Chip mounter and control system thereof

Abstract

The invention provides a chip mounter and a control system thereof, and relates to the technical field of chip mounters, the chip mounter comprises a chip mounter main body and a suction assembly which is arranged in the chip mounter main body and can move three-dimensionally, the suction assembly comprises a driving mechanism and a suction nozzle, the suction nozzle is internally provided with a moving cavity, the moving cavity is internally provided with a moving part which is in sliding connection with the moving cavity, and the driving mechanism is connected with the driving mechanism. The moving part divides the moving cavity into two chambers; a suction nozzle head is arranged at the tail end of the suction nozzle and sleeved with a sliding sleeve, and the sliding sleeve is in sliding connection with the suction nozzle head. Through cooperation of the moving cavity, the moving part and the sliding sleeve, when the component is separated, controllable pressing is performed on the component, gas is sprayed out from the contact position of the sliding sleeve and the component, the purpose of separating the component from the suction nozzle while the component is safely installed in place is achieved, and the precision and the qualified rate of the chip mounter are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip placement machines, and in particular to a chip placement machine and a control system thereof. Background Art

[0002] Electronic component placement machines are one of the indispensable key equipment in the field of modern electronic manufacturing. They are mainly responsible for accurately placing various types of chip SMC / SMD (surface mount components) on the corresponding positions on the surface of the PCB (printed circuit board) that has been printed with solder paste or patch adhesive in the production line. With the development trend of miniaturization, lightweight, high density and multi-functionality of electronic products, the role of placement machines is becoming increasingly important.

[0003] The electronic component placement machine is mainly composed of PCB transmission, component feeding, component removal, component positioning and component installation. Because electronic components are large and small, and are delicate parts that are easily damaged, installing components is a process that requires precision.

[0004] In the process of installing components, existing placement machines mostly use negative pressure suction to move and install components. After the suction nozzle in the negative pressure suction device contacts the component, the suction nozzle is connected to the suction pipe, and the negative pressure generator generates negative pressure in the suction nozzle. After the component is moved to the installation position, the suction nozzle is switched to connect to the blow pipe, thereby separating the component from the suction nozzle.

[0005] In existing technologies, the airflow used to separate components from the nozzle is insufficiently dynamically adjusted, and the airflow intensity cannot be automatically adjusted to suit different component sizes. This can easily lead to excessive airflow, causing component displacement or material flying. When the airflow hits electronic components, it can easily cause them to tilt or pins to misalign, resulting in poor solder joints. When the airflow pressure for microcomponents is ≥0.18MPa, the component displacement rate increases by 63%. When components are separated from the nozzle by negative pressure release without airflow, static electricity or residual negative pressure can cause the components to stick to the nozzle.

[0006] Furthermore, most nozzles are made of pure metal (such as tungsten steel or stainless steel) and lack a buffer layer. Experimental data shows that when a rigid nozzle's placement pressure exceeds 0.5N, the solder ball collapse rate of QFN packaged chips increases by 37%.

[0007] Therefore, in order to solve the above problems, the present invention proposes a chip placement machine and a control system thereof, aiming to improve the efficiency of the chip placement machine through blowing and pressing accuracy. Summary of the Invention

[0008] The purpose of the present invention is to provide a chip mounter and a control system thereof, aiming to solve the problems of insufficient mounting accuracy and low product qualification rate caused by blowing control and pressing process during the component installation process of the chip mounter.

[0009] To achieve the above-mentioned object, the present invention adopts the following technical solution: a chip placement machine, comprising a chip placement machine body and a suction assembly disposed therein capable of three-dimensional movement, the suction assembly comprising a drive mechanism and a suction nozzle, a movable cavity disposed therein, a movable member slidably connected thereto disposed within the movable cavity, the movable member dividing the movable cavity into two chambers;

[0010] A nozzle head is provided at the end of the nozzle, and a sliding sleeve is provided on the outer shell of the nozzle head. The sliding sleeve is slidably connected to the nozzle head.

