Method for manufacturing a printed circuit board and apparatus for separating a printed circuit board

Abstract

A method for manufacturing a printed wiring board (400) comprises the following steps. A printed wiring board (200) is held using a printed wiring board separating apparatus (100). The printed wiring board (200) is separated in a state where a plurality of pressing portions (5) of the printed wiring board separating apparatus (100) support the printed wiring board (200). The printed wiring board (200) includes a first substrate member (91), a second substrate member (92), and a connecting portion (93). The plurality of pressing portions includes a plurality of first pressing portions (10) and a plurality of second pressing portions (20).In separating the printed wiring board (200), the plurality of first pressing portions (10) are arranged to be separated from each other along a direction in which the connecting portion (93) extends, the plurality of second pressing portions (20) are arranged to be separated from each other along the direction in which the connecting portion (93) extends, and the second substrate member (92) is separated from the first substrate member (91) at the connecting portion (93).

Description

Technical area

[0001] The present disclosure relates to a method for manufacturing a printed circuit board and an apparatus for separating a printed circuit board.

[0002] During the manufacturing of a printed wiring board, a wiring pattern is formed on a printed wiring board, and an electronic component is mounted on the printed wiring board. Afterward, the printed wiring board is separated. When separating the printed wiring board, the printed wiring board must be separated in such a way as to avoid damage to each of the electronic components mounted on the printed wiring board and the wiring pattern provided on the printed wiring board. As an exemplary method for separating a printed wiring board, Japanese Patent Application Laid-Open No. 63-191599 (PTL 1) describes a method for separating a printed wiring board using a substrate separating jig including a jig member in which the printed wiring board is arranged. Citation listPatent literature

[0003] PTL 1: Disclosure of Japanese Patent Application No. 63-191599 Overview of the inventionTechnical problem

[0004] However, in the substrate separator disclosed in PTL 1, when the electronic component is mounted on or around a substrate separation boundary line, it is difficult to secure the surroundings around the substrate separation line while avoiding interference between the substrate separator and the component. Therefore, when separating the printed wiring board, any of the electronic components mounted on the printed wiring board and any of the wiring patterns provided on the printed wiring board may be damaged.

[0005] The present disclosure has been made in view of the above, and has an object to provide a method for manufacturing a printed circuit board and a printed circuit board separating apparatus for suppressing damage to each of the electronic components mounted on a printed circuit board and each of the wiring patterns provided on the printed circuit board. Solution to the problem

[0006] A method for manufacturing a printed wiring board according to the present disclosure includes the following steps. A printed wiring board is held using a printed wiring board separating device. The printed wiring board is separated in a state where a plurality of pressing portions of the printed wiring board separating device support the printed wiring board. The printed wiring board includes a first substrate member, a second substrate member, and a connecting portion. An electronic component is attached to the first substrate member. The second substrate member is to be separated from the first substrate member. The connecting portion connects the first substrate member and the second substrate member. The first substrate member has a first surface and a second surface.The second surface is arranged to face away from the first surface. The plurality of pressing sections includes a plurality of first pressing sections and a plurality of second pressing sections. The plurality of second pressing sections are separated from the plurality of first pressing sections in a thickness direction of the printed wiring board.When separating the printed wiring board, the plurality of first pressing portions are arranged to be separated from each other along a direction in which the connecting portion extends, the plurality of second pressing portions are arranged to be separated from each other along the direction in which the connecting portion extends, the plurality of first pressing portions support the first surface, the plurality of second pressing portions support the second surface, and the second substrate member is separated from the first substrate member at the connecting portion. Advantageous effects of the invention

[0007] According to the method for manufacturing a printed wiring board according to the present disclosure, the printed wiring board is separated in the state where the plurality of pressing portions of the printed wiring board separating device supports the printed wiring board. Therefore, even when the electronic component is mounted above or around the connecting portion, the plurality of pressing portions can support the surroundings around the connecting portion while avoiding the electronic component. In this way, it is possible to prevent damage to each of the electronic components mounted on the printed wiring board and each of the wiring patterns provided on the printed wiring board. Short description of the drawings Fig. 1 is a schematic perspective view showing a configuration of a printed wiring board separating apparatus according to a first embodiment. Fig. Figure 2 is a schematic cross-sectional view taken along a line II-II of the Fig. 1. Fig. 3 is a schematic cross-sectional view taken along a line III-III of the Fig. 2. Fig. 4 is a schematic plan view showing a configuration of a printed wiring board according to the first embodiment. Fig. 5 is a schematic cross-sectional view taken along a line VV of the Fig. 4. Fig. 6 is a flowchart schematically showing a method for manufacturing the printed circuit board according to the first embodiment. Fig. 7 is a schematic perspective view showing a step of preparing the wiring board separating apparatus. Fig. 8 is a schematic perspective view showing a step of holding the printed wiring board using the printed wiring board separating apparatus. Fig. 9 is a schematic perspective view showing a step of separating the printed wiring board. Fig. 10 is a schematic plan view showing positions where a plurality of pressing sections are arranged. Fig. 11 is a schematic cross-sectional view showing the positions where the plurality of pressing portions are arranged. Fig. 12 is a schematic plan view showing a configuration of a printed circuit board according to the first embodiment. Fig. 13 is a schematic plan view showing a configuration of a printed wiring board according to a modification of the first embodiment. Fig. 14 is a schematic perspective view showing a configuration of a printed wiring board separating apparatus according to a second embodiment. Fig. 15 is a schematic cross-sectional view showing a configuration of a printed wiring board separating apparatus according to a third embodiment. Description of the embodiments

[0008] Embodiments of the present disclosure will be described below with reference to figures. Note that in the figures described below, the same or corresponding parts are designated by the same reference numerals and will not be described repeatedly. First Embodiment. (Device for separating a printed wiring board)

[0009] A configuration of a printed wiring board separating apparatus 100 according to a first embodiment will be described with reference to FIG. Fig. 1 to 3. As described in Fig. 1, the printed wiring board separating apparatus 100 mainly includes a base portion 4, a support portion 3, a plurality of pressing portions 5, a first plate 1, a second plate 2, a stopper 6, and support portions 7.

[0010] The base portion 4 has, for example, a plate shape. The thickness direction of the base portion 4 is defined as an up-down direction Z. A support portion 3 is provided on the base portion 4. The support portion 3 supports a printed wiring board 200. Each of the support portions 7 is provided on the base portion 4. A support portion 7 supports the second board 2. A first board 1 is attached to the base portion 4. A second board 2 is attached to the support portion 7. The second board 2 faces the first board 1. The second board 2 is separated from the first board 1. The plurality of pressing portions 5 are attached to each of the first board 1 and the second board 2. The plurality of pressing portions 5 support the printed wiring board 200. A stopper 6 is provided on the base portion 4. The stopper 6 serves to position the printed wiring board 200.The printed wiring board separating device 100 is a device that supports the printed wiring board 200 when separating the printed wiring board 200.

