Component assembly system

Abstract

A component mounting system is used to mount an electronic component on a printed circuit board. The component mounting system includes a component mounter provided with a feeder holding section, a component feeder detachably held by the feeder holding section and configured to feed the electronic component to the component mounter, an adhesive supply device detachably held by the feeder holding section and configured to supply an adhesive to the component mounter, an application state checking device detachably held by the feeder holding section and comprising a film to which the adhesive supplied by the adhesive supply device can be applied, and configured to check an application state of the adhesive supplied by the adhesive supply device based on a state of the adhesive applied to the film, a storage device,which is configured to accommodate the component feeder, the adhesive feeder, and the application state checking device, and a moving device configured to move the component feeder between the storage and the feeder holding section, and configured to make the adhesive feeder and the application state checking device movable between the storage and the feeder holding section.

Description

Technical area

[0001] A technique disclosed in the present specification relates to a component mounting system for mounting an electronic component on a printed circuit board. State of the art

[0002] In a component mounter for mounting an electronic component on a printed circuit board, an adhesive may be applied to the printed circuit board to mount the electronic component. For example, JP-A-H9-75830 discloses a component mounter including an adhesive supply device that supplies an adhesive. When the adhesive is applied to the printed circuit board by the device, the adhesive may not be properly applied to the printed circuit board, for example, if the applied amount of adhesive is insufficient. Therefore, before applying the adhesive to the printed circuit board, a test application is performed in which the adhesive is test-applied to a location other than the printed circuit board. The component mounter disclosed in JP-A-H9-75830 is equipped with an application state checking device including a test application film of the adhesive supply device.Before applying the adhesive to a printed circuit board, the adhesive is test-applied to the film of the device to check the application condition. By checking the condition of the test-applied adhesive on the film, it is confirmed whether the adhesive is being fed properly by the adhesive feeder. Summary of the inventionTechnical problem

[0003] Depending on the production schedule, the type of printed circuit board to be manufactured may change, and accordingly, the type of adhesive applied to the printed circuit board may also differ. As a result, it may be necessary to replace the adhesive with a different type before starting production with the component mounter. When the remaining amount of adhesive in the adhesive supply device becomes insufficient, the adhesive supply device must be replaced. Similarly, in the application condition checking device, if there is no part of the sheet on which test application can be performed, it is also necessary to replace the application condition checking device. However, in the component mounter disclosed in JP-A-H9-75830, the adhesive supply device and the application condition checking device are installed in the component mounter by a worker.For this reason, when the adhesive feeding device or the application status checking device needs to be replaced, the assembly process of the component assembler will be stopped until the replacement work is completed by the worker, resulting in a decrease in productivity and an increase in labor costs.

[0004] The present specification discloses a technique for efficiently replacing or installing an adhesive supplying device or a device for checking an application state of the adhesive. Solution to the problem

[0005] A component mounting system disclosed in the present description is used for mounting an electronic component on a printed circuit board. The component mounting system comprises a component mounter provided with a feeder holding section, a component feeder detachably held by the feeder holding section and configured to feed the electronic component to the component mounter, an adhesive supply device detachably held by the feeder holding section and configured to supply an adhesive to the component mounter, an application state checking device detachably held by the feeder holding section and comprising a film to which the adhesive supplied by the adhesive supply device can be applied, and configured toto check an application state of the adhesive supplied by the adhesive supply device based on a state of the adhesive applied to the film, a storage configured to accommodate the component feeder, the adhesive supply device, and the application state checking device, and a moving device configured to move the component feeder between the storage and the feeder holding section, and configured to make the adhesive supply device and the application state checking device movable between the storage and the feeder holding section.

[0006] The component feeder, adhesive feeder, and application status checker are installed in the feeder holding section and can be further moved by the moving device. This allows the adhesive feeder and application status checker to be moved by the moving device that moves the component feeder, and the adhesive feeder and application status checker can be automatically installed in the component mounter. Therefore, the replacement of the adhesive feeder and application status checker by the worker is eliminated, thus improving productivity. Short description of the characters Fig. 1 is a view showing a schematic configuration of a component mounting system according to an example. Fig. is a view showing a schematic configuration of a component mounter. Fig. 3 is a cross-sectional view along the line III-III of Fig. 2. Fig. is a block diagram showing a control system of the component mounter. Fig. is a view showing a schematic configuration of a component feeder. Fig. 6 is a view showing a schematic configuration of an adhesive supply device. Fig. 7 is a view showing a schematic configuration of an application state checking device. Description of the embodiments

[0007] The main features of an example described below are listed. The technical elements described below are independent technical elements or have a technical benefit alone or in various combinations and are not limited to the combinations disclosed in the claims as originally filed.

