Temperature control device, test device, temperature control method and temperature control program

Abstract

A temperature control device is provided, comprising: a mounting unit containing a mounting surface on which a plate-shaped test object is mounted, the test object having a plurality of components formed on it; a plurality of heating devices, each of which is provided for each of a plurality of zones into which the mounting surface is divided, and configured to heat a corresponding zone; a component temperature sensing unit configured to acquire component temperature data according to a temperature measurement in a test specimen connected to a probe for operational testing among the plurality of components of the test object; and a temperature control unit configured to control at least one of the plurality of heating devices corresponding to at least one of the plurality of zones on which at least a part of the test specimen is mounted.so that a gap between a temperature specified by the component temperature data and a first target temperature is closed.

Description

Background1. Technical area

[0001] The present invention relates to a temperature control device, a testing device, a temperature control method and a temperature control program. 2. State of the art

[0002] Patent Document 1 describes: “ Fig. 1 is a diagram of a dual-zone temperature control system 102 for an electrostatic chuck 104 holding a workpiece 106 in a plasma processing chamber 124." (paragraph 0014), "This diagram shows a dual-zone system or a dual-circuit system with two independent coolant flow zones." (paragraph 0018) and the like.

[0003] Patent Document 2 describes: “The processing apparatus 100 performs predetermined processing, such as plasma etching, plasma CVD (Chemical Vapor Deposition), or heat treatment, on the semiconductor wafer W, which is an exemplary object to be processed.” (paragraph 0024), “The upper surface of the electrostatic chuck 6 on which the semiconductor wafer W is mounted is, for example, concentrically divided into a plurality of divided regions.” (paragraph 0042), “For example, as shown in Fig. 4, the heating device 6c is provided for each divided area 60 inside the electrostatic holder 6 and below each divided area 60." (paragraph 0043), "For example, as shown in Fig. 4, at least one temperature sensor 20 is provided for each divided area 60 on the lower surface of the electrostatic chuck 6." (paragraph 0044) and the like.

[0004] Patent Document 3 states: "The temperature distribution of each of the divided zones can be individually controlled by the plurality of main heaters, and the temperature in each zone can be finely adjusted by a sub-heater that generates heat, with the amount per unit area being smaller than that of the main heater. Thus, when a plate-shaped sample is held, even if a temperature distribution partially occurs in the plate-shaped sample due to changes in the plasma generation state or the film formation condition, the temperature distribution can be suppressed by finely adjusting the temperature by the sub-heater" (paragraph 0045).

[0005] Patent Document 4 describes: "The temperature control device 20 controls the temperature of the electronic component D formed in the wafer W on the stage 10 so that the temperature is fixed at a target temperature by heating by the heating mechanism 40 and cooling by the cooling mechanism 50." (paragraph 0029), "In the heating mechanism 40, the LED light incident on the lid member 31 on which the wafer W of the stage 10 is mounted is controlled in 43 LED units. Accordingly, the heating mechanism 40 can direct the LED light only to any portion in the lid member 31 or cause the intensity of the irradiation light for any portion to be different from that for another portion.” (paragraph 0033) and “However, during inspection, the relay 82 is often connected on the cable 81 side on the tester 4 side, and therefore, for example, the temperature measuring circuit 80 uses the temperature of the electronic component D only during system identification of the temperature estimation unit 60 and uses the temperature estimated by the temperature estimation unit 60 to control the temperature of the electronic component D.” (paragraph 0036). State of the art documentPatent document Patent Document 1: Japanese translation of PCT Patent Application No. 2019-519098 Patent Document 2: Japanese Patent Application Publication No. 2017-11169 Patent Document 3: International Publication No. 2016 / 080502 Patent Document 4: Japanese Patent Application Publication No. 2021-19066 Summary

[0006] In a first aspect of the present invention, a temperature control device is provided. The temperature control device may comprise a mounting unit including a mounting surface on which a test object in plate form is mounted, a plurality of components being formed on the test object. The temperature control device may comprise a plurality of heaters, each provided for each of a plurality of zones into which the mounting surface is divided, for heating a corresponding one of the plurality of zones. The temperature control device may comprise a component temperature detection unit configured to detect component temperature data according to a temperature measurement value in a device under test connected to a probe for an operation test among the plurality of components of the test object.The temperature control device may comprise a temperature control unit configured to control at least one of the plurality of heaters corresponding to at least one of the plurality of zones on which at least a portion of the device under test is mounted, so as to close a gap between a temperature indicated by the device temperature data and a first target temperature.

[0007] The temperature control unit may be arranged to control two or more heaters corresponding to two or more zones on each of which at least a part of the device under test is mounted, so that the gap between the temperature indicated by the device temperature data and the first target temperature is closed.

[0008] The temperature control device may further comprise a zone temperature acquisition unit configured to acquire zone temperature data according to a temperature measurement value corresponding to at least one other zone among the plurality of zones to which the test piece is not mounted. The temperature control unit may be configured to control at least one other heating device corresponding to the at least one other zone so that a gap between a temperature indicated by the zone temperature data and a second target temperature is closed.

[0009] The temperature control device may further comprise a plurality of temperature sensors, each provided for each zone of the plurality of zones. The zone temperature detection unit may be configured to detect zone temperature data according to a measured value from at least one temperature sensor provided for the at least one other zone among the plurality of temperature sensors.

[0010] The zone temperature detecting unit may be configured to detect zone temperature data according to a temperature measurement value corresponding to the at least one other zone by causing the at least one other heating device corresponding to the at least one other zone to function as a temperature sensor.

[0011] The plurality of zones can be arranged in a grid pattern on the mounting surface.

[0012] A size of each of the plurality of zones may differ from a size of each of the plurality of components.

[0013] In a second aspect of the present invention, a test device is provided. The test device may comprise a probe device configured to connect at least one probe to at least one terminal of a device under test, which is a target of an operational test in a board-shaped test object on which a plurality of components are formed. The test device may comprise the temperature control device. The test device may comprise a test unit configured to perform an operational test of the device under test using the at least one probe.

