PCB processing machine

Abstract

A blank processing machine comprising a blank conveying part, a cleanliness monitoring sensor, a moving part, and a control part is disclosed. The blank conveying part conveys a blank into a processing location in a device and conveys the blank out of the processing location after processing is completed. The cleanliness monitoring sensor detects the cleanliness in the device. The moving part performs a predetermined processing for the blank located at the processing location. The control part controls the operation of the moving part such that the operating speed of the moving part is changed according to the detection result of the cleanliness monitoring sensor.

Description

TECHNICAL FIELDThe technique disclosed in the present specification relates to a board processing machine for performing specific processing (e.g., component mounting processing) for boards.PRIOR ARTHeretofore, board processing machines for performing a certain processing for boards have been well known. In recent years, there have been growing needs for board processing machines capable of performing the processing for boards in a clean environment with small dusts, etc., to produce products with high quality and high reliability. As an example of this board processing machine, the prior art disclosed in JP H09-300271A is available.SUMMARY OF THE INVENTIONPROBLEM TO BE SOLVED OF THE INVENTIONWhen the movable part thereof is operated by the operation of a conventional board processing machine, a turbulent air flow occurs in the apparatus, mainly causing the lowering of cleanliness in the apparatus. As a result, the user specification of cleanliness may not be satisfied. As to the former board processing machine, for example, there is taken a measure that gaps of the case are filled as much as possible to increase the tightness, and at the same time, by increasing the performance of the air conditioner supplying clean air, the internal pressure of the case is increased to discharge dusts, etc. When this measure is taken, there is a need to set the case only for the specification of the cleanliness, thereby causing the problem of the cost increase.The present description therefore provides the technique for satisfying the user specification about cleanliness while avoiding the cost increase.MEANS FOR ACHIEVING THE OBJECTThe present specification discloses a board processing machine including a board conveying part, a cleanliness monitoring sensor, a movable part, and a control part. The board conveying part conveys a board into a processing location in an apparatus and conveys the board out of the processing location after completion of the processing. The cleanliness monitoring sensor detects cleanliness in the apparatus. The movable part performs predetermined processing for the board located at the processing location. The control part controls the operation of the movable part such that the operation speed of the movable part is changed according to the detection result of the cleanliness monitoring sensor. Therefore, by the above-mentioned constitution, the operation speed of the movable part is appropriately changed depending on the cleanliness at this time, so that the movable part can perform the appropriate operation at the changed operation speed. Thus, the user specification about cleanliness can be satisfied while avoiding the cost increase.BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1 is a schematic side view illustrating a component mounting machine according to Embodiment 1. FIG. 2 is a schematic cross-sectional view taken along line A-A of the component mounting machine of FIG. 1. FIG. 3 is a schematic plan view illustrating an embodiment in which a plurality of component mounting machines are provided. FIG. 4 is a flowchart for explaining the operation of the component mounting machine according to Embodiment 1. FIG. 5 is another flowchart for explaining the operation of the component mounting machine according to Embodiment 1.EMBODIMENT OF THE INVENTIONIn the board processing machine disclosed in the present specification, the control part may be configured to restrict the operation speed of the movable part according to the decrease in cleanliness. According to this constitution, the lowering of cleanliness can be suppressed by restricting the operation speed of the movable part.In the board processing machine disclosed in the present specification, the control part may be configured to store a predetermined reference value for cleanliness, and besides, in the case where the reduced cleanliness is below the reference value, the apparatus stops. According to this constitution, the apparatus can be prevented from continuing to operate in a state in which cleanliness is lowered.The board processing machine disclosed in the present specification may be a component mounting machine for mounting components on the board, and the movable part may be an XY robot having a component mounting head. According to this constitution, the operation speed of the XY robot performing the component mounting processing can be changed depending on the cleanliness, and thus the cleanliness in the apparatus can be maintained at a desired state.In the board processing machine disclosed in the present specification, the cleanliness monitoring sensor may be a particle counter for measuring the number and size of dusts in the apparatus. By using the particle counter, the cleanliness in the apparatus can be quantitatively recognized.In the board processing machine disclosed in the present specification, the cleanliness monitoring sensor can perform the measurement in the vicinity of the board conveyed to the processing location by the board conveying part. According to this constitution, cleanliness in a space where the processing for the board is performed can be appropriately monitored by disposing the cleanliness monitoring sensor in the vicinity of the board.Further, in the board processing machine disclosed in the present specification, a component camera that captures an image of the component may be mounted in the vicinity of the board conveying part. The cleanliness monitoring sensor may be mounted between the board conveying part and the component camera.