BASE

Abstract

Socket (1) comprising: a base (2) having a mounting area (21) on which an IC chip (9) is mounted, the base (2) carrying a plurality of contact elements (99) electrically connectable to the IC chip (9); an actuating element (3) vertically movable relative to the base (2) and shaped such that the IC chip (9) can be inserted onto the mounting area (21); a pivoting element (4) pivoting relative to the base (2) in accordance with vertical movement of the actuating element (3);and a pressing member (5) which moves in accordance with the pivoting of the pivoting member (4) between a contact position and a retracted position while keeping its position constant, wherein the pressing member (5) is in contact with an upper surface of the IC chip (9) mounted on the mounting area (21) in the contact position and the retracted position is oblique and upward away from the contact position in an outward direction of the socket.;

Description

TECHNICAL FIELD

[0001] The present invention relates to a socket, in particular a socket for testing an IC chip. STATE OF THE ART

[0002] A socket for testing an IC chip is intended to be downsized, in addition to securing the electrical connection between the IC chip and the socket. For example, Patent Literature 1 discloses an IC socket provided with a support member configured to position a pivot shaft of a pressure pad in a proximal position when the pressure pad is in a pressing position and to position the pivot shaft of the pressure pad in a distal position when the pressure pad is in a releasing position.

[0003] In addition, there are technical problems such as lateral deviation of the IC chip and possible damage to the IC chip (e.g., scratches on the surface of the IC chip) due to the physical contact between the IC chip and the socket when the IC chip is pressed down. For example, Patent Literature 2 discloses an IC test handler including a clamping device that can suppress a certain amount of lateral deviation of an IC during an IC clamping operation and prevent the occurrence of contact failures at the terminals, even for ICs with rear terminals arranged at a narrower terminal pitch. An IC pressing section always moves in an arcuate trajectory with the same posture due to a parallel connector mechanism, so that no oblique downward force is applied to the IC at the time of contact with the IC, thus suppressing lateral deviation of the IC.

[0004] Patent Literature 3 discloses a socket that protects the upper surface of a semiconductor device from contact scratches using a locking plate. The distal end of a locking element is prevented from coming into direct contact with a BGA by the locking plate, and the BGA is pressed downward in the vertical direction. PATENT LITERATURE PTL1: Published Japanese Patent Application No. 2004-325393 PTL 2: Published Japanese Patent Application No. 2004-184173 PTL 3: Published Japanese Patent Application No. 2009-140629 TECHNICAL PROBLEM

[0005] There is a technical problem of suppressing or avoiding damage to an IC chip due to contact with a pressure element while promoting the miniaturization of a socket to enable high-density mounting of sockets on a substrate. SOLUTION TO SOLVE THE PROBLEMS

[0006] A socket according to one aspect of the present disclosure may include: a base including a mounting area on which an IC chip is mounted, the base carrying a plurality of contact elements electrically connectable to the IC chip; an actuator that is vertically movable relative to the base and shaped to allow the IC chip to be inserted onto the mounting area; a pivoting member pivoting in accordance with vertical movement of the actuating member relative to the base; and a pressing member that moves between a contact position and a retracted position in accordance with the pivoting of the pivoting member while keeping its posture constant, wherein the pressing member is in contact with an upper surface of the IC chip mounted on the mounting area in the contact position and the retracted position is obliquely and upwardly away from the contact position in an outward direction of the socket.

[0007] In some embodiments, the pressure element is located above the pivot element in the retracted position.

[0008] In some embodiments, the pressure element in the retracted position is arranged in its entirety within a contour of the base.

[0009] In some embodiments, the constant position is a substantially horizontal position.

[0010] In some embodiments, the pressure element includes a metal heat dissipation element, the heat dissipation element having a bottom surface that contacts the top surface of the IC chip when the pressure element is in the contact position. The heat dissipation element may be mounted to the pressure element so as to be elastically movable in the vertical direction.

[0011] In some embodiments, the pressure element includes a contactable element capable of contacting the top surface of the IC chip, wherein the contactable element is elastically displaceable in the vertical direction.

[0012] In some embodiments, it further includes: at least one upper link coupling an upper end of the pressure member to the actuating member; and at least one lower link coupling a lower end of the pressure member to the actuating member and provided parallel to the upper link, wherein a parallel link is configured by the pressure member, the actuating member, the upper link, and the lower link. The lower link may include a connection to the pivot member at a position between a connection between the lower link and the pressure member and a connection between the lower link and the actuating member.The pivot member may include a lower end rotatably supported by the base, an upper end rotatably coupled to the lower link, and a protruding portion protruding in the outward direction of the base between the lower end and the upper end. A top dead center may be established based on interference between the pressing member and the upper link. A bottom dead center of the pressing member may be determined based on interference between the lower link and the base.

[0013] In some embodiments, the pressure element is biased by an elastic element at a free end of the pivot element toward a guide included in the base, and a position of the pressure element is kept constant based on the contact between the pressure element and the guide.

[0014] In some embodiments, the pressure element is swingably mounted on a free end of the pivoting element and includes a guide projection that engages a guide groove formed on the base. The guide groove is formed in an arc shape for maintaining a constant position of the pressure element. A bottom dead center of the pressure element can be determined based on an interference between the pressure element and the base.

[0015] A method for electrically connecting an IC chip to a socket according to one aspect of the present disclosure may include: a first step including lowering an operating member of the base, which is vertically movable relative to a base of the base, against an upward biasing force caused by an elastic member, wherein a pivot member pivots in an outward direction of the base upon lowering of the operating member, and the pressing member moves obliquely and upwardly away from the lower position in accordance with the pivoting movement of the pivot member from a lower position to an upper position, with its position remaining constant; and after the first step, a second step of mounting an IC chip via an opening formed in the actuator onto a mounting portion of the base.

