Scoreboard, display module and display device

Abstract

A display panel, a display module and a display device, wherein the display panel comprises a first substrate support (1) and a second substrate support (2) arranged opposite each other, as well as a liquid crystal layer (3) and several conductive layers arranged between the first substrate support (1) and the second substrate support (2); the display panel also comprises several heating elements (4), and the several heating elements (4) are distributed in at least one of the conductive layers.

Description

Technical field

[0001] The present disclosure relates to the field of display technology, in particular a display panel, a display module and a display device. State of the art

[0002] The liquid crystal display (LCD) is a non-self-illuminating display that requires a backlight module to achieve its display function through the backlight source provided by the backlight module. However, at certain temperatures, especially at very low temperatures of minus dozens of degrees, the viscosity coefficient of the liquid crystal material increases and the response time slows down, so that the liquid crystal display cannot be displayed correctly.

[0003] Currently, the most common heating solutions for liquid crystal displays on the market are mainly external heating films or heating plates. These solutions are expensive, have poor yield, low heating efficiency, and impair the display's appearance.

[0004] The aforementioned information disclosed as prior art serves only to facilitate a better understanding of the background of the present disclosure. It may therefore contain information that is not part of the prior art known to a person skilled in the art. Disclosure of the invention

[0005] The purpose of the present disclosure is to provide a display board, a display module and a display device that achieves a heating effect on the display board while simultaneously improving the display quality.

[0006] To achieve the above-mentioned objective of the invention, the following technical solutions are applied in the present disclosure: According to a first aspect of the present disclosure, a display panel is provided, the display panel comprising a first substrate support and a second substrate support arranged opposite each other, as well as a liquid crystal layer and several conductive layers arranged between the first substrate support and the second substrate support; The display panel also includes several heating elements distributed in at least one of the conductive layers.

[0007] In an exemplary embodiment of the present disclosure, the heating elements are distributed in at least two of the conductive layers, wherein, in the case of the heating elements distributed in different conductive layers, the heating elements in at least one of the conductive layers are connected in parallel to the heating elements in another of the conductive layers.

[0008] In an exemplary embodiment of the present disclosure, the multiple conductive layers comprise: a first group of conductive layers comprising at least one of the conductive layers, wherein the first conductive layers are arranged on the side of the liquid crystal layer near the first substrate support; a second group of conductive layers comprising at least one of the conductive layers, wherein the second group of conductive layers is arranged on the side of the liquid crystal layer facing away from the first substrate support; The heating elements are distributed in the first group of conductive layers and / or the second group of conductive layers. In an exemplary embodiment of the present disclosure, the display panel comprises a display area and a peripheral area located at the periphery of the display area; the scoreboard also includes: Adapter lines, wherein the adapter lines are distributed in at least one of the several conductive layers, and wherein the adapter lines are arranged in the peripheral area; heating control unit for controlling the switching on and off of the heating elements, wherein the adapter lines connect the heating elements and the heating control unit.

[0009] In an exemplary embodiment of the present disclosure, the multiple conductive layers comprise a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, a fifth conductive layer, and a sixth conductive layer, arranged successively in the direction away from the first substrate support: The first conductive layer comprises a light-shielding structure; the second conductive layer comprises an active region of a transistor; the third conductive layer comprises a gate electrode of the transistor; the fourth conductive layer comprises a source electrode and a drain electrode of the transistor; the fifth conductive layer comprises a first electrode; and the sixth conductive layer comprises a second electrode, the second electrode being used to form an electric field with the first electrode to drive the liquid crystal layer; wherein the heating elements are distributed in at least one of the six conductive layers formed by the combination of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer and the sixth conductive layer.

[0010] In an exemplary embodiment of the present disclosure, the heating elements are distributed in at least two of the six conductive layers formed by the combination of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer and the sixth conductive layer, and the heating elements in at least one of the conductive layers are connected in parallel with the heating elements in another of the conductive layers.

[0011] In an exemplary embodiment of the present disclosure, the multiple conductive layers further comprise: a seventh conductive layer provided between any two of the six conductive layers formed by the combination of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer and the sixth conductive layer, or provided on a side of the first conductive layer located near the first substrate support; where at least some of the heating elements are distributed in the seventh conductive layer.

[0012] In an exemplary embodiment of the present disclosure, the heating elements distributed in the seventh conductive layer are connected in parallel with the heating elements in at least one of the six conductive layers formed by the combination of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer and the sixth conductive layer.

[0013] In an exemplary embodiment of the present disclosure, the multiple conductive layers further comprise: an eighth conductive layer, which is arranged on the side of the liquid crystal layer facing away from the first substrate support; where at least some of the heating elements are distributed in the eighth conductive layer.

[0014] In an exemplary embodiment of the present disclosure, the display board further comprises: Frame sealant that seals between the first substrate support and the second substrate support, wherein a conductive element is provided within the frame sealant, wherein the heating elements distributed in the eighth conductive layer are connected to the heating control unit via the conductive element.

[0015] In an exemplary embodiment of the present disclosure, the heating elements distributed in the eighth conductive layer are connected in parallel with the heating elements in at least one of the six conductive layers formed by the combination of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer and the sixth conductive layer.

[0016] In an exemplary embodiment of the present disclosure, the display panel comprises several data lines and several scanning lines, wherein the scanning lines and the data lines intersect to define several pixel areas; Several heating elements extend in the direction of extension of the scanning lines and are arranged in the direction of arrangement of the scanning lines; or several heating elements extend in the direction of extension of the data lines and are arranged in the direction of arrangement of the data lines.

[0017] In an exemplary embodiment of the present disclosure, if the heating elements extend in the direction of extension of the scanning lines, the orthogonal projections of the heating elements onto the first substrate support overlap at least partially with the orthogonal projections of the scanning lines onto the first substrate support, or the distances between the orthogonal projections of the heating elements onto the first substrate support and the orthogonal projections of the scanning lines onto the first substrate support are not greater than 20 µm; if the heating elements extend in the direction of the data lines, the orthogonal projections of the heating elements onto the first substrate support overlap at least partially with the orthogonal projections of the data lines onto the first substrate support, or the distances between the orthogonal projections of the heating elements onto the first substrate support and the orthogonal projections of the data lines onto the first substrate support are not greater than 20 µm.

[0018] In an exemplary embodiment of the present disclosure, the first electrode or the second electrode has several slots, wherein the slots have kinks and the individual slots are parallel to each other; wherein the direction of extension of the heating elements runs parallel to the arrangement direction of the individual slots, and the orthogonal projections of the heating elements onto the first substrate support overlap at least partially with the orthogonal projections of the kinks onto the first substrate support.

[0019] In an exemplary embodiment of the present disclosure, the display board further comprises: a color membrane layer arranged between the liquid crystal layer and the second substrate support, wherein the color membrane layer comprises light-shielding sections and several light-filtering sections bounded by the light-shielding sections, wherein the light-filtering sections are arranged one-to-one with the pixel regions in the direction perpendicular to the first substrate support; wherein the orthogonal projections of the heating elements onto the first substrate support are located within the orthogonal projections of the light-shielding sections onto the first substrate support.

[0020] In an exemplary embodiment of the present disclosure, the orthogonal projections of the heating elements distributed in different conductive layers onto the first substrate support overlap at least partially, and the overlap rate is not less than 90%.

[0021] In an exemplary embodiment of the present disclosure, at least some of the heating elements are connected in parallel or in series from the multiple heating elements distributed in the same conductive layer to form a heating unit.

[0022] In an exemplary embodiment of the present disclosure, at least two of the heating elements of the several heating elements distributed in the same conductive layer are connected in series or in parallel.

[0023] In an exemplary embodiment of the present disclosure, the display panel has a central axis that runs perpendicular to the direction of extension of the heating elements; The heating element has a first end and a second end, wherein the first end of the respective heating elements lies on one side of the central axis, the second end of the respective heating elements lies on the other side of the central axis, and the first end and the second end of the heating element lie in the peripheral area; wherein the first end and / or the second end of at least two of several heating elements distributed in the same conductive layer are connected to each other.

[0024] In an exemplary embodiment of the present disclosure, the adapter lines connect the heating unit and the heating control unit, wherein the adapter lines are distributed in at least two of the several conductive layers, and the adapter lines distributed in different conductive layers are connected in parallel.

[0025] According to a second aspect of the present disclosure, a display module is provided which includes the display panel as described in the first aspect.

