ADHESIVE STRUCTURE, SEMICONDUCTOR DEVICE, MOTOR, FLYING OBJECT AND METHOD FOR MAKING AN ADHESIVE STRUCTURE

Abstract

An adhesive structure (100) comprises a porous thin film (11) formed from an epoxy-based resin, in which pores are formed by a porous framework, and an adhesive (13) is impregnated into the pores of the porous thin film (11). This configuration not only allows for sufficient reduction of thermal stress but also achieves excellent adhesion.

Description

TECHNICAL AREA

[0001] The present invention relates to an adhesive structure, a semiconductor device, a motor, a flying object and a method for producing an adhesive structure. TECHNICAL BACKGROUND

[0002] In recent years, the high-temperature resistance of drive components for motors, semiconductor devices, etc., has been investigated, and temperature resistance has also been required for adhesives used to bond components. Examples of adhesives that exhibit high bond strength and can withstand high temperatures include epoxy-based adhesives. Conventional epoxy-based adhesives only have a heat resistance of approximately 180 °C at most, but in recent years, adhesives with a heat resistance of over 200 °C have become available.

[0003] In general, an adhesive with high heat resistance exhibits problems such as becoming brittle when cured and lacking high adhesive strength. Furthermore, under thermal stress due to temperature cycling, etc., the adhesive strength cannot be maintained, leading to cracking or detachment from the bonding surface.

[0004] When used for connecting semiconductor devices to adequately reduce thermal stress on an adhesive between a semiconductor element and a wiring circuit board, patent document 1, for example, discloses an adhesive surface body with a structure in which adhesive layers are formed on both surfaces of a planar porous base material. QUOTE LIST PATENT DOCUMENT

[0005] Patent document 1: Japanese patent application disclosure JP 2000-17240A (paragraph

[0010] andFig. 1) SUMMARY OF THE INVENTION TASK TO BE SOLVED WITH THE INVENTION

[0006] However, in such an adhesive surface body according to patent document 1, an adhesive is used for the adhesive layers, and therefore it is not possible to achieve a strength required for structural bonding.

[0007] The present invention was conceived to solve the above problem, and the object of the present invention is to provide an adhesive structure that can sufficiently dissipate thermal stress and has excellent adhesion, a semiconductor device, a motor, a flying object and a method for producing an adhesive structure. MEANS OF SOLVING THE TASK

[0008] An adhesive structure according to the present invention comprises a thin film formed from an epoxy-based resin, in which pores are formed by a porous framework. The pores of the thin film are impregnated with an adhesive.

[0009] A semiconductor device according to the present invention comprises: a semiconductor element arranged on a surface of a substrate via the adhesive structure; a connecting wire connecting an electrode arranged on the surface of the substrate and an electrode arranged on a surface of the semiconductor element; and a sealing resin sealing the semiconductor element.

[0010] An engine according to the present invention has the following features: a cylindrical steel plate attached to a shaft; and a magnet connected to an outer circumference of the steel plate via the adhesive structure.

[0011] A flying object according to the present invention is equipped with a compressor. The adhesive structure is used to connect a sensor and a component used in the compressor.

[0012] A method for producing an adhesive structure according to the present invention comprises: a step of applying a solution of an epoxy-based resin to a substrate and carrying out heat curing to produce a thin film of a desired thickness; and a step of impregnating an adhesive into the thin film detached from the substrate. IMPACT OF THE INVENTION

[0013] An adhesive structure according to the present invention not only makes it possible to sufficiently reduce thermal stresses, but also to achieve excellent adhesion. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a sectional view showing the configuration of an adhesive structure according to embodiment 1. Fig. Figure 2 is a sectional view showing a state of the connection using the adhesive structure according to embodiment 1. Fig. Figure 3 is a diagram showing the rate of change of the adhesive strength of the adhesive structure according to embodiment 1. Fig. Figure 4 is a sectional view showing the configuration of a semiconductor device using an adhesive structure according to embodiment 2. Fig. Figure 5 is a sectional view showing the configuration of an SPM motor using an adhesive structure according to embodiment 3. Fig. Figure 6 is a block diagram showing the configuration of an adhesive structure according to embodiment 4. Fig. Figure 7 is a system flow diagram showing an operational sequence of an aeronautical system using the adhesive structure according to embodiment 4. DESCRIPTION OF THE EXECUTION FORMS Execution form 1

[0014] Fig. Figure 1 is a sectional view showing the configuration of an adhesive structure according to embodiment 1 of the present invention. As shown in Fig. Figure 1 shows an adhesive structure 100 according to the present embodiment 1, composed of a porous thin layer 11 and an adhesive 13 which is impregnated in the porous thin layer 11.