[0016] A socket according to another aspect of the present disclosure may include: a base including a mounting area on which an IC chip is mounted, the base carrying a plurality of contact elements electrically connectable to the IC chip; an actuator that is vertically movable relative to the base and shaped to allow the IC chip to be inserted onto the mounting area; and a first and a second pressure element, each of which moves in accordance with a vertical movement of the actuating element between a first and a second position, its position remaining constant, the second position being obliquely and upwardly away from the first position in an outward direction of the socket, each pressure element in the first position being in contact with an upper surface of the IC chip mounted on the mounting area, wherein each of the first and second printing elements includes a heat dissipation element in which heat dissipation fins are arranged at a predetermined interval, and when the first and second pressure elements are in the first position, the heat dissipation fins of the first pressure element and the heat dissipation fins of the second pressure element are arranged alternately as viewed from one side of the base. TECHNICAL EFFECT

[0017] According to one aspect of the present invention, it can be made possible to suppress or avoid damage to an IC chip due to contact with a pressing member, while at the same time promoting downsizing of a socket to enable mounting of the sockets in high density on a substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view of a substrate for testing IC chips in which a large number of sockets are mounted in high density on the substrate according to one aspect of the disclosure; Fig. Figure 2 is a schematic perspective view of the base in a closed state; Fig. 3 is a schematic perspective view of the base in an open state; Fig. Figure 4 is a schematic side view of the base in the closed state; Fig. Figure 5 is a schematic side view of the base in the open state; Fig. Figure 6 is a schematic plan view of the base in the closed state; Fig. 7 is a schematic plan view of the base in the open state; Fig. Figure 8 is a schematic cross-sectional view of the base in the closed state, taken along alternating long and short lines CX1 in Fig. 6; Fig. Figure 9 is a schematic cross-sectional view of the base in the open state, taken along the alternating long and short lines CX1 in Fig. 7; Fig. 10 is a schematic representation of a pressure element moving obliquely upward in an outward direction of the socket from a contact position to a retracted position in a constant position in the socket; Fig. Figure 11 is a schematic cross-sectional view of the base in the open state, taken along alternating long and short lines CX2 in Fig. 7; Fig. 12 is a schematic top view illustrating a state in which the contact surfaces of the printing elements are superimposed on predetermined regions of an IC chip; Fig. Fig. 13 is a schematic top view illustrating a state in which the contact surfaces of the pressure element and the predetermined regions of the IC chip are superposed in a manner different from that shown in Fig. 12 illustrated manner; Fig. 14 is a schematic diagram illustrating that a stop position of the pressing member can be adjusted based on a collision between the pressing member and a base; Fig. 15 is a schematic cross-sectional view of another socket in the closed state; Fig. 16 is a schematic cross-sectional view of the other socket in the open state; Fig. Figure 17 is a schematic cross-sectional view of yet another base in the closed state; Fig. 18 is a schematic cross-sectional view of the still further base in the open state; Fig. 19 is a schematic diagram illustrating that interference occurs between the pressure member and a first link to adjust a top dead center of the pressure member; Fig. 20 is a schematic plan view of a base according to a modified example; and Fig. Figure 21 is a schematic cross-sectional view of the base taken along alternating long and short lines in Fig. 20. DETAILED DESCRIPTION OF THE INVENTION

[0018] Various embodiments and features are discussed below with reference to the drawings. Those skilled in the art would be able to combine the respective embodiments and / or features without the need for excessive descriptions and would appreciate the synergistic effects of such combinations. Overlapping descriptions between the embodiments are generally omitted. The drawings referred to are primarily for describing inventions and are simplified to facilitate preparation of the drawings. The respective features are to be understood as universal features that apply not only to the socket and the method for connecting it to an IC chip shown here, but also to other sockets and methods for connecting to an IC chip that are not shown in the present description.

[0019] As in Fig. 1, the sockets 1 are mounted two-dimensionally in high density on an upper surface of a test substrate 8. IC chips are mounted on the sockets 1 and connected to a test fixture via wiring of the test substrate 8. Input signals such as a clock signal and a test signal are supplied to the IC chip (via the test substrate 8 and the socket 1), so that output signals are obtained from the IC chips (via the socket 1 and the test substrate 8), and thus a test of the IC chip can be performed (e.g., determining whether an output signal pattern matches a correct signal pattern). A prerequisite for a correct functional test of the IC chips is that the electrical connection between the sockets 1 and the IC chips mounted on the sockets 1 is well established.It should be noted that the test substrate 8 includes an upper surface parallel to a plane defined by XY axes and perpendicularly intersected by a Z axis, and includes wirings (surface wirings and / or internal wirings) for electrical connection between the sockets 1 and the external test fixture.

[0020] In Fig. 1, the pedestals 1 are arranged at a predetermined pitch P1 in the X-axis direction and at a predetermined pitch P2 in the Y-axis direction. The predetermined pitch P1 and the predetermined pitch P2 are the same. Note that the pedestals 1 have a first lateral width parallel to the X-axis and a second lateral width parallel to the Y-axis. The first lateral width and the second lateral width are the same. If the first lateral width and the second lateral width of the pedestals 1 are different, the predetermined pitch P1 and the predetermined pitch P2 may also be different. As will be apparent from the following explanations, the pedestals 1 are designed for high-density arrangement on the test substrate 8. In short, the printing element explained below does not protrude beyond the contour of the pedestal 1 in the plan view of the pedestal 1.It should be noted that the contour of the base 1 may be defined by the contour of an actuating element, which is explained further below in the plan view of the base 1, but should not be limited thereto.

[0021] In the present specification, an “outward direction of the base” means a direction from an inner position of the base 1 to an outer position of the base 1 in the plan view of the base 1 as indicated by a Fig. 1, and is typically orthogonal to one side of a (e.g. rectangular) contour of the base 1. An inward direction of the base refers to a direction from the outer position of the base 1 to the inner position of the base 1 in the plan view of the base 1, as indicated by an arrow D1 shown in Fig. 1, and is typically orthogonal to one side of a (e.g. rectangular) contour of the base 1.