(Embodiment 1)An embodiment of the component mounting machine 21 (an example of a board processing machine) according to the present invention will be explained below with reference to the figures. FIG. 1 is a schematic side view of a component mounting machine 21 according to the present embodiment. FIG. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1, FIG. 3 is a schematic plan view illustrating the present embodiment in which a plurality of component mounting machines 21 are provided.As shown in FIGS. 1-3, the component mounting machine 21 is a device for mounting components 2 on a board 1, and a plurality of component mounting machines 21 are arranged in the longitudinal direction (X direction) of a board conveyance path 4 conveying the board 1. Normally, a plurality of component mounting machines 21 are provided together with other board processing machines on a component production line. On the upstream side of the plurality of component mounting machines 21, a printing machine (not illustrated) is mounted. The printed circuit board 1 is printed with a pattern of solder by the printing machine, and the printed circuit board 1 printed with the pattern of solder is conveyed out toward the plurality of component mounting machines 21. On the downstream side of the plurality of component mounting machines 21, a board inspection machine and a reflow machine (both not illustrated) are mounted. The board inspection machine inspects the board 1 carried out by the plurality of component mounting machines 21 after component mounting. The board inspection machine is, for example, a board vision inspection machine that inspects whether or not components 2 are normally mounted on the board 1. When components 2 are normally mounted on the board 1, the board 1 is carried out to the reflow machine by the board inspection machine. By the reflow machine, the board 1 inspected by the board inspection machine is subjected to reflow treatment. That is, the reflow machine heats the board 1 conveyed in, melts the solder, and solders the components 2 onto the board 1.The component mounting machine 21 is provided with a plurality of component feeders 22, a head unit 23, an XY robot 24 for moving the head unit 23, a board conveyance path 25, an operation panel 26, an air conditioner (16, 17, 14), a component camera 41, a control device 31, and so on.A plurality of components 2 are accommodated in each component feeder 22. The component feeder 22 is detachably attached to a feeder holder 30, and supplies the components 2 to a holder 23 aof the head unit 23. The specific constitution of the component feeder 22 is not limited. For example, a belt feeder on which a plurality of components 2 are accommodated on a belt, a tray feeder on which a plurality of components 2 are accommodated on a tray, or a bulk material feeder on which a plurality of components 2 are accommodated randomly in a container may be available.The XY robot 24, which is a movable part, moves a moving base 24a in X and Y directions and thus the head unit 23 between the upper side of the component feeder 22 and the upper side of the board 1. the XY robot 24 is formed of guide rails for guiding the moving base 24a, a moving mechanism for moving the moving base 24a along the guide rails, a motor for driving the moving mechanism, and so on. The XY robot 24 is accommodated inside a housing 12 and at the same time arranged above the circuit board 1. The head unit 23 is fixed to the moving base 24a. The head unit 23 is moved by the XY robot 24 in a space from the upper side of the component feeder 22 to the upper side of the board 1.The head unit 23 is a movable unit for mounting the circuit board 1 with components 2, and the head unit 23 is provided with the holder 23 aand a component mounting head 23 b. The holder 23a is fixed to the moving base 24a. The component mounting head 23 bis detachably supported on the holder 23 a. The component mounting head 23 bis provided with a plurality of suction nozzles 29. The plurality of suction nozzles 29 are detachably supported on the component mounting head 23 b. The plurality of suction nozzles 29 are configured to be moved up and down (in the Z direction in the figure) by an actuator (not shown) housed in the component mounting head 23 band besides being able to suck the components 2.To mount the components 2 on the board 1 by the component mounting head 23 b, the suction nozzle 29 is first moved downward until the suction surface of the suction nozzle 29 comes into contact with the component 2 accommodated in the component feeder 22. Subsequently, the component 2 is sucked by the suction nozzle 29 and then the suction nozzle 29 is moved upward. After completion of the treatment for sucking the component 2 by the suction nozzle 29, the XY robot 24 is driven to position the component mounting head 23b with respect to the board 1. Then, the suction nozzle 29 is moved down against the board 1, whereby the component 2 is mounted on the board 1. The component mounting head 23 band the suction nozzle 29 are automatically replaced by a not-illustrated replacement robot.The board conveyance path 25, which is a board conveyance part, is a device that performs the operation of conveying