[0014] In a third aspect of the present invention, a temperature control method is provided. The temperature control method may include mounting a plate-shaped test object on a mounting surface of a mounting unit, with a plurality of components formed on the test object. The temperature control method may include acquiring component temperature data according to a temperature measurement value in a device under test connected to a probe for an operation test among the plurality of components of the test object.The temperature control method may comprise controlling at least one of the plurality of heating devices, each provided for each of the plurality of zones into which the mounting surface is divided and adapted to heat a corresponding one of the plurality of zones, wherein at least one of the plurality of heating devices corresponds to at least one of the plurality of zones on which at least a part of the device under test is mounted, so that a gap between a temperature indicated by the device temperature data and a first target temperature is closed.

[0015] In a fourth aspect of the present invention, a temperature control program executed by a computer is provided. The temperature control program can cause the computer to function as a component temperature acquisition unit configured to acquire component temperature data according to a temperature measurement value in a device under test connected to a probe for an operation test among the plurality of components mounted on a test object in a plate shape mounted on a mounting surface of a mounting unit.The temperature control program may cause the computer to function as a temperature control unit configured to control, among a plurality of heating devices, each provided for each of the plurality of zones into which the mounting surface is divided and configured to heat a corresponding one of the plurality of zones, at least one of the plurality of zones corresponding to at least one of the plurality of zones on which at least a part of the device under test is mounted, so as to close a gap between a temperature indicated by the component temperature data and a first target temperature.

[0016] The summary clause does not necessarily describe all necessary features of the embodiments of the present invention. The present invention may also be a sub-combination of the features described above. Short description of the drawing Fig. 1 shows a structure of a test device 10 according to the present embodiment. Fig. 2A is a plan view of the wafer holder 100 according to the present embodiment. Fig. 2B is a bottom view of the wafer holder 100 according to the present embodiment. Fig. 2C is a side view of the wafer holder 100 according to the present embodiment. Fig. 2D is a perspective cross-sectional view of the wafer holder 100 according to the present embodiment. Fig. 2E is a cross-sectional side view of the wafer holder 100 according to the present embodiment. Fig. 3A is an enlarged cross-sectional view of the wafer holder 100 according to the present embodiment. Fig. 3B is a transparent view of the wafer holder 100 according to the present embodiment. Fig. 4 shows functional configurations of the test device 10 according to the present embodiment. Fig. 5 shows the operation sequence of the test device 10 according to the present embodiment. Fig. 6 shows an arrangement example of the test piece 400 on the mounting unit 200 according to the present embodiment. Fig. Figure 7 shows an example of a computer 2200 in which aspects of the present invention may be embodied in whole or in part. Description of exemplary embodiments

[0017] The present invention is described below using exemplary embodiments of the invention. However, the following exemplary embodiments do not limit the invention according to the claims. Furthermore, not all combinations of features described in the exemplary embodiments are necessarily essential to the solution of the invention.

[0018] Fig. 1 shows a structure of a test apparatus 10 according to the present embodiment, together with a wafer 20. The wafer 20 is an example of a plate-shaped test object. The wafer 20 may be disk-shaped. A test object of the test apparatus 10 may be a portion separated from the wafer 20, a substrate on which components are formed, or the like, instead of the wafer 20. In the present embodiment, a plurality of components, such as electronic components or optical components, are formed on one surface of the wafer 20, which surface is located on the upper side in the drawing (the surface is also referred to as the "upper surface").

[0019] The test apparatus 10 is configured to perform an operational test for each component on the wafer 20 before each component on the wafer 20 is singulated by dicing. Such an operational test may be, for example, a functional test of components, a BIST test using a BIST circuit of components, or the like. The test apparatus 10 includes a wafer holder 100, a stage 105, a central processing unit 110, a test head 130, a HiFix 140, and a probe board 145.

[0020] The wafer stage 100 is an example of a fixture to which the test object is mounted, and through this fixture, the wafer stage 100 holds the wafer 20 on which a plurality of components are formed. The wafer stage 100 according to the present embodiment is a vacuum stage. Alternatively, the wafer stage 100 may be an electrostatic stage. The wafer stage 100 may include a heater for each zone into which the mounting surface of the wafer 20 is divided, so that temperature control can be performed in each zone. In addition, the wafer stage 100 circulates a coolant supplied from a cooling device 125 to cool each zone.

[0021] The stage 105 is configured to movably support the wafer holder 100. The stage 105 may be capable of moving the wafer holder 100 in XYZ directions. The stage 105 may be capable of rotating the wafer holder 100 about a vertical axis perpendicular to the top surface of the wafer holder 100.

[0022] The central processing unit 110 is configured to control each unit in the test device 10 so that the operational test of each device is performed under a predetermined temperature condition. In the present embodiment, the central processing unit 110 is a housing different from the housing in which the test head 130 and the like are provided. Alternatively, each structure in the central processing unit 110 may be provided in the same housing as the test head 130 and the like. The central processing unit 110 includes a test controller 115, a temperature controller 120, and the cooling device 125.

[0023] The test controller 115 may be a computer, such as a control computer, a workstation, a server computer, a general-purpose computer, or a personal computer (PC). The test controller 115 may also be a computer system connected to a plurality of computers. Such a computer system is also a computer in the broadest sense. Furthermore, the test controller 115 may be implemented by one or more virtual computing environments that can be executed on a computer. Alternatively, the test controller 115 may be a special-purpose computer developed for operational testing of components, or it may be special-purpose hardware implemented by special-purpose circuitry.

[0024] The test controller 115 is configured to control the operational test of each component in the wafer 20. If the test controller 115 is implemented by a computer, it can control the operational test of each component by executing a test control program. The test controller 115 instructs the stage 105 to sequentially bring each of the plurality of components of the wafer 20 into contact with the probe board 145. The test controller 115 indicates the temperature status of the operational test to the temperature controller 120 and causes the temperature controller 120 to control the temperature of the component under test. The test controller 115 supplies a test program to a test circuit 135 in the test head 130 to cause the test circuit 135 to execute the test program. The test controller 115 collects and stores test results for each component.

[0025] The temperature controller 120 is connected to the test controller 115. The temperature controller 120 and the test controller 115 may be implemented by a computer or may be implemented using a computer identical to the test controller 115. Alternatively, the temperature controller 120 may be special-purpose hardware implemented by special circuitry.

