ELECTRONIC DEVICE

Abstract

An electronic device (1) comprising a housing (11), a plurality of first heat dissipation elements (12), a first air guide element (13), a fan (15), and a second air guide element (16). The plurality of first heat dissipation elements (12) are mounted at spaced-apart positions on a mounting surface (11a) of the housing (11) and dissipate heat transferred from the housing (11) to the ambient air. The first air guide element (13) forms a first gap (14) between the first air guide element (13) and the mounting surface (11a). The fan (15) generates an airflow along the first heat dissipation elements (12) in the first gap (14) between the mounting surface (11a) and the first air guide element (13). A section of the first air guide element (13) faces a second gap (17) formed between the second air guide element (16) and the side surface (11b) of the housing (11).

Description

Technical field

[0001] The present disclosure relates to an electronic device. Technical background

[0002] An electronic device, such as a power conversion device, dissipates heat generated by electronic components housed within an enclosure via the enclosure and a heat dissipation element to air surrounding the heat dissipation element in order to cool the electronic components. An example of the heat dissipation element included in the electronic device of this type is disclosed in patent literature 1. A heat sink component disclosed in patent literature 1, equipped with a fan, comprises a heat sink body attached to a high-heat-generating element, a cover covering an upper surface of the heat sink body, and a cooling fan integrated into a central section of the heat sink body. List of patent literature

[0003] Patent literature 1: Unexamined Japanese patent application publication no. H7-297583 Brief description of the invention: Technical problem

[0004] In the heat sink disclosed in patent literature 1, which is equipped with a fan, air drawn in through an inlet opening in the cover flows between heat dissipation fins and is discharged from a lateral side of the heat sink body. If the heat sink disclosed in patent literature 1, which is equipped with a fan, is provided on the upper surface of the housing of the electronic device to cool the electronic components contained therein, the upper surface of the housing is cooled, but the side and bottom surfaces are not. Accordingly, depending on the position, the amount of heat generated, or the like of the electronic components within the housing of the electronic device, the cooling by the heat sink may be insufficient, leading to an increase in the internal temperature of the housing and inadequate cooling of the electronic components.

[0005] Under such circumstances, one objective of the present disclosure is to provide an electronic device with high efficiency in cooling electronic components. Solution to the problem

[0006] To achieve the aforementioned objective, an electronic device according to the present disclosure comprises a housing, a plurality of first heat dissipation elements, a first air guide element, a fan, and at least one second air guide element. The housing accommodates an electronic component that generates heat when energized. The plurality of first heat dissipation elements are mounted at spaced-apart positions on a mounting surface of the housing, which is a surface intersecting a vertical direction, and dissipate heat transferred from the housing to ambient air. The first air guide element forms a first gap between itself and the mounting surface, with the plurality of first heat dissipation elements being arranged at least partially within the first gap. The fan generates an airflow along the plurality of first heat dissipation elements in the first gap.The second air guide element forms a second gap between itself and a side surface of the housing, which is a surface extending in the vertical direction. A section of the first air guide element faces this second gap. Advantageous effects of the invention

[0007] The fan included in the electronic device according to the present disclosure generates an airflow along the first heat dissipation elements in the first gap defined between the first air guide element and the mounting surface of the housing. This airflow induces an airflow in a second gap defined between the second air guide element and the side surface of the housing, causing air to flow along both the mounting surface and the side surface of the housing. The resulting electronic device thus exhibits high cooling efficiency for the electronic components. Brief description of the drawings Fig. 1 is a front view of an electronic device according to embodiment 1; Fig. Figure 2 is a top view of the electronic device according to embodiment 1; Fig. Figure 3 is a cross-sectional view of the electronic device according to embodiment 1 along line III-III, as seen by the arrows in Fig. 1. Indicated direction; Fig. Figure 4 is a diagram illustrating an airflow in the electronic device according to embodiment 1; Fig. Figure 5 is a diagram illustrating an airflow in the electronic device according to embodiment 1; Fig. 6 is a front view of an electronic device according to embodiment 2; Fig. 7 is a top view of the electronic device according to embodiment 2; Fig. Figure 8 is a cross-sectional view of the electronic device according to embodiment 2 along line VIII-VIII, as seen by the arrows in Fig. 6 indicated direction; Fig. Figure 9 is a diagram illustrating an airflow in the electronic device according to embodiment 2; Fig. Figure 10 is a diagram illustrating an airflow in the electronic device according to embodiment 2; Fig. 11 is a front view of an electronic device according to embodiment 3; Fig. 12 is a top view of the electronic device according to embodiment 3; Fig. Figure 13 is a cross-sectional view of the electronic device according to embodiment 3 along line XIII-XIII, as seen by the arrows in Fig. 11 indicated direction; Fig. Figure 14 is a diagram illustrating an airflow in the electronic device according to embodiment 3; Fig. Figure 15 is a diagram illustrating an airflow in the electronic device according to embodiment 3; Fig. Figure 16 is a front view of a first modified example of the electronic device according to the embodiment; Fig. Figure 17 is a diagram illustrating an airflow in the first modified example of the electronic device according to the embodiment; Fig. Figure 18 is a front view of a second modified example of the electronic device according to the embodiment; Fig. Figure 19 is a diagram illustrating an airflow in the second modified example of the electronic device according to the embodiment; Fig. Figure 20 is a diagram illustrating an upper surface of a housing included in a third modified example of the electronic device according to the embodiment; Fig. Figure 21 is a front view of a fourth modified example of the electronic device according to one embodiment; Fig. Figure 22 is a diagram illustrating an upper surface of a housing included in the fourth modified example of the electronic device according to the embodiment; Fig. Figure 23 is a diagram illustrating an upper surface of a housing included in a fifth modified example of the electronic device according to the embodiment; and Fig. Figure 24 is a front view of a sixth modified example of the electronic device according to the embodiment. Description of embodiments