[0011] Preferably, a third elastic member is provided at one end of the sliding sleeve close to the suction nozzle, and a pressure detection member is provided at the other end of the third elastic member. The pressure detection member is connected to the suction nozzle for real-time monitoring of the mounting pressure.

[0012] Preferably, a sealing ring is provided between the sliding sleeve and the nozzle head, and the sealing ring can ensure the sealing between the sliding sleeve and the nozzle head during the sliding process.

[0013] Preferably, a vent is provided on the movable member, a sealing member is provided at one end of the vent away from the nozzle head, a first elastic member is provided at one end of the sealing member close to the nozzle head, and the other end of the first elastic member is connected to the vent.

[0014] Preferably, a sliding groove is provided on the movable member, a limiting member is provided in the sliding groove, the limiting member can slide in the sliding groove, and the limiting member can limit the sealing member.

[0015] Preferably, a second elastic member is provided at one end of the limiting member away from the sealing member, and the other end of the second elastic member is connected to the inner side wall of the sliding groove.

[0016] Preferably, a pushing groove is provided on the side wall of the movable cavity opposite to the sealing member, and the pushing groove can move the limiting member in a direction away from the sealing member after contacting the limiting member.

[0017] Preferably, a side of the movable member away from the nozzle head and a side of the movable chamber away from the nozzle head are both provided with suction members, and the two suction members can attract each other after approaching each other.

[0018] Preferably, a connecting sleeve is provided between the suction nozzle and the driving mechanism, and the connecting sleeve enables the suction nozzle to be quickly assembled and disassembled.

[0019] A chip placement machine control system includes the following steps:

[0020] S01: Visual positioning, using a high-resolution camera to scan PCB reference points and compensate for PCB manufacturing errors;

[0021] S02: Component suction, the nozzle moves to the feeder position according to the program instructions and accurately sucks the components through negative pressure;

[0022] S03: Dynamic calibration: the flying camera or laser sensor detects the angle, position and polarity of the components in real time and corrects the placement offset in real time;

[0023] S04: Placement execution, the X and Y axis servo systems drive the components to the target coordinates, and the Z axis servo system controls the suction nozzle to press down according to the feedback data of the pressure detection part, releasing the components to the PCB pads.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] 1. The present invention arranges a movable cavity and a movable part. When sucking components, the movable part moves in a direction away from the components. When the negative pressure in the cavity of the movable cavity close to the components reaches a specified value, the components are sucked. After the components are moved into place, the suction nozzle switches the air jet tube, and the movable plate moves in a direction close to the components. When the movable plate moves to the limit, the air pressure in the suction nozzle head and the sliding sleeve is equal to that in the outside world, and the components can be easily separated from the suction nozzle. Therefore, while ensuring the normal operation of the suction nozzle, the gas blown into the suction nozzle will not affect the electronic components, thereby solving the negative impact of excessive blowing on the components.

[0026] 2. The present invention cooperates with the sliding sleeve and the moving part. When the component is detached, the moving part makes the air pressure in the nozzle head and the sliding sleeve equal to that in the outside world. The nozzle moves further toward the component, and the sliding sleeve still contacts the component, resulting in a decrease in the volume of the gas in the nozzle head and the sliding sleeve and an increase in the air pressure. Finally, the gas is ejected at the contact position between the sliding sleeve and the component, thereby preventing the component from adhering to the nozzle due to static electricity or residual negative pressure. In addition, the provision of the third elastic part can protect the component while installing it in place, so that the performance of the component will not be damaged due to excessive squeezing of the nozzle, thereby achieving the purpose of separating the component from the nozzle while the component is installed in place, thereby improving the accuracy and qualified rate of the placement machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of the chip placement machine of the present invention.

[0028] Figure 2 It is a structural schematic diagram of the working area of ​​the placement machine of the present invention.