[0026] The temperature controller 120 is configured to control the temperature of the device under test in response to the instruction from the test controller 115. If the temperature controller 120 is implemented by a computer, it can control the temperature of the device under test by executing the temperature control program. The temperature controller 120 adjusts the temperature of the device under test such that the temperature meets a specific temperature condition by controlling a plurality of heaters included in the wafer holder 100 and the cooling device 125.

[0027] The cooling device 125 is connected to the temperature controller 120. The cooling device 125 is configured to supply a liquid or gaseous coolant to the wafer holder 100 and to cool the coolant returned from the wafer holder 100 to a specific temperature by the temperature controller 120 and to circulate the coolant to the wafer holder 100.

[0028] The test head 130 includes the test circuit 135. The test circuit 135 is connected to the test controller 115. The test circuit 135 may be provided on a test board that may be attachable and detachable to the backplane of the test head 130, or may be implemented using a plurality of test boards. The test circuit 135 may include various circuits for determining the quality of the device under test by sending and receiving a signal to and from the device under test, including at least one of: a site controller configured to control each unit in the test circuit 135 by executing the test program; a pattern generator configured to generate a test pattern; a timing generator configured to generate timing; a waveform shaper configured to shape the test pattern using the timing generated by the timing generator and output a test signal;a driver circuit configured to amplify the test signal to output the amplified test signal to the component under test; a comparator configured to compare a response signal from the device under test with a target value; or a determiner configured to determine the quality of the component under test based on the comparison result of the comparator.

[0029] The HiFix 140 is connected between the test head 130 and the probe board 145. The HiFix 140 connects the terminals between the test circuit 135 and the probe board 145 and connects each terminal of the test circuit 135 to the corresponding terminal of the probe board 145 via a signal cable.

[0030] The probe board 145 is connected to the test circuit 135 via the HiFix 140. The probe board 145 contains a plurality of probes 150. Each of the plurality of probes 150 has one end electrically connected to the terminal of the test circuit 135 via the probe board 145 and the HiFix 140, and the other end is in contact with a terminal of an electrode pad provided on the device under test, or the like. Thus, each probe 150 electrically connects the terminal of the test circuit 135 and the terminal of the component under test.

[0031] It should be noted that the test device 10 described above is intended to show an example of the structure of the test device, and that there are various variations in the function, structure, and arrangement of each unit. Furthermore, the test device 10 may omit some configurations or may include additional configurations depending on the content of the operational test to be performed.

[0032] Fig. 2A to 2E are a top view ( Fig. 2A), a bottom view ( Fig. 2B), a side view from direction A in Fig. 2B ( Fig. 2C), a perspective cross-sectional view BB' in Fig. 2B and a cross-sectional side view at BB' in Fig. 2B ( Fig. 2D) of the wafer holder 100 according to the present embodiment. As in Fig. As shown in Figure 2A, the wafer holder 100 includes a disk-shaped mounting unit 200. The surface on the first surface side of the mounting unit 200 is a mounting surface 210 on which the wafer 20 is mounted.

[0033] As in Fig. 2B, at least one inlet 220a-b (also referred to as "inlet 220") and at least one outlet 230a-b (also referred to as "outlet 230") are provided on the rear side with respect to the mounting surface 210 of the mounting unit 200 (also referred to as the "rear surface"). The inlet 220 is an opening for causing the coolant supplied from the cooling device 125 to flow into a space within the mounting unit 200. The outlet 230 is an opening for causing the coolant to flow out of the space within the mounting unit 200. In the example of the present drawing, the space within the mounting unit 200 is divided into two spaces: a space in a semicircular section on the left side and a space in a semicircular section on the right side of the mounting unit 200 in Fig. 2B. The coolant flowing into the mounting unit 200 from the inlet 220a flows into the space in the semicircular section on the left side of the mounting unit 200 to cool the mounting surface 210 and flows out of the outlet 230a to return to the cooling device 125. The coolant flowing into the mounting unit 200 from the inlet 220b flows into the space in the semicircular section on the right side of the mounting unit 200 to cool the mounting surface 210 and flows out of the outlet 230b to return to the cooling device 125. Although two inlets 220 and two outlets 230 are provided in the example of the present drawing, any number of inlets 220 and any number of outlets 230 may be provided.

[0034] As in Fig. 2B and Fig. 2C, a plurality of pin-shaped heating terminals 240 are exposed on the back of the mounting unit 200, each of which is connected to each of the plurality of heating devices. In the example of the present drawing, two heating terminals 240 are provided for each heating device, and these two heating terminals 240 are connected to both ends of the heating device.

[0035] As in Fig. 2D and Fig. As shown in Figure 2E, a flow channel 250 is formed within the mounting unit 200 as a space into which the coolant flows from the inlet 220a-b. In a portion where the heating port 240 is located in the mounting unit 200, the flow channel 250 is not provided, but a guide is provided through which the heating port 240 is screwed. Thus, the heating port 240 does not come into contact with the coolant.

[0036] Fig. 3A is an enlarged cross-sectional view of the wafer holder 100 according to the present embodiment. The mounting unit 200 may be made of ceramic, such as aluminum nitride, and may have insulating properties. A heater 310 is formed near the mounting surface 210 in the mounting unit 200. The heater 310 may be provided in a layer closer to the mounting surface 210 than to the back surface in the mounting unit 200. The heater terminal 240 extends from the heater 310 to the back surface of the mounting unit 200 and is exposed on the back surface.

[0037] A conductive ground plane 320 is formed on the side of the mounting surface 210 of the mounting unit 200. The ground plane 320 can cover at least the entire area of ​​the mounting surface 210 on which the components of the wafer 20 are mounted. The ground plane 320 can be connected to ground and maintained at ground potential for at least a period of time during which the wafer 20 is mounted thereon. The ground plane 320 shields noise generated by the operation of the heating device 310 to prevent the noise from reaching the device under test 400.