[0008] An electronic device according to one or more embodiments of the present disclosure is described in detail below with reference to the accompanying drawings. In the drawings, identical or corresponding components are designated with the same reference numeral. Design 1

[0009] An electronic device 1 according to embodiment 1 is described by way of example with reference to an electronic device which is mounted on a movable body, such as an aircraft, a rail vehicle or a ship and has a housing in which electronic components are included which generate heat when energized.

[0010] The in Fig. 1, Fig. 2 and Fig. 3 electronic device 1 shown, wherein Fig. 3 along line III-III in Fig. 1. The cross-sectional view shown is, for example, a power conversion device mounted on an aircraft and converts electrical power supplied by a power source into power to be delivered to other onboard equipment of the aircraft, and delivers the converted power to the onboard equipment of the aircraft.

[0011] The electronic device 1 has a housing 11 that accommodates electronic components, such as switching elements and diodes, which generate heat when energized, a plurality of first heat dissipation elements 12 which are mounted at spaced-apart positions on a mounting surface 11a of the housing 11, a first air guide element 13 which forms a first gap 14 between the first air guide element 13 and the mounting surface 11a, a fan 15 which generates an airflow along the first heat dissipation elements 12, and a second air guide element 16 which forms a second gap 17 between the second air guide element 16 and a side surface 11b of the housing 11.

[0012] In Fig. 1, Fig. 2 to Fig. Figure 3 shows the Z-axis in the vertical direction. The X-axis and Y-axis are defined as mutually orthogonal axes lying in the horizontal plane. The X-axis, Y-axis, and Z-axis are orthogonal to each other.

[0013] The housing 11 has a mounting surface 11a and a bottom surface 11c, which are surfaces intersecting the Z-axis, as well as a side surface 11b, which is a surface extending along the Z-axis. The side surface 11b of the housing 11 is arranged parallel to an XZ-plane or a YZ-plane. In embodiment 1, among the surfaces of the housing 11 that intersect the Z-axis, there is an upper surface, specifically an outer surface of the housing 11, oriented in a positive Z-axis direction, which is the mounting surface 11a. Among the surfaces of the housing 11 that intersect the Z-axis, there is an outer surface of the housing 11 that is oriented in a negative Z-axis direction, which is the bottom surface 11c. An electronic component is mounted on the side opposite the mounting surface 11a, specifically on an upper section of an inner surface of the housing 11 in the vertical direction.

[0014] The housing 11 possesses sufficient rigidity and strength to withstand the maximum expected vibration of a moving body without deformation. For example, the housing 11 is made of metal, such as iron or aluminum. In embodiment 1, the housing 11 has a box-like shape with an upper section open in the vertical direction and accommodates any number of electronic components. The opening is closed by a plate-shaped heat sink, on the main surface of which, facing the interior of the housing, electronic components are mounted. In this case, the surface of the heat sink facing outwards from the housing 11 forms the mounting surface 11a. The heat sink is made of a material with high thermal conductivity, for example, metal such as iron or aluminum, fine ceramic, or graphite.

[0015] The majority of the first heat dissipation elements 12 are mounted at spaced-apart positions on the mounting surface 11a. In embodiment 1, the first heat dissipation elements 12 are arranged in the radial direction, which is orthogonal to the central axis AX1 of the fan 15. The first heat dissipation elements 12 each have a finned shape extending in the radial direction. The first heat dissipation elements 12 are made of a material with high thermal conductivity, for example, metal such as iron or aluminum, fine ceramic, or graphite.

[0016] The first heat dissipation elements 12 are mounted on the mounting surface 11a by welding, soldering, or other fastening methods. The first heat dissipation elements 12 conduct heat transferred from the electronic components housed within the enclosure 11 to the ambient air via the mounting surface 11a of the enclosure 11.

[0017] The first air guide element 13 is arranged such that a main surface of the same faces the mounting surface 11a, thereby forming the first gap 14 between the first air guide element 13 and the mounting surface 11a. A section of the first air guide element 13 faces the second gap 17. Specifically, an end section of the first air guide element 13 is arranged vertically above the second gap 17 on the side in the negative Y-axis direction.

[0018] In embodiment 1, the first air guide element 13 is a flat, plate-shaped element. The first air guide element 13 is attached to at least one of the plurality of first heat dissipation elements 12. For example, the first air guide element 13 is attached to at least one of the plurality of first heat dissipation elements 12, which serves as a support element. Specifically, the first air guide element 13 is attached to the first heat dissipation element 12 by adhesive bonding, fitting, fastening with a fastener, welding, or other fastening methods.

