Optical component, imaging lens and electronic device

Abstract

Optical component (11), comprising: a substrate (110) with an aspherical surface (AS1, AS2), wherein light passes through the aspherical surface (AS1, AS2); and an antireflection film (111) which is arranged at least on the aspherical surface (AS1, AS2), wherein the antireflection film (111) comprises: a nanostructured layer (1110) comprising a plurality of ridge-like projections (RLP) extending in an undirected manner, wherein a bottom surface (BPS) of the plurality of ridge-like projections (RLP) is located closer to the substrate (110) than a top surface (TPS) of the plurality of ridge-like projections (RLP), wherein the plurality of ridge-like projections (RLP) gradually taper from the bottom surface (BPS) to the top surface (TPS), and an average structural height (H1) of the plurality of ridge-like projections (RLP) is greater than 108 nm and less than 368 nm; and at least one intermediate layer (1111) arranged between the nanostructure layer (1110) and the substrate (110); wherein a major component of the nanostructure layer (1110) is aluminium oxide, the nanostructure layer (1110) further comprises a metallic dopant (MDA), at least a part of the metallic dopant (MDA DA) is distributed within the plurality of burr-like projections (RLP) and the metallic dopant (MDA) comprises at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide and chromium oxide.

Description

BACKGROUNDTechnical field

[0001] The present disclosure relates to an optical component, an imaging lens and an electronic device, in particular to an optical component and an imaging lens that can be used in an electronic device. Description of related technology

[0002] With the development of semiconductor manufacturing technology, the performance of image sensors has improved and their pixel size has been reduced. Therefore, high image quality is one of the essential features of an optical system today. Furthermore, due to rapid technological change, smartphones equipped with optical systems are becoming multifunctional for various applications, so the requirements for the functionality of optical systems have increased.

[0003] In recent years, the use of miniature optical systems in mobile devices for photography has become increasingly popular. However, mobile devices are often exposed to strong sunlight when used outdoors, which significantly affects the optical systems due to strong non-imaging stray light. In particular, non-imaging light is easily reflected in the optical systems, severely affecting image quality.

[0004] Conventional techniques for optical systems include methods such as dyeing, sandblasting, and coating the surfaces of optical elements to reduce reflectivity and eliminate stray light. Although these methods can improve optical image quality, they are still insufficient to eliminate high-intensity stray light. In addition, in the field of optical systems for non-mobile devices, other techniques exist to reduce reflectivity, such as the formation of porous microstructures on the surface of coatings. However, these structures are not sufficiently stable and are prone to deformation due to environmental influences, which significantly reduces the effectiveness of anti-reflection.Therefore, improving the structure of internal components in optical systems to reduce the reflection intensity of non-imaging light has become a crucial issue to meet today's high-end requirements for electronic devices. SUMMARY

[0005] According to one aspect of the present disclosure, an optical component comprises a substrate and an anti-reflection film. Preferably, the substrate has an aspherical surface, and light passes through the aspherical surface. Preferably, the anti-reflection film is disposed at least on the aspherical surface. The anti-reflection film comprises a nanostructure layer and at least one intermediate layer. The nanostructure layer comprises a plurality of ridge-like protrusions extending non-directionally, wherein a bottom surface of the ridge-like protrusions is disposed closer to the substrate than a top surface of the ridge-like protrusions, and the ridge-like protrusions gradually taper from the bottom surface to the top surface. An average structural height of the ridge-like protrusions is greater than 108 nm and less than 368 nm. The intermediate layer is disposed between the nanostructure layer and the substrate.Furthermore, a main component of the nanostructure layer is aluminum oxide. The nanostructure layer further comprises a metallic dopant, and at least a portion of the metallic dopant is distributed within the ridge-like protrusions. The metallic dopant preferably comprises at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.

[0006] According to another aspect of the present disclosure, an optical component comprises a substrate and an anti-reflection film. Preferably, the substrate has a reflective surface configured to reflect light. Preferably, the anti-reflection film is disposed on at least one or some surfaces of the substrate. The anti-reflection film comprises a nanostructure layer and at least one intermediate layer. The nanostructure layer comprises a plurality of ridge-like protrusions extending non-directionally, wherein a bottom surface of the ridge-like protrusions is disposed closer to the substrate than a top surface of the ridge-like protrusions, and the ridge-like protrusions gradually taper from the bottom surface to the top surface. An average structural height of the ridge-like protrusions is greater than 108 nm and less than 368 nm. The intermediate layer is disposed between the nanostructure layer and the substrate.Furthermore, a main component of the nanostructure layer is aluminum oxide. The nanostructure layer further comprises a metallic dopant, and at least a portion of the metallic dopant is distributed within the ridge-like protrusions. Preferably, the metallic dopant contains at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.