[0038] Fig. 3B is a transparent view of the wafer holder 100 viewed from the mounting surface 210 side. The mounting surface 210 of the mounting unit 200 is divided into a plurality of zones 300. In the present embodiment, the plurality of zones 300 are arranged in a grid pattern on the mounting surface 210. In the example of the present drawing, each zone 300 has a rectangular shape and is arranged to form a square grid or a rectangular grid. Alternatively, the plurality of zones 300 may be arranged in a rhombic grid. The plurality of zones 300 may be arranged in another grid shape, such as a hexagonal grid, and accordingly, the shape of each zone 300 may have a different shape, such as a hexagon.

[0039] The plurality of heaters 310 are provided for each zone 300, and each of the plurality of heaters 310 is configured to heat the corresponding zone 300. This drawing shows an example of the wiring pattern of the heater 310 in the zone 300, and the wiring pattern of the heater 310 may use any wiring pattern capable of heating the zone 300.

[0040] Fig. 4 shows functional configurations of the test device 10 according to the present embodiment. Fig. The test device 10 shown in Figure 1 comprises a probe device 410, a test unit 420, a temperature control device 430, and the cooling device 125 as a functional configuration. The probe device 410 is a functional configuration that integrates the HiFix 140 and the probe board 145 into Fig. 1. The probe device 410 is configured to connect one or more probes 150 to each of one or more terminals of the device under test 400, which is the target of the operational test in the wafer 20 on which a plurality of components are formed.

[0041] The test unit 420 is a functional embodiment that integrates the test controller 115 and 135 into Fig. 1. The test unit 420 uses one or more probes 150 that are connected to the device under test 400 to perform the operational test of the device under test 400.

[0042] The temperature control device 430 is a functional configuration that integrates the wafer holder 100 and the temperature controller 120 into Fig. 1. The wafer holder 100 includes the mounting unit 200, which includes the mounting surface 210 on which the wafer 20 containing the device under test 400 is mounted, the plurality of heaters 310, and the cooling unit 460. In the present embodiment, the cooling unit 460 includes the flow channel 250 and is configured to cool the wafer 20 mounted on the mounting surface 210 using the coolant.

[0043] The temperature controller 120 includes a component temperature detection unit 470, a zone temperature detection unit 480, and a temperature control unit 490. The component temperature detection unit 470 is configured to detect component temperature data according to a temperature measurement value in the device under test 400, which is connected to the probe 150 among the plurality of devices of the wafer 20 for the operational test. In the present embodiment, the test circuit 135 is configured to detect a temperature measurement value of the temperature sensor in the device under test 400 using at least one probe 150. The test controller 115 reads the temperature measurement value acquired by the test circuit 135 from the test circuit 135 and transmits the temperature measurement value to the component temperature detection unit 470. Thus, the component temperature detection unit 470 can detect the component temperature data corresponding to the temperature measurement value of the device under test 400.Alternatively, the component temperature detection unit 470 may be connected to the probe device 410 to read the temperature measurement value of the temperature sensor in the device under test 400 using the probe 150, or may be connected to the test circuit 135 to detect the temperature measurement value from the test circuit 135.

[0044] The component temperature data acquired by the component temperature acquisition unit 470 may be the temperature measurement value itself of the temperature sensor in the device under test 400, or may be data converted from the temperature measurement value and changing according to the temperature measurement value. For example, the device under test 400 may include a temperature sensor using a thermodiode, a resistance temperature detector, a thermocouple, or the like, and the temperature measurement value may be a value indicative of a voltage, a current, a resistance value, or the like, depending on the type of temperature sensor. The test circuit 135 or the test controller 115 may convert such a temperature measurement value into component temperature data indicating a temperature (°C).

[0045] The zone temperature acquisition unit 480 is configured to acquire zone temperature data according to the temperature measurement value of each of the plurality of zones 300. The zone temperature acquisition unit 480 may acquire zone temperature data according to a temperature measurement value corresponding to at least one zone 300 among the plurality of zones 300 to which the device under test 400 is not mounted. The zone temperature data may be the temperature measurement value itself, as in the case of the component temperature data, or may be data converted from the temperature measurement value and changing according to the temperature measurement value.

[0046] In the present embodiment, the zone temperature detection unit 480 is configured to detect the zone temperature data according to the temperature measurement value corresponding to each zone 300 by causing each heater 310 corresponding to each zone 300 to function as a temperature sensor. Since the heater 310 is a resistor that generates heat in response to a flowing current, the resistance value of the resistor changes according to the temperature. Thus, the zone temperature detection unit 480 stops heating by the heater 310 at the time when the temperature of the zone 300 is to be measured and causes a predetermined current for measurement to flow in the heater 310.Then, the zone temperature detecting unit 480 measures a potential difference between both ends of the heater 310 at which the current to be measured has flowed, so that the zone temperature detecting unit 480 can detect a temperature measurement value that changes according to the temperature of the zone 300.

[0047] Alternatively, the wafer stage 100 may include a plurality of temperature sensors, each provided for each zone 300 in the plurality of zones 300. In this case, the zone temperature acquisition unit 480 is configured to acquire zone temperature data according to the measured value of the temperature sensor provided for the corresponding zone 300 using each of the plurality of temperature sensors.

[0048] The temperature control unit 490 is connected to the component temperature detection unit 470 and the zone temperature detection unit 480. The temperature control unit 490 is configured to control at least one heater 310 corresponding to at least one zone 300 on which at least a portion of the device under test 400 is mounted, so as to close a gap between the temperature indicated by the component temperature data and a component target temperature. Herein, the target temperature of the component is also referred to as the "first target temperature."

[0049] Fig. 5 shows the operation flow of the test apparatus 10 according to the present embodiment. In S500, the test apparatus 10 mounts the wafer 20 on the mounting unit 200 of the wafer holder 100. The test controller 115 can inform an external handler that the next test of the wafer 20 is ready to start, and the handler informed of this can mount the wafer 20 on the mounting unit 200.

[0050] The test apparatus 10 repeats the test processing from S510 to S580 until the tests of all devices formed on the wafer 20 are completed. If the wafer 20 contains N devices and the test apparatus 10 can only test one device at a time, the test apparatus 10 repeats the test process for one device N times. If the test apparatus 10 can perform tests on K (two, four, or the like) devices simultaneously, the test apparatus 10 can repeat the test processing for K devices N / K times.