[0019] As in Fig. As shown in Figure 2, the first air guide element 13 has a ventilation opening 13a that allows outside air to flow into the first gap 14 of the electronic device 1. In embodiment 1, a circular ventilation opening 13a is formed in the center of the first air guide element 13.

[0020] The first heat dissipation elements 12 are at least partially arranged in the first gap 14. In embodiment 1, the majority of first heat dissipation elements 12 are arranged in the first gap 14 in a spaced-apart state.

[0021] The fan 15 is a radial blower that draws in air through the ventilation opening 13a of the first air guide element 13 and blows the drawn-in air along the mounting surface 11a in the first gap 14. The fan 15 is attached to the first air guide element 13.

[0022] The second air guide element 16 is designed such that a main surface of the same faces the side surface 11b, thereby forming the second gap 17 between the second air guide element 16 and the side surface 11b. In embodiment 1, the second air guide element 16 is a flat, plate-shaped element. The second air guide element 16 is attached to the side surface 11b by a pair of mounting elements 18. Each mounting element 18 is attached to the side surface 11b by a fastening method such as adhesive bonding, fitting, fastening with a fastener, welding, or other fastening methods. The second air guide element 16 is attached to the mounting elements 18 by a fastening method such as adhesive bonding, fitting, fastening with a fastener, welding, or other fastening methods.

[0023] In embodiment 1, the electronic device 1 has a second air guide element 16, which faces the side surface 11b on the side in the negative Y-axis direction, and a second air guide element 16, which faces the side surface 11b on the side in the positive Y-axis direction. The second air guide element 16 is positioned such that its upper end 16a is vertically spaced from the first air guide element 13. The second air guide element 16 is also positioned such that its lower end 16b is vertically arranged above the bottom surface 11c of the housing 11.

[0024] The cooling of the electronic components contained in the electronic device 1 with the structure described above is described below. When the fan 15 is operating, the fan 15 draws in air, as indicated by the black arrows in the diagram. Fig. As shown in Figure 4, air located vertically above the first air guide element 13 flows in the direction of the negative Z-axis. As shown in Fig. As shown in Figure 5, the fan 15 blows the intake air out in a radial direction. Since the first air guide element 13 is provided, the air blown out by the fan 15 flows through the first gap 14, which is defined between the first air guide element 13 and the mounting surface 11a of the housing 11, along the mounting surface 11a and between the first heat dissipation elements 12, and then flows out of the electronic device 1. This transfers heat generated by the electronic components housed within the housing 11, via the mounting surface 11a of the housing 11 and the first heat dissipation elements 12, to the air flowing between the first heat dissipation elements 12 in the first gap 14. This allows the electronic components to be cooled.

[0025] The in Fig. The airflow, represented by black arrows, creates a negative pressure at the end section of the first gap 14, which is located vertically above the second gap 17. This causes air to move vertically upwards in the second gap 17, which is formed between the second air guide element 16 and the side surface 11b, as shown by white arrows. The end section of the first air guide element 14 faces the end surface of the second air guide element 16 near the mounting surface 11a, specifically its upper end 16a in the vertical direction. In other words, the second air guide element 16 is positioned so that its upper end 16a is vertically spaced from the first air guide element 13.The second air guide element 16 allows air that has moved vertically upwards along the side surface 11b of the housing 11 to flow between the upper end 16a in the vertical direction and the first air guide element 13. Accordingly, as shown by the white arrows, the air that has moved vertically upwards through the second gap 17 flows along the first air guide element 13 and passes between the upper end 16a of the second air guide element 16 in the vertical direction and the first air guide element 13, and then flows out of the electronic device 1.

[0026] The second air guide element 16 is positioned such that its lower end 16b is located vertically above the base surface 11c of the housing 11. This allows outside air to flow into the second gap 17 through a gap located vertically below the second air guide element 16, specifically through a gap between the lower end 16b of the second air guide element 16 and a surface on which the electronic device 1 is installed. Accordingly, as indicated by the white arrows, outside air flows into the second gap 17 and moves upwards in the vertical direction as described above. The operation of the fan 15 promotes natural convection in the second gap 17, as described above.This allows heat generated by the electronic components housed within the enclosure 11 to be transferred via the side surface 11b of the enclosure 11 to the air flowing through the second gap 17. This enables the electronic components to be cooled.

[0027] As described above, the electronic device 1 according to embodiment 1 has the first air guide element 13 and the second air guide element 16, and thus the operation of the fan 15 causes an airflow to be generated along the mounting surface 11a and along the side surface 11b. This results in more air flowing along the housing 11, thereby providing the electronic device 1 with high efficiency in cooling the electronic components housed within the housing 11.

[0028] The improved cooling performance of the electronic components suppresses temperature increases, leading to a longer lifespan and a reduced failure rate. This improved cooling also allows for a smaller size of electronic device 1 and, if electronic device 1 is a power conversion device, an increase in the power conversion device's capacity. Design 2

[0029] The configuration of the electronic device is not limited to the examples described above and can be any configuration that allows cooling of the electronic components housed within the enclosure 11 by allowing air to flow along the mounting surface 11a and the side surface 11b. Embodiment 2 describes an electronic device 2 with a configuration different from that of the electronic device 1 according to Embodiment 1, with the emphasis being on the differences from Embodiment 1.

