INVERTER UNIT

Abstract

An inverter device is disclosed. The inverter device according to one aspect of the present invention has the following features: a current conversion module that converts direct current and alternating current into one; a cooling module configured to be connected to the current conversion module in such a way as to receive the heat generated by the latter; and a cover element that accommodates the current conversion module and is connected to the cooling module in order to exchange heat with the cooling module; wherein the cooling module is in direct contact with a portion of the components of the current conversion module so that it can exchange heat with the latter, and wherein the cover element can be arranged to accommodate another portion of the components of the current conversion module in such a way as to receive the heat generated by this other portion, and is in direct contact with the cooling module.

Description

Field of invention

[0001] The present invention relates to an inverter device, in particular an inverter device with a structure capable of effectively cooling generated heat. State of the art

[0002] An inverter is a device that converts direct current (DC) into alternating current (AC). An inverter typically consists of a rectifier unit and an inverter unit. The rectifier unit is electrically connected to an external power source, receiving an AC current and converting it into a DC current. The inverter unit can then receive this DC current, convert it back into an AC current, and thus transmit it to external loads, etc.

[0003] To perform the processes mentioned above, the inverter comprises various types of electrical devices. For example, the inverter may contain semiconductor elements, such as IGBTs (Insulated-Gate Bipolar Transistors), which serve to convert direct current (DC) into alternating current (AC). Such a semiconductor element is designed to convert DC into AC through a switching process.

[0004] Typically, a significant amount of heat is generated during the operation of the semiconductor element. If this heat is not dissipated in a timely manner, there is a risk of damage to the semiconductor elements or the various electrical components that incorporate such a semiconductor element and are subsequently used in the inverter. In this case, reliable operation of the semiconductor element or inverter device is unlikely. Furthermore, the possibility of an explosion of the semiconductor element or inverter device due to overheating cannot be ruled out.

[0005] Accordingly, it is usually essential for an inverter to provide a component for dissipating the generated heat.

[0006] South Korean published patent document no. 10-2013-0089329 discloses an inverter cooling device. In particular, it discloses an inverter cooling device capable of dissipating heat generated in an IGBT module by providing various flow paths for cooling water within a cooling housing.

[0007] However, the inverter cooling device disclosed in the aforementioned prior art document is arranged in such a way that it is stacked with the IGBT and designed to be in direct contact with the IGBT. This means that the inverter cooling device according to the prior art document inevitably results in an increase in thickness.

[0008] South Korean published patent document no. 10-2015-0025755 discloses an inverter cooling device. In particular, an inverter cooling device is disclosed which can regulate airflow by separating a flow section according to the amount of heat generated by an electrical element located inside.

[0009] However, the inverter cooling device disclosed in the aforementioned prior art document requires a separate, movable component to alter the airflow path inside. This means that the aforementioned prior art document does not provide a method for effectively cooling an inverter cooling device without a separate element.

[0010] South Korean published patent document no. 10-2013-0089329 (published on August 12, 2013)

[0011] South Korean published patent document no. 10-2015-0025755 (published on March 11, 2015) Disclosure of the invention. Technical problem

[0012] The present invention was developed to solve the above-mentioned problems, the object of which is to provide an inverter device which has a structure in which the cooling effect can be improved.

[0013] The further object of the present invention is to provide an inverter device that is capable of cooling a large number of components.

[0014] The further object of the present invention is to provide an inverter device which has a structure in which any heat exchange between several components can be prevented.

[0015] The further object of the present invention is to provide an inverter device having a structure in which each of the several components can be designed as a module.

[0016] The objects of the present invention are not limited to the objects mentioned above, the further, unmentioned objects being clearly understandable to a person skilled in the art in the field to which the present invention belongs, from the following description. Technical solutions

[0017] According to one aspect of the present invention, an inverter device is provided comprising the following features: a current conversion module that converts direct current and alternating current into one; a cooling module configured to be connected to the current conversion module in such a way as to receive the heat generated by the latter; and a cover element that accommodates the current conversion module and is connected to the cooling module in order to exchange heat with the cooling module; wherein the cooling module is in direct contact with a portion of the components of the current conversion module so that it can exchange heat with the latter, and wherein the cover element can be arranged to accommodate another portion of the components of the current conversion module in such a way as to receive the heat generated by that other portion, and wherein it is in direct contact with the cooling module.

[0018] The inverter device can be provided in which the power conversion module has a substrate element that forms an outer shape of the module and is connected to the cooling module and the cover element; and a capacitor element that is coupled to the substrate element and thus electrically connected to it; wherein the cover element is coupled to the substrate element and at least partially accommodates the capacitor element, and has a capacitor cover that is in contact with the cooling module.

[0019] Furthermore, the inverter device can be provided in which the capacitor element is penetratingly connected to the substrate element, and the capacitor element extends in one direction, with one section in its direction of extension being on one side of the substrate element, while its other section in its direction of extension is on the other side of the substrate element, and with the capacitor cover being on the other side of the substrate element and thus accommodating the other section of the capacitor element.

[0020] The inverter device can be provided in which the capacitor element is designed such that the length of one section is shorter than that of the other section.

[0021] Furthermore, the inverter unit can be provided in which the cooling module has a heat sink, which is connected to the power conversion module and the cover element in such a way that it receives the heat generated by the power conversion module; and a cooling channel formed inside the heat sink and fluidically connected to the outside, so that a heat-absorbing cooling medium flows through the cooling channel; wherein the condenser cover is connected to one side of the heat sink.

[0022] The inverter unit can be provided in which the cooling module has a cooling communication element that is coupled to the heat sink and fluidically connected to the cooling channel, and of which a part is exposed to the outside, with the condenser cover being connected to one side of the respective sides of the heat sink on which the cooling communication element is not provided.

[0023] Furthermore, the inverter device can be provided in which the power conversion module comprises a substrate element that forms an outer shape of the module and is connected to the cooling module and the cover element; and a reactor element that is electrically connected to the substrate element; wherein the cover element has a reactor lid that is connected to the cooling module and accommodates the reactor element.

[0024] The inverter unit can be provided in which the cooling module has a heat sink which is connected to the power conversion module and the cover element in such a way that it receives the heat generated by the power conversion module, wherein the reactor cover is arranged opposite the substrate element such that the heat sink is located between the reactor cover and the substrate element.

[0025] Furthermore, the inverter device can be provided in which the heat sink has a first cooling surface connected to the substrate element; and a second cooling surface spaced apart from and opposite the first cooling surface, and coupled to the reactor lid.

[0026] The inverter device can be provided in which the power conversion module has a substrate element, which forms an outer shape of the module, coupled to the cooling module and the cover element and has a penetrating opening therein; and an IGBT element, which is electrically connected to the substrate element and arranged adjacent to the opening; wherein the cooling module is arranged so that it is at least partially exposed to the opening and is brought into contact with the IGBT element.

[0027] Furthermore, the inverter device can be provided in which the cooling module has a heat sink that is coupled to the power conversion module and the cover element in such a way that it receives the heat generated by the power conversion module; and a cooling channel formed inside the heat sink and fluidically connected to the outside, so that a heat-absorbing cooling medium flows through the cooling channel; wherein the cooling channel has a first cooling channel that is positioned so that it is offset to one side of the heat sink in the vertical direction of the same.

[0028] The inverter device can be provided in which the cooling channel has a second cooling channel which is positioned so that it is offset to another side of the heat sink in the vertical direction of the same, and which communicates with the first cooling channel, wherein the cooling module has a cooling communication element which communicates with one of the first and the second cooling channels, so that it forms an inlet and an outlet channel for the cooling medium.

