Laminated transparent sheet and method for its manufacture

Abstract

A laminated transparent sheet is provided, comprising: a pair of transparent sheets (420a, 420b); a display device (100) arranged between the pair of transparent sheets, comprising a first substrate and a plurality of display elements formed on the first substrate; and a wireless near-field communication antenna (200) arranged between the pair of transparent sheets, comprising a second substrate and a spiral coil formed on the second substrate. The display device (100) and the wireless near-field communication antenna (200) are configured to overlap in plan view, and an electromagnetic shielding element (300), comprising a third substrate and a metal mesh film formed on the third substrate, is provided between the display device (100) and the wireless near-field communication antenna (200).

Description

Technical field

[0001] The present disclosure relates to a laminated transparent plate and a method for its manufacture, and relates, for example, to a laminated transparent plate comprising a display device and a wireless near-field communication antenna between a pair of transparent plates, and a method for its manufacture. State of the art

[0002] As disclosed in patent document 1, the inventors have developed a transparent display device in which a fine light-emitting diode (LED) element formed on a transparent substrate is used as a pixel. Such a transparent display device is provided on a transparent element, such as a window or a partition of a vehicle or building, since, for example, a back surface (the side opposite a visible side) can be visually detected by the transparent display device.

[0003] Furthermore, patent document 2 discloses a laminated glass or composite glass in which a display device and a wireless near field communication (NFC) antenna are arranged close together between a pair of glass plates. Document listPatent documents [Patent document 1] International Patent Publication No. WO 2019 / 146634 [Patent Document 2] Published Japanese translation of the international PCT publication for patent application no. 2022-500295 Summary of the invention: Technical problem

[0004] The inventors have found that when a wireless near-field communication antenna is placed close to a display device, as disclosed in patent document 2, noise appears in an image displayed by the display device.

[0005] The present disclosure was prepared with such circumstances in mind and provides a laminated transparent plate that can reduce noise generated in an image displayed by a display device due to a wireless near-field communication antenna. Solution to the problem

[0006] One aspect of the present disclosure provides a laminated transparent plate with a structure [1].

[0007] [1] Laminated transparent sheet comprising: a pair of transparent plates; a display device arranged between the pair of transparent plates and comprising a first substrate and a plurality of display elements formed on the first substrate; and a wireless near-field communication antenna arranged between the pair of transparent plates and comprising a second substrate and a spiral coil formed on the second substrate, wherein the display device and the wireless near-field communication antenna are arranged so that they overlap in plan view, and an electromagnetic shielding element comprising a third substrate and a metal mesh film formed on the third substrate is provided between the display device and the wireless near-field communication antenna.

[0008] In one aspect of the present revelation:

[0009] [2] Laminated transparent plate according to [1], wherein the line spacing of the metal mesh film is 100 µm to 6000 µm and the line width of the metal mesh film is 3 µm to 200 µm.

[0010] [3] Laminated transparent plate according to [1] or [2], wherein each of the first to third substrates is transparent, the majority of display elements are light-emitting diode elements, each arranged for each pixel, and have an area of ​​10000 µm or less. 2 exhibit, and the display device is a transparent display device.

[0011] [4] Laminated transparent plate according to [1] to [3], wherein the metal mesh film is formed from a metal containing one of Cu, Ni, Fe and Cr as a major component.

[0012] [5] Laminated transparent plate according to [1] to [4], further comprising: a first control circuit which controls the display device; and a second control circuit which controls the wireless near-field communication antenna, wherein the first and the second control circuit are both provided outside the pair of transparent plates.

[0013] [6] Laminated transparent plate according to [5], wherein wiring extending from the pair of transparent plates is electromagnetically shielded for connecting the wireless near-field communication antenna to the second control circuit.

[0014] [7] Laminated transparent plate according to one of [1] to [6], wherein the pair of transparent plates is a pair of glass plates.

[0015] [8] Laminated transparent plate according to [7], further comprising: a first intermediate film provided between one of the pair of glass plates and the display device; and a second intermediate film provided between the other of the pair of glass plates and the wireless near-field communication antenna.

[0016] [9] Laminated transparent panel according to [1] to [8], wherein the laminated transparent panel is used for a window of a self-driving vehicle, the display device shows a fare of the self-driving vehicle, and a user of the self-driving vehicle pays the fare by means of communication using the wireless near field communication antenna.

[0017] One aspect of the present disclosure provides a laminated transparent plate with a structure

[10] .

[0018]

[10] Laminated transparent sheet comprising: a pair of transparent plates; a display device arranged between the pair of transparent plates, comprising a first substrate and a plurality of light-emitting elements formed on the first substrate; and a wireless near-field communication antenna arranged between the pair of transparent plates and comprising a second substrate and a spiral coil formed on the second substrate, wherein the display device and the wireless near-field communication antenna are arranged so that they are aligned in the top view, and a distance between the display device and the wireless near-field communication antenna is equal to or greater than 5 mm.

[0019] One aspect of the present disclosure provides a method for producing a laminated transparent plate with a structure

[11] .

[0020]

[11] Method for producing a laminated transparent plate, wherein a display device comprising a first substrate and a plurality of light-emitting elements formed on the first substrate and a wireless near-field communication antenna comprising a second substrate and a spiral coil formed on the second substrate are arranged between a pair of transparent plates, the method comprising: Arrange the display device and the wireless near-field communication antenna such that they overlap in plan view; and Providing an electromagnetic shielding element comprising a third substrate and a metal mesh film formed on the third substrate, between the display device and the wireless near-field communication antenna.

[0021] One aspect of the present disclosure provides a method for producing a laminated transparent plate with the structure shown below

[12] .

[0022]

[12] Method for producing a laminated transparent plate, wherein a display device comprising a first substrate and a plurality of light-emitting elements formed on the first substrate and a wireless near-field communication antenna comprising a second substrate and a spiral coil formed on the second substrate are arranged between a pair of transparent plates, the method comprising: Arranging the display device and the wireless near-field communication antenna in a manner oriented in the top view; and Adjust the distance between the display device and the wireless near-field communication antenna so that it is equal to or greater than 5 mm. Advantageous effects of the invention

[0023] According to the present disclosure, a laminated transparent plate can be provided which can reduce noise generated in an image displayed by a display device due to a wireless near-field communication antenna. Brief description of the drawings Fig. Figure 1 is a schematic top view showing an example of a laminated transparent sheet according to a first embodiment; Fig. Figure 2 is a schematic top view of a display device 100; Fig. Figure 3 is a schematic top view of an electromagnetic shielding element 300; Fig. 4 is a sectional view along section line IV-IV in the Fig. 1; Fig. Figure 5 is a schematic partial top view showing an example of a display area 101 of the display device 100; Fig. 6 is a section view along section line VI-VI in the Fig. 5; Fig. Figure 7 is a sectional view showing an example of a method for manufacturing the display device 100; Fig. Figure 8 is a sectional view showing an example of the method for manufacturing the display device 100; Fig. Figure 9 is a sectional view showing an example of the method for manufacturing the display device 100; Fig. Figure 10 is a sectional view showing an example of the method for manufacturing the display device 100; Fig. Figure 11 is a sectional view showing an example of the method for manufacturing the display device 100; Fig. Figure 12 is a sectional view showing an example of the method for manufacturing the display device 100; Fig. Figure 13 is a sectional view showing an example of the method for manufacturing the display device 100; Fig. Figure 14 is a sectional view showing an example of the method for manufacturing the display device 100; Fig. Figure 15 is a schematic top view showing an example of a laminated transparent sheet according to a second embodiment; and Fig. Figure 16 is a schematic sectional view showing an example of a laminated transparent sheet according to a third embodiment. Description of embodiments

[0024] Specific embodiments of the present disclosure are described in detail below with reference to the drawings. However, the present disclosure is not limited to the following embodiments. For clarity, the following description and drawings have been simplified.

[0025] In this description, a "display device" refers to a device that allows visual information, such as a person, a background, and the like, located on the back surface of the display device, to be visually recognized in a desired usage environment. It should be noted that whether information is "visually recognizable" is determined at least in a non-display state of the display device, i.e., in a state where the display device is not switched on.

[0026] In this description, "transparent" means that the transmittance for visible light is equal to or greater than 20%, preferably equal to or greater than 40%, and more preferably equal to or greater than 60%. It can also mean that the transmittance is equal to or greater than 5% and the opacity is equal to or less than 20. If the transmittance is equal to or greater than 5%, an outdoor location will be visible with a brightness equal to or greater than that of an indoor location when viewed from the indoor location during the day, and adequate visibility can be ensured.

[0027] If the transmittance is equal to or greater than 40%, the back surface of the display can be visually detected without substantial difficulty, even if the brightness of the front and back surfaces of the display is approximately identical. If the opacity value is equal to or less than 10, sufficient background contrast can be ensured.