[0030] As in Fig. 6 and Fig. 7 as well as in Fig. 8 shown, where Fig. 8 along line VIII-VIII in Fig. As shown in the cross-sectional view shown in Figure 6, the electronic device 2 has a plurality of first heat dissipation elements 19 with fin shapes, the main surfaces of which are parallel to the YZ plane, a first air guide element 20 forming a first gap 14 between the first air guide element 20 and the mounting surface 11a, a fan 21 provided adjacent to one end of the mounting surface 11a and configured to blow air to another end of the mounting surface 11a, and a plurality of second heat dissipation elements 22 provided in the second gap 17.

[0031] The majority of the first heat dissipation elements 19 are mounted at spaced-apart positions on the mounting surface 11a. As shown in Fig. 8 shown, in which the first air guide element 20 is made of Fig. 6 and Fig. In embodiment 2, the first heat dissipation elements 19 have lamellar shapes extending in one direction of airflow from the fan 21. In embodiment 2, the majority of the first heat dissipation elements 19 are arranged at intervals along the X-axis. The first heat dissipation elements 19 are made of a material with high thermal conductivity, for example, a metal such as iron or aluminum, a fine ceramic, or graphite.

[0032] The first heat dissipation elements 19 are mounted on the mounting surface 11a by welding, soldering, or other fastening methods. The first heat dissipation elements 19 conduct heat transferred from the electronic components housed within the enclosure 11 to the ambient air via the mounting surface 11a of the enclosure 11.

[0033] The first air guide element 20 is arranged such that one of its main surfaces faces the mounting surface 11a, thereby forming the first gap 14 between the first air guide element 20 and the mounting surface 11a. One end section of the first air guide element 20 in the Y-axis direction is located adjacent to the fan 21. Another end of the first air guide element 20 in the Y-axis direction faces the second gap 17. Specifically, one end section of the first air guide element 20 is located vertically above the second gap 17 on the side of the negative Y-axis.

[0034] In embodiment 2, the first air guide element 20 is a flat, plate-shaped element. The first air guide element 20 is attached to at least one of the plurality of first heat dissipation elements 19. For example, the first air guide element 20 is attached to at least one of the plurality of first heat dissipation elements 19, which serves as a support element. Specifically, the first air guide element 20 is attached to the first heat dissipation element 19 by adhesive bonding, fitting, fastening with a fastener, welding, or other fastening methods.

[0035] The first heat dissipation elements 19 are at least partially arranged in the first gap 14. In embodiment 2, the majority of first heat dissipation elements 19 are arranged in the first gap 14 in a spaced-apart state.

[0036] The fan 21 is an axial fan located adjacent to one end of the mounting surface 11a in the Y-axis direction and configured to blow air to the other end of the mounting surface 11a in the Y-axis direction. In embodiment 2, two fans 21, contained within the electronic device 2, are provided at intervals in the X-axis direction. Each fan 21 is located at the end section of the mounting surface 11a on the positive Y-axis side and blows air in the negative Y-axis direction.

[0037] The majority of the secondary heat dissipation elements 22 are arranged in the second gap 17 and mounted on the side surface 11b. In embodiment 2, the secondary heat dissipation elements 22 are arranged in the second gap 17 in the X-axis direction. The secondary heat dissipation elements 22 have lamellar shapes extending in the vertical direction. The secondary heat dissipation elements 22 are made of a material with high thermal conductivity, for example, a metal such as iron or aluminum, a fine ceramic, or graphite.

[0038] The second heat dissipation elements 22 are mounted on the side surface 11b by welding, soldering, or other fastening methods. The second heat dissipation elements 22 conduct heat transferred from the electronic components housed within the enclosure 11 to the ambient air via the side surface 11b of the enclosure 11.

[0039] In embodiment 2, the second air guide element 16 is a flat, plate-shaped element. The second air guide element 16 is attached to at least one of the plurality of second heat dissipation elements 22. For example, the second air guide element 16 is attached to at least one of the plurality of second heat dissipation elements 22, which serves as a support element. Specifically, the second air guide element 16 is attached to at least one of the second heat dissipation elements 22 by adhesive bonding, fitting, fastening with a fastener, welding, or other fastening methods.

[0040] The cooling of the electronic components contained in the electronic device 2 with the structure described above is described below. When the fan 21 is operating, it blows air in the negative Y-axis direction, as indicated by the black arrows. Fig. 9 and Fig. Figure 10 illustrates this. Since the first air guide element 20 is provided, the air blown out by the fan 21 flows through the first gap 14, which is defined between the first air guide element 20 and the mounting surface 11a of the housing 11, along the mounting surface 11a and between the first heat dissipation elements 19, and then flows out of the electronic device 2. This transfers heat generated by the electronic components housed within the housing 11, via the mounting surface 11a of the housing 11 and the first heat dissipation elements 19, to the air flowing between the first heat dissipation elements 19 in the first gap 14. This allows the electronic components to be cooled.