[0008] In the component mounting system disclosed in the present specification, the component feeder may store first identification information that identifies the component feeder. The adhesive supply device may store second identification information that identifies the adhesive supply device. The application state checking device may store third identification information that identifies the application state checking device.The component mounter may include a detecting section that communicates with the component feeder, the adhesive feeder, and the application state checking device held by the feeder holding section and determines the first identification information, the second identification information, and the third identification information of each of the component feeder, the adhesive feeder, and the application state checking device, and an identifying section configured to identify the component feeder, the adhesive feeder, and the application state checking device held by the feeder holding section based on the first identification information, the second identification, and the third identification information detected by the detecting section.With such a configuration, when the component feeder, adhesive feeder, or application status checking device is installed in the feeder holding section, it is possible to identify which of the component feeder, adhesive feeder, and application status checking device is installed in the feeder holding section. The type of component feeder or adhesive feeder can also be recognized from the identification information.

[0009] The component mounting system disclosed in the present specification may further include a management device that manages the component mounter and the moving device. The adhesive supply device may include a residual amount measuring section configured to measure the residual amount of adhesive in the adhesive supply device. The component mounter may include a communication section configured to transmit information about the residual amount of adhesive measured by the residual amount measuring section of the adhesive supply device held by the feeder holding section to the management device.The management device can move the adhesive supply device from the supply holding section to the storage through the moving device when the remaining amount of adhesive of the adhesive supply device held by the supply holding section is less than a predetermined amount, and can move another adhesive supply device housed in the storage to the supply holding section. With such a configuration, the device can be automatically replaced when the remaining amount of adhesive in the device held by the supply holding section decreases.

[0010] The component mounting system disclosed in the present specification may further include a management device that manages the component mounter and the moving device. The application state checking device may include a winding section configured to wind a film and a winding amount measuring section configured to measure the winding amount of the film wound by the winding section. The component mounter may include a communication section that transmits information about the winding amount of the sheet measured by the winding amount measuring section of the application state checking device held by the feeder holding section to the management device.The management device can move the application state checking device from the feeder holding section to the storage through the moving device when the winding amount of the film of the application state checking device held by the feeder holding section is greater than a predetermined amount, and can move another application state checking device housed in the storage to the feeder holding section. With such a configuration, the application state checking device can be automatically replaced when the film that can be used by the application state checking device held by the feeder holding section decreases.

[0011] In the component mounting system disclosed in the present specification, the feeder holding section can be configured to accommodate multiple adhesive feeders. With such a configuration, installing multiple adhesive feeders in the feeder holding section can reduce the time required to interrupt the assembly process to replace the adhesive feeder. Furthermore, multiple adhesive feeders that supply different types of adhesive can be installed simultaneously. Example

[0012] The component mounting system 1 of an example will be described with reference to the figures. As in Fig. 1, the component mounting system 1 includes a plurality of component mounters 10, a management device 8, a component feeder 30, a loader 50, a warehouse 54, an adhesive supply device 60, and an application state checking device 80.

[0013] As in Fig. 1, each component mounter 10 is communicatively connected to the management device 8. The management device 8 is communicatively connected to a plurality of component mounters 10 and the loader 50, and manages a plurality of component mounters 10 and the loader 50. The management device 8 and the plurality of component mounters 10 constitute a component assembly line 100. The management device 8 is equipped with a computer having a CPU and a storage device. The management device 8 controls the entire component assembly line 100 by controlling the operation of each component mounter 10. That is, the management device 8 determines, for each of a plurality of component mounters 10, the type, position, and the like of electronic components 4 to be mounted on a circuit board 2 by the component mounter 10, and gives an instruction thereof to the component mounter 10.When the component mounter 10 operates based on the instruction of the management device 8, the electronic components 4 required for the circuit board 2 are mounted on the circuit board 2.