[0015] The porous thin film 11 is a thin film with a porous framework. It is composed of a resin obtained by heating and curing an epoxy primer and an amine-based curing agent as its main components. A phase-separation material is added during curing, resulting in a polymerization-induced phase-separation mechanism. During curing, a region of crosslinking polymerization and a region of phase separation are randomly formed, enabling the fabrication of a porous thin film with a three-dimensional continuous network framework and pores.

[0016] Examples of the epoxy monomer used here include aromatic epoxy resins, such as a bisphenol-A type epoxy resin, a hydrogenated bisphenol-A type epoxy resin, a brominated bisphenol-A type epoxy resin, a bisphenol-F type epoxy resin, a bisphenol-E type epoxy resin, a bisphenol-AD type epoxy resin, a stilbene type epoxy resin, a biphenyl type epoxy resin, a bisphenol-A novolak type epoxy resin, a cresol novolak type epoxy resin, and an epoxy resin containing a heteroaromatic ring, and non-aromatic epoxy resins, such as... Examples include an aliphatic glycidyl ether epoxy resin, an aliphatic glycidyl ester epoxy resin, an alicyclic glycidyl ether epoxy resin, and an alicyclic glycidyl ester epoxy resin. For these epoxides, the number of epoxy groups as functional groups in the monomer is not limited, but bifunctional or tetrafunctional epoxy monomers are desirable.These epoxy monomers can be used alone or in combinations of two or more. Their combinations make it possible to modify properties such as flexibility, pore size, heat resistance, and strength / elongation.

[0017] Examples of hardening agents also include aromatic amines, such as m-phenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, benzyldimethylamine and dimethylaminomethylbenzene; aliphatic amines, such as ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, iminobispropylamine, bis(hexamethylene)triamine, trimethylhexamethylenediamine and polyetherdiamine; cyclic aliphatic amines, such as isophoronediamine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane and bis(4-aminocyclohexyl)methane; amines with a heteroaromatic ring and modified products thereof. Furthermore, it is also possible to use a non-aromatic curing agent, such as an aliphatic polyamide amine consisting of a polyamine and a dimer acid. These curing agents can be used alone or in combination with two or more.Regarding the ratio of the hardening agent to the epoxy monomer, the hardening agent mixed with the epoxy monomer is preferably in a range of 40 to 300 parts by weight, based on 100 parts by weight of unhardened epoxy.

[0018] To form pores during the heating and curing of a thermosetting resin, it is necessary to select a phase-separating pore former that induces phase separation. Here, the phase-separating pore former is one that can dissolve an uncured monomer (or polymer) and / or a curing agent that form an epoxy resin. After the monomer (or uncured polymer) and the curing agent have polymerized, the uncured monomer (or polymer) and / or the curing agent, phase-separated from a polymerized product, are removed. Examples of phase-separating pore formers include cellosolves, such as methylcellosolve and ethylcellosolve; esters, such as ethylene glycol monomethyl ether acetate and propylene glycol monomethyl ether acetate; glycols, such as polyethylene glycol and polypropylene glycol; and ethers, such as... B. Polyoxyethylene monomethyl ether and polyoxyethylene dimethyl ether.These phase-separating pore-forming agents can be used alone or in combination with two or more. Diethylene glycol, triethylene glycol, tetraethylene glycol, or polyethylene glycol are preferably used as phase-separating pore-forming agents. The amount of phase-separating pore-forming agent added is preferably in the range of 10 to 400 parts by weight, based on 100 parts by weight of the uncured epoxy / curing agent.

[0019] For adhesive 13, when used alone, an adhesive is used that has physical properties of an adhesion strength of 10 MPa or more between steel plates (SPCCs, steel plate cold commercials) and a glass transition temperature of 150 °C or higher.