[0029] Furthermore, the inverter device can be provided in which the power conversion module has a substrate element that forms an outer shape of the module and is coupled to the cooling module and the cover element; and a capacitor element that is coupled to the substrate element and thus electrically connected to it; wherein the cooling channel has a second cooling channel that is positioned so that it is offset to one side of the heat sink in the longitudinal direction of the same in order to adjoin the capacitor element and which communicates with the first cooling channel. Effects of the invention

[0030] According to the above embodiments, the inverter device according to an embodiment of the present invention can have an improved cooling effect.

[0031] A power conversion module comprises an IGBT element, a capacitor element, and a reactor element. This IGBT element, capacitor element, and reactor element generate heat during operation of the inverter device.

[0032] The IGBT element is coupled to a substrate element, forming an electrically conductive connection. A cooling module is connected to this substrate element. An opening is formed in the substrate element, allowing the cooling module to be at least partially exposed to one of its upper surfaces. This allows the IGBT element to come into contact with the cooling module through the opening. In other words, the heat generated in the IGBT element can be transferred to the cooling module via thermal conduction.

[0033] The capacitor element is coupled to the substrate element, forming an electrically conductive connection. The substrate element is coupled to the capacitor cover. The capacitor cover at least partially accommodates the capacitor element and has an inner surface designed to be in contact with the capacitor element. Therefore, the heat generated in the capacitor element can be transferred to the capacitor cover.

[0034] The condenser cover is coupled to the cooling module. Therefore, the heat transferred to the condenser cover can also be transferred to the cooling module. This means that the heat generated by the condenser element can be transferred to the condenser cover or the cooling module in the form of heat conduction.

[0035] The reactor element is electrically connected to the substrate element. The reactor element is housed within the reactor lid. This lid is designed to accommodate the reactor element, with its inner surface in contact with it. Therefore, the heat generated by the reactor element can be transferred to the reactor lid.

[0036] The reactor lid is connected to the cooling module. Therefore, heat transferred to the reactor lid can also be transferred to the cooling module. This means that heat generated by the reactor element can also be transferred to the reactor lid or the cooling module via conduction.

[0037] Therefore, the heat generated by the IGBT element, capacitor element, and reactor element can be transferred to the cooling module via different pathways. Accordingly, the cooling performance of the respective components of the inverter unit can be improved.

[0038] According to the above embodiments, the inverter device according to the exemplary embodiment of the present invention can also cool several components.

[0039] This means that the IGBT element, the capacitor element, and the reactor element can each be connected to the substrate element in such a way that they can be coupled to it or electrically connected to it. The IGBT element, the capacitor element, and the reactor element are designed to be spaced apart from each other and to exchange heat with the cooling module at different points.

[0040] In particular, the IGBT element can be in direct contact with the cooling module and thus exchange heat with it. In contrast, the capacitor element and the reactor element can exchange heat with the cooling module via the capacitor cover and the reactor cover, respectively.

[0041] Therefore, several components included in the inverter device, especially the power conversion module, can all be cooled simultaneously or at different times.

[0042] Furthermore, according to the embodiment of the present invention, the inverter device can prevent arbitrary heat exchange between several components.

[0043] As described above, the main heat sources, i.e., the IGBT element, the condenser element, and the reactor element, are spaced apart from each other. Furthermore, the design ensures that the heat generated by each of the IGBT, condenser, and reactor elements is transferred to the cooling module via different paths.

[0044] Therefore, random heat exchange between the IGBT element, the condenser element, and the reactor element can be prevented. As a result, the cooling effect on the IGBT element, condenser element, and reactor element can be improved.

[0045] According to the above configurations, the inverter device can be designed such that each of its several components is designed as a module.

[0046] As described above, the IGBT element is directly connected to the substrate element. The capacitor element is at least partially housed in the capacitor cover. The capacitor element, together with the capacitor cover, is connected to the substrate element. The reactor element is housed in the reactor cover and thus connected to the cooling module via the reactor cover.

[0047] The cooling module includes a heat sink that is connected to the IGBT element, the condenser cover, and the reactor cover from various directions. A cooling channel is formed within the heat sink through which the cooling medium flows, and this cooling channel is fluidically connected to an external fluid supply source or outlet via the cooling communication element.

[0048] This means that the condenser element beneath the main heat sources can be modularized using the condenser cover. Similarly, the reactor element can be modularized using the reactor cover. Furthermore, the cooling module can also be modularized by incorporating the heat sink and the cooling communication element.

[0049] Accordingly, every component provided for in the inverter device can be designed modularly.

[0050] It is understood that the effects of the present invention are not limited to the effects described above, but include all effects that can be derived from the embodiments of the invention described in the detailed description or the claims of the present invention. Brief description of the drawings

[0051] They show: Fig. 1 an inverter device according to an embodiment of the present invention in a perspective view; Fig. 2 a front view of the inverter unit Fig. 1; Fig. 3 a rear view of the inverter unit Fig. 1; Fig. 4 a top view of the inverter unit Fig. 1; Fig. 5 a perspective exploded view of the inverter unit from Fig. 1; Fig. 6 a power conversion module, a cooling module and a cover element, wherein these elements are in the inverter device made of Fig. 1 are provided in a perspective representation; Fig. 7 a right side view of the power conversion module, the cooling module and the cover element made of Fig. 6; Fig. 8 a perspective view of a cross-section AA through the power conversion module, the cooling module and the cover element made of Fig. 6; Fig. 9 a perspective view of a cross-section BB through the power conversion module, the cooling module and the cover element made of Fig. 6; Fig. 10 a perspective exploded view of the power conversion module, the cooling module and the cover element made of Fig. 6; Fig. 11 the cooling module, which is in the inverter unit Fig. 6 is provided for in a perspective representation; Fig. 12 to 14 each show a cross-section of the cooling module Fig. 11; Fig. 15 a flat cross-section that forms an internal component of the inverter device Fig. 1. The generated water flow is illustrated; and Fig. 16 a lateral cross-section that provides a transmission path within the inverter device Fig. 1. Heat generated is illustrated. Preferred embodiments of the invention

[0052] The exemplary embodiments of the present invention are described in detail below with reference to the accompanying drawings, such that a person skilled in the art in the field to which the present invention belongs can easily carry out the invention. The present invention can be implemented in many different forms and is not limited to the exemplary embodiments described herein. To clarify the present invention, parts not related to the description have been omitted from the drawings, while identical or similar components throughout the entire description are designated with the same reference numerals.

[0053] The words and terms used in this description and the claims should not be interpreted as being limited to their ordinary or dictionary meanings, but should be interpreted as having meanings and concepts consistent with the technical idea of ​​the present invention, in accordance with the principles according to which the inventors may define terms and concepts in order to best explain their invention.

[0054] Therefore, the embodiments described in this description and the configurations shown in the drawings correspond to a preferred embodiment of the present invention, and do not represent all the technical ideas of the present invention, so that the corresponding configurations may have various equivalents and variants that can replace them at the time of filing of the present invention.

[0055] In the following description, the explanation of some components may be omitted in order to clarify the features of the present invention.

[0056] The term "communicating" or "communication" (with regard to hydrodynamics) used in the following description means that one or more elements are fluidically connected to each other. In one embodiment, the "communication" can occur through an element such as a pipeline, pipe, piping, etc. In the following description, the term "communicating" can be used to mean that one or more elements are "fluidically connected to each other."

[0057] The terms "electrically conductive or conductive" and "electrical line" as used in the following description mean that one or more elements are connected to each other in such a way that they can transmit electrical currents or electrical signals to one another. In one embodiment, the "electrical line" may be in a wired form, such as via a cable element or the like, or in a wireless form, such as via Bluetooth, Wi-Fi, RFID, or the like. In another embodiment, the term "electrical line" may also encompass the meaning of "telecommunications."

[0058] The term "fluid" used in the following description means any form of material that flows under external force and whose shape, volume, etc., can vary. In one embodiment, the fluid can be a liquid, such as water, etc., or a gas, such as air, etc.