[0014] The component mounter 10 mounts electronic components 4 on the printed circuit board 2. The component mounter 10 is also referred to as a surface mount machine or chip mounter. The printed circuit board 2 is transported from a first end of the component assembly line 100 to a second end. In each component mounter 10, predetermined electronic components 4 are mounted on the printed circuit board 2. The printed circuit board 2 transported to the second end of the component assembly line 100 is shipped as a finished product or further processed as a semi-finished product in a later step.

[0015] As in Fig. 2 to Fig. 4, the component mounter 10 includes a feeder holding section 14, a head 16, an imaging device 20, a moving device 18 that moves the head 16 and the imaging device 20, a circuit board conveyor 22, an operation panel 24, a communication section 28, and a control device 26.

[0016] The feeder holding section 14 includes a plurality of slots, and the component feeder 30 can be removably installed in each of the plurality of slots. The feeder holding section 14 can be attached to the component mounter 10 or detachable from the component mounter 10. As shown in Fig. 3, the feeder holding section 14 comprises a connection 15. In Fig. 3 shows a state where the component feeder 30 (and the adhesive supply device 60 and the application state checking device 80 described later) are not installed in the slot on the highest X-direction side. The connector 15 is arranged at a position that connects to the connector 40 (described later) of the component feeder 30 when the component feeder 30 is installed in the feeder holding section 14. Furthermore, the adhesive supply device 60 and the application state checking device 80 can be detachably installed in the feeder holding section 14. The component feeder 30, the adhesive supply device 60, and the application state checking device 80 will be described in detail later.

[0017] The head 16 is detachably attached to a movable base 18a (described later) of the moving device 18. The head 16 includes one or more nozzles 6 that receive the electronic components 4. The nozzle 6 is detachably attached to the head 16. The head 16 is capable of moving the nozzle 6 in a Z direction (here, the vertical direction) and moves the nozzle 6 toward and away from the component feeder 30 installed in the feeder holding section 14 or on the circuit board 2. The head 16 can receive electronic components 4 fed from the component feeder 30 with the nozzle 6 and mount the electronic components 4 received by the nozzle 6 on the circuit board 2. Different types of heads 16 can be attached to the movable base 18a depending on the type of electronic component 4. The head 16, to which a bonding tool 66 described later can be attached, can also be attached to the movable base 18a.

[0018] The imaging device 20 is attached to the movable base 18a (described later) and moves together with the movable base 18a. The imaging device 20 includes a camera and a light source. The camera is arranged so that its imaging direction is downward and captures images of an upper surface of the circuit board 2 and an upper surface of a film 84 (described later) provided in the application state inspection device 80. A CCD camera, for example, is used as the camera. The light source includes LEDs and illuminates the upper surface of the circuit board 2 and the upper surface of the film 84. The image data of an image captured by the imaging device 20 is stored in a memory (not shown) of the control device 26.

[0019] The moving device 18 moves the head 16 and the imaging device 20 between the component feeder 30 and the circuit board 2. The moving device 18 of the present example is an XY robot that moves the movable base 18a in the X direction and in the Y direction perpendicular to the X direction on the horizontal plane. The moving device 18 includes a guide rail that guides the movable base 18a, a moving mechanism that moves the movable base 18a along the guide rail, a motor that drives the moving mechanism, and the like. The moving device 18 is arranged above the component feeder 30 and the circuit board 2. The head 16 and the imaging device 20 are fixed to the movable base 18a.The head 16 and the imaging device 20 move over the component feeder 30, the adhesive feeder 60, or the application state checking device 80 installed in the feeder holding section 14, and over the printed circuit board 2 by means of the moving device 18.

[0020] The printed circuit board conveyor 22 transports the printed circuit board 2 in the X direction. The printed circuit board conveyor 22 of the present example includes, for example, a pair of conveyor belts, a device attached to the conveyor belts that supports the printed circuit board 2 from below, and a drive device that drives the conveyor belts. The printed circuit board conveyor 22 receives the printed circuit board 2 from a printed circuit board processing machine near a first side, conveys the printed circuit board 2 into the component mounter 10, and positions the printed circuit board 2 in a component mounting position. When the mounting of the electronic components 4 on the printed circuit board 2 is completed, the printed circuit board conveyor 22 transports the printed circuit board 2 out of the component mounter 10 and delivers the printed circuit board 2 to an adjacent printed circuit board processing machine on a second side.