[0020] Examples of adhesive 13 include a mixture of epoxy resins with a high glass transition temperature, such as 4,4'-methylenebis(N,N-diglycidylaniline), N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane, N,N,N',N'-Tetraglycidyl-m-xylenediamine and 2,2'-Diallylbisphenol-A-diallyl ether, aromatic amines, such as phenylenediamine, 4,4'-Dimethyldiphenylmethane, 3,3'-Diaminodiphenylsulfone, diaminocyclohexane, N,N'-diphenyl-1,4-phenylenediamine and 4,4'-diaminodiphenyl ether, etc. Furthermore, it is also possible to use commercially available adhesives such as Y612 from CEMEDINE CO., LTD, GTH-T from Panacol-Elosol GmbH, TB2237J from ThreeBond Co., Ltd. and CLS-1194 from ADEKA CORPORATION, which have high heat resistance and a higher modulus of elasticity than the porous thin film 11.

[0021] The elastic modulus of these adhesives 13 is between 2000 and 10000 MPa, and therefore the difference in elastic modulus between the adhesive 13 and the porous thin film 11 is large. The ratio of the elastic modulus of the impregnated adhesive 13 to that of the porous thin film 11 is preferably in the range of 2 to 20. If the ratio of the elastic modulus is less than 2, the effect of using a thin film is small, and there is no organic material that can exhibit an elastic modulus ratio greater than 20. Since the impregnated adhesive 13 is rigid, the elongation of the adhesive itself is small, amounting to about 1 to 5%.

[0022] The combination of the adhesive with the porous thin film 11 allows the porous thin film 11 to be made flexible, thus preventing the immediate appearance of cracks at a joint surface and distributing stress, thereby enabling high strength against the stress generated by temperature changes. The strain ratio of the adhesive 13 to the porous thin film 11 is preferably in the range of 2 to 1000 and more preferably in the range of 2 to 20. With increasing thickness of the porous thin film 11, it becomes difficult to impregnate the adhesive 13; therefore, the thickness of the porous thin film 11 is preferably 1 mm or less and more preferably 0.001 mm or more and 0.5 mm or less. It is not possible to produce a thin layer thinner than 0.001 mm, and if the thickness exceeds 0.5 mm, the adhesive layer becomes too thick for subsequent bonding, resulting in poor practical usability.

[0023] Next, a method for producing the porous thin film 11, which is used in the adhesive structure 100 according to embodiment 1 of the present invention, is described.

[0024] First, a mixture obtained by adding the phase-separating pore-forming agent to the main epoxy agent and the amine-based curing agent is stirred thoroughly. This epoxy solution is then applied thinly to a pretreated substrate to achieve the desired thickness and subsequently subjected to thermal curing. Finally, after thermal curing, the epoxy thin film is removed from the substrate, resulting in a porous epoxy thin film, as defined in porous thin film 11. Washing this thin film with a solvent, if required, allows for a thin film with a cleaner surface condition.

[0025] Here, the elastic modulus of the produced porous thin film 11 is characterized as lying in the range of 0.1 to 3000 MPa. Within this range, the porous thin film 11 with an elastic modulus in the range of 10 to 1000 MPa is preferred to improve the adhesive reliability. It was found that the porous thin film 11 currently has a pore diameter of 0.1 to 100 µm, and if the pore diameter is smaller than 0.1 µm, the adhesive cannot be sufficiently impregnated. If the pore diameter exceeds 100 µm, a fine and flexible structure cannot be achieved, leading to poor performance. Preferably, a pore diameter of 0.5 to 10 µm is desirable.

[0026] Furthermore, it was found that the produced porous thin film 11 exhibits a glass transition temperature of 60 to 200 °C. When a porous thin film has a glass transition temperature of less than 60 °C, its heat resistance typically decreases significantly. While it is possible to produce a porous thin film with a glass transition temperature above 200 °C, it is not possible to guarantee structural flexibility, as such a layer is a rigid resin. A glass transition temperature of 100 to 140 °C is desirable, as this ensures good bond reliability without cracking or delamination.

[0027] It is found that the porous thin film 11 is itself soft and exhibits an elongation of approximately 3 to 50%. If the elongation ratio with respect to a hardened product is less than 2, sufficient hardening cannot be achieved, and if the elongation ratio exceeds 1000, such a flexible structure has low heat resistance and is therefore unsuitable for applications requiring high heat resistance.

[0028] The porous adhesive structure 100 can be obtained by impregnating the adhesive 13 into the prepared porous thin film 11. Sufficient impregnation of the adhesive 13 into the porous thin film 11 can be achieved during impregnation by repeated vacuum degassing at a temperature lower than the curing temperature of the adhesive 13. It should be noted that the adhesive 13 used exhibits an adhesive strength of 10 MPa or more between SPCCs after curing and has a glass transition temperature of 170 to 300 °C, which is higher than that of the porous thin film.