[0028] Regarding the term "transparent", it does not matter whether any color is present, i.e., "transparent" can be colorless transparent or colored transparent.

[0029] It should be noted that the transmittance refers to a value (%) measured by a method according to ISO 9050. The turbidity value refers to a value measured by a method according to ISO 14782. (First embodiment)<Aufbau einer laminierten transparenten Platte>

[0030] First, a structure of a laminated transparent sheet according to a first embodiment is described with reference to the Fig. 1 to 4 described. The Fig. Figure 1 is a schematic top view showing an example of a laminated transparent sheet according to the first embodiment. Fig. Figure 2 is a schematic top view of a display device 100. Fig. Figure 3 is a schematic top view of an electromagnetic shielding element 300. Fig. 4 is a sectional view along section line IV-IV in the Fig. 1.

[0031] As it is in Fig. Figures 1 to 4 show a laminated transparent plate 400 according to the present embodiment comprising a pair of transparent plates 420a and 420b, a display device 100, a wireless near field communication antenna 200 and an electromagnetic shielding element 300.

[0032] It should be noted that it goes without saying that the right-handed orthogonal xyz coordinates, which are in the Fig. Figure 1 and the following drawings serve to describe the positional relationships between components. Generally, the positive z-axis direction is a vertically upper side and the xy-plane is a horizontal plane, and these are common to all drawings.

[0033] The laminated transparent panel 400 according to the present embodiment is used, for example, as a window of a self-driving vehicle. The display device 100 shows, for example, a fare for the self-driving vehicle. A user of the self-driving vehicle then pays the fare using an integrated circuit (IC) via communication using the wireless near-field communication antenna 200.

[0034] Alternatively, the laminated transparent panel 400 can be used, for example, for an entrance window of a fee-based establishment. The display device 100 then shows, for example, an entrance fee for the establishment. A user of the establishment then pays the entrance fee with an IC card via communication using the wireless near-field communication antenna 200.

[0035] It should be noted that the display device 100 can show additional information, such as the remaining balance of the IC card. Furthermore, the laminated transparent panel 400 can be used as a window at the entrance of a room for easy access by a user with an IC card. In this case, for example, the name, ID number, and similar information of the user entering the room will be displayed on the display device 100.

[0036] Near-field communication (NFC) using the wireless near-field communication antenna 200 is a wireless communication method using a frequency within the 13.56 MHz band. International standards for near-field communication include, for example, ISO 18092, ISO 14443 Type A, ISO 14443 Type B, and ISO 15693.

[0037] The transparent sheets 420a and 420b of the laminated transparent sheet 400 according to the present embodiment are glass sheets. The transparent sheets 420a and 420b can, for example, be transparent resin sheets, such as acrylic sheets.

[0038] As it is in the Fig. As shown in Figure 4, the laminated transparent plate 400 according to the present embodiment is obtained by connecting the pair of transparent plates 420a and 420b via an intermediate film 410. In particular, the display device 100, the wireless near-field communication antenna 200, and the electromagnetic shielding element 300 are arranged between the pair of transparent plates 420a and 420b via the intermediate films 410a and 410b in the laminated transparent plate 400. The intermediate films 410a and 410b are, for example, made of polyvinyl butyral (PVB).

[0039] As it is in the Fig. As shown in Figure 4, the transparent plate 420a is arranged so that it is directed via the intermediate film 410a towards the display device 100. In other words, the transparent plate 420a is located on the visible side (vehicle exterior). Conversely, the transparent plate 420b is arranged so that it is directed via the intermediate film 410b towards the wireless near-field communication antenna 200. In other words, the transparent plate 420b is located on the reverse side (vehicle interior). It should be noted that in the Fig. 4. The positional relationship between the display device 100 and the wireless near-field communication antenna 200 can be opposite. In other words, the wireless near-field communication antenna 200 can be arranged on the side of the transparent plate 420a, while the wireless near-field communication antenna 200 can be arranged on the side of the transparent plate 420b.

[0040] As it is in Fig. 1, Fig. 2 and Fig. As shown in Figure 4, the display device 100 is a transparent display device comprising a transparent substrate (first substrate) 10, wiring 40 and a flexible wiring plate 60.

[0041] As it is in the Fig. As shown in Figure 1, the display device 100 is arranged at an end section of the laminated transparent plate 400 and the flexible wiring plate 60 extends from the transparent plates 420a and 420b.

[0042] It should be noted that, although this is not in the Fig. Figure 1 shows the flexible wiring plate 60 connected to a display device control circuit (first control circuit) 70 for controlling the display device 100, as shown in the Fig. Figure 15, which will be described later, shows the display device control circuit 70. In other words, the display device control circuit 70 is located outside the transparent plates 420a and 420b. The display device control circuit 70 is opaque. Therefore, the visibility on the rear surface through the transparent plates 420a and 420b is improved by locating the display device control circuit 70 outside the transparent plates 420a and 420b.

[0043] This includes, as it is in Fig. 1 and Fig. As shown in Figure 2, the display device 100 has a display area 101. As shown in the Fig. As shown in Figure 2, the display area 101 is an area composed of a plurality of pixels (PIX) and displays an image. It should be noted that the image includes letters or characters. As will be described in detail later, each pixel (PIX) in the display area 101 contains at least one light-emitting diode (LED) element. In other words, the display device 100 is a display device in which a single LED element is used as the display element in each pixel and which is referred to as an LED display or the like.

[0044] No LED elements are formed in a non-display area that is different from display area 101.

[0045] It should be noted that inorganic electroluminescence (EL) displays and inorganic electroluminescence (EL) displays also include LED displays, which incorporate LED elements as display elements.

[0046] Furthermore, the display device 100 can be a liquid crystal display that includes liquid crystal elements as display elements instead of LED elements.

[0047] Furthermore, the display device 100 may not be a transparent display device and may use an opaque substrate instead of the transparent substrate 10.

[0048] As it is in the Fig. As shown in Figure 2, the transparent substrate 10 includes, for example, the display area 101, and the wiring 40 and the LED elements connected to the wiring 40 are formed on a main surface of the transparent substrate 10. The LED elements are an example of small electronic elements, each with an area of ​​250,000 µm or less. 2 exhibit.

[0049] The wiring extends to 40, which is located in the Fig. The wiring is shown linearly in the x-axis and y-axis directions. The wires 40 extending in the x-axis direction have a large width at an end section of the transparent substrate 10 on the side of the positive x-axis direction, extend in the negative y-axis direction, and are then connected to the flexible wiring plate 60. In other words, at least parts of the wiring sections 40 extending in the negative y-axis direction are thicker than the sections extending in the x-axis direction. Furthermore, the wiring sections 40 extending in the y-axis direction have a large width at an end section of the transparent substrate 10 on the side of the negative y-axis direction and are connected to the flexible wiring plate 60.In other words, at sections of the wiring 40 that extend in the y-axis direction, their width in the negative y-axis direction is greater than at one end in the positive y-axis direction.

[0050] In Fig. 1 and Fig. 2 is an opaque area in which the wiring 40 is configured to have a large width, schematically shown as opaque wiring area 40a. In practice, the wide wiring 40 is provided as a densely packed wiring group within the opaque wiring area 40a. Therefore, it can also be observed that at least parts of the wiring 40 sections extending into the opaque wiring area 40a are thicker than the sections extending into the display area 101. It should be noted that the wiring 40 can have essentially the same line width in the x-axis direction (section of the display area) and the y-direction (opaque wiring area 40a) and can form a net-like wiring group within the opaque wiring area 40a.

[0051] It should be noted that each of the 40 wiring connections, which are in the Fig. 1 is drawn in a line form, formed from a plurality of fine wirings, as will be described later.

[0052] As described in detail later, the width of the fine wiring 40 is, for example, 1 µm to 100 µm and preferably 3 µm to 20 µm. Since the width of the wiring 40 is equal to or less than 100 µm, the wiring 40 is hardly visible even when the laminated transparent plate is viewed, for example, from a short distance of several tens of centimeters to about 2 meters, and the visibility on the back surface is excellent.

[0053] On the other hand, the width of the wires 40 in the opaque wiring area 40a is, for example, 100 µm to 10,000 µm and preferably 100 µm to 5,000 µm. Spacing between the wires is, for example, 3 µm to 5,000 µm and preferably 50 µm to 1,500 µm. The wires 40 in the opaque wiring area 40a can be visually detected. Therefore, the opaque wiring area 40a, which in the xy-view is essentially L-shaped along the circumferential edge section of the display device 100, is covered and concealed, for example, by certain means.