the board 1 into a processing site P 1 (i.e., component mounting site) in the apparatus, the operation of positioning the board 1 at the processing site P 1 before component mounting, and the operation of conveying the board 1 from the processing site P 1 to the outside of the apparatus after component mounting. The board conveyance path 25 can also be regarded as a movable part for performing predetermined processing for the board 1 at the processing location P 1. The board conveying path 25 according to the present embodiment may be formed of, for example, a pair of belt conveyors, a support device (not illustrated) that is attached to the belt conveyors and besides supports the board 1 from below, and a drive device for driving the belt conveyors. The board 1 is conveyed from the upstream side (left side in FIG. 3 ) toward the downstream side (right side in FIG. 3 ).The air conditioner is a clean air supply device provided with an intake fan 16, an exhaust fan 17 and a filter 14. The suction fan 16 is set up in the upper region in the housing 12. The filter 14 is fixed to the ceiling of the housing 12. The suction fan 16 is a means for introducing air from the outside of the casing 12 into the inside of the casing 12, and when introducing air into the inside of the casing 12 by the action of the suction fan 16, the air is transmitted through the filter 14. The air passed through the filter 14 reaches, as a downward flow, the processing point P 1 at which the circuit board 1 is placed (see arrow A 1 in FIG. 1 ). The filter 14 collects dusts contained in air outside the housing 12 and cleanses the air. The filter 14 is not particularly limited. For example, a HEPA (High Efficiency Particulate Air Filter) filter may be used. The exhaust fan 17 is installed in the rear region in the housing 12. Near the location of the exhaust fan 17 on the housing 12, an exhaust duct 13 is provided. The exhaust fan 17 is a device for exhausting the air from the inside of the casing 12 to the outside of the casing 12 via the exhaust duct 13. the air reaching the machining location P 1 forms a transverse flow and is exhausted from the exhaust duct 13 (see arrow A 2 in FIG. 1 ).The component camera 41 is provided at a position that is between the board conveyance path 25 and the component feeders 22 and below the movement path of the component mounting head 23 b. The component camera 41 is a component capturing camera for capturing an image of the component 2 suctioned by the component mounting head 23 bfrom below. As the component camera 41, a digital image pickup device including image sensors, for example, CCD (charge coupled device), CMOS (complementary metal oxide semiconductor), etc. is used.The control device 31 (control part) is formed of a computer having a central processing unit, ROM, RAM. The control device 31 is mutually communicatable with the component feeders 22, the component mounting head 23 b, the XY robot 24, the board conveyor 25, the operation panel 26, the component camera 41, and the replacement robot via buses. The control devices 31 are connected to a production control computer 6 for storing a production program via a bus in such a way that they can be mutually communicated (see FIG. 3 ). Each control device 31 controls the operation of each part (component feeder 22, component mounting head 23 b, XY robot 24, board conveyor 25, operation panel 26, replacement robot) based on the production program. By this control, each control device 31 performs the mounting treatment for mounting the plurality of components 2 on the board 1.The component mounting machine 21 is further provided with a cleanliness monitoring sensor 42 for detecting cleanliness of air in the apparatus. The cleanliness monitoring sensor 42 according to the present embodiment is a particle counter. The particle counter measures the number and size of dusts in air by irradiating the sucked air with laser and thus receiving the scattered light from the particles. The cleanliness monitoring sensor 42 performs the measurement in the vicinity of the board 1 conveyed to the processing location P 1 by the board conveying path 25. More specifically, the cleanliness monitoring sensor 42 is mounted between the board conveying path 25 and the component accommodating component camera 41 mounted in its vicinity. The air inlet part of the cleanliness monitoring sensor 42 is set at substantially the same height as the board 1. The cleanliness monitoring sensor 42 is communicatively connected to the controller 31, and always outputs a sensor output to the controller 31. Therefore, the control device 31 can always monitor the cleanliness in the device. As shown in FIG. 3, the cleanliness monitoring sensor 42 is provided on each of the plurality of component mounting machines 21. The control device 31 on each component mounting machine 21 stores, in the storage area, a later-mentioned program for controlling the operating speed of the movable part. The programs for controlling the operating speed of the movable part are independently performed for each component mounting machine 21.On the component mounting machine 21, the control part controls the operation of the movable part so as to change the operation speed of the movable part according to the detection result of the cleanliness monitoring sensor 42. That is, the control device 31 according to the present embodiment controls the operation of the XY robot 24 such that the operation speed of the XY robot 24 is changed, according to the detection result of the cleanliness monitoring sensor 42. Specifically, the control device 31 limits the operation speed of the XY robot 24 according to the decrease in cleanliness. For example, a production program for determining