Electrical driver device, driver kit and light fixture

Abstract

An electrical driver device (1) for use with a light source, comprising a housing (10) and a printed circuit board (20) with at least one electrical component (22, 23), wherein the printed circuit board (20) is mounted in a receiving space (11) enclosed by the housing (10), characterized in that the housing (10) has a heat dissipation section (121, 131) which extends from an inner surface (120, 130) of the housing (10) adjacent to the receiving space (11) into the receiving space (11) and is in contact there with the at least one electrical component (22, 23) in order to dissipate heat from the at least one electrical component (22, 23) via the heat dissipation section (121, 131) into the housing (10).

Description

Technical field

[0001] The present invention relates to an electrical driver device for use with a light source, a driver kit for providing an electrical driver device and a light source. Background of the invention

[0002] Luminaires known from the prior art typically have an electrical driver device that supplies a light source of the luminaire with electrical energy.

[0003] Such driver devices are often also called ballasts and, when the light is connected to an AC mains supply, regulate the current flow between the AC mains supply and the light source in order to compensate for fluctuations in the current and to ensure proper operation of the light, especially when using LED light sources which would otherwise quickly become overloaded due to their low energy consumption.

[0004] During operation, electrical components of the driver device also release heat, which may lead to overheating and thus to a loss of function or even damage to the driver device. Summary

[0005] The present invention is based on the objective of reliably and cost-effectively protecting electrical components of a lamp, in particular electrical components of its driver device, from overheating.

[0006] To solve this problem, an electrical driver device according to claim 1, a driver kit according to claim 16 and a luminaire according to claim 17 are provided.

[0007] The respective dependent claims relate to preferred embodiments, which can each be provided individually or in combination.

[0008] According to a first aspect of the invention, an electrical driver device for use with a light source is provided. The driver device comprises a housing and a printed circuit board with at least one electrical component, the printed circuit board being mounted in a receiving space enclosed by the housing. The housing has a heat dissipation section that extends from an inner surface of the housing adjacent to the receiving space into the receiving space and is in contact there with the at least one electrical component in order to dissipate heat from the at least one electrical component via the heat dissipation section into the housing.

[0009] By using the heat dissipation section, the heat generated during the operation of the electrical component can be reliably and quickly dissipated into the housing via a solid-state section through the established contact, especially in comparison to the prior art method of heat dissipation via the air surrounding the electrical component.

[0010] Put simply, the heat dissipation section bridges a gap between the inner surface and at least one electrical component to improve heat dissipation.

[0011] The improved heat dissipation reliably protects the circuit board and, in particular, the electrical component from overheating.

[0012] Designing the heat dissipation section as part of the housing is comparatively simple and inexpensive to manufacture, especially compared to an example design where expensive heat conduction materials, e.g. in the form of GapPads, would have to bridge a distance between the electrical component and the housing.

[0013] GapPad is a technical term for soft, elastic, relatively thick blocks of material with high thermal conductivity, which can be used to fill gaps between components. For example, these can be made of an electrically insulating elastomer.

[0014] The inner surface of the housing is preferably a bottom surface, a top surface, or a side surface of the housing, each adjoining the receiving space. The inner surface is preferably flat.

[0015] The housing can be made in one or more parts and thus comprise one or more housing elements which are preferably connected to each other by force and / or form locking.

[0016] The printed circuit board can include at least one electrical component as well as other electrical components.

[0017] Preferably, the heat dissipation section is in contact with the electrical component that exhibits the highest heat release during operation of the driver device.

[0018] Preferably, however, a separate heat dissipation section of the housing can be provided for several of the electrical components in order to reliably dissipate the heat from the several electrical components into the housing.

[0019] Preferably, the printed circuit board comprises a base plate made of an electrically insulating material with conductive traces attached to it, wherein the at least one electrical component or the several electrical components are attached to the base plate and have contact with the conductive traces.

[0020] Preferably, the printed circuit board has multiple mounting interfaces through which it is attached to corresponding mounting points on the housing. It should be noted that the heat dissipation sections of the housing are not considered mounting points.