[0007] According to another aspect of the present disclosure, an imaging lens includes one of the aforementioned optical components, and an optical axis of the imaging lens passes through the optical component.

[0008] According to another aspect of the present disclosure, an electronic device includes the aforementioned imaging lens and an image sensor disposed on an image surface of the imaging lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The disclosure can be better understood by reading the following detailed description of the embodiments with reference to the accompanying drawings: Fig. 1 is a cross-sectional view of an imaging lens according to the first embodiment of the present disclosure; Fig. 2 is a cross-sectional view of an optical component of the Fig. 1 shown imaging lens; Fig. 3 is an enlarged view of the Fig. 2 shown area EL3; Fig. 4 is a perspective view of the Fig. 1 shown optical component of the imaging lens; Fig. 5 is an enlarged view of the Fig. 4 shown area EL5; Fig. 6 is another perspective view of the Fig. 1 shown optical component of the imaging lens; Fig. 7 is an enlarged view of the Fig. 6 shown area EL7; Fig. Figure 8 is a partially enlarged cross-sectional view of the optical component of the Fig. 1 shown imaging lens under a transmission electron microscope; Fig. 9 is a partially enlarged cross-sectional view of the optical component of the Fig. 1 shown imaging lens; Fig. 10 is a schematic view of the stacking relationship between a nanostructure layer, an intermediate layer and a substrate of the optical component of the imaging lens shown in Fig. 1 is shown; Fig. 11 is a cross-sectional view of an imaging lens according to the second embodiment of the present disclosure; Fig. 12 is a cross-sectional view of an optical component of the imaging lens shown in Fig. 11 is shown; Fig. 13 is a perspective view of the optical component of the Fig. 11 shown imaging lens; Fig. 14 is a schematic view of the stacking relationship between a nanostructure layer, three intermediate layers and a substrate of the optical component of the device shown in Fig. 11 shown imaging lens; Fig. 15 is a cross-sectional view of an imaging lens according to the third embodiment of the present disclosure; Fig. 16 is a cross-sectional view of an optical component of the Fig. 15 shown imaging lens; Fig. 17 is a perspective view of the Fig. 15 shown optical component of the imaging lens; Fig. 18 is a partially enlarged cross-sectional view of the Fig. 15 shown optical component of the imaging lens; Fig. 19 is a sectional view of the Fig. 17 shown optical component; Fig. 20 is a view of the top of the Fig. 17 shown optical component; Fig. 21 is an enlarged view of the Fig. 20 shown area EL21; Fig. 22 is a cross-sectional view of an imaging lens according to the 4th embodiment of the present disclosure; Fig. 23 is a cross-sectional view of an optical component of the Fig. 22 shown imaging lens; Fig. 24 is a cross-sectional view of an imaging lens according to the 5th embodiment of the present disclosure; Fig. 25 is a cross-sectional view of an optical component of the Fig. 24 shown imaging lens; Fig. 26 is a perspective view of an electronic device according to the 6th embodiment of the present disclosure; Fig. 27 is another perspective view of the Fig. 26 shown electronic device; Fig. 28 is an illustration of an image taken by an ultra-wide-angle imaging lens; Fig. Figure 29 is an illustration of an image taken by a high pixel imaging lens; Fig. 30 is an illustration of an image taken by a telephoto imaging lens; Fig. 31 is a perspective view of an electronic device according to the 7th embodiment of the present disclosure; Fig. 32 is a perspective view of an electronic device according to the 8th embodiment of the present disclosure; Fig. 33 is a side view of the Fig. 32 shown electronic device; Fig. 34 is a view of the top of the Fig. 32 shown electronic device; Fig. 35 is a partial cross-sectional view of an anti-reflection film and a substrate of an optical component according to a configuration of the present disclosure under a transmission electron microscope; Fig. 36 is a distribution map of aluminum elements in the Fig. 35, which was analyzed using an energy dispersive X-ray spectrometer; Fig. 37 is a distribution map of silicon elements in the Fig. 35, which was analyzed using an energy dispersive X-ray spectrometer; and Fig. 38 is a distribution map of titanium in the Fig. 35, which was analyzed with an energy dispersive X-ray spectrometer. DETAILED DESCRIPTION

[0010] In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, it will be apparent that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown schematically to simplify the drawing.

[0011] The present disclosure provides an optical component, and the optical component has optical applications, such as light folding, convergence, divergence, shielding, or reflection reduction related to optical phenomena, but the present disclosure is not limited to the above-mentioned literal descriptions of applications. The optical component may be, for example, a lens element or a prism, but the present disclosure is not limited thereto. The optical component comprises a substrate and an anti-reflection film, wherein the substrate may be made of, for example, glass material or plastic material, and the anti-reflection film is disposed on at least one or some surfaces of the substrate. The anti-reflection film comprises a nanostructured layer and at least one intermediate layer, wherein the intermediate layer is disposed between the nanostructured layer and the substrate.

