stretching of a plate element (W2) to an end time Ed of the stretching of the plate element (W2).

Description

Technical area

[0001] The present invention relates to an expansion device, a method for manufacturing semiconductor chips, and a semiconductor chip, and more particularly, it relates to an expansion device having an expansion ring for dividing a wafer into a plurality of semiconductor chips, a method for manufacturing semiconductor chips, and a semiconductor chip. Technical background

[0002] An expansion device with an expansion ring for dividing a wafer into a plurality of semiconductor chips is known from the prior art. Such an expansion device is disclosed, for example, in Japanese Patent Laid-Open No. 2011-211053.

[0003] Japanese Patent Laid-Open No. 2011-211053 discloses an expansion device with a cylindrical portion for dividing a wafer into a plurality of chips. The expansion device includes a carrier (clamping unit), the cylindrical portion, and an imager. The carrier supports (holds) a processing object including a wafer bonded to an adhesive sheet. The cylindrical portion expands the adhesive sheet supported by the holder to divide the wafer into a plurality of chips.

[0004] The imager measures a distance between the multiple chips after the wafer is divided into the multiple chips. This allows the expansion device to detect a portion where the distance between the plurality of chips is not expanded (a portion that is not divided). State of the artPatent document

[0005] Patent Document 1: Japanese Patent Disclosure No. 2011-211053 Description of the invention Problems to be solved by the invention

[0006] In the expansion device disclosed in Japanese Patent Laid-Open No. 2011-211053, the wafer is divided into a plurality of chips, and then the distance between the plurality of chips is measured. Therefore, when the adhesive film of the processing object is stretched, it is not possible to detect whether the plurality of separated chips have been separated near the end of the expansion ("expansion"). If the plurality of chips have been separated near the end of the expansion of the adhesive film, it is very likely that a wafer is not divided into a plurality of chips due to a slight change, such as the same adhesive film being slightly softer or a modified layer of the wafer being slightly smaller during the next or subsequent expansion of the adhesive film. In such a case, the imager of the device disclosed in Japanese Patent Laid-Open No.The expansion device disclosed in Japanese Patent Application No. 2011-211053 cannot detect the distance between the plurality of chips after the wafer is divided into the plurality of chips, and therefore, it is not possible to detect an event that highly likely prevents the wafer from being divided into the plurality of chips. Therefore, the expansion device disclosed in Japanese Patent Application No. 2011-211053 cannot detect an event predicted to prevent the wafer from being divided into a plurality of chips, and therefore, it is difficult to prevent the possibility that the wafer will not be divided into a plurality of chips.

[0007] The present invention has been proposed to solve the above-mentioned problems, and an object of the present invention is to provide an expansion apparatus, a semiconductor chip manufacturing method, and a semiconductor chip each capable of preventing the possibility that a wafer is not divided into a plurality of chips. Means to solve the problems

[0008] An expansion apparatus according to a first aspect of the present invention includes a clamping unit for holding a wafer ring structure including an elastic plate member to which a wafer to be divided into a plurality of semiconductor chips along a dividing line has been attached; an expansion ring for dividing the wafer into a plurality of spaced-apart semiconductor chips by expanding the plate member while the clamping unit holds the wafer ring structure; and an imager for imaging an expanded state of the wafer through the expansion ring at a plurality of times from a start of expansion of the plate member to an end of expansion of the plate member.

[0009] As described above, the expansion device according to the first aspect of the present invention includes the imager for imaging the expanded state of the wafer by the expansion ring at a plurality of timings from a start of expansion of the plate member to an end of expansion of the plate member. Accordingly, the expanded state (split state) of the wafer near the end of expansion can be detected based on an image captured at a timing near the end of expansion among the plurality of timings imaged by the imager, and thus it is possible to detect whether or not the plurality of separated semiconductor chips near the end of expansion have been separated.When the plurality of semiconductor chips are separated near the end of the plate member's extension, it is highly likely that the wafer will not be divided into the plurality of semiconductor chips due to a slight change, such as the same plate member being slightly softer or a modified layer of the wafer being formed slightly smaller during the next or subsequent plate member extension. In this regard, according to the present invention, the stretched state (split state) of the wafer near the end of the plate member's extension is detected, making it possible to detect an event considered highly likely to prevent the wafer from being divided into the plurality of semiconductor chips.Consequently, it is possible to detect an event predicted to prevent the wafer from being divided into the plurality of semiconductor chips, and thus it is possible to prevent the possibility that the wafer is not divided into the plurality of semiconductor chips.

[0010] In the expansion device according to the first aspect, the imager is preferably operable to capture a moving image including a plurality of captured images obtained by imaging the expanded state of the wafer through the expansion ring at a plurality of consecutive times from a start of expansion of the plate member to an end of expansion of the plate member. Accordingly, the moving image including the plurality of captured images is captured by the imager, so that the expanded state of the wafer from a start of expansion of the plate member to an end of expansion of the plate member can be reliably and completely captured, and thus the time at which the plurality of semiconductor chips have been separated can be accurately detected.

[0011] The expansion device according to the first aspect preferably further comprises an expansion support member for maintaining an expanded state of the plate member in the vicinity of the wafer, and the imager is preferably attached to the expansion support member. Accordingly, it is not necessary to provide a special mounting member for attaching the imager to the expansion device, and thus an increase in the number of components of the expansion device and the complexity of the structure can be reduced or prevented.

[0012] In such a case, the expansion holding member preferably includes a cylindrical press ring surrounding the wafer and a lid for covering the press ring, and the imager is preferably attached to the lid of the expansion holding member. Accordingly, the lid is provided at a position where the upward opening of the cylindrical press ring surrounding the wafer is covered, and thus the imager can be arranged above the wafer. Consequently, the imager images the wafer from above, making it possible to easily image the plurality of semiconductor chips that are separated and spaced from each other.

[0013] In the expansion device in which the imager is located in the lid, the imager is preferably located in a central portion of the lid in the radial direction of the press ring. Accordingly, the entire wafer surrounded by the cylindrical press ring can be easily imaged from above by the imager.

[0014] The expansion device including the expansion support member preferably further includes an element moving mechanism for moving the expansion support member in an up-down direction, and the imager is preferably operable to image the expanded state of the wafer by the expansion ring in a state where the expansion support member, which is lowered by the element moving mechanism, covers the wafer. Accordingly, the expanded state of the wafer can be imaged by the imager at a closer position, and thus, it is possible to obtain an image in which the division of the wafer into the plurality of semiconductor chips is more clearly depicted.

[0015] The expansion device comprising the expansion holding member including the lid preferably further comprises an ultraviolet irradiation device at a position in a downward direction with respect to the imager for irradiating the plate member in the expanded state with ultraviolet rays from below, and the expansion holding member is preferably operable to cover the wafer from above with the cylindrical press ring and the lid so that the ultraviolet rays irradiated onto the plate member from the ultraviolet irradiation device do not leak out of the expansion holding member.Accordingly, the expansion holding member can be used not only as a mounting member for the imager but also as a cover for blocking the ultraviolet rays, and thus an increase in the number of components and the complexity of the structure can be reduced or prevented compared with a case where a cover is separately provided to block the ultraviolet rays.

[0016] The expansion device according to the first aspect preferably further comprises a notification device for notifying a user of an abnormality in the wafer's expanded state through the imager based on an imaging result of the wafer's expanded state. Accordingly, the user can be prompted to recognize the abnormality in the wafer's expanded state, and thus the user can be prompted to correct the abnormality in the wafer's expanded state.

[0017] The expansion device according to the first aspect preferably further comprises a clamping movement mechanism for moving the clamping unit in an up-down direction, wherein the expansion device is preferably operable to expand the plate member by moving the clamping unit downward using the clamping movement mechanism while an upper end of the expansion ring is located at a predetermined height position in the up-down direction, and wherein the imager is preferably operable to image the expanded state of the wafer through the expansion ring when the upper end is located at the predetermined height position. Accordingly, the wafer is held in the expanded state at the predetermined height position, and thus, when the expanded state of the wafer is imaged by the imager, the focus of the imager can be prevented from moving away from the wafer.Consequently, it is possible to prevent the occurrence of a blurred portion in an image showing the stretched state of the wafer taken by the imager.

[0018] The expansion device according to the first aspect preferably further comprises a squeegee unit at a position in a downward direction with respect to the imager for locally pressing the wafer from below after the plate member is expanded by the expansion ring, and the imager is preferably operable to capture images before and after the squeegee unit locally compresses the wafer after the plate member is expanded by the expansion ring. Accordingly, the number of semiconductor chips separated by the pressing of the squeegee unit can be determined from the captured image captured by the imager before the squeegee unit locally compresses the wafer and the captured image captured by the imager after the squeegee unit locally compresses the wafer.

[0019] A method for manufacturing semiconductor chips according to a second aspect of the present invention includes forming a modified layer in a wafer having a plurality of semiconductor chips by emitting a laser beam onto the wafer from a laser irradiation device operable to emit the laser beam, and imaging, by an imager, an expanded state of the wafer by an expansion ring at a plurality of timings from an expansion start of an elastic plate member to which the wafer has been attached to an expansion end of the plate member, while the expansion ring divides the wafer into the plurality of individual semiconductor chips by expanding the plate member in a state where a clamp unit operable to hold a wafer ring structure including the plate member holds the wafer ring structure.

[0020] As described above, the semiconductor chip manufacturing method according to the second aspect of the present invention includes imaging the expanded state of the wafer by the expansion ring at a plurality of timings from a start of expansion of the plate member to an end of expansion of the plate member by the imager. Accordingly, the expanded state (split state) of the wafer near the end of expansion can be detected based on an image acquired at a timing near the end of expansion among the plurality of imaging timings by the imager, and thus it is possible to detect whether or not the plurality of separated semiconductor chips near the end of expansion have been separated.When the plurality of semiconductor chips are separated near the end of the plate member's extension, it is highly likely that the wafer will not be divided into the plurality of semiconductor chips due to a slight change, such as the same plate member being slightly softer or a modified layer of the wafer being formed slightly smaller during the next or subsequent plate member extension. In this regard, according to the present invention, the stretched state (split state) of the wafer near the end of the plate member's extension is detected, making it possible to detect an event that highly likely prevents the wafer from being divided into a plurality of chips.Consequently, it is possible to detect an event predicted to prevent the wafer from being divided into the plurality of semiconductor chips, and thus it is possible to obtain the semiconductor chip manufacturing method that can prevent the possibility that the wafer is not divided into the plurality of semiconductor chips.

[0021] A semiconductor chip according to a third aspect of the present invention is manufactured by an expansion device comprising a clamping unit for holding a wafer ring structure having an elastic plate member to which a wafer to be divided into a plurality of semiconductor chips has been attached along a dividing line; an expansion ring for dividing the wafer into a plurality of spaced-apart semiconductor chips by stretching the plate member while the clamping unit holds the wafer ring structure; and an imager for imaging an expanded state of the wafer by the expansion ring at a plurality of times from a start of expansion of the plate member to an end of expansion of the plate member.