[0022] Fig. 2 is a schematic perspective view of the base 1 in a closed state. Fig. 3 is a schematic perspective view of the base 1 in an open state. Fig. 4 is a schematic side view of the base 1 in the closed state. Fig. Figure 5 is a schematic side view of the base 1 in the open state. Fig. Figure 6 is a schematic plan view of the base 1 in the closed state. Fig. 7 is a schematic plan view of the base 1 in the open state. Fig. Figure 8 is a schematic cross-sectional view of the base 1 in the closed state, taken along alternating long and short lines CX1 in Fig. 6. Fig. Figure 9 is a schematic cross-sectional view of the base 1 in the open state, taken along the alternating long and short lines CX1 in Fig. 7.

[0023] The base 1 includes a base 2, an actuating element 3, a pivoting element 4, and a pressing element 5. The base 2 is composed of one or a plurality of resin parts and is typically an assembly of a plurality of resin parts. Likewise, the actuating element 3 is composed of one or a plurality of resin parts and is provided so that it is capable of moving vertically relative to the base 2. When the actuating element 3 is pressed downward, the base 1 assumes the Fig. 3 as a deformed state. In the open state, an IC chip 9 can be mounted on the socket 1, and the IC chip 9 can be removed from the socket 1. Note that the transfer of the IC chip 9 may be performed using a suction tool or the like. The IC chip 9 is mounted on the socket 1 when the socket 1 is in the open state, and the socket 1 is then slid to the closed state so that the socket 1 and the IC chip 9 are electrically connected.

[0024] The base 2 includes a mounting area 21 on which the IC chip 9 is mounted, and a base wall 22 provided around the mounting area 21, which has a plurality of contact elements 99 (see Fig. 10 in addition to Fig. 8 and Fig. 9) that are electrically connectable to the IC chip 9 (e.g., lead terminals of the IC chip 9 and / or bumps formed on the lower surface of the IC chip 9). The mounting area 21 includes a mounting surface 21a on which the IC chip 9 is mounted. The mounting surface 21a is typically a flat surface orthogonal to the Z-axis. However, unevennesses may be formed on the mounting surface 21a, such as through-holes or slots for the contact elements 99 or recesses that correspond to the bumps on the lower surface of the IC chip 9.

[0025] The base wall 22 of the base 2 extends upward from the mounting surface 21a (or a plane containing the mounting surface 21a) of the mounting area 21, thus defining (at least partially) an arrangement space for the IC chip 9 above the mounting surface 21a. The inner wall surface of the base wall 22 can serve as a guide surface to guide the movement of the IC chip 9, which is conveyed onto the mounting surface 21a by a conveying device such as a suction cup. It should be noted that the base wall 22 can be provided partially or locally around the entire circumference of the mounting surface 21a, thereby avoiding interference with the pivoting element 4 described below. In an illustrated example, the base wall 22 includes four wall sections corresponding to the four sides defining the rectangular contour of the mounting surface 21a.A cutout or opening 23 is formed in each of the wall sections opposite each other in the Y-axis direction. The cutout or opening 23 has the same meaning as a space in which the base wall 22 is not formed. The pivot member 4 can pivot at a large pivot angle through the cutout or opening 23.

[0026] Each contact element 99 may be an arrangement of a pair of pin elements. Suitably, an interval between the paired pin elements (particularly between the upper tips of the paired pin elements) changes in accordance with a vertical movement of the actuator 3, whereby the pin elements can hold the bump of the IC chip 9 therebetween. When the actuator 3 is in an initial position (top dead center), the interval between the upper tip of one pin element and the upper tip of the other pin element is minimized. The interval between the upper tips of the pin elements increases as the actuator 3 descends. The interval between the upper tips of the pin elements is largest when the actuator 3 is in the lowest position (bottom dead center).Collision between the contact elements 99 and the protrusions on the lower surface of the IC chip 9 at the time of mounting the IC chip 9 is avoided by switching the contact elements 99 between the open and closed states. Note that a member that moves horizontally in accordance with the vertical movement of the actuator 3 can be used to cause the pin elements to switch between the open and closed states in accordance with the vertical movement of the actuator 3. Other configurations of contact elements can also be adopted. For example, a contact element configured not for contact with the protrusion of the IC chip 9 but with a lead terminal provided on the outer edge of the IC chip 9 can be used.

[0027] The number and arrangement of the contact elements 99 supported by the base 2 may vary depending on the number and positions of the protrusions of the IC chip 9 (or depending on the number and positions of the lead terminals). Typically, the contact elements 99 are arranged (e.g., linearly) along a side that defines the outer periphery of the mounting area 21 (or one side of the IC chip 9 mounted on the mounting area 21) in plan view. A number of other contact elements may also be adopted.

[0028] The actuator 3 is provided so that it is vertically movable relative to the base 2 and appropriately engages the base 2 so that it is slidable (can move linearly) in the vertical direction. For example, the base 2 or the actuator 3 is provided with a protruding guide extending in the vertical direction, while the other actuator is provided with a groove into which the protruding guide fits. The actuator 3 can move stably in the vertical direction relative to the base 2 based on the engagement between the protruding guide and the groove. The actuator 3 is shaped so that the IC chip 9 can be inserted into the mounting area 21. Typically, the actuator 3 is a frame-like or tubular member that includes an opening 35 through which the IC chip 9 can be inserted.The actuating element 3 includes a hollow tube 33 surrounding the base 2 in a plane orthogonal to the vertical direction and an opening 35 at least partially defined by the hollow tube 33.