[0029] By impregnating the adhesive 13 into the porous thin film 11, the adhesive structure 100 exhibits excellent adhesion strength in practical use, as the adhesive 13 maintains high adhesion despite a decrease compared to its original thickness. Using a configuration like that of the adhesive structure 100 makes it possible to achieve a stress relaxation effect under environmental changes. For example, it is possible to achieve resistance to a temperature cycle test with a temperature range as wide as -20 to 130 °C.

[0030] Furthermore, when bonding by thermal curing between materials with different coefficients of thermal expansion, such as magnets / steel plates, aluminum / iron, Invar / iron and engineering plastics (polyetheretherketone, polyacetal, polycarbonate, polyethersulfone, polyphenylene sulfide, polyimide, polyetherimide) / metal, the problem has been that the adhesive detaches from one bonding surface due to the differences in the coefficient of thermal expansion, but this problem can be solved by using the adhesive structure 100.

[0031] Furthermore, when using the adhesive structure 100, a physical treatment, such as polishing on the adhesive surface with sandpaper to improve surface roughness and achieve a new surface, atmospheric treatment, argon plasma treatment, deep ultraviolet light treatment, and corona discharge treatment, is carried out as a surface treatment to improve the adhesion between the aforementioned materials, so that improvements in adhesion and bond strength can be expected.

[0032] Furthermore, a silane adhesion promoter can be applied as a chemical treatment to achieve the same effect. For example, this can be used for epoxy-based adhesives. 2-(3,4-Epoxycyclohexyl)ethyltrimethoxysilane, 3-Glycidoxypropylmethyldimethoxysilane, 3-Glycidoxypropyltrimethoxysilane, 3-Glycidoxypropylmethyldiethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, 3-Aminopropyltrimethoxysilane, 3-Triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-Phenyl-3-aminopropyltrimethoxysilane, N-(Vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride, etc., can be used as primers. This causes stress relaxation during heat curing, making the adhesive not only more flexible for use in locations with significant temperature differences, but also suitable for applications where conventional adhesives cannot be used.

[0033] Fig. Figure 2 is a view showing a bonded state using the adhesive structure 100 according to embodiment 1 of the present invention. As shown in Fig. As shown in Figure 2, an adhesive surface 12 is in direct contact with the impregnated adhesive 13. In addition, in many cases the thickness of the adhesive 13 is generally designed, also to comply with the design tolerances and the clearance to other components, such that the thickness of the adhesive structure 100 is preferably 0.5 mm or less.

[0034] Fig. Figure 3 is a diagram showing a rate of change of the adhesive strength of the adhesive structure 100 according to embodiment 1 of the present invention. Fig. Figure 3 shows the result of a temperature cycle test performed by bonding the adhesive structure 100 to the bonding surface 12, such as an Invar material, for up to 300 cycles within a temperature range of -15 to 130 °C (◯: adhesive structure 100, Δ: commercially available adhesive). This result shows that the adhesive strength of the commercially available adhesive decreases after the temperature cycle test, while the adhesive strength of the adhesive structure 100 is maintained even after the test. The adhesive structure 100, which has a more flexible structure due to its porous framework, achieved an effect that would not have been possible with a conventional rigid component alone.

[0035] As described above, the adhesive structure 100 according to the present embodiment 1 comprises a porous thin film 11 made of an epoxy-based resin, in which pores are formed by a porous framework, the pores of the porous thin film 11 being impregnated with the adhesive 13. Thus, the porous epoxy resin thin film exhibits flexible mechanical properties and a stress relaxation effect, so that the stress generated due to temperature cycles, etc., can be relieved, enabling applications for devices with large temperature changes. With this configuration, stress relief is achieved without reducing the glass transition temperature, adhesion, etc., exhibited by the adhesive.Furthermore, when a rigid adhesive is used alone, a shear test reveals a fracture mode with interfacial failure, and cracks frequently occur, whereas the use of the porous thin film with the adhesive impregnated within it allows at least part of the adhesive's fracture mode to lead to cohesive failure within the porous thin film, thus enabling stress distribution. Design 2

[0036] In embodiment 2, a case is described in which the adhesive structure 100 according to embodiment 1 is applied to an electronic component.