[0022] As described above, the semiconductor chip according to the third aspect of the present invention is manufactured by the expansion device including the imager for imaging the expanded state of the wafer by the expansion ring at a plurality of timings from a start of expansion of the plate member to an end of expansion of the plate member. Accordingly, the expanded state (split state) of the wafer near the end of expansion can be detected based on an image captured by the imager at a timing near the end of expansion among the plurality of imaging timings, and thus it is possible to detect whether or not the plurality of separated semiconductor chips near the end of expansion have been separated.When the plurality of semiconductor chips are separated near the end of the plate member's expansion, it is highly likely that the wafer will not be divided into the plurality of semiconductor chips due to a slight change, such as the same plate member being slightly softer or a modified layer of the wafer being formed slightly smaller during the next or subsequent expansion of the plate member. In this regard, according to the present invention, the expanded state (split state) of the wafer near the end of the plate member's expansion is detected, making it possible to detect an event that highly likely prevents the wafer from being divided into a plurality of chips.Consequently, it is possible to detect an event predicted to prevent the wafer from being divided into the plurality of semiconductor chips, and thus it is possible to obtain the semiconductor chip that can prevent the possibility of the wafer not being divided into the plurality of semiconductor chips. Advantageous effect of the invention

[0023] According to the present invention, as described above, it is possible to prevent the possibility that the wafer is not divided into a plurality of chips. Brief description of the drawings [ Fig. 1] A plan view showing a semiconductor wafer processing apparatus including a dicing device and an expanding device according to a first embodiment. [ Fig. 2] A plan view showing a wafer ring structure to be processed in the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 3] A sectional view taken along the line III-III in Fig. 2. [ Fig. 4] A plan view of the separating device arranged next to the expanding device according to the first embodiment. [ Fig. 5] A side view showing the separating device arranged next to the expanding device according to the first embodiment, viewed from the Y2 direction side. [ Fig. 6] A plan view of the expansion device according to the first embodiment. [ Fig. 7] A side view showing the expansion device according to the first embodiment as seen from the Y2 direction side. [ Fig. 8] A side view showing the expansion device according to the first embodiment, viewed from the X1 direction side. [ Fig. 9] A block diagram showing the control configuration of the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 10] A flowchart of the first half of a semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 11] A flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 12] A side view showing a state in which a clamp unit is arranged in a raised position in the expansion device according to the first embodiment. [ Fig. 13] A side view showing a state where the clamp unit is arranged in a lowered position in the expansion device according to the first embodiment. [ Fig. 14] A side view showing a state in which an ultraviolet irradiation device in the expansion device according to the first embodiment radiates ultraviolet rays. [ Fig. 15] A timing chart showing the lowering of the clamp unit from the raised position to the lowered position and the timing of imaging by an imager in the expansion device according to the first embodiment. [ Fig. 16] A side view showing the state before a moving image is captured by the imager in the expansion device according to the first embodiment. [ Fig. 17] A schematic diagram showing the state of a wafer before capturing a moving image in the expansion apparatus according to the first embodiment. [ Fig. 18] A side view showing an example of a state in the first half of a moving image pickup period by the imager in the expansion device according to the first embodiment. [ Fig. 19] A schematic view showing an example of an image picked up by the imager in the first half of the moving image pickup period in the expanding apparatus according to the first embodiment. [ Fig. 20] A side view showing an example of a state in the latter half of the moving image pickup period by the imager in the expansion device according to the first embodiment. [ Fig. 21] A schematic view showing an example of an image captured by the imager in the latter half of the moving image capturing period in the expanding apparatus according to the first embodiment. [ Fig. 22] A side view showing an example of a state just before the end of the moving image pickup period by the imager in the expansion device according to the first embodiment. [ Fig. 23] A schematic view showing an example of an image captured by the imager just before the end of the moving image capture period in the expansion device according to the first embodiment. [ Fig. 24] A side view showing an example of a state after capturing a moving image by the imager in the expansion device according to the first embodiment. [ Fig. 25] A schematic view showing an example of a post-termination still image acquired after the acquisition of a moving image by the imager in the expansion device according to the first embodiment. [ Fig. 26] A plan view of a notification device in the expansion device according to the first embodiment. [ Fig. 27] A schematic view showing a state in which a tensile force acts on the wafer in the expansion apparatus according to the first embodiment. [ Fig. 28] A schematic view illustrating that semiconductor chips are separated from an outer part of the wafer in the expansion apparatus according to the first embodiment. [ Fig. 29] A schematic view showing an example of a state in which the semiconductor chips have been detected by a computer for dicing control in the expansion apparatus according to the first embodiment. [ Fig. 30] A timing chart showing the timing of imaging by the imager in the expansion apparatus according to the first embodiment. [ Fig. 31] A schematic view of an example in which semiconductor chips are separated from an inner part of the wafer in the expansion apparatus according to the first embodiment. [ Fig. 32] A schematic view showing an example of a state in which semiconductor chips in the post-termination still image were detected by the computer for dicing control in the expansion apparatus according to the first embodiment. [ Fig. 33] A flowchart of a wafer imaging process of the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 34] A plan view of a semiconductor wafer processing apparatus including a dicing apparatus and an expanding apparatus according to a second embodiment. [ Fig. 35] A side view showing the semiconductor wafer processing apparatus having the dicing apparatus and the expanding apparatus according to the second embodiment, viewed from the Y2 direction side. [ Fig. 36] A side view showing the semiconductor wafer processing apparatus having the dicing apparatus and the expanding apparatus according to the second embodiment, as seen from the X1 direction side. [ Fig. 37] A block diagram showing the control configuration of the semiconductor wafer processing apparatus according to the second embodiment. [ Fig. 38] A flowchart of the first half of a semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the second embodiment. [ Fig. 39] A flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the second embodiment. [ Fig. 40] A partial sectional view of an imager and a nitrogen supply device on an expansion holding member of an expansion device according to a third embodiment. [ Fig. 41] A plan view showing a state in which a third mounting member of the nitrogen supply device of the expansion device according to the third embodiment has been removed. [ Fig. 42] A plan view of the third mounting member of the nitrogen supply device of the expansion device according to the third embodiment. [ Fig. 43] A schematic view showing an image taken by an imager before pressing by a doctor unit in an expanding device according to a modification example of the first to third embodiments. [ Fig. 44] A schematic view showing an image taken by the imager after being pressed by the squeegee unit in the expanding device according to the modification example of the first to third embodiments. Modes for carrying out the invention

[0024] Some embodiments of the present invention are described below with reference to the drawings. First embodiment

[0025] The configuration of a semiconductor wafer processing apparatus 100 according to a first embodiment of the present invention will now be described with reference to FIG. Fig. 1 to 33 described. Semiconductor wafer processing device

[0026] As in Fig. As shown in FIG. 1, the semiconductor wafer processing apparatus 100 is an apparatus that processes a wafer W1 provided on a wafer ring structure W. The semiconductor wafer processing apparatus 100 forms a modified layer in the wafer W1 and divides the wafer W1 along the modified layer to form a plurality of semiconductor chips Ch (see FIG. Fig. 8).

[0027] The wafer ring structure W is now described with reference to the Fig. 2 and Fig. 3. The wafer ring structure W comprises the wafer W1, a plate element W2, and an annular element W3.

[0028] The wafer W1 is a circular, thin plate made of a crystal of a semiconductor material used as a material for a semiconductor integrated circuit. The modified layer is formed inside the wafer W1 by modifying the inside along a dividing line through processing in the semiconductor wafer processing apparatus 100. This means that the wafer W1 is processed so that it can be divided along the dividing line. The plate member W2 is an elastic adhesive tape. An adhesive layer is provided on the top surface W21 of the plate member W2. The wafer W1 is bonded to the adhesive layer on the plate member W2. The annular member W3 is a ring-shaped metal frame in plan view. The annular member W3 is attached to the adhesive layer on the plate member W2 and surrounds the wafer W1.

[0029] The semiconductor wafer processing apparatus 100 includes a dicing device 1 and an expanding device 2. Hereinafter, an up-down direction is defined as the Z direction, an upward direction as the Z1 direction, and a downward direction as the Z2 direction. In a horizontal direction perpendicular to the Z direction, a direction in which the dicing device 1 and the expanding device 2 are aligned is defined as the X direction, a direction from the dicing device 1 to the expanding device 2 in the X direction is defined as the X1 direction, and a direction from the expanding device 2 to the dicing device 1 in the X direction is defined as the X2 direction. A direction perpendicular to the X direction in the horizontal direction is defined as the Y direction, a direction in the Y direction is defined as the Y1 direction, and the other direction in the Y direction is defined as the Y2 direction. Separation device

[0030] As in the Fig. 1, Fig. 4 and Fig. As shown in Figure 5, the dicing device 1 emits a laser with a wavelength that is transparent to the wafer W1 along the separation line (street) to form the modified layer. The modified layer refers to a crack, defect, or the like formed within the wafer W1 by the laser. A method for forming the modified layer in the wafer W1 in this way is called dicing.

[0031] The separation device 1 has a base 11, a chuck table unit 12, a laser 13 and an image generator 14.

[0032] The base 11 is a base on which the chuck table unit 12 is installed. The base 11 has a rectangular shape in plan view. Chuck table unit

[0033] The chuck table unit 12 includes a suction unit 12a, clamps 12b, a rotation mechanism 12c, and a table moving mechanism 12d. The suction unit 12a sucks the wafer ring structure W on the upper side of the suction unit 12a on the Z1 direction side. The suction unit 12a is a table with a suction hole, a suction piping, etc., for sucking the lower surface of the annular member W3 of the wafer ring structure W on the Z2 direction side. The suction unit 12a is supported by the table moving mechanism 12d via the rotation mechanism 12c. The clamps 12b are provided at an upper end of the suction unit 12a. The clamps 12b hold the wafer ring structure W sucked by the suction unit 12a. The clamps 12b hold the annular element W3 of the wafer ring structure W sucked by the suction unit 12a from the Z1 direction side. In this way, the wafer ring structure W is held by the suction unit 12a and the clamps 12b.

[0034] The rotation mechanism 12c rotates the suction unit 12a in a circumferential direction about a rotation center axis C parallel to the Z direction. The rotation mechanism 12c is attached to an upper end of the table movement mechanism 12d. The table movement mechanism 12d moves the wafer ring structure W in the X and Y directions. The table movement mechanism 12d includes an X-direction movement mechanism 121 and a Y-direction movement mechanism 122. The X-direction movement mechanism 121 moves the rotation mechanism 12c in the X1 direction or the X2 direction. The X-direction movement mechanism 121 includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. The Y-direction movement mechanism 122 moves the rotation mechanism 12c in the Y1 direction or the Y2 direction.The Y-direction motion mechanism 122 includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. Laser

[0035] The laser 13 emits a laser beam onto the wafer W1 of the wafer ring structure W held by the chuck table unit 12. The laser 13 is arranged on the Z1 direction side of the chuck table unit 12. The laser 13 includes a laser irradiation device 13a, a fixture 13b, and a Z-direction movement mechanism 13c. The laser irradiation device 13a emits a pulsed laser beam. The fixture 13b is a frame to which the laser 13 and the imager 14 are attached. The Z-direction movement mechanism 13c moves the laser 13 in the Z1 or Z2 direction. The Z-direction movement mechanism 13c includes a linear feed module or a ball screw and a drive, which includes, for example, a motor with an encoder.The laser irradiation device 13a may be a laser irradiation device that oscillates a continuous wave laser beam as a laser beam as long as a modified layer can be formed by multiphoton absorption. Image provider

[0036] The imager 14 images the wafer W1 of the wafer ring structure W held by the chuck table unit 12. The imager 14 is arranged on the Z1 direction side of the chuck table unit 12. The imager 14 includes a high-resolution camera 14a, a wide-angle camera 14b, a Z-direction movement mechanism 14c, and a Z-direction movement mechanism 14d.

[0037] The high-resolution camera 14a and the wide-angle camera 14b are near-infrared imaging cameras. The high-resolution camera 14a has a narrower viewing angle than the wide-angle camera 14b. The high-resolution camera 14a has a higher resolution than the wide-angle camera 14b. The wide-angle camera 14b has a wider viewing angle than the high-resolution camera 14a. The wide-angle camera 14b has a lower resolution than the high-resolution camera 14a. The high-resolution camera 14a is arranged on the X1 direction side of the laser irradiation device 13a. The wide-angle camera 14b is arranged on the X2 direction side of the laser irradiation device 13a. Thus, the high-resolution camera 14a, the laser irradiation device 13a, and the wide-angle camera 14b are arranged side by side in this order from the X1 direction side to the X2 direction side.

[0038] The Z-direction movement mechanism 14c moves the high-resolution camera 14a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14c includes a linear conveyor module or a ball screw and a drive, which, for example, has a motor with an encoder. The Z-direction movement mechanism 14d moves the wide-angle camera 14b in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14d includes a linear conveyor module or a ball screw and a drive, which, for example, has a motor with an encoder. Expansion device

[0039] As in the Fig. 1, Fig. 6 and Fig. 7, the expansion device 2 divides the wafer W1 to form the plurality of semiconductor chips Ch (see FIG. Fig. 8). The expansion device 2 forms a sufficient gap between the plurality of semiconductor chips Ch. A modified layer is formed in the wafer W1 by emitting a laser having a wavelength that is transparent to the wafer W1 along the separation line (street) in the dicing device 1. In the expansion device 2, the plurality of semiconductor chips Ch are formed by dividing the wafer W1 along the modified layer previously formed in the dicing device 1.