[0054] The flexible wiring plate 60 is a strip-shaped power supply device for supplying current to the display area 101. Since the flexible wiring plate 60 is opaque, it is connected to end sections of the wiring 40 formed on an edge section of the transparent substrate 10. In the Fig. 1, Fig. 2 and Fig. In the example shown, the flexible wiring plate 60 is connected to the end sections of the wiring 40 in the opaque wiring area 40a, which is formed on the end section of the transparent substrate 10 on the side of the negative y-axis direction. Corresponding to the opaque wiring area 40a, the flexible wiring plate 60 is also covered and concealed, for example, by certain means. The flexible wiring plate 60 can be electromagnetically shielded.

[0055] In the laminated transparent sheet 400, which is in the Fig. As shown in Figure 1, strip-shaped shielding layers 401 are provided along their entire circumferential edge. Since the shielding layers 401 block sunlight, deterioration of an adhesive (for example, a resin such as urethane) used to assemble the laminated transparent plate 400 with a vehicle due to ultraviolet radiation can be prevented.

[0056] It should be noted that, although the Fig. 1 is a top view, the shielding layers 401 and the opaque wiring area 40a are represented by dots for easy understanding.

[0057] If the laminated transparent sheet 400, which is in the Fig. As shown in Figure 4, the shielding layers 401 are formed on a surface of the transparent plate 420a on the inside of the vehicle and on a surface of the transparent plate 420b on the inside of the vehicle.

[0058] It should be noted that the shielding layer 401 can only be formed on one of the transparent plates 420a and 420b. Furthermore, the shielding layers 401 can be formed on the surfaces of the transparent plates 420a and 420b on the exterior of the vehicle.

[0059] This includes, as it is in Fig. 1 and Fig. As shown in Figure 4, the shielding layers 401 are designed to overlap the flexible wiring plate 60 and the opaque wiring area 40a. Therefore, the flexible wiring plate 60 and the opaque wiring area 40a are less likely to be visually detected from the inside and outside of the vehicle, and the design of the laminated transparent plate 400 is improved.

[0060] Although the shielding layers 401 are not specifically limited, they can be formed, for example, by applying and firing a ceramic color paste containing a fusible glass frit that contains a pigment. For example, an organic printing ink containing a pigment can be applied and dried to form the shielding layers 401. The shielding layers 401 can be formed from colored or dyed films or foils. Although the color of the pigment and the color of the colored or dyed films or foils can be any color, as long as visible light can be shielded to such an extent that at least one section to be concealed can be hidden, a dark color is preferred, and a black color is more preferred. Furthermore, the shielding layers 401 are preferably opaque.

[0061] As it is in Fig. 1 and Fig. As shown in Figure 4, the wireless near-field communication antenna 200 comprises a transparent substrate (second substrate) 210 and a coil 220.

[0062] As it is in the Fig. As shown in Figure 1, the coil 220 is a spirally structured wiring and is formed on the transparent substrate 210. The coil 220 is formed, for example, from a metal film of copper (Cu), aluminum (Al), silver (Ag), gold (Au), or the like. Of these, a metal containing copper or aluminum as a major component is preferred due to its low resistivity and low cost. The coil 220 can also be formed from a so-called transparent conductive metal oxide-based film of tin oxide (SnO2), indium oxide (In2O3), zinc oxide (ZnO), or the like.

[0063] The transparent substrate 210 is made of a material similar to that of the transparent substrate 10, which will be described in detail later.

[0064] As it is in the Fig. As shown in Figure 1, the wireless near-field communication antenna 200 is arranged such that it overlaps the display device 100 in plan view. Furthermore, wiring for driving the coil 220, i.e., the wireless near-field communication antenna 200, extends from the transparent plates 420a and 420b. In the present embodiment, the wiring for driving the wireless near-field communication antenna 200 is electromagnetically shielded. With such a design, noise generated in an image displayed by the display device 100 due to the wireless near-field communication antenna 200 can be more effectively reduced.

[0065] It should be noted that, although this is in the Fig. Not shown in Figure 1, an antenna drive circuit (second drive circuit) 230 for driving the wireless near-field communication antenna 200 is provided outside the transparent plates 420a and 420b, as shown in the Fig. Figure 15, which will be described later, shows the antenna control circuit 230, which is opaque. Therefore, visibility on the rear surface via the transparent plates 420a and 420b is improved by placing the antenna control circuit 230 outside of these plates.

[0066] As it is in Fig. 3 and Fig. As shown in Figure 4, the electromagnetic shielding element 300 comprises a transparent substrate (third substrate) 310 and a metal mesh film 320.

[0067] The transparent substrate 310 is made of a material similar to that of the transparent substrate 10, which will be described in detail later.

[0068] As it is in the Fig. As shown in Figure 3, the metal mesh film 320 is a metal film structured in a mesh form and formed on the transparent substrate 310. For example, the metal mesh film 320 is formed in a mesh form by a plurality of metal wires extending in the x-axis direction and a plurality of metal wires extending in the y-axis direction that intersect each other. The plurality of metal wires extending in the x-axis or y-axis direction is not restricted to a linear shape and can be configured in a sinusoidal waveform or a triangular waveform.

[0069] The metal mesh film 320, for example, is a metal that contains copper (Cu), nickel (Ni), iron (Fe) and chromium (Cr) as a main component.

[0070] The line width of the metal mesh film 320 is, for example, 3 µm to 200 µm. The line width of the metal mesh film 320 is preferably 5 µm to 100 µm and more preferably 5 µm to 50 µm. The larger the line width, the better the electromagnetic shielding performance, and the smaller the line width, the better the visibility.

[0071] The thickness of the metal mesh film 320 is, for example, 0.1 µm to 5.0 µm. The thickness of the metal mesh film 320 is preferably 0.3 µm to 3.0 µm and more preferably 0.4 µm to 2.0 µm. The greater the thickness, the better the electromagnetic shielding performance.

[0072] The line spacing of the metal mesh film 320 is, for example, 100 µm to 6000 µm. The line spacing of the metal mesh film 320 is preferably 200 µm to 4000 µm and more preferably 300 µm to 3000 µm. The larger the line spacing, the better the visibility, and the smaller the line spacing, the better the electromagnetic shielding performance.

[0073] As it is in Fig. 1 and Fig. As shown in Figure 4, the electromagnetic shielding element 300 is provided between the display device 100 and the wireless near-field communication antenna 200, which are arranged so that they overlap in plan view. With such a setup, noise generated in an image displayed by the display device 100 due to the wireless near-field communication antenna 200 can be reduced.

[0074] This overlaps, as is described in the Fig. As shown in Figure 1, the electromagnetic shielding element 300 preferably covers the entire wireless near-field communication antenna 200 in a top view. Furthermore, the electromagnetic shielding element 300 preferably overlaps the entire display device 100 in a top view. With such a configuration, the laminated transparent plate 400 according to the present embodiment can more effectively reduce noise generated in an image displayed by the display device 100 due to the wireless near-field communication antenna 200.

[0075] It should be noted that, although the wireless near-field communication antenna 200 is arranged such that the entire wireless near-field communication antenna 200 surrounds the display device 100 in the Fig. 1. The wireless near-field communication antenna 200 can be arranged such that part of it overlaps the display device 100. In this case, the electromagnetic shielding element 300 can only be arranged in an area where the wireless near-field communication antenna 200 and the display device 100 overlap, or it can be arranged such that it overlaps either only the entire wireless near-field communication antenna 200 or the entire display device 100.

[0076] As described above, the electromagnetic shielding element 300 is provided between the display device 100 and the wireless near-field communication antenna 200, which are arranged such that they overlap in the top view within the laminated transparent plate 400 according to the present embodiment. Therefore, the laminated transparent plate 400 according to the present embodiment can reduce noise generated in an image displayed by the display device 100 due to the wireless near-field communication antenna 200. <Detaillierter Aufbau des Anzeigebereichs 101>

[0077] Next, a detailed construction of the display area 101 of the display device 100 will be given with reference to Fig. 5 and Fig. 6 described. Fig. Figure 5 is a schematic partial top view showing an example of the display area 101 of the display device 100. Fig. 6 is a section view along section line VI-VI in the Fig. 5.

[0078] As it is in Fig. 5 and Fig. As shown in Figure 6, the display device 100 is a transparent display device comprising the transparent substrate 10, a light-emitting unit 20, an integrated circuit (IC) chip 30, the wiring 40, and a protective layer 50. The display area 101 is an area formed from a plurality of pixels and displays an image. It should be noted that the image includes letters or characters. As shown in the Fig. As shown in Figure 2, the display area 101 is formed from the plurality of pixels PIX, which are aligned in a row direction (x-axis direction) and a column direction (y-axis direction).