[0037] Fig. Figure 4 is a sectional view showing the configuration of a semiconductor device using the adhesive structure 100 according to embodiment 2 of the present invention. As shown in Fig. Figure 4 shows a semiconductor device 200 composed of a substrate 21, a semiconductor element 23 arranged on a surface of the substrate 21 via the adhesive structure 100, a connecting wire 24 connecting an electrode (not shown) arranged on the surface of the substrate 21 and a surface electrode (not shown) arranged on a surface of the semiconductor element 23, and a sealing resin 25 sealing the semiconductor element 23.

[0038] Power devices or similar components carrying high currents of several hundred amperes must withstand high temperatures of approximately 200 °C, thus requiring exceptional heat resistance. In particular, power semiconductors such as SiC, GaN, and Ga2O3 can operate at 300 °C or higher. To utilize this capability, the adhesive structure 100 according to embodiment 1 can be used as a mounting material for a module capable of withstanding these high temperatures.

[0039] By using the adhesive structure 100 according to embodiment 1 in the semiconductor device 200, which is a power device or the like, it is possible to reduce the stresses arising due to temperature cycles, etc.

[0040] It should be noted that, if required, a specific degree of thermal conductivity can also be imparted to the porous thin film 11 by adding any quantity of powder (flake-shaped, spherical, needle-shaped, and special shapes) of thermally conductive materials, such as silicon dioxide, boron nitride, aluminum oxide, aluminum nitride, magnesium oxide, silicon nitride, beryllium oxide, and diamond. Furthermore, if electrical conductivity is required, electrically conductive powder (flake-shaped, spherical, needle-shaped, and special shapes) of thermally conductive materials, such as copper, silver, carbon black, and graphite, can also be added.

[0041] Furthermore, a printed circuit board formed by laminating a glass prepreg material using an epoxy, a ceramic substrate formed by stacking a ceramic layer and sintering it, a conductor frame formed by punching a thin pure copper sheet, etc., can be used as a substrate that serves as a mounting material.

[0042] As described above, the semiconductor device 200, which uses the adhesive structure 100 according to the present embodiment 2, comprises the semiconductor element 23, which is arranged on the surface of the substrate 21 via the adhesive structure 100 according to embodiment 1, the bonding wire 24, which connects the electrode arranged on the surface of the substrate 21 and the electrode arranged on the surface of the semiconductor element 23, and the sealing resin 25, which seals the semiconductor element 23. Thus, when connecting the semiconductor element, it is not only possible to sufficiently dissipate the stress arising due to temperature cycles, etc., but also to achieve excellent adhesion. embodiment 3

[0043] In embodiment 3, a case is described in which the adhesive structure 100 according to embodiment 1 is applied to a motor.

[0044] Fig. Figure 5 is a sectional view showing the configuration of a motor using the adhesive structure 100 according to embodiment 3 of the present invention. As shown in Fig. Figure 5 shows a motor 300 consisting of a shaft 34, a cylindrical steel plate 33 attached to the shaft 34 and magnets 32, which are connected to the outer circumference of the steel plate 33 via the adhesive structure 100.

[0045] In an SPM motor (surface permanent magnet motor, surface permanent magnet synchronous motor), the adhesive structure 100 according to embodiment 1 can be used to fasten magnets that require high heat resistance, to fasten parts in a motor compartment, etc.

[0046] By using the adhesive structure 100 according to embodiment 1 in the motor 300, which is an SPM motor or the like, it is possible to reduce the stress caused by temperature cycles, etc.

[0047] The magnet used can be a ferrite magnet, a neodymium magnet, a samarium-cobalt magnet, an alnico magnet, a composite magnet, etc., regardless of its alloy composition. The material bonded to the magnet is iron, and its form can be a die-cast part or an electromagnetic steel plate in which thin iron sheets are stacked.

[0048] As described above, the motor 300, which uses the adhesive structure 100 according to the present embodiment 3, has the cylindrical steel plate 33, which is attached to the shaft 34, and magnets 32, which are bonded to the outer circumference of the steel plate 33 via the adhesive structure 100 according to embodiment 1. Thus, when connecting the magnets, it is not only possible to sufficiently dissipate the stress arising due to temperature cycles, etc., but also to obtain excellent adhesion. Design 4

[0049] In embodiment 4, a case is described in which the adhesive structure 100 according to embodiment 1 is applied for aircraft components.

[0050] Fig. Figure 6 is a block diagram showing the configuration of the adhesive structure 100 according to embodiment 4 of the present invention. Fig. Figure 7 shows a system flow of an on-board air conditioning system using the adhesive structure 100 according to embodiment 4 of the present invention.