[0041] The in Fig. 9 and Fig. The airflow, represented by black arrows, creates a negative pressure at the end section of the first gap 14, which is located vertically above the second gap 17. This causes air to move vertically upwards in the second gap 17, which is formed between the second air guide element 16 and the side surface 11b, as shown by white arrows. The second air guide element 16 is positioned such that its upper end 16a is vertically spaced from the first air guide element 20, allowing air that has moved vertically upwards along the side surface 11b of the housing 11 to flow between the upper end 16a and the first air guide element 20.Accordingly, as shown by white arrows, the air that has moved upwards in the vertical direction through the second gap 17 flows along the first air guide element 20 and passes between the upper end 16a of the second air guide element 16 in the vertical direction and the first air guide element 20 and then flows out of the electronic device 2.

[0042] The second air guide element 16 is positioned such that its lower end 16b is located vertically above the base surface 11c of the housing 11. This allows outside air to flow into the second gap 17 through a gap located vertically below the second air guide element 16, specifically through a gap between the lower end 16b of the second air guide element 16 and a surface on which the electronic device 2 is installed. Accordingly, as indicated by the white arrows, outside air flows into the second gap 17 and moves upwards in the vertical direction as described above. The operation of the fan 21 promotes natural convection in the second gap 17, as described above.This allows heat generated by the electronic components housed within the enclosure 11 to be transferred via the side surface 11b of the enclosure 11 to the air flowing through the second gap 17. This enables the electronic components to be cooled.

[0043] As described above, the electronic device 2 according to embodiment 2 has the first air guide element 20 and the second air guide element 16, and thus the operation of the fan 21 causes an airflow to be generated along the mounting surface 11a and along the side surface 11b. This results in more air flowing along the housing 11, thereby providing the electronic device 2 with high cooling efficiency for the electronic components housed within the housing 11.

[0044] The electronic device 2 has the second heat dissipation elements 22 arranged in the second gap 17, and thus heat from the electronic components housed within the enclosure 11 is efficiently transferred via the side surface 11b and the second heat dissipation elements 22 to the air in the second gap 17. This results in an electronic device 2 with high cooling efficiency for the electronic components housed within the enclosure 11.

[0045] The improved cooling performance of the electronic components suppresses temperature increases, leading to a longer lifespan and a reduced failure rate. This improved cooling also allows for a smaller size of electronic device 2 and, if electronic device 2 is a power conversion device, an increase in its capacity. embodiment 3

[0046] The configuration of the electronic device is not limited to the examples described above and can be any configuration that allows cooling of the electronic components housed within the enclosure 11 by allowing air to flow along the mounting surface 11a and the side surface 11b. Embodiment 3 describes an electronic device 3 with a configuration different from that of the electronic device 1 according to Embodiment 1, with the emphasis being on the differences from Embodiment 1.

[0047] As in Fig. 11, Fig. 12 and Fig. 13 shown, where Fig. 13 one along line XIII-XIII in Fig. As shown in the cross-sectional view shown in Figure 11, the electronic device 3 has a second air guide element 23 that forms a second gap 24 between the second air guide element 23 and the side surface 11b, a first support element 25 that supports the first air guide element 13, and a second support element 26 that supports the second air guide element 23.

[0048] As in Fig. As shown in Figure 12, the first air guide element 13 is supported by four first support elements 25. The first air guide element 13 is attached to the four first support elements 25 by adhesive bonding, fitting, fastening with a fastener, welding or other fastening methods.

[0049] As in Fig. 11, Fig. 12 to Fig. As shown in Figure 13, the second air guide element 23 is designed such that a section of the second air guide element 23 faces the side surface 11b, thereby forming the second gap 24 between the second air guide element 23 and the side surface 11b. The second air guide element 23 has a section facing the side surface 11b and a section facing the surface on which the electronic device 3 is installed. For example, the second air guide element 23 is formed by bending a flat, plate-shaped element at a right angle.

[0050] In embodiment 3, the electronic device 3 has a second air guide element 23 with a section facing the side surface 11b in the negative Y-axis direction, and a second air guide element 23 with a section facing the side surface 11b in the positive Y-axis direction. The second air guide element 23 is positioned such that its upper end 23a is vertically spaced from the first air guide element 13. The second air guide element 23 is also positioned such that its lower end 23b is vertically arranged above the bottom surface 11c of the housing 11.

[0051] As in Fig. As shown in Figure 13, every second air guide element 23 is supported by four second support elements 26. The second air guide element 23 is attached to four second support elements 26 by adhesive bonding, fitting, fastening with a fastener, welding or other fastening methods.

[0052] The first support elements 25 and the second support elements 26 are attached to the surface on which the electronic device 3 is installed.

[0053] The cooling of the electronic components of the electronic device 3 with the structure described above is described below. When the fan 15 is operating, the fan 15 draws in air, as indicated by the black arrows in Fig. As shown in Figure 14, air located vertically above the first air guide element 13 flows in the direction of the negative Z-axis. As shown in Fig. As shown in Figure 15, the fan 15 blows the intake air out in a radial direction. Since the first air guide element 13 is provided, the air blown out by the fan 15 flows through the first gap 14, which is defined between the first air guide element 13 and the mounting surface 11a of the housing 11, along the mounting surface 11a and between the first heat dissipation elements 12, and then flows out of the electronic device 3. This transfers heat generated by the electronic components housed within the housing 11, via the mounting surface 11a of the housing 11 and the first heat dissipation elements 12, to the air flowing between the first heat dissipation elements 12 in the first gap 14. This allows the electronic components to be cooled.