[0079] It should be noted that the Fig. 5 shows a portion of the display area 101 and displays a total of four pixels, including two pixels in each of the row and column directions. Each pixel (PIX) is surrounded by a single-dot dash line. Furthermore, the transparent substrate 10 and the protective layer 50, which are located in the Fig. 6 are shown, in the Fig. 5 omitted. Furthermore, the Fig. 5 A top view and the light-emitting unit 20 and the IC chip 30 are indicated by dots for easy understanding. <Planare Anordnung der lichtemittierenden Einheit 20, des IC-Chips 30 und der Verdrahtungen 40>

[0080] First, the planar arrangement of the light-emitting unit 20, the IC chip 30, and the wiring 40 is described with reference to the Fig. 5 described.

[0081] As it is in the Fig. As shown in Figure 5, the pixel PIX, which is surrounded by the single-dot dashed line, is arranged in a matrix form with a pixel spacing Px in the row direction (x-axis direction) and a pixel spacing Py in the column direction (y-axis direction). Each pixel PIX comprises the light-emitting unit 20 and the IC chip 30, as shown in the Fig. Figure 5 is shown. In other words, the light-emitting unit 20 and the IC chip 30 are arranged in a matrix form with pixel spacing Px in the row direction (x-axis direction) and with pixel spacing Py in the column direction (y-axis direction).

[0082] It should be noted that the arrangement of the pixels PIX, i.e., the light-emitting units 20, is not limited to the matrix form, as long as they are arranged at a given pixel distance in a given direction.

[0083] As it is in the Fig. As shown in Figure 5, the light-emitting unit 20 in each pixel (PIX) comprises at least one LED element.

[0084] In the example of Fig. 5 Each light-emitting unit 20 comprises a red LED element 21, a green LED element 22, and a blue LED element 23. The LED elements 21 to 23 correspond to subpixels (partial pixels) that form a pixel. Since each light-emitting unit 20 comprises the LED elements 21 to 23, which emit light of red, green, and blue colors, which are the three primary colors of light, the display device according to the present embodiment can display a color image.

[0085] It should be noted that each light-emitting unit can comprise 20 or more LED elements of similar color. Consequently, it is possible to expand the dynamic range of the image.

[0086] The LED elements 21 to 23 are small and are so-called micro-LED elements. In particular, the width (length in the x-axis direction) and length (length in the y-axis direction) of LED element 21 on the transparent substrate 10 are, for example, equal to or less than 100 µm, preferably equal to or less than 50 µm, and more preferably equal to or less than 20 µm. The same applies to LED elements 22 and 23. The lower limit of the width and length of the LED element is, for example, equal to or greater than 3 µm, taking into account various manufacturing conditions and the like.

[0087] It should be noted that, although the dimensions, i.e., the widths and lengths, of the LED elements 21 to 23 in the Fig. 5 are identical, but their dimensions may differ from each other.

[0088] The area occupied by each of the LED elements 21 to 23 on the transparent substrate 10 is, for example, equal to or less than 10000 µm². 2 , is preferably equal to or less than 3000 µm 2 and is preferably equal to or less than 500 µm 2 It should be noted that the lower limit of the area occupied by an LED element may be equal to or greater than 10 µm due to various manufacturing conditions and the like. 2 is. In this description, the areas occupied by components such as LED elements, wiring, and the like refer to areas with respect to the xy-plane in the Fig. 5.

[0089] It should be noted that, although the shape of the LED elements 21 to 23, which are in the Fig. Figure 5 shows a rectangular shape (including a square shape), the shape is not specifically restricted.

[0090] Since the LED elements 21 to 23, for example, have a mirror structure for efficient light extraction on the visible side, their transmittance is low, for example, around 10% or less. However, the LED elements 21 to 23 are small, with an area of ​​10,000 µm or less. 2As described above, the LED elements 21 to 23 are used in the display device according to the present embodiment. Therefore, the LED elements are barely visible even when the display device is viewed from a short distance of, for example, several tens of centimeters to about 2 meters. Furthermore, the low-transmittance area in the display area 101 is narrow, and visibility on the rear surface is excellent. In addition, there is a high degree of freedom in the arrangement of the wiring 40 and the like.

[0091] It should be noted that "the low transmittance area in display area 101," for example, is an area where the transmittance is equal to or less than 20%. The same applies to the following description.

[0092] Furthermore, since the LED elements 21 to 23 are small, it is unlikely that the LED elements will be damaged even if the display device is curved. Therefore, the display device according to the present embodiment can be used by mounting it on a curved transparent plate, such as a window pane for a motor vehicle or automobile, or by enclosing it between two curved transparent plates. The display device according to the present embodiment can be curved by using a flexible material as the transparent substrate 10.

[0093] Although the LED elements 21 to 23 are not specifically restricted, they are, for example, inorganic materials. The red LED element 21 is, for example, AlGaAs, GaAsP, GaP, or the like. The green LED element 22 is, for example, InGaN, GaN, AlGaN, GaP, AlGalnP, ZnSe, or the like. The blue LED element 23 is, for example, InGaN, GaN, AlGaN, ZnSe, or the like.

[0094] The luminous efficacy, i.e., the energy conversion efficiency, of the LED elements 21 to 23 is, for example, equal to or greater than 1%, is preferably equal to or greater than 5%, and is more preferably equal to or greater than 15%. If the luminous efficacy of the LED elements 21 to 23 is equal to or greater than 1%, sufficient luminance can be obtained even with the small size of the LED elements 21 to 23 described above, and the display device can even be used during the day. Furthermore, if the luminous efficacy of the LED elements is equal to or greater than 15%, heat generation is prevented, and encapsulation within the laminated glass using a resin adhesive layer is facilitated.

[0095] Each of the pixel spacings Px and Py is, for example, 100 µm to 3000 µm, preferably 180 µm to 1000 µm, and more preferably 250 µm to 400 µm. High transparency can be achieved while ensuring sufficient display capability by setting the pixel spacings Px and Py within the aforementioned range. Furthermore, a diffraction phenomenon that can be caused by light from the rear surface of the display device can be prevented.

[0096] Furthermore, the pixel density in the display area 101 of the display device according to the present embodiment is, for example, equal to or greater than 10 ppi, is preferably equal to or greater than 30 ppi and is more preferably equal to or greater than 60 ppi.

[0097] Furthermore, the area of ​​a pixel is PIX Px × Py and this area is, for example, 1 × 10 4 µm 2 up to 9 × 10 6 µm 2 preferably 3 × 10 4µm 2 up to 1 × 10 6 µm 2 and preferably amounts to 6 × 10 4 µm 2 up to 2 × 10 5 µm 2 By setting the area of ​​a pixel to 1 × 10 4 µm 2 up to 9 × 10 6 µm 2 The transparency of the display device can be improved while ensuring adequate display capability. The area of ​​a pixel can be selected appropriately according to the size, application, viewing distance, and the like of the display area 101.

[0098] The proportion of the area occupied by the LED elements 21 to 23, relative to the area of ​​a pixel, is, for example, equal to or less than 30%, is preferably equal to or less than 10%, is more preferably equal to or less than 5%, and is more preferably equal to or less than 1%. The transparency and visibility on the back surface are improved by adjusting the proportion of the area occupied by the LED elements 21 to 23, relative to the area of ​​a pixel, to equal to or less than 30%.

[0099] Although the three LED elements 21 to 23 are arranged in such a way that they are in a line in the positive x-axis direction in this order in each pixel in the Fig. The present disclosure is not limited to the arrangement shown in Figure 5. For example, the arrangement order of the three LED elements 21 to 23 can be changed. Furthermore, the three LED elements 21 to 23 can be arranged in the y-axis direction. Alternatively, the three LED elements 21 to 23 can be arranged at the vertices of a triangle.

[0100] Furthermore, in a case where each light-emitting unit 20 comprises the majority of LED elements 21 to 23, as is the case in the Fig. As shown in Figure 5, the spacing of the LED elements 21 to 23 in the light-emitting unit 20 is, for example, equal to or less than 100 µm and is preferably equal to or less than 10 µm. Furthermore, the LED elements 21 to 23 can be arranged so that they are in contact with each other. In this way, a first power supply branch line 41a can be easily shared and an opening ratio can be improved.

[0101] It should be noted that, although the arrangement order, the arrangement direction and the like of the majority of LED elements in each light-emitting unit 20 in the example of Fig. While the 5 are identical, they can be different. Furthermore, in a case where each light-emitting unit 2 comprises three LED elements emitting light of different wavelengths, the LED elements can be arranged such that in some of the light-emitting units 20 they are aligned in the x-axis or y-axis direction, while in other light-emitting units 20 the LED elements of each color can be arranged at the vertices of a triangle.