[0051] In S520, the test device 10 connects each probe 150 to at least one device under test 400 (in the case of simultaneous measurement of K components, there are K devices under test 400) to be tested according to the test processing. After the stage 105 in the test device 10 has moved the wafer holder 100 in the XY direction in response to the instruction from the test controller 115 such that each terminal of each device under test 400 is arranged directly under the corresponding probe 150, the stage 105 in the test device 10 moves the wafer holder 100 in a Z direction towards the probe 150 (in the example of Fig. 1, the wafer holder 100 is raised so that the corresponding probe 150 comes into contact with each terminal of each device under test 400.

[0052] In S530, the zone temperature acquisition unit 480 in the temperature controller 120 acquires zone temperature data according to the temperature measurement value of each zone 300. In S540, the component temperature acquisition unit 470 in the temperature controller 120 acquires component temperature data of each device under test 400 via the probe 150, the HiFix 140, the test circuit 135, and the test controller 115. If the device under test 400 includes an electrode pad directly connected to the temperature sensor, the test circuit 135 can read the temperature measurement value of the temperature sensor via the probe 150 connected to the electrode pad.If the device under test 400 does not include an electrode pad directly connected to the temperature sensor, when the circuit inside the device under test 400 reads the temperature measurement value from the temperature sensor to store the temperature measurement value in a register memory or the like within the device under test 400, the test circuit 135 may transmit a command or the like for reading the temperature measurement value to a communication port of the device under test 400 connected to the test circuit 135 via the probe 150, and read the temperature measurement value from the device under test 400. The test controller 115 may determine that a device under test 400 that does not properly respond to the command for reading the temperature measurement value via the communication port is defective.

[0053] In S550, the temperature control unit 490 controls the temperature of each zone 300 and each device under test 400 based on the component temperature data of each device under test 400 and the zone temperature data of each zone 300. In the present embodiment, the temperature control unit 490 controls the amount of heat generated by each heater 310 by adjusting the magnitude of the current flowing in each heater 310. As the amount of heat generated by the heater 310 increases, the temperature of each zone 300 rises. In the present embodiment, the cooling unit 460 cools all zones 300 evenly. Accordingly, when the amount of heat generated by the heater 310 is smaller than the amount of radiant heat by cooling, the temperature of each zone 300 decreases. The cooling device 125 can set the temperature of the coolant to be supplied to the cooling unit 460 to a predetermined temperature.Alternatively, the temperature control unit 490 may adjust the temperature of the coolant for the cooling device 125 supplied to the cooling unit 460 from the cooling device 125.

[0054] The temperature control unit 490 controls at least one heating device 310 corresponding to at least one zone 300 on which at least a portion of the device under test 400 is mounted, to close the gap between the temperature specified by the device temperature data and the device target temperature. Furthermore, the temperature control unit 490 may control at least one other heating device 310 corresponding to the at least one other zone 300 in which the device under test 400 is not mounted, to close a gap between the temperature specified by the zone temperature data and the zone target temperature. Herein, the zone target temperature is also referred to as the "second target temperature."

[0055] The component target temperature and the zone target temperature are predetermined according to the specification of the test performed by the test fixture 10. The temperature controller 120 can set the component target temperature and the zone target temperature in response to the instruction from the test controller 115. The zone target temperature can be the same as the component target temperature or a value obtained by adding a user-defined positive or negative offset to the component target temperature. For example, the test fixture 10 can set the zone target temperature to a value equal to or close to the component target temperature, so that a component other than the device under test 400 is preheated and can be tested immediately after becoming the test target.

[0056] In S560, the test controller 115 determines whether the temperature specified by the component target data of each device under test 400 is within a target range, which is within a component target temperature ± a tolerance. If the temperature specified by the component target data is not within the target range, the test controller 115 allows the process to proceed to S530 and continues with the temperature controller 120 setting the temperature of the device under test 400. If the component target data is not within the target range, the test controller 115 allows the process to proceed to S570. Note that the test controller 115 may or may not include the temperature of each zone 300 when determining the conditions in S560.The test controller 115 may allow the process to proceed to S570 under the additional condition that the temperature specified by the zone target temperature of each zone 300 is within a target range that is within a zone target temperature ± a tolerance.

[0057] In S570, the test apparatus 10 performs a test on each device under test 400. The test apparatus 10 determines the quality of the device under test 400 based on the test result. The test apparatus 10 completes the test of the wafer 20 when the test processing from S510 to S580 ends for all devices.

[0058] The temperature controller 120 described above can perform temperature control on the device under test 400 connected to the probe 150, enabling the acquisition of the component temperature data among all the components of the wafer 20 by acquiring the component temperature data of the device under test 400, so that the temperature indicated by the component temperature data of the device under test 400 becomes the target temperature of the device. Thus, the temperature controller 120 can adjust the temperature of the device under test 400 to the target component temperature with greater precision compared to the case where the temperature control is performed using the temperature measurement value on the wafer stage 100 side.

[0059] Furthermore, by using the temperature controller 120, temperature control can be performed in a zone 300 in which a component that does not come into contact with the probe and whose component temperature data is not identified is mounted, so that the temperature measurement value becomes the zone target temperature by using the zone temperature data according to the temperature measurement value of each zone 300.

[0060] Fig. 6 shows an arrangement example of the device under test 400 on the mounting unit 200 according to the present embodiment. As shown in the present drawing, not every component may be arranged to fit each zone 300, but may be arranged across two or more zones 300. Furthermore, the size of each of the plurality of zones 300 may be the same as or different from the size of each of the plurality of components. In this case, it is possible for at least a part of the device under test 400 to be mounted in each of two or more zones 300. In the example of the present drawing, a part of the device under test 400 is mounted in each of the four zones 300, zones 300a-d.

[0061] In such a case, the temperature control unit 490 may control two or more heaters 310 corresponding to two or more zones 300, each of which has at least a portion of the device under test 400 mounted thereon, so that the gap between the temperature indicated by the device temperature data and the device target temperature is closed. The temperature control unit 490 calculates the positional relationship of each device and each zone 300 using information about the position and size of each device and information about the position and size of each zone 300 in the wafer 20.For example, the temperature control unit 490 may set the temperatures of each zone 300 in which at least a portion of the device under test 400 is mounted to the same temperature, and when the temperature indicated by the device temperature data is lower than the device target temperature, the temperature control unit 490 may increase the temperature of these zones 300, and when the temperature indicated by the device temperature data is higher than the device target temperature, the temperature control unit 490 may decrease the temperature of these zones 300.