[0040] Therefore, in the expansion device 2, the wafer W1 is divided along the modified layer by expanding the plate member W2. Furthermore, in the expansion device 2, the gap between the plurality of semiconductor chips Ch formed by the division is increased by expanding the plate member W2.

[0041] The expansion device 2 includes a base 201, a cassette unit 202, a lifting hand unit 203, a suction hand unit 204, a base 205, a cooling air supply unit 206, a cooling unit 207, an expansion member 208, a base 209, an expansion holding member 210, a heat shrink unit 211, an ultraviolet irradiation unit 212, a squeegee unit 213, and a clamp unit 214. base

[0042] The base 201 is a base on which the cassette unit 202 and the lifting hand unit 203 are installed. The base 201 has a rectangular shape in plan view. Cassette unit

[0043] The cassette unit 202 can accommodate a plurality of wafer ring structures W. The cassette unit 202 includes wafer cassettes 202a, a Z-direction moving mechanism 202b, and pairs of placement sections 202c.

[0044] A plurality of (three) wafer cassettes 202a are arranged in the Z direction. Each of the wafer cassettes 202a has a receiving space that can accommodate a plurality of (five) wafer ring structures W. The wafer ring structure W is manually fed and inserted into the wafer cassette 202a. The wafer cassette 202a can accommodate one to four wafer ring structures W or six or more wafer ring structures W. Furthermore, one, two, or four or more wafer cassettes 202a can be arranged in the Z direction.

[0045] The Z-direction movement mechanism 202b moves the wafer cassettes 202a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 202b includes a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The Z-direction movement mechanism 202b also includes mounting tables 202d that support the wafer cassettes 202a from below. A plurality of (three) mounting tables 202d are arranged according to the positions of the plurality of wafer cassettes 202a.

[0046] A plurality of (five) pairs of placement sections 202c are arranged within the wafer cassette 202a. The annular element W3 of the wafer ring structure W is placed on the pair of placement sections 202c from the Z1 direction side. One of the pair of placement sections 202c protrudes in the X2 direction from the inner surface of the wafer cassette 202a on the X1 direction side. The other of the pair of placement sections 202c protrudes in the X1 direction from the inner surface of the wafer cassette 202a on the X2 direction side. Lifting hand unit

[0047] The lifting hand unit 203 can remove the wafer ring structure W from the cassette unit 202. Furthermore, the lifting hand unit 203 can pick up the wafer ring structure W into the cassette unit 202.

[0048] Specifically, the lifting hand unit 203 includes a Y-direction movement mechanism 203a and a lifting hand 203b. The Y-direction movement mechanism 203a includes a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The lifting hand 203b supports the annular element W3 of the wafer ring structure W from the Z2 direction side. Suction hand unit

[0049] The suction hand unit 204 sucks the ring-shaped element W3 of the wafer ring structure W from the Z1 direction side.

[0050] Specifically, the suction hand unit 204 includes an X-direction movement mechanism 204a, a Z-direction movement mechanism 204b, and a suction hand 204c. The X-direction movement mechanism 204a moves the suction hand 204c in the X-direction. The Z-direction movement mechanism 204b moves the suction hand 204c in the Z-direction. The X-direction movement mechanism 204a and the Z-direction movement mechanism 204b each include a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The suction hand 204c sucks and supports the annular element W3 of the wafer ring structure W from the Z1-direction side. The suction hand 204c supports the annular element W3 of the wafer ring structure W by generating a negative pressure. base

[0051] As in the Fig. 7 and Fig. As shown in Figure 8, the base 205 is a base on which the expansion element 208, the cooling unit 207, the ultraviolet irradiation device 212, and the doctor blade unit 213 are installed. The base 205 has a rectangular shape in plan view. Fig. 8, the clamping unit 214, which is arranged on the side of the cooling unit 207 in the Z1 direction, is shown by dotted lines. Cooling air supply device

[0052] The cooling air supply device 206 supplies cooling air to the plate element W2 from the Z1 direction side when the plate element W2 is expanded by the expansion element 208.

[0053] The cooling air supply device 206 specifically includes a supply device main body 206a, a cooling air supply port 206b, and a moving mechanism 206c. Cooling air supplied from a cooling air supply device can flow out through the cooling air supply port 206b. The cooling air supply port 206b is provided at one end of the supply device main body 206a on the Z2 direction side. The cooling air supply port 206b is arranged in a central portion of the end of the supply device main body 206a on the Z2 direction side. The moving mechanism 206c includes, for example, a linear conveyor module or a ball screw and a motor with an encoder.

[0054] The cooling air supply device is a device that generates cool air. The cooling air supply device supplies cooled air, for example, by a heat pump. Such a cooling air supply device is installed on the base 205. The cooling air supply device 206 and the cooling air supply device are connected to each other by a hose (not shown). Cooling unit

[0055] The cooling unit 207 cools the plate element W2 from the Z2 direction side.

[0056] Specifically, the cooling unit 207 includes a cooling element 207a, which includes a heat sink 271 and a Peltier element 272, and a Z-direction movement mechanism 207b. The heat sink 271 is made of a member with a large heat capacity and high thermal conductivity. The heat sink 271 is made of a metal such as aluminum. The Peltier element 272 cools the heat sink 271. The heat sink 271 is not limited to aluminum and can also be made of another member with a large heat capacity and high thermal conductivity. The Z-direction movement mechanism 207b is a cylinder.

[0057] The cooling unit 207 is movable in the Z1 direction or the Z2 direction by the Z-direction moving mechanism 207b. Thus, the cooling unit 207 is movable to a position where it contacts the plate member W2 and to a position spaced apart from the plate member W2. Expansion element

[0058] The expansion element 208 expands the plate element W2 of the wafer ring structure W to divide the wafer W1 along the separation line.

[0059] Specifically, the expansion element 208 includes an expansion ring 281. The expansion ring 281 expands the plate element W2 by supporting the plate element W2 from the Z2 direction. The expansion ring 281 has a ring shape in plan view. The structure of the expansion ring 281 is described in detail below. base

[0060] The base 209 is a support material to which the cooling air supply device 206, the expansion holding element 210 and the shrink tube 211 are attached. Expansion holding element

[0061] As in the Fig. 7 and Fig. 8, the expansion holding member 210 holds the plate member W2 from the Z1 direction side so that the plate member W2 does not shrink near the wafer W1 due to heating by a heater ring 211a.

[0062] Specifically, the expansion holding member 210 includes a pressing ring 210a, a lid 210b, and an inlet 210c. The pressing ring 210a has a ring shape in plan view. The lid 210b is provided on the pressing ring 210a to cover an opening of the pressing ring 210a. The inlet 210c is an inlet ring with a ring shape in plan view. A plurality of inlet openings are formed in the lower surface of the inlet 210c on the Z2 direction side. The pressing ring 210a is moved in the Z direction by a Z-direction moving mechanism 210d. That is, the Z-direction moving mechanism 210d moves the pressing ring 210a to a position where the plate member W2 is held down and to a position away from the plate member W2. The Z-direction movement mechanism 210d includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder.The Z-direction movement mechanism 210d is an example of an "element movement mechanism" as defined in the claims. The structure of the expansion holding element 210 will be described in more detail below. Heat shrink device

[0063] The heat shrinking device 211 shrinks the plate member W2 expanded by the expansion member 208 by heating, maintaining the gap between the plurality of semiconductor chips Ch.

[0064] The heat shrink device 211 includes the heating ring 211a and a Z-direction movement mechanism 211b. The heating ring 211a has a ring shape in plan view. The heating ring 211a has a jacketed heater that heats the plate member W2. The Z-direction movement mechanism 211b moves the heating ring 211a in the Z direction. The Z-direction movement mechanism 211b includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. Ultraviolet irradiation facility

[0065] The ultraviolet irradiation device 212 emits ultraviolet rays onto the plate member W2 to reduce the adhesive force of the adhesive layer of the plate member W2. Specifically, the ultraviolet irradiation device 212 includes an ultraviolet illumination device. The ultraviolet irradiation device 212 is arranged at one end of a press 213a of the squeegee unit 213 described below, on the Z1 direction side. The ultraviolet irradiation device 212 radiates the ultraviolet rays Ut onto the plate member W2 while moving together with the squeegee unit 213. Squeegee unit

[0066] The squeegee unit 213 divides the wafer W1 along the modified layer by locally pressing the wafer W1 from the side in the Z2 direction after the plate member W2 is expanded. Specifically, the squeegee unit 213 includes the press 213a, a Z-direction moving mechanism 213b, an X-direction moving mechanism 213c, and a rotation mechanism 213d.

[0067] The press 213a generates bending stress in the wafer W1 to divide the wafer W1 along the modified layer by being moved by the rotation mechanism 213d and the X-direction movement mechanism 213c, while compressing the wafer W1 from the Z2 direction side via the plate member W2. The press 213a presses the wafer W1 by being raised by the Z-direction movement mechanism to a raised position on the Z1 direction side to contact the wafer W1 via the plate member W2. When the press 213a is lowered by the Z-direction movement mechanism to a lowered position on the Z2 direction side, contact with the wafer W1 is released, so that the wafer W1 is no longer compressed. The press 213a is a squeegee.

[0068] The press 213a is attached to one end of the Z-direction movement mechanism 213b on the Z1 direction side. The Z-direction movement mechanism 213b moves the press 213a linearly in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 213b is, for example, a cylinder. The Z-direction movement mechanism 213b in the Z direction is attached to one end of the X-direction movement mechanism 213c on the Z1 direction side.

[0069] The X-direction movement mechanism 213c is mounted on one end of the rotary mechanism 213d on the Z1 direction side. The X-direction movement mechanism 213c linearly moves the press 213a in one direction. The X-direction movement mechanism 213c includes a linear feed module or a ball screw and a drive, for example, a motor with an encoder.

[0070] In the squeegee unit 213, the press 213a is raised by the Z-direction movement mechanism. In the squeegee unit 213, the press 213a is moved in the Y-direction by the X-direction movement mechanism 213c while locally compressing the wafer W1 from the Z2-direction side via the plate member W2, so that the wafer W1 is divided. In the squeegee unit 213, the press 213a is lowered to the lowered position by the Z-direction movement mechanism. After the press 213a completes its movement in the Y-direction, the press 213a in the squeegee unit 213 is rotated 90 degrees by the rotation mechanism 213d.

[0071] In the squeegee unit 213, the press 213a is raised by the Z-direction movement mechanism 213b. After the press 213a is rotated 90 degrees in the squeegee unit 213, the press 213a is moved by the X-direction movement mechanism 213c while locally pressing the wafer W1 from the Z2 direction side via the plate member W2, so that the wafer W1 is divided. clamping unit

[0072] The clamping unit 214 holds the annular element W3 of the wafer ring structure W. Specifically, the clamping unit 214 includes a gripper 214a, a Z-direction movement mechanism 214b, and a Y-direction movement mechanism 214c. The gripper 214a supports the annular element W3 from the Z2 direction side and holds down the annular element W3 from the Z1 direction side. Thus, the annular element W3 is held by the gripper 214a. The gripper 214a is connected to the Z-direction movement mechanism 214b. The Z-direction movement mechanism 214b is an example of a "clamp movement mechanism" in the claims.

[0073] The Z-direction movement mechanism 214b moves the clamping unit 214 in the Z-direction. Specifically, the Z-direction movement mechanism 214b moves the gripper 214a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 214b includes a linear conveyor module or a ball screw and a drive, which has, for example, a motor with an encoder. The Z-direction movement mechanism 214b is connected to the Y-direction movement mechanism 214c. The Y-direction movement mechanism 214c moves the Z-direction movement mechanism 214b in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 214c includes a linear conveyor module or a ball screw and a drive, which has, for example, a motor with an encoder. Control configuration of a semiconductor wafer processing apparatus

[0074] As in Fig. 9, the semiconductor wafer processing apparatus 100 includes a first controller 101, a second controller 102, a third controller 103, a fourth controller 104, a fifth controller 105, a sixth controller 106, a seventh controller 107, an eighth controller 108, a stretch control computer 109, a handling control computer 110, a singulation control computer 111, and a memory 112.