[0011] The support portion 3 includes a fixed rail 31, a movable rail 32, and fastening portions 33. The fixed rail 31 is provided on the base portion 4. The fixed rail 31 extends along a direction perpendicular to the up-down direction Z. The direction in which the fixed rail 31 extends is defined as a front-back direction Y. A direction perpendicular to each of the up-down direction Z and the front-back direction Y is defined as a left-right direction X.

[0012] A movable rail 32 is provided on the base portion 4. The movable rail 32 extends in a front-back direction Y. The movable rail 32 faces the fixed rail 31. The movable rail 32 is separated from the fixed rail 31. A position of the movable rail 32 in a left-right direction X is adjustable. From another perspective, it can be seen that the movable rail 32 can adjust a distance between the movable rail 32 and the fixed rail 31 in the left-right direction X. The fixed rail 31 and the movable rail 32 are configured to support the printed wiring board 200. Fixing portions 33 are provided on the fixed rail 31 and the movable rail 32, respectively.

[0013] The fixed rail 31 has a first bottom surface 41, a first top surface 43, and a first support surface 42. The fixed rail 31 is in contact with the base portion 4 at the first bottom surface 41. The first top surface 43 is located opposite the first bottom surface 41. The fixing portion 33 is provided on the first top surface 43. The first support surface 42 is located opposite the first bottom surface 41. In the up-down direction Z, the first support surface 42 is located between the first bottom surface 41 and the first top surface 43. From another perspective, it can be seen that the first support surface 42 is located between the fixing portion 33 and the base portion 4 in the up-down direction Z. In the left-right direction X, the first support surface 42 is located between the first top surface 43 and the movable rail 32. The first support surface 42 extends in the front-backward direction Y.

[0014] The movable rail 32 has a second bottom surface 51, a second top surface 53, and a second support surface 52. The movable rail 32 is in contact with the base portion 4 at the second bottom surface 51. The second top surface 53 is located opposite the second bottom surface 51. The fastening portion 33 is provided on the second top surface 53. The second support surface 52 is located opposite the second bottom surface 51. In the up-down direction Z, the second support surface 52 is located between the second bottom surface 51 and the second top surface 53. From another perspective, it can be seen that the second support surface 52 is located between the fastening portion 33 and the base portion 4 in the up-down direction Z. In the up-down direction Z, the second support surface 52 is located substantially at the same position as the first support surface 42.In the left-right direction X, the second support surface 52 is located between the first support surface 42 and the second upper surface 53. The second support surface 52 extends in the forward-backward direction Y.

[0015] In the up-down direction Z, the first plate 1 is located away from the first upper side 43 with respect to the first support surface 42. From another perspective, it can be seen that the first support surface 42 is located between the first plate 1 and the first upper side 43 in the up-down direction Z. The first plate 1 extends along a direction perpendicular to the up-down direction Z. A first slot 19 is provided in the first plate 1. The first slot 19 extends in the left-right direction X. In the up-down direction Z, the first slot 19 extends through the first plate 1.

[0016] In the up-down direction Z, the second plate 2 is located away from the first plate 1 with respect to the first support surface 42. From another perspective, it can be seen that the first support surface 42 is located between the first plate 1 and the second plate 2 in the up-down direction Z. The second plate 2 extends along a direction perpendicular to the up-down direction Z. A second slot 29 is provided in the second plate 2. The second slot 29 extends along the left-right direction X. In the up-down direction Z, the second slot 29 extends through the second plate 2. In the front-back direction Y, the second slot 29 may be provided at substantially the same position as the first slot 19. From another perspective, it can be seen that the second slot 29 may overlap the first slot 19 when viewed along the up-down direction Z.

[0017] The plurality of pressing sections 5 are separated from each other. Each of the plurality of pressing sections 5 is formed from a resin. In particular, each of the plurality of pressing sections 5 is formed from an epoxy resin, for example. The plurality of pressing sections 5 includes a plurality of first pressing sections 10 and a plurality of second pressing sections 20.

[0018] Each of the first pressing sections 10 is mounted on the first plate 1 in the first slot 19. The first pressing section 10 extends along the up-down direction Z. The number of first pressing sections 10 is, for example, six. The six first pressing sections 10 are separated from each other. The six first pressing sections 10 are arranged side by side along the left-right direction X.

[0019] In the second slot 29, each of the second pressing sections 20 is attached to the second plate 2. The second pressing section 20 is separated from the first pressing section 10. Specifically, the second pressing section 20 is separated from the first pressing section 10 in the up-down direction Z. The second pressing section 20 extends along the up-down direction Z. The number of second pressing sections 20 is, for example, six. The six second pressing sections 20 are separated from each other. The six second pressing sections 20 are arranged side by side along the left-right direction X. The six second pressing sections 20 respectively face the first pressing sections 10. In the front-back direction Y, the second pressing sections 20 may be located at substantially the same positions as the first pressing sections 10.

[0020] As in the Fig. 2 and Fig. 3, the device 100 for separating a printed wiring board comprises a third plate 63, a first screw 61, a second screw 62 and a spring 64. The Fig. 2 is a cross section parallel to the left-right direction X and intersecting each of the first pressing sections 10 and the second pressing sections 20. Fig. 2 shows an enlarged view of an area comprising a first screw 61, a first pressing section 10, a second screw 62 and a second pressing section 20. The Fig. 3 is a cross section parallel to the front-back direction Y and intersecting the first pressing section 10 and the second pressing section 20.

[0021] As in the Fig. 2 and Fig. 3, the first plate 1 has an outer peripheral portion 16 and an inner peripheral portion 17. The outer peripheral portion 16 is in contact with the base portion 4 (see Fig. 1). The inner peripheral portion 17 is adjacent to the outer peripheral portion 16. The inner peripheral portion 17 is surrounded by the outer peripheral portion 16. The inner peripheral portion 17 is in contact with the first pressing portion 10. In the up-down direction Z, the thickness of the inner peripheral portion 17 is less than the thickness of the outer peripheral portion 16.

[0022] The first pressing portion 10 includes a first main body portion 11 and a first tapered portion 12. The first main body portion 11 is in contact with the inner peripheral portion 17. The first main body portion 11 is surrounded by the outer peripheral portion 16. A first screw hole 18 is provided in the first main body portion 11. The first screw hole 18 extends along the up-down direction Z. The first tapered portion 12 is adjacent to the first main body portion 11. The diameter of the first tapered portion 12 is smaller in a direction away from the first main body portion 11.

[0023] The first tapered portion 12 forms a first tip surface 13. The first tip surface 13 is a portion intended to come into contact with the printed wiring board 200. The diameter of the first tip surface 13 is defined as a first diameter D1. The first diameter D1 is, for example, 3 mm. In the up-down direction Z, the position of the first tip surface 13 can be substantially aligned with the position of each first support surface 42 (see Fig. 1) and every second support surface 52 (see Fig. 1) match.

[0024] A first screw 61 is fixed to the first pressing portion 10 in the first screw hole 18. The first screw 61 is surrounded by the inner peripheral portion 17 and the outer peripheral portion 16. The inner peripheral portion 17 is interposed between the first screw 61 and the first pressing portion 10, thereby fixing the first pressing portion 10 and the first screw 61, respectively. By loosening the fixing between the first screw 61 and the first pressing portion 10, the first pressing portion 10 and the first screw 61 can be moved along the first slot 19. From another perspective, it can be seen that each of the positions of the first pressing portion 10 and the first screw 61 in the left-right direction X can be adjusted by loosening the fixing between the first screw 61 and the first pressing portion 10.In other words, it can be seen that each of the six first pressing sections 10 is provided so as to be adjustable in a position of the first pressing section 10 in the left-right direction X.