[0062] The temperature control unit 490 can set the temperatures of each zone 300 in which at least a portion of the test piece 400 is mounted to different temperatures and adjust the temperature of the test piece 400. For example, the temperature control unit 490 can adjust the temperature of the test piece 400 by more strongly changing the temperature of the zone 300 that has a greater influence on the temperature of the test piece 400, for example, because the area of ​​the test piece 400 that overlaps the zone 300 is larger or because the distance between the center of the zone 300 and the center of the test piece 400 is smaller. In this case, the temperature control unit 490 can perform temperature control with an applied bias voltage so that the gap between the temperature of each zone 300 and the temperature of an adjacent zone 300 is closed.

[0063] Furthermore, the temperature control unit 490 may control each heater 310 corresponding to each zone 300 on which the test piece 400 is not mounted, so that the gap between the temperature indicated by the zone temperature data of each zone 300 and the zone target temperature is closed. In this case, the temperature control unit 490 may further perform temperature control with an applied bias voltage to cause the temperature of each zone 300 to be closer to the temperature of the adjacent zone 300. In this case, the temperature control unit 490 controls the target zone 300 adjacent to the zone 300 on which the test piece 400 is mounted, so that the temperature of this zone is a temperature that is between the temperature of the adjacent zone 300 on which the test piece 400 is mounted and the temperature of the adjacent zone 300 on which the test piece 400 is not mounted.

[0064] For example, the temperature control unit 490 may control the temperature of each zone 300 in which at least a portion of the test piece 400 is mounted by using the following parameter ΔT1. ΔT1=a×S×(TGdev−Tdev)+b×(Tnbr−Tzone)

[0065] Here, a and b are predetermined positive factors, S is a factor corresponding to the area of ​​the test piece 400 overlapping the zone 300 (or a factor that increases as the distance between the center of the zone 300 and the center of the test piece 400 decreases), Tdev is a temperature specified by the component temperature data, TGdev is a component target temperature, Tzone is a temperature specified by the zone temperature data, and Tnbr is an average value of the temperatures of the adjacent zones 300.

[0066] The first term of ΔT1 takes a value corresponding to a product of a difference between a component target temperature and a temperature of a device under test 400, and an overlap of the target zone 300 and the device under test 400. It becomes a large positive value because the temperature of the device under test 400 is lower than the component target temperature and the target zone 300 and the device under test 400 overlap more. Accordingly, the temperature control unit 490 controls the temperature of the zone 300 so that the temperature of the zone 300 changes more as the target zone 300 overlaps more with the device under test 400.

[0067] The second term of ΔT1 takes a positive value, which becomes larger as a difference obtained by subtracting the temperature of the target zone 300 from the average value of the temperatures of two or more zones 300 adjacent to the target zone 300 increases. Accordingly, the temperature control unit 490 applies a bias voltage to cause the temperature of the target zone 300 to be closer to the average value of the temperatures of the adjacent zones 300. To further increase the weight of the first term of ΔT1, b may be set smaller compared to a × S. Furthermore, the temperature control unit 490 may perform temperature control of the zone 300 while setting b = 0 and not using the second term.

[0068] When ΔT1 is positive, the temperature control unit 490 increases the amount of heat generated by the heater 310 associated with the target zone 300 to raise the temperature of the target zone 300. When ΔT1 is negative, the temperature control unit 490 decreases the amount of heat generated by the heater 310 associated with the target zone 300 to lower the temperature of the target zone 300. Here, the temperature control unit 490 may control the amount of heat generated by the heater 310 through a controller such as PID control using an input of ΔT1 or control using an output value of predetermined filter processing using an input of ΔT1.

[0069] The temperature control unit 490 can control the temperature of each zone 300 in which the test piece 400 is not mounted using the following parameter ΔT2. ΔT2=c×(TGzone−Tzone)+d×(Tnbr−Tzone)

[0070] Here c and d are given positive factors.

[0071] The first term of ΔT2 takes a value corresponding to a difference between the zone target temperature and a temperature of a target zone 300, and becomes a larger positive value when the temperature of the target zone 300 is lower than the zone target temperature. Accordingly, the temperature control unit 490 changes the temperature of the target zone 300 more significantly the lower the temperature of the target zone 300 is compared to the zone target temperature.

[0072] The second term of ΔT2 takes a positive value, which increases as the difference between the average temperature of the zones 300 adjacent to the target zone 300 and the temperature of the target zone 300 increases. Accordingly, the temperature control unit 490 applies a bias voltage to make the temperature of the target zone 300 closer to the average temperature of the adjacent zones 300. To further increase the weight of the first term of ΔT2, d can be set smaller than c. Furthermore, the temperature control unit 490 can perform temperature control of the zone 300 while setting d = 0 and not using the second term.

[0073] When ΔT2 is positive, the temperature control unit 490 increases the amount of heat generated by the heater 310 associated with the target zone 300 to increase the temperature of the target zone 300. When ΔT2 is negative, the temperature control unit 490 decreases the amount of heat generated by the heater 310 associated with the target zone 300 to lower the temperature of the target zone 300. Here, the temperature control unit 490 can control the amount of heat generated by the heater 310 through control such as PID control using an input of ΔT2 or control using an output value of a predetermined filter processing using an input of ΔT2.By performing the temperature control described in connection with the present drawing, the temperature control device 430 can largely adjust the temperature of the zone 300 which has a larger area overlapping with the device under test 400 or which is closer to the device under test to close the gap between the temperature of the device under test 400 and the target temperature of the device.Moreover, in a case where the temperature control device 430 adjusts the temperature of each zone 300 according to the temperature of the adjacent zone 300, the temperature control device 430 may increase the amount of heat generated by the heaters 310 of zones 300 surrounding a specific zone 300, rather than extremely increasing the amount of heat generated by the specific heater 310 to cause the temperature of the specific zone to be locally high, so that the load applied to the heater 310 of the specific zone 300 can be even more uniform.