[0021] Preferably, the housing is made of a metallic material.

[0022] Metallic materials, for example a steel or aluminum alloy, are particularly suitable for heat dissipation, are cost-effective and allow for a mechanically stable construction.

[0023] The heat dissipation section can be designed as a component that is attached to a housing element of the housing by force and / or form locking.

[0024] In a preferred embodiment, however, the heat dissipation section is an integral part of a housing element of the housing.

[0025] Integral in this context means that at least one material-bonded connection exists, in this case between the heat dissipation section and the rest of the housing element. This can be achieved, for example, by material bonding or by manufacturing the housing element and heat dissipation section as a single piece.

[0026] In a preferred embodiment, the heat dissipation section is designed as an indentation projecting from the inner surface, which is produced in particular by a non-separating indentation of a portion of the housing element. In other words, the indentation extends seamlessly into the housing element.

[0027] As a result, the housing element has high structural strength, especially compared to the case of a heat dissipation section produced by separating processes, which usually weakens the structural integrity of the housing element.

[0028] According to the principles of manufacturing processes, impression forming is one of the forming processes and includes, among other things, stamping or sinking.

[0029] In a preferred embodiment, the heat dissipation section is designed as a tab projecting from the inner surface, which is produced in particular by separating and deforming a portion of the housing element.

[0030] In contrast to the indentation, the tab does not extend seamlessly into the housing element, but has at least one free end and one end that merges into the housing element.

[0031] The tab has the advantage over the indentation that it is easier to manufacture and also less prone to inaccuracies in the mounting of the circuit board in the receiving space.

[0032] In a preferred embodiment, the tab is designed as an elastic preload element which, in a mounted state with the circuit board attached, is elastically deformed by interaction with the at least one electrical component, starting from an initial state without the circuit board attached, in order to exert a preload force on the at least one electrical component.

[0033] This allows deviations in the distance between the inner surface and the at least one electrical component to be advantageously compensated, which in turn ensures that the heat dissipation section is always in contact with the at least one electrical component. Such deviations can arise, for example, from assembly inaccuracies when mounting the circuit board, from thermally induced deformations of the circuit board and / or housing, or from load-induced deformations of the circuit board and / or housing.

[0034] In a preferred embodiment, the tab has at least a first subsection and a second subsection, wherein in the initial state the first subsection projects from the inner surface at an angle α1, with α1 > 0°, and the second subsection is angled relative to the first subsection, such that it is at an angle α2 to the inner surface, preferably with α1 > α2 ≥ 0 or with α1 > α2 > 0.

[0035] This creates a structure in which the first section serves to bridge a large part of the distance between the inner surface and the at least one electrical component, and the second section serves as a contact area for contact with the at least one electrical component.

[0036] The angles α1 and α2 denote the smallest angles enclosed between the inner surface and the surfaces of the sub-sections inclined to it and can be determined, for example, by measuring an angle enclosed between a surface normal of the inner surface and a surface normal of the surface of a sub-section of the tab.

[0037] Preferably, 10° ≤ α1 ≤ 90°, where α1 = 90° corresponds to a right-angled arrangement, and more preferably 20° ≤ α1 ≤ 70°, and particularly preferably 30° ≤ α1 ≤ 60°. For α2, preferably 0° ≤ α2 ≤ 70°, and more preferably 2.5° ≤ α2 ≤ 50°, and particularly preferably 5° ≤ α2 ≤ 40°. If α2 = 0, a second section, substantially parallel to the inner surface, can be provided for a flat bearing surface. If α2 < 0, the second section can, for example, protrude like a spring, so that when the electrical component is in contact with it, it is biased against the component, thus preferably ensuring a permanently secure connection.

[0038] Preferably, the individual sections of the tab are designed to be flat.

[0039] In a preferred embodiment, the tab has a bending point in a transition between the first subsection and the second subsection, which is formed in the form of one or more material recesses, preferably slot-shaped.

[0040] This introduces a flexibility in the transition between the first and second subsections, which allows the second subsection to be bent in a targeted manner relative to the first subsection when making contact with the at least one electrical component, in order to preferably obtain the largest possible contact area between the second subsection and the at least one electrical component.