[0026] In an exemplary embodiment of the present disclosure, the display module further comprises a temperature sensing circuit, wherein the temperature sensing circuit comprises: a current input and output unit connected to a current switching control terminal, a current input terminal, a first node and a current output terminal, wherein the current input and output unit is configured to output the current from the current input terminal via the first node and then the current output terminal under a switching control signal from the current switching control terminal; a temperature sensing unit connected to the first node, wherein the temperature sensing unit is integrated into the display panel and is configured to generate leakage current, wherein the temperature sensing unit comprises at least one PIN diode.

[0027] In an exemplary embodiment of the present disclosure, the current input and output unit comprises a first transistor and a second transistor, wherein the first electrode of the first transistor is connected to the current input terminal, the second electrode of the first transistor and the first electrode of the second transistor are both connected to the first node, the second electrode of the second transistor is connected to the current output terminal, and the gate electrode of the first transistor and the gate electrode of the second transistor are both connected to the current switching control terminal; The first terminal of the PIN diode is connected to the first node and the second terminal of the PIN diode is connected to the first supply voltage terminal.

[0028] In an exemplary embodiment of the present disclosure, the temperature sensing circuit further comprises: a first control unit connecting a signal control terminal, the first supply voltage terminal, the second supply voltage terminal and the current switching control terminal, wherein the first control unit is configured to output the voltage of the first supply voltage terminal or the second supply voltage terminal to the current switching control terminal under a control signal from the signal control terminal; the first control unit comprises at least two inverters, wherein the output of the k-th inverter is connected to the input of the (k+1)-th inverter, the input of the first inverter is connected to the signal control terminal, the output of the last inverter is connected to the current switching control terminal, where k is a positive integer greater than or equal to 1.

[0029] In an exemplary embodiment of the present disclosure, the temperature sensing circuit further comprises: a second control unit, which is connected to the output of one of the inverters in the first control unit, to the first supply voltage terminal and the first terminal of the PIN diode, and is configured to apply the first supply voltage of the first supply voltage terminal to the first terminal of the PIN diode under a control signal from the output of the inverter connected to it.

[0030] According to a third aspect of the present disclosure, a display device is provided which includes a display module as described in the second aspect.

[0031] The present disclosure proposes a display panel in which several heating elements are arranged between a first substrate support and a second substrate support, and the multiple heating elements are distributed in at least one conductive layer. In this way, a higher resource utilization rate and a relatively better heating effect are achieved compared to the prior art, in which the heating elements are arranged outside the display panel. Furthermore, several heating elements can heat the display panel simultaneously or section by section, which helps to improve the uniformity and heating rate, meet the heating requirements, and improve the display quality. Brief description of the characters

[0032] The aforementioned and further features and advantages of the present disclosure will become clearer through the detailed description of exemplary embodiments with reference to the accompanying figures. Fig. Figure 1 is a schematic representation of a structure of the display board in an exemplary embodiment of the present disclosure; Fig. Figure 2 is a schematic representation of a display board structure with a seventh conductive layer in an exemplary embodiment of the present disclosure; Fig. Figure 3 is a schematic representation of a display board structure with a seventh conductive layer in another exemplary embodiment of the present disclosure; Fig. Figure 4 is a schematic representation of a display board structure with an eighth conductive layer in an exemplary embodiment of the present disclosure; Fig. Figure 5 is a schematic representation of a structure of the parallel connection of heating elements in different conductive layers in an exemplary embodiment of the present disclosure; Fig. Figure 6 is a schematic representation of a structure of the parallel connection of heating elements in different conductive layers in another exemplary embodiment of the present disclosure; Fig. Figure 7 is a schematic representation of a structure of the parallel connection of heating elements in different conductive layers in another exemplary embodiment of the present disclosure; Fig. Figure 8 is a schematic representation of a structure of the parallel connection of heating elements in different conductive layers in another exemplary embodiment of the present disclosure; Fig. Figure 9 is a schematic representation of a structure of the parallel connection of heating elements in different conductive layers in another exemplary embodiment of the present disclosure; Fig. Figure 10 is a schematic representation of a structure for shielding electromagnetic interference on a display panel in an exemplary embodiment of the present disclosure; Fig. Figure 11 is a schematic representation of a structure for shielding electromagnetic interference on a display panel in another exemplary embodiment of the present disclosure; Fig. 12 is a schematic representation of a structure for shielding electromagnetic interference on a display panel in another exemplary embodiment of the present disclosure; Fig. Figure 13 is a schematic representation of a structure of the position distribution of the heating elements in an exemplary embodiment of the present disclosure; Fig. Figure 14 is a schematic representation of a structure of the position distribution of the heating elements in another exemplary embodiment of the present disclosure; Fig. Figure 15 is a schematic representation of a structure of the position distribution of the heating elements in another exemplary embodiment of the present disclosure; Fig. Figure 16 is a schematic representation of a structure of the position distribution of the heating elements in another exemplary embodiment of the present disclosure; Fig. Figure 17 is a schematic representation of a structure of the position distribution of the heating elements in another exemplary embodiment of the present disclosure; Fig. Figure 18 is a schematic representation of a structure of the position distribution of the heating elements in another exemplary embodiment of the present disclosure; Fig. Figure 19 is a schematic representation of a structure of the position distribution of the heating elements in another exemplary embodiment of the present disclosure; Fig. Figure 20 is a schematic representation of a structure of the eighth conductive layer in an exemplary embodiment of the present disclosure; Fig. Figure 21 is a schematic representation of a structure of the connection of heating elements in the same conductive layer in an exemplary embodiment of the present disclosure; Fig. Figure 22 is a schematic representation of a structure of the connection of heating elements in the same conductive layer in another exemplary embodiment of the present disclosure; Fig. 23 is a schematic representation of a structure of the connection of heating elements in the same conductive layer in another exemplary embodiment of the present disclosure; Fig. Figure 24 is a schematic representation of a structure of the connection of heating elements in the same conductive layer in another exemplary embodiment of the present disclosure; Fig. Figure 25 is a schematic representation of a structure of the connection of adapter leads in different conductive layers in an exemplary embodiment of the present disclosure; Fig. Figure 26 is a schematic representation of the structure of a temperature sensing circuit in an exemplary embodiment of the present disclosure; Fig. Figure 27 is a schematic representation of the structure of a display module in an exemplary embodiment of the present disclosure.

[0033] The main elements in the figures are marked with the following reference symbols: 1 first substrate carrier 001 first group of conductive layers; 002 second group of conductive layers; 101 first conductive layer; 102 second conductive layer; 103 third conductive layer; 104 fourth conductive layer; 105 fifth conductive layer; 051 first electrode; 106 sixth conductive layer; 061 second electrode; 611 kink; 107 seventh conductive layer; 108 eighth conductive layer; 110 buffer layer; 120 first gate insulating layer; 130 second gate insulating layer; 140 Interlayer dielectric layer; 150 Planarization layer; 160 Passivation layer; 170 first orientation layer; 180 insulating layer; 2 second substrate carrier; 210 Color membrane layer; 211 Light shielding section; 212 Light filtering section; 220 second orientation layer; 3 Liquid crystal layer 301 spacers; 302 Frame sealant; 303 conductive element; 004 Heating unit; 4 heating elements; 5 adapter cables; 6 Heating control unit; 71 Power input and output unit; N1 first junction; In power input connection; Out power output connector; G1 switching control connection; T1 first transistor; T2 second transistor; 72 Temperature sensing unit; D1 first PIN diode; D2 second PIN diode; 73 first control unit; GATE signal control connection; VSS first supply voltage connection; VDD second supply voltage connection; 74 second control unit; T3 third transistor; DL data line; GL scanning line; AA display area; FA Peripheral Area; FA1 Binding area; 10 Gate driver circuit; 20 Contact component; 30 connecting line; 40 pads. Detailed description of the drawing

[0034] Exemplary embodiments are now described in detail with reference to the accompanying figures. However, these embodiments can be implemented in various forms and should not be understood as limited to the examples presented here; rather, these exemplary embodiments are provided to make the disclosure more comprehensive and complete and to fully convey the concept of the embodiments to the person skilled in the art. The described features, structures, or properties can be combined in one or more exemplary embodiments in any suitable manner. Many specific details are given in the following description to provide a sufficient understanding of the exemplary embodiments of this disclosure.

[0035] For clarity, certain areas and layer thicknesses may be exaggerated in the figures. The same reference symbols in the figures denote identical or similar structures, and therefore their detailed description is omitted.