[0012] The nanostructure layer comprises a plurality of ridge-like protrusions extending non-directionally. A bottom surface of the ridge-like protrusions is closer to the substrate than a top surface of the ridge-like protrusions, and the ridge-like protrusions gradually taper from the bottom surface to the top surface. Therefore, the ridge-like protrusions contribute to the formation of a gradient refractive index, thereby reducing the reflectance. Furthermore, an average structural height of the ridge-like protrusions is greater than 108 nm and less than 368 nm. Furthermore, the height of each ridge-like protrusion can be different; therefore, the average structural height of the ridge-like protrusions can be calculated using at least three or more ridge-like protrusions, prioritizing those with identifiable contours. Additionally, the height of a ridge-like protrusion can be determined from a cross-sectional observation (e.g.,Destructive measurement) can be defined as the vertical height from the absolute bottom of the ridge-like projection (e.g., the toe of the ridge) to the top of the ridge-like projection (e.g., the tip of the ridge). It is based on . Fig. 8 and Fig. 9, which are schematic views respectively showing the bottom surface BPS, the top surface TPS, and the average structural height H1 of the ridge-like protrusions RLP and the substrate 110 in the imaging lens according to the first embodiment of the present disclosure.

[0013] The main component of the nanostructure layer is aluminum oxide (Al2O3). The nanostructure layer further comprises a metallic dopant, and the metallic dopant is at least partially distributed within the ridge-like protrusions. Therefore, the nanostructure layer comprising the metallic dopant is beneficial for increasing the tolerance and durability of the nanostructure layer to environmental changes, thereby reducing the effects of such changes on the film structure and maintaining the performance of the anti-reflective film. These environmental changes may include fluctuations in temperature, humidity, or other chemical disturbances, but the present disclosure is not limited thereto.

[0014] The metallic dopant comprises at least one of titanium, vanadium, chromium, tantalum, zirconium, niobium, titanium oxide, vanadium oxide, chromium oxide, tantalum oxide, zirconium oxide, or niobium oxide. In one aspect, the metallic dopant is selected from a group consisting of titanium, vanadium, chromium, tantalum, zirconium, niobium, titanium oxide, vanadium oxide, chromium oxide, tantalum oxide, zirconium oxide, and niobium oxide. In one aspect, the metallic dopant is selected from a group consisting of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide. In one aspect, the main component of the metallic dopant is titanium oxide. Therefore, it is advantageous for increasing the stability of the anti-reflection film. In one aspect, the metallic dopant is selected from a group consisting of tantalum, zirconium, niobium, tantalum oxide, zirconium oxide, and niobium oxide.Furthermore, the detection method for metallic dopants can be performed using a transmission electron microscope (TEM) equipped with an energy-dispersive X-ray spectrometer (EDS) for analysis. Regardless of whether the metallic dopant is in the form of metal elements or metal oxides, the distribution of the metal species serves as the primary basis for evaluation. See, for example, [link missing]. Fig. 35 to Fig. 38. Fig. 35 is a partial cross-sectional view of an anti-reflection film and a substrate of an optical component according to a configuration of the present disclosure under a transmission electron microscope, Fig. 36 is a distribution map of aluminum elements in the Fig. 35, analyzed using an energy dispersive X-ray spectrometer, Fig. 37 is a distribution map of silicon elements in the Fig. 35, analyzed using an energy dispersive X-ray spectrometer and Fig. 38 is a distribution map of titanium elements in the Fig. 35, which was analyzed with an energy dispersive X-ray spectrometer. As shown in Fig. 35 to Fig. As can be seen in Figure 38, the transmission electron microscope provides high-resolution images of the microstructure of the antireflection film SPA and the substrate SPB of the optical component. In addition, the energy-dispersive X-ray spectrometer provides information on the elemental composition of the antireflection film SPA and the substrate SPB. This information on the elemental composition can include, for example, the element types and their distribution within the substrate SPB and the nanostructure layer SPA1 and the intermediate layer SPA2 of the antireflection film SPA.

[0015] In one configuration, the substrate has an aspherical surface, light passes through the aspherical surface, and the anti-reflection film is disposed at least on the aspherical surface. In another configuration, the substrate has a reflective surface configured to reflect light. Furthermore, the anti-reflection film can also be disposed on the reflective surface.