[0102] In the example of Fig. The IC chip 30 is arranged for each pixel (PIX) and controls the light-emitting unit 20. Specifically, the IC chip 30 is connected to each of the LED elements 21 to 23 via control lines 45 and can control the LED elements 21 to 23 individually. The IC chip 30 is, for example, a hybrid IC that includes an analog section and a logic section. The analog section includes, for example, a current control circuit, a converter circuit, and the like.

[0103] It should be noted that the IC chip 30 can be arranged for a plurality of pixels, and each IC chip 30 can control the plurality of connected pixels. If one IC chip 30 is arranged for every four pixels, for example, the number of IC chips 30 can be reduced to 1 / 4 of the number in the example of Fig. 5 can be reduced, and the area occupied by the IC chips 30 can be reduced. Furthermore, the IC chip 30 is not essential.

[0104] The area of ​​an IC chip 30 is, for example, equal to or less than 100,000 µm. 2 , is preferably equal to or less than 10000 µm 2 and is preferably equal to or less than 5000 µm 2 Although the transmittance of the IC chips 30 has a low value of about 20% or less, the area with low transmittance in the display area 101 becomes narrow, and the visibility on the back surface side is improved by using the IC chips 30 of the aforementioned size.

[0105] As it is in the Fig. As shown in Figure 5, the wiring 40 comprises a plurality of power supply lines 41, a plurality of grounding lines 42, a plurality of row data lines 43, a plurality of column data lines 44 and a plurality of control lines 45.

[0106] In the example of Fig. The power supply lines 41, the grounding lines 42, and the column data lines 44 extend in the y-axis direction. Conversely, the row data lines 43 extend in the x-axis direction.

[0107] In each pixel PIX, the power supply line 41 and the column data line 44 are located closer to the negative x-axis direction than the light-emitting unit 20 and the IC chip 30, and the ground line 42 is located closer to the positive x-axis direction than the light-emitting unit 20 and the IC chip 30. The power supply line 41 is located closer to the negative x-axis direction than the column data line 44. In pixel PIX, the row data line 43 is located closer to the negative y-axis direction than the light-emitting unit 20 and the IC chip 30.

[0108] Although a detailed description is given later, the power supply line 41 comprises a first power supply branch line 41a and a second power supply branch line 41b, as described in the Fig. Figure 5 shows that the grounding line 42 includes a grounding branch line 42a. The row data line 43 includes a row data branch line 43a. The column data line 44 includes a column data branch line 44a. Each of these branch lines is incorporated into the wiring 40.

[0109] As it is in the Fig. As shown in Figure 5, each power supply line 41 extending in the y-axis direction is connected to the light-emitting unit 20 and the IC chip 30 of each of the pixels PIX, which are positioned such that they are oriented in the y-axis direction. Specifically, the LED elements 21 to 23 are positioned in the positive x-axis direction, in this order, on the side closer to the positive x-axis direction than the power supply line 41 in each pixel PIX. Therefore, the first power supply branch line 41a, which branches off from the power supply line 41 in the positive x-axis direction, is connected to the end sections of the LED elements 21 to 23 on the side of the positive y-axis direction.

[0110] In each pixel (PIX), the IC chip 30 is located on the side of the negative y-axis direction of the LED elements 21 to 23. Therefore, the second power supply branch line 41b, which branches off from the first power supply branch line 41a in the negative y-axis direction, extends linearly and is connected to the side of the negative x-axis direction of the end section of the IC chip 30 on the side of the positive y-axis direction between the LED element 21 and the column data line 44.

[0111] As it is in the Fig. As shown in Figure 5, each grounding line 42 extending in the y-axis direction is connected to the IC chip 30 of each of the pixels PIX, which are provided such that they are aligned in the y-axis direction. In particular, the grounding branch line 42a, which branches off from the grounding line 42 in the negative x-axis direction, extends linearly and is connected to the end section of the IC chip 30 on the side of the positive x-axis direction.

[0112] The grounding line 42 is connected to the LED elements 21 to 23 via the grounding branch line 42a, the IC chip 30 and the control lines 45.

[0113] As it is in the Fig. As shown in Figure 5, each row data line 43 extending in the x-axis direction is connected to the IC chip 30 of each of the pixels (PIX) that are provided such that they are aligned in the x-axis (row) direction. In particular, the row data line branch line 43a, which branches from the row data line 43 in the positive y-axis direction, extends linearly and is connected to the end section of the IC chip 30 on the side of the negative y-axis direction.

[0114] The line data line 43 is connected to the LED elements 21 to 23 via the line data branch line 43a, the IC chip 30 and the control lines 45.

[0115] As it is in the Fig. As shown in Figure 5, each column data line 44 extending in the y-axis direction is connected to the IC chip 30 of each of the pixels (PIX) that are provided such that they are aligned in the y-axis direction (column direction). In particular, the column data branch line 44a, which branches off from the column data line 44 in the positive x-axis direction, extends linearly and is connected to the end section of the IC chip 30 on the side of the negative x-axis direction.

[0116] The column data line 44 is connected to the LED elements 21 to 23 via the column data branch line 44a, the IC chip 30 and the control lines 45.

[0117] In each pixel PIX, the control lines 45 connect the LED elements 21 to 23 to the IC chip 30. In particular, in each pixel PIX, the three control lines 45 extend in the y-axis direction, and each of the control lines 45 connects the end section of each of the LED elements 21 to 23 on the side of the negative y-axis direction to the end section of the IC chip 30 on the side of the positive y-axis direction.

[0118] It should be noted that the arrangement of the power supply line 41, the grounding line 42, the row data line 43, the column data line 44, the branch lines thereof and the control lines 45, which are in the Fig. Figure 5 is merely an example and can be modified as appropriate. For instance, at least either the power supply line 41 or the grounding line 42 can extend in the x-axis direction instead of the y-axis direction. Furthermore, a configuration can be used in which the power supply line 41 and the column data line 44 are replaced.

[0119] Furthermore, a structure that is vertically inverted, which is located in the Fig. As shown in Figure 5, a structure is obtained by horizontally inverting the entire structure, which is located in the Fig. 5 is shown, is obtained, or the like is used.

[0120] Furthermore, the row data line 43, the column data line 44, their branch lines and the control lines 45 are not essential.

[0121] The wiring 40 is, for example, a metal such as copper (Cu), aluminum (Al), silver (Ag), or gold (Au). Of these, a metal containing copper or aluminum as its main component is preferred due to its low resistivity and low cost. Furthermore, the wiring 40 can be coated with a material such as titanium (Ti), molybdenum (Mo), copper oxide, or carbon to reduce reflection. Irregularities can also be formed on the surface of the coated material.

[0122] The width of all wiring 40 in the display area 101, which is in the Fig. As shown in Figure 5, the thickness is, for example, 1 µm to 100 µm and preferably 3 µm to 20 µm. If the width of the wiring 40 is equal to or less than 100 µm, the wiring 40 itself is hardly visible, even when the display device is viewed from a short distance of, for example, several tens of centimeters to about 2 meters, and visibility on the rear surface is excellent. On the other hand, in the case of the thickness range described later, an excessive increase in the resistance of the wiring 40, as well as a voltage drop and a decrease in signal intensity, can be prevented if the width of the wiring 40 is equal to or greater than 1 µm. In addition, a reduction in thermal conductivity due to the wiring 40 can also be prevented.

[0123] In a case where the wiring 40 extends predominantly in the x-axis and y-axis directions, as described in the Fig. As shown in Figure 5, a transverse diffraction pattern extending in the x-axis and y-axis directions can be generated by light emitted from outside the display device, and the visibility on the rear surface of the display device can be reduced. By reducing the width of each wire, this diffraction can be prevented and the visibility on the rear surface can be further improved. The width of the wires 40 is equal to or less than 50 µm with regard to preventing diffraction, is preferably equal to or less than 10 µm, and is more preferably equal to or less than 5 µm.

[0124] The specific electrical resistance of the wiring 40 is, for example, equal to or less than 1.0 × 10 -6Ωm and is preferably equal to or less than 2.0 × 10⁻⁶ 8 Ωm. The thermal conductivity of the wiring 40 is, for example, 150 W / (m · K) to 5500 W / (m · K) and is preferably 350 W / (m · K) to 450 W / (m · K).

[0125] The distances between the adjacent wiring 40 in the display area 101, which is located in the Fig. As shown in Figure 5, the distances are, for example, 3 µm to 100 µm and preferably 5 µm to 30 µm. If there is an area where the wires 40 are densely packed, visual detection on the back surface may be obstructed. If the distances between the adjacent wires 40 are equal to or greater than 3 µm, such obstruction of visual detection can be prevented. Conversely, if the distances between the adjacent wires 40 are equal to or less than 100 µm, sufficient detection capability can be ensured.