[0059] The terms used in the following description, "top", "bottom", "left side", "right side", "front" and "back", are used with regard to the Fig. To understand the coordinate system shown in section 1.

[0060] With reference to Fig. Figures 1 to 5 show an inverter device 10 according to an embodiment of the present invention. The inverter device 10 can be electrically connected to an external power source (not shown) and a load (not shown).

[0061] The inverter 10 can receive an electric current from the external power source (not shown), convert it, and then transmit it to the load (not shown). In one embodiment, the inverter 10 can be configured to primarily convert an alternating current into a direct current, then secondarily convert the converted direct current back into another alternating current, and finally transmit this to the load (not shown). For this purpose, the inverter 10 includes a current conversion module 300, which will be described later.

[0062] Furthermore, according to the embodiment of the present invention, the inverter device 10 comprises a component (i.e., a cover element 500 to be mentioned later) that at least partially surrounds the heat-generating current conversion module 300. This component can be in direct contact with the cooling module 400 and receive heat from it in the form of thermal conduction. Accordingly, the cooling effect of the current conversion module 300 can be improved.

[0063] Since the operating principle of the inverter device 10 is a well-known technology, a detailed description of it is omitted.

[0064] In the illustrated embodiment, the inverter unit 10 comprises a frame 100, a housing 200, a current conversion module 300, a cooling module 400 and a cover element 500.

[0065] The frame 100 forms part of an outer shape of the inverter device 10. Other components of the inverter device 10 may be connected to the frame 100 or housed within this frame 100.

[0066] The frame 100 is connected to the housing 200. The frame 100 is connected to each side of the housing 200 in the vertical direction of the same, in the illustrated embodiment to both the top and bottom of the same.

[0067] A space is formed within the frame 100. This space formed within the frame 100 accommodates other components of the inverter device 10, namely the cooling module 400 and the cover element 500.

[0068] The frame 100 can be designed according to the shape of the inverter device 10. In the illustrated embodiment, the frame 100 has a polygonal prism shape in which the length in the forward-backward direction is greater than the width in the left-right direction and the height in the upward-downward direction is greater than the width in the upward-downward direction.

[0069] The frame 100 can be composed of several sections. These several sections can be positioned at different locations and connected to the housing 200, or accommodate other components of the inverter unit 10.

[0070] In the illustrated embodiment, the frame 100 has a first frame 110 and a second frame 120.

[0071] The first frame 110 forms part of the several sections. The first frame 110 is connected to one side of the housing 200 in the vertical direction, in the illustrated embodiment, to the top of the housing. Furthermore, the first frame 110 covers the housing 200 and the current conversion module 300 housed within it, and is connected to the housing 200.

[0072] The first frame 110 is arranged opposite the second frame 120 in such a way that the housing 200 and the power conversion module 300 housed in this housing 200 are arranged between the two frames.

[0073] The second frame 120 forms a remaining part of the several sections. In this configuration, the second frame 120 is connected to another side of the housing 200 in the vertical direction, specifically to its underside in the illustrated embodiment. The second frame 120 covers the housing 200 from below and is connected to it. The second frame 120 is positioned opposite the first frame 110 such that the housing 200 is located between the two frames.

[0074] Within the second frame 120, a space is formed. The cooling module 400 and the cover element 500 are located in this space of the second frame 120. As will be mentioned later, the cooling module 400 can be positioned between the inner and outer parts of the second frame 120.

[0075] The space within the second frame 120 communicates with the outside. This allows the cooling module 400, located within the space within the second frame 120, to communicate with an external fluid supply source, such as a water supply source. The fluid, for example, the water supplied by the water supply source, can then flow along the cooling module 400 into the interior of the second frame 120, exchange heat with the cooling module 400, and then flow out of the second frame 120 to the outside.

[0076] Accordingly, the heat generated by the power conversion module 300 can be dissipated to the outside via the cooling module 400 from the inverter unit 10.

[0077] This means that the heat generated in the power conversion module 300 can be dissipated from the inverter unit 10 to the outside via the cooling module 400. Consequently, the heat from the power conversion module 300 can be removed, thus improving the heat dissipation efficiency of the power conversion module 300 and the entire inverter unit 10.

[0078] The housing 200 forms another part of the outer shape of the inverter device 10. Other components of the inverter device 10 may be connected to the housing 200 or housed in this housing 200.

[0079] The housing 200 is connected to the frame 100. One side of the housing 200, in its vertical direction (in the illustrated embodiment, its top side), is connected to the first frame 110. The other side of the housing 200, in its vertical direction (in the illustrated embodiment, its bottom side), is connected to the second frame 120.

[0080] A compartment is formed within the housing 200. The power conversion module 300 is located in this compartment of the housing 200. The compartment of the housing 200 communicates with the compartment formed within the second frame 120.

[0081] The housing 200 can be designed according to the shape of the inverter device 10. In the illustrated embodiment, the housing 100 has a polygonal prism shape in which the length in the forward-backward direction is greater than the width in the left-right direction and the height in the upward-downward direction is greater than the width in the upward-downward direction.

[0082] With reference to Fig. According to the illustrated embodiment, the inverter device 10 has the current conversion module 300, as shown in sections 6 to 10.

[0083] The primary function of the 300-phase power conversion module is to convert incoming direct current (DC) into alternating current (AC). The AC converted by the 300-phase power conversion module can then be transferred to an external load. The 300-phase power conversion module is electrically connected to both the external power source and the load.

[0084] The power conversion module 300 is coupled to the frame 100 and the housing 200. Some components of the power conversion module 300 are housed in the space formed within the frame 100, in particular the second frame 120, while other components of the power conversion module 300 are housed in the space formed within the housing 200.

[0085] The power conversion module 300 is connected to the cooling module 400. Therefore, the heat generated by the power conversion module 300 can be transferred to the cooling module 400.

[0086] As will be mentioned later, heat exchange can take place via the cooling module 400. Accordingly, it is understandable that the heat generated by the power conversion module 300 can be transferred to the cooling module 400.

[0087] The power conversion module 300 is coupled to the cover element 500. Some components of the power conversion module 300 can be enclosed by the cover element 500. In this way, the heat generated by some components of the power conversion module 300 can be transferred to the cover element 500. As mentioned later, the cover element 500 can be brought into contact with the cooling module 400, thus facilitating heat exchange with it.

[0088] Accordingly, some of the heat generated by the power conversion module 300 can be transferred directly to the cooling module 400, while another portion can be transferred to the cooling module 400 via the cover element 500. This allows the power conversion module 300 to be cooled effectively, as will be explained in more detail later.

[0089] In the illustrated embodiment, the current conversion module 300 comprises a substrate element 310, an IGBT element 320 (IGBT: insulated gate bipolar transistor), a connector element 330, a capacitor element 340 and a reactor element 350.

[0090] The substrate element 310 forms a body of the current conversion module 300. Furthermore, the substrate element 310 is connected to the other components of the current conversion module 300, namely the IGBT element 320, the connector element 330, and the capacitor element 340. The substrate element 310 is electrically connected to the IGBT element 320, the connector element 330, the capacitor element 340, and the reactor element 350.

[0091] Within the substrate element 310, a through-hole can be formed into which the capacitor element 340 is coupled. In the illustrated embodiment, several through-holes are formed such that they are offset to one side of the substrate element 310 in its longitudinal direction, i.e., towards its rear. Therefore, the multiple capacitor elements 340 can each be coupled into each of the through-holes, with some of them being positioned on the top side of the substrate element 310, while the remaining part can be positioned on the bottom side of the substrate element 310.

[0092] Furthermore, the substrate element 310 can be electrically connected to the reactor element 350. The substrate element 310 can be electrically connected to the reactor element 350, which is housed in the reactor lid 520, via a cable element or the like.