[0021] The control device 26 is equipped with a computer with a CPU and a storage device. The control device 26 controls the operation of the individual sections of the component mounter 10 based on a production program transmitted from the management device 8. As shown in Fig. 4, the control device 26 is connected to the head 16, the moving device 18, the imaging device 20, the printed circuit board conveyor 22, the operation panel 24, and the communication section 28, and controls each section of the head 16, the moving device 18, the imaging device 20, the printed circuit board conveyor 22, the operation panel 24, and the communication section 28. The control device 26 receives information from the component feeder 30, the adhesive supply device 60, and the application state checking device 80 installed in the feeder holding section 14 via the connector 15. The information acquired from the component feeder 30 includes, for example, identification information (described later) for identifying the component feeder 30 and information on a remaining amount of electronic components 4.The information acquired by the adhesive supply device 60 includes, for example, identification information (described later) for identifying the adhesive supply device 60 and information about the remaining amount of adhesive in a gluing tool 66 (described later). The information acquired by the application state checking device 80 includes, for example, identification information (described later) for identifying the application state checking device 80 and information about the winding amount of the film 84 (described later).

[0022] The control panel 24 is a display device that provides a worker with various information about the component mounter 10, and an input device that receives instructions or information from the worker.

[0023] The communication section 28 sends and receives information to and from the management device 8. Specifically, the communication section 28 receives information about the production program from the management device 8. The communication section 28 transmits information about the component feeder 30, the adhesive feeder 60, and the application state checking device 80 installed in the feeder holding section 14 to the management device 8. The information about the component feeder 30 is, for example, the identification information of the component feeder 30 and the remaining amount of electronic components 4 accommodated in the component feeder 30.The information about the adhesive supply device 60 is, for example, the identification information of the adhesive supply device 60 and the remaining amount of the adhesive in a bonding tool 66 (described later) installed in the adhesive supply device 60. The information about the application state checking device 80 is, for example, the identification information of the application state checking device 80 and the wound amount of the film 84 (described later) installed in the application state checking device 80.

[0024] The component feeder 30 is detachably installed in the feeder holding section 14 and feeds electronic components 4 to the component mounter 10 (in particular, the nozzle 6). As shown in Fig. 5, the component feeder 30 includes a main body 32, a reel 34 detachably attached to the main body 32, a tape feed mechanism 38, a terminal 40, and a control device 42.

[0025] A long tape 36 is wound on the spool 34, which holds a plurality of electronic components 4 at regular intervals. The tape feed mechanism 38 feeds a certain amount of the tape 36, which holds electronic components 4, from the spool 34. The amount of tape 36 fed by the tape feed mechanism 38 is adjusted according to the spacing between the electronic components 4 housed in the tape 36. The electronic components 4 on the fed-out tape 36 are picked up by the head 16 at the component pick-up position 44. The spool 34 is interchangeable with respect to the main body 32 of the component feeder 30.

[0026] The terminal 40 is arranged on a side surface on the +Y direction side of the component feeder 30 (that is, a side surface located on the PCB conveyor 22 side when the component feeder 30 is installed in the feeder holding section 14). When the component feeder 30 is installed in the feeder holding section 14, the terminal 40 is connected to the terminal 15 of the feeder holding section 14.

[0027] The control device 42 controls each section of the component feeder 30. The memory (not shown) of the control device 42 stores identification information that identifies the component feeder 30. The identification information includes information about the reels 34 installed in the component feeder 30, the types of electronic components 4 housed in the reels 34, and the like.

[0028] In the present example, the component feeder 30 is a belt-type component feeder, but it is not limited to this configuration. For example, the component feeder may be a tray feeder that receives multiple electronic components 4 on a tray, or a bulk component feeder that randomly receives multiple electronic components 4 in a bin.

[0029] As in Fig. 1, the loader 50 is a device for automatically attaching and detaching the component feeder 30 to the feeder holding section 14. The loader 50 is configured to detach and retrieve the component feeder 30, which is a replacement target, from the feeder holding section 14 and to attach the component feeder 30 to be used in production to the feeder holding section 14. Each component mounter 10 constituting the component assembly line 100 is arranged along one direction, and the loader 50 is configured to move with respect to each slot of the feeder holding section 14 of each component mounter 10 by means of a guide rail 52 extending along the one direction (X direction in Fig. 3). The loader 50 moves between the feeder holding section 14 of each component mounter 10 and the warehouse 54 along the guide rail 52. The loader 50 moves the adhesive supply device 60 and the application state checking device 80 between the holding section 14 of each component mounter 10 and the warehouse 54, and attaches and detaches the adhesive supply device 60 and the application state checking device 80 to and from the feeder holding section 14. The loader 50 is configured to communicate with the management device 8.