[0075] The first controller 101 controls the squeegee unit 213. The first controller 101 includes a central processing unit (CPU) and a memory, which includes, for example, a read-only memory (ROM) and a random access memory (RAM). The first controller 101 may include a hard disk drive (HDD) as memory, which retains the stored information even after the power is turned off. The hard disk drive may be provided jointly for the first controller 101, the second controller 102, the third controller 103, the fourth controller 104, the fifth controller 105, the sixth controller 106, the seventh controller 107, and the eighth controller 108.

[0076] The second controller 102 controls the cooling air supply device 206 and the cooling unit 207. The second controller 102 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The third controller 103 controls the heat shrink device 211 and the ultraviolet irradiation device 212. The third controller 103 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The second controller 102 and the third controller 103 may include a hard disk as storage, which retains stored information even after the power is turned off.

[0077] The fourth controller 104 controls the cassette unit 202 and the lifting hand unit 203. The fourth controller 104 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The fifth controller 105 controls the suction hand unit 204. The fifth controller 105 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The fourth controller 104 and the fifth controller 105 can include a hard disk as storage, which retains stored information, for example, even after the power is turned off.

[0078] The sixth controller 106 controls the chuck table unit 12. The sixth controller 106 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The seventh controller 107 controls the laser 13. The seventh controller 107 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The eighth controller 108 controls the imager 14. The eighth controller 108 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The sixth controller 106, the seventh controller 107, and the eighth controller 108 can include, for example, a hard disk as storage, which retains stored information even after the power is turned off.

[0079] The expansion control computer 109 performs calculations regarding a process for expanding the plate element W2 based on the processing results of the first controller 101, the second controller 102, and the third controller 103. The expansion control computer 109 includes a CPU and a memory, such as a ROM and a RAM. The configuration of the expansion control computer 109 is described in detail below.

[0080] The handling control computer 110 performs calculations regarding a process for moving the wafer ring structure W based on the processing results of the fourth controller 104 and the fifth controller 105. The handling control computer 110 includes a CPU and a memory, for example, a ROM and a RAM.

[0081] The singulation control computer 111 performs calculations related to a process for singulating the wafer W1 based on the processing results of the sixth controller 106, the seventh controller 107, and the eighth controller 108. The singulation control computer 111 includes a CPU and a memory, for example, a ROM and a RAM.

[0082] The memory 112 stores programs for operating the separating device 1 and the expanding device 2. The memory 112 includes, for example, a ROM, a RAM, and an HDD.

[0083] Manufacturing process of semiconductor chips The overall operation of the semiconductor wafer processing apparatus 100 will be described below with reference to the Fig. 10 and Fig. 11 described.

[0084] In step S1, the wafer ring structure W is removed from the cassette unit 202. That is, after the wafer ring structure W stored in the cassette unit 202 is supported by the lifting hand 203b, the lifting hand 203b is moved in the Y1 direction by the Y-direction moving mechanism 203a, so that the wafer ring structure W is removed from the cassette unit 202. In step S2, the wafer ring structure W is transferred to the chuck table unit 12 of the dicing device 1 by the suction hand 204c. That is, the wafer ring structure W removed from the cassette unit 202 is moved in the X2 direction by the X-direction moving mechanism 204a while being sucked by the suction hand 204c. The wafer ring structure W, which has been moved in the X2 direction, is brought to the chuck table unit 12 by the suction hand 204c and then held by the chuck table unit 12.

[0085] In step S3, a modified layer is formed in the wafer W1 by the laser 13. In step S4, the wafer ring structure W containing the wafer W1 in which the modified layer has been formed is transferred from the suction hand 204c to the clamping unit 214. In step S5, the plate member W2 is cooled by the cooling air supply device 206 and the cooling unit 207. That is, the wafer ring structure W held by the clamping unit 214 is moved (lowered) in the Z2 direction by the Z-direction moving mechanism 214b to contact the cooling unit 207, and the cooling air supply device 206 supplies cooling air from the Z1 direction side to cool the plate member W2.

[0086] In step S6, the wafer ring structure W is moved from the clamping unit 214 to the expansion member 208. That is, the wafer ring structure W with the cooled plate member W2 is moved in the Y1 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. In step S7, the plate member W2 is expanded by the expansion member 208. That is, the wafer ring structure W is moved in the Z2 direction 214b by the Z-direction moving mechanism while being held by the clamping unit 214. Then, the plate member W2 contacts the expansion ring 281 and is expanded by pulling the expansion ring 281. In this way, the wafer W1 is divided along the dividing line (modified layer).

[0087] In step S8, the expanded plate member W2 is held downward from the Z1 direction side by the expansion holding member 210. That is, the pressing ring 210a is moved (lowered) in the Z2 direction by the Z-direction moving mechanism 210d until it touches the plate member W2. Then, the process proceeds from a point A in Fig. 10 over a point A in Fig. 11 proceed to step S9.

[0088] As in Fig. As shown in Figure 11, in step S9, after the plate member W2 is held down by the expansion holding member 210, the plate member W2 is irradiated with ultraviolet rays Ut by the ultraviolet irradiation device 212 while the wafer W1 is pressed by the squeegee unit 213. In this way, the wafer W1 is further divided by the squeegee unit 213. Furthermore, the adhesive force of the plate member W2 is reduced by the ultraviolet rays Ut emitted by the ultraviolet irradiation device.

[0089] In step S10, while the heat shrinking device 211 heats and shrinks the plate member W2, the clamping unit 214 is lifted. At this time, the inlet 210c sucks air near the heated plate member W2. In step S11, the wafer ring structure W is transferred from the clamping unit 214 to the suction hand 204c. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. Then, the wafer ring structure W is sucked by the suction hand 204c after the holding by the clamping unit 214 on the cooling unit 207 side is released in the Z1 direction.

[0090] In step S12, the wafer ring structure W is transferred from the suction hand 204c to the lifting hand 203b. In step S13, the wafer ring structure W is stored in the cassette unit 202. That is, the wafer ring structure W carried by the lifting hand 203b is moved in the Y1 direction by the Y-direction moving mechanism 203a to be stored in the cassette unit 202. This completes the process performed on one wafer ring structure W. Then, the process returns from a point B in Fig. 11 via a point B in Fig. 10 back to step S1.

[0091] Detailed configuration of expansion element, expansion holding element, ultraviolet irradiation device and squeegee unit

[0092] The detailed configuration of the expansion member 208, the expansion holding member 210, the ultraviolet irradiation device 212 and the doctor unit 213 will now be described with reference to the Fig. 12 and Fig. 13 described. In Fig. 12, the heat shrink device 211 of the expansion device 2 is not shown for the sake of simplicity.

[0093] Fig. Figure 12 shows the state of the expansion device 2 before the plate member W2 is expanded by the expansion ring 281. The clamp unit 214 is arranged in a raised position Up. That is, the gripper 214a is arranged in the raised position Up by the Z-direction movement mechanism 214b.

[0094] Fig. 13 shows the state of the expansion device 2 in which the plate member W2 is expanded by the expansion ring 281. The clamp unit 214 is arranged in a lowered position Lw. That is, the gripper 214a is moved by the Z-direction moving mechanism 214b in the Z2 direction from the raised position Up to the lowered position Lw.

[0095] The plate member W2 is expanded by contact with an upper end 281a of the expansion ring 281 when the gripper 214a is moved in the Z2 direction from the raised position Up to the lowered position Lw. At this time, the wafer W1 is pulled by the plate member W2, so that a tensile stress is generated in the wafer W1, and thus the wafer W1 is divided along the modified layer formed in the wafer W1. In this way, the plurality of semiconductor chips Ch are formed. Expansion element

[0096] The expansion member 208 includes the expansion ring 281, which divides the wafer W1 into a plurality of semiconductor chips Ch spaced apart by an interval Mr by expanding the plate member W2 while the clamp unit 214 holds the wafer ring structure W. That is, the expansion ring 281 expands the plate member W2 by the clamp unit 214, which is moved in the Z2 direction from the raised position Up toward the lowered position Lw by the Z-direction moving mechanism 214b.

[0097] The expansion ring 281 is attached to the base 205. The upper end 281a of the expansion ring 281 is positioned at a predetermined height position Hd in the Z direction. The predetermined height position Hd is a height position with the top surface of the base 205 as a reference point. In this way, the upper end 281a of the expansion ring 281 is held at the predetermined height position Hd.

[0098] As in Fig. 14, the expansion holding member 210 maintains the expanded state of the plate member W2 near the wafer W1. In Fig. 14, the heat shrink device 211 of the expansion device 2 is not shown for the sake of simplicity.

[0099] The expansion holding element 210 has in particular the pressing ring 210a and the cover 210b.

[0100] The press ring 210a has a cylindrical shape that encloses the wafer W1 in plan view. The lid 210b covers the opening of the press ring 210a, which opens in the Z1 direction. The lid 210b is provided on the inner side 1210a of the press ring 210a to close the opening of the press ring 210a, which opens in the Z1 direction. The lid 210b is provided at one end of the inner side 1210a of the press ring 210a on the Z1 direction side. The inner side 1210a is the inner side of the cylindrical press ring 210a in the radial direction.

[0101] The cover 210b has a through-hole 1210b penetrating in the Z direction. The through-hole 1210b is provided in a central portion of the cover 210b in the radial direction of the pressing ring 210a. An image sensor 215 is attached to the through-hole 1210b to close the through-hole 1210b.

[0102] The ultraviolet irradiation device 212 emits ultraviolet rays Ut onto the plate element W2 in the stretched state from the Z2 direction side. The ultraviolet irradiation device 212 is located at a position in the Z2 direction with respect to the imager 215. The ultraviolet irradiation device 212 is located in the Z2 direction with respect to the wafer W1 of the plate element W2 in the stretched state.

[0103] The cylindrical press ring 210a and the lid 210b cover the wafer W1 from the Z1 direction side to prevent the ultraviolet rays Ut emitted by the ultraviolet irradiation device 212 from leaking out of the expansion holding member 210. Thus, the expansion holding member 210 not only has the function of maintaining the expanded state of the plate member W2 near the wafer W1 but also the function of shielding the ultraviolet rays Ut. The expansion holding member 210 is made of metal, such as stainless steel, to reduce or prevent material deterioration caused by shielding the ultraviolet rays Ut. Imager and notification device

[0104] The expansion device 2 according to the first embodiment includes the imager 215 and a notification device 216. Image provider

[0105] The imager 215 images the expanded state of the wafer W1 of the wafer ring structure W held by the clamp unit 214. That is, the imager 215 images the expanded state (divided state) of the wafer W1 by the expansion ring 281, with the upper end 281a located at the predetermined height position Hd (see FIG. Fig. 13).

[0106] The imager 215 is a wide-angle camera with a viewing angle that enables imaging of the entire wafer W1 in the expanded state from the Z1 direction side. The imager 215 includes a plurality of illuminators (not shown). The plurality of illuminators illuminate the wafer W1 in a space covered by the expansion holding member 210 when the expansion holding member 210 covers the wafer W1 from the Z1 direction side. The space is a space surrounded by the plate member W2 and the wafer W1 in the expanded state, and the expansion holding member 210. Thus, the imager 215 images the expanded state of the wafer W1 by the expansion ring 281 in a state where the expansion holding member 210 lowered by the Z-direction moving mechanism 210d covers the wafer W1.

[0107] The image sensor 215 is attached to the expansion support member 210. Specifically, the image sensor 215 is attached to the cover 210b of the expansion support member 210. The image sensor 215 is arranged in the central portion of the cover 210b in the radial direction of the pressing ring 210a. The radial direction of the pressing ring 210a is substantially perpendicular to the Z direction.