[0025] As in the Fig. 2 and Fig. As shown in Figure 3, the second pressing portion 20 includes a second main body portion 21, a second tapered portion 22, a neck portion 24, and a head portion 25. The second tapered portion 22 is adjacent to the second main body portion 21. The second tapered portion 22 faces the first tapered portion 12. The diameter of the second tapered portion 22 is smaller in a direction away from the second main body portion 21.

[0026] The second tapered portion 22 forms a second tip surface 23. The second tip surface 23 is a portion intended to come into contact with the printed wiring board 200. The second tip surface 23 faces the first tip surface 13. The diameter of the second tip surface 23 is defined as a second diameter D2. The second diameter D2 is, for example, substantially equal to the first diameter D1.

[0027] The neck portion 24 is adjacent to the second main body portion 21. The neck portion 24 is arranged remote from the second tapered portion 22 with respect to the second main body portion 21. From another perspective, it can be seen that the second main body portion 21 is arranged between the second tapered portion 22 and the neck portion 24. The neck portion 24 has, for example, a cylindrical columnar shape. The diameter of the neck portion 24 is smaller than the diameter of the second main body portion 21.

[0028] The head portion 25 is adjacent to the neck portion 24. The head portion 25 is located remote from the second main body portion 21 with respect to the neck portion 24. From another perspective, it can be seen that the neck portion 24 is located between the second main body portion 21 and the head portion 25. The head portion 25 has, for example, the shape of a circular plate. The diameter of the head portion 25 is larger than the diameter of the neck portion 24.

[0029] The third plate 63 is provided with a through hole 27 and a second screw hole 28. The through hole 27 extends along the up-down direction Z. In the through hole 27, the second pressing portion 20 is attached to the third plate 63. Specifically, the neck portion 24 is disposed in the through hole 27. From another perspective, it can be seen that the neck portion 24 is surrounded by the third plate 63. The neck portion 24 may be separated from the third plate 63. The head portion 25 may be surrounded by the second plate 63. The head portion 25 may be in contact with the third plate 63. In the through hole 27, the second pressing portion 20 can be moved along the up-down direction Z.

[0030] A second screw hole 28 is provided along the up-down direction Z. In the second screw hole 28, a second screw 62 is fixed to the third plate 63. The second screw 62 is surrounded by the second plate 2. The second plate 2 is arranged between the second screw 62 and the third plate 63, thereby fixing the second screw 62 and the third plate 63, respectively. By loosening the fixing between the second screw 62 and the third plate 63, the second screw 62, the third plate 63, and the second pressing portion 20 can be moved along the second slot 29. From another perspective, by loosening the fixing between the second screw 62 and the third plate 63, the positions of the second screw 62, the third plate 63, and the second pressing portion 20 in the left-right direction X can be adjusted, respectively.In other words, it can be seen that each of the six second pressing sections 20 is provided so as to be adjustable in a position of the second pressing section 20 in the left-right direction X.

[0031] The spring 64 surrounds the neck portion 24. In the up-down direction Z, the spring 64 is provided between the third plate 63 and the second main body portion 21. The spring 64 is in contact with, for example, the third plate 63 and the second main body portion 21. The spring 64 is, for example, a compression coil spring. The spring 64 can exert an elastic force along the up-down direction Z on the third plate 63 and the second pressing portion 20. (Printed wiring board)

[0032] Next, with reference to the Fig. 4 and Fig. 5, a configuration of the printed wiring board 200 according to the present disclosure is described. As in Fig. As shown in Figure 4, the printed wiring board 200 mainly includes a first substrate member 91, a second substrate member 92, a connecting portion 93, electronic components 99, connectors 97, integrated circuits 98, and a wiring pattern (not shown). The thickness direction of the printed wiring board 200 is the up-down direction Z (see Fig. 1).

[0033] The electronic components 99, the integrated circuits 98, and the connectors 97 are each mounted on the first substrate member 91. Specifically, the electronic components 99, the integrated circuits 98, and the connectors 97 are each fixed to the first substrate member 91 with a solder (not shown). The solder includes, for example, tin (Sn), silver (Ag), and copper (Cu). In other words, the solder is, for example, an Sn-Ag-Cu-based solder. The wiring pattern is provided on the first substrate member 91. The wiring pattern is formed of a metal. The wiring pattern electrically connects the electronic components 99, the integrated circuits 98, and the connectors 97 to each other.

[0034] The second substrate member 92 is a part to be separated from the first substrate member 91. The electronic components 99, the integrated circuits 98, and the connectors 97 may not be attached to the second substrate member 92. The second substrate member 92 is separated from the first substrate member 91. A connecting portion 93 is provided between the first substrate member 91 and the second substrate member 92. The connecting portion 93 connects the first substrate member 91 and the second substrate member 92. The connecting portion 93 extends in the left-right direction X.

[0035] The first substrate element 91, the second substrate element 92, and the connecting portion 93 are each formed, for example, from a glass fabric and an epoxy resin. Specifically, the first substrate element 91, the second substrate element 92, and the connecting portion 93 are each formed by impregnating the glass fabric with the epoxy resin.

[0036] The electronic component 99 is, for example, a surface-mounted electronic component. Specifically, the electronic component 99 is, for example, a ceramic capacitor. Viewed in the up-down direction Z below, the electronic component 99 has, for example, a rectangular shape. Viewed in the up-down direction Z, the long side of the electronic component 99 is, for example, 0.6 mm. Viewed in the up-down direction Z, the short side of the electronic component 99 is, for example, 0.3 mm. The ceramic capacitor includes an internal electrode (not shown) and a dielectric ceramic (not shown). The dielectric ceramic is formed of, for example, barium titanate (BaTiO3), calcium titanate (CaTiO3), strontium titanate (SrTiO3), or calcium zirconate (CaZrO3).

[0037] As in Fig. 5, the first substrate element 91 has a first surface 81 and a second surface 82. The second surface 82 is arranged facing away from the first surface 81. The electronic component 99 (see Fig. 4) and the integrated circuit 98 (see Fig. 4) are each mounted on the second surface 82. Each of the electronic components 99 and the integrated circuit 98 may be mounted on the first surface 81. For example, the connector 97 is mounted on the second surface 82. On the other hand, the connector 97 is not mounted on the first surface 81.

[0038] The thickness of the printed wiring board 200 in the up-down direction Z is defined as a first thickness H1. The first thickness H1 is the distance between the first surface 81 and the second surface 82 in the up-down direction Z. The first thickness H1 is, for example, 1.6 mm. The first thickness H1 may be, for example, 0.2 mm or more and 3 mm or less. Fig. The cross section shown in Fig. 5 is a cross section parallel to the front-back direction and intersecting the connector 97.