[0074] Various embodiments of the present invention may be described with reference to flowcharts and block diagrams, whose blocks may represent (1) steps of processes in which operations are performed, or (2) portions of components responsible for performing operations. Certain steps and portions may be implemented by dedicated circuitry, programmable circuitry supplied with computer-readable instructions stored on computer-readable media, and / or processors supplied with computer-readable instructions stored on computer-readable media. The dedicated circuitry may include digital and / or analog hardware circuitry, or an integrated circuit (IC) and / or a discrete circuitry.The programmable circuit may include a reconfigurable hardware circuit including logical AND, logical OR, logical XOR, logical NAND, logical NOR, and other logical operations, as well as a memory element such as a flip-flop, a register, or a field programmable gate array (FPGA) and a programmable logic array (PLA), and the like.

[0075] A computer-readable medium may include any tangible device capable of storing instructions to be executed by a suitable device, and as a result, the computer-readable medium with the instructions stored in the tangible device comprises an article of manufacture containing executable instructions to create means for performing the operations specified in the flowcharts or block diagrams. Examples of computer-readable media may include an electronic storage medium, a magnetic storage medium, an optical storage medium, an electromagnetic storage medium, a semiconductor storage medium, and the like.More specific examples of the computer-readable medium may include a floppy disk (registered trademark), a floppy disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), electrically erasable programmable read-only memory (EEPROM), static random access memory (SRAM), portable CD read-only memory (CD-ROM), digital versatile disk (DVD), Blu-ray disk (registered trademark), memory stick, integrated circuit card, or the like.

[0076] The computer-readable instruction may be an assembly instruction, an Instruction Set Architecture (ISA) instruction, a machine instruction, a machine-dependent instruction, microcode, a firmware instruction, state-setting data, or either source code or object code written in any combination of one or more programming languages, including an object-oriented programming language such as Smalltalk (registered trademark), JAVA (registered trademark), C++, or the like, and conventional procedural programming languages ​​such as the "C" programming language or similar programming languages.

[0077] The computer-readable instructions may be provided to a processor or programmable circuit of a general-purpose computer, special-purpose computer, or other programmable data processing device to produce a machine either locally over a local area network (LAN) or over a wide area network (WAN), such as the Internet, and may be executed to generate the means for performing the operations indicated by the flowcharts and block diagrams. Examples of the processor include a computer processor, a processing unit, a microprocessor, a digital signal processor, a controller, a microcontroller, and the like.

[0078] Fig.7 shows an example of a computer 2200 in which aspects of the present invention may be embodied in whole or in part. A program installed in the computer 2200 may cause the computer 2200 to function as devices of the embodiments of the present invention or one or more portions thereof, or to perform operations associated with devices of the embodiments of the present invention, and / or cause the computer 2200 to perform processes of the embodiments of the present invention or steps thereof. Such a program may be executed by the CPU 2212 to cause the computer 2200 to perform certain operations associated with some or all of the flowchart and block diagram blocks described herein.

[0079] The computer 2200 according to the present embodiment includes the CPU 2212, a RAM 2214, a graphics controller 2216, and a display device 2218, which are connected to each other via a host controller 2210. The computer 2200 also includes input / output units such as a communication interface 2222, a hard disk drive 2224, a DVD-ROM drive 2226, and an IC card drive, which are connected to the host controller 2210 via an input / output controller 2220. The computer also includes legacy input / output units such as a ROM 2230 and a keyboard 2242, which are connected to the input / output controller 2220 via an input / output chip 2240.

[0080] The CPU 2212 operates according to the programs stored in the ROM 2230 and the RAM 2214, thereby controlling each unit. The graphics controller 2216 captures image data generated by the CPU 2212 into a frame buffer or the like provided in the RAM 2214 or within itself, so that the image data is displayed on the display device 2218.

[0081] The communication interface 2222 communicates with other electronic devices over a network. The hard disk drive 2224 stores programs and data used by the CPU 2212 within the computer 2200. The DVD-ROM drive 2226 reads the programs or data from the DVD-ROM 2201 and supplies the hard disk drive 2224 with the programs or data via the RAM 2214. The IC card drive reads programs and data from an IC card and / or writes programs and data to the IC card.

[0082] The ROM 2230 stores therein a boot program or the like that is executed by the computer 2200 when activated, and / or a program depending on the hardware of the computer 2200. The input / output chip 2240 can also connect various input / output devices to the input / output controller 2220 via a parallel port, a serial port, a keyboard port, a mouse port, and the like.

[0083] A program is provided from computer-readable media such as the DVD-ROM 2201 or the IC card. The program is read from the computer-readable media, installed in the hard disk drive 2224, RAM 2214, or ROM 2230, which are also examples of computer-readable media, and executed by the CPU 2212. The information processing described in these programs is read into the computer 2200, resulting in cooperation between a program and the various types of hardware resources mentioned above. An apparatus or method can be constituted by implementing the operation or processing of information according to the use of the computer 2200.

[0084] For example, when communication is performed between the computer 2200 and an external device, the CPU 2212 may execute a communication program loaded into the RAM 2214 to instruct the communication processing to the communication interface 2222 based on the processing described in the communication program. The communication interface 2222, under the control of the CPU 2212, reads transmission data stored in a transmission buffer area provided in a recording medium such as the RAM 2214, the hard disk drive 2224, the DVD-ROM 2201, or the IC card, and transmits the read transmission data to a network or writes reception data received from a network into a reception buffer area or the like provided on the recording medium.

[0085] In addition, the CPU 2212 can cause all or a necessary part of a file or database stored on an external recording medium such as the hard disk drive 2224, the DVD-ROM drive 2226 (DVD-ROM 2201), the IC card, etc., to be read into the RAM 2214, and perform various types of processing on the data in the RAM 2214. The CPU 2212 can then write the processed data back to the external recording medium.