the operation speed of the XY robot 24 (i.e., normal operation speed, restricted operation speed) per device type is stored in the storage area of the control device 31. The control device 31 decides the operation speed per part type based on the production program and the detection result of cleanliness. The controller 31 also stores a predetermined first reference cleanliness value C 1 in the storage area. The control device 31 is configured to decide whether or not to restrict the operation speed of the XY robot 24 based on the first reference value C 1. The value of the first reference value C 1 is appropriately determined based on the user's specification on cleanliness.Next, the operation of the component mounting machine 21 will be explained based on the flowchart of FIG. 4.The control device 31 performs the following steps according to the program for controlling the operating speed of the movable part. First, the board conveying path 25 is driven by the control device 31, whereby the board 1 placed outside the device is conveyed and positioned in the processing place P1 in the device (step S110). Subsequently, the controller 31 inputs the sensor output signal of the cleanliness wash sensor 42 to obtain a measurement value of cleanliness (step S 120). Subsequently, the controller 31 reads the first reference value C 1 from the storage area and compares the input measurement value of cleanliness with the first reference value C 1 (step S 130). When the control device 31 judges that the measurement value of the cleanliness is equal to or more than the first reference value C 1, that is, the cleanliness in the device satisfies the user specification (Yes in step S 130), the control device 31 proceeds to step S 170. In step S 170, the control device 31 controls the XY robot 24 to be operated at the normal speed without particularly limiting the operation speed of the XY robot 24. Then, the procedure moves to subsequent step S 150. When the control device 31 judges that the measurement value of the cleanliness is not equal to or more than the first reference value C 1, that is, the cleanliness in the device is so low that the user specification cannot be satisfied (No in step S 130), the control device 31 proceeds to step S 140. In step S 140, the controller 31 limits the operation speed of the XY robot 24 and controls it to operate at a lower speed. Then, the process proceeds to the subsequent step S150. In step S 150, the control device 31 judges whether or not the component mounting processing is completed. When the control device 31 judges that the component mounting processing has not been completed yet (No in step S 150), the control device 31 returns to step S 120 and repeats the measurement of cleanliness, the judgment by comparing the measurement value of cleanliness with the first reference value C 1, and driving the XY robot 24 at the normal or low speed. On the other hand, when the control device 31 judges that the component mounting processing is completed (Yes in step S 150), the control device 31 proceeds to step S 160 and conveys the board 1 to the outside of the device after the component mounting.The operation of the component mounting machine 21 may be performed in a different order from that in the flowchart of FIG. 4. Next, the operation of the component mounting machine 21 will be explained based on another flowchart in FIG. 5. Here, two reference values (first reference value C 1, second reference value C 2) for cleanliness are predetermined. The second reference value C2 is a reference value determined according to cleanliness lower than the above first reference value C1.The control device 31 first conveys the board 1 into the machining location P 1, positions it there, then inputs the sensor output signal of the cleanliness monitoring sensor 42, and compares the measurement value of the cleanliness with the first reference value C 1 (steps S 110-S 130). When the controller 31 judges that the measurement value of cleanliness is equal to or more than the first reference value C 1 (Yes in step S 130), the controller 31 proceeds to step S 170. In step S 170, the control device 31 controls the XY robot 24 to be operated at the normal speed without particularly limiting the operation speed of the XY robot 24. Then, the procedure moves to subsequent step S 150. On the other hand, when the controller 31 judges that the measurement value of cleanliness is not equal to or more than the first reference value C 1 (No in step S 130), the controller 31 proceeds to step S 153. In step S 135, the controller 31 reads a second reference value C 2 from the storage area and compares the input measurement value of cleanliness with the second reference value C 2. When the control device 31 judges that the measurement value of cleanliness is equal to or more than the second reference value C 2, that is, the cleanliness in the device satisfies the user specification but a relatively small decrease in cleanliness occurs (Yes in step S 135), the control device 31 proceeds to step S 140. In step S 140, the control device 31 restricts the operation speed of the XY robot 24 and controls it to be operated at a lower speed. Then, the procedure proceeds to step S150. However, when the control device 31 judges that the measurement value of cleanliness is not equal to or more than the second reference value C 2, that is, that cleanliness in the device does not meet the user specification and a relatively large decrease in cleanliness occurs (No in step S 135), the control device 31 proceeds to step S 180. In step S 180, the control device 31 disables, i.e., stops, the XY robot 24, and returns to step S 120. Similarly, after the transition to step S 150, if it is