[0126] It should be noted that in a case where the distances between the adjacent wirings 40 are not constant due to a curvature of the wirings 40 or the like, the distances between the adjacent wirings 40 described above represent the minimum value thereof.

[0127] The proportion of the area occupied by the wiring 40 in relation to the area of ​​a pixel is, for example, equal to or less than 30%, is preferably equal to or less than 10%, is more preferably equal to or less than 5%, and is more preferably equal to or less than 3%. The transmittance of the wiring 40 has a low value of 20% or less, or 10% or less. However, by setting the proportion of the area occupied by the wiring 40 in a pixel to equal to or less than 30%, an area with low transmittance in the display area 101 becomes narrow, and the visibility on the back-side is improved.

[0128] Furthermore, the sum of the areas occupied by the light-emitting unit 20, the IC chip 3 and the wiring 40, in relation to the area of ​​a pixel, is, for example, equal to or less than 30%, preferably equal to or less than 20%, and more preferably equal to or less than 10%. <Schnittaufbau des Anzeigebereichs 101>

[0129] Next, a sectional view of the display area 101, which is formed on the transparent substrate 10 in the display device 100, is shown with reference to the Fig. 6 described.

[0130] The transparent substrate 10 is a transparent material with insulating properties. In the example of Fig. 6 the transparent substrate 10 has a two-layer structure comprising a main substrate 11 and an adhesive layer 12.

[0131] As will be described in detail later, the main substrate 11, for example, is a transparent resin.

[0132] The adhesive layer 12 is, for example, a transparent resin hardener of an epoxy type, an acrylic type, a silicone type, an olefin type, a polyimide type, a novolac type or the like.

[0133] It should be noted that the main substrate 11 can be a thin glass plate with a thickness of, for example, 200 µm or less, and preferably 100 µm or less. Furthermore, the adhesive layer 12 is not essential.

[0134] Examples of the transparent resin forming the main substrate 11 include polyester-based resins, such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); olefin-based resins, such as a cycloolefin polymer (COP) and a cycloolefin copolymer (COC); cellulose-based resins, such as cellulose, acetylcellulose, and triacetylcellulose (TAC); imide-based resins, such as polyimide (PI); amide-based resins, such as polyamide (PA); amide-imide-based resins, such as polyamide-imide (PAI); carbonate-based resins, such as polycarbonate (PC); sulfone-based resins, such as polyethersulfone (PES); para-xylene-based resins, such as polypara-xylene; and vinyl-based resins, such as polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polyvinyl acetate (PVAc), and polyvinyl alcohol. (PVA) and polyvinyl butyral (PVB), and acrylic-based resins, such as polymethyl methacrylate (PMMA), an ethylene-vinyl acetate copolymer resin (EVA), urethane-based resins, such asthermoplastic polyurethane (TPU), and epoxy-based resins.

[0135] Of the materials described above that are used for the main substrate 11, polyethylene naphthalate and polyimide are preferred with regard to improving heat resistance. Furthermore, a cycloolefin polymer, a cycloolefin copolymer, polyvinyl butyral, and the like are preferred with regard to their low birefringence indices and their ability to reduce distortion and blurring of an image viewed through the transparent insulating substrate.

[0136] The aforementioned materials can be used alone, or two or more types of materials can be mixed and used. Furthermore, the main substrate 11 can be formed by laminating flat sheets of different materials.

[0137] The thickness of the transparent substrate 10 is, for example, 1 µm to 1000 µm and is preferably 5 µm to 200 µm. The internal transmittance for visible light of the transparent substrate 10 is, for example, equal to or greater than 50%, is preferably equal to or greater than 70%, and is more preferably equal to or greater than 90%.

[0138] Furthermore, the transparent substrate 10 can exhibit flexibility. This allows the transparent display device to be used, for example, by mounting it on a curved transparent plate or by arranging it between two curved transparent plates. In addition, the transparent substrate 10 can be a material that contracts when heated to 100 °C or higher.

[0139] As it is in the Fig. As shown in Figure 6, the LED elements 21 to 23 and the IC chip 30 are provided on the transparent substrate 10, i.e., the adhesive layer 12, and are connected to the wiring 40, which is arranged on the transparent substrate 10. In the example of Fig. 6 the wiring 40 is formed by a first metal layer M1, which is formed on the main substrate 11, and a second metal layer M2, which is formed on the adhesive layer 12.

[0140] The thickness of the wiring 40, i.e., the sum of the thickness of the first metal layer M1 and the thickness of the second metal layer M2, is, for example, from 0.1 µm to 10 µm and is preferably 0.5 µm to 5 µm. The thickness of the first metal layer M1 is, for example, about 0.5 µm, while the thickness of the second metal layer M2 is, for example, about 3 µm.

[0141] In particular, as can be seen in the Fig. As shown in Figure 6, the grounding conductor 42, which extends in the y-axis direction, forms a two-layer structure comprising the first metal layer M1 and the second metal layer M2, due to the large current. In other words, the adhesive layer 12 is removed, and the second metal layer M2 is formed on the first metal layer M1 at the point where the grounding conductor 42 is located. Although this is not shown in the Fig. As shown in Figure 6, the power supply line 41, the row data line 43 and the column data line 44, which are located in the Fig. Figure 5 shows a two-layer structure comprising the first metal layer M1 and the second metal layer M2.

[0142] The power supply line 41, the grounding line 42, and the column data line 44, which extend in the y-axis direction, intersect the row data line 43, which extends in the x-axis direction, as shown in the Fig. 5 is shown. Although this is in the Fig. As shown in Figure 6, the row data line 43 is formed only by the first metal layer M1, and the power supply line 41, the grounding line 42, and the column data line 44 are formed only by the second metal layer M2 at the intersection point. At this intersection point, the adhesive layer 12 is provided between the first metal layer M1 and the second metal layer M2, and the first metal layer M1 and the second metal layer M2 are insulated from each other.

[0143] Accordingly, the first power supply branch line 41a is formed only by the first metal layer M1, and the column data line 44 is formed only by the second metal layer M2 at the intersection between the column data line 44 and the first power supply branch line 41a, as shown in the Fig. 5 is shown.

[0144] In the example of Fig. 6. The grounding branch line 42a, the control line 45, and the first power supply branch line 41a are formed only by the second metal layer M2 and are designed to cover the end sections of the LED elements 21 to 23 and the IC chip 30. Although this is in the Fig. As shown in Figure 6, the second power supply branch line 41b, the row data branch line 43a and the column data branch line 44a are formed only by the second metal layer M2.

[0145] It should be noted that the first power supply branch line 41a is formed only by the first metal layer M1 at the intersection with the column data line 44, as described above, and at the other locations only by the second metal layer M2. Furthermore, a metal contact point made of copper, silver, gold, or the like may be arranged on the wiring 40 formed on the transparent substrate 10, and at least either the LED elements 21 to 23 or the IC chip 30 may be arranged on it.

[0146] The protective layer 50 is a transparent resin formed on substantially the entire surface of the transparent substrate 10 to cover and protect the light-emitting unit 20, the IC chip 30 and the wiring 40.

[0147] The thickness of the protective layer 50 is, for example, 3 µm to 1000 µm and preferably 5 µm to 200 µm. The thickness of the protective layer 50 may not be uniform, as long as it lies within the aforementioned range.

[0148] The elastic modulus of the protective layer 50, for example, is equal to or less than 10 GPa. A lower elastic modulus allows for better absorption of impacts or shocks during removal, thus preventing damage to the protective layer 50.

[0149] The internal transmittance for visible light of the protective layer 50 is, for example, equal to or greater than 50%, is preferably equal to or greater than 70%, and is more preferably equal to or greater than 90%.

[0150] It should be noted that the protective layer 50 is not essential.

[0151] Examples of the transparent resin forming the protective layer 50 include vinyl-based resins such as polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polyvinyl acetate (PVAc), polyvinyl alcohol (PVA) and polyvinyl butyral (PVB); olefin-based resins such as a cycloolefin polymer (COP) and a cycloolefin copolymer (COC); urethane-based resins such as a thermoplastic polyurethane (TPU); polyester-based resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); acrylic-based resins such as polymethyl methacrylate (PMMA), ethylene-vinyl acetate copolymer resins (EVA) and thermoplastic resins of copolymers thereof.

[0152] A transparent resin adhesive can be used as the transparent resin that forms the protective layer 50, forming the adhesive layer 12.

[0153] It should be noted that the protective layer 50 may be formed from one type of transparent resin or from a plurality of types of transparent resins. <Verfahren zur Herstellung einer Anzeigevorrichtung>

[0154] Next, an example of a method for manufacturing the display device according to the first embodiment will be given with reference to Fig. 6 and 7 to 14 described. The Fig. Figures 7 to 14 are sectional views showing an example of the method for manufacturing the display device according to the first embodiment. Fig. Figures 7 to 14 are sectional views, which the Fig. 6 correspond and show a state in which the display area 101 is formed on the transparent substrate 10.