[0041] In a preferred embodiment, the inner surface of the housing, from which the heat dissipation section extends into the receiving space, runs parallel to a main surface of the printed circuit board.

[0042] This allows for a mechanically symmetrical design in which the main surface of the circuit board maintains a constant distance across the surface to the inner surface of the housing and thus to the housing itself.

[0043] The main surface of the printed circuit board is preferably a main surface of a base plate of the printed circuit board on which conductor tracks are provided.

[0044] In a preferred embodiment, the housing comprises at least a cover element and a bottom element as housing elements, between which the circuit board is arranged, wherein the inner surface of the housing, from which the heat dissipation section extends into the receiving space, is preferably a bottom surface of the bottom element or a top surface of the cover element.

[0045] The housing's at least two-part design facilitates access to the mounting chamber, allowing the circuit board to be attached there.

[0046] Preferably, the base element and / or the cover element have a substantially U-shape in cross-section along a longitudinal direction of the driver device. This allows the housing to be largely formed by just these two housing elements, namely the cover element and the base element. The legs projecting from a base / cover section of the base / cover element can preferably be used to form the side walls of the housing.

[0047] In a preferred embodiment, the heat dissipation section is in contact with the at least one electrical component via a thermally conductive intermediate layer that has a higher thermal conductivity than the heat dissipation section.

[0048] This can improve heat conduction at the joint between the component and the heat dissipation element.

[0049] In a preferred embodiment, the thermally conductive intermediate layer is formed from a thermal paste and / or from a thermal conducting body, which is in particular made of an electrically insulating elastomer.

[0050] In a preferred embodiment, the heat dissipation section extends across an electrically insulating insulating layer and is in contact with at least one electrical component.

[0051] This prevents current from flowing into the casing.

[0052] In a preferred embodiment, the electrical component is a semiconductor component, a capacitor element, or an inductor, particularly in the form of a coil.

[0053] In a preferred embodiment, the printed circuit board comprises N further electrical components, with N≥1, and the housing has N further heat dissipation sections, each extending from an inner surface of the housing adjacent to the receiving space into the receiving space and in contact there with one of the N further electrical components in order to dissipate heat from the respective electrical component via the respective heat dissipation section into the housing.

[0054] In this way, heat dissipation can occur at several electrical components on the circuit board, thus preventing overheating across the entire circuit board.

[0055] In a preferred embodiment, the driver device is an LED driver device for supplying energy to an LED light source.

[0056] LED driver devices typically contain particularly sensitive components, so improved heat dissipation protects them especially well from damage.

[0057] According to a second aspect of the invention, a driver kit is provided for supplying an electrical driver device, comprising at least a housing and a printed circuit board (PCB) mounted in a receiving space enclosed by the housing, the PCB comprising at least one electrical component, and designed for use with a light source. The driver kit comprises a housing and a set of printed circuit boards, comprising a first and a second PCB, which differ in at least one position of at least one electrical component on the respective PCB. Each PCB of the set of printed circuit boards can be mounted in a receiving space enclosed by the housing, and the housing has, on an inner surface adjacent to the receiving space, at least a partially punched-out first preparation section adapted to the first PCB and a partially punched-out second preparation section.which is adapted to the second printed circuit board, such that, when a driver device comprising the housing and the first printed circuit board is provided, the first preparation section can be formed by deformation into a heat dissipation section extending from the inner surface of the housing into the receiving space and in contact there with the at least one electrical component of the first printed circuit board mounted in the receiving space in order to dissipate heat from the at least one electrical component of the first printed circuit board into the housing, and when a driver device comprising the housing and the second printed circuit board is provided, the second preparation section can be formed by deformation into a heat dissipation section extending from the inner surface of the housing into the receiving space and in contact there with the at least one electrical component of the second printed circuit board mounted in the receiving space,to dissipate heat from at least one electrical component of the second circuit board into the housing.