judged that the component mounting processing has not been completed yet (No in step S 150), the process returns to step S 120. In these cases, the steps such as measurement of cleanliness, etc. are repeated. On the other hand, when the control device 31 judges that the component mounting processing is completed (Yes in step S 150), the control device 31 proceeds to step S 160 and conveys the board 1 to the outside of the device after the component mounting. Even if the degree of lowering of cleanliness in the apparatus is judged to be relatively large and thus the XY robot 24 is stopped, the control device 31 controls the air conditioner so that its operation is maintained to perform the cleaning of the air. Thereby, the XY robot 24 starts its operation at a low speed when the measurement value of cleanliness again becomes equal to or more than the second reference value C 2. Further, the XY robot 24 starts its operation at the normal speed when the measurement value of cleanliness again becomes equal to or more than the first reference value C 1.As explained above, on the component mounting machine 21 according to the present embodiment, the control device 31 controls the operation of the movable part such that the operation speed of the movable part is changed, in accordance with the detection result of the cleanliness monitoring sensor 42. That is, the control device 31 controls the operation of the XY robot 24 so as to change the operation speed of the XY robot 24, according to the detection result of the cleanliness monitoring sensor 42. When the XY robot 24 is operated thereby, turbulent air flow occurs in the apparatus, mainly causing the lowering of cleanliness in the apparatus. Therefore, according to the reduction in cleanliness, the control device 31 according to the present embodiment restricts the operation speed of the XY robot 24, whereby the reduction in cleanliness can be suppressed. That is, the XY robot 24 performs the component mounting operation at a lower speed than usual, whereby the component mounting processing can be continued with suppressing the turbulent air flow for the purpose of preventing the cleanliness reduction. That is, the component mounting processing can be continued in the environment satisfying the user specification about the cleanliness, and thus the board 1 can be manufactured with high reliability and high quality in a state in which the productivity is maintained to some extent.In the present embodiment, it is sufficient to merely add a cleanliness monitoring sensor 42 so that the user specification on cleanliness can be satisfied while avoiding the cost increase. That is, the cost increase is caused by making the measure of filling gaps of the housing 12 as much as possible to increase the tightness and at the same time increasing the performance of the air conditioner as in the prior art, since the facilities must be designed for exclusive use. On the other hand, in the present embodiment, it is sufficient to merely add the cleanliness monitoring sensor 42 so that the cost increase satisfying the user specification about cleanliness can be effectively avoided.In the component mounting machine 21 according to the present embodiment, the control device 31 stores the predetermined reference values (first reference value C 1 and second reference value C 2) for cleanliness, and stops the device when cleanliness is lowered much and falls below the second reference value C 2. When the component mounting processing is continued in a state where cleanliness is much lowered, not only the reliability and quality of the manufactured board 1 is lowered, but also the turbulent air flow in the apparatus is not eliminated. In the present embodiment, on the other hand, the component mounting processing is not performed until the cleanliness is returned to a state where the user specification about the cleanliness is satisfied. After the relocation, the component mounting processing is re-engaged. Therefore, the high reliability and quality of the manufactured board 1 can be maintained.On the component mounting machine 21 according to the present embodiment, as the cleanliness monitoring sensor 42, a particle counter for measuring the number and size of dusts in the apparatus is used. The particle counter can be easily set up at a desired location in the housing 12 because it is a relatively small device. By measuring the number and size of fine particles in air, cleanliness can be accurately measured.On the component mounting machine 21 according to the present embodiment, the cleanliness wash-over sensor 42 performs the measurement in the vicinity of the board 1 conveyed to the machining location P 1 by the board conveying path 25. More specifically, the cleanliness monitoring sensor 42 is disposed between the board conveyance path 25 and the component-accommodating component camera 41 disposed near the board conveyance path 25, and performs the measurement there. Therefore, the cleanliness of the air in the area where the component mounting operation is performed can be measured more accurately.In the above, Embodiment 1 is explained, but concrete configurations are not limited to Embodiment 1. In Embodiment 1, the board processing machine is the component mounting machine 21 for mounting the component 2 on the board 1, and the movable part as the object whose operation speed is to be controlled depending on cleanliness is the XY robot 24. The invention is not limited to this constitution. In another embodiment, as the movable part, as the object whose operation speed is to be controlled, another structure other than the XY robot 24 (e.g., replacement robot, board conveyor 25, etc.) may be added.In Embodiment 1, the board processing