[0036] The described features, structures, or properties can be combined in one or more embodiments in any suitable manner. Many specific details are given in the following description to provide a sufficient understanding of the embodiments of this disclosure. However, the person skilled in the art will recognize that the technical solutions of this disclosure can also be implemented in practice without one or more of the described specific details, or that other methods, components, materials, etc., can be used. In other cases, generally known structures, materials, or processes are not shown or described in detail so as not to obscure the essential technical ideas of this disclosure.

[0037] When a structure is “on” another structure, this can mean that one structure is integrally formed on the other structure, or that one structure is “directly” arranged on the other structure, or that one structure is “indirectly” arranged on the other structure via another structure.

[0038] The terms "a", "an", "the", "a", "a" are used to indicate the presence of one or more elements / components, etc.; the terms "comprise" and "have" are used to indicate open inclusion and mean that, in addition to the listed elements / components, etc., further elements / components, etc., may be present. The terms "first", "second", etc., serve only for identification and do not limit the number of objects.

[0039] Liquid crystal displays (LCDs) offer the potential for use in electronic rearview mirrors due to their advantages of thin, lightweight modules and fast image response times. However, the response time of LCDs is slow at low temperatures, which can lead to problems such as image lag and delay. Therefore, heating the LCD is necessary. Current technologies primarily use external heating foils or plates to heat the LCD. These solutions are expensive, have low efficiency, and negatively impact the display's performance.

[0040] As in the Fig. As shown in Figures 1 to 4, in one embodiment of the present disclosure a display panel is provided which comprises a first substrate support 1 and a second substrate support 2, which are arranged opposite each other, as well as a liquid crystal layer 3 and several conductive layers which are arranged between the first substrate support 1 and the second substrate support 2; the display panel also comprises several heating elements 4, wherein they are distributed in at least one of the conductive layers.

[0041] The display panel provided by the present disclosure is arranged between the first substrate support 1 and the second substrate support 2 and incorporates multiple heating elements 4, distributed within at least one conductive layer. Compared to the prior art, where the heating elements 4 are located outside the display panel, this approach offers a higher resource utilization rate and a relatively better heating effect. Furthermore, multiple heating elements 4 can heat the display panel simultaneously or section by section, which helps to improve heating uniformity and speed, thereby meeting heating requirements and enhancing display quality.

[0042] The individual components of the display board provided by the embodiments of the present disclosure are explained in more detail below in conjunction with the accompanying figures: The present disclosure provides a display panel, which may be a TFT-LCD (Thin Film Transistor Liquid Crystal Display) display panel.

[0043] As in the Fig. As shown in Figures 1 to 4, the display panel comprises a first substrate support 1 and a second substrate support 2, which are arranged opposite each other, as well as a liquid crystal layer 3 and several conductive layers located between the first substrate support 1 and the second substrate support 2.

[0044] The first substrate support 1 and the second substrate support 2 can be made of inorganic material or organic material. For example, in one embodiment of the present disclosure, the materials of the first substrate support 1 and the second substrate support 2 can consist of glass materials such as soda-lime glass, quartz glass, sapphire glass, etc., or of metal materials such as stainless steel, aluminum, nickel, etc.In another embodiment of the present disclosure, the materials of the first substrate support 1 and the second substrate support 2 can be polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyvinylphenol (PVP), polyethersulfone (PES), polyimide, polyamide, polyacetal, polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or a combination thereof. The first substrate support 1 and the second substrate support 2 can also be flexible substrate supports. In one embodiment of the present disclosure, for example, the material of the first substrate support 1 and the second substrate support 2 can be polyimide (PI). The first substrate support 1 and the second substrate support 2 can also be a composite of multilayer materials.In one embodiment of the present disclosure, the first substrate support 1 and the second substrate support 2 can, for example, contain a bottom film layer, a pressure-sensitive adhesive layer, a first polyimide layer and a second polyimide layer, which are arranged stacked sequentially.

[0045] The liquid crystal layer 3 and the multiple conductive layers are arranged between the first substrate support 1 and the second substrate support 2, and several heating elements 4 are distributed in at least one of the conductive layers. When activated, the heating elements 4 can effectively heat the liquid crystal layer 3. Compared to the prior art, where the heating elements 4 are located outside the display panel, this results in a higher resource utilization rate and a relatively better heating effect.

[0046] In some embodiments of the present disclosure, the multiple heating elements 4 are distributed in at least two conductive layers. This arrangement enables the heating elements 4 to heat the display panel simultaneously within the multilayer structure, which contributes to improved heating uniformity and heating speed. Furthermore, the distribution of the multiple heating elements 4 in the at least two conductive layers reduces the influence on the aperture rate of the display panel to some extent, thus achieving the heating effect and simultaneously improving the display quality.

[0047] In some embodiments of the present disclosure, the multiple conductive layers comprise a first group of conductive layers 001 and a second group of conductive layers 002, wherein the first group of conductive layers 001 comprises at least one conductive layer and the first conductive layer 001 is arranged on a side of the liquid crystal layer 3 that is located near the first substrate support 1; wherein the second group of conductive layers 002 comprises at least one conductive layer and the second group of conductive layers 002 is arranged on a side of the liquid crystal layer 3 that is facing away from the first substrate support 1; the heating elements 4 are distributed on the first group of conductive layers 001 and / or the second group of conductive layers 002.

[0048] In some embodiments of the present disclosure, as in the Fig. As shown in Figures 5 to 9, the heating elements 4 are distributed in different conductive layers, with the heating elements 4 in at least one conductive layer being connected in parallel with the heating elements 4 in another conductive layer. The number of conductive layers can be two, three, four, five, six or more, and the heating elements 4 can be distributed in two, three, four, five, six or more conductive layers. Among these heating elements 4, the heating elements 4 in at least two conductive layers are connected in parallel.

[0049] As in the Fig. As shown in Figures 1 to 4, several conductive layers comprise, for example, a first conductive layer 101, a second conductive layer 102, a third conductive layer 103, etc., and heating elements 4 are distributed in each conductive layer, the heating elements 4 distributed in the first conductive layer 101 being connected in parallel with the heating elements 4 distributed in the second conductive layer 102, as shown in Figure 1 to 4. Fig. 6 shown. Alternatively, the heating elements 4 distributed in the first conductive layer 101, the heating elements 4 distributed in the second conductive layer 102 and the heating elements 4 distributed in the third conductive layer 103 are connected in parallel, as shown in Fig. 5. It should be noted that the examples given here serve only to illustrate the parallel connection of the heating elements 4 and do not constitute a limitation of the present disclosure.

[0050] The display panel comprises a display area AA and a peripheral area FA located at the periphery of display area AA. Display area AA is used to display an image, and peripheral area FA can be equipped with peripheral circuitry. Heating elements 4 in different conductive layers can be connected via vias located in peripheral area FA to reduce their impact on the aperture rate of the display panel.

[0051] Since the space required for arranging the heating elements 4 on the display panel is too small in the relevant technology, the heating elements 4 are usually too small in size; for example, their wire width is too narrow, resulting in excessive resistance and impairing the heating effect. In the present disclosure, connecting the heating elements 4 in parallel helps to reduce their resistance and increase their current, thereby improving their heating efficiency. It should be noted that heating elements 4 located in different conductive layers can be connected in parallel if they are distributed across more than two conductive layers. The specific number of parallel conductive layers can be adjusted according to the actual resistance of the heating elements 4, the heating requirements of the display panel, and other factors.

[0052] In some embodiments of the present disclosure, as in the Fig. 5 to 9 as well as in the Fig. As shown in Figure 26, the display panel further comprises adapter lines 5 and a heating control unit 6. The adapter lines 5 are distributed in at least one of the several conductive layers and are located in the peripheral area FA. The heating control unit 6 can be located in the peripheral area FA or provided as an external unit to control the switching on or off of the heating elements 4. The adapter lines 5 connect the heating elements 4 to the heating control unit 6. The heating control unit 6 controls whether the display panel is heated by switching the heating elements 4 on or off. Furthermore, the adapter lines 5 can also be distributed in the same conductive layer as the heating elements 4, and if both are distributed in the same conductive layer, they can be manufactured by the same photolithographic process.

[0053] In some embodiments of the present disclosure, the orthogonal projections of the heating elements 4, which are distributed in the various conductive layers on the first substrate support 1, overlap at least partially, and the overlap rate is not less than 90%. Preferably, the orthogonal projections of the heating elements 4, which are distributed in the various conductive layers on the first substrate support 1, overlap substantially completely. That is, the shapes and arrangements, etc., of the heating elements 4 in the various conductive layers are essentially the same in order to facilitate the connection of the heating elements 4 in the various conductive layers and at the same time reduce the influence on the aperture rate of the display panel.It should be noted here that the overlap rate in this embodiment refers to the percentage of the overlap area of ​​the orthogonal projections of the heating elements 4 in the various conductive layers on the first substrate support 1 to the area of ​​the orthogonal projections of the heating elements 4 in a single layer on the first substrate support 1.