[0058] The driver kit allows for the provision of multiple driver devices, for which the aforementioned advantages of improved heat dissipation can be achieved using the same housing for a wide variety of printed circuit boards.

[0059] By adapting the housing to the number of printed circuit boards, it is now sufficient to provide only one type of housing, which can be adapted to a wide variety of printed circuit boards by deforming the respective preparation sections.

[0060] This simplifies manufacturing and thus also reduces the manufacturing costs for a wide variety of driver devices.

[0061] According to a third aspect of the invention, a lamp is provided which comprises a light source and an electrical driver device according to the first aspect or one of its preferred embodiments, by means of which the light source can be supplied with electrical energy.

[0062] The advantages explained above with regard to the first aspect also apply to the luminaire, which can be reliably protected from overheating by using the heat dissipation sections according to the invention.

[0063] Preferably, the light source is an LED light source and the driver device is an LED driver device.

[0064] Further aspects and their advantages, as well as more specific embodiments of the aforementioned aspects and embodiments, are described below with the aid of the drawings shown in the accompanying figures.

[0065] Identical or similar elements in the figures can be designated with the same reference symbols, but sometimes they can be designated with different reference symbols. Fig. Figure 1 shows a top view of a cross-section of an embodiment of the driver device according to the invention. Fig. Figure 2A shows a top view of a section of a cross-section of an embodiment of the driver device according to the invention in the area of ​​a heat dissipation section without a circuit board attached in the receiving space. Fig. Figure 2B shows a top view of the heat dissipation section from the exemplary embodiment shown in Fig. 2A in a view rotated 90° relative to this one.

[0066] It is emphasized that the present invention is in no way limited to the embodiments and features described below, provided that these are covered by the subject matter of the claims.

[0067] The invention further comprises modifications of the aforementioned embodiments, in particular those resulting from modifications and / or combinations of individual or multiple features of the described embodiments within the scope of protection of the independent claims. Detailed character description

[0068] Fig. Figure 1 shows a top view of a cross-section of an embodiment of the driver device 1 according to the invention.

[0069] The cross-section is perpendicular to a longitudinal direction of the driver device 1.

[0070] The driver device 1 is designed for use with a light source and comprises a housing 10 and a circuit board 20 with at least one electrical component 22, 23.

[0071] The circuit board 20 is mounted in a receiving space 11 enclosed by the housing 10.

[0072] The housing 10 has at least one heat dissipation section 121, 131, which extends from an inner surface 120, 130 of the housing 10 adjacent to the receiving space 11 into the receiving space 11 and is in contact there with the at least one electrical component 22, 23 in order to dissipate heat from the at least one electrical component 22, 23 via the heat dissipation section 121, 131 into the housing 10.

[0073] In simplified terms, the heat dissipation section 121, 131 bridges a gap between the inner surface 120, 130 and the at least one electrical component 22, 23.

[0074] In the illustrated embodiment, the printed circuit board 20 comprises, by way of example, three electrical components 121, 131 in the form of two semiconductor components 121 and an inductor 131, which are preferably mounted on a lower and an upper main surface of a base plate 21 of the printed circuit board 20. However, the invention should not be understood as being limited to use with a printed circuit board 20 with the aforementioned components 22, 23. Thus, heat dissipation sections can be used for any component that generates heat during operation.

[0075] In the illustrated embodiment, the housing 10 has, by way of example, three heat dissipation sections 121, 131, each of which is in contact with one of the electrical components 22, 23. However, the invention is not to be understood as requiring a separate heat dissipation section 121, 131 for each electrical component 22, 23 of the circuit board 20. Thus, with a plurality of electrical components 22, 23, only one heat dissipation section 121, 131 may be present.

[0076] The housing 10 is preferably designed in multiple parts and comprises in particular a base element 12 and a cover element 13 as housing elements of the housing 10, which are preferably connected to each other by force and / or form-fitting in order to form the housing 10.

[0077] Preferably, the base element 12 and / or the cover element 13 have a substantially U-shaped cross-section in the longitudinal direction. This allows the housing 10 to be largely formed by just the cover element 13 and the base element 12. The legs projecting from a base / cover section of the base / cover element 12, 13 can preferably be used to form side walls of the housing 10 (see Figure 1). Fig. 1) and preferably include connection interfaces for force-fit and / or form-fit connection of bottom and cover elements 12, 13.