[0155] First, as is stated in the Fig. As shown in Figure 7, the first metal layer M1 is formed on substantially the entire surface of the main substrate 11, and the first metal layer M1 is then structured by photolithography, thereby forming a wiring of the lower layer. In particular, the wiring of the lower layer is formed by the first metal layer M1 at the positions where the power supply line 41, the grounding line 42, the row data line 43, the column data line 44, and the like are located, as shown in the Fig. 5 are shown, which are to be formed.

[0156] It should be noted that wiring of the lower layer is not formed at intersections of the power supply line 41, the earthing line 42 and the column data line 44 with the row data line 43.

[0157] Next, as it says in the Fig. As shown in Figure 8, the adhesive layer 12 is formed on substantially the entire surface of the main substrate 11 and the LED elements 21 to 23 and the IC chip 30 are then mounted on the adhesive layer 12, which has a stickiness (i.e., on the transparent substrate 10).

[0158] The LED elements 21 to 23 are obtained by growing crystals on a wafer using, for example, a liquid-phase growth process, a hydride vapor deposition (HVPE) process, a metal-organic chemical vapor deposition (MOCVD) process, or the like, and then structuring the crystals. The LED elements 21 to 23, structured on the wafer, are transferred, for example, using a microtransfer printing technique, to the transparent substrate 10. For the IC chip 30, the IC chip 30, which is structured on a Si wafer, is transferred, for example, using a microtransfer printing technique, to the transparent substrate 10 according to the LED elements 21 to 23.

[0159] Next, as it says in the Fig. As shown in Figure 9, a photoresist FR1 is formed on substantially the entire surface of the transparent substrate 10, including the main substrate 11 and the adhesive layer 12, and the photoresist FR1 on the first metal layer M1 is then removed by structuring. In this process, the photoresist FR1 is removed at the intersections of the line data line 43 with the power supply line 41, the grounding line 42, and the column data line 44, which are located in the Fig. 5 are shown, not removed.

[0160] Next, as it says in the Fig. As shown in Figure 10, the adhesive layer 12 at the point from which the photoresist FR1 has been removed is removed by dry etching, so that the first metal layer M1, i.e., the wiring of the lower layer, is exposed.

[0161] Next, as it says in the Fig. As shown in Figure 11, the photoresist FR1 is completely removed from the transparent substrate 10. A plating seed layer, not shown, is then formed on substantially the entire surface of the transparent substrate 10.

[0162] Next, as it says in the Fig. As shown in Figure 12, a photoresist FR2 is formed on substantially the entire surface of the transparent substrate 10, and the photoresist FR2 at the location where the wiring of the top layer is to be formed is then removed by structuring, thereby exposing the nucleation layer.

[0163] Next, as it says in the Fig. As shown in Figure 13, the second metal layer M2 is formed by plating at the point from which the photoresist FR2 has been removed, i.e., on the nucleation layer. In this way, the wiring of the upper layer is formed by the second metal layer M2.

[0164] Next, as it says in the Fig. As shown in Figure 14, the photoresist FR2 is removed. Furthermore, the nucleation layer exposed by the removal of the photoresist FR2 is removed by etching.

[0165] As described above, the display area 101 is formed on the transparent substrate 10. (Second embodiment)

[0166] Next, a laminated transparent sheet is produced according to a second embodiment with reference to the Fig. 15 described. The Fig. Figure 15 is a schematic top view showing an example of a laminated transparent sheet according to the second embodiment. Fig. 15 is a diagram that the Fig. 1 corresponds to the first embodiment.

[0167] In the laminated transparent sheet 400 according to the first embodiment, which is in the Fig. As shown in Figure 1, the wireless near-field communication antenna 200 is arranged so that it overlaps the display device 100 in the top view.

[0168] On the other hand, in the laminated transparent sheet 400 according to the present embodiment, which is in the Fig. As shown in Figure 15, a display device 100 and a wireless near-field communication antenna 200 are arranged such that they are positioned at a predetermined distance d in the top view. Therefore, the electromagnetic shielding element 300, which is shown in the Fig. 1 is shown, in the Fig. 15 not needed.

[0169] In particular, the laminated transparent sheet 400 according to the present embodiment, which is in the Fig. Figure 15 shows the wireless near-field communication antenna 200 arranged with a deviation of the distance d from the display device 100 along outer edge sections of the transparent plates 420a and 420b.

[0170] With such a structure, the laminated transparent plate 400 according to the present embodiment can reduce the noise generated in an image displayed by the display device 100 due to the wireless near-field communication antenna 200 without providing the electromagnetic shielding element 300.

[0171] The distance d between the display device 100 and the wireless near-field communication antenna 200, which is located in the Fig. The distance d shown in Figure 15 is equal to or greater than 5 mm. The distance d is preferably equal to or greater than 10 mm and more preferably equal to or greater than 15 mm. In particular, the distance d is the shortest distance between wiring 40 of the display device 100 and a coil 220 of the wireless near-field communication antenna 200.

[0172] With a larger distance d, the noise generated in an image displayed by the display device 100 due to the wireless near-field communication antenna 200 can be reduced even further. On the other hand, if the distance d, i.e., the distance between the position of the wireless near-field communication antenna 200, over which a user places an IC card, and the position of the display device 100, where a predetermined information is displayed, is excessively large, the user's convenience is reduced.

[0173] According to the display device 100, which is located in the Fig. As shown in Figure 1, the display device 100 is located in the Fig. As shown in Figure 15, a flexible wiring board 60 is provided at an end section of the laminated transparent plate 400, and extends from the transparent plates 420a and 420b. The flexible wiring board 60 is connected to a display device control circuit 70 for controlling the display device 100. In other words, the display device control circuit 70 is provided outside the transparent plates 420a and 420b.

[0174] It should be noted that an antenna control circuit 230 for controlling a wireless near-field communication antenna 200 is provided outside the transparent plates 420a and 420b, as shown in the Fig. Figure 15 shows that a wiring connection for driving the coil 220, i.e., the wireless near-field communication antenna 200, extends from the transparent plates 420a and 420b.

[0175] As described above, the display device 100 and the wireless near-field communication antenna 200 are arranged such that they are aligned at a predetermined distance d (d ≥ 5 mm) in the top view within the laminated transparent plate 400 according to the present embodiment. Therefore, the laminated transparent plate 400 according to the present embodiment can reduce the noise generated in an image displayed by the display device 100 due to the wireless near-field communication antenna 200 without providing the electromagnetic shielding element 300.

[0176] Since the overall structure is identical to that of the laminated transparent plate according to the first embodiment, its detailed description is omitted. (Third embodiment)

[0177] Next, a laminated transparent sheet according to a third embodiment is described with reference to the Fig. 16 described. The Fig. Figure 16 is a schematic sectional view showing an example of a laminated transparent sheet according to the third embodiment. Fig. 16 is a diagram that the Fig. 4 corresponds to the first embodiment.

[0178] The display device 100, the wireless near-field communication antenna 200, and the electromagnetic shielding element 300 are located between the pair of transparent plates 420a and 420b via the intermediate films 410a and 410b in the laminated transparent plate 400 according to the first embodiment, which is shown in the Fig. As shown in section 4, the arrangement is as follows.

[0179] On the other hand, display devices 100a and 100b, wireless near-field communication antennas 200a and 200b, and electromagnetic shielding elements 300a and 300b are sandwiched between a pair of transparent plates 420a and 420b via intermediate films 410a and 410b in a laminated transparent plate 400 according to the present embodiment, which is in the Fig. As shown in 16, arranged.

[0180] In other words, the laminated transparent sheet 400 according to the first embodiment, which is described in the Fig. Figure 4 shows a set consisting of the display device, the wireless near-field communication antenna, and the electromagnetic shielding element, while the laminated transparent plate 400 according to the present embodiment, which is shown in the Fig. Figure 16 shows two sets of display devices, wireless near-field communication antennas and electromagnetic shielding elements.

[0181] It should be noted that the planar arrangement of the display device 100a, the wireless near-field communication antenna 200a and the electromagnetic shielding element 300a is the planar arrangement of the display device 100, the wireless near-field communication antenna 200 and the electromagnetic shielding element 300, which is shown in the Fig. Figure 1 shows the planar arrangement of the display device 100b, the wireless near-field communication antenna 200b, and the electromagnetic shielding element 300b. It should be noted that the planar arrangement of the display device 100, the wireless near-field communication antenna 200, and the electromagnetic shielding element 300 shown in the Fig. 1 is shown, corresponds.