[0054] In some embodiments of the present disclosure, as in the Fig. As shown in Figures 1 to 4, the multiple conductive layer comprises a first conductive layer 101, a second conductive layer 102, a third conductive layer 103, a fourth conductive layer 104, a fifth conductive layer 105, and a sixth conductive layer 106, arranged sequentially in the direction away from the first substrate support 1. The first conductive layer 101 comprises a light-shielding structure; the second conductive layer 102 comprises an active region of a transistor; the third conductive layer 103 comprises a gate electrode of the transistor; the fourth conductive layer 104 comprises a source electrode and a drain electrode of the transistor; the fifth conductive layer 105 comprises a first electrode 051; and the sixth conductive layer 106 includes a second electrode 061, wherein the second electrode 061 is used to form an electric field with the first electrode 051 to drive the liquid crystal layer 3.The first electrode 051 can be a pixel electrode or a common electrode, and accordingly, the second electrode 061 can be a common electrode or a pixel electrode. In this embodiment, the first conductive layer 101, the second conductive layer 102, the third conductive layer 103, the fourth conductive layer 104, the fifth conductive layer 105, and the sixth conductive layer 106 can be combined to form a first group of conductive layers 001.

[0055] The display panel further comprises a first gate insulating layer 120, which is arranged between the second conductive layer 102 and the third conductive layer 103; a second gate insulating layer 130 and an interlayer dielectric layer 140, which are arranged between the third conductive layer 103 and the fourth conductive layer 104; and a planarization layer 150, which is arranged between the fourth conductive layer 104 and the fifth conductive layer 105; and a passivation layer 160, which is arranged between the fifth conductive layer 105 and the sixth conductive layer 106.

[0056] The heating elements 4 are distributed in at least one of the six conductive layers formed by the combination of the first conductive layer 101, the second conductive layer 102, the third conductive layer 103, the fourth conductive layer 104, the fifth conductive layer 105, and the sixth conductive layer 106. That is, the heating elements 4 can be distributed in one, two, three, or more of the six conductive layers.

[0057] In one embodiment, the heating elements 4 are distributed in at least two of the six conductive layers formed by the combination of the first conductive layer 101, the second conductive layer 102, the third conductive layer 103, the fourth conductive layer 104, the fifth conductive layer 105, and the sixth conductive layer 106. The heating elements 4 in at least one of the conductive layers are connected in parallel with the heating elements 4 in another conductive layer. In this embodiment, the heating elements 4 can each be manufactured from the same material and using the same photolithography process as the first conductive layer 101, the second conductive layer 102, the third conductive layer 103, the fourth conductive layer 104, the fifth conductive layer 105, and the sixth conductive layer 106, respectively, in order to avoid additional process steps and save costs.

[0058] For example, if the heating elements 4 are distributed in the first conductive layer 101, the material of the first conductive layer 101 can be a metal or an alloy material, wherein the metal or alloy material can first be deposited on one side of the first substrate support 1 to form a conductive material layer, and subsequently the conductive material layer can be patterned to obtain the heating elements 4 and the light-shielding structure.As another example, if the heating elements 4 are distributed in the second conductive layer 102, the material of the second conductive layer 102 can be a conductive material such as polysilicon or IGZO (indium gallium zinc oxide). The conductive material, such as polysilicon or IGZO, can first be deposited on one side of the first conductive layer 101 to form a conductive layer, and then the conductive layer can be patterned to create structures such as the heating elements 4 and the active region of the transistor. Furthermore, if the heating elements 4 are distributed in other conductive layers, the process can be analogous to the examples mentioned above, although this will not be discussed in detail here.

[0059] In some embodiments of the present disclosure, as in the Fig. As shown in Figures 5 to 9, the heating elements 4 are distributed in at least two of the six conductive layers formed by the combination of the first conductive layer 101, the second conductive layer 102, the third conductive layer 103, the fourth conductive layer 104, the fifth conductive layer 105, and the sixth conductive layer 106. The heating elements 4 in at least one of the conductive layers are connected in parallel with the heating elements 4 in another conductive layer. In this embodiment, the heating elements 4 in the different conductive layers can be connected via a via and subsequently connected to the heating control unit 6 via an adapter line 5. The connected vias can be located in the peripheral area FA to reduce the influence on the aperture rate of the display panel.

[0060] For example, in Fig. As shown in Figure 6, if the heating elements 4 are distributed in the first conductive layer 101 and the second conductive layer 102, and the adapter lead 5 is distributed in the fourth conductive layer 104, a via can be formed in the structures such as the first conductive layer 101 and the second conductive layer 102 before the formation of the fourth conductive layer 104. This via is located in the peripheral region FA, and then a connection can be made between the heating elements 4 distributed in the first conductive layer 101 and the heating elements 4 distributed in the second conductive layer 102 via the adapter leads 5 distributed in the fourth conductive layer 104. As a further example, as shown in Figure 6, Fig. As shown in Figure 5, if the heating elements 4 are distributed in the first conductive layer 101, the second conductive layer 102 and the third conductive layer 103, and the adapter leads 5 are distributed in the fourth conductive layer 104, a via can be formed in the structures such as the first conductive layer 101, the second conductive layer 102 and the third conductive layer 103 before the formation of the fourth conductive layer 104, with this via being located in the peripheral region FA, and then a connection can be made between the heating elements 4 distributed in the first conductive layer 101 and the heating elements 4 distributed in the second conductive layer 102 and the heating elements 4 distributed in the third conductive layer 103 by means of the adapter leads 5 distributed in the fourth conductive layer 104, and thus connected to the heating control unit 6 located in the peripheral region FA.

[0061] As another example of how in Fig. As shown in Figure 7, if the heating elements 4 are distributed in the second conductive layer 102 and the third conductive layer 103 and the adapter leads 5 are distributed in the fourth conductive layer 104, a via can be formed in the structures such as the second conductive layer 102 and the third conductive layer 103 before the formation of the fourth conductive layer 104, with this via being located in the peripheral region FA, and subsequently the heating elements 4 distributed in the second conductive layer 102 are connected to the heating elements distributed in the third conductive layer 103 via the adapter leads 5 distributed in the fourth conductive layer 104.

[0062] As another example of how in Fig. As shown in Figure 8, if the heating elements 4 are distributed in the fourth conductive layer 104 and the fifth conductive layer 105 and the adapter leads 5 are distributed in the sixth conductive layer 106, a via can be formed in the structures such as the fourth conductive layer 104 and the fifth conductive layer 105 before the formation of the sixth conductive layer 106, with this via being located in the peripheral region FA, and subsequently the heating elements 4 distributed in the fourth conductive layer 104 are connected to the heating elements distributed in the fifth conductive layer 105 by the adapter leads 5 distributed in the sixth conductive layer 106.

[0063] In some embodiments of the present disclosure, as in the Fig. As shown in Figures 2 to 4, heating elements 4 can also be formed by additionally adding photolithography processes to the display panel. For example, as shown in the Fig. 2 and Fig. As shown in Figure 3, the multiple conductive layers also include a seventh conductive layer 107, which is provided between any two of the six conductive layers formed by the combination of the first conductive layer 101, the second conductive layer 102, the third conductive layer 103, the fourth conductive layer 104, the fifth conductive layer 105, and the sixth conductive layer 106. Alternatively, the seventh conductive layer is provided on a side of the first conductive layer 101 that is located near the first substrate support 1. As shown in Figure 3, the seventh conductive layer is located on the side of the first conductive layer 101 that is located near the first substrate support 1. Fig. As shown in Figure 2, the seventh conductive layer 107 is arranged between the first conductive layer 101 and the second conductive layer 102. Fig. As shown in Figure 3, the seventh conductive layer 107 is arranged between the third conductive layer 103 and the fourth conductive layer 104. In this embodiment, the first conductive layer 101, the second conductive layer 102, the third conductive layer 103, the fourth conductive layer 104, the fifth conductive layer 105, the sixth conductive layer 106, and the seventh conductive layer 107 can be combined to form the first group of conductive layers 001.