[0051] As in Fig. As shown in Figure 6, outside air is first taken in by a jet engine 41, compressed air is generated with a compressor 42, for which a sensor and a component 44 are used, which use the adhesive structure 100, and the air is mixed with fuel in a combustion chamber and intermittently burned (step S701).

[0052] Subsequently, the temperature of the air expelled from the combustion chamber is reduced to an arbitrary temperature by a heat exchanger 43, for which a sensor and a component 45 are used, which utilize the adhesive structure 100 (step S702).

[0053] Next, compressed air is supplied from compressor 42, for which the sensor and component 44 are used, which utilize the adhesive structure 100 (step S703), and is forwarded to an air conditioning system of the aircraft (step S704).

[0054] Finally, this air is cooled in the air conditioning system (step S705) and directed into the interior of the aircraft (step S706).

[0055] The temperature of the air outside the aircraft ranges from 0 °C to 40 °C at ground level and is as low as -40 °C to -60 °C at altitudes of 10,000 m or more. Therefore, the condition of the sensor and component 44, which are used for the compressor 42, must be maintained from a relatively high temperature of 100 °C to 200 °C down to a low temperature of -40 °C to -60 °C.

[0056] By using the configuration as specified above, where the adhesive structure 100 is used in the air conditioning system for aircraft, heat resistance and high toughness are achieved to maintain a structure in locations with large temperature differences.

[0057] As described above, the aircraft air conditioning system, which uses the adhesive structure 100 of the present embodiment 4, employs the adhesive structure 100 according to embodiment 1 to connect the sensor and the component 44 used in the compressor 42. Thus, when connecting the sensor and the component, it is not only possible to sufficiently dissipate the stress arising due to temperature cycles, etc., but also to achieve excellent adhesion.

[0058] Although the invention is described above with reference to various exemplary embodiments and implementations, it should be understood that the various features, aspects and functions described in relation to one or more of the individual embodiments are not limited in their applicability to the specific embodiment for which they are described, but rather can be used alone or in various combinations in relation to one or more of the embodiments of the invention.

[0059] It is therefore understood that numerous modifications, not shown by way of example, can be developed without deviating from the scope of the present invention. For example, at least one of the components can be modified, added, or removed. At least one of the components mentioned in at least one of the preferred embodiments can be selected and combined with the components mentioned in another preferred embodiment. DESCRIPTION OF REFERENCE MARKS 11 porous thin film 13 Adhesive 100 adhesive structure QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2000 -17 240 A

[0005]

Claims

[1] Adhesive structure comprising a thin layer formed from an epoxy resin in which pores are formed by a porous framework, wherein an adhesive is impregnated into the pores of the thin layer. [2] Adhesive structure according to claim 1, wherein the elastic modulus ratio of the adhesive to the thin film is 2 or higher and 20 or lower. [3] Adhesive structure according to claim 1 or 2, wherein the thin film has a glass transition temperature of 60 °C or higher and 200 °C or lower, and a glass transition temperature of a cured product of the impregnated adhesive is higher than the glass transition temperature of the porous thin film. [4] Adhesive structure according to any one of claims 1 to 3, wherein each of the pores has a diameter of 0.1 µm or more and 100 µm or less. [5] Adhesive structure according to any one of claims 1 to 4, wherein the elongation ratio of the thin film to the adhesive is 2 or more and 1000 or less. [6] Adhesive structure according to any one of claims 1 to 5, wherein the thin film contains a thermally conductive material. [7] Adhesive structure according to any one of claims 1 to 6, wherein the thin film contains an electrically conductive material. [8] Semiconductor device comprising the following: - a semiconductor element arranged on a surface of a substrate via the adhesive structure according to one of claims 1 to 7; - a connecting wire that links an electrode located on the surface of the substrate and an electrode located on a surface of the semiconductor element; and - a sealing resin that seals the semiconductor element. [9] Engine which features: - a cylindrical steel plate attached to a shaft; and a magnet connected to an outer circumference of the steel plate via the adhesive structure according to any one of claims 1 to 7. [10] Flying object equipped with a compressor, wherein the adhesive structure according to any one of claims 1 to 7 is used to connect a sensor and a component used for the compressor. [11] Method for producing an adhesive structure, the method comprising: a step of applying a solution in which a phase-separating pore former is added to an epoxy main agent and an amine-based curing agent, on a substrate and performing heat curing to produce a thin film; and a step of impregnating an adhesive in the thin layer detached from the substrate.

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