[0093] Furthermore, the substrate element 310 is connected to both the frame 100 and the housing 200. In the illustrated embodiment, the substrate element 310 is positioned between the housing 200 and the second frame 120 located on the underside, and is connected to both the housing 200 and the second frame 120.

[0094] The substrate element 310 is connected to the cooling module 400. An opening is formed within the substrate element 310, which extends through the substrate in the thickness direction, or, in the illustrated embodiment, in the vertical direction. Therefore, the cooling module 400 can pass through the opening and is thus at least partially exposed to the interior of the housing 200.

[0095] The IGBT element 320 can be arranged so that it comes into contact with an exposed section of the cooling module 400. This allows the heat generated by the IGBT element 320 to be efficiently transferred to the cooling module 400.

[0096] The substrate element 310 is connected to the cover element 500. In particular, the substrate element 310 is connected to the capacitor element 510, which accommodates the capacitor element 340.

[0097] The substrate element 310 is coupled to the frame 100 and the housing 200 and can be provided in any shape that can be electrically connected to the IGBT element 320, the connector element 330, the capacitor element 340, and the reactor element. In one embodiment, the substrate element 310 can be in the form of a printed circuit board (PCB), printed board assembly (PBA), or the like. In this embodiment, the substrate element 310 can be provided in a plate shape in which the width in the left-right direction is shorter than the length in the forward-backward direction, and which has a thickness in the up-down direction.

[0098] The IGBT 320 element essentially performs the task of converting the primary direct current back into alternating current. The IGBT 320 element is electrically connected to both the external power source and the load.

[0099] The IGBT element 320 can be provided in any form capable of converting direct current to alternating current. In one embodiment, the IGBT element 320 can be provided in the form of a switching element.

[0100] Several IGBT elements can be provided for this IGBT element 320. These multiple IGBT elements 320 can be arranged spaced apart from one another and each be electrically connected to the substrate element 320. In the illustrated embodiment, three IGBT elements 320 are provided, spaced apart from one another in the width direction of the substrate element 310, i.e., in the left-right direction of the same.

[0101] In one embodiment, the IGBT element 320 can be arranged such that it is at least partially in contact with the cooling module 400. In this embodiment, the heat generated by the IGBT element 320 can be transferred to the cooling module by thermal conduction. Accordingly, the IGBT element 320 is cooled, thus preventing damage due to overheating.

[0102] The connector element 330 electrically connects the power conversion module 300 to the external power source and the load. Furthermore, the connector element 330 is electrically connected to the substrate element 310. Accordingly, the connector element 330 can also be electrically connected to the IGBT element 320.

[0103] Furthermore, the connector element 330 can be positioned such that it is offset towards one end of the substrate element 310 in the longitudinal direction of the same. In the illustrated embodiment, the connector element 330 is positioned such that it adjoins a rear end of the substrate element 310. The connector element 330 can be arranged at any point where it can be electrically connected to the external power source and the load.

[0104] The capacitor element 340 is located between the IGBT element 320 and the connector element 330.

[0105] When the electrical energy transmitted by the IGBT element 320 is converted, the capacitor element 340 maintains the electrical voltage so that the electrical energy can be supplied at a constant voltage. The capacitor element 340 can be designed as an element capable of storing the electrical energy.

[0106] The capacitor element 340 is electrically connected to other components of the current conversion module 300. In the illustrated embodiment, the capacitor element 340 is electrically connected to the substrate element 310, the IGBT element 320, the connector element 330, and the reactor element 350.

[0107] The capacitor element 340 is connected to the substrate element 310. In this case, a section of the capacitor element 340 is coupled into the through-hole formed in the substrate element 310 in the vertical direction of the substrate element 310, and in the illustrated embodiment, a section on the upper side of the capacitor element 340 is thereby supported.

[0108] The capacitor element 340 is connected to the capacitor cover 510. Another section of the capacitor element 340 is coupled to the capacitor cover 510 in the vertical direction of the same; in the illustrated embodiment, this is a lower section. In this embodiment, the other section of the capacitor element 340 is therefore not exposed within the interior of the second frame 120.

[0109] The heat generated by the capacitor element 340 can be transferred to the capacitor cover 510 surrounding the capacitor element 340. As will be mentioned later, the capacitor cover 510 is brought into contact with the cooling module 400, allowing the heat to be transferred to the cooling module 400, thus cooling the capacitor element 340.

[0110] Several capacitor elements can be provided for this capacitor element 340. These multiple capacitor elements 340 can be spaced apart from one another and each connected to the substrate element 310 and the capacitor cover 510. The multiple capacitor elements 340 can be designed such that they are electrically connected to one another, thus increasing the total capacitance of the capacitor elements 340.

[0111] In the illustrated embodiment, a total of six capacitor elements 340 are provided, spaced apart from one another in the longitudinal and transverse directions of the substrate element 310, i.e., in the forward-backward and left-right directions. The multiple capacitor elements 340, which are spaced apart from one another, can each be connected to the capacitor cover 510, but do not come into direct contact with each other.

[0112] Accordingly, the heat generated by the respective capacitor elements 340 will be released to the outside via the capacitor cover 510, although it may not be transferred directly to other capacitor elements 340.

[0113] A detailed description of the process by which the heat generated by the capacitor elements 340 is released via various paths, thus cooling the capacitor elements 340, will be mentioned later.

[0114] The reactor element 350 is designed to suppress the harmonics of the electrical energy transmitted to or converted by the inverter unit 10, thereby improving the power factor. The reactor element 350 is electrically connected to the IGBT element 320, the connector element 330, and the capacitor elements 340 via the substrate element 310.

[0115] The reactor element 350 is connected to the cover element 500. Specifically, the reactor element 350 is arranged such that it is housed within the reactor cover 520 and thus surrounded by this reactor cover 520. Accordingly, the reactor element 350 can be positioned so that it is not directly exposed to the interior of the second frame 120.

[0116] The reactor element 350 can exchange heat with the reactor cover 520. Therefore, the heat generated by the reactor element 350 can be transferred to the reactor cover 520. As mentioned later, the heat transferred to the reactor cover can then be transferred to the cooling module 400.

[0117] Accordingly, reactor element 350 can be effectively cooled.

[0118] Several reactor elements can be provided for this reactor element 350. These multiple reactor elements 350 can be arranged at intervals from one another and each electrically connected to the substrate element 310. Furthermore, the multiple reactor elements 350 can each be housed in the reactor lid 520, thus transferring the generated heat to the reactor lid 520. This means that the heat exchange between the multiple reactor elements 350 is minimized.

[0119] In the illustrated embodiment, the reactor elements 350 are provided in pairs and are spaced apart from each other in the width direction of the substring element 310, i.e. in the left-right direction.

[0120] Since the operating principle of the reactor elements 350 is a well-known technology, a detailed description of it is omitted.

[0121] With renewed reference to Fig. According to an embodiment of the present invention, the inverter device 10 has a cooling module 400, as shown in sections 6 to 14.

[0122] The cooling module 400 is directly or indirectly connected to the IGBT elements 320 and the capacitor elements 340. Therefore, the heat generated by the IGBT elements 320 or the capacitor elements 340 can be transferred to the cooling module 400. This means that the cooling module 400 can be designed to cool the respective IGBT elements 320 or the respective capacitor elements 340.

[0123] In one embodiment, the cooling module 400 can be designed to use different fluid phases as a cooling medium. For example, water in liquid phase can flow in the cooling module 400. In this embodiment, the cooling module 400 can, so to speak, be configured to cool the power conversion module 300 in the form of water cooling.

[0124] Alternatively, the inverter device 10 according to the embodiment of the present invention can be configured such that the power conversion module 300 is cooled by means of only one liquid-phase or gas-phase cooling medium. In this embodiment, the inverter device 10 can be configured such that the power conversion module 300 is cooled by means of water cooling or air cooling.