[0039] As in the Fig. 4 and Fig. As shown in Figure 5, a portion of the connector 97 may be disposed over the connecting portion 93. A portion of the connector 97 may be located over the second substrate element 92. The connector 97 is separated from the connecting portion 93 and the second substrate element 92.

[0040] As in Fig. 5, the connecting portion 93 has a first groove surface 71 and a second groove surface 72. The first groove surface 71 is adjacent to the first surface 81. The second groove surface 72 is arranged remote from the first groove surface 71. The second groove surface 72 is adjacent to the second surface 82. In a cross-section that runs parallel to the front-back direction Y and intersects the connecting element 97, the first groove surface 71 is recessed in a direction from the first surface 81 to the second surface 82. In the cross-section that runs parallel to the front-back direction Y and intersects the connector 97, the second groove surface 72 is recessed in a direction from the second surface 82 to the first surface 81.

[0041] A distance between the first groove surface 71 and the second groove surface 72 in the up-down direction Z is smaller in a direction away from each of the first substrate members 91 and second substrate members 92. From another perspective, it can be seen that the thickness of the connecting portion 93 in the up-down direction Z is minimum at the center of the connecting portion 93 in the Y direction. The thickness of the portion of the connecting portion 93 with the smallest thickness in the up-down direction Z is defined as a second thickness H2. The second thickness H2 is smaller than the first thickness H1. The second thickness H2 is, for example, 0.4 mm. (Method for manufacturing a printed circuit board)

[0042] Next, with reference to the Fig. 6 to 11, a method for manufacturing a printed circuit board 400 according to the first embodiment is described. As in Fig. 6, the method for manufacturing a printed wiring board 400 according to the first embodiment mainly includes: a step (S10) of preparing the printed wiring board separating apparatus; a step (S20) of holding the printed wiring board using the printed wiring board separating apparatus; and a step (S30) of separating the printed wiring board.

[0043] First, the step (S10) for preparing the apparatus for separating a printed wiring board is performed. As shown in Fig. As shown in Fig. 7, a first plate 1 having first pressing portions 10 attached thereto is mounted on a base portion 4. In a state where the fastening between the first screw 61 and the first pressing portion 10 is released, the position of each of the first pressing portions 10 is adjusted in the left-right direction X. By tightening the first screw 61 and the first pressing portion 10, the first pressing portion 10 is fixed.

[0044] The distance between the movable rail 32 and the fixed rail 31 in the left-right direction X is adjusted so that the printed wiring board 200 (see Fig. 4) is supported by the first support surface 42 and the second support surface 52. The position of the stopper 6 in the forward-backward direction Y is adjusted. In this way, a distance between each of the plurality of pressing sections 5 and the connecting section 93 (see Fig. 4) set in the forward-backward direction Y.

[0045] Next, the step (S20) of holding the printed wiring board is performed using the printed wiring board separating apparatus. As shown in Fig. 8, the printed wiring board 200 is arranged on the fixed rail 31 and the movable rail 32. In particular, the printed wiring board 200 is arranged on the first support surface 42 (see Fig. 7) and the second support surface 52 (see Fig. 7). In the left-right direction X, the printed wiring board 200 is arranged between the first top surface 43 and the second top surface 53.

[0046] The first pressing section 10 is in contact with the first surface 81 (see Fig. 5) of the first substrate member 91. The printed wiring board 200 is pressed against the stopper 6. Thus, the printed wiring board 200 is positioned in the front-back direction. The printed wiring board 200 is arranged between each of the fixed rails 31 and movable rails 32 and each of the fixing portions 33. In this way, the printed wiring board 200 is held using the printed wiring board separating apparatus 100.

[0047] Next, the printed wiring board separation step (S30) is performed. Second pressing portions 20 are attached to the second board 2. The position of each second pressing portion 20 in the left-right direction X is adjusted. As shown in Fig. As shown in Figure 9, the second plate 2 with the second pressing portions 20 attached thereto is attached to the support portion 7. Each of the second pressing portions 20 is in contact with the second surface 82 of the first substrate member 91. The first substrate member 91 is arranged between each first pressing portion 10 and each second pressing portion 20. From another perspective, it can be seen that the plurality of second pressing portions 20 face the respective plurality of first pressing portions 10, with the first substrate member 91 arranged therebetween. In this way, the first substrate member 91 is supported.

[0048] In Fig. 10, the first support surface 42, the second support surface 52 and the second tip surfaces 23 of the second pressing sections 20 are each shown by a two-dot chain line. Fig. 11 corresponds to the cross section shown in Fig. 3. As shown in the Fig. 10 and Fig. 11, each of the first pressing sections 10 and each of the second pressing sections 20 is separated from the connecting section 93. The first pressing sections 10 and the second pressing sections 20 are arranged along the direction in which the connecting section 93 extends. Specifically, six first pressing sections 10 are arranged to be separated from each other along the direction in which the connecting section 93 extends. Six second pressing sections 20 are arranged to be separated from each other along the direction in which the connecting section 93 extends. Each of the first pressing sections 10 and each of the second pressing sections 20 are arranged to be separated from each other.

[0049] The first pressing portion 10 is arranged to avoid the electronic component 99, the integrated circuit 98, and the connector 97, respectively. Similarly, the second pressing portion 20 is arranged to avoid the electronic component 99, the integrated circuit 98, and the connector 97, respectively. From another perspective, it can be seen that the first pressing portion 10 and the second pressing portion 20 do not press the electronic component 99, the integrated circuit 98, and the connector 97. Therefore, the electronic component 99, the integrated circuit 98, and the connector 97 can be prevented from being damaged by the pressing of the electronic component 99, the integrated circuit 98, and the connector 97 by the first pressing portion 10 and the second pressing portion 20.Note that the first pressing portion 10 and the second pressing portion 20 must not be in contact with the electronic component 99, the integrated circuit 98, and the connector 97. The first pressing portion 10 and the second pressing portion 20 are separated from the electronic component 99, the integrated circuit 98, and the connector 97. In the left-right direction X, each of the first pressing portion 10 and the second pressing portion 20 is disposed between the first support surface 42 and the second support surface 52.

[0050] Viewed in the up-down direction Z, the shortest distance between each of the plurality of pressing portions 5 and the connecting portion 93 is defined as a first shortest distance E1. In particular, as shown in the Fig. 10 and Fig. 11, the first shortest distance E1 in the second pressing section 20 is the shortest distance between the outer edge of the second tip surface 23 and a boundary between the second surface 82 and the second groove surface 72 when viewed along the up-down direction Z. Similarly, the first shortest distance E1 in the first pressing section 10, viewed in the up-down direction Z, is the shortest distance between the outer edge of the first tip surface 13 and a boundary between the first surface 81 and the first groove surface 71. The first shortest distance E1 is, for example, 3 mm or more and 10 mm or less. The lower limit of the first shortest distance E1 is not particularly limited, but may be, for example, 5 mm or more or 6 mm or more. The upper limit of the first shortest distance E1 is not particularly limited, but may be, for example, 8 mm or less or 7 mm or less.If the first shortest distance E1 is less than 3 mm, each of the first pressing sections 10 and the second pressing sections 20 may interfere with the second substrate member 92 when separating the second substrate member 92 from the first substrate member 91. If the first shortest distance E1 is longer than 10 mm, strain in the first substrate member 91 may not be sufficiently reduced when separating the second substrate member 92 from the first substrate member 91.