[0064] It should be noted that an insulating layer 180 is provided between the seventh conductive layer 107 and its adjacent conductive layer if the display panel additionally contains a seventh conductive layer 107. In such embodiments, at least some of the heating elements 4 are distributed in the seventh conductive layer 107.It should be noted that in this embodiment, in addition to the seventh conductive layer 107, the heating elements 4 can be distributed in any conductive layers from the first to the sixth conductive layers mentioned above, and the heating elements 4 in the seventh conductive layer 107 are connected in parallel to the heating elements 4 in at least one of the six conductive layers formed by the combination of the first conductive layer 101, the second conductive layer 102, the third conductive layer 103, the fourth conductive layer 104, the fifth conductive layer 105, and the sixth conductive layer 106. As in . Fig. As shown in Figure 9, the heating elements 4 distributed in the first conductive layer 101, the heating elements 4 distributed in the seventh conductive layer 107 and the heating elements 4 distributed in the second conductive layer 102 are connected in parallel.

[0065] In some embodiments of the present disclosure, as in the Fig. As shown in Figures 13 to 18, the heating elements 4 are designed as heating wires which can be arranged in various ways in several areas of the display panel.

[0066] The display panel comprises several data lines DL and several scanning lines GL, with the scanning lines GL and the data lines DL intersecting to define multiple pixel areas. As shown in the Fig. 13 and Fig. As shown in Figure 14, several heating elements 4 extend along the direction of extension of the scanning lines GL and are arranged along the arrangement direction of the scanning lines GL; or as shown in the Fig. 16, Fig. 17 and Fig. As shown in Figure 18, several heating elements 4 extend along the direction of extension of the data lines DL and are arranged along the direction of arrangement of the data lines DL. In particular, the heating elements 4 can be heating wires with a wire width of 5-10 µm, such as 5 µm, 6 µm, 7 µm, 8 µm, 9 µm, or 10 µm, etc., but this is not limited to this. In a specific embodiment, the several scanning lines GL extend along the first direction X and are arranged along the second direction Y, with the angle between the first direction X and the second direction Y being approximately 90°. The several data lines DL extend along the second direction Y and are arranged along the first direction X.In one embodiment, the heating elements 4 are essentially parallel or overlapping with the scanning lines GL, which extend along the first direction X and are arranged along the second direction Y. In another embodiment, the heating elements 4 are essentially parallel or overlapping with the data lines DL, which extend along the second direction Y and are arranged along the first direction X.

[0067] In some embodiments of the present disclosure, as in Fig. As shown in Figure 14, if the heating elements 4 extend along the direction of extension of the scanning lines GL, the orthogonal projections of the heating elements 4 onto the first substrate support 1 overlap at least partially with the orthogonal projections of the scanning lines GL onto the first substrate support 1, or the distance between the orthogonal projection of a heating element 4 onto the first substrate support 1 and the orthogonal projection of a scanning line GL onto the first substrate support 1 is no more than 20 µm. As shown in the Fig. Figures 16 to 18 show that when the heating elements 4 extend along the direction of the data lines DL, the orthogonal projections of the heating elements 4 onto the first substrate carrier 1 overlap at least partially with the orthogonal projections of the data lines DL onto the first substrate carrier 1, or the distance between the orthogonal projections of the heating elements 4 onto the first substrate carrier 1 and the orthogonal projections of the data lines DL onto the first substrate carrier 1 is no more than 20 µm. In such embodiments, the heating elements 4 overlap with or are located near the scanning lines GL or the data lines DL. This solution reduces the influence on the aperture rate and ensures display quality.

[0068] In some other embodiments of the present disclosure, as in Fig. As shown in Figure 13, the first electrode 051 or the second electrode 061 has several slots, wherein the slots have kinks 611 and the individual slots are arranged parallel to each other; wherein the direction of extension of the heating elements 4 is aligned parallel to the direction of arrangement of the respective slots and the orthogonal projections of the heating elements 4 onto the first substrate support 1 overlap at least partially with the orthogonal projections of the kinks 611 onto the first substrate support 1. Furthermore, the edges of the data lines DL are parallel to the edges of the slots. The slots are each arranged in the direction of extension of the scanning lines GL, and the heating elements 4 extend along the direction of extension of the scanning lines GL.

[0069] The display panel is explained in more detail using the example of the first electrode 051 as a pixel electrode and the second electrode 061 as a common electrode. In this embodiment, a pixel unit of the display panel can be divided into two parts at the bends 611 of the slots, whereby the liquid crystal molecules of the two parts tilt in opposite directions under voltage control, thus enabling self-compensation for the "chromatic aberration" at different viewing directions, which is caused by the anisotropy of the refractive index of the liquid crystal molecules, and further improving the display quality of the display panel. Furthermore, in this embodiment, the area of ​​the bends 611 is a dark display area, and the arrangement of the heating elements 4 in this dark display area makes it possible to reduce its influence on the display quality.

[0070] In the present disclosure, the heating elements 4 can extend in the direction of extension of the scanning lines GL or in the direction of extension of the data lines DL. If the heating elements 4 extend in the direction of extension of the data lines DL, the heating elements 4 can be distributed in the same conductive layer as the scanning lines GL or not in the same conductive layer. As in the Fig. 16 and Fig. As shown in Figure 17, if, for example, the scanning lines GL are distributed in the third conductive layer 103, the heating elements 4 are not distributed in this third conductive layer 103, but together with the data lines DL in the fourth conductive layer 104 or together with the active area of ​​the transistor in the second conductive layer 102, whereby this embodiment can avoid a short circuit between the heating elements 4 and the scanning lines GL. It is understood that the heating elements 4, as shown in Fig. As shown in Figure 18, the heating elements 4 can also be distributed in the same conductive layer as the scanning lines GL. In this case, the heating elements 4, which are distributed in the same conductive layer as the scanning lines GL, must be separated upon contact with the scanning lines GL and redirected through another conductive layer, such as the fourth conductive layer 104, which contains the data lines DL, to ensure that the separated heating elements 4 can be connected for conduction.

[0071] Similarly, if the heating elements 4 extend in the direction of the scanning lines GL, they may or may not be distributed in the same conductive layer as the data lines DL. For example, if the data lines DL are distributed in the fourth conductive layer 104, the heating elements 4 are not distributed in the fourth conductive layer 104, which allows this embodiment to avoid a short circuit between the heating elements 4 and the data lines DL. It is understood that the heating elements 4 may also be distributed in the same conductive layer as the data lines DL. In this case, the heating elements 4 distributed in the same conductive layer as the data lines DL must be separated upon contact with the data lines DL and redirected through another conductive layer to ensure that the separated heating elements 4 can be connected for conduction.

[0072] Furthermore, the heating elements 4 can be located not only near the scanning lines GL or the data lines DL and the dark display areas corresponding to the bends 611, but also at other locations on the display panel. In particular, if the heating elements 4 are made of a transparent material such as ITO (indium tin oxide), IZO (indium zinc oxide), or similar, they can be positioned at any location on the display panel, as shown in Fig. 15 shown.

[0073] In the present disclosure, the heating elements 4 can be arranged on the side of the liquid crystal layer 3 near the first substrate support 1, or they can also be provided on a side of the liquid crystal layer 3 facing away from the first substrate support 1, for example on a color membrane substrate support.

[0074] In some embodiments of the present disclosure, as in Fig. As shown in Figure 4, the multiple conductive layers further comprise an eighth conductive layer 108, which is arranged on a side of the liquid crystal layer 3 facing away from the first substrate support 1, wherein at least some of the heating elements 4 are distributed in the eighth conductive layer 108. The heating elements 4 distributed in the eighth conductive layer 108 can be separately connected to the heating control unit 6 and are controlled separately by means of the heating control unit 6. As shown in the Fig. 20 and Fig. As shown in Figure 26, they are connected via a peripheral connecting line 30 to a solder pad 40 in the bonding area FA1, which in turn is connected to an external heating control unit 6. Naturally, the heating elements 4 distributed in the eighth conductive layer 108 can also be connected in parallel with the heating elements 4 distributed in the other conductive layers via a structure with conductive properties and be jointly controlled by the corresponding heating control unit 6. In this embodiment, the eighth conductive layer 108 can accordingly form a second group of conductive layers 002.

[0075] In some embodiments, such as in Fig. As shown in Figure 4, the display panel further comprises a frame sealant 302, which is sealed between the first substrate support 1 and the second substrate support 2, wherein the frame sealant 302 is provided with a conductive element 303 and the heating elements 4 distributed in the eighth conductive layer 108 are connected to the heating control unit 6 via this conductive element 303. The heating control unit 6 can be arranged on the side of the first substrate support 1.