[0108] As in Fig. 15, the imager 215 images the expanded state of the wafer W1 through the expansion ring 281 at a plurality of times from the expansion start time St to the expansion end time Ed of the plate member W2. Fig. 15 is a timing chart showing an example of an imaging process by the imager 215.

[0109] Specifically, the imager 215 captures a moving image including a plurality of captured images obtained by imaging the stretched state (divided state) of the wafer W1 through the expansion ring 281 at a plurality of consecutive times from the stretch start time St to the stretch end time Ed of the plate member W2. For example, when the time required for the expansion ring 281 to stretch the wafer W1 is approximately 0.1 to 2 seconds, the imager 215 captures a moving image at approximately 100 fps. The frame rate of the moving image captured by the imager 215 is set in advance by a user.

[0110] The imager 215 starts capturing a moving image of the stretched state of the wafer W1 when the clamp unit 214 starts to descend from the raised position Up, and stops capturing a moving image of the stretched state of the wafer W1 when the clamp unit 214 reaches the lowered position Lw.

[0111] The imager 215 captures a still image of the semiconductor chips Ch separated from the wafer W1 after it has finished capturing a moving image of the stretched state of the wafer W1.

[0112] Thus, the image pickup process by the imager 215 is performed during a motion picture pickup period T and at a time point after the end of the motion picture pickup Tp. The time point before the start of the motion picture pickup refers to the time point immediately before the clamp unit 214 starts to lower from the raised position Up. The motion picture pickup period T refers to the time point between the time point at which the clamp unit 214 starts to lower from the raised position Up and the time point at which the clamp unit 214 reaches the lowered position Lw. The time point after the end of the motion picture pickup Tp refers to the time point immediately after the clamp unit 214 reaches the lowered position Lw.

[0113] The motion picture recording period T can be divided, for example, into a first half T1, a second half T2, and a final part T3. The first half T1 is a period of time during the motion picture recording period T that precedes the second half T2 and the final part T3. The second half T2 is a period of time between the first half T1 and the second half T2 during the motion picture recording period T. The final part T3 is a period of time during the motion picture recording period T that follows the second half T2.

[0114] The imaging process by the imager 215 in the first half T1, the second half T2 and the last part T3 as well as at the time after the end of the moving image recording Tp will now be described with reference to the Fig. 15 to 25 described.

[0115] As in the Fig. 16 and Fig. As shown in Figure 17, before the start of motion picture recording, the expansion ring 281 contacts the plate member W2 near the wafer W1. The expansion support member 210 has moved to an upper position so that it does not contact the plate member W2 that contacts the expansion ring 281 near the wafer W1. The upper position is a region on the Z1 direction side with respect to the plate member W2 that contacts the expansion ring 281 near the wafer W1. Due to the modified layer in the wafer W1, a crack Cr is formed in the wafer W1.

[0116] As in the Fig. 18 and Fig. 19, in the first half T1, a first captured image P1 is captured as one of a plurality of captured images captured in the motion picture capture by the imager 215. In the first half T1, the clamp unit 214 is lower than the raised position Up. As a result, a part of the wafer W1 is divided into a plurality of semiconductor chips Ch due to a tensile stress caused by the expansion of the plate member W2. The portion of the wafer W1 is a portion outside an undivided central portion of the wafer W. The imager 215 captures the first captured image P1 in which the wafer W1 on the center side, which remains undivided, and the plurality of semiconductor chips Ch formed outside the wafer W1 on the center side appear as one of the plurality of captured images captured in the motion picture capture.

[0117] As in the Fig. 20 and Fig. 21, in the second half T2, a second captured image P2 is captured as one of a plurality of captured images captured in the motion picture capture by the imager 215. In the second half T2, the clamp unit 214 is lower than the height position of the clamp unit 214 in the first half T1. As a result, the entire wafer W1 is divided into a plurality of semiconductor chips Ch due to a tensile stress caused by the expansion of the plate member W2. The imager 215 captures the second captured image P2, in which the separated semiconductor chips Ch appear, as one of the plurality of captured images captured in the motion picture capture.

[0118] As in the Fig. 22 and Fig. 23, in the final part T3, a third captured image P3 is captured as one of the plurality of captured images captured in the motion picture capture by the imager 215. In the final part T3, the clamp unit 214 is lower than the height position of the clamp unit 214 in the second half part T2. Similar to the second half T2, the entire wafer W1 is divided into a plurality of semiconductor chips Ch. The imager 215 captures the third captured image P3 in which the separated semiconductor chips Ch appear as one of the plurality of captured images captured in the motion picture capture.

[0119] As in the Fig. 24 and Fig. As shown in Fig. 25, the imager 215 brings the plate member W2 near the wafer W1 into contact with the expansion ring 281 at the time point after the end of the moving image recording Tp, and images the plurality of semiconductor chips Ch with the expanded plate member W2. Thus, a post-termination still image Pe is captured. Notification setup

[0120] The notification device 216 notifies the user of an abnormality in the stretched state of the wafer W1 based on the imaging results of the stretched state of the wafer W1 by the imager 215. The imaging results refer to the plurality of captured images (such as the first captured image P1, the second captured image P2, and the third captured image P3) captured during the moving image acquisition by the imager 215.

[0121] The notification device 216 includes a display for informing the user of the abnormality in the stretched state of the wafer W1 by displaying the abnormality on a screen. The notification device 216 may be a notification device that notifies the user of the abnormality in the stretched state of the wafer W1 through communication. Detailed configuration of the computer for strain control

[0122] In the expansion device 2, the expansion control computer 109 performs control to detect the semiconductor chips Ch separated from the wafer W1 based on the plurality of captured images captured during the moving image acquisition by the imager 215. In other words, the expansion control computer 109 checks the timing at which the entire wafer W1 was divided into a plurality of semiconductor chips Ch when the wafer W1 is expanded, a change in the timing at which the entire wafer W1 was divided into a plurality of semiconductor chips Ch when the wafer W1 is expanded, and the order in which the wafer W1 was divided when the wafer W1 is expanded.

[0123] An overview of detecting the separated semiconductor chips Ch based on a plurality of captured images will now be described with reference to the Fig. 27 and Fig. 28 described. Fig. 27 shows a state in which an outer part of the wafer W1 is divided into semiconductor chips Ch1, and then a part of the wafer W1 inside the semiconductor chips Ch1 is divided into semiconductor chips Ch2. Fig. Figure 28 shows the wafer W1 before stretching.

[0124] When the expansion of the wafer W1 is compared with a separation force Ef exerted on the semiconductor chips Ch1 at the moment the semiconductor chips Ch1 are separated and a separation force Ef exerted on the semiconductor chips Ch2 at the moment the semiconductor chips Ch2 are separated, the separation force Ef exerted on the semiconductor chips Ch2 is increased by the amount of the expansion force of the plate member W2, which is increased by the lowering of the clamp unit 214. In such a case, however, in addition to the gaps between the semiconductor chips Ch1 and the semiconductor chips Ch2, the gaps between the semiconductor chips Ch2 and the wafer W1 are also increased, so the separation force Ef exerted on the semiconductor chips Ch2 is reduced by the amount of the escaped tensile stress on the wafer W1.

[0125] As in Fig. 28, the length of the parting line (crack Cr) of the wafer W1 is smaller in the outer part (shown with hatching) of the wafer W1 than in the inner part (shown without hatching) of the wafer W1. In addition, the number of semiconductor chips Ch to be separated is smaller in the outer region (shown with hatching) of the wafer W1 than in the inner region (shown without hatching) of the wafer W1. Therefore, when the separation force Ef is applied to the wafer W1, the outer part (shown with hatching) of the wafer W1 is more likely to be divided into semiconductor chips Ch than the inner part (shown without hatching) of the wafer W1, and thus the wafer W1 is divided inward from the outer part (shown with hatching) of the wafer W1.

[0126] In this way, the separated semiconductor chips Ch are detected, so that it is possible to check the time at which the wafer W1 was divided into the semiconductor chips Ch and whether the wafer W1 was broken apart starting from the outer part (shown hatched) or not. Method for detecting separated semiconductor chips

[0127] As in Fig. 29, the strain control computer 109 performs control to detect the semiconductor chip Ch separated from the wafer W1 in each of the plurality of captured images based on the outer shape of the semiconductor chip Ch in a plan view.

[0128] In Fig. Figure 29 shows the first captured image P1 as an example of one of the plurality of captured images. The outer shape in plan view for detecting the semiconductor chip Ch by the image process is determined in advance by the user based on the length in the X direction, the length in the Y direction, and a tolerance (for example, about 5%). Fig. 29, the outer shape of the semiconductor chip Ch in plan view is exemplary rectangular. When a shape matching the outer shape of the semiconductor chip Ch in plan view, which was determined in advance, is detected in the first captured image P1, the strain control computer 109 performs control to detect the shape as the semiconductor chip Ch. The detected semiconductor chip Ch is displayed with rectangular hatching.

[0129] As in Fig. 30, the strain control computer 109 performs control to detect the timing at which the semiconductor chips Ch were separated, based on the semiconductor chips Ch detected in the plurality of captured images captured in the moving image capture during the moving image capture period T.

[0130] Specifically, the stretch control computer 109 performs control to transmit the stretched-state abnormality to the notification device 216 based on detecting the semiconductor chips Ch captured in the image (for example, the third captured image P3) captured in the last part T3 among the plurality of captured images. That is, when semiconductor chips Ch are formed by dividing a part of the wafer W1 that was not divided in the first half T1 and the second half T2 in the last part T3, the notification device 216 is notified of the stretched-state abnormality.In addition, the strain control computer 109 performs control to specify the semiconductor chips Ch detected in the image (for example, the third captured image P3) taken in the final part T3 and not in the image (for example, the first captured image P1) taken in the first half T1 or the image (for example, the second captured image P2) taken in the second half T2.

[0131] In such a case, all the semiconductor chips Ch are separated from the wafer W1, but there is a high probability that a part of the wafer W1 is not separated, for example, due to the hardness of the plate member W2, the condition of the wafer W1, or a change in room temperature. Therefore, the user is prompted to detect the abnormality in the stretched state through the notification device 216, so that the user can be prompted to make a change, such as increasing the descent speed of the Z-direction moving mechanism 214b of the clamp unit 214 or lowering the lowered position Lw of the clamp unit 214.

[0132] The strain control computer 109 performs control to notify the strained state abnormality to the notification device 216 based on a difference between the first time point at which the semiconductor chips Ch are detected and the first time point at which the semiconductor chips Ch are detected in recent days. In such a case, the first time point at which the semiconductor chips Ch are detected in the day is in the second half of T2, but the first time point at which the semiconductor chips Ch are detected in recent days is in the first half of T1, for example. In such a case, there is a high possibility that there will be an unexpected change in, for example, the batch difference of the plate material W2 or the temperature in the facility.Therefore, the notification device 216 causes the user to recognize the abnormality in the expanded state so that the plate material W2 or the facility can be checked.

[0133] As in Fig. As shown in Fig. 31, the stretch control computer 109 performs control to transmit the stretched-state abnormality to the notification device 216 based on the fact that the wafer W1 is not divided from the outer part of the wafer W1 inward. For example, in a region Ar of the captured image, a semiconductor chip Ch separated from the wafer W1 is detected within the wafer W1 in a region Ar1 and the wafer W1 in a region Ar2. Then, when a semiconductor chip Ch is detected in at least one of the wafer W1 in the region Ar1 or the wafer W1 in the region Ar2 in the next captured image, it is detected that the wafer W1 has not been divided from the outer part of the wafer W1 toward the inside.In such a case, there is a high probability that the plate member W2 is not evenly expanded, poor attachment of the wafer W1 to the plate member W2 occurs, or the modified layer formed in the wafer W1 is not uniform. Therefore, the notification device 216 prompts the user to detect the abnormality in the expanded state so that the plate member W2 or the dicing device 1 can be inspected.