[0051] As in Fig. As shown in Figure 10, the shortest distance between each first support surface 42 and each second support surface 52 and the connecting portion 93 in the up-down direction Z is defined as a second shortest distance E2. The second shortest distance E2 may be substantially equal to the first shortest distance E1.

[0052] In the left-right direction X, the distance between two adjacent first pressing sections 10 of six first pressing sections 10 is preferably 30 mm or less. If the distance between two adjacent first pressing sections 10 is greater than 30 mm, the strain in the first substrate member 91 when separating the second substrate member 92 from the first substrate member 91 may not be sufficiently reduced. If the distance between two adjacent first pressing sections 10 is set to 30 mm or less, the strain in the first substrate member 91 can be effectively reduced. Similarly, the distance between two adjacent second pressing sections 20 of six second pressing sections 20 in the left-right direction X is preferably 30 mm or less.If the distance between two adjacent second pressing sections 20 is greater than 30 mm, the strain in the first substrate member 91 may not be sufficiently reduced when separating the second substrate member 92 from the first substrate member 91. If the distance between two adjacent second pressing sections 20 is set to 30 mm or less, the strain in the first substrate member 91 can be effectively reduced. The spring 64 exerts an elastic force on the first substrate member 91 via the second pressing section 20. The elastic force exerted by the spring 64 is preferably, for example, 5 N or more.

[0053] As in Fig. As shown in Figure 11, the position of the second pressing portion 20 in a direction perpendicular to the up-down direction Z is substantially the same as the position of any one of the six first pressing portions 10. From another perspective, it can be seen that the central axis (second central axis 102) of the second pressing portion 20 substantially coincides with the central axis (first central axis 101) of any one of the six first pressing portions 10. Thus, the force applied from the first pressing portion 10 to the printed wiring board 200 and the force applied from the second pressing portion 20 to the printed wiring board 200 are applied along the same straight line. Therefore, the moment of the force applied to the printed wiring board 200 can be reduced. As a result, the strain of the printed wiring board 200 can be reduced.

[0054] Next, a force is applied to the second substrate member 92 along the up-down direction Z. This fractures the thin portion of the connecting portion 93. As a result, the second substrate member 92 is separated from the first substrate member 91 at the connecting portion 93.

[0055] When separating the second substrate member 92 from the first substrate member 91 at the connecting portion 93, each of the plurality of pressing portions 5 supports the first substrate member 91. Specifically, the first pressing portion 10 supports the first surface 81. The second pressing portion 20 supports the second surface 82. The printed wiring board 200 is separated in a state where the plurality of pressing portions 5 of the printed wiring board separating apparatus 100 support the printed wiring board 200. In this way, the printed circuit board 400 is manufactured. (Printed circuit board configuration)

[0056] Next, with reference to Fig. 12, a configuration of the printed circuit board 400 according to the first embodiment is described. As in Fig. As shown in Figure 12, the printed circuit board 400 mainly includes a first substrate member 91, electronic components 99, integrated circuits 98, connectors 97, and the wiring pattern (not shown). Each of the electronic components 99, integrated circuits 98, and connectors 97 is connected to the first substrate member 91 by solder (not shown). Each of the electronic components 99 and integrated circuits 98 can be attached to either surface of the first substrate member 91. The connector 97 is attached to the second surface 82 of the first substrate member 91. The wiring pattern electrically connects the electronic components 99, the integrated circuits 98, and the connectors 97. Viewed in the thickness of the printed circuit board 400, the connector 97 protrudes outward with respect to the first substrate member 91.

[0057] Next, the functions and effects of the printed wiring board separating apparatus 100 according to the first embodiment will be described.

[0058] Normally, when the printed wiring board 200 is separated, stress is applied to the surroundings around the connecting portion 93. Therefore, strain is generated in the surroundings around the connecting portion 93. If the printed wiring board 200 is separated without supporting the surroundings around the connecting portion 93, the strain in the first substrate member 91 becomes excessively large at a portion around the connecting portion 93. In this case, the electronic components mounted around the connecting portion 93 and the wiring patterns of the substrate may be damaged. In particular, if the strain in the first substrate member 91 is excessively large at a portion where a ceramic capacitor is mounted, a crack will be generated in the ceramic capacitor, causing damage to the ceramic capacitor.

[0059] When the pressing portion is a one-piece component, it is difficult to arrange the pressing portion so that the component mounted above or around the connecting portion 93 is not avoided when supporting the first substrate member 91. As a result, the electronic components 99 mounted on the printed wiring board 200 and the wiring pattern provided on the printed wiring board 200 may be damaged.

[0060] According to the method for manufacturing the printed wiring board 400 according to the first embodiment, the printed wiring board is separated in the state where the plurality of pressing portions 5 of the printed wiring board separating apparatus 100 supports the printed wiring board 200. The plurality of pressing portions 5 include the plurality of first pressing portions 10 and the plurality of second pressing portions 20. The plurality of first pressing portions 10 are arranged to be separated from each other along the direction in which the connecting portion 93 extends. The plurality of second pressing portions 20 are arranged to be separated from each other along the direction in which the connecting portion 93 extends.Therefore, even when the electronic component 99 is mounted above or around the connecting portion 93, the plurality of pressing portions 5 can support the surroundings around the connecting portion 93 while surrounding the electronic component 99. Thus, when the printed wiring board 200 is separated, the strain in the first substrate member 91 at the portion around the connecting portion 93 can be reduced. This can prevent damage to the electronic components 99 mounted on the printed wiring board 200 and the wiring patterns provided on the printed wiring board 200.

[0061] Furthermore, according to the method for manufacturing the printed circuit board 400 according to the first embodiment, a printed circuit board 400 with high reliability can be obtained. By manufacturing an electronic device using the printed circuit board 400, an electronic device with high reliability can be obtained.

[0062] According to the method for manufacturing the printed wiring board 400 according to the first embodiment, in the step of separating the printed wiring board, the first pressing portion 10 supports the first surface 81. The second pressing portion 20 supports the second surface 82. Therefore, the elongation of the first substrate member 91 in the up-down direction Z when separating the printed wiring board 200 can be reduced compared to a case where only one of the first surface 81 and the second surface 82 is supported. Thus, damage to the electronic components 99 mounted on the printed wiring board 200 and the wiring patterns provided on the printed wiring board 200 can be further suppressed.

[0063] According to the method for manufacturing the printed circuit board 400 according to the first embodiment, each of the plurality of pressing portions 5 is formed of a resin. The resin is softer than the metal of the wiring pattern of the printed wiring board 200. Therefore, even if each of the plurality of pressing portions 5 and the wiring pattern are in contact with each other, when the plurality of pressing portions 5 support the printed wiring board 200, damage to the wiring pattern can be prevented.