[0030] The warehouse 54 is located further upstream of the component mounter 10, which is located furthest upstream of the component assembly line 100. A plurality of component feeders 30 can be housed in the warehouse 54. Specifically, the warehouse 54 accommodates both component feeders 30 that are not used in the assembly process and component feeders 30 that have been used in the assembly process. The guide rail 52 is attached to the front of the warehouse 54. That is, the guide rail 52 is attached to the front of the warehouse 54 and to a plurality of component mounters 10. The loader 50 moves the component feeder 30 housed in the warehouse 54 to each slot of the feeder holding section 14 of each component mounter 10 and moves the component feeder 30 from each slot of the feeder holding section 14 of each component mounter 10 to the warehouse 54.In addition to the component feeder 30, the warehouse 54 also contains the adhesive feed device 60 and the device for checking the application status 80.

[0031] The adhesive supply device 60 is detachably installed in the feeder holding section 14 and supplies an adhesive to the component mounter 10. As shown in Fig. 6, the adhesive supply device 60 includes a main body 62, a pocket 64 disposed in the main body 62, an adhesive tool 66, a heater 68, a connector 70, and a controller 72.

[0032] The main body 62 has a shape that can be installed in the feeder holding section 14. That is, the main body 62 has a shape that follows the slot of the feeder holding section 14. The X-direction dimension of the main body 62 is larger than the X-direction dimension of the component feeder 30. Therefore, the adhesive feeder 60 is installed via a plurality of slots (two slots in this example) of the feeder holding section 14.

[0033] The pocket 64 is located on the top surface of the main body 62 on the +Y direction side. The pocket 64 has a shape that can accommodate the adhesive tool 66. The adhesive tool 66 is housed in the pocket 64. An adhesive (e.g., glue) is housed in the adhesive tool 66. The adhesive tool 66 is mounted on the head 16, which is configured to accommodate the adhesive tool 66, and moves between the adhesive supply device 60 and the circuit board 2 by the moving device 18 while mounted on the head 16. The adhesive tool 66 is used to apply the adhesive to the circuit board 2. When the adhesive tool 66 is mounted on the head 16, pressure is applied to the adhesive in the adhesive tool 66 by a pressure applying device (not shown), causing the adhesive to eject from the tip end of the adhesive tool 66.

[0034] The heater 68 is arranged around the pocket 64. The heater 68 regulates the temperature of the adhesive tool 66 housed in the pocket 64. In order to apply the adhesive to the circuit board 2 in a stable state, it is necessary to set the adhesive to a predetermined temperature that is higher than room temperature. By arranging the heater 68 near the pocket 64, the temperature of the adhesive contained in the adhesive tool 66 can be appropriately adjusted while the adhesive tool 66 is housed in the pocket 64.

[0035] The terminal 70 is arranged on a side surface on the +Y direction side of the adhesive feeder 60 (that is, a side surface located on the circuit board conveyor 22 side when the adhesive feeder 60 is installed in the feeder holding section 14). When the adhesive feeder 60 is installed in the feeder holding section 14, the terminal 70 is connected to the connector 15 of the feeder holding section 14.

[0036] The control device 72 controls each section of the adhesive supply device 60. The memory (not shown) of the control device 72 stores identification information that identifies the adhesive supply device 60. The identification data includes information about the type of adhesive contained in the adhesive supply device 60. Furthermore, the control device 72 calculates the remaining amount of adhesive in the adhesive tool 66. Specifically, the control device 72 calculates the remaining amount of adhesive based on the amount of adhesive applied per application from the adhesive tool 66 and the number of times the adhesive is used. The calculated remaining amount of adhesive is stored in the memory of the control device 72. In the present example, the control device 72 calculates the remaining amount of adhesive, but the configuration is not limited thereto.For example, the adhesive supply device may include a mass measuring device that measures the mass of the adhesive in the gluing tool 66, and the control device 72 may store the mass of the adhesive detected by the mass measuring device as the remaining amount of the adhesive in the memory.