[0125] The cooling module 400 is connected to the power conversion module 300, so that it receives the heat generated by the power conversion module 300. The cooling module 400 is designed to cool the received heat. That is to say, it can be designed so that the cooling module 400 is configured to directly exchange heat with the power conversion module 300.

[0126] Furthermore, the cooling module 400 is connected to the frame 100. In particular, the cooling module 400 is housed in the space formed within the second frame 120. Some components of the cooling module 400 penetrate a surface of the second frame 120 and are then connected to it.

[0127] The cooling module 400 communicates with the exterior of the inverter unit 10. In particular, some components of the cooling module 400 penetrate the surface of the second frame 120 and are connected to it, so that they are exposed to the outside. Each of the components of the cooling module 400 can be fluidically connected to an external fluid supply source or an external fluid outlet.

[0128] The fluid flowing from the external fluid supply source into the cooling module 400 can absorb the heat transferred to the cooling module 400 and then flow back out to the external fluid outlet.

[0129] The cooling module 400 can be made of a material with high thermal conductivity. In one embodiment, the cooling module 400 can be made of copper, aluminum, or an alloy material containing these materials.

[0130] The cooling module 400 is connected to the power conversion module 300 and can be positioned anywhere it can receive the heat generated by the power conversion module 300. In the illustrated embodiment, the cooling module 400 is positioned such that it is offset towards the front, corresponding to the position of the IGBT element 320 of the power conversion module 300. The position of the cooling module 400 can be changed depending on the position of the IGBT element 320.

[0131] Furthermore, the cooling module 400 can be connected to a component of the power conversion module 300 and thus receive the generated heat in the form of heat conduction. In the illustrated embodiment, the cooling module 400 is directly connected to the IGBT element 320.

[0132] Furthermore, the cooling module 400 can be connected to a component of the power conversion module 300 via the cover element 500 and thus receive the generated heat in the form of heat conduction. In the illustrated embodiment, the cooling module 400 is connected to the capacitor elements 340 and the reactor elements 350 by means of the condenser cover 510 and the reactor cover 520, respectively.

[0133] In the illustrated embodiment, the cooling module 400 has a heat sink 410, a cooling communication element 420 and a first cooling channel 430.

[0134] The heat sink 410 forms part of an outer shape of the cooling module 400. Furthermore, the heat sink 410 represents that part of the cooling module 400 which is coupled to the power conversion module 300.

[0135] The heat sink 410 can be in contact with the IGBT element 320 of the power conversion module 300 and thus exchange heat with it. Furthermore, the heat sink 410 can be brought into contact with the condenser cover 510 and thus receive the heat generated by the condenser element 340. In addition, the heat sink 410 can also be connected to the reactor cover 520 and thus receive the heat generated by the reactor element 350.

[0136] In the illustrated embodiment, the top of the heat sink 410 is connected to the IGBT elements 320, while the bottom of the heat sink 410 is connected to the reactor elements 350. Furthermore, the rear of the heat sink 410 is connected to the condenser cover 510.

[0137] Furthermore, the heat sink 410 can be positioned at a distance from the second frame 120. Therefore, any heat exchange between the heat sink 410 and the second frame 120 can be avoided.

[0138] Furthermore, the heat sink 410 can have a shape corresponding to the shape of the opening formed within the current conversion module 300, in particular the substrate element 310. The heat sink 410 can also have a shape corresponding to the shape of the condenser cover 510 and the reactor cover 520. In the illustrated embodiment, the heat sink 410 has a polygonal prism shape, which has a length in the forward-backward direction, a width in the left-right direction, and a height in the up-down direction.

[0139] In the illustrated embodiment, the heat sink 410 has a first cooling surface 411 and a second cooling surface 412.

[0140] The first cooling surface 411 forms an outer surface of the heat sink 410. In the illustrated embodiment, the first cooling surface 411 forms the top surface of the heat sink 410.

[0141] The first cooling surface 411 is connected to the IGBT element 320. The first cooling surface 411 can receive the heat generated by the IGBT element 320 in the form of heat conduction. In the illustrated embodiment, the first cooling surface 411 is connected to the underside of the IGBT element 320 and thus in contact with it.

[0142] The first cooling surface 411 is arranged opposite the second cooling surface 412 such that the first cooling channel 430 is located between these two surfaces. In the illustrated embodiment, the first cooling surface 411 is arranged so that it lies opposite the second cooling surface 412 along the vertical direction of the heat sink 410, i.e., the upward-downward direction.

[0143] In contrast, the second cooling surface 412 forms another outer surface of the heat sink 410. In the illustrated embodiment, the second cooling surface 412 forms the underside of the heat sink 410.

[0144] The second cooling surface 412 is arranged at a distance from the second frame 120. In the illustrated embodiment, the second cooling surface 412 is arranged at a distance from an underside inner surface of the second frame 120.

[0145] This spacing also prevents any heat exchange between the cooling module 400 and the second frame 120.

[0146] The second cooling surface 412 is connected to the reactor lid 520. Therefore, the heat generated by the reactor elements 350 can be transferred via the reactor lid 520 and the second cooling surface 412 to the cooling medium flowing in the first cooling channel 430.

[0147] The second cooling surface 412 can have a shape corresponding to the shape of the first cooling surface 411. In the illustrated embodiment, the second cooling surface 412 is designed as a polygonal plate with a width in the left-right direction, a length in the forward-backward direction, and a thickness in the up-down direction. It is understood that the shape of the second cooling surface 412 corresponds to the shape of the reactor lid 520.

[0148] The cooling communication element 420 fluidically connects the cooling module 400 to the external fluid supply source and the fluid outlet. The cooling communication element 420 forms an inlet and outlet channel for the cooling medium flowing in the cooling module 400.

[0149] The cooling communication element 420 is connected to the second frame 120. The cooling communication element 420 penetrates a surface of the second frame 120 in its width direction; in the illustrated embodiment, this is either a left or a right surface, and is thus connected to it. One end of the cooling communication element 420, in its length direction, extends outwards from the second frame 120, so that it is fluidically connected to both the outer fluid supply source and the outer fluid outlet.

[0150] Furthermore, the cooling communication element 420 is connected to the heat sink 410. The cooling communication element 420 extends from the heat sink 410 towards the outside of the second frame 120. In the illustrated embodiment, the cooling communication element 420 is connected to a surface of the heat sink 410 in its lateral direction, i.e., to a left surface or a right surface.

[0151] Furthermore, the cooling communication element 420 is fluidically connected to the first cooling channel 430. The fluid flowing from the external fluid supply source into the cooling communication element 420 can flow into the first cooling channel 430. Therefore, the fluid flowing along the first cooling channel 430, and thus exchanging heat with the heat sink 410, can flow along the cooling communication element 420 to the external fluid outlet.

[0152] The cooling communication element 420 can have any shape that connects the external fluid supply source or the external fluid outlet to the first cooling channel 430. In the illustrated embodiment, the cooling communication element 420 has a circular cross-section and a length in the width direction of the cooling body 410, i.e., in the left-right direction, and is designed as a tube with a cavity penetrating through it.

[0153] This cooling communication element 420 can be used with multiple cooling communication elements. One of the multiple cooling communication elements 420 can form an inlet channel for the fluid. Another of the multiple cooling communication elements 420 can be connected to the external fluid outlet. The other cooling communication element 420 can form an outlet channel for the fluid.

[0154] In the illustrated embodiment, the cooling communication element 420 is provided with a pair of a first communication element 421 and a second communication element 422.