[0076] In other embodiments, the heating elements 4 distributed in the eighth conductive layer 108 are connected in parallel to the heating elements 4 in at least one of the six conductive layers formed by the combination of the first conductive layer 101, the second conductive layer 102, the third conductive layer 103, the fourth conductive layer 104, the fifth conductive layer 105, and the sixth conductive layer 106. In such embodiments, the parallel connection structures can differ. For example, the heating elements 4 distributed in the eighth conductive layer 108 can be connected to a particular conductive layer via the conductive element 303 in the frame sealant 302 and thereby further connected to the heating elements 4 in that conductive layer, without any limitation specified in this disclosure.

[0077] In the present revelation, as in Fig. Figure 10 shows an eighth conductive layer 108 on the side of the liquid crystal layer 3 near the second substrate support 2, wherein this eighth conductive layer 108 contributes to shielding the electromagnetic radiation of the signals from the data lines DL, etc., within the display area AA, as well as from the gate driver circuit 10 in the peripheral area FA, thereby improving the electromagnetic compatibility (EMC) of a display product such as an onboard product. Furthermore, as shown in Figure 10, it contributes to the shielding of the display area. Fig. 11 shown to reduce the interference of the external touch component 20, thus improving the overall performance of the display product.

[0078] Furthermore, as in Fig. As shown in Figure 12, a conductive layer, such as the seventh conductive layer 107, is provided on the side of the liquid crystal layer 3 near the first substrate support 1, which can further protect the signals from the data lines DL, the gate driver circuit 10, etc., within the display panel from interference by external electromagnetic radiation in order to improve the stability of the display panel.

[0079] In some embodiments of the present disclosure, as in the Fig. 4 and Fig. As shown in Figure 19, the display panel further comprises a color membrane layer 210 arranged between the liquid crystal layer 3 and the second substrate support 2. The display panel also includes a first orientation layer 170 and a second orientation layer 220, the first orientation layer 170 being arranged between the sixth conductive layer 106 and the liquid crystal layer 3, and the second orientation layer 220 being arranged between the liquid crystal layer 3 and the color membrane layer 210. The color membrane layer 210 comprises light-shielding sections 211 and several light-filtering sections 212 bounded by the light-shielding sections 211, the light-filtering sections 212 being arranged one-to-one with the pixel regions in the direction perpendicular to the first substrate support 1. The light-shielding sections 211 consist of a light-shielding material, such as a black resin material.The light emitted by the background light source can emit different colored light after passing through the light filtering sections 212. The display panel also includes spacers 301 arranged between the first substrate support 1 and the second substrate support 2, wherein the orthogonal projection of the spacer 301 onto the first substrate support 1 overlaps at least partially with the orthogonal projection of the light-shielding sections 211 onto the first substrate support 1.

[0080] The orthogonal projections of the heating elements 4 onto the first substrate support 1 are located within the orthogonal projections of the light-shielding sections 211 onto the first substrate support 1. In an embodiment as shown in Fig. As shown in Figure 19, the heating elements 4 distributed in the eighth conductive layer 108 can be a lattice structure, wherein the orthogonal projection of the conductive layer of the lattice structure onto the first substrate support 1 is within the orthogonal projections of the light shielding sections 211 onto the first substrate support 1.

[0081] In the present revelation, as in the Fig. As shown in Figures 21 to 24, several heating elements 4 can be present. Of the several heating elements 4 distributed in the same conductive layer, at least some of the heating elements 4 are connected in parallel or in series to form a heating unit 004. The specific connection method can be selected according to the actual heating requirements. In some embodiments, for example, at least two of the several heating elements 4 distributed in the same conductive layer are connected in series or in parallel, and in particular, two, three, four, five or more of the heating elements 4 can be connected in series or in parallel to form the heating unit 004.

[0082] In some embodiments, the display panel has a central axis O extending perpendicular to the direction of extension of the heating elements 4, wherein the heating element 4 has a first end and a second end, the first end of each heating element 4 being located on one side of the central axis O and the second end of each heating element 4 being located on the other side of the central axis O; wherein the first end and / or the second end of the at least two heating elements 4 are connected to each other by the multiple heating elements 4 distributed in the same conductive layer. Furthermore, the first end and the second end of the heating elements 4 can be located in the peripheral area FA, whereby the heating elements 4 thus formed are distributed over the entire display area AA of the display panel and each individual zone of the display area AA can be heated.

[0083] In some embodiments of the present disclosure, the adapter lines 5 connect the heating unit 004 and the heating control unit 6, wherein the adapter lines 5 are distributed in at least two of the several conductive layers and the adapter lines 5 distributed in different conductive layers are connected in parallel. In this embodiment, the adapter lines 5 located in different conductive layers are connected in parallel, which to some extent contributes to increasing the current-carrying capacity of the adapter lines 5 and ensuring the safety and stability of the display panel.

[0084] In the present disclosure, there are various ways of connecting the multiple heating elements 4 distributed in the same conductive layer. In one embodiment, as in Fig. As shown in Figure 21, among the multiple heating elements 4 distributed in the same conductive layer, the first ends of each pair of heating elements 4 are connected, while the second ends are not connected, thus forming several essentially U-shaped sections. These U-shaped sections constitute the heating unit 004. One end of this U-shaped section can serve as an input, which is controlled by the heating control unit 6 to determine whether a supply voltage should be applied. When the supply voltage is applied, the other end of the U-shaped section serves as an output, and the current flows from the input through this U-shaped section and is then released through the output, thus heating the display panel. It should be noted that different U-shaped sections can be connected to different heating control units 6 to achieve independent control of each U-shaped section.Furthermore, each U-shaped part can be connected to the heating control unit 6 via the solder pads 40.

[0085] In another embodiment, as in Fig. As shown in Figure 23, among the multiple heating elements 4 distributed in the same conductive layer, the first ends of at least two heating elements 4 are connected to each other, and their second ends are likewise connected to each other. In this embodiment, the heating elements 4 distributed in the same conductive layer can be connected in parallel to each other. For example, among the multiple heating elements 4 distributed in the same conductive layer, the first ends of two, three, four, five, or more heating elements 4 are connected to each other, and their second ends are also connected to each other to form a grid section. This grid section forms the heating unit 004. As mentioned previously, the grid section is connected to the heating control unit 6, which controls the switching on and off of this grid section.Accordingly, different grid sections can be connected to different heating control units 6 to enable independent control of each grid section. Naturally, several heating elements 4 in the same conductive layer can also be connected in parallel to form a single unit, as shown in [reference]. Fig. 22 shown, the exact number of parallel circuits in this disclosure is not limited.

[0086] In this embodiment, as in the Fig. 22, Fig. 23 and Fig. As shown in Figure 25, the first ends and the second ends of the multiple heating elements 4 distributed in the same conductive layer can be connected by a connecting line 04, the connecting line 04 being located in the same conductive layer as the heating elements 4. As shown in Fig. As shown in Figure 25, both the heating elements 4 and the connecting line 04 are distributed in the second conductive layer 102. This connecting line 04 can also be used as an adapter line 5 multiplex and connected in parallel with the adapter lines 5 distributed in other conductive layers. For example, the connecting line 04 is connected in parallel with the adapter line 5 distributed in the third conductive layer 103 and the adapter line 5 distributed in the fourth conductive layer 104, thereby jointly connecting the heating unit 004 to the solder pads 40 and thus to the heating control unit 6.

[0087] In another embodiment, as in Fig. As shown in Figure 24, three heating elements 4 from the multiple heating elements 4 distributed in the same conductive layer can be connected in series to form an S-shaped part. This S-shaped part forms the heating unit 004. As mentioned previously, the S-shaped part is connected to the heating control unit 6, which controls the switching on and off of this S-shaped part. Different S-shaped parts can be connected to different heating control units 6 to allow independent control of each S-shaped part. Of course, three, four, five, or more heating elements 4 can be connected in series in the same conductive layer to form a serpentine part, without the present disclosure being limited to this.In this embodiment, the S-shaped part can also be connected to the heating control unit 6 via adapter lines 5, which are distributed in different conductive layers, the specific connection method being applicable to the embodiments above and not described in detail here.

[0088] As in the Fig. 26 and Fig.As shown in Figure 27, the present disclosure also provides a display module comprising a display panel according to one of the embodiments mentioned above.The display module also includes a temperature sensing circuit comprising a current input and output unit 71 and a temperature sensing unit 72, wherein the current input and output unit 71 is connected to a current switching control terminal G1, a current input terminal In, a first node N1 and a current output terminal Out; wherein the current input and output unit 71 is configured to output current from the current input terminal In, via the first node N1 and then via the current output terminal Out, under a switching control signal from the current switching control terminal G1; wherein the temperature sensing unit 72 is connected to the first node N1 and the temperature sensing unit 72 is integrated into the display panel and is configured to generate a leakage current, such that the temperature sensing unit 72 includes at least one PIN diode.