[0029] In the illustrated example, the hollow tube 33 includes four wall portions provided on the outer periphery of the four wall portions of the base wall 22 of the base 2 as mentioned above. Like the base wall 22 of the base 2, the hollow tube 33 includes a cutout 34 in each of the wall portions opposite in the Y-axis direction. The cutout 34 may be shaped to pivot a lower connecting piece 62, described below. The cutout or opening 23 of the base 2 and the cutout 34 of the hollow tube 33 are adjacent to each other in the inward and outward directions of the socket, so that they are in spatial communication. The IC chip 9 in the socket 1 or a heat dissipation member 52, discussed below, may be cooled by air supply (heat dissipation). It should be noted that the hollow tube 33 includes a protruding portion 36 which extends upwards and projects into the cutout 34.Lower connecting pieces 62 are provided on both sides of the projecting portion 36, which are explained below.

[0030] In the present embodiment, the base 1 further includes the pivoting member 4 and the pressing member 5. The pivoting member 4 pivots in accordance with the vertical movement of the operating member 3 relative to the base 2. In accordance with the pivoting of the pivoting member 4, the pressing member 5 moves between a contact position (see Fig. 8), in which the pressure element 5 is in contact with the upper surface of the IC chip 9 mounted on the mounting area 21, and a retracted position (see Fig. 9) that is obliquely and upwardly spaced from the contact position in the outward direction of the socket, with its posture remaining constant. With such a configuration, it is possible to suppress or avoid damage to the IC chip 9 due to contact with the pressing member 5, while promoting the downsizing of the socket 1. Note that the oblique and upward movement of the pressing member 5 from the contact position toward the retracted position can be understood assuming that a base level is set on the pressing member 5 located at the contact position, but it can also be understood based on a comparison with the mounting surface 21a of the socket 1 or the IC chip 9 mounted on the mounting surface 21a.

[0031] The pivot member 4 is pivotally supported on the base 2 and pivots in accordance with the vertical movement of the operating member 3. The pivot member 4 pivots to generate a force in the horizontal direction (orthogonal to the vertical direction) based on the vertical movement of the operating member 3 (in other words, it pivots to cause a displacement of a part (e.g., an upper end 4b) of the pivot member 4 along the horizontal direction). Specifically, the pivot member 4 pivots in the outward direction of the base when the operating member 3 moves downward and in the inward direction of the base when the operating member 3 ascends. For this purpose, the pivot member 4 may be biased by a spring (not shown) to pivot in the outward direction of the base.It should be noted that a pivot shaft of the pivot member 4 is located at a predetermined position of the base 2 (it does not move in the vertical direction, unlike the positions shown in . Fig. 15 to Fig. 18 illustrated embodiments, which are explained below).

[0032] The pivoting element 4 can be shaped in various ways and can be suitably shaped so that it bends at least in one place. In an illustrated example (see Fig. 9), the pivot member 4 includes: a lower end 4a rotatably supported by the base 2; an upper end 4b rotatably connected to the lower link 62 explained below and arranged to receive a force from the spring for the operating member in the closed state; and a projecting portion 4c projecting in the outward direction of the base between the lower end 4a and the upper end 4b to receive a force from the operating member 3. The pivot member 4 is bent at a location between the lower end 4a and the upper end 4b. The projecting portion 4c is formed on the outer angle side of the bent part. The projecting portion 4c is formed as a projection having a pair of moderately inclined surfaces. The upper end 4b is capable of moving between an outer position of the base (see Fig. 9) and an inward position of the base (see Fig. 8) relative to a pivot axis of the lower end 4a. The protruding portion 4c is provided to prevent the pivoting member 4 from pivoting when the pressing member 5 is in the contact position based on an interference between the protruding portion 4c and the operating member 3 (its inner wall surface). This is because there is a possibility that the pivoting member 4 may pivot unintentionally in accordance with a balance of forces acting on the operating member 3 and the pressing member 5.

[0033] The pressure element 5 itself can be used as a link component (one of four links) of a parallel link to move the pressure element 5 between the contact position and the retracted position while maintaining the constant posture, but this is not necessarily limited to this. In this case, the base 1 may further include at least one upper link 61 (suitably a pair of upper links 61) that couples the upper end 4b of the pressure element 5 to the actuator 3, and at least one lower link 62 (suitably a pair of lower links 62) that couples the lower end 4a of the pressure element 5 to the actuator 3 and is arranged parallel to the upper link 61. The parallel link is configured by the pressure element 5, the actuator 3, the upper link 61, and the lower link 62.By configuring the parallel link to be supported by the pivot member 4, the pressure member 5 can be moved between the contact position and the retracted position in accordance with the vertical movement of the actuator 3. Note that the lower link 62 may include a connection with the pivot member 4 at a position between a connection between the lower link 62 and the pressure member 5 and a connection between the lower link 62 and the actuator 3.

[0034] The pressure element 5 extends in the vertical direction parallel to a wall portion of the hollow tube 33 of the actuating element 3. A connection (a second connection J2) between the pressure element 5 and the upper connecting piece 61 is located above a connection (a first connection J1) between the pressure element 5 and the lower connecting piece 62, and these connections are arranged on the same vertical line (see Fig. 8). A connection (a fourth connection J4) of the upper link 61 and the actuator 3 is located above a connection (a third connection J3) of the lower link 62 and the actuator 3, and these connections are arranged on the same vertical line. The vertical distance between the first and second connections is equal to the vertical distance between the third and fourth connections. The distance between the first and third connections is equal to the distance between the second and fourth connections. Typically, the distance between the first and third connections is greater than the vertical distance between the first and second connections. Note that at the third connection J3, a shaft is provided which extends along the X-axis and penetrates the protruding portion 36 of the aforementioned actuator 3.