[0037] The application state checking device 80 serves to check the proper application of the adhesive (ie, the application state of the adhesive) from the adhesive tool 66 accommodated in the adhesive feed device 60. The application state checking device 80 is removably installed in the feeder holding section 14. As shown in Fig. 7, the application state checking device 80 includes the main body 82, the film 84, a feeding section 86 that feeds the film 84, a winding section 88 that winds the film 84, a motor 89, a connector 90, and the control device 92.

[0038] Similar to the main body 62 of the adhesive feeder 60, the main body 82 has a shape that can be installed in the feeder holding section 14. The X-direction dimension of the main body 82 is larger than the X-direction dimension of the component feeder 30. Therefore, the application condition checking device 80 is installed via a plurality of slots (two slots in this example) of the feeder holding section 14.

[0039] The film 84 is used for applying the adhesive with the adhesive tool 66 accommodated in the adhesive feed device 60 on a test basis (i.e., for a test application of adhesive). The film 84 is fed from the feed section 86, exposed to the outside of the main body 82 at a test application position 85, and wound onto the winding section 88. The feed section 86 and the winding section 88 are rotatably supported on the main body 82. The motor 89 is connected to the winding section 88, and the winding section 88 rotates in the direction in which the film 84 is wound by the motor 89 (in Fig. 7 clockwise). As the winding section 88 rotates and winds up the film 84, the film 84 is pulled, causing the feed section 86 to also rotate.

[0040] The connector 90 is arranged on a side surface on the +Y direction side of the application state checking device 80 (that is, a side surface located on the board conveyor 22 side when the application state checking device 80 is installed in the feeder holding section 14). When the application state checking device 80 is installed in the feeder holding section 14, the connector 90 is connected to the connector 15 of the feeder holding section 14.

[0041] The control device 92 controls each section of the application state checking device 80. The memory (not shown) of the control device 92 stores identification information that identifies the application state checking device 80. The control device 92 calculates the winding amount of the film 84 wound on the winding section 88. Specifically, the winding amount of the film 84 is calculated from the drive amount of the motor 89 connected to the winding section 88. The calculated winding amount of the film 84 is stored in the memory of the control device 92.

[0042] Here, a process for checking the application state of the adhesive using the application state checking device 80 will be described. The process for checking the application state of the adhesive is performed in a state where the adhesive supply device 60 and the application state checking device 80 are installed in the supply holding section 14. The process for checking the application state of the adhesive is performed before the adhesive is applied to the circuit board 2.

[0043] First, the control device 26 of the component mounter 10 attaches the adhesive tool 66 housed in the adhesive supply device 60 to the head 16. Next, the control device 26 moves the adhesive tool 66 over the test application position 85 and applies the adhesive in the adhesive tool 66 to the film 84 exposed at the test application position 85. Next, the control device 26 moves the imaging device 20 over the test application position 85 and images the test application position 85 from above. Next, the control device 26 determines whether the size or shape of the applied adhesive is within a predetermined range based on the captured image. Next, the control device 26 transmits the information that the test application is complete to the application status checking device 80 via the terminals 15 and 90.

[0044] When the control device 92 of the application state checking device 80 receives information from the control device 26 that the test application is completed, the control device 92 drives the motor 89 by a predetermined amount and winds the film 84 onto the winding section 88. Then, the film 84, to which the adhesive has been applied by the test application, moves from the test application position 85 to the winding section 88 side, and at the test application position 85, the film 84 is exposed without the adhesive applied.

[0045] In the present example, the loader 50 moves the component feeder 30 between the warehouse 54 and each component mounter 10. When production is started on the component assembly line 100, the management device 8 moves the component feeder 30 required for each component mounter 10 through the feeder 50 in accordance with the production program. As described above, the loader 50 may also move the adhesive feeder 60 and the application status checker 80. Depending on the production program, an adhesive may be applied to the circuit board 2. Several different types of adhesives may be applied to the circuit board 2. When production is started on the assembly line 100, the management device 8 moves the adhesive feeder 60 required for each component mounter 10 through the loader 50 in accordance with the production program.In addition, an application condition check device 80 must be installed in the component mounter 10 in which the adhesive feeder 60 is installed to test the application. Before production begins on the component assembly line 100, the management device 8 moves the corresponding types of the component feeder 30, the adhesive feeder 60, and the application condition check device 80 between the warehouse 54 and each component mounter 10 using the loader 50, so that the component feeder 30, the adhesive feeder 60, and the application condition check device 80 required for each component mounter 10 are installed in each component mounter 10.