[0134] As in Fig. As shown in Figure 32, the stretch control computer 109 performs control to detect the number of separated semiconductor chips Ch based on the semiconductor chips Ch detected in the post-termination still image Pe taken after the end of the shooting of the moving image Tp. The stretch control computer 109 performs control to identify whether the separation of the semiconductor chips Ch is good or not based on the detected number of separated semiconductor chips Ch. Fig. 32, the detected semiconductor chips Ch are displayed with a rectangular hatching. Wafer imaging process

[0135] The wafer imaging process using the strain control calculator 109 and the imager 215 of the semiconductor wafer processing apparatus 100 will now be described below with reference to Fig. 33 described.

[0136] In step S101, it is determined whether the clamp unit 214 has reached the raised position "Up" or not. If the clamp unit 214 has reached the raised position "Up," the process proceeds to step S102, and if the clamp unit 214 has not reached the raised position "Up," the process operation in step S101 is repeated. In step S102, it is determined whether the clamp unit 214 has started to lower or not. If the clamp unit 214 has started to lower, the process proceeds to step S103, and if the clamp unit 214 has not started to lower, the process operation in step S102 is repeated.

[0137] In step S103, the imager 215 begins capturing a moving image of the wafer W1 in the expanded state. The clamp unit 214 begins to descend, and thus the plate member W2 contacting the expansion ring 281 is expanded by the downwardly moving clamp unit 214. In step S104, it is determined whether or not the clamp unit 214 has reached the lowered position Lw. If the clamp unit 214 has reached the lowered position Lw, the process proceeds to step S105. If the clamp unit 214 has not reached the lowered position Lw, the process in step S104 is repeated.

[0138] In step S105, the post-termination still image Pe is captured by the imager 215, and then the wafer imaging process is terminated.

[0139] In a process other than the wafer imaging process in a manufacturing method for the semiconductor chip Ch (the semiconductor chip manufacturing process described above), which is a manufacturing method for manufacturing the semiconductor chip Ch, the dicing control computer 111 performs a step of forming a modified layer in the wafer W1 by emitting a laser beam onto the wafer W1 including the plurality of semiconductor chips Ch from the laser irradiation device 13a that emits the laser beam.Furthermore, the expansion control computer 109 performs a step of imaging, by the imager 215, the expanded state of the wafer W1 by the expansion ring 281 at a plurality of timings from a start of expansion of the plate member W2 to an end of expansion of the plate member W2, while the expansion ring 281 divides the wafer W1 into the plurality of individual semiconductor chips Ch by expanding the plate member W2 in a state where the clamp unit 214 operable to hold the wafer ring structure W holds the wafer ring structure W.

[0140] The semiconductor chip Ch manufactured by such a semiconductor chip Ch manufacturing method is manufactured by the expansion device 2 having the clamp unit 214, the expansion ring 281, and the imager 215. Advantageous effects of the first embodiment

[0141] According to the first embodiment, the following advantageous effects are achieved.

[0142] According to the first embodiment, as described above, the expansion device 2 includes the imager 215 for imaging the expanded state of the wafer W1 by the expansion ring 281 at the plurality of timings from the expansion start timing St to the expansion end timing Ed of the plate member W2. Accordingly, the expanded state (split state) of the wafer W1 near the expansion end timing Ed can be detected based on an image captured at a timing near the expansion end timing Ed among the plurality of timings of imaging by the imager 215, and thus, it is possible to detect whether or not the plurality of separated semiconductor chips Ch have been separated near the expansion end timing Ed.When the plurality of semiconductor chips Ch have been separated from the wafer W1 near the end of the extension of the plate member W2, it is very likely that the wafer W1 will not be divided into the plurality of semiconductor chips Ch due to a slight change, such as that the same plate member W2 is slightly softer or that a modified layer of the wafer W1 is formed slightly smaller at the next or subsequent extension of the plate member W2.In this regard, according to the present invention, the stretched state (divided state) of the wafer W1 near the end of the extension of the plate member W2 is detected so that it is possible to detect an event that is considered highly likely to prevent the wafer W1 from being divided into the plurality of semiconductor chips Ch, and consequently, it is possible to detect an event that is predicted to prevent the wafer W1 from being divided into the plurality of semiconductor chips Ch, and thus it is possible to prevent the possibility that the wafer W1 is not divided into the plurality of semiconductor chips Ch.

[0143] According to the first embodiment, as described above, the imager 215 is operable to capture the moving image including the plurality of captured images obtained by imaging the expanded state of the wafer W1 through the expansion ring 281 at the plurality of consecutive times from the expansion start time St to the expansion end time Ed of the plate member W2. Accordingly, the moving image including the plurality of captured images is captured by the imager 215, so that the expanded state of the wafer W1 from the expansion start time St to the expansion end time Ed of the plate member W2 can be reliably and completely captured, and thus the time at which the plurality of semiconductor chips Ch have been separated can be accurately detected.

[0144] According to the first embodiment, as described above, the expansion device 2 includes the expansion support member 210 for maintaining the expanded state of the plate member W2 near the wafer W1. The imager 215 is attached to the expansion support member 210. Accordingly, it is not necessary to provide a special mounting member for fixing the imager 215 to the expansion device 2, and thus an increase in the number of components of the expansion device 2 and the complexity of the structure can be reduced or prevented.

[0145] According to the first embodiment, as described above, the expansion holding member 210 includes the cylindrical pressing ring 210a surrounding the wafer W1. The expansion holding member 210 includes the lid 210b for covering the upward opening of the pressing ring 210a. The imager 215 is attached to the lid 210b of the expansion holding member 210. Accordingly, the lid 210b is provided at a position where the upward opening of the cylindrical pressing ring 210a surrounding the wafer W1 is covered, and thus the imager 215 can be arranged above the wafer W1. Consequently, the imager 215 images the wafer W1 from above, making it possible to easily image the plurality of semiconductor chips Ch that are separated and spaced from each other.

[0146] According to the first embodiment, as described above, the imager 215 is located in the central portion of the lid 210b in the radial direction of the press ring 210a. Accordingly, the entire wafer W1 surrounded by the cylindrical press ring 210a can be easily imaged from above by the imager 215.

[0147] According to the first embodiment, as described above, the expansion device 2 includes the Z-direction moving mechanism 210d for moving the expansion holding member 210 in the up-down direction. The imager 215 is capable of imaging the expanded state of the wafer W1 by the expansion ring 281 in a state where the expansion holding member 210, which is lowered by the Z-direction moving mechanism 210d, covers the wafer W1. Accordingly, the expanded state of the wafer W1 can be imaged by the imager 215 at a closer position, and thus, it is possible to obtain an image in which the division of the wafer W1 into the plurality of semiconductor chips Ch is more clearly imaged.

[0148] According to the first embodiment, as described above, the expansion device 2 includes the ultraviolet irradiation device 212 at a position in the Z2 direction with respect to the imager 215 for irradiating the plate member W2 in the expanded state from below with ultraviolet rays Ut. The expansion holding member 210 can cover the wafer W1 from above with the cylindrical pressing ring 210a and the lid 210b, so that the ultraviolet rays Ut irradiated onto the plate member W2 by the ultraviolet irradiation device 212 do not leak out of the expansion holding member 210.Accordingly, the expansion holding member 210 can be used not only as a mounting member for the imager 215 but also as a cover for blocking the ultraviolet rays Ut, and thus an increase in the number of components and the complexity of the structure can be reduced or prevented compared with a case where a cover is separately provided to block the ultraviolet rays.

[0149] According to the first embodiment, as described above, the expansion device 2 includes the notification device 216 for informing the user of the abnormality in the expanded state of the wafer W1 based on the imaging results of the expanded state of the wafer W1 by the imager 215. Accordingly, the user can be prompted to recognize the abnormality in the expanded state of the wafer W1, and thus the user can be prompted to improve the abnormality in the expanded state of the wafer W1.

[0150] According to the first embodiment, as described above, the expansion device 2 includes the Z-direction moving mechanism 214b for moving the clamp unit 214 in the up-down direction. In the expansion device 2, the plate member W2 is expanded by moving the clamp unit 214 downward using the Z-direction moving mechanism 214b while the upper end 281a of the expansion ring 281 is located at the predetermined height position Hd in the up-down direction. The imager 215 is capable of imaging the expanded state of the wafer W1 through the expansion ring 281 when the upper end 281a is located at the predetermined height position Hd. Accordingly, the wafer W1 in the stretched state is held at the predetermined height position Hd, and thus, when the stretched state of the wafer W1 is imaged by the imager 215, the focus of the imager 215 can be prevented from moving away from the wafer W1.Consequently, it is possible to prevent the occurrence of a blurred portion in an image showing the stretched state of the wafer W1 taken by the imager 215.

[0151] According to the first embodiment, as described above, the manufacturing method of the semiconductor chip Ch includes a step of imaging the expanded state of the wafer W1 by the expansion ring 281 at a plurality of timings from a start of expansion of the plate member W2 to an end of expansion of the plate member W2 by the imager 215. Accordingly, the expanded state (split state) of the wafer W1 near the end of expansion can be detected based on the image captured at the timing near the end of expansion from among the plurality of timings of imaging by the imager 215, and thus it is possible to detect whether or not the plurality of separated semiconductor chips Ch have been separated near the end of expansion.When the plurality of semiconductor chips Ch have been separated near the end of the extension of the plate member W2, it is highly likely that the wafer W1 will not be divided into the plurality of semiconductor chips Ch due to a slight change, such as the same plate member W2 being slightly softer or a modified layer of the wafer W1 being formed slightly smaller during the next or subsequent extension of the plate member W2. In this regard, according to the present invention, the stretched state (split state) of the wafer W1 near the end of the extension of the plate member W2 is detected so that it is possible to detect an event that prevents the wafer W1 from being divided into the plurality of chips with high probability.Consequently, it is possible to detect an event predicted to prevent the wafer W1 from being divided into the plurality of semiconductor chips Ch, and thus it is possible to obtain the manufacturing method for the semiconductor chip Ch that can prevent the possibility that the wafer W1 is not divided into the plurality of semiconductor chips Ch.

[0152] According to the first embodiment, as described above, the semiconductor chip Ch is manufactured by the expansion device 2 including the imager 215 to image the expanded state of the wafer W1 by the expansion ring 281 at a plurality of timings from a start of expansion of the plate member W2 to an end of expansion of the plate member W2. Accordingly, the expanded state (split state) of the wafer W1 near the end of expansion can be detected based on the image acquired at the timing near the end of expansion from among the plurality of imaging timings by the imager 215, and thus it is possible to detect whether or not the plurality of separated semiconductor chips Ch near the end of expansion have been separated.When the plurality of semiconductor chips Ch have been separated near the end of the extension of the plate member W2, it is highly likely that the wafer W1 will not be divided into the plurality of semiconductor chips Ch due to a slight change, such as the same plate member W2 being slightly softer or a modified layer of the wafer W1 being formed slightly smaller during the next or subsequent extension of the plate member W2. In this regard, according to the present invention, the stretched state (split state) of the wafer W1 near the end of the extension of the plate member W2 is detected so that it is possible to detect an event considered highly likely to prevent the wafer W1 from being divided into the plurality of chips.Consequently, it is possible to detect an event predicted to prevent the wafer W1 from being divided into the plurality of semiconductor chips Ch, and thus it is possible to obtain the semiconductor chip Ch that can prevent the possibility that the wafer W1 is not divided into the plurality of semiconductor chips Ch. Second embodiment

[0153] The configuration of a semiconductor wafer processing apparatus 300 according to a second embodiment will now be described with reference to FIG. Fig. 34 to 39. In the second embodiment, unlike the first embodiment, a doctor unit 3213 is arranged outside an expansion ring 3281. In the second embodiment, a detailed description of the same or similar configurations as in the first embodiment is omitted. In the second embodiment, a detailed description of the same or similar configurations as in the first embodiment is omitted.

[0154] Semiconductor wafer processing apparatus As in Fig. 34 and Fig. 35, the semiconductor wafer processing apparatus 300 is an apparatus that processes a wafer W1 provided on a wafer ring structure W.