[0029] Figure 3 It is a structural schematic diagram of the suction component of the present invention.

[0030] Figure 4 This invention Figure 3 A partial enlarged view of point A in the middle.

[0031] Figure 5 It is a schematic diagram of the cross-sectional structure of the suction nozzle of the present invention.

[0032] Figure 6 This invention Figure 5 A partial enlarged view of point B in the middle.

[0033] Reference numerals:

[0034] 1. SMT machine body; 2. Suction assembly; 21. Suction nozzle; 211. Moving cavity; 212. Moving part; 2121. Vent; 2122. Sealing part; 2123. First elastic part; 2124. Limiting part; 2125. Sliding groove; 2126. Second elastic part; 2127. Pushing groove; 2128. Suction part; 213. Suction nozzle head; 214. Sliding sleeve; 2141. Sealing ring; 215. Third elastic part; 216. Pressure detection part; 22. Connecting sleeve. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] Example 1

[0037] In order to solve the problem of insufficient placement accuracy and low product qualification rate caused by the blowing control and pressing process during the installation of components by the placement machine, Figures 1 to 6 As shown, the present invention proposes a placement machine, including a placement machine body 1, in which a suction component 2 capable of moving in three-dimensional directions is provided. The suction component 2 includes a driving mechanism and a suction nozzle 21, and the suction nozzle 21 is located at the end of the driving mechanism; it should be noted that the movement of the suction component 2 can be driven by multiple linear motors to ensure the positioning accuracy of the suction component 2.

[0038] A movable cavity 211 is provided in the suction nozzle 21 . A movable member 212 is provided in the movable cavity 211 . The movable member 212 is slidably connected to the movable cavity 211 . The movable member 212 divides the movable cavity 211 into two chambers.

[0039] It should be noted that a rotating mechanism is provided in the driving mechanism, which is driven by a stepper motor or a servo system to adjust the component placement direction. At the same time, the driving mechanism also needs to complete axial movement to perform more precise position control of the suction nozzle 21. The direction of the movable cavity 211 and the movable member 212 therein can be set in any direction within the suction nozzle 21; in this embodiment, the movable member 212 moves along the axial direction of the suction nozzle 21, and there is no gap between the movable cavity 211 and the movable member 212. The movable cavity 211 is divided into two chambers by the movable member 212, and as the movable member 212 moves, the volume of the two chambers of the movable cavity 211 is constantly changing.

[0040] A connecting sleeve 22 is provided between the suction nozzle 21 and the driving mechanism, and the connecting sleeve 22 enables the suction nozzle 21 to be quickly assembled and disassembled.

[0041] It should be noted that the suction nozzle 21 is inserted into the connecting sleeve 22, and the connecting sleeve 22 is connected to the suction pipe and the blowing pipe through the solenoid valve. The upper end of the movable cavity 211 is provided with a through hole, which is connected to the inside of the connecting sleeve 22; in the initial state, the movable part 212 is located at the lower end of the movable cavity 211; when the solenoid valve is connected to the suction pipe, the cavity air pressure on the upper side of the movable part 212 in the movable cavity 211 decreases, and the air pressure of the other cavity remains unchanged, and a pressure difference is formed between the two, causing the movable part 212 to move upward; when the solenoid valve is connected to the blowing pipe, the cavity air pressure on the upper side of the movable part 212 increases, causing the movable part 212 to move downward.

[0042] The nozzle 21 is provided with a nozzle head 213 at the end thereof, which is covered with a sliding sleeve 214. The sliding sleeve 214 is slidably connected to the nozzle head 213. For example, the nozzle head 213 is located at the end of the nozzle 21 away from the drive mechanism and is in communication with the movable chamber 211. The sliding connection between the sliding sleeve 214 and the nozzle head 213 can relieve the pressure exerted by the nozzle 21 on the components.