[0064] If the first shortest distance E1 is too small, each of the plurality of pressing portions 5 may interfere with the second substrate member 92 when separating the second substrate member 92 from the first substrate member 91. If the first shortest distance E1 is too large, the strain in the first substrate member 91 may not be sufficiently reduced when separating the second substrate member 92 from the first substrate member 91. According to the method for manufacturing the printed wiring board 400 according to the first embodiment, in the printed wiring board separating step (S30), the first shortest distance E1 between each of the plurality of pressing portions 5 and the connecting portion 93 along the up-down direction Z is 3 mm or more and 10 mm or less.Therefore, it is possible to sufficiently reduce the strain in the first substrate member 91 while avoiding the interference between each of the plurality of pressing portions 5 and the second substrate member 92.

[0065] When the pressing portion 5 is a one-piece component, a special pressing portion 5 is required that corresponds to the arrangement of the components in the printed wiring board 200, for example, to avoid a component being mounted above or around the connecting portion 93. According to the printed wiring board separating apparatus 100 of the first embodiment, each of the first pressing portions 10 and the second pressing portions 20 is configured to be adjustable in position in the left-right direction X. Thus, the position of each of the plurality of pressing portions 5 can be adjusted for each substrate type to match the position of the connector 97 arranged above the connecting portion 93.Therefore, the portion of the first substrate member 91 can be supported around the connecting portion 93 without having to provide a dedicated pressing portion according to the arrangement of the components of the printed wiring board 200.

[0066] It should be noted that it has been described above that the connecting portion 93 has a first groove surface 71 and a second groove surface 72; however, the configuration of the printed wiring board separating apparatus 100 according to the present disclosure is not limited to such a configuration. In particular, as shown in Fig. 13, perforations may be provided in the connecting portion 93. From another perspective, it can be seen that through holes 95 may be provided in the connecting portion 93.

[0067] The connecting portion 93 may include connecting elements 94. Viewed in the up-down direction Z, each of the connecting elements 94 is a portion of the printed wiring board 200 included in a region where the through-hole 95 extends along the direction in which the through-hole 95 extends. The connecting element 94 connects the first substrate member 91 and the second substrate member 92. The connecting portion 93 is a combination of a region where the through-hole 95 is provided and a region where the connecting element 94 is located.

[0068] When viewed in the up-down direction Z, the first shortest distance E1 is the shortest distance between the outer edge of the connecting portion 93 and the outer edge of each of the plurality of pressing portions 5. From another perspective, when viewed in the up-down direction Z, the shortest distance in the Y direction between the wall surface of the through-hole 95 and the outer edge of each of the plurality of pressing portions 5 is the first shortest distance E1.

[0069] The printed wiring board 200 may be formed, for example, from a base member with insulating properties obtained by incorporating a polyimide resin, a phenolic resin, or the like into a glass mat, a paper base member, or the like. The first pressing section 10 and the second pressing section 20 may each be formed from a resin such as MC nylon (brand name) or polycarbonate.

[0070] The electronic component 99 may be a resistor, an inductor, a thermistor, or the like. The solder may comprise bismuth (Bi), indium (In), antimony (Sb), or lead (Pb). The solder may be formed from a Sn-Cu-based solder, a Sn-Bi-based solder, a Sn-In-based solder, a Sn-Sb-based solder, or a Sn-Pb-based solder.

[0071] A part of the connector 97 may not be located above the connecting portion 93. The number of the first pressing portions 10 is not limited to six. The number of the first pressing portions 10 may be, for example, 2 or more and 30 or less. The number of the second pressing portions 20 is not limited to six. The number of the second pressing portions 20 may be, for example, 2 or more and 30 or less. The second shortest distance E2 may be smaller than the first shortest distance E1. The second shortest distance E2 may be larger than the first shortest distance E1. In the front-back direction Y, each of the first pressing portion 10 and the second pressing portion 20 may be arranged between the first support surface 42 and the second substrate member 92.

[0072] The outer shape of the first pressing section 10 may be a cylindrical columnar shape, an elliptical columnar shape, a quadrangular columnar shape, or a polygonal columnar shape. When the outer shape of the first pressing section 10 is a quadrangular columnar shape, the shape of the first tip surface 13 may be a square shape or a rectangular shape. Similarly, the outer shape of the second pressing section 20 may be a cylindrical columnar shape, an elliptical columnar shape, a quadrangular columnar shape, or a polygonal columnar shape. When the outer shape of the second pressing section 20 is a quadrangular columnar shape, the shape of the second tip surface 23 may be a square shape, a rectangular shape, or a polygonal shape. Second embodiment.

[0073] Next, a configuration of a printed wiring board separating apparatus 100 according to a second embodiment will be described with reference to Fig. 14. The printed wiring board separating apparatus 100 according to the second embodiment differs from the printed wiring board separating apparatus 100 according to the first embodiment mainly in that the second pressing portion 20 is not provided, and the other points are substantially the same configuration as the printed wiring board separating apparatus 100 according to the first embodiment. The following mainly describes the differences from the configuration of the printed wiring board separating apparatus 100 according to the first embodiment.

[0074] As in Fig. As shown in FIG. 14, the printed wiring board separating apparatus according to the second embodiment may include neither the second pressing portion 20 nor the second board 2. In the printed wiring board separating step (S30), the first pressing portion 10 supports the first substrate member 91 when separating the second substrate member 92 from the first substrate member 91.

[0075] The surface of the first substrate member 91 supported by the first pressing portion 10 is preferably a surface on which no connector 97 is attached. The direction of the force applied to the second substrate member 92 from the first substrate member 91 when separating the second substrate member 92 is a direction along the up-down direction Z and from the first substrate member 91 to the first pressing portion 10. In other words, the force is preferably applied to the second substrate member 92 along the direction from the first substrate member 91 to the first pressing portion 10 in a state where the first pressing portion 10 supports the surface to which the connector 97 is not attached. Thus, the first substrate member 91 can be supported using the first pressing portion 10 while preventing the second substrate member 92 from coming into contact with the connector 97. Third embodiment.

[0076] Next, a configuration of a printed wiring board separating apparatus 100 according to a third embodiment will be described with reference to Fig. 15. The printed wiring board separating apparatus 100 according to the third embodiment differs from the printed wiring board separating apparatus 100 according to the first embodiment mainly in that a pressure sensor 9 is provided, and the other points are substantially the same as the configuration of the printed wiring board separating apparatus 100 according to the first embodiment. The differences from the configuration of the printed wiring board separating apparatus 100 according to the first embodiment will be mainly described below. Fig. 15 corresponds to the cross section shown in Fig. 3 shown cross section.

[0077] As in Fig.As shown in Figure 15, the printed wiring board separating apparatus 100 includes a pressure sensor 9. In the up-down direction Z, the pressure sensor 9 is provided, for example, between the second pressing portion 20 and the third plate 63. Specifically, the pressure sensor 9 is provided, for example, between the third plate 63 and the spring 64 in the up-down direction Z. The pressure sensor 9 may surround the neck portion 24. The pressure sensor 9 is, for example, a piezoelectric element type.