[0035] When the actuator 3 begins to descend against the biasing force of the actuator 3 spring, the lower link 62 begins to pivot in the outward direction of the socket relative to its pivot axis in the actuator 3 (note that the lower link 62 could also be said to pivot in the outward direction of the socket about a pivot axis (a coupling shaft S3) of the upper end 4b of the pivot member 4). Simultaneously with the beginning of the pivoting of the lower link 62, the upper link 61 begins to pivot in the outward direction of the socket relative to its pivot axis. Likewise, the pressure member 5 begins to move from the contact position toward the retracted position.When the operating member 3 lowers to a position (near the protruding portion 4c or below the protruding portion 4c) in which the operating member 3 allows the pivoting member 4 to pivot in the outward direction of the base, the pivoting member 4 starts to pivot in the outward direction of the base.

[0036] The above-mentioned pivoting of the upper connecting piece 61, the lower connecting piece 62 and the pivoting element 4 is continued, whereupon the pressing element 5 reaches the retracted position away from the IC chip 9, directed obliquely upwards, so that it is possible to insert the IC chip 9 into the socket 1 and to remove the IC chip 9 from the socket 1 without being hindered by the pressing element 5. The pressing element 5 in the retracted position may be located above the pivoting element 4 and / or offset in the outward direction of the socket from the pivot axis of the pivoting element 4 (see the position indicated by an arrow D3 in Fig. 9). This ensures a sufficient opening to mount the IC chip 9 in the open state into the socket 1 or to remove it from it.

[0037] The entire pressure element 5 in the retracted position can be arranged within the contour of the socket 1. Accordingly, the socket 1 can be maintained in the smaller size in the open state. The contour of the socket 1 can be defined by the contour of the actuator 3 when the socket 1 is viewed from above. If the pressure element 5 were to move too much in the outward direction of the socket, the size of the socket 1 in the open state would increase, and it would be more difficult to mount the sockets 1 at a higher density on the test substrate 8 (i.e., it would be necessary to arrange the sockets 1 at a greater pitch).

[0038] Likewise, the pressure element 5, the upper connecting piece 61, and the lower connecting piece 62 can also be located directly above the actuating element 3 (e.g., the wall portion of the hollow tube 33) and / or within the contour of the base 1 (seen from above) when the pressure element 5 is in the retracted position. Likewise, when the pressure element 5 is in the retracted position, a part (e.g., the upper end 4b and the protruding portion 4c) of the pivoting element 4 can also be located directly above the actuating element 3 (e.g., the wall portion of the hollow tube 33) and / or within the contour of the base 1 (seen from above).

[0039] When the pressure element 5 is in the retracted position, the upper and lower connecting pieces 61 and 62 are preferably slightly inclined inward of the base with respect to the vertical direction to ensure stable operation of the parallel connecting piece. To this end, a protrusion may be provided that limits an angle of the upper connecting piece 61 or the lower connecting piece 62 (with respect to the vertical direction) (e.g., in the base 2).

[0040] If necessary, the pressure element 5 can also be used for heat dissipation of the IC chip 9. In some cases, the pressure element 5 includes a main body 51 and a heat dissipation element 52 made of metal. When the pressure element 5 is in the contact position, the heat dissipation element 52 is in direct contact with the IC chip 9 and thus promotes heat dissipation. In addition, the socket 1 (in short, the base 2 and the actuating element 3) can be shaped such that the heat dissipation element 52 can be visible from one side when the pressure element 5 is in the contact position (e.g., the cutout or opening 23 and the cutout 34 can be formed as in Fig. 4). Accordingly, the heat dissipation element 52 can be effectively cooled by air supply.

[0041] The heat dissipation member 52 can have various shapes. Preferably, the heat dissipation member 52 includes a plurality of heat dissipation fins 53, each extending in the vertical direction, and a connecting plate 54 to which the heat dissipation fins 53 are connected (suitably at the lower ends of the heat dissipation fins 53). The heat dissipation fins 53 can be arranged parallel to each other at a predetermined interval. A ventilation path is defined between the heat dissipation fins 53 adjacent to each other in the arrangement direction of the heat dissipation fins 53. At least when the pressure member 5 is in the contact position, the connecting plate 54 can be provided so as to be parallel to the mounting surface 21a of the mounting portion 21 of the base 2.When the pressure element 5 is in the contact position, the pressure element 5 comes into contact with the upper surface of the IC chip 9 on the lower surface of the heat dissipation member 52 (e.g., the lower surface of the connection plate 54). Accordingly, it may be possible to more efficiently dissipate the heat generated by the IC chip 9 at the time of testing the IC chip 9.

[0042] In some cases, when each of the two pressure elements 5 arranged to face each other in pairs in the base is in the contact position (a first position), the heat dissipation fins 53 of one pressure element 5 and the heat dissipation fins 53 of the other pressure element 5 may be arranged alternately as viewed from one side of the base. In other words, a row of the heat dissipation fins 53 of one pressure element 5 is positioned offset in the lateral direction relative to a row of the heat dissipation fins 53 of the other pressure element 5. Accordingly, the cooling of the heat dissipation fins 53 can be promoted by the air supply. It should be noted that the offset of the row of heat dissipation fins 53 may be visible via a ventilation opening (e.g., the aforementioned cutout 34) of the actuator 3.

[0043] The heat dissipation member 52 is usually harder than the main body 51 because of a material difference between metal and resin. For this reason, the upper surface of the IC chip 9 is easily scratched. The heat dissipation member 52 can be mounted on the pressing member 5 so as to be elastically displaceable in the vertical direction, so that damage to the IC chip 9 at the time of contact can be more safely or sufficiently avoided. For example, the pressing member 5 may further include a spring (not shown) that biases the heat dissipation member 52 downward relative to the main body 51. When the pressing member 5 descends and the heat dissipation member 52 comes into contact with the IC chip 9, the heat dissipation member 52 can be displaced upward against the biasing force of the spring, thereby reducing the force exerted on the IC chip 9.It should be noted that a member arranged to be elastically displaceable in the vertical direction need not be limited to the heat dissipation member 52 and may be replaced by other members (referred to as a contactable member for convenience) as long as the member comes into contact with the upper surface of the IC chip 9.