[0043] It should be noted that the nozzle head 213 is coaxially arranged with the nozzle 21, and the nozzle head 213 can be a cylindrical structure. The nozzle head 213 is connected to the chamber in the movable chamber 211 close to the nozzle head 213, and the sliding sleeve 214 is sleeved on the outside of the nozzle head 213, and when the sliding sleeve 214 slides to the uppermost end, the lower end of the sliding sleeve 214 also grows out of the nozzle head 213. The lower end of the sliding sleeve 214 is the position that contacts the components, and the sliding sleeve 214 can be made of different materials, such as tungsten steel, ceramics, carbon fiber, etc., which needs to be selected according to the electrostatic sensitivity, weight and other properties of the components; the lower end of the sliding sleeve 214 can be provided with a soft contact ring, such as a contact ring made of silicone material, to avoid damage to the circuit board when pressing down, while enhancing the sealing.

[0044] In this embodiment, a third elastic member 215 is provided at one end of the sliding sleeve 214 close to the suction nozzle 21, and a pressure detection member 216 is provided at the other end of the third elastic member 215. The pressure detection member 216 is connected to the suction nozzle 21 for real-time monitoring of the mounting pressure.

[0045] It should be noted that the third elastic member 215 can relieve the pressure of the suction nozzle 21 on the components. A pressure sensor is provided in the pressure detection member 216. The pressure detection member 216 can be located in the groove opened at the end of the suction nozzle 21. This can protect the pressure sensor and will not be affected by other factors. The accuracy of the pressure sensor.

[0046] In this embodiment, a sealing ring 2141 is provided inside the sliding sleeve 214 , and the sealing ring 2141 can ensure the sealing between the sliding sleeve 214 and the nozzle head 213 during the sliding process.

[0047] In this embodiment, the volume of the movable chamber 211 is 2 to 3 times the sum of the internal volumes of the nozzle head 213 and the sliding sleeve 214. When the nozzle 21 is working normally, the vacuum negative pressure needs to reach 53.33 kPa (400 mmHg) or above, which means that the volume of the gas in the nozzle 21 needs to expand to about 211% of the original volume. Taking into account the different airflow requirements of components of different sizes, in this embodiment, the movable part 212 is located at the lower end of the movable chamber 211 in the initial state, so the volume of the movable chamber 211 is 2 to 3 times the sum of the internal volumes of the nozzle head 213 and the sliding sleeve 214. During use, the volume of the movable chamber 211 will not be fully used, depending on the size of the components. The weight and material are used to adjust the air pressure in the movable chamber 211 in real time. The air pressure in the movable chamber 211 is different, and the position of the movable part 212 is also different. The less gas is extracted, the closer the movable part 212 is to the lower end of the movable chamber 211; the less gas is extracted, the closer the movable part 212 is to the upper end of the movable chamber 211.

[0048] It should be noted that when sucking components, the suction nozzle 21 is placed against the component to be sucked, and the lower end of the sliding sleeve 214 contacts the component. At this time, the suction nozzle 21 moves slightly downward, the third elastic member 215 contracts and deforms, and the pressure detection member 216 detects the pressure value and feeds back to ensure that the sliding sleeve 214 does not over-extrude the component. At this time, the suction nozzle 21 is connected to the suction pipe through the electromagnetic valve, and the suction pipe sucks out the gas in the cavity on the upper side of the moving member 212 in the moving chamber 211, and the moving member 212 is moved out. The air pressure in the cavity above the moving part 212 decreases, and the moving part 212 moves upward under the influence of the air pressure, thereby increasing the volume of the cavity below the moving part 212. The gas originally in the suction nozzle head 213 and the sliding sleeve 214 enters the cavity below the moving part 212, and the air pressure in the suction nozzle head 213 and the sliding sleeve 214 decreases. When the air pressure drops to the set level, the moving part 212 stops moving. At this time, the components are pressed against the lower end of the sliding sleeve 214 due to the atmospheric pressure, completing the absorption of the components.