[0078] Preferably, at least one or all heat dissipation sections 121, 131 are an integral part of a housing element of the housing. In the illustrated embodiment, the base element 12, for example, has two heat dissipation sections 121 that extend from a base surface 120 of the base element 12 into the receiving space 11.

[0079] Furthermore, the cover element 13, for example, has a heat dissipation section 131 that extends from a ceiling surface 130 of the cover element 13 into the receiving chamber 11. The bottom surface 120 and the ceiling surface 130 are to be understood as the inner surfaces of the housing.

[0080] Preferably, the circuit board 20 is arranged in the receiving space 11 such that it runs parallel to at least one inner surface 120, 130 of the housing 10, from which a heat dissipation section 121, 131 extends into the receiving space 11. In this arrangement, a main surface of the circuit board 20, which is in particular a main surface of the base plate 21, runs parallel to said inner surface 120, 130.

[0081] Preferably, at least one or all of the heat dissipation sections 121, 131 are designed as tabs projecting from the respective inner surface 120, 130, which are produced in particular by separating and deforming a part of the housing element.

[0082] Preferably, such a tab is designed as an elastic preload element which, in a mounted state with the circuit board 20 attached, is elastically deformed by interaction with the associated electrical component 22, 23 from an initial state without the circuit board 20 attached, in order to exert a preload force on the electrical component 22, 23 (see also Fig. 2).

[0083] Preferably, at least one or all of the heat dissipation sections 121, 131 are in contact with the associated electrical component 22 via a thermally conductive intermediate layer 30, which has a higher thermal conductivity than the associated heat dissipation section 121. In the illustrated embodiment, only one thermally conductive intermediate layer 30 is present.

[0084] The proposed driver device 1, according to the illustrated embodiment, allows, in simplified terms, a gap between an electrical component 22, 23 and an inner surface 120, 130 of the housing 10 to be bridged by a heat dissipation section 121, 131. By using the heat dissipation section 121, 131, the heat generated during operation of the electrical component 22, 23 can thus be reliably and quickly dissipated via the contact established through the heat dissipation section 121, 131 (as a solid section) into the housing 10, thereby preventing, for example, overheating of the electrical component 22, 23.

[0085] Fig. Figure 2A shows a top view of a section of a cross-section of an embodiment of the driver device 1 according to the invention in the area of ​​a heat dissipation section 121 without a circuit board attached in the receiving space 11 (see also for comparison Fig. 1). Fig. Figure 2B shows a top view of the heat dissipation section 121 from the embodiment shown in Figure 2B. Fig. 2A in a view rotated 90° relative to this one.

[0086] Fig. 2A and Fig. 2B are described together below.

[0087] The heat dissipation section 121 is preferably designed as a tab and extends from an inner surface 120 of the housing 10 (here, for example, a bottom surface of a base element 12) into the receiving space 11, in order to make contact with an electrical component of the printed circuit board therein, if a printed circuit board is attached therein (see also Fig. 1).

[0088] Preferably, the tab is designed as an elastic prestressing element, which in a mounted state with the circuit board attached (see also Fig. 1) through interaction with the associated electrical component, starting from an initial state without a mounted circuit board, it is elastically deformed in order to exert a preload force on the electrical component. Accordingly, it shows Fig. 2A such an initial state.

[0089] The heat dissipation section 121, or the tab, preferably has at least a first subsection 121-1 and a second subsection 121-2. The first subsection 121-1 preferably serves to bridge a large part of the distance between the inner surface 120 and the electrical component of the printed circuit board subsequently mounted in the receiving space 11. The second subsection 121-2 preferably serves as a contact area for contact with the electrical component (see also Fig. 1) Preferably, the subsections 121-1 and 121-2 are planar.