machine as the object whose operation speed is to be controlled depending on cleanliness is the component mounting machine 21. In another embodiment, for example, another board processing machine other than the component mounting machine 21 (e.g., printing machine, vision inspection machine, etc.) may serve as the object whose operation speed is to be controlled depending on cleanliness. When the board processing machine is a printing machine, the operation speed of its movable part (XY robot for driving the printing head or the squeegee) can be controlled depending on the cleanliness. When the board processing machine is a vision inspection machine, the operation speed of its movable part (XY robot for driving the camera) can be controlled depending on the cleanliness.In Embodiment 1, the particle counter is used as the cleanliness monitoring sensor 42 for detecting cleanliness in the apparatus. However, the invention is not limited to this constitution. In another embodiment, for example, a cleanliness monitoring sensor of a type other than the particle counter may be used.In Embodiment 1, the cleanliness monitoring sensor 42 is mounted between the board conveyance path 25 and the component camera 41. However, the invention is not limited to this constitution. In another embodiment, the cleanliness monitoring sensor 42 may be provided, for example, at a position other than between the board conveyance path 25 and the component camera 41. In addition, each component mounting machine 21 is equipped with one cleanliness monitoring sensor 42, but may be equipped with a plurality of cleanliness monitoring sensors 42.In Embodiment 1, a plurality of component mounting machines 21 are each equipped with a cleanliness monitoring sensor 42. However, the invention is not limited to this constitution. In a further exemplary embodiment, a plurality of component mounting machines 21 can be equipped, for example, partially, i.e. not all, with a cleanliness monitoring sensor 42. For example, a single component mounting machine 21 (e.g., only the foremost component mounting machine 21) may be equipped with a cleanliness monitoring sensor 42. In this case, the operation speeds of the movable parts of the individual component mounting machines 21 can be controlled smoothly based on the measurement result of the cleanliness monitoring sensor 42. Further, the cleanliness monitoring sensor 42 may be provided on every other one of the plurality of component mounting machines 21. In this case, the operation speeds of the movable parts of two adjacent component mounting machines 21 can be controlled smoothly based on the measurement result of the cleanliness monitoring sensor 42.In the above, concrete examples of the present invention are explained in detail. These are merely examples and therefore do not limit the claims. The technique according to the claims also includes various variations of the concrete examples illustrated above. The technical elements explained in the present specification or the drawings prove the technical utility individually or through various combinations, and are not limited to the combinations according to the original claims in the application. The technique illustrated in the present specification or the drawings can achieve multiple purposes simultaneously and achieves technical utility by achieving one of the purposes itself.LIST OF REFERENCE CHARACTERS1 Board 2 Component 21 Component mounting machine as a board processing machine 23 Component mounting head 24 XY robot as a movable part 25 Board conveyance path as a board conveyance part 31 Control device as a control part 41 Component camera 42 Cleanliness monitoring sensor C 1 First reference value C 2 Second reference value P 1 Processing location

Claims

A board processing machine comprising a board conveying part for conveying a board into a processing site in an apparatus and conveying the board out of the processing site after completion of processing, a cleanliness monitoring sensor for detecting cleanliness in the apparatus, a movable part for performing predetermined processing for the board located at the processing site, and a control part that controls the operation of the movable part such that the operation speed of the movable part is changed according to the detection result of the cleanliness monitoring sensor.The board processing machine according to claim 1, wherein the control part is configured to restrict the operation speed of the movable part according to the decrease in cleanliness.The board processing machine according to claim 2, wherein the control part is configured to store a predetermined reference value for cleanliness, and besides, in the case where the lowered cleanliness falls below the reference value, the apparatus stops.The board processing machine according to any one of claims 1 to 3, which is a component mounting machine for mounting components on the board, wherein the movable part is an XY robot having a component mounting head.The board processing machine according to any one of claims 1 to 3, wherein the cleanliness monitoring sensor is a particle counter for measuring the number and size of dusts in the apparatus.The board processing machine according to claim 5, wherein the cleanliness monitoring sensor performs the measurement in the vicinity of the board conveyed to the processing location by the board conveying part.The board processing machine according to claim 6, wherein a component camera that captures an image of the component is further mounted in the vicinity of the board conveyance part, the cleanliness monitoring sensor being mounted between the board conveyance part and the component camera.

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