[0049] After the component is moved to the specified position, the solenoid valve is switched to the air blowing pipe, and the air blowing pipe blows air to the cavity on the upper side of the moving part 212 in the moving chamber 211. The air pressure in the cavity on the upper side of the moving part 212 increases, and the moving part 212 moves downward under the influence of the air pressure until the moving part 212 is pushed to the lowermost side of the moving chamber 211. Because the gas in the cavity on the lower side of the moving part 212 comes from the nozzle head 213 and the sliding sleeve 214, when the moving part 212 reaches the lowermost side of the moving chamber 211, the air pressure in the nozzle head 213 and the sliding sleeve 214 is equal to that before the component is sucked, that is, it is equal to the external air pressure. At this time, the suction nozzle 21 is moved slightly downward, so that the sliding sleeve 214 moves upward relative to the suction nozzle head 213, the volume of the gas in the suction nozzle head 213 and the sliding sleeve 214 is reduced, and the air pressure is increased. Since the cavity on the upper side of the moving part 212 is still in a high-pressure state, the moving part 212 will not be pushed upward. At this time, the gas in the suction nozzle head 213 and the sliding sleeve 214 is discharged from the contact position between the sliding sleeve 214 and the component, thereby separating the component and the suction nozzle 21, and when the gas is ejected, the sliding sleeve 214 is still squeezing the component, and the ejected gas will not affect the position of the component, and the installation of the component is completed.

[0050] In this embodiment, by setting the movable cavity 211 and the movable part 212, the components will not spray out too much gas during the separation from the suction nozzle 21, thereby avoiding the impact of excessive air jet on the components; at the same time, the sliding sleeve 214 and the movable part 212 cooperate to spray out the gas in the sliding sleeve 214, that is, there will be no excessive air jet, and the components can be separated from the suction nozzle 21, thereby improving the accuracy and pass rate of the placement machine.

[0051] Example 2

[0052] In actual use, if the suction nozzle 21 has already started to suck air before it contacts any component, the moving member 212 will be unable to suck the component after reaching the uppermost end of the moving cavity 211 .

[0053] In order to solve the above technical problems, in another embodiment of the present invention, a vent hole 2121 is provided on the movable part 212, and a sealing member 2122 is provided at the end of the vent hole 2121 away from the suction nozzle head 213. The sealing member 2122 can seal the vent hole 2121, and a first elastic member 2123 is provided at the end of the sealing member 2122 close to the suction nozzle head 213. The other end of the first elastic member 2123 is connected to the vent hole 2121.

[0054] It should be noted that the vent 2121 can be arranged in a stepped shape, and the sealing member 2122 can prevent the gas from passing from top to bottom, and allow the gas to pass from bottom to top; when there is gas from bottom to top, the sealing member 2122 separates from the moving member 212, and the vent 2121 connects the two chambers of the moving cavity 211. When the gas passes through, the first elastic member 2123 drives the sealing member 2122 to approach the moving member 212, and finally seals the vent 2121.

[0055] In this embodiment, the movable member 212 is provided with a sliding groove 2125, and a limiting member 2124 is provided in the sliding groove 2125. The limiting member 2124 can slide in the sliding groove 2125 and limit the sealing member 2122. For example, the sliding groove 2125 is provided along the radial direction of the movable member 212, and the end of the limiting member 2124 close to the sealing member 2122 can be inserted into the sealing member 2122, thereby limiting the sealing member 2122.

[0056] It should be noted that there can be multiple sliding grooves 2125 and limiting members 2124 along the circumference of the sealing member 2122. A groove for accommodating the limiting member 2124 is opened around the sealing member 2122. The limiting member 2124 slides in the sliding groove 2125 to complete the limiting and release of the sealing member 2122.

[0057] In this embodiment, a second elastic member 2126 is provided at one end of the limiting member 2124 away from the sealing member 2122 , and the other end of the second elastic member 2126 is connected to the inner wall of the sliding groove 2125 .