[0090] In the initial state, the first subsection 121-1 is at an angle α1, with α1 > 0°, away from the inner surface 120, and the second subsection 121-2 is angled relative to the first subsection 121-2, so that the second subsection 121-2 is at an angle α2 to the inner surface 120, with α1 > α2 ≥ 0.

[0091] In the event of contact between the tab and the electrical component when the printed circuit board is mounted in the receiving space 11, the tab is deformed towards the inner surface 120 and thus pre-tensioned to exert a pre-tensioning force on the electrical component. Preferably, the deformation results in at least the angle α2 being smaller in the mounted state than in the initial state, which is exemplified in Fig. 2A is shown.

[0092] Preferably, the tab has a bending point in a transition between the first subsection 121-1 and the second subsection 121-2 (see Fig.2B), which is formed in the form of one or more material recesses, for example in the form of one or more slots 123-3 running along a dividing line between the first subsection 121-1 and the second subsection 121-2.

[0093] This introduces a flexibility in the transition between the first and second subsection 121-1, 121-2, which allows for a targeted and easier bending of the second subsection 121-2 relative to the first subsection 121-1 when making contact with the at least one electrical component.

[0094] Above, exemplary embodiments of the present invention and their advantages have been described in detail with reference to the accompanying figures.

[0095] It is emphasized again that the present invention is in no way limited to the embodiments and features described above, provided they are covered by the subject matter of the following claims. The invention further includes modifications of the aforementioned embodiments, in particular those resulting from modifications and / or combinations of the features of the described embodiments within the scope of protection of the independent claims. List of reference symbols 1 Driver device 10 cases 11 Recording Room 12 floor elements 13 Cover element 20 circuit boards 21 Base plate 22 Semiconductor device 23 Inductance 30 thermally conductive intermediate layer 120 interior surface area, floor area of ​​the floor element 121 Heat dissipation section of the floor element 121-1 first subsection 121-2 second subsection 121-3 slot 130 internal surface area, ceiling surface of the cover element 131 Heat dissipation section of the ceiling element