[0182] According to the laminated transparent plate 400 of the first embodiment, which is described in the Fig. As shown in Figure 4, the user performs wireless communication with the wireless near-field communication antenna 200 via the transparent plate 420a using an IC card, while visually an image displayed on the display device 100 is recognized from outside the vehicle via the transparent plate 420a.

[0183] On the other hand, according to the laminated transparent plate 400 of the present embodiment, which is in the Fig. Figure 16 shows wireless communication with the wireless near-field communication antenna 200a via the transparent plate 420a using an IC card, while visually an image displayed on the display device 100a is detected from outside the vehicle via the transparent plate 420a. The wireless near-field communication antenna 200a is positioned between the transparent plate 420a and the display device 100a, as shown in the Fig. Figure 16 shows that the electromagnetic shielding element 300a is provided between the display device 100a and the wireless near-field communication antenna 200a.

[0184] Furthermore, according to the laminated transparent plate 400 of the present embodiment, which is in the Fig. Figure 16 shows wireless communication with the wireless near-field communication antenna 200b via the transparent plate 420b using an IC card, while visually an image displayed on the display device 100b is detected from inside the vehicle via the transparent plate 420b. The wireless near-field communication antenna 200b is positioned between the transparent plate 420b and the display device 100b, as shown in the figure. Fig. Figure 16 shows that the electromagnetic shielding element 300b is provided between the display device 100b and the wireless near-field communication antenna 200b.

[0185] It should be noted that, although the transparent substrates 10 of the display devices 100a and 100b are in the laminated transparent plate 400, which is in the Fig. As shown in Figure 16, the display devices 100a and 100b can be attached to one another and may share a transparent substrate. In other words, wiring 40 and the like are formed on both surfaces of a transparent substrate 10, and the display device 100a, which is visually detected via the transparent plate 420a, and the display device 100b, which is visually detected via the transparent plate 420b, can be integrated.

[0186] As it is in the Fig. As shown in Figure 16, the electromagnetic shielding element 300a is provided between the display device 100a and the wireless near-field communication antenna 200a, such that they overlap in the laminated transparent plate 400 in the top view according to the present embodiment. With such a setup, the noise generated in an image displayed by the display device 100a due to the wireless near-field communication antenna 200a can be reduced. It is self-evident that with such a setup, the noise generated in an image displayed by the display device 100b due to the wireless near-field communication antenna 200a can also be reduced.

[0187] On the other hand, the electromagnetic shielding element 300b is provided between the display device 100b and the wireless near-field communication antenna 200b, which are arranged such that they are visible in plan view in the laminated transparent plate 400 according to the present embodiment, which is shown in the Fig. As shown in Figure 16, they overlap. With such a setup, the noise generated in an image displayed by the display device 100b due to the wireless near-field communication antenna 200b can be reduced. It is self-evident that the noise generated in an image displayed by the display device 100a due to the wireless near-field communication antenna 200b can also be reduced with such a setup.

[0188] Furthermore, the wireless near-field communication antenna 200a and the wireless near-field communication antenna 200b are arranged above the two electromagnetic shielding elements 300a and 300b, as shown in the Fig. Figure 16 shows that such a setup can effectively prevent mutual interference between a wireless signal from the wireless near-field communication antenna 200a and a wireless signal from the wireless near-field communication antenna 200b.

[0189] Since the overall structure is identical to that of the laminated transparent plate according to the first embodiment, its detailed description is omitted.

[0190] It should be noted that the present disclosure is not limited to the foregoing embodiments and may be modified in a suitable manner without derogation from the essentials.

[0191] This application claims priority on the basis of Japanese patent application No. 2023-078321, which was filed on May 11, 2023, and whose entire disclosure is incorporated herein. Reference symbol list 10 TRANSPARENT SUBSTRATE 11 MAIN SUBSTRATE 12 ADHESIVE LAYER 20 Light-emitting unit 21-23 LED ELEMENT 30 IC-CHIP 40 WIRING 40a LIGHT-PROTECTED WIRING AREA 41 POWER SUPPLY LINE 41a FIRST POWER SUPPLY BRANCH LINE 41b Second power supply branch line 42 Grounding conductor 42a Earthing branch line 43 ROW DATA LINE 43a ROW DATA BRANCHING LINE 44 COLUMN DATA LINE 44a COLUMN DATA BRANCHING LINE 45 CONTROL CABLE 50 PROTECTIVE LAYER 60 Flexible Wiring Plate 70 DISPLAY DEVICE-CONTROL CIRCUIT 100, 100a, 100b DISPLAY DEVICE 101 DISPLAY AREA 200, 200a, 200b WIRELESS NEAR-FIELD COMMUNICATION ANTENNA 210 TRANSPARENT SUBSTRATE 220 COIL 230 Antenna Control Circuit 300, 300a, 300b Electromagnetic Shielding Element 310 TRANSPARENT SUBSTRATE 320 METAL NET FILM 400 LAMINATED TRANSPARENT SHEET 401 Shielding layer 410, 410a, 410b INTERMEDIATE SHEET 420a, 420b TRANSPARENT PLATE FR1, FR2 Photopaint PIX PIXEL QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] WO 2019 / 146634

[0003] JP 2023-078321

[0191]

Claims

[1] Laminated transparent sheet comprising: a pair of transparent plates; a display device arranged between the pair of transparent plates and comprising a first substrate and a plurality of display elements formed on the first substrate; and a wireless near-field communication antenna arranged between the pair of transparent plates and comprising a second substrate and a spiral coil formed on the second substrate, wherein the display device and the wireless near-field communication antenna are arranged so that they overlap in plan view, and an electromagnetic shielding element comprising a third substrate and a metal mesh film formed on the third substrate is provided between the display device and the wireless near-field communication antenna. [2] Laminated transparent sheet according to claim 1, wherein a line spacing of the metal mesh film is 100 µm to 6000 µm, and The line width of the metal mesh film is 3 µm to 200 µm. [3] Laminated transparent sheet according to claim 1 or 2, wherein Each of the first to third substrates is transparent, The majority of display elements are light-emitting diode elements, each arranged for each pixel and with an area of ​​10000 µm or less. 2 exhibit, and The display device is a transparent display device. [4] Laminated transparent plate according to claim 1 or 2, wherein the metal mesh film is formed from a metal containing one of Cu, Ni, Fe and Cr as a major component. [5] Laminated transparent sheet according to claim 1 or 2, further comprising: a first control circuit which controls the display device; and a second control circuit which controls the wireless near-field communication antenna, wherein The first and second control circuits are both provided outside the pair of transparent plates. [6] Laminated transparent plate according to claim 5, wherein wiring extending from the pair of transparent plates is electromagnetically shielded for connecting the wireless near-field communication antenna to the second control circuit. [7] Laminated transparent plate according to claim 1 or 2, wherein the pair of transparent plates is a pair of glass plates. [8] Laminated transparent plate according to claim 7, further comprising: a first intermediate film provided between one of the pair of glass plates and the display device; and a second intermediate film, which is provided between the other of the pair of glass plates and the wireless near-field communication antenna. [9] Laminated transparent plate according to claim 1 or 2, wherein the laminated transparent panel is used for a window of a self-driving vehicle, The display device shows a fare for the self-driving vehicle, and a user of the self-driving vehicle pays the fare through communication using the wireless near-field communication antenna. [10] Laminated transparent sheet comprising: a pair of transparent plates; a display device arranged between the pair of transparent plates and comprising a first substrate and a plurality of light-emitting elements formed on the first substrate; and a wireless near-field communication antenna arranged between the pair of transparent plates and comprising a second substrate and a spiral coil formed on the second substrate, wherein the display device and the wireless near-field communication antenna are arranged so that they are aligned in the top view, and a distance between the display device and the wireless near-field communication antenna is equal to or greater than 5 mm. [11] Method for producing a laminated transparent plate, wherein a display device comprising a first substrate and a plurality of light-emitting elements formed on the first substrate and a wireless near-field communication antenna comprising a second substrate and a spiral coil formed on the second substrate are arranged between a pair of transparent plates, the method comprising: Arrange the display device and the wireless near-field communication antenna such that they overlap in plan view; and Providing an electromagnetic shielding element comprising a third substrate and a metal mesh film formed on the third substrate, between the display device and the wireless near-field communication antenna. [12] Method for producing a laminated transparent plate, wherein a display device comprising a first substrate and a plurality of light-emitting elements formed on the first substrate and a wireless near-field communication antenna comprising a second substrate and a spiral coil formed on the second substrate are arranged between a pair of transparent plates, the method comprising: Arranging the display device and the wireless near-field communication antenna in a manner oriented in the top view; and Adjust the distance between the display device and the wireless near-field communication antenna so that it is equal to or greater than 5 mm.

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