[0086] Various types of information, such as various types of programs, data, tables, and databases, can be stored in the recording medium to undergo information processing. The CPU 2212 can perform various types of processing on the data read from the RAM 2214, including various types of operations, information processing, condition judgment, conditional branching, unconditional branching, information search / replacement, etc., as described throughout this disclosure and denoted by an instruction sequence of programs, and write the result back to the RAM 2214. In addition, the CPU 2212 can search for information in a file, a database, etc. on the recording medium.For example, if a plurality of entries, each having an attribute value of a first attribute associated with an attribute value of a second attribute, are stored on the recording medium, the CPU 2212 may search for an entry that satisfies the condition among the plurality of entries whose attribute value of the first attribute is designated, and reads the attribute value of the second attribute stored in the entry, thereby obtaining the attribute value of the second attribute associated with the first attribute that satisfies the predetermined condition.

[0087] The program or software modules discussed above may be stored in computer-readable media on or near the computer 2200. Furthermore, a recording medium such as a hard disk or RAM provided in a server system connected to a dedicated communications network or the Internet may be used as a computer-readable medium, thereby providing the program to the computer 2200 over the network.

[0088] While the embodiments of the present invention have been described, the technical scope of the invention is not limited to the above-described embodiments. Those skilled in the art will appreciate that various modifications and improvements can be made to the above-described embodiments. It should also be apparent from the scope of the claims that the embodiments added with such modifications or improvements are within the technical scope of the invention.

[0089] The operations, procedures, steps, and stages of each process performed by an apparatus, system, program, and method shown in the claims, embodiments, or diagrams may be performed in any order, as long as the order is not indicated by "before," "previous," or the like, and as long as the output of a previous process is not used in a subsequent process. Even if the process flow is described in the claims, embodiments, or diagrams using terms such as "first" or "next," this does not necessarily mean that the process must be performed in that order. Explanation of reference symbols 10 Test device 20 wafers 100 wafer holder 105 Stage 110 Central unit 115 Test control 120 Temperature control 125 Cooling device 130 test head 135 Test circuit 140 HiFix 145 probe board 150 probe 200 fastening unit 210 mounting surface 220a-b inlet 230a-b outlet 240 heating connection 250 flow channel 300 zone 310 Heating device 320 Ground plane 400 candidates 410 probe device 420 test units 430 Temperature control device 460 cooling unit 470 Component Temperature Detection Unit 480 zone temperature recording unit 490 Temperature control unit 2200 computers 2201 DVD-ROM 2210 host controller 2212 CPU 2214 RAM 2216 graphics controller 2218 Display device 2220 Input / Output Controller 2222 Communication interface 2224 hard disk drive 2226 DVD-ROM drive 2230 ROM 2240 input / output chip 2242 keyboard QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 2019-519098

[0005] JP 2017-11169

[0005] WO 2016 / 080502

[0005] JP 2021-19066

[0005]

Claims

[1] Temperature control device comprising: a mounting unit comprising a mounting surface on which a test object in plate form is mounted, wherein a plurality of components are formed on the test object, a plurality of heating devices, each of which is provided for each of a plurality of zones into which the mounting surface is divided, for heating a corresponding one of the plurality of zones, a component temperature detection unit configured to detect component temperature data according to a temperature measurement value in a device under test connected to a probe for an operation test among the plurality of components of the device under test, and a temperature control unit configured to control at least one of the plurality of heaters corresponding to at least one of the plurality of zones on which at least a portion of the device under test is mounted so as to close a gap between a temperature indicated by the device temperature data and a first target temperature. [2] The temperature control apparatus according to claim 1, wherein the temperature control unit is arranged to control two or more heaters corresponding to two or more zones on each of which at least a part of the device under test is mounted, so that the gap between the temperature indicated by the device temperature data and the first target temperature is closed. [3] The temperature control device according to claim 1 or 2, further comprising a zone temperature detection unit configured to detect zone temperature data according to a temperature measurement value corresponding to at least one other zone among the plurality of zones on which the test piece is not mounted, wherein the temperature control unit is configured to control at least one other heating device corresponding to the at least one other zone so as to close a gap between a temperature indicated by the zone temperature data and a second target temperature, [4] The temperature control device according to claim 3, further comprising a plurality of temperature sensors each provided for each zone of the plurality of zones, wherein the zone temperature detecting unit is configured to detect zone temperature data according to a measured value of at least one temperature sensor provided for the at least one other zone among the plurality of temperature sensors. [5] The temperature control device according to claim 3, wherein the zone temperature detecting unit is configured to detect zone temperature data according to a temperature measurement value corresponding to the at least one other zone by causing the at least one other heating device corresponding to the at least one other zone to function as a temperature sensor. [6] Temperature control device according to one of claims 1 to 5, wherein the plurality of zones are arranged in a grid pattern on the mounting surface. [7] The temperature control device according to any one of claims 1 to 6, wherein a size of each of the plurality of zones is different from a size of each of the plurality of components. [8] Test device comprising: a probe device adapted to connect at least one probe to at least one terminal of a device under test which is a target of an operational test in a test object in plate form on which a plurality of components are formed, the temperature control device according to one of claims 1 to 7 and a test unit configured to perform an operational test of the device under test using the at least one probe. [9] Temperature control method comprising: Fixing a test object in plate form on a fixing surface of a fixing unit, wherein a plurality of components are formed on the test object, Acquiring component temperature data according to a temperature measurement value in a device under test connected to a probe for an operational test among the plurality of components of the device under test, and Controlling at least one of the plurality of heating devices, each provided for each of the plurality of zones into which the mounting surface is divided and arranged to heat a corresponding one of the plurality of zones, wherein at least one of the plurality of heating devices corresponds to at least one of the plurality of zones on which at least a part of the device under test is mounted, so that a gap between a temperature indicated by the component temperature data and a first target temperature is closed. [10] Temperature control program executed by a computer that causes the computer to act as: a component temperature detection unit configured to detect component temperature data according to a temperature measurement value in a device under test connected to a probe for an operation test among the plurality of components mounted on a test object in a plate shape mounted on a mounting surface of a mounting unit, and a temperature control unit configured to control, among a plurality of heating devices, each of which is provided for each of the plurality of zones into which the mounting surface is divided and configured to heat a corresponding one of the plurality of zones, at least one of the plurality of zones corresponding to at least one of the plurality of zones on which at least a part of the device under test is mounted, so as to close a gap between a temperature indicated by the component temperature data and a first target temperature.

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