[0155] The first communication element 421 is connected to a left surface of the heat sink 410, penetrating and connecting to a left surface of the second frame 120. Furthermore, the first communication element 421 communicates with a left end of the first cooling channel 430. A left end of the first communication element 421 extends outwards from the second frame 120 and communicates with one of its two components, i.e., the external fluid supply source and the external fluid outlet.

[0156] The second communication element 422 is connected to a right-hand surface of the heat sink 410, penetrating and connecting to a right-hand surface of the second frame 120. Furthermore, the second communication element 422 communicates with a right-hand end of the first cooling channel 430. A right-hand end of the second communication element 422 extends outwards from the second frame 120 and communicates with another of the two components, namely the external fluid supply source and the external fluid outlet.

[0157] The first cooling channel 430 forms a channel through which the fluid flowing into the cooling module 400 exchanges heat with the cooling module 400. The first cooling channel 430 is formed within the heat sink 410.

[0158] That is, how best to Fig. As shown in Figure 12, the first cooling channel 430 is designed as a recessed groove inside the cooling body 410. The respective ends of the first cooling channel 430 are open and each communicates with the cooling communication element 420.

[0159] In the illustrated embodiment, a left end of the first cooling channel 430 communicates with the first communication element 421. Furthermore, a right end of the first cooling channel 430 communicates with the second communication element 422.

[0160] The first cooling channel 430 is fluidically connected to the cooling communication element 420 and can be configured in any shape that allows the fluid to flow within the cooling body 410. In the illustrated embodiment, the first cooling channel 430 has three first straight channel sections 431 and two first curved channel sections 432 and is thus configured in an "S" shape.

[0161] The first cooling channel 430 is designed to be long enough to allow the fluid flowing in it to exchange heat sufficiently with the cooling sink 410, but it is advantageously provided that the first cooling channel extends to a length that does not excessively reduce the flow velocity of the fluid.

[0162] With reference to Fig. Figure 13 shows an embodiment of the cooling module 400 according to the exemplary embodiment of the present invention.

[0163] The cooling module 400 according to the illustrated embodiment has several cooling channels which are designed to be stacked along the vertical direction of the cooling module, i.e., the upward-downward direction. That is, the first cooling channel 430 is located at the bottom of the interior of the heat sink 410, while the second cooling channel 440 is located at the top of the interior of the heat sink 410.

[0164] The first cooling channel 430 and the second cooling channel 440 communicate with each other. Therefore, some of the cooling medium flowing into the first cooling channel 430 via the cooling communication element 420 can be transferred to the second cooling channel 440. Furthermore, some of the cooling medium flowing through the second cooling channel 440 can flow back out through the first cooling channel 430 and the cooling communication element 420.

[0165] In another embodiment, it can be designed such that the cooling medium flowing in via the cooling communication element 420 only flows through the second cooling channel 440 and then flows out.

[0166] The second cooling channel 440 is positioned so that it is closer to the power conversion module 300, in particular the IGBT element 320, than the first cooling channel 430. Therefore, it follows that the cooling medium flowing through the second cooling channel 440 can effectively receive heat from the IGBT element 320.

[0167] The second cooling channel 440 can have any shape that allows the cooling medium flowing within it to receive the heat generated by the power conversion module 300. In the illustrated embodiment, the second cooling channel 440 is shaped similarly to the first cooling channel 430 in an "S" shape.

[0168] In the illustrated embodiment, the second cooling channel 440 has a second straight channel section 441, a second curved channel section 442 and a channel communication hole 443.

[0169] The second straight channel section 441 extends in the width direction of the heat sink 410, in the illustrated embodiment in the left-right direction. Several second straight channel sections 441 are provided, and they can be spaced apart from each other in the longitudinal direction of the heat sink 410, in the illustrated embodiment in the forward-backward direction.

[0170] Some of the several second straight channel sections 441 can communicate with the first cooling channel 430 via the channel communication hole 443. In the illustrated embodiment, the second straight channel section 441 positioned furthest back communicates with the first cooling channel 430 via the channel communication hole 443 positioned on the left. Furthermore, the second straight channel section 441 positioned furthest forward communicates with the first cooling channel 430 via the channel communication hole 443 positioned on the right.

[0171] The multiple second straight channel sections 441 communicate with each other via the multiple second curved channel sections 442. The second curved channel sections 442 extend between the ends of the adjacent second straight channel sections 441. Furthermore, the second curved channel sections 442 can be rounded such that they extend convexly outwards in the width direction of the heat sink 410.

[0172] For this second curved channel section 442, several second curved channel sections can also be provided. These several second curved channel sections 442 can each communicate with the several second straight channel sections 441 at different points.

[0173] In the illustrated embodiment, a pair of second curved channel sections 442 is provided. The second straight channel section 441 positioned at the front and the second straight channel section 441 positioned in the middle communicate with each other via one second curved channel section 442. The second straight channel section 441 positioned in the middle and the second straight channel section 441 positioned at the rear communicate with each other via another second curved channel section 442.

[0174] The first cooling channel 430 and the second cooling channel 440 communicate with each other via the channel communication hole 443. In one embodiment, the first straight channel section 431 and the second straight channel section 441 can communicate with each other via the channel communication hole 443.

[0175] The channel communication hole 443 can have any shape through which the first cooling channel 430 and the second cooling channel 440 can communicate with each other. In one embodiment, the channel communication hole 443 penetrates the cooling body 410 in the vertical direction; in the illustrated embodiment, it penetrates the cooling body in the upward-downward direction, with one end of it able to communicate with the first cooling channel 430 in its direction of extension, while its other end can communicate with the second straight channel section 441 or the second curved channel section 442.

[0176] For this channel communication hole 443, several channel communication holes can be provided. The first cooling channel 430 and the second cooling channel 440 can also communicate with each other at different points via these multiple channel communication holes 443. Furthermore, each channel communication hole 443 can communicate with a different end of the ends of every second straight channel section 441 with which every second curved channel section 442 does not communicate.

[0177] In the illustrated embodiment, a pair of channel communication holes 443 is provided. One channel communication hole 443 is located at the left end of the rearward-positioned, second straight channel section 441. This one channel communication hole 443 forms one of the inlet and outlet channels for the cooling medium to the second cooling channel 440.

[0178] Furthermore, another channel communication hole 443 is located at the right end of the front-positioned, second straight channel section 441. This other channel communication hole 443 connects another of the inlet channel and outlet channel for the cooling medium to the second cooling channel 440.

[0179] With reference to Fig. Figure 4 shows the cooling module 400 according to a further embodiment of the present invention. In this embodiment, the cooling module 400 has a second cooling channel 440 that communicates with the first cooling channel 430.

[0180] The second cooling channel 440 is positioned such that it is offset to one side of the heat sink 410 in its longitudinal direction, in this embodiment towards its rear. That is, in this embodiment, the second cooling channel 440 is positioned so that it abuts the condenser cover 510, enabling it to effectively receive the heat generated by the condenser elements 340.

[0181] In this embodiment, the second cooling channel 440 can be configured in any shape that allows it to communicate with the first cooling channel 430 and thus form a fluid channel. In the illustrated embodiment, the second cooling channel 440 consists of a second straight channel section 441, a second curved channel section 442, and a channel communication opening 443.

[0182] In the illustrated embodiment, several channel sections are provided for this second straight channel section 441, wherein these several channel sections are spaced apart from one another in the vertical direction of the heat sink 410, i.e., in the upward-downward direction. Several channel sections are also provided for the second curved channel section 442, wherein these several second curved channel sections each communicate with the several second straight channel sections 441.

[0183] The second straight channel section 441 can communicate with the first cooling channel 430 and the cooling communication element 420 via the channel communication hole 443. In this embodiment, the channel communication hole 443 can be formed by a space extending in the longitudinal direction of the cooling body 410, i.e., forwards and backwards. One end of the channel communication hole 443 can communicate with the second straight channel section 441 or the second curved channel section 442 in the same direction as the cooling body, while its other end can communicate with the first cooling channel 430 or the cooling communication element 420.