[0054] The in Fig. The airflow, represented by black arrows, causes a negative pressure to form at the end section of the first gap 14, which is located vertically above the second gap 24. This causes air to move vertically upwards in the second gap 24, which is formed between the second air guide element 23 and the side surface 11b, as shown by white arrows. The second air guide element 23 is positioned such that its upper end 23a is vertically spaced from the first air guide element 13, allowing air that has moved vertically upwards along the side surface 11b of the housing 11 to flow between the upper end 23a and the first air guide element 13.Accordingly, as shown by white arrows, the air that has moved upwards in the vertical direction through the second gap 24 flows along the first air guide element 13 and passes between the upper end 23a of the second air guide element 23 in the vertical direction and the first air guide element 13 and then flows out of the electronic device 3.

[0055] The second air guide element 23 is positioned such that its lower end 23b is located vertically above the base surface 11c of the housing 11. This allows outside air to flow into the second gap 24 through a gap located vertically below the second air guide element 23, specifically through a gap between the lower end 23b of the second air guide element 23 and a surface on which the electronic device 3 is installed. Accordingly, as indicated by the white arrows, outside air flows into the second gap 24 and moves upwards in the vertical direction as described above. The operation of the fan 15 promotes natural convection in the second gap 24, as described above.This allows heat generated by the electronic components housed within the enclosure 11 to be transferred via the side surface 11b of the enclosure 11 to the air flowing through the second gap 24. This enables the electronic components to be cooled.

[0056] As described above, the electronic device 3 according to embodiment 3 has the first air guide element 13 and the second air guide element 23, and thus the operation of the fan 15 causes an airflow to be generated along the mounting surface 11a and along the side surface 11b. This results in more air flowing along the housing 11, thereby providing the electronic device 3 with high efficiency in cooling the electronic components housed within the housing 11.

[0057] The improved cooling performance of the electronic components suppresses temperature increases, leading to a longer service life and a reduced failure rate. This improved cooling also allows for a smaller size of the electronic device 3 and, if the electronic device 3 is a power conversion device, an increase in its capacity.

[0058] The embodiments described above are not to be construed as limiting the scope of protection of this disclosure. The embodiments described above can be suitably combined. As an example, the electronic device 2 can have the second air guide element 16 or the second air guide element 23 corresponding to the side surface 11b facing in the positive Y-axis direction. In this case, an end section of the first air guide element 20 can be arranged vertically above the second air guide element 23 in the Y-axis direction. Furthermore, the upper end 16a of the second air guide element 16 or the upper end 23a of the second air guide element 23 can be in contact with the first air guide element 20 in the vertical direction.

[0059] As another example, the electronic device 3 can include the first heat dissipation elements 19, the first air guide element 20, and the fan 21, which are contained in the electronic device 2. In this case, the first air guide element 20 only needs to be supported by the first support elements 25.

[0060] The mounting surface is not limited to the upper surface of the housing 11 in the vertical direction. For example, the bottom surface of the housing 11 can serve as a mounting surface in the vertical direction. The bottom surface 11c of the housing 11, which is located in the Fig. The electronic device 4 shown in section 16 serves as a mounting surface on which the majority of first heat dissipation elements 12 are mounted. The configuration of the electronic device 4 is similar to that of the electronic device.

[0061] The second air guide element 16 is positioned so that its lower end 16b is vertically adjacent to the first air guide element 13, and guides air flowing through the first gap 14 into the second gap 17. The lower end 16b of the second air guide element 16 is vertically adjacent to the first air guide element 13 to such an extent that it prevents air blown out by the fan 15, which has passed between the first heat dissipation elements 12, from escaping in the horizontal direction. Preferably, the lower end 16b of the second air guide element 16 is in vertical contact with the first air guide element 13.

[0062] When fan 15 is operating, fan 15 draws in air, as indicated by the black arrows in the diagram. Fig. As shown in Figure 17, air located vertically below the first air guide element 13 is drawn in along the positive Z-axis direction. The fan 15 blows the drawn-in air out in a radial direction. Because of the first air guide element 13, the air blown out by the fan 15 flows through the first gap 14, which is defined between the first air guide element 13 and the mounting surface 11a of the housing 11, along the mounting surface 11a and between the first heat dissipation elements 12. By providing the second air guide element 16 at a position where its lower end 16b is adjacent to the first air guide element 13 in the vertical direction, the air that has passed between the first heat dissipation elements 12 is guided into the second gap 17 and moves upwards through the second gap 17 in the vertical direction.

[0063] The air that has moved upwards in the vertical direction through the second gap 17 is discharged outwards from the electronic device 4. As a result of the airflow described above, heat is transferred from the electronic components housed within the enclosure 11 via the bottom surface 11c and the side surface 11b of the enclosure 11 to the air flowing through the first gap 14 and the second gap 17, thereby cooling the electronic components. In the example of the Fig. 16 and Fig. 17 the electronic components are preferably provided near the bottom surface 11c inside the housing 11.