[0058] A pushing groove 2127 is provided on the side wall of the movable cavity 211 opposite to the sealing member 2122 . The pushing groove 2127 can move the limiting member 2124 in a direction away from the sealing member 2122 after contacting the limiting member 2124 .

[0059] It should be noted that when the moving part 212 approaches the upper side wall inside the moving cavity 211, the limiting part 2124 contacts the inclined surface of the pushing groove 2127. When the moving part 212 continues to approach, the inclined surface of the pushing groove 2127 pushes the limiting part 2124 to move away from the sealing part 2122, thereby releasing the limit on the sealing part 2122.

[0060] In this embodiment, the side of the moving member 212 away from the nozzle head 213 and the side of the moving cavity 211 away from the nozzle head 213 are both provided with an attracting member 2128. The two attracting members 2128 can attract each other when they are close to each other. The attracting members 2128 can be magnets that attract each other.

[0061] It should be noted that when the placement machine is operating normally, the moving part 212 will not reach the uppermost end of the moving cavity 211 , the restriction of the limiting part 2124 will not be contacted, and the moving part 212 does not allow any gas to flow.

[0062] When the suction nozzle 21 has not yet touched the components but has begun to absorb air, the movable part 212 is pushed by the airflow and moves to the uppermost end of the movable cavity 211, and the limiting part 2124 releases the restriction of the sealing part 2122. The sealing part 2122 is pushed by the airflow and separates from the movable part 212, and the vent hole 2121 connects the two sides of the movable part 212; at this time, the components can still be sucked, the entire suction nozzle 21 is in a negative pressure state, and the movable part 212 is always at the uppermost end of the movable cavity 211 because of the suction part 2128; after the components are in place, they can still be installed, and when the solenoid valve is switched to the blow pipe, there is no gas in the vent hole 2121 Circulation, the sealing member 2122 seals the vent hole 2121, and the limiting member 2124 limits the sealing member 2122. The air pressure of the blowing pipe is greater than the air pressure in the movable chamber 211. The gas in the blowing pipe enters the movable chamber 211 and pushes the movable member 212 to move downward, compressing the gas originally in the movable chamber 211 and separating the components from the suction nozzle 21. At this time, the gas discharged by the suction nozzle 21 is not much, and there is only the gas in the movable chamber 211, the suction nozzle head 213 and the sliding sleeve 214 when they are in a negative pressure state. When the suction nozzle 21 sprays air, the sliding sleeve 214 still presses the components. Therefore, the early suction of the suction nozzle 21 will not affect the efficiency.

[0063] The present invention improves the working ability of the placement machine in other situations through the cooperation of the vent hole 2121, the seal 2122 and the limiter 2124, and achieves the purpose of separating the component from the suction nozzle 21 while the component is installed in place. The accuracy and qualified rate of the placement machine are improved. In this state, the problem of insufficient placement accuracy and low product qualified rate caused by the blowing control and pressing process during the placement process of the placement machine is solved.

[0064] Example 3

[0065] Based on the above embodiment, this embodiment further provides a control system for a placement machine, including the following specific steps:

[0066] S01: Visual positioning, using a high-resolution camera such as CMOS or CCD to scan PCB reference points, generate a three-dimensional coordinate map, and compensate for PCB manufacturing errors.

[0067] S02: Component suction, the suction nozzle 21 moves to the feeder position according to the program instructions and accurately sucks the components through negative pressure.

[0068] S03: Dynamic calibration: flying cameras or laser sensors detect the angle, position and polarity of components in real time, and correct placement offsets in real time.

[0069] S04: Placement is executed. The X- and Y-axis servo systems drive the components to the target coordinates. The Z-axis servo system controls the suction nozzle 21 to press down according to the feedback data of the pressure detection part 216, and releases the components to the PCB pads. In this process, the "in-flight correction" technology is used, and the components complete the secondary position correction during the movement.