[0044] As already shown in the drawings referred to in the above description, the socket 1 may have an increased lateral width in one direction (e.g., in the X-axis direction) with respect to the two directions of the X and Y axes of the socket 1 at the time of the plan view of the socket 1. This may increase the contact area between the pressing member 5 (e.g., the heat dissipation member 52) and the IC chip 9. It may promote the IC chip 9 to be pressed with more uniform force and / or to be heat dissipated more uniformly.

[0045] Furthermore, an additional parallel link may be used to stably support the laterally extended pressing member 5. In short, the base 1 may include a pair of upper links 61 and 63 arranged to sandwich the pressing member 5 or a part of the pressing member 5 in the width direction of the base 1 (e.g., in the X-axis direction), and a pair of lower links 62 and 64 arranged to sandwich the pressing member 5 or a part of the pressing member 5 in the width direction of the base 1 (e.g., in the X-axis direction). That is, at one end of the pressing member 5 in the X-axis direction, the upper end of the pressing member 5 is (rotatably) axially coupled to the upper link 61, and the lower end of the pressing member 5 is (rotatably) axially coupled to the lower link 62.At the other end of the pressing member 5 in the X-axis direction, the upper end of the pressing member 5 is (rotatably) axially coupled to the upper link 63, and the lower end of the pressing member 5 is (rotatably) axially coupled to the lower link 64. As shown in the drawings, it is desirable to position the lower link 62 closer to the center of the base 1 in the width direction than the upper link 61, and to position the lower link 64 closer to the center of the base 1 in the width direction than the upper link 63. Accordingly, the cutout 34 on the actuator 3 can be made larger.

[0046] The base 1 may include a pair of pivot members 41 and 42 for individually supporting the aforementioned pair of parallel links. A coupling shaft S3 may be typically used for a connection between the pivot member 41 and the lower link 62, as well as for a connection between the pivot member 42 and the lower link 64, but should not be limited thereto. The pivot member 41 may be positioned closer to the center of the base 1 in the width direction than the lower link 62 to reduce the size of the base 1. Likewise, the pivot member 42 may be positioned closer to the center of the base 1 in the width direction than the lower link 64.

[0047] An upper shaft S1, which penetrates the pressure element 5 or a part of the pressure element 5, can be placed between the upper connecting piece 61 and the upper connecting piece 63. The upper shaft S1 is capable of rotating relative to the pressure element 5 (e.g., to the main body 51 of the pressure element 5). Likewise, a lower shaft S2, which penetrates the pressure element 5 or a part of the pressure element 5, can be placed between the lower connecting piece 62 and the lower connecting piece 64. The lower shaft S2 is capable of rotating relative to the pressure element 5 (e.g., to the main body 51 of the pressure element 5). This allows the pressure element 5 to move to a more stable position. It should be noted that the upper shaft S1 and the lower shaft S2, as well as the coupling shaft S3, extend along the X-axis.

[0048] In the heat dissipation member 52 (e.g., the respective heat dissipation fins 53 extending in the vertical direction), an upper slot 56 in the vertical direction into which the upper shaft S1 is inserted and a lower slot 57 in the vertical direction into which the lower shaft S2 is inserted may be formed, so that the heat dissipation member 52 can be elastically displaced in the vertical direction on the pressing member 5 as described above, and thus a correspondingly adjusted downward pressing force is exerted from the pressing member 5 to the IC chip 9. Typically, the upper and lower slots 56 and 57 are opened in an elliptical shape elongated in the vertical direction, but other opening shapes may also be adopted.

[0049] For the connection of the actuating element 3 with the connecting piece 61 to 64, shafts (see dashed lines in Fig. 2), but other means may also be adopted. For the connection between the base 2 and the pivoting element 4, a shaft (see shaft S9 in Fig. 8) may be used, but other means may also be adopted. Other means include a rotatable fitting based on recesses and projections, bearings, and the like.

[0050] The base 1 may be configured to be mirror-symmetrical with respect to a center plane PL (see Fig. 2) of the base 1. Accordingly, a base 1 may include two pressure elements 5 corresponding to the two opposite sides of the rectangular contour of the base 1. The pressure elements 5 may move between the contact position and the retracted position in accordance with the vertical movement of the actuating element 3, as described above (see Fig. 10). When the pressing elements 5 include heat dissipation elements 52, heat dissipation of the IC chip 9 is further promoted. Note that an embodiment is also adopted in which only one pressing element 5 is provided, corresponding to one side of the rectangular contour of the socket 1. Likewise, an embodiment is also adopted in which four pressing elements 5 are provided, corresponding to the four sides of the rectangular contour of the socket 1. Five or six pressing elements 5 can also be provided in the manner described above when the contour of the socket 1 is a pentagon or a hexagon.

[0051] As already mentioned, the pressure element 5 can be moved obliquely upwards from the contact position to the retracted position, while maintaining a constant position in the outward direction of the base, based on the vertical movement of the actuating element 3 (see Fig. 10). This shifts the socket 1 from the closed state to the open state. As shown in Fig. 10 and Fig. 11, a latch 7 can be used in addition to the pressure element 5 to press the IC chip 9 downwards. The latch 7 is, as shown in Fig. 11, pivotally supported by the base 2 and, in the example shown, is located between the pivot members 41 and 42. Note that the latch 7 is narrower in the X-axis direction than the push member 5. The latch 7 is always spring-biased and pivots in the inward direction of the socket (about a pivot shaft of the latch 7 in the base 2). The latch 7 includes a push portion 71 for pressing the IC chip 9 and a spring-biased portion 72 located on both sides of the pivot axis of the latch 7. When the operating member 3 is lowered, the biased portion 72 of the latch 7 is pressed downward by the operating member 3, and the latch 7 pivots in the outward direction of the socket against the biasing force of the spring.In this way, just as the pressing action of the pressing element 5 is canceled, the downward pressing action of the latch 7 against the IC chip 9 can be canceled based on the lowering of the actuating element 3.