[0046] At this time, the management device 8, as shown in Fig. 3, cause multiple adhesive feeders 60 to be installed in a component mounter 10 as needed. For example, different types of adhesive feeders 60 can be installed in a component mounter 10, or two or more of the same type of adhesive feeders 60 can be installed in a component mounter 10. In this case, too, the adhesive feeder 60 is moved to the component mounter 10 by the loader 50. In the present example, the adhesive feeder 60 can be installed in the feeder holding section 14. Thus, two or more adhesive feeders 60 can be installed in a component mounter 10. Fig.3, two adhesive feeders 60 are installed in the feeder holding section 14, but the number of adhesive feeders 60 installed in the feeder holding section 14 is not particularly limited. The number of adhesive feeders 60 installed in the feeder holding section 14 may be one, three, or more. Since multiple adhesive feeders 60 can be installed in one component mounter 10, it is possible to establish a flexible production schedule in the component assembly line 100. Two or more application status checking devices 80 may be installed in one component mounter 10.

[0047] When the component feeder 30, the adhesive feeder 60, and the application state checking device 80 are installed in the feeder holding section 14 of the component mounter 10, identification information of the component feeder 30, the adhesive feeder 60, and the application state checking device 80 installed in the feeder holding section 14 is output to the control device 26 of the component mounter 10 via the terminals 15, 40, 70, and 90. The control device 26 identifies which device has been installed in each slot of the feeder holding section 14 based on the acquired identification information.For example, when the component feeder 30 is installed in the feeder holding section 14, the control device 26 recognizes that the device installed in the feeder holding section 14 is the component feeder 30 based on the acquired identification information and indicates the type of the electronic component 4 housed in the component feeder 30. When the adhesive supply device 60 is installed in the feeder holding section 14, the control device 26 recognizes that the device installed in the feeder holding section 14 is the adhesive supply device 60 based on the acquired identification information and indicates the type of adhesive contained in the adhesive supply device 60.If an application state checking device 80 is installed in the feeder holding section 14, the control device 26 indicates, based on the acquired identification information, that the device installed in the feeder holding section 14 is the application state checking device 80.

[0048] During the execution of the mounting process, the component mounter 10, in which the adhesive supply device 60 and the application state checking device 80 are installed, acquires information on the remaining amount of adhesive from the adhesive supply device 60 and information on the winding amount of the film 84 from the application state checking device 80. When the component mounter 10 acquires the information on the remaining amount of adhesive and the information on the winding amount of the film 84, the component mounter 10 transmits the acquired information to the management device 8 via the communication section 28. Accordingly, the management device 8 can acquire the remaining amount of adhesive in the adhesive supply device 60 and the remaining amount of the usable film 84 in the application state checking device 80 installed in each component mounter 10.

[0049] The management device 8 causes the loader 50 to replace the adhesive supply device 60 and the application state checking device 80 based on information on the remaining amount of adhesive and information on the wound amount of the film 84 acquired from each component mounter. Specifically, when the management device 8 determines that the remaining amount of adhesive is less than a predetermined amount based on the acquired information on the remaining amount of adhesive, the management device 8 moves the adhesive supply device 60, including the adhesive tool 66, in which the remaining amount of adhesive is less than the predetermined amount, from the feeder holding section 14 to the warehouse 54 through the loader 50.Then, the management device 8 moves the adhesive supply device 60 including the adhesive tool 66, in which the adhesive is sufficiently contained, from the warehouse 54 to the feeder holding section 14 through the loader 50. Similarly, when the management device 8 determines that the remaining amount of the usable film 84 is less than a predetermined amount based on the acquired information on the wound amount of the film 84, the management device 8 moves the application state checking device 80, in which the remaining amount of the film 84 is less than the predetermined amount, from the feeder holding section 14 through the loader 50, and moves the application state checking device 80, in which a sufficient amount of the usable film 84 is accommodated, from the warehouse 54 to the feeder holding section 14 through the loader 50.As described above, in the present example, not only the component feeder 30 but also the adhesive feeder 60 and the application state checking device 80 can be moved between the feeder holding section 14 and the warehouse 54 with the loader 50. Therefore, it is possible to automatically replace the adhesive feeder 60 and the application state checking device 80 installed in the component mounter 10. Since the adhesive feeder 60 and the application state checking device 80 are movable by means of the loader 50 that moves the component feeder 30, the adhesive feeder 60 and the application state checking device 80 can be automatically replaced without requiring any special configuration for replacing the adhesive feeder 60 or the application state checking device 80.