[0078] The pressure sensor 9 detects the force exerted by the first substrate member 91 on the plurality of pressing portions 5. Specifically, when a force in the direction from the printed wiring board 200 to the second pressing portion 20 is applied to the second pressing portion 20, the pressure sensor 9 is disposed between the spring 64 and the third plate 63. In this case, the force exerted on the second pressing portion 20 is transmitted to the pressure sensor 9 via the spring 64. Thus, the pressure sensor 9 indirectly detects the force exerted by the first substrate member 91 on the second pressing portion 20.

[0079] When an abnormality occurs in the printed wiring board separating apparatus 100 during the fixing of the printed wiring board 200 to the plurality of pressing portions 5, the magnitude of the force exerted by the first substrate member 91 on each of the plurality of pressing portions 5 falls outside an assumed force magnitude range. Therefore, the abnormality in the printed wiring board separating apparatus 100 can be detected by detecting the force magnitude with the pressure sensor 9.

[0080] Examples of abnormalities in the printed wiring board separating apparatus 100 include: an abnormality in attaching the first board 1 or the second board 2; a positional deviation of the first pressing section 10 or the second pressing section 20; damage to the first pressing section 10 or the second pressing section 20; a reduced spring force of the spring 64 due to deterioration of the spring 64; an abnormality in attaching the first pressing section 10 to the first board 1; an abnormality in attaching the second pressing section 20 to the second board 2; and the like.

[0081] Similarly, the above-described abnormality in separating the second substrate member 92 from the first substrate member 91 can be detected using the pressure sensor 9. If there is an abnormality in the shape of the connecting portion 93, an excessively large force is applied to the first substrate member 91 when separating the second substrate member 92 from the first substrate member 91. Therefore, the force applied by the first substrate member 91 to each of the plurality of pressing portions 5 exceeds the assumed force magnitude range. Therefore, the abnormality in the shape of the connecting portion 93 in separating the second substrate member 92 from the first substrate member 91 can be detected using the pressure sensor 9.

[0082] When the second substrate member 92 is separated from the first substrate member 91 in a state where either the printed wiring board separating apparatus 100 or the connecting portion 93 has an abnormality, the strain of the first substrate member 91 may become excessively large. The printed wiring board separating apparatus 100 according to the third embodiment includes a pressure sensor 9. This allows the abnormality in the printed wiring board separating apparatus 100 or the connecting portion 93 to be detected. Thus, the second substrate member 92 can be prevented from being separated from the first substrate member 91 in a state where an abnormality exists in the printed wiring board separating apparatus 100 or the connecting portion 93.This can prevent the electronic components 99 attached to the printed wiring board 200 and the wiring patterns provided on the printed wiring board 200 from being damaged.

[0083] As described above, the pressure sensor 9 is a piezoelectric element; however, the configuration of the printed wiring board separating apparatus 100 according to the present disclosure is not limited to such a configuration. Specifically, the pressure sensor 9 may be a resistance film type or a capacitive type. In the up-down direction Z, the pressure sensor 9 may be provided between the first pressing portion 10 and the spring 64. The pressure sensor 9 may be provided between the first pressing portion 10 and the first board 1.

[0084] The embodiments disclosed herein are in all respects illustrative and not restrictive. The scope of the present disclosure is defined by the terms of the claims, not by the embodiments described above, and is intended to include all modifications that fall within the scope and meaning of the terms of the claims.

[0085] In the following, various embodiments of the present disclosure are described in summary form as supplementary notes. (Supplementary Note 1)

[0086] A method of manufacturing a printed circuit board, the method comprising: Holding a printed wiring board using a printed wiring board separating device; and Separating the printed wiring board in a state where a plurality of pressing portions of the printed wiring board separating apparatus support the printed wiring board, wherein the printed wiring board comprises: a first substrate element to which an electronic component is attached, a second substrate element to be separated from the first substrate element, and a connecting portion connecting the first substrate element and the second substrate element, wherein the first substrate element has a first surface and a second surface facing away from the first surface, wherein the plurality of pressing sections comprises: a plurality of first pressing sections and a plurality of second pressing portions separated from the plurality of first pressing portions in a thickness direction of the printed wiring board, and wherein, in separating the printed wiring board, the plurality of first pressing portions are arranged so as to be separated from each other along a direction in which the connecting portion extends, wherein, in separating the printed wiring board, the plurality of second pressing portions are arranged so as to be separated from each other along the direction in which the connecting portion extends, wherein, in separating the printed wiring board, the plurality of first pressing portions support the first surface, wherein, in separating the printed wiring board, the plurality of second pressing portions support the second surface, and wherein, in separating the printed wiring board, the second substrate member is separated from the first substrate member at the connecting portion. (Supplementary Note 2)

[0087] A method of manufacturing a printed circuit board according to claim 1, wherein, in separating the printed wiring board, the plurality of second pressing portions face the respective plurality of first pressing portions, wherein the printed wiring board is arranged between each of the plurality of second pressing sections and each of the plurality of first pressing sections. (Supplementary Note 3)

[0088] A method of manufacturing a printed circuit board according to claim 1 or 2, wherein each of the plurality of first pressing portions is provided so as to be adjustable in a position of the first pressing portion in the direction in which the connecting portion extends, and wherein each of the plurality of second pressing portions is provided so as to be adjustable in a position of the second pressing portion in the direction in which the connecting portion extends. (Supplementary Note 4)

[0089] A method of manufacturing a printed circuit board according to claim 3, wherein, in separating the printed wiring board, none of the plurality of first pressing portions and none of the plurality of second pressing portions presses the electronic component. (Supplementary Note 5)

[0090] A method of manufacturing a printed circuit board according to claim 3, wherein a distance between two adjacent first pressing portions of the plurality of first pressing portions in the direction in which the connecting portion extends is 30 mm or less, and wherein a distance between two adjacent second pressing portions of the plurality of second pressing portions in the direction in which the connecting portion extends is 30 mm or less. (Supplementary Note 6)

[0091] A method of manufacturing a printed circuit board according to claim 1 or 2, wherein each of the plurality of pressing portions is formed of a resin. (Supplementary Note 7)

[0092] A method of manufacturing a printed circuit board according to claim 1 or 2, wherein the device for separating a printed wiring board comprises a pressure sensor, and wherein, upon separating the printed wiring board, the pressure sensor detects a force exerted by the printed wiring board on the plurality of pressing portions. (Supplementary Note 8)

[0093] A method of manufacturing a printed circuit board according to claim 1 or 2, wherein, in separating the printed wiring board, a shortest distance between each of the plurality of pressing portions and the connecting portion along the thickness direction of the printed wiring board is 3 mm or more and 10 mm or less. (Supplementary Note 9)

[0094] Apparatus for separating a printed wiring board, comprising: a support portion that supports a printed wiring board; and a plurality of pressing sections supporting the printed wiring board, wherein the printed wiring board comprises: a first substrate element to which an electronic component is attached, a second substrate element to be separated from the first substrate element, and a connecting portion connecting the first substrate element and the second substrate element, wherein the first substrate element has a first surface and a second surface arranged to face away from the first surface, wherein the plurality of pressing sections comprises: a plurality of first pressing sections separated from each other, and a plurality of second pressing sections separated from and separated from the plurality of first pressing sections in a thickness direction of the printed wiring board, wherein the plurality of first pressing portions are arranged along a direction in which the connecting portion extends, wherein the plurality of second pressing portions are arranged along the direction in which the connecting portion extends, wherein each of the plurality of first pressing portions and the plurality of second pressing portions supports the first substrate member when the second substrate member is separated from the first substrate member at the connecting portion, wherein the plurality of first pressing portions support the first surface, and wherein the plurality of second pressing portions support the second surface. (Supplementary Note 10)