[0052] In a case where it is known in advance that the IC chip 9 has heat generating regions 91 and 92, as shown in Fig. As shown in Fig. 12, the heat dissipation members 52 of the pressure elements 5 can be selectively brought into contact with the heat generation regions 91 and 92, which are the target regions. Note that the heat generation regions 91 and 92 are regions that generate more heat at the time of operation of the IC chip 9 than other portions (e.g., a peripheral region) of the IC chip. Fig. 13 illustrates an example in which two heat dissipation members 52 are associated with a heat generation region 93 in the IC chip 9. In this way, the position, size, and shape of the pressure member 5 (or the heat dissipation member 52) in the socket 1 can be changed according to a position and area of ​​the heat generation region 93 in the IC chip 9.

[0053] The pressure element 5 descends and reaches the bottom dead center, while the actuating element 3 ascends. The deep dead center of the pressure element 5 can be determined based on an interference between the pressure element 5 and the base 2. For this purpose, a first stopped portion 58 can be provided in the pressure element 5 (e.g., the main body 51), as shown in Fig. 14. When the pressing element 5 is in the contact position, the stopped portion 58 comes into contact with the base 2 (e.g., the upper surface of the base wall 22), thereby defining the stop position (bottom dead center) of the pressing element 5 and optimizing a contact position of the pressing element 5 with the IC chip 9. For example, the pressing element 5 can be prevented from pressing the IC chip 9 downward excessively. The stopped portion 58 may be provided near the second connection J2 of the upper connector 61 and the pressing element 5 (e.g., adjacent to the second connection J2 in the inward direction of the socket). The stopped portion 58 may also be provided in another component such as the heat dissipation member 52, the upper connector 61, or the lower connector 62.In some cases, the deep dead center of the pressing member 5 is determined based on an interference between the lower link 62 and the base 2. In order to sufficiently retain the stopped portion 58 by the base 2, the base 2 may be provided with a projection extending inwardly of the socket to such an extent that the attachment and detachment of the IC chip 9 is not hindered.

[0054] The use of the parallel connector is not mandatory to maintain the constant position of the pressure element 5. This aspect is explained by the Fig. 15 to Fig. 18 briefly explained. In Fig. 15 and Fig. 16, the pressure element 5 is biased toward a guide plate 110 of the base 2 by a spring 120 at a free end of the pivoting element 4, and the position of the pressure element 5 is maintained constant based on the contact between the pressure element 5 and the guide plate 110. The guide plate 110 is a part of the base 2 and is provided directly above the above-described base wall 22. Therefore, even with the guide plate 110 provided, there are no problems in attaching and detaching the IC chip 9 to and from the socket 1. Specifically, the guide plate 110 includes a guide surface 111 along which the pressure element 5 slides. The guide surface 111 includes a curved surface curved along a pivoting location of the free end of the pivoting element 4. Of course, guides other than the guide plate 110 may also be used.

[0055] In a Fig. 17 and Fig. In the case shown in Fig. 18, the pressing member 5 is swingably attached to the free end of the pivot member 4 and includes guide projections 511 and 512 that respectively engage with the guide grooves 211 and 212 formed on the base 2. The guide grooves 211 and 212 are arcuately shaped to hold the pressing member 5 in a constant position. The guide grooves 211 and 212 are formed on the inner wall surface of the guide plate 110 included in the base 2. The guide grooves 211 and 212 may be formed to curve along the pivoting location of the free end of the pivot member 4. The guide projections 511 and 512 are projections that project in the outward direction of the base. Other configurations may also be adopted.

[0056] At the Fig. 15 to Fig. In the embodiment shown in Figure 18, the pivot axis of the pivot member 4 moves vertically and downwardly in accordance with the vertical movement of the actuating member 3. The pivot member 4 includes engagement projections that engage with the guide grooves 211 and 212 provided in the base 2, thereby stabilizing a pivoting position of the pivot member 4. The pivot member 4 may also be provided in other shapes.

[0057] The pressure element 5 rises and reaches the top dead center, while the actuating element 3 descends. A position of the pressure element 5 at the top dead center can be determined based on an interference between the pressure element 5 and the upper connecting pieces 61 and 63. For example, the pressure element 5 (e.g., the main body 51) can be provided with a second stopped portion 59, as shown in Fig. 19. When the pressing member 5 is in the retracted position (top dead center), the stopped portion 59 comes into contact with the upper link 63, thus preventing rotation of the pressing member 5 while keeping the position of the pressing member 5 constant. The pressing member 5 does not move further in the outward direction of the socket even when an external force is applied, thus preventing stacking of the parallel link that might otherwise occur. Just to be safe, if the upper links 61 and 63 and the lower links 62 and 64 are arranged on the same perpendicular line, there is a possibility that the parallel link may not function properly.As described above, the upper and lower connecting pieces 61 and 62 are preferably slightly inclined with respect to the vertical direction in the inward direction of the base when the pressing member 5 is in the retracted position.

[0058] Fig. 20 is a schematic plan view of a base according to a modified example. Fig. Figure 21 is a schematic sectional view of the base taken along alternating long and short dashed lines in Fig. 20. As from Fig. 20 and Fig.As can be seen from Fig. 21, the protruding portion 4c has a length adjusted so that the operating member 3 collides with the protruding portion 4c when the operating member 3 ascends. When the operating member 3 ascends, the operating member 3 collides with the protruding portion 4c of the pivot member 4 and pushes the protruding portion 4c upward, and accordingly, the pivot member 4 pivots inward of the base. This ensures that the pressing member 5 descends and reaches the contact position.