[0070] In summary, when the chip placement machine and its control system are in use, the negative pressure state in the nozzle head 213 and the sliding sleeve 214 can be broken by the setting of the moving chamber 211 and the moving part 212, and at the same time, it will not affect the electronic components. The suction nozzle 21 is further moved toward the direction of the component, so that the volume of the gas in the nozzle head 213 and the sliding sleeve 214 is reduced, and the gas is ejected from the contact position between the sliding sleeve 214 and the component, thereby achieving the purpose of separating the component from the suction nozzle 21 while the component is installed in place, and solving the problems of insufficient placement accuracy and low product qualification rate caused by the blowing control and pressing process during the installation of components by the chip placement machine.

[0071] It should be noted that in the description of the present invention, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is merely for ease of description and does not indicate or imply that the device or element must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, it should not be understood as limiting the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0072] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A chip mounter, comprising a chip mounter body and a suction component therein capable of three-dimensional movement, wherein the suction component comprises a drive mechanism and a suction nozzle, characterized in that: A movable cavity is provided in the nozzle, and a movable member is provided in the movable cavity for sliding connection therewith, and the movable member divides the movable cavity into two chambers; A nozzle head is provided at the end of the nozzle, and a sliding sleeve is provided on the outer shell of the nozzle head. The sliding sleeve is slidably connected to the nozzle head.

2. The chip mounter according to claim 1, characterized in that: A third elastic member is provided at one end of the sliding sleeve close to the suction nozzle, and a pressure detection member is provided at the other end of the third elastic member. The pressure detection member is connected to the suction nozzle for real-time monitoring of the mounting pressure.

3. The chip mounter according to claim 1, characterized in that: A sealing ring is provided between the sliding sleeve and the nozzle head, and the sealing ring can ensure the sealing performance between the sliding sleeve and the nozzle head during the sliding process.

4. The chip mounter according to claim 1, characterized in that: The movable part is provided with a vent hole, a sealing part is provided at one end of the vent hole away from the nozzle head, a first elastic part is provided at one end of the sealing part close to the nozzle head, and the other end of the first elastic part is connected to the vent hole.

5. The chip mounter according to claim 1, characterized in that: The movable member is provided with a sliding groove, and a limiting member is provided in the sliding groove. The limiting member can slide in the sliding groove, and the limiting member can limit the sealing member.

6. The chip mounter according to claim 1, characterized in that: A second elastic member is provided at one end of the limiting member away from the sealing member, and the other end of the second elastic member is connected to the inner side wall of the sliding groove.

7. The chip mounter according to claim 1, characterized in that: A pushing groove is provided on a side wall of the movable cavity opposite to the sealing member. The pushing groove can move the limiting member in a direction away from the sealing member after contacting the limiting member.

8. The chip mounter according to claim 1, characterized in that: The side of the moving part away from the nozzle head and the side of the moving cavity away from the nozzle head are both provided with suction parts, and the two suction parts can attract each other after approaching each other.

9. The chip mounter according to claim 1, characterized in that: A connecting sleeve is provided between the suction nozzle and the driving mechanism, and the connecting sleeve enables the suction nozzle to be quickly assembled and disassembled.

10. A chip mounter control system, according to any one of claims 1 to 9, characterized in that: The following steps are involved: S01: Visual positioning, using a high-resolution camera to scan PCB reference points and compensate for PCB manufacturing errors; S02: Component suction, the nozzle moves to the feeder position according to the program instructions and accurately sucks the components through negative pressure; S03: Dynamic calibration: the flying camera or laser sensor detects the angle, position and polarity of the components in real time and corrects the placement offset in real time; S04: Placement execution, the X and Y axis servo systems drive the components to the target coordinates, and the Z axis servo system controls the suction nozzle to press down according to the feedback data of the pressure detection part, releasing the components to the PCB pads.

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