[0184] With renewed reference to Fig. 6 to 10, the inverter device 10 according to the embodiment of the present invention has a cover element 500.

[0185] The cover element 500 is designed to enclose some components of the power conversion module 300. A space is formed within the cover element 500 that can accommodate some of the components of the power conversion module 300.

[0186] The space can be shaped to correspond to some of the components of the power conversion module 300. In this embodiment, the heat generated by some of the components of the power conversion module 300 can be transferred to the cover element 500.

[0187] The cover element 500 is located in an interior space of the second frame 120. The cover element 500 is connected to the cooling module. Specifically, a portion of the cover element 500 is connected to one side of the heat sink 410 in its longitudinal direction, i.e., to its rear side, and thus exchanges heat with this heat sink. Conversely, another portion of the cover element 500 is connected to a second cooling surface 412 provided in the heat sink 410 and thus exchanges heat with this heat sink.

[0188] The cover element 500 can be made of a material with high thermal conductivity. In one embodiment, the cover element 500 can be made of copper, aluminum, or an alloy material containing these materials.

[0189] Several cover elements can be provided for this cover element 500. These multiple cover elements 500 can each accommodate different components provided in the power conversion module 300, and thus exchange heat with these components. Furthermore, the multiple cover elements 500 can be connected to the cooling module 400 at different points and thus exchange heat with it.

[0190] In the illustrated embodiment, each cover element 500 has a condenser cover 510 and a reactor cover 520.

[0191] The capacitor cover 510 houses the capacitor element 340. Therefore, the capacitor cover 510 and the capacitor element 340 can exchange heat. The capacitor cover 510 is designed to receive the heat generated by the capacitor element 340.

[0192] Within the capacitor cover 510, a space can be formed to accommodate the capacitor element 340. This space can be shaped to match the shape of the capacitor element 340. Therefore, the capacitor element 340, enclosed in this space, can be brought into contact with the inner surface of the capacitor cover 510. Consequently, the heat generated by the capacitor element 340 can be transferred to the capacitor cover 510 by thermal conduction.

[0193] The capacitor cover 510 is connected to the substrate element 310. One side of the capacitor cover 510, in the vertical direction of the same (in the illustrated embodiment, a top side), can be connected to a bottom side of the substrate element 310.

[0194] Furthermore, the condenser cover 510 is connected to the cooling module 400. In particular, the condenser cover 510 is connected to one side of the heat sink 410 in its longitudinal direction, and in the illustrated embodiment, to its rear side. Therefore, heat generated by the condenser element 340 can be transferred to the heat sink 410 via the condenser cover 510. It is understood that the heat transferred to the heat sink 410 can then be transferred to the cooling medium flowing in the first cooling channel 430.

[0195] The capacitor cover 510 can at least partially accommodate the capacitor element 340. In the illustrated embodiment, the capacitor cover 510 is designed to accommodate a remaining portion of the capacitor element 340, with the exception of a portion adjacent to one of its upper ends. This portion adjacent to the upper end of the capacitor element 340 can be connected to and supported by the substrate element 310.

[0196] In one embodiment, the capacitor cover 510 can be connected to the capacitor element 340 and thus moved together with it. In other words, the capacitor cover 510 and the capacitor element 340 can be designed as a single module.

[0197] The condenser cover 510 can have any shape capable of accommodating the condenser element 340 and being connected to the cooling module 400, thus enabling heat exchange with these components. In the illustrated embodiment, the condenser cover 510 has a polygonal prism shape with a rectangular cross-section and a height in the upward-downward direction.

[0198] In any case, it is sufficient that the condenser cover 510 and the cooling module 400 are reliably in contact with each other, and that the inner surface of the condenser cover 510 and the condenser element 340 included in it are also reliably in contact with each other in order to be able to carry out the heat exchange between them.

[0199] The reactor lid 520 houses the reactor element 350. Therefore, the reactor lid 520 can exchange heat with the reactor element 350. The reactor lid 520 is designed to receive the heat generated by the reactor element 350.

[0200] Within the reactor lid 520, a space can be formed to accommodate the reactor element 350. This space can be shaped to match the shape of the reactor element 350. Therefore, the reactor element 350, enclosed within the space, can be brought into contact with the inner surface of the reactor lid 520. Consequently, the heat generated by the reactor element 350 can be transferred to the reactor lid 520 by thermal conduction.

[0201] The reactor cover 520 is connected to the cooling module 400. In particular, the reactor cover 520 is connected to the second cooling surface 412 on the underside of the heat sink 410. The reactor cover 520 is located between the inner underside surface of the second frame 120 and the heat sink 410.

[0202] Therefore, the heat generated by the reactor element 350 can be transferred via the reactor cover 520 to the cooling element 410. It is understood that the heat transferred to the cooling element 410 can then be transferred to the cooling medium flowing in the first cooling channel 430.

[0203] The reactor cover 520 can fully accommodate the reactor element 350. This means that the reactor element 350 can be designed so that it is not arbitrarily exposed to the outside from the reactor cover 520. In this embodiment, the reactor cover 520 can be connected to the reactor element 350 and thus moved together with it. In other words, the reactor cover 520 and the reactor element 350 can be designed as a single module.

[0204] The reactor cover 520 can have any shape capable of accommodating the reactor element 350 and being connected to the cooling module 400, thus enabling heat exchange with these components. In the illustrated embodiment, the reactor cover 510 has a polygonal prism shape with a rectangular cross-section and a height in the upward-downward direction.

[0205] In this embodiment, one of the surfaces of the reactor lid 520 opposite the second cooling surface 412, in the illustrated embodiment a top surface of the same, can be designed to have a shape corresponding to the shape of the second cooling surface 412. In this embodiment, the contact reliability and thus the heat exchange efficiency between the reactor lid 520 and the second cooling surface 412 can be improved.

[0206] In any case, it is sufficient that the reactor lid 520 and the cooling module 400 are reliably in contact with each other, and that the inner surface of the reactor lid 520 and the reactor element 350 contained therein are also reliably in contact with each other in order to be able to carry out the heat exchange between them.

[0207] With reference to Fig. 15 and Fig. Figure 16 shows, as an example, a flow process of the cooling medium which is formed within the inverter device 10 according to the embodiment of the present invention.

[0208] As described above, in the inverter device 10 according to the embodiment of the present invention, the main heat-generating components, namely the IGBT element 320, the capacitor element 340, and the reactor element 350, are arranged such that they are in contact with the other components. The heat generated by the IGBT element 320, capacitor element 340, and reactor element 350 can then be transferred to the other components by thermal conduction.

[0209] In one embodiment, the heat generated by the IGBT element 320, capacitor element 340 and reactor element 350 can also be transferred to the several cooling media, each consisting of different phases.

[0210] Accordingly, the IGBT element, the capacitor element 340 and the reactor element 350 can be effectively cooled.

[0211] The following description assumes that the cooling module 400 cools the power conversion module 300 using water. Alternatively, it should be understood that the cooling module can also use other fluids in a liquid phase, such as cooling oil.

[0212] With reference to Fig. Figure 15 shows an embodiment in which the power conversion module 300 is cooled by water cooling. In the illustrated embodiment, it is designed such that the water flow (WF) runs from one side of the inverter device 10 in its lateral direction to the other side. It is subsequently assumed that the left, first communication element 421 forms an inlet channel for the water, while the right, second communication element 422 forms an outlet channel for the water.

[0213] The water flowing in from the external fluid supply source passes through the first communication element 421 into the first cooling channel 430. The water flow (WF) runs through a cavity formed within the first communication element 421 into the first cooling channel 430. The incoming water flows along the several first straight channel sections 431 and the several first curved channel sections 432, then exchanges heat with the cooling element 410, and afterwards flows out to the outside via the second communication element 422.