Claims

[1] Electrical driver device (1) for use with a light source, comprising a housing (10) and a printed circuit board (20) with at least one electrical component (22, 23), wherein the printed circuit board (20) is mounted in a receiving space (11) enclosed by the housing (10), characterized by , that the housing (10) has a heat dissipation section (121, 131) which extends from an inner surface (120, 130) of the housing (10) adjacent to the receiving space (11) into the receiving space (11) and is in contact there with the at least one electrical component (22, 23) in order to dissipate heat from the at least one electrical component (22, 23) via the heat dissipation section (121, 131) into the housing (10). [2] Electrical driver device (1) according to claim 1, wherein the heat dissipation section (121, 131) is an integral part of a housing element (12, 13) of the housing (10). [3] Electrical driver device (1) according to claim 2, wherein the heat dissipation section (121, 131) is designed as an indentation projecting from the inner surface (120, 130), which is produced in particular by a non-separating indentation of a partial area of ​​the housing element (12, 13). [4] Electrical driver device (1) according to claim 2, wherein the heat dissipation section (121, 131) is designed as a tab (121, 131) projecting from the inner surface (120, 130), which is produced in particular by separating and deforming a part of the housing element (12, 13). [5] Electrical driver device (1) according to claim 4, wherein the tab (121, 131) is designed as an elastic preload element which, in a mounted state with the circuit board (20) attached, is elastically deformed by interaction with the at least one electrical component (22, 23) from an initial state without the circuit board (20) attached, in order to exert a preload force on the at least one electrical component (22, 23). [6] Electrical driver device (1) according to one of claims 4 or 5, wherein the tab (121) has at least a first subsection (121-1) and a second subsection (121-2), wherein in the initial state the first subsection (121-1) is angled away from the inner surface (120) at an angle α1, with α1 > 0°, and the second subsection (121-2) is angled relative to the first subsection (121-1) so that it is at an angle α2, with α1 > α2 ≥ 0°, to the inner surface (120). [7] Electrical driver device (1) according to claim 6, wherein the tab (121) has a bending point in a transition between the first subsection (121-1) and the second subsection (121-1), which is formed in the form of one or more material recesses (123-3), which are preferably slot-shaped. [8] Electrical driver device (1) according to one of claims 1 to 7, wherein the inner surface (120, 130) of the housing (10), from which the heat dissipation section (121, 131) extends into the receiving space (11), runs parallel to a main surface of the printed circuit board (20). [9] Electrical driver device (1) according to one of claims 1 to 8, wherein the housing (10) comprises as housing elements (12, 13) at least a cover element (13) and a base element (12) between which the circuit board (20) is arranged, wherein the inner surface (120, 130) of the housing (10), from which the heat dissipation section (121, 131) extends into the receiving space (11), is preferably a base surface (121) of the base element (120) or a top surface (131) of the cover element (131). [10] Electrical driver device (1) according to one of claims 1 to 9, wherein the heat dissipation section (121, 131) is in contact with the at least one electrical component (22, 23) via a thermally conductive intermediate layer (30) which has a higher thermal conductivity than the heat dissipation section (121, 131). [11] Electrical driver device (1) according to claim 10, wherein the thermally conductive intermediate layer (30) is formed from a thermal paste and / or from a thermal conducting body, which is in particular made from an electrically insulating elastomer. [12] Electrical driver device (1) according to one of claims 1 to 11, wherein the heat dissipation section (121, 131) is in contact with the at least one electrical component (22, 23) across an electrically insulating insulating layer. [13] Electrical driver device (1) according to one of claims 1 to 12, wherein the at least one electrical component (22, 23) is a semiconductor component (22) or a capacitor element or an inductor (23), in particular in the form of a coil. [14] Electrical driver device (1) according to one of claims 1 to 13, wherein the printed circuit board (20) comprises N further electrical components (22, 23), with N≥1, and the housing (10) has N further heat dissipation sections (121, 131) which each extend from an inner surface (120, 130) of the housing (10) adjacent to the receiving space (11) into the receiving space (11) and are in contact there with one of the N further electrical components (22, 23) in order to dissipate heat from the respective electrical component (22, 23) via the respective heat dissipation section (121, 131) into the housing (10). [15] Electrical driver device (1) according to any one of claims 1 to 14, wherein the driver device (1) is an LED driver device (1) for supplying energy to an LED light source. [16] Driver kit for providing an electrical driver device (1) comprising at least a housing (10) and a printed circuit board (20) mounted in a receiving space (11) enclosed by the housing (10), which includes at least one electrical component (22, 23) and is designed for use with a light source, the driver kit includes: - a case (10); and - a set of printed circuit boards (20) comprising a first and a second printed circuit board (20) that differ at least in one position of at least one electrical component (22, 23) of the respective printed circuit board (20); wherein each printed circuit board (20) of the set of printed circuit boards (20) can be mounted in a receiving space (11) enclosed by the housing (10), and the housing (10) has on an inner surface (120, 130) adjacent to the receiving space (11) at least a partially punched first preparation section adapted to the first circuit board (20) and a partially punched second preparation section adapted to the second circuit board (20), such that, when a driver device (1) comprising the housing (10) and the first printed circuit board (20) is provided, the first preparation section can be formed by deformation into a heat dissipation section (121, 131) which extends from the inner surface (120, 130) of the housing (10) into the receiving space (11) and is in contact there with the at least one electrical component (22, 23) of the first printed circuit board (20) fixed in the receiving space (11) in order to dissipate heat from the at least one electrical component (22, 23) of the first printed circuit board (20) into the housing (10), and When providing a driver device (1) comprising the housing (10) and the second circuit board (20), the second preparation section can be formed by deformation into a heat dissipation section (121, 131) which extends from the inner surface (120, 130) of the housing (10) into the receiving space (11) and is in contact there with the at least one electrical component (22, 23) of the second circuit board (20) fixed in the receiving space (11) in order to dissipate heat from the at least one electrical component (22, 23) of the second circuit board (20) into the housing (10). [17] Lamp, comprising: - a light source, and - an electrical driver device (1) according to one of claims 1 to 15, by means of which the light source can be supplied with electrical energy.

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