[0064] The electronic device 4 can have an axial fan instead of the fan 15, which blows air in the negative Z-axis direction. In this case, the air flows in the opposite direction to that in Fig. The airflow is shown in Figure 17. That is, the second air guide element 16 directs air flowing through the second gap 17 into the first gap 14. In this case as well, as a result of the airflow, heat is transferred from the electronic components housed inside the casing 11 via the bottom surface 11c and the side surface 11b of the casing 11 to the air flowing through the first gap 14 and the second gap 17, thereby cooling the electronic components.

[0065] The fan's airflow direction is not limited to the examples above. For example, the one in Fig. The electronic device 5 shown in Figure 18 includes a fan 27, which is an axial fan that blows air in the positive Z-axis direction. The fan 27 is mounted on the first air guide element 13, with a section of the fan 27 being arranged in the ventilation opening 13a of the first air guide element 13.

[0066] The second air guide element 16 is positioned so that its upper end 16a is vertically adjacent to the first air guide element 13, and guides air flowing through the second gap 17 into the first gap 14. The upper end 16a of the second air guide element 16 is vertically adjacent to the first air guide element 13 to such an extent that air drawn in by the fan 27, which is blown in the positive Z-axis direction and has moved upwards vertically through the second gap 17, is prevented from escaping horizontally. Preferably, the upper end 16a of the second air guide element 16 is in vertical contact with the first air guide element 13.

[0067] When the fan 27 is operating, it draws air in from the first gap 14, blows the drawn-in air in the positive Z-axis direction, and blows the air out of the ventilation opening 13a of the first air guide element 13, as indicated by black arrows in Fig. Figure 19 illustrates this. As a result, air flows in the first gap 14 between the first heat dissipation elements 12 towards the fan 27. Since the first air guide element 13 is provided, the air drawn in by the fan 27 flows through the first gap 14, which is defined between the first air guide element 13 and the mounting surface 11a of the housing 11, along the mounting surface 11a and between the first heat dissipation elements 12. The airflow towards the fan 27 causes a negative pressure to develop in the first gap 14, which is located vertically above the second gap 17. As a result, air moves upwards in the second gap 17 in the vertical direction, as shown by the white arrows.

[0068] The second air guide element 16 is positioned so that its upper end 16a is in vertical contact with the first air guide element 13. Accordingly, the second air guide element 16 directs air that has moved upwards vertically through the second gap 17 into the first gap 14. In the first gap 14, the air flows between the first heat dissipation elements 12 towards the fan 27. As a result of this airflow, heat generated by the electronic components housed within the enclosure 11 is transferred via the mounting surface 11a and the side surface 11b of the enclosure 11 to the air flowing through the first gap 14 and the second gap 17, thus cooling the electronic components.

[0069] As another example, the electronic device 2 can have a fan 21, which is an axial fan, located at the end section on the side of the positive Y-axis and blowing air in the negative Y-axis direction, and a fan 21, which is an axial fan, located at the end section on the side of the negative Y-axis and blowing air in the positive Y-axis direction.

[0070] The number of second air guide elements 16 is not limited to the preceding example. The in Fig. The electronic device 6 shown in Figure 20 has four secondary air guide elements 16, corresponding to the four side surfaces 11b. Each secondary air guide element 16 forms a secondary gap 17 between itself and the corresponding side surface 11b. By providing the secondary air guide elements 16 facing the respective side surfaces 11b, an airflow is generated along each side surface 11b. This results in more effective cooling of the electronic components within the housing 11.

[0071] The number, arrangement positions, and shapes of the first and second heat dissipation elements are not limited to the examples above. As an example, the following is shown in Fig. 21 and Fig. 22 The electronic device 7 shown has a plurality of second heat dissipation elements 22 arranged in the vertical direction and in the horizontal direction and having lamellar shapes.

[0072] As another example, the one in Fig. 23 The electronic device 8 shown includes a plurality of first heat dissipation elements 19, which are arranged in the direction of airflow of the fan 21 and in a direction orthogonal to the direction of airflow of the fan 21.

[0073] As another example, the first heat dissipation elements 12 and 19 can have curved surfaces. Likewise, the second heat dissipation elements 22 can have curved surfaces.

[0074] As another example, the first heat dissipation elements 12 and 19 can be formed integrally with the housing 11. Likewise, the second heat dissipation elements 22 can be formed integrally with the housing 11.

[0075] The structures of the first heat dissipation elements and the second heat dissipation elements are not limited to the examples above. As an example, the one in Fig. The electronic device 9 shown in Figure 24 comprises a plurality of first heat dissipation elements 28, which are heat pipes. Each first heat dissipation element 28 has a main pipe 28a extending in the Y-axis direction and mounted on the mounting surface 11a, and branch pipes 28b connected to the main pipe 28a and extending vertically. The electronic device 9 further comprises a plurality of heat dissipation fins 29 attached to the first heat dissipation elements 28. The heat dissipation fin 29 located at the lower end in the vertical direction serves as the first air guide element.