[0050] The following describes some features of the component mounting system 1 of the example. Terminal 15 of the example is an example of a "determination section," control device 26 is an example of an "identification section," component feeder 30 is an example of a "component feeding device," loader 50 is an example of a "moving device," control device 72 is an example of a "remaining amount measuring section," and control device 92 is an example of a "winding amount measuring section."

[0051] Although specific examples of the technology disclosed in the present specification have been described in detail above, the specific examples are merely examples and are not intended to limit the scope of the claims. The technology claimed within the scope of the claims includes various modifications and changes made to the specific examples described above. Moreover, the technical elements described in the present specification or the figures have technical uses alone or in various combinations and are not limited to the combinations described in the claims as originally filed. Furthermore, the technology described in the present specification or the figures simultaneously fulfills multiple purposes and has technical uses by fulfilling even one of the multiple purposes.

[0052] The present specification also discloses a technical idea in which, in claim 4, "the component mounting system according to claim 2" is changed to "the component mounting system according to claim 2 or 3". QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP-A-H9-75830 [0002, 0003]

Claims

[1] A component mounting system for mounting an electronic component on a printed circuit board, the component mounting system comprising: a component mounter equipped with a feeder holding section; a component feeder detachably held by the feeder holding section and configured to feed the electronic component to the component mounter; an adhesive supply device detachably held by the supply holding portion and configured to supply an adhesive to the component mounter; an application state checking device detachably held by the feeder holding portion and comprising a film to which the adhesive supplied from the adhesive supply device can be applied, and configured to check an application state of the adhesive supplied from the adhesive supply device based on a state of the adhesive applied to the film; a storage configured to accommodate the component feeder, the adhesive feeder, and the application status checking device; and a moving device configured to move the component feeder between the storage and the feeder holding section, and configured to make the adhesive supply device and the application state checking device movable between the storage and the feeder holding section. [2] The component mounting system according to claim 1, wherein the component feeder stores first identification information that identifies the component feeder, the adhesive supply device stores second identification information that identifies the adhesive supply device, the device for checking the application state stores a third identification information that identifies the device for checking the application state, and the component assembler includes a detection section that is connected to the component feeder, the adhesive supply device, and the application state checking device, each held by the feeder holding section, and detects the first identification information, the second identification information, and the third identification information from the component feeder, the adhesive supply device, and the application state checking device, respectively, and an identification section configured to identify the component feeder, the adhesive supply device, and the application state checking device held by the feeder holding section based on the first identification information, the second identification, and the third identification information detected by the detection section. [3] The component mounting system according to claim 2, further comprising: a management device configured to manage the component mounter and the movement device, wherein the adhesive supply device includes a residual amount measuring section configured to measure a residual amount of the adhesive of the adhesive supply device, the component mounter has a communication section configured to transmit information about the remaining amount of the adhesive measured by the remaining amount measuring section of the adhesive supply device held by the feeder holding section to the management device, and the managing device moves the adhesive supply device from the feeder holding section to the storage by the moving device when the remaining amount of the adhesive of the adhesive supply device held by the feeder holding section is less than a predetermined amount, and moves another adhesive supply device housed in the storage to the feeder holding section. [4] The component mounting system according to claim 2, further comprising: a management device configured to manage the component mounter and the movement device, wherein the application state checking device comprises a winding section configured to wind the film, and a winding amount measuring section configured to measure a winding amount of the film wound by the winding section, the component mounter includes a communication section configured to transmit information about the winding amount of the film measured by the winding amount measuring section of the application state checking device held by the feeder holding section to the management device, and the managing device moves the application state checking device from the feeder holding section to the storage by the moving device when the winding amount of the film of the application state checking device held by the feeder holding section is greater than a predetermined amount, and moves another application state checking device housed in the storage to the feeder holding section. [5] The component mounting system according to any one of claims 1 to 4, wherein the feeder holding section is configured to accommodate a plurality of adhesive devices.

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