[0095] A printed wiring board separating apparatus according to claim 9, wherein each of the plurality of first pressing portions is provided so as to be adjustable in a position of the first pressing portion in the direction in which the connecting portion extends, and wherein each of the plurality of second pressing portions is provided so as to be adjustable in a position of the second pressing portion in the direction in which the connecting portion extends. (Supplementary Note 11)

[0096] A printed wiring board separating apparatus according to claim 9 or 10, wherein each of the plurality of pressing portions is formed of a resin. (Supplementary Note 12)

[0097] A printed wiring board separating apparatus according to claim 9 or 10, comprising: a pressure sensor that detects a force exerted by the first substrate member on each of the plurality of pressing portions. List of reference symbols 1 first plate; 2 second plate; 3 bracket section; 4 base section; 5 pressing section; 6 stop; 7 support section; 9 pressure sensor; 10 first pressing section; 11 first main body section; 12 first tapered section; 13 first tip surface; 16 outer peripheral section; 17 inner peripheral section; 18 first screw hole; 19 first slot; 20 second pressing section; 21 second main body section; 22 second tapered section; 23 second tip surface; 24 neck section; 25 head section; 27 through hole; 28 second screw hole; 29 second slot; 31 fixed rail; 32 movable rail; 33 fastening section; 41 first subpage; 42 first support surface; 43 first top side; 51 second subpage; 52 second support surface; 53 second top side; 61 first screw; 62 second screw; 63 third plate; 64 spring; 71 first groove surface; 72 second groove surface; 81 first area; 82 second area; 91 first substrate element; 92 second substrate element; 93 connecting section; 94 connecting element; 95 through hole; 97 connectors; 98 integrated circuit; 99 electronic components; 100 Device for separating a printed circuit board; 101 first central axis; 102 second central axis; 200 printed wiring board; 400 printed circuit boards; D1 first diameter; D2 second diameter; E1 first shortest distance; E2 second shortest distance; H1 first thickness; H2 second thickness; X Left-right direction; Y forward-backward direction; Z Up-down direction. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 63-191599 [0002, 0003]

Claims

[1] A method of manufacturing a printed circuit board, the method comprising: Holding a printed wiring board using a printed wiring board separating device; and Separating the printed wiring board in a state where a plurality of pressing portions of the printed wiring board separating apparatus support the printed wiring board, wherein the printed wiring board comprises: a first substrate element to which an electronic component is attached, a second substrate element to be separated from the first substrate element, and a connecting portion connecting the first substrate element and the second substrate element, wherein the first substrate element has a first surface and a second surface facing away from the first surface, wherein the plurality of pressing sections comprises: a plurality of first pressing sections and a plurality of second pressing portions separated from the plurality of first pressing portions in a thickness direction of the printed wiring board, and wherein, in separating the printed wiring board, the plurality of first pressing portions are arranged so as to be separated from each other along a direction in which the connecting portion extends, wherein, in separating the printed wiring board, the plurality of second pressing portions are arranged so as to be separated from each other along the direction in which the connecting portion extends, wherein, in separating the printed wiring board, the plurality of first pressing portions support the first surface, wherein, in separating the printed wiring board, the plurality of second pressing portions support the second surface, and wherein, in separating the printed wiring board, the second substrate member is separated from the first substrate member at the connecting portion. [2] A method of manufacturing a printed circuit board according to claim 1, wherein, in separating the printed wiring board, the plurality of second pressing portions face the respective plurality of first pressing portions, wherein the printed wiring board is arranged between each of the plurality of second pressing sections and each of the plurality of first pressing sections. [3] A method of manufacturing a printed circuit board according to claim 1 or 2, wherein each of the plurality of first pressing portions is provided so as to be adjustable in a position of the first pressing portion in the direction in which the connecting portion extends, and wherein each of the plurality of second pressing portions is provided so as to be adjustable in a position of the second pressing portion in the direction in which the connecting portion extends. [4] A method for manufacturing a printed wiring board according to claim 3, wherein, in separating the printed wiring board, none of the plurality of first pressing portions and none of the plurality of second pressing portions presses the electronic component. [5] A method of manufacturing a printed circuit board according to claim 3, wherein a distance between two adjacent first pressing portions of the plurality of first pressing portions in the direction in which the connecting portion extends is 30 mm or less, and wherein a distance between two adjacent second pressing portions of the plurality of second pressing portions in the direction in which the connecting portion extends is 30 mm or less. [6] A method of manufacturing a printed circuit board according to claim 1 or 2, wherein each of the plurality of pressing portions is formed of a resin. [7] A method of manufacturing a printed circuit board according to claim 1 or 2, wherein the device for separating a printed wiring board comprises a pressure sensor, and wherein, upon separating the printed wiring board, the pressure sensor detects a force exerted by the printed wiring board on the plurality of pressing portions. [8] A method for manufacturing a printed wiring board according to claim 1 or 2, wherein, in said separating step, a shortest distance between each of the plurality of pressing portions and the connecting portion along the thickness direction of the printed wiring board is 3 mm or more and 10 mm or less. [9] Apparatus for separating a printed wiring board, comprising: a support portion that supports a printed wiring board; and a plurality of pressing sections supporting the printed wiring board, wherein the printed wiring board comprises: a first substrate element to which an electronic component is attached, a second substrate element to be separated from the first substrate element, and a connecting portion connecting the first substrate element and the second substrate element, wherein the first substrate element has a first surface and a second surface arranged to face away from the first surface, wherein the plurality of pressing sections comprises: a plurality of first pressing sections separated from each other, and a plurality of second pressing sections separated from and separated from the plurality of first pressing sections in a thickness direction of the printed wiring board, wherein the plurality of first pressing portions are arranged along a direction in which the connecting portion extends, wherein the plurality of second pressing portions are arranged along the direction in which the connecting portion extends, wherein each of the plurality of first pressing portions and the plurality of second pressing portions supports the first substrate member when the second substrate member is separated from the first substrate member at the connecting portion, wherein the plurality of first pressing sections support the first surface, and wherein the plurality of second pressing portions support the second surface. [10] A printed wiring board separating apparatus according to claim 9, wherein each of the plurality of first pressing portions is provided so as to be adjustable in a position of the first pressing portion in the direction in which the connecting portion extends, and wherein each of the plurality of second pressing portions is provided so as to be adjustable in a position of the second pressing portion in the direction in which the connecting portion extends. [11] A printed wiring board separating apparatus according to claim 9 or 10, wherein each of the plurality of pressing portions is formed of a resin. [12] A printed wiring board separating apparatus according to claim 9 or 10, comprising: a pressure sensor that detects a force exerted by the first substrate member on each of the plurality of pressing portions.

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