[0076] The shapes of the first support elements 25 and the second support elements 26 are not limited to the examples above. For example, the first support elements 25 and the second support elements 26 can have plate-like shapes.

[0077] The electronic devices 1 to 9 can be mounted not only on aircraft but also on any movable body. They can also be installed at any location in ground-based installations. For example, electronic device 1 can be mounted under the floor of a rail vehicle. If there is space below electronic device 1 in the vertical direction, the lower end of the second air guide element 16 can be positioned vertically below the bottom surface 11c of the housing 11.

[0078] The foregoing describes some exemplary embodiments for illustrative purposes. Although the foregoing description presents specific embodiments, those skilled in the art will recognize that changes in form and detail can be made without departing from the broader spirit and scope of protection of the invention. Accordingly, the description and the drawings are to be considered in an explanatory, not a limiting, sense. This detailed description is therefore not to be understood in a limiting sense, and the scope of protection of the invention is defined exclusively by the appended claims and by the full scope of the equivalents to which such claims refer. Reference symbol list 1, 2, 3, 4, 5, 6, 7, 8, 9 Electronic device 11 cases 11a Mounting area 11b Side surface 11c floor area 12, 19, 28 First heat dissipation element 13, 20 First air guide element 13a Ventilation opening 14 First gap 15, 21, 27 fans 16, 23 Second air guide element 16a, 23a Upper end in the vertical direction 16b, 23b Lower end in the vertical direction 17, 24 Second gap 18 Mounting element 22 Second heat dissipation element 25 First support element 26 Second support element 28a Main pipe 28b Branch pipe 29 Heat dissipation fin AX1 Central Axis

Claims

comprising an electronic device: a housing for receiving an electronic component which generates heat when energized; a plurality of first heat dissipation elements which are mounted at spaced-apart positions on a mounting surface of the housing which is a surface intersecting a vertical direction and which are configured to dissipate heat transferred from the housing to ambient air; a first air guide element which forms a first gap between the first air guide element and the mounting surface, wherein the plurality of first heat dissipation elements are at least partially arranged in the first gap; a fan for generating an airflow along the plurality of first heat dissipation elements in the first gap;and at least a second air guide element forming a second gap between the at least one second air guide element and a side surface of the housing, which is a surface extending in the vertical direction, wherein a section of the first air guide element faces the second gap. Electronic device according to claim 1, wherein an end section of the first air guide element faces an end section of the second air guide element, which is a section closer to the mounting surface. Electronic device according to claim 1 or 2, wherein the first air guide element has a ventilation opening, and the fan is a radial blower that draws in air through the ventilation opening of the first air guide element and blows the drawn-in air along the mounting surface in the first gap. Electronic device according to claim 1 or 2, wherein the first air guide element has a ventilation opening, and the fan is an axial fan that draws air from the first gap and blows the drawn-in air through the ventilation opening of the first air guide element. Electronic device according to claim 3 or 4, wherein the plurality of first heat dissipation elements have fin shapes extending in a radial direction orthogonal to a central axis of the fan. Electronic device according to claim 1 or 2, wherein the fan is an axial fan arranged at a position adjacent to one end of the mounting surface and configured to blow air to another end of the mounting surface. Electronic device according to claim 6, wherein the plurality of first heat dissipation elements have fin shapes extending in a blowing direction of the fan. Electronic device according to any one of claims 1 to 7, wherein the mounting surface is an upper surface of the housing in the vertical direction. Electronic device according to claim 8, wherein the second air guide element is provided in a position where an upper end of the same is spaced vertically from the first air guide element, and allows air that has moved upwards along the side surface of the housing in the vertical direction to flow between the upper end in the vertical direction and the first air guide element. Electronic device according to claim 8, wherein the second air guide element is provided in a position where an upper end of the same is adjacent in the vertical direction to the first air guide element, and directs air flowing through the first gap to the second gap or directs air through the second gap to the first gap. Electronic device according to one of claims 8 to 10, wherein the second air guide element is provided in a position where a lower end of the same is arranged vertically above a bottom surface of the housing in the vertical direction, and allows outside air to flow into the second gap. Electronic device according to any one of claims 1 to 7, wherein the mounting surface is a bottom surface of the housing in the vertical direction. Electronic device according to claim 12, wherein the second air guide element is provided in a position where a lower end of the same is adjacent in the vertical direction to the first air guide element, and directs air flowing through the first gap to the second gap or directs air flowing through the second gap to the first gap. Electronic device according to one of claims 1 to 13, wherein the first air guide element is attached to the plurality of first heat dissipation elements. Electronic device according to one of claims 1 to 14, further comprising: a plurality of second heat dissipation elements arranged in the second gap and mounted on the side surface and designed to dissipate heat transferred from the housing to the ambient air. Electronic device according to claim 15, wherein the second air guide element is attached to the plurality of second heat dissipation elements. Electronic device according to one of claims 1 to 16, wherein the first air guide element is supported by a first support element which is attached to a surface on which the housing is installed. Electronic device according to one of claims 1 to 17, wherein the second air guide element is supported by a second support element which is attached to a surface on which the housing is installed.

Images