[0059] Based on the procedure described above, one skilled in the art can add various modifications to the embodiments and features. Those skilled in the art can understand a method for assembling the base 1 based on the drawings of the application. A detailed explanation of the method is omitted. Description of reference symbols 1 base 2 Base 3 Actuating element 4 Swivel element 4a lower end 4b upper end 4c above section 5 Pressure element 7 bars 8 Test substrate 9 IC chip 21 Assembly area 21a Mounting surface 22 Base wall 23 Opening 33 hollow tube 34 Excerpt 35 Opening 41 Swivel element 42 Swivel element 51 main body 52 Heat dissipation element 53 Heat dissipation fin 54 Connecting plate 56 upper slot 57 lower slot 61 upper connecting piece 62 lower connecting piece 63 upper connecting piece 64 lower connecting piece 71 Print section 72 prestressed section 91 Heat generation region 92 heat generation region 93 Heat generation region 99 contact element QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 2004-325393

[0004] JP 2004-184173

[0004] JP 2009-140629

[0004]

Claims

[1] Base, comprising: a base including a mounting area on which an IC chip is mounted, the base carrying a plurality of contact elements electrically connectable to the IC chip; an actuator that is vertically movable relative to the base and shaped to allow the IC chip to be inserted onto the mounting area; a pivoting member pivoting in accordance with vertical movement of the actuating member relative to the base; and a pressing member that moves in accordance with a pivoting of the pivoting member between a contact position and a retracted position while keeping its posture constant, wherein the pressing member is in contact with an upper surface of the IC chip mounted on the mounting area in the contact position and the retracted position is obliquely and upwardly away from the contact position in an outward direction of the socket. [2] The base of claim 1, wherein the pressure member is located above the pivot member in the retracted position. [3] Base according to claim 1, wherein the pressure element in the retracted position is arranged in its entirety within a contour of the base. [4] The base of claim 1, wherein the constant position is a substantially horizontal position. [5] The socket of claim 1, wherein the pressing member includes a metal heat dissipation member, the heat dissipation member having a lower surface in contact with the upper surface of the IC chip when the pressing member is in the contact position. [6] The socket according to claim 1, wherein the pressing member includes a contactable member capable of coming into contact with the upper surface of the IC chip, the contactable member being elastically displaceable in the vertical direction. [7] The socket according to any one of claims 1 to 6, further comprising: at least one upper link coupling an upper end of the pressing member to the operating member; and at least one lower link coupling a lower end of the pressing member to the operating member and provided parallel to the upper link, wherein a parallel link is configured by the pressing member, the operating member, the upper link and the lower link. [8] The socket according to claim 7, wherein a bottom dead center of the pressing member is set based on an interference between the lower link and the base. [9] The socket according to claim 7, wherein the lower link includes a connection with the pivot member at a position between a connection between the lower link and the pressure member and a connection between the lower link and the actuating member. [10] The base according to claim 7, wherein the pivot member includes a lower end rotatably supported by the base, an upper end rotatably coupled to the lower link, and a protruding portion protruding outwardly of the base between the lower end and the upper end. [11] The base according to claim 10, wherein the protruding portion has a length adjusted so that the operating member collides with the protruding portion when the operating member ascends. [12] The socket according to claim 7, wherein a position of the pressing member is maintained at a top dead center based on an interference between the upper link and the pressing member. [13] The socket according to claim 7, wherein the at least one upper connecting piece includes a pair of upper connecting pieces arranged to sandwich the pressing member or a part of the pressing member in a width direction of the socket, and the at least one lower connecting piece includes a pair of lower connecting pieces arranged to sandwich the pressing member or a part of the pressing member in the width direction of the socket. [14] A socket according to claim 13, wherein an upper shaft is supported between the pair of upper connecting pieces, the upper shaft penetrating through the pressure element or a part of the pressure element; and a lower shaft is supported between the pair of lower connecting pieces, the lower shaft penetrating through the pressure element or a part of the pressure element. [15] The socket according to claim 14, wherein a heat dissipation member is attached to the pressing member so as to be elastically displaceable in the vertical direction, and the heat dissipation member includes: an upper slot extending in the vertical direction and into which the upper shaft is inserted, and a lower slot extending in the vertical direction and into which the lower shaft is inserted. [16] A base according to any one of claims 1 to 6, wherein the pressure element is biased by an elastic element at a free end of the pivoting element towards a guide included in the base and a position of the pressure element is kept constant based on the contact between the pressure element and the guide. [17] A base according to any one of claims 1 to 6, wherein the pressing member is swingably mounted on a free end of the pivoting member and includes a guide projection which engages with a guide groove formed on the base, and the guide groove is formed in an arc shape for the constant position of the pressing member. [18] A socket according to any one of claims 1 to 6, wherein a bottom dead center of the pressure element is determined based on an interference between the pressure element and the base. [19] Base, comprising: a base including a mounting area on which an IC chip is mounted, the base carrying a plurality of contact elements electrically connectable to the IC chip; an actuator that is vertically movable relative to the base and shaped to allow the IC chip to be inserted onto the mounting area; and a first and a second pressure element, each of which moves in accordance with a vertical movement of the actuating element between a first and a second position, its position remaining constant, the second position being obliquely and upwardly away from the first position in an outward direction of the socket, each pressure element in the first position being in contact with an upper surface of the IC chip mounted on the mounting area, wherein each of the first and second printing elements includes a heat dissipation element in which heat dissipation fins are arranged at a predetermined interval, and when the first and second pressure elements are in the first position, the heat dissipation fins of the first pressure element and the heat dissipation fins of the second pressure element are arranged alternately as viewed from one side of the base. [20] A method for electrically connecting an IC chip to a socket, the method comprising: a first step including lowering an operating member of the base, which is vertically movable relative to a base of the base, against an upward biasing force caused by an elastic member, wherein a pivot member pivots in an outward direction of the base upon lowering of the operating member, and the pressing member moves obliquely and upwardly away from the lower position in accordance with the pivoting movement of the pivot member from a lower position to an upper position, with its position remaining constant; and after the first step, a second step of mounting an IC chip via an opening formed in the actuator onto a mounting portion of the base.

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