[0089] In this embodiment, the temperature sensing unit 72 is integrated into the display panel, thereby enabling more precise temperature sensing and improving the accuracy of the display panel's temperature measurement. In particular, the temperature sensing unit 72 can be arranged in a peripheral area FA of the display panel, and there can be several of them, which is not limited in the present disclosure. The temperature sensing unit 72 includes a PIN diode whose forward current varies with the temperature change. When the current input and output unit 71 conducts under the control of the current switching control terminal G1, current is input from the current input terminal In, and when it flows through the first node N1, a leakage current is generated due to the presence of the PIN diode.This causes the current output from the current output terminal Out to differ from the current input to the current output terminal Out. By measuring the current difference between the two, the leakage current generated by the PIN diode can be determined. Based on this correlation between the leakage current and the temperature, the temperature of the display panel can then be determined.

[0090] In some embodiments of the present disclosure, the current input and output unit 71 comprises a first transistor T1 and a second transistor T2, wherein the first electrode of the first transistor T1 is connected to the current input terminal In, the second electrode of the first transistor T1 and the first electrode of the second transistor T2 are both connected to the first node N1, the second electrode of the second transistor T2 is connected to the current output terminal Out, and both the gate electrode of the first transistor T1 and the gate electrode of the second transistor T2 are connected to the current switching control terminal G1.

[0091] In the present disclosure, the first electrode of the transistor can be a source electrode or a drain electrode, and the second electrode can be a drain electrode or a source electrode. The first transistor T1 and the second transistor T2 used can be a P-type transistor or an N-type transistor. It is only necessary to connect the electrode of the selected transistor type accordingly, with reference to the respective electrode of the corresponding transistor in the embodiments of the present disclosure, and to provide the appropriate high voltage or low voltage at the corresponding voltage terminals.For example, in an N-type transistor, its input terminal is the drain electrode and its output terminal is the source electrode, and its control terminal is the gate electrode; in a P-type transistor, its input terminal is the source electrode and its output terminal is the drain electrode, and its control terminal is the gate electrode. The levels of the control signals at their control terminals also differ between transistor types. For example, in an N-type transistor, if the control signal is high, the N-type transistor is conducting; and if the control signal is low, the N-type transistor is off. In a P-type transistor, the P-type transistor is conducting when the control signal is low, and the P-type transistor is off when the control signal is high.In particular, in one embodiment, the first transistor T1 and the second transistor T2 are N-type transistors.

[0092] The temperature sensing unit 72 comprises at least one PIN diode. If there is more than one PIN diode, the multiple PIN diodes are connected in parallel, the first terminal of the PIN diode is connected to the first node N1, and the second terminal of the PIN diode is connected to a first supply voltage terminal VSS. The first supply voltage terminal VSS can be supplied with the first supply voltage Vss. In a specific embodiment, the temperature sensing unit 72 comprises a first PIN diode D1 and a second PIN diode D2, wherein the first terminal of the first PIN diode D1 and the first terminal of the second PIN diode D2 are both connected to the first node N1, and the second terminal of the first PIN diode D1 and the second terminal of the second PIN diode D2 are both connected to the first supply voltage terminal VSS.

[0093] In some embodiments of the present disclosure, the temperature sensing circuit also includes a first control unit 73. This control unit 73 is connected to a signal control terminal GATE, the first supply voltage terminal VSS, the second supply voltage terminal VDD, and the current switching control terminal G1, wherein the first control unit 73 is configured to output a voltage from the first supply voltage terminal VSS or the second supply voltage terminal VDD to the current switching control terminal G1 under the control signal from the signal control terminal GATE. The second supply voltage terminal VDD can be supplied with a second supply voltage Vdd.The first control unit 73 comprises at least two inverters, wherein the output of the k-th inverter is connected to the input of the (k+1)-th inverter, the input of the first inverter is connected to the signal control terminal GATE, and the output of the last inverter is connected to the current switching control terminal G1, where k is a positive integer greater than or equal to 1.

[0094] In a specific embodiment, the first control unit 73 comprises two inverters, each a CMOS inverter comprising a PMOS transistor and an NMOS transistor connected in series. The phase difference between the input signal at the input and the output signal at the output of each inverter is 180 degrees. For example, if the input signal at the input of the first inverter is a high-level signal, the output signal at its output is a low-level signal; that is, the input signal at the input of the second inverter is a low-level signal, and the output signal at its output is a high-level signal, with the two transistors of the current input and output unit 71 now conducting, thus enabling temperature sensing by the display panel.

[0095] In some embodiments of the present disclosure, the temperature sensing circuit further comprises a second control unit 74, which is connected to the output of one of the inverters in the first control unit 73, the first supply voltage terminal VSS, and the first terminal of the PIN diode, and is configured to apply the first supply voltage of the first supply voltage terminal VSS to the first terminal of the PIN diode upon receipt of the control signal from the output of the inverter connected to it. The second control unit 74 comprises a third transistor T3, wherein the control terminal of the third transistor T3 is connected to the output of the first inverter, the first electrode of the third transistor T3 is connected to the first supply voltage terminal VSS, and its second electrode is connected to the first terminal of the PIN diode. In particular, the third transistor T3 is an N-type transistor.

[0096] In the present disclosure, a high-level signal can be inputted to the input of the first inverter when temperature sensing of the display panel is required, wherein at this time the output signal from the first inverter is a low-level signal, and the output signal from the second inverter is a high-level signal, wherein at this time both transistors of the current input and output unit 71 are conducting. Simultaneously, the input signal at the control terminal of the third transistor T3 is a low-level signal, thereby switching off the third transistor T3. The voltage at the first terminal of the PIN diode is equal to the voltage at the first node N1, while the voltage at the second terminal of the PIN diode is Vss.Current is supplied via the current input terminal In, and when it flows through the first node N1, a leakage current is generated due to the presence of the PIN diode. This causes the current output at the current output terminal Out to differ from the current input at the current output terminal Out. By measuring the current difference between the two, the leakage current generated by the PIN diode can be determined. Based on the correlation between this leakage current and the temperature, the temperature of the display panel can then be calculated.

[0097] If temperature sensing of the display panel is not required, a low-level signal can be applied to the input of the first inverter. At this point, the output signal from the first inverter is a high-level signal, and the output signal from the second inverter is a low-level signal. Both transistors of the current input / output unit 71 are now off, and the current input / output unit 71 is switched off. Simultaneously, the input signal at the control terminal of the third transistor T3 is a high-level signal, causing the third transistor T3 to conduct and applying the first supply voltage Vss to the first terminal of the PIN diode. At this point, there is no voltage at either terminal of the PIN diode, and the entire temperature sensing circuit is in a non-operational state.

[0098] In some embodiments of the present disclosure, the display module further comprises a driver chip and a printed circuit board, wherein the driver chip is connected to the display panel and the printed circuit board is connected to the driver chip. The first control unit 73 can be arranged in the driver chip, and the current input and output unit 71 can be arranged in the printed circuit board. Of course, the first control unit 73 and / or the current input and output unit 71 can also be integrated into the display panel, to which the present disclosure is not limited.

[0099] An embodiment of the present disclosure also provides a display device comprising a display module according to one of the embodiments of the present disclosure. The display device can be used in any product or component with display functions, such as mobile phones, tablets, televisions, monitors, laptops, digital picture frames, navigators, etc.

[0100] It is understood that the present disclosure does not limit its application to the detailed structure and arrangement of the components proposed herein. The present disclosure may also have other embodiments and can be implemented and carried out in a variety of ways. The aforementioned variations and modifications fall within the scope of the present disclosure. It is understood that the present disclosure, as disclosed and limited in this description, extends to all alternative combinations of two or more individual features mentioned or apparent in the text and / or the accompanying figures. All these different combinations represent several alternative aspects of the present disclosure. The embodiments described in this description represent the optimal known ways of implementing the present disclosure and enable the person skilled in the art to utilize the present disclosure.