[0214] Therefore, the water flowing into the first cooling channel 430 can flow for a sufficient length of time and absorb the heat generated in the power conversion module 300.

[0215] In this process, the cooling medium flowing in the first cooling channel 430, i.e. water, can absorb heat from the several components.

[0216] This means that the water can absorb heat from the IGBT element 320 connected to the first cooling surface 411, the reactor cover 520 connected to the second cooling surface 412 and the reactor element 350 housed in this reactor cover, as well as from the condenser cover 510 and the condenser element 340 housed in this condenser cover.

[0217] As a result, the cooling effects of the power conversion module 300 and the inverter unit 10 can be improved by the water.

[0218] With reference to Fig. 16 is an example of a path along which the heat generated in the inverter device 10 according to the embodiment of the present invention moves through the process described above.

[0219] First, the heat generated by the IGBT element 320 is transferred to the cooling module 400 via the first cooling surface 411. Then, the transferred heat is transferred to the cooling medium flowing along the first cooling channel 430 and subsequently dissipated from the inverter unit 10 to the outside.

[0220] This process allows the IGBT element 320 to be cooled.

[0221] Furthermore, the heat generated by the capacitor element 340 is transferred to the capacitor cover 510, which houses this capacitor element. The transferred heat is then transferred to the cooling medium 400 connected to the capacitor cover 510. Finally, the transferred heat is transferred to the cooling medium flowing along the first cooling channel 430 and then dissipated from the inverter unit 10 to the outside.

[0222] This process allows the capacitor element 340 to be cooled.

[0223] Furthermore, the heat generated by the reactor element 350 is transferred to the reactor cover 520, which houses this reactor element. The transferred heat is then transferred via the second cooling surface 412 to the cooling module 400. Finally, the transferred heat is transferred to the cooling medium flowing along the first cooling channel 430 and then dissipated to the outside from the inverter unit 10.

[0224] This process allows reactor element 350 to be cooled.

[0225] The inverter unit 10 includes the cooling module 400, which is in direct contact with and connected to some components of the power conversion module 300. Furthermore, other components of the power conversion module 300 are housed in the cover element 500, which is in contact with and also connected to the cooling module 400.

[0226] This means that the heat generated by the respective components of the power conversion module 300 is transferred to the cooling module 400 via various paths. Accordingly, the heat generated by the multiple heat sources can be effectively dissipated from the inverter unit 10 to the outside.

[0227] Although the embodiments of the present invention have been described above, the spirit of the present invention is not limited to the embodiments specified in this description, and a person skilled in the art who understands the spirit of the present invention can readily propose other embodiments by adding, modifying, removing or supplementing components within the same spirit. Reference symbol list: 10 Inverter unit 100 frames 110 First frame 120 Second frame 200 cases 300 power conversion module 310 substrate element 320 IGBT element 330 connector element 340 Capacitor element 350 reactor element 400 cooling module 410 heat sinks 411 First cooling surface 412 Second cooling surface 420 Cooling communication element 421 First communication element 422 Second communication element 430 First cooling channel 431 First straight canal section 432 First curved canal section 440 Second cooling channel 441 Second straight canal section 442 Second curved canal section 443 Channel Communication Hole 500 cover element 510 Capacitor cover 520 reactor lids WF Water Flow HF thermal motion QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] KR 10-2015-0025755 [0008, 0011] KR 10-2013-0089329

[0010]

Claims

[1] Inverter device having the following features: a power conversion module that converts one from direct current and converts alternating current into another; a cooling module designed to be connected to the power conversion module in such a way that it receives the heat generated by the latter; and a cover element that houses the power conversion module and is connected to the cooling module in order to exchange heat with this cooling module; wherein the cooling module is in direct contact with part of the components of the power conversion module, so that it can exchange heat with it, and The cover element can be arranged in such a way that it accommodates another part of the components of the power conversion module, receives the heat generated by this other part, and is in direct contact with the cooling module. [2] Inverter device according to claim 1, wherein the power conversion module is a substrate element that forms an outer shape of the module and is connected to the cooling module and the cover element; and a capacitor element that is coupled to the substrate element and thus electrically connected to it; exhibits, wherein the cover element is coupled to the substrate element and at least partially accommodates the capacitor element, and has a capacitor cover in contact with the cooling module. [3] Inverter device according to claim 2, wherein the capacitor element is penetratingly connected to the substrate element, and the capacitor element extends in one direction, with one section of it being located on one side of the substrate element in its direction of extension, while its other section is located on the other side of the substrate element in its direction of extension, and the capacitor cover is located on the other side of the substrate element and thus accommodates the other section of the capacitor element. [4] Inverter device according to claim 3, wherein the capacitor element is designed such that the length of one section is shorter than that of the other section. [5] Inverter device according to claim 2, wherein the cooling module has a heat sink which is connected to the power conversion module and the cover element in such a way as to receive the heat generated by the power conversion module; and a cooling channel formed inside the heat sink and fluidically connected to the outside, so that a heat-absorbing cooling medium flows through the cooling channel; has, where the condenser cover is connected to one side of the heat sink. [6] Inverter device according to claim 5, wherein the cooling module has a cooling communication element that is coupled to the heat sink and fluidically connected to the cooling channel, and of which part is exposed to the outside, where the condenser cover is connected to one side of the respective sides of the heat sink on which the cooling communication element is not provided. [7] Inverter device according to claim 1, wherein the power conversion module is a substrate element that forms an outer shape of the module and is connected to the cooling module and the cover element; and a reactor element that is electrically connected to the substrate element; and wherein the cover element has a reactor lid which is connected to the cooling module and accommodates the reactor element. [8] Inverter device according to claim 7, wherein the cooling module has a heat sink which is connected to the power conversion module and the cover element in such a way that it receives the heat generated by the power conversion module, and wherein the reactor lid is arranged opposite the substrate element such that the heat sink is located between the reactor lid and the substrate element. [9] Inverter device according to claim 8, wherein the heat sink has a first cooling surface connected to the substrate element; and a second cooling surface, which is spaced apart from the first cooling surface and positioned opposite it, and is coupled to the reactor lid; has. [10] Inverter device according to claim 1, wherein the power conversion module comprises a substrate element, which forms an outer shape of the module, coupled to the cooling module and the cover element, and having a penetrating opening therein; and an IGBT element, which is electrically connected to the substrate element and arranged adjacent to the opening; and wherein the cooling module is arranged in such a way that it is at least partially exposed to the opening and is brought into contact with the IGBT element. [11] Inverter device according to claim 1, wherein the cooling module comprises a heat sink which is coupled to the power conversion module and the cover element in such a way that it receives the heat generated by the power conversion module; and a cooling channel which is formed inside the heat sink and fluidically connected to the outside, so that a heat-absorbing cooling medium flows through the cooling channel; and wherein the cooling channel includes a first cooling channel which is positioned such that it is offset to one side of the heat sink in the vertical direction of the same. [12] Inverter device according to claim 11, wherein the cooling channel has a second cooling channel which is positioned such that it is offset to another side of the heat sink in the vertical direction thereof, and which communicates with the first cooling channel, and wherein the cooling module has a cooling communication element that communicates with one of the first and the second cooling channels, so that it forms an inlet and an outlet channel for the cooling medium. [13] Inverter device according to claim 11, wherein the power conversion module comprises a substrate element that forms an outer shape of the module and is coupled to the cooling module and the cover element; and a capacitor element that is coupled to the substrate element and thus electrically connected to it; and wherein the cooling channel has a second cooling channel which is positioned so that it is offset to one side of the heat sink in the longitudinal direction of the same in order to be adjacent to the condenser element and which communicates with the first cooling channel.

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