[0155] The semiconductor wafer processing apparatus 300 includes a dicing device 1 and an expanding device 302. An up-down direction is defined as the Z direction, an upward direction is defined as the Z1 direction, and a downward direction is defined as the Z2 direction. In a horizontal direction perpendicular to the Z direction, a direction in which the dicing device 1 and the expanding device 302 are aligned is defined as the X direction, a direction from the dicing device 1 to the expanding device 302 in the X direction is defined as the X1 direction, and a direction from the expanding device 302 to the dicing device 1 in the X direction is defined as the X2 direction.A direction perpendicular to the X direction in the horizontal direction is defined as the Y direction, a direction in the Y direction is defined as the Y1 direction, and the other direction in the Y direction is defined as the Y2 direction. Separation device

[0156] The dicing device 1 emits a laser having a wavelength transparent to the wafer W1 along a separation line (street) to form a modified layer.

[0157] The separation device 1 specifically comprises a base 11, a chuck table unit 12, a laser 13 and an image generator 14. Expansion device

[0158] As in the Fig. 35 and Fig. 36, the expansion device 302 divides the wafer W1 to form a plurality of semiconductor chips Ch.

[0159] The expansion device 302 includes a base 201, a cassette unit 202, a lifting hand unit 203, a suction hand unit 204, a base 205, a cooling air supply device 206, a cooling unit 207, an expansion member 3208, a base 209, an expansion holding member 210, a heat shrink device 211, an ultraviolet irradiation device 212, a squeegee unit 3213, a clamping unit 214, an imager 215, and a notification device 216. Expansion element

[0160] The expansion element 3208 expands a plate element W2 of the wafer ring structure W to divide the wafer W1 along the separation line.

[0161] Specifically, the expansion element 3208 includes an expansion ring 3281 and a Z-direction movement mechanism 3282.

[0162] The expansion ring 3281 expands the plate member W2 by supporting the plate member W2 from the Z2 direction side. The expansion ring 3281 has a ring shape in plan view. The Z-direction movement mechanism 3282 moves the expansion ring 3281 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 3282 includes a linear conveyor module or a ball screw and a drive, such as a motor with an encoder. The Z-direction movement mechanism 3282 is fixed to the base 205. In the expanded state, an upper end 3281a of the expansion ring 3281 is held at a predetermined height position Hd by the Z-direction movement mechanism 3282. Squeegee unit

[0163] The squeegee unit 3213 further divides the wafer W1 along the modified layer by pressing the wafer W1 from the side in the Z2 direction after the plate member W2 is stretched. Specifically, the squeegee unit 3213 includes a press 3213a, an X-direction moving mechanism 3213b, a Z-direction moving mechanism 3213c, and a rotation mechanism 3213d.

[0164] The press 3213a generates bending stress in the wafer W1 to divide the wafer W1 along the modified layer by being moved by the rotating mechanism 3213d and the X-direction moving mechanism 3213b, while pressing the wafer W1 from the Z2 direction side over the plate member W2 after being moved by the Z-direction moving mechanism 3213c. The press 3213a is a squeegee roller. The press 3213a is attached to one end of the rotating mechanism 3213d on the Z1 direction side. The Z-direction moving mechanism 3213c moves the rotating mechanism 3213d in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 3213c includes, for example, a cylinder. The Z-direction moving mechanism 3213c is fixed to one end of the X-direction moving mechanism 3213b on the Z1 direction side.The X-direction movement mechanism 3213b includes a linear motion module or a ball screw and a drive, such as a motor with an encoder. The X-direction movement mechanism 3213b is mounted on one end of the base 205 on the Z1 direction side.

[0165] In the squeegee unit 3213, the press 3213a divides the wafer W1 by moving in the Y direction by the X-direction moving mechanism 3213b, while pressing the wafer W1 from the Z2 direction side over the plate member W2 after being moved in the Z1 direction by the Z-direction moving mechanism 3213c. Furthermore, in the squeegee unit 3213, after the press 3213a completes its movement in the Y direction, the press 3213a is rotated 90 degrees by the rotation mechanism 3213d. Moreover, the press 3213a in the squeegee unit 3213 divides the wafer W1 by being moved in the X direction by the X direction moving mechanism 3213b while pressing the wafer W1 from the Z2 direction side over the plate member W2 after being rotated by 90 degrees. Control configuration of a semiconductor wafer processing apparatus

[0166] As in Fig. 37, the semiconductor wafer processing apparatus 300 includes a first controller 101, a second controller 102, a third controller 103, a fourth controller 3104, a fifth controller 3105, a sixth controller 3106, a seventh controller 3107, an eighth controller 3108, a ninth controller 3109, a stretch control computer 3110, a handling control computer 3111, a dicing control computer 3112, and a memory 3113.The first controller 101, the second controller 102, the third controller 103, the fifth controller 3105, the sixth controller 3106, the seventh controller 3107, the eighth controller 3108, the ninth controller 3109, the stretch control computer 3110, the handling control computer 3111, the singulation control computer 3112, and the memory 3113 have the same configurations as the first controller 101, the second controller 102, the third controller 103, the fourth controller 104, the fifth controller 105, the sixth controller 106, the seventh controller 107, the eighth controller 108, the stretch control computer 109, the handling control computer 110, the singulation control computer 111, and the memory 112 according to the first embodiment, and therefore its description is omitted.

[0167] The fourth controller 3104 controls the expansion element 3208. The fourth controller 3104 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The fourth controller 3104 may include, for example, a hard disk as memory, which retains stored information even after the power is turned off.

[0168] Process for manufacturing semiconductor chips The overall operation of the semiconductor wafer processing apparatus 300 will be described below with reference to the Fig. 38 and Fig. 39 described.

[0169] The processes in step S1 to step S6, step S8 and step S11 are respectively the same as the processes in step S1 to step S6, step S8 and step S11 in the method for manufacturing semiconductor chips according to the first embodiment, so the description thereof is omitted.

[0170] In step S307, the plate member W2 is expanded by the expansion member 3208. That is, the expansion ring 3281 is moved in the Z1 direction by the Z-direction moving mechanism 3282. The wafer ring structure W is moved in the Z2 direction by a Z-direction moving mechanism 214b while being held by the clamp unit 214. Then, the plate member W2 is expanded by contact with the expansion ring 3281 and pulled by the expansion ring 3281. In this way, the wafer W1 is divided along the dividing line (modified layer).

[0171] As in Fig. As shown in Fig. 39, in step S309, while the heat shrinking device 211 heats and shrinks the plate member W2 and the ultraviolet irradiation device 212 irradiates the plate member W2 with ultraviolet rays Ut, the clamp unit 214 is lifted. At this time, an inlet 210c sucks air near the heated plate member W2. In step S310, the wafer ring structure W is moved by the clamp unit 214 to the squeegee unit 3213. That is, the wafer ring structure W is moved in the Y2 direction by a Y-direction moving mechanism 214c while being held by the clamp unit 214.

[0172] In step S311, after the wafer ring structure W is moved to the squeegee unit 3213, the wafer W1 is pressed by the squeegee unit 3213. Thus, the wafer W1 is further divided by the squeegee unit 3213. Detailed configuration of the computer for strain control

[0173] The detailed configuration of the strain control calculator 3110 is the same as the detailed configuration of the strain control calculator 109 according to the first embodiment, so its description is omitted. The other configurations of the second embodiment are similar to those of the first embodiment, so their description is omitted. Advantageous effects of the second embodiment

[0174] According to the second embodiment, the following advantageous effects are achieved.

[0175] According to the second embodiment, the expansion device 302, similar to the first embodiment, includes the imager 215 for imaging the expanded state of the wafer W1 by the expansion ring 3281 at a plurality of timings from the expansion start timing St to the expansion end timing Ed of the plate member W2. Accordingly, it is possible to prevent the possibility of the wafer W1 not being divided into the plurality of semiconductor chips Ch. The other advantageous effects of the second embodiment are similar to those of the first embodiment, and therefore, their description is omitted. Third embodiment

[0176] The configuration of a semiconductor wafer processing apparatus 400 according to a third embodiment will now be described with reference to FIG. Fig. 40 to 42. In the third embodiment, unlike the first embodiment, an expansion device 402 includes both an imager 4215 and a nitrogen supply device 4217. In the third embodiment, a detailed description of the same or similar configurations as in the first embodiment will be omitted.

[0177] Semiconductor wafer processing apparatus As in Fig. 40, the semiconductor wafer processing apparatus 400 is an apparatus that processes a wafer W1 provided on a wafer ring structure W.

[0178] The semiconductor wafer processing apparatus 400 includes a dicing device 1 and the expansion device 402. An up-down direction is defined as the Z direction, an upward direction is defined as the Z1 direction, and a downward direction is defined as the Z2 direction. In a horizontal direction perpendicular to the Z direction, a direction in which the dicing device 1 and the expansion device 402 are aligned is defined as the X direction, a direction from the dicing device 1 to the expansion device 402 in the X direction is defined as the X1 direction, and a direction from the expansion device 402 to the dicing device 1 in the X direction is defined as the X2 direction.A direction perpendicular to the X direction in the horizontal direction is defined as the Y direction, a direction in the Y direction is defined as the Y1 direction, and the other direction in the Y direction is defined as the Y2 direction. Separation device

[0179] The dicing device 1 emits a laser having a wavelength transparent to the wafer W1 along a separation line (street) to form a modified layer.

[0180] The separation device 1 specifically comprises a base 11, a chuck table unit 12, a laser 13 and an image generator 14. Expansion device

[0181] As in Fig. 40 and Fig. 41, the expansion device 402 divides the wafer W1 to form a plurality of semiconductor chips Ch.

[0182] The expansion device 402 includes a base 201, a cassette unit 202, a lifting hand unit 203, a suction hand unit 204, a base 205, a cooling air supply device 206, a cooling unit 207, an expansion member 208, a base 209, an expansion holding member 4210, a heat shrink device 211, an ultraviolet irradiation device 212, a squeegee unit 213, a clamping unit 214, the imager 4215, a notification device 216, and the nitrogen supply device 4217. Expansion holding element

[0183] As in Fig. 40, the expansion holding member 4210 includes a pressing ring 4210a and a cover 210b.

[0184] The press ring 4210a includes an air release hole 4211a. The air release hole 4211a is a hole through which the oxygen in the expansion holding member 4210 flows out through the nitrogen supplied from the nitrogen supply device 4217. The air release hole 4211a penetrates the press ring 4210a in the radial direction. The air release hole 4211a is located on the Z2 direction side of the press ring 4210a.

[0185] The cover 210b includes a through-hole 1210b extending in the Z direction. The through-hole 1210b is provided in a central portion of the cover 210b in the radial direction of the pressing ring 4210a. The imager 4215 is arranged within the through-hole 1210b. Furthermore, the nitrogen supply device 4217 is attached to an edge of the through-hole 1210b on the Z1 direction side. The through-hole 1210b is covered with the nitrogen supply device 4217. Image provider

[0186] The imager 4215 images the stretched state of the wafer W1 of the wafer ring structure W held by the clamp unit 214. The imager 4215 is a fisheye camera with a viewing angle that enables imaging of the entire wafer W1 in the stretched state from the Z1 direction side. Nitrogen supply device

[0187] As in the Fig. 40 and Fig. 41, immediately before the ultraviolet irradiation by the ultraviolet irradiation device 212, the nitrogen supply device 4217 flows nitrogen into a space inside the expansion holding member 4210, so that oxygen is not supplied to a part of the plate member W2 on which the adhesive force is to be reduced during the ultraviolet irradiation by the ultraviolet irradiation device 212.

[0188] The nitrogen supply device 4217 has a first mounting element 4217a, a second mounting element 4217b, a third mounting element 4217c and a nitrogen supply hose 4217d.

[0189] The first mounting member 4217a is fixed to the edge of the through-hole 1210b on the Z1-direction side surface of the cover 4210b of the expansion support member 4210. The first mounting member 4217a has an X-shape when viewed from the Z1 direction. The imager 4215 is fixed to a central portion of the Z2-direction side surface of the first mounting member 4217a by a plurality of (four) screws 4217e.

[0190] The second mounting member 4217b is attached to the Z1-direction surface of the first mounting member 4217a. The second mounting member 4217b has an annular shape when viewed from the Z1-direction side. The second mounting member 4217b is a spacer that forms a space between the first mounting member 4217a and the third mounting member 4217c, allowing the nitrogen supplied through the nitrogen supply tube 4217d to flow into this space.