Claims

[1] A display panel comprising a first substrate support and a second substrate support arranged opposite to each other, and a liquid crystal layer and a plurality of conductive layers arranged between the first substrate support and the second substrate support; the display panel also comprises a plurality of heating elements distributed in at least one of the conductive layers. [2] A display panel according to claim 1, wherein the heating elements are distributed in at least two of the conductive layers, wherein in the heating elements distributed in different conductive layers, the heating elements in at least one of the conductive layers are connected in parallel with the heating elements in another of the conductive layers. [3] The display panel according to claim 1, wherein the plurality of conductive layers comprises: a first group of conductive layers comprising at least one of the conductive layers, wherein the first conductive layers are arranged on the side of the liquid crystal layer near the first substrate support; a second group of conductive layers comprising at least one of the conductive layers, wherein the second group of conductive layers is arranged on the side of the liquid crystal layer facing away from the first substrate carrier; the heating elements are distributed in the first group of conductive layers and / or the second group of conductive layers. [4] A display panel according to claim 1, wherein the display panel comprises a display area and a peripheral area located at the periphery of the display area; the display panel further comprising: adapter lines, wherein the adapter lines are distributed in at least one of the plurality of conductive layers, wherein the adapter lines are arranged in the peripheral region; Heating control unit for controlling the switching on and off of the heating elements, with the adapter cables connecting the heating elements and the heating control unit. [5] A display panel according to claim 4, wherein the plurality of conductive layers comprises a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, a fifth conductive layer and a sixth conductive layer arranged sequentially in the direction away from the first substrate support: the first conductive layer comprises a light-shielding structure; the second conductive layer comprises an active region of a transistor; the third conductive layer comprises a gate electrode of the transistor; the fourth conductive layer comprises a source electrode and a drain electrode of the transistor; the fifth conductive layer comprises a first electrode; and the sixth conductive layer comprises a second electrode, the second electrode being used to form an electric field with the first electrode for driving the liquid crystal layer; wherein the heating elements are distributed in at least one of the six conductive layers formed by the combination of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer and the sixth conductive layer. [6] A display panel according to claim 5, wherein the heating elements are distributed in at least two of the six conductive layers formed by the combination of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer and the sixth conductive layer, and the heating elements in at least one of the conductive layers are connected in parallel with the heating elements in another of the conductive layers. [7] The display panel of claim 5, wherein the plurality of conductive layers further comprise: a seventh conductive layer provided between any two of the six conductive layers formed by the combination of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer, and the sixth conductive layer, or provided on a side of the first conductive layer that is close to the first substrate support; wherein at least a portion of the heating elements are distributed in the seventh conductive layer. [8] A display panel according to claim 7, wherein the heating elements distributed in the seventh conductive layer are connected in parallel with the heating elements in at least one of the six conductive layers formed by the combination of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer and the sixth conductive layer. [9] The display panel of claim 5, wherein the plurality of conductive layers further comprise: an eighth conductive layer arranged on the side of the liquid crystal layer facing away from the first substrate carrier; wherein at least a portion of the heating elements are distributed in the eighth conductive layer. [10] A display panel according to claim 9, wherein the display panel further comprises: Frame sealing means which seals between the first substrate carrier and the second substrate carrier, wherein a conductive element is provided within the frame sealing means, wherein the heating elements distributed in the eighth conductive layer are connected to the heating control unit via the conductive element. [11] A display panel according to claim 9, wherein the heating elements distributed in the eighth conductive layer are connected in parallel with the heating elements in at least one of the six conductive layers formed by the combination of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer and the sixth conductive layer. [12] A display panel according to any one of claims 5, 7 or 9, wherein the display panel comprises a plurality of data lines and a plurality of scan lines, the scan lines and the data lines crossing to define a plurality of pixel regions; a plurality of heating elements extend in the extending direction of the scanning lines and are arranged in the arranging direction of the scanning lines; or more heating elements extend in the extension direction of the data lines and are arranged in the arrangement direction of the data lines. [13] A display panel according to claim 12, wherein, when the heating elements extend in the direction of extension of the scanning lines, the orthogonal projections of the heating elements onto the first substrate carrier at least partially overlap with the orthogonal projections of the scanning lines onto the first substrate carrier, or the distances between the orthogonal projections of the heating elements onto the first substrate carrier and the orthogonal projections of the scanning lines onto the first substrate carrier are not greater than 20 µm; when the heating elements extend in the direction of extension of the data lines, the orthogonal projections of the heating elements onto the first substrate carrier at least partially overlap with the orthogonal projections of the data lines onto the first substrate carrier, orthe distances between the orthogonal projections of the heating elements onto the first substrate carrier and the orthogonal projections of the data lines onto the first substrate carrier are not greater than 20 µm. [14] A display panel according to claim 12, wherein the first electrode or the second electrode has a plurality of slots, the slots having kinks and the individual slots being parallel to each other; wherein the extension direction of the heating elements is parallel to the arrangement direction of the individual slots, and the orthogonal projections of the heating elements onto the first substrate carrier at least partially overlap with the orthogonal projections of the kinks onto the first substrate carrier. [15] A display panel according to claim 12, wherein the display panel further comprises: a color membrane layer disposed between the liquid crystal layer and the second substrate support, the color membrane layer having light-shielding portions and comprises a plurality of light filtering sections delimited by the light shielding sections, wherein the light filtering sections are arranged in a one-to-one correspondence with the pixel regions in the direction perpendicular to the first substrate carrier; wherein the orthogonal projections of the heating elements onto the first substrate carrier are located within the orthogonal projections of the light shielding sections onto the first substrate carrier. [16] A display panel according to claim 1, wherein the orthogonal projections of the heating elements distributed in different conductive layers onto the first substrate support at least partially overlap, and the overlap rate is not less than 90%. [17] A display panel according to claim 12, wherein at least a part of the heating elements of the plurality of heating elements distributed in the same conductive layer are connected in parallel or in series to form a heating unit. [18] A display panel according to claim 17, wherein at least two of the heating elements of the plurality of heating elements distributed in the same conductive layer are connected in series or in parallel. [19] A display panel according to claim 18, wherein the display panel has a central axis perpendicular to the direction of extension of the heating elements; the heating element has a first end and a second end, the first end of the respective heating elements being on one side of the central axis, the second end of the respective heating elements being on the other side of the central axis, and the first end and the second end of the heating element being in the peripheral region; wherein the first end and / or the second end of the at least two of a plurality of heating elements distributed in the same conductive layer are connected to each other. [20] The display panel according to claim 19, wherein the adapter lines connect the heating unit and the heating control unit, the adapter lines being distributed in at least two of the plurality of conductive layers, and the adapter lines distributed in different conductive layers being connected in parallel. [21] A display module comprising the display panel according to any one of claims 1-20. [22] The display module of claim 21, wherein the display module further comprises a temperature sensing circuit, the temperature sensing circuit comprising: a power input and output unit connected to a power switching control terminal, a power input terminal, a first node, and a power output terminal, the power input and output unit being configured to output the power from the power input terminal via the first node and then the power output terminal under a switching control signal from the power switching control terminal; a temperature sensing unit connected to the first node, wherein the temperature sensing unit is integrated into the display panel and is configured to generate leakage current, wherein the temperature sensing unit comprises at least one PIN diode. [23] The display module according to claim 22, wherein the power input and output unit comprises a first transistor and a second transistor, the first electrode of the first transistor being connected to the power input terminal, the second electrode of the first transistor and the first electrode of the second transistor being both connected to the first node, the second electrode of the second transistor being connected to the power output terminal, the gate electrode of the first transistor and the gate electrode of the second transistor being both connected to the power switching control terminal; the first terminal of the PIN diode being connected to the first node, and the second terminal of the PIN diode being connected to the first power supply voltage terminal. [24] The display module of claim 23, wherein the temperature sensing circuit further comprises: a first control unit connecting a signal control terminal, the first supply voltage terminal, the second supply voltage terminal, and the current switching control terminal, the first control unit being configured to output the voltage of the first supply voltage terminal or the second supply voltage terminal to the current switching control terminal under a control signal from the signal control terminal; the first control unit comprises at least two inverters, wherein the output of the k-th inverter is connected to the input of the (k+1)-th inverter, the input of the first inverter is connected to the signal control terminal, the output of the last inverter is connected to the current switching control terminal, where k is a positive integer greater than or equal to 1. [25] The display module of claim 24, wherein the temperature sensing circuit further comprises: a second control unit connected to the output of one of the inverters in the first control unit, to the first supply voltage terminal and to the first terminal of the PIN diode and configured to apply the first supply voltage of the first supply voltage terminal to the first terminal of the PIN diode under a control signal from the output of the inverter connected to it. [26] A display device comprising the display module according to any one of claims 21-25.

Images