[0191] As in the Fig. 40 and Fig. As shown in Figure 42, the third mounting member 4217c is fixed to the Z1-direction surface of the second mounting member 4217b. The second mounting member 4217b has a circular shape when viewed from the Z1 side. The third mounting member 4217c is a cover that covers the through-hole 1210b from the Z1-direction side.

[0192] The first mounting member 4217a, the second mounting member 4217b, and the third mounting member 4217c are all fixed to the edge of the through hole 1210b of the cover 210b on the Z1 direction side by a plurality of (four) screws 4217f.

[0193] The nitrogen supply hose 4217d supplies nitrogen to the space within the expansion support member 4210 through a gap between the first mounting member 4217a and the third mounting member 4217c. The nitrogen supply hose 4217d is horizontally attached to a central portion of the third mounting member 4217c via a hose joint 4217g. The nitrogen supply hose 4217d is connected to a nitrogen supply source (not shown).

[0194] Thus, the oxygen in the expansion holding member 4210 is purged with nitrogen through the air release hole 4211a, so that no oxygen is supplied to the part of the plate member W2 where the adhesive force is to be reduced during ultraviolet irradiation, and thus the adhesive force of the plate member W2 can be reduced by ultraviolet irradiation from the ultraviolet irradiation device 212. The other configurations of the third embodiment are similar to those of the first embodiment, so their description is omitted.

[0195] Advantageous Effects of the Third Embodiment According to the third embodiment, the following advantageous effects are achieved.

[0196] According to the third embodiment, the expansion device 402, similar to the first embodiment, includes the imager 4215 for imaging the expanded state of the wafer W1 by the expansion ring 281 at a plurality of timings from the expansion start time St to the expansion end time Ed of the plate member W2. Accordingly, it is possible to prevent the possibility of the wafer W1 not being divided into the plurality of semiconductor chips Ch. The other advantageous effects of the third embodiment are similar to those of the first embodiment, and therefore, their description is omitted. Modification examples

[0197] The embodiments disclosed at this time are to be considered as illustrative and not restrictive in all respects. The scope of the present invention is not indicated by the above description of the embodiments, but by the scope of the claims. Furthermore, all modifications (modification examples) are included within the meaning and scope corresponding to the scope of the claims.

[0198] For example, although in each of the aforementioned first to third embodiments, the example in which the imager 215 (4215) images the state of the plate member W2 spread by the expansion ring 281 (3281) was shown, the present invention is not limited thereto. In the present invention, the imager 215 (4215) may be configured as shown in a modification example in FIGS. Fig. 43 and Fig.44, a captured image Ps1 and a captured image Ps2 before and after the wafer W1 is compressed by the squeegee unit 213 (3213). The captured image Ps1 is an image captured by the imager 215 (4215) before the wafer W1 is compressed, and the captured image Ps2 is an image captured by the imager 215 (4215) after the wafer W1 is compressed. That is, the expansion device 2 (302, 402) has the squeegee unit 213 (3213) at a position in the downward direction with respect to the imager 215 (4215) to locally press the wafer W1 from below after the plate member W2 is expanded by the expansion ring 281 (3281). The imager 215 (4215) takes images before and after the squeegee unit 213 (3213) locally compresses the wafer W1 after the plate member W2 is expanded by the expansion ring 281 (3281).Accordingly, the number of semiconductor chips Ch separated by the pressing of the squeegee unit 213 (3213) can be detected from the captured image Ps1 captured by the imager 215 (4215) before the squeegee unit 213 (3213) locally compresses the wafer W1 and the captured image Ps2 captured by the imager 215 (4215) after the squeegee unit 213 (3213) locally compresses the wafer W1.

[0199] Although in each of the aforementioned first to third embodiments, the example in which the imager 215 (4215) captures a moving image with a plurality of captured images was shown, the present invention is not limited to this. In the present invention, the imager can perform high-speed imaging in which a plurality of captured images are captured. In other words, the imager captures the expanded state of the wafer by the expansion ring using high-speed image capture in which a plurality of images are captured at a plurality of consecutive times with shorter time intervals than in the normal moving image capture from a start of expansion of the plate member to a stop of expansion of the plate member.Accordingly, the imager performs high-speed imaging so that the detailed stretched state of the wafer from the start of the expansion of the film material to the end of the expansion of the film part can be detected, and thus the time at which the plurality of semiconductor chips were separated can be detected more accurately.

[0200] Although in each of the aforementioned first to third embodiments, the example in which the imager 215 (4215) captures a moving image with a plurality of captured images captured at a plurality of consecutive times was shown, the present invention is not limited thereto. In the present invention, the imager may intermittently capture a plurality of images as still images.

[0201] Although the example in which the image sensor 215 (4215) is mounted on the expansion support member 210 (4210) was shown in each of the aforementioned first to third embodiments, the present invention is not limited thereto. In the present invention, the image sensor may also be mounted on the upper base of the expansion device.

[0202] Although the example in which the image sensor 215 is mounted on the cover 210b of the expansion support member 210 (4210) was shown in each of the aforementioned first to third embodiments, the present invention is not limited thereto. In the present invention, the image sensor may also be mounted on the press ring.

[0203] Although in each of the aforementioned first to third embodiments, the example in which the image sensor 215 is attached to the central portion of the cover 210b of the expansion support member 210 (4210) was shown, the present invention is not limited thereto. In the present invention, the image sensor may be attached to a portion other than the central portion of the cover.

[0204] Although the example in which the expansion holding member 210 (4210) includes the cover 210b was shown in each of the aforementioned first to third embodiments, the present invention is not limited thereto. In the present invention, the expansion holding member may not include the cover.

[0205] Although in each of the aforementioned first to third embodiments, the example was shown in which the notification device 216 includes a display to notify the user of the abnormality in the stretched state of the wafer W1 by displaying the abnormality on the screen, the present invention is not limited thereto. In the present invention, instead of notifying the user of the abnormality in the stretched state of the wafer by the notification device, the abnormality in the stretched state of the wafer may be recorded in a memory.

[0206] Although in each of the aforementioned first to third embodiments, the example was shown in which the strain control calculator 109 (3110) determines that the semiconductor chips Ch separated from the wafer W1 have been detected when the external shape of the semiconductor chip Ch in a plan view matches the shape of the semiconductor chip Ch separated from the wafer W1 in the plurality of images captured by the imager 215, the present invention is not limited to this. In the present invention, the strain control calculator can detect a distance between the detected adjacent semiconductor chips based on the horizontal position coordinates, inclinations, and dimensions of the semiconductor chips detected in the plurality of images captured by the imager, and determine whether or not the semiconductor chips separated from the wafer have been detected.

[0207] Although the example in which the expansion device 2 (302, 402) includes the squeegee unit 213 (3213) was shown in each of the aforementioned first to third embodiments, the present invention is not limited thereto. In the present invention, the expansion device may not include the squeegee unit.

[0208] While the control process of the strain control calculator 109 (3110) is described using the flowchart in a manner driven by a process flow in which processes are performed in order along a process flow for convenience in each of the aforementioned first to third embodiments, the present invention is not limited thereto. In the present invention, the control process of the strain control calculator may be performed in an event-driven manner, with the processes being performed in an event-based manner. In this case, the control process may be performed entirely in an event-driven manner or in a combination of event-driven and process-driven. List of reference symbols 2, 302, 402 expansion device 12b terminal 210, 4210 Expansion retaining element 210a, 4210a press ring 210b lid 210d Z-direction movement mechanism (element movement mechanism) 212 Ultraviolet irradiation facility 213, 3213 doctor blade unit 214 clamping unit 214b Z-direction movement mechanism (clamping movement mechanism) 215, 4215 Imagers 216 Notification setup 281, 3281 expansion ring 281a, 3281a upper end (of the expansion ring) 1210a Inside (of the press ring) Ch, Ch1, Ch2 semiconductor chip Ed stretch end time Hd preset height position P1 first captured image (multiple captured images) P2 second captured image (multiple captured images) P3 third captured image (multiple captured images) St Beginning of expansion Ut ultraviolet rays W wafer ring structure W1 wafer W2 plate element QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 2011-211053 [0002, 0006] JP 2011-211053 [0003, 0005, 0006]

Claims

[1] Expansion device, comprising: a clamping unit for holding a wafer ring structure having an elastic plate member to which a wafer to be divided into a plurality of semiconductor chips along a dividing line has been attached; an expansion ring for dividing the wafer into a plurality of spaced-apart semiconductor chips by expanding the plate member while the clamping unit holds the wafer ring structure; and an imager for imaging an expanded state of the wafer through the expansion ring at a plurality of times from a start of expansion of the plate member to an end of expansion of the plate member. [2] The expansion apparatus according to claim 1, wherein the imager is operable to capture a moving image including a plurality of captured images obtained by imaging the expanded state of the wafer through the expansion ring at a plurality of consecutive times from a start of expansion of the plate member to an end of expansion of the plate member. [3] The expansion device according to claim 1, further comprising: an expansion holding member for maintaining an expanded state of the plate member in the vicinity of the wafer; wherein the imager is attached to the expansion support element. [4] The expansion device according to claim 3, wherein the expansion holding member comprises: a cylindrical press ring surrounding the wafer; and a cover for covering the pressing ring; and the imager is attached to the cover of the expansion holding member. [5] The expansion device according to claim 4, wherein the imager is located in a central portion of the lid in a radial direction of the pressing ring. [6] The expansion device according to claim 3, further comprising: an element moving mechanism for moving the expansion holding element in an up / down direction; where the imager is operable to image the expanded state of the wafer by the expansion ring in a state where the expansion holding member lowered by the member moving mechanism covers the wafer. [7] The expansion device according to claim 4, further comprising: an ultraviolet irradiation device at a position in a downward direction with respect to the imager for irradiating the plate member in the stretched state from below with ultraviolet rays; wherein the expansion holding member is operable to cover the wafer from above with the cylindrical pressing ring and the lid, so that the ultraviolet rays radiated from the ultraviolet irradiation device onto the plate member do not escape outward from the expansion holding member. [8] The expansion device according to claim 1, further comprising: a notification device for notifying a user of an abnormality in the stretched state of the wafer through the imager based on an imaging result of the stretched state of the wafer. [9] The expansion device according to claim 1, further comprising: a clamping movement mechanism for moving the clamping unit in an up-down direction; wherein the expansion device is operable to expand the plate member by moving the clamp unit downward using the clamp movement mechanism while an upper end of the expansion ring is at a predetermined height position in the up-down direction; and the imager is operable to image the expanded state of the wafer through the expansion ring with the upper end at the predetermined height position. [10] The expansion device according to claim 1, further comprising: a squeegee unit at a position in a downward direction with respect to the imager for locally pressing the wafer from below after the plate member has been expanded by the expansion ring; wherein the imager is operable to capture images before and after the doctor unit locally compresses the wafer after the plate member has been expanded by the expansion ring. [11] A method for manufacturing a semiconductor chip, comprising: Forming a modified layer in a wafer having a plurality of semiconductor chips by emitting a laser beam onto the wafer from a laser irradiation device operable to emit the laser beam; Imaging, by an imager, a stretched state of the wafer by an expansion ring at a plurality of times from a stretching start of an elastic plate member to which the wafer has been attached to a stretching end of the plate member, while the expansion ring divides the wafer into the plurality of individual semiconductor chips by stretching the plate member in a state in which a clamp unit operable to hold a wafer ring structure including the plate member holds the wafer ring structure. [12] A semiconductor chip manufactured by an expansion device, the expansion device comprising: a clamping unit for holding a wafer ring structure having an elastic plate member on which a wafer to be divided into a plurality of semiconductor chips along a dividing line has been mounted; an expansion ring for dividing the wafer into a plurality of spaced-apart semiconductor chips by expanding the plate member while the clamping unit holds the wafer ring structure; and an imager for imaging an expanded state of the wafer through the expansion ring at a plurality of times from a start of expansion of the plate member to an end of expansion of the plate member.

Images