[0016] In one configuration, the main component of the interlayer may be silicon dioxide (SiO2). Therefore, it is advantageous for increasing the bonding stability of the anti-reflection film. In another configuration, the main component of the interlayer may be the same as one of the components forming the nanostructure layer. Therefore, it is advantageous for adjusting the gradient refractive index of the anti-reflection film and also facilitates bonding of the nanostructure layer. Furthermore, the main component of the interlayer may be, for example, aluminum, titanium, vanadium, chromium, oxides of the aforementioned elements, or combinations thereof, but the present disclosure is not limited thereto.

[0017] The number of intermediate layers can be multiple, and the intermediate layers can form thin film interference, which is beneficial for reducing the reflectance.

[0018] The at least portion of the metallic dopant distributed within the ridge-like protrusions can gradually taper in a direction away from the substrate. Therefore, the metallic dopant can also adjust the degree of the refractive index gradient of the nanostructure layer, thereby reducing the reflectance.

[0019] At least a further portion of the metallic dopant may be distributed on the surface of the ridge-like protrusions. Therefore, it is advantageous to protect the ridge-like protrusions and prevent structural deformation of the ridge-like protrusions due to environmental fluctuations, thereby maintaining the anti-reflection performance.

[0020] A coverage thickness of the metallic dopant on the surface of the ridge-like protrusions may be greater than 1 nm and less than 40 nm. Therefore, a suitable thickness condition can preserve the structural shape of the ridge-like protrusions while improving the weather resistance of the ridge-like protrusions. Furthermore, the coverage thickness of the metallic dopant on the surface of the comb-like protrusions may be greater than 1 nm and less than 30 nm. Fig. 8, which shows a schematic view of the coverage thickness D1 of the metallic dopant MDA on the surface of the ridge-like protrusions RLP in the imaging lens according to the first embodiment of the present disclosure.

[0021] The optical component may further comprise a matte structure formed integrally with the substrate. The matte structure may be located on one or some surfaces of the substrate and may have a wavy shape (e.g., continuous convex-concave shapes). Therefore, a wavy surface is advantageous for reducing stray light reflections. Furthermore, the matte structure may be formed on the substrate of the optical component by mold design. Furthermore, the matte structure may be located outside an optically active region of the optical component.

[0022] The mat structure may have a plurality of protrusion portions, and the protrusion portions may be arranged regularly. Therefore, this is advantageous for facilitating quality control of the mat structure.

[0023] The height of the protrusion sections can be greater than 40 µm and less than 1000 µm. Therefore, it is beneficial to prevent stray light reflections from reaching the image surface.

[0024] The optical component may further comprise a light-blocking layer located on one or some surfaces of the substrate and configured to block light transmission. Furthermore, the light-blocking layer may be disposed outside the optically active region of the optical component. Therefore, it is advantageous for reducing stray light. Furthermore, the light-blocking layer may be composed of materials that reduce light reflection, such as dark ink, photocurable coatings, acrylic pigments, carbon black, or metal oxides, for example, but the present disclosure is not limited thereto. Furthermore, the anti-reflection film may further be disposed on the light-blocking layer.

[0025] According to the present disclosure, an imaging lens is provided. The imaging lens includes the above-mentioned optical component, and an optical axis of the imaging lens passes through the optical component.

[0026] According to the present disclosure, an electronic device is provided. The electronic device includes an image sensor and the above-mentioned imaging lens, and the image sensor is arranged on an image surface of the imaging lens.

[0027] According to the present disclosure, the above-mentioned features and conditions can be used in numerous combinations to achieve corresponding effects.

[0028] In accordance with the above description of the present disclosure, the following specific embodiments are provided for further explanation. 1. Embodiment

[0029] Fig. 1 is a cross-sectional view of an imaging lens according to the first embodiment of the present disclosure, Fig. 2 is a cross-sectional view of an optical component of the Fig. 1 shown imaging lens, Fig. 3 is an enlarged view of the Fig. 2 shown area EL3, Fig. 4 is a perspective view of the Fig. 1 shown optical component of the imaging lens, Fig. 5 is an enlarged view of the Fig. 4 shown area EL5, Fig. 6 is another perspective view of the Fig. 1 shown optical component of the imaging lens, Fig. 7 is an enlarged view of the Fig. 6 shown area EL7, Fig. 8 is a partially enlarged cross-sectional view of the Fig. 1 shown optical component of the imaging lens under a transmission electron microscope, Fig. 9 is a partially enlarged cross-sectional view of the optical component of the Fig. 1 shown imaging lens and Fig. 10 is a schematic view of the stacking relationship between a nanostructure layer, an intermediate layer and a substrate of the optical component of the device shown in Fig. 1 shown imaging lens.

[0030] In this embodiment, an imaging lens 1 is provided. The imaging lens 1 is a telephoto imaging lens, and the imaging lens 1 includes a plurality of optical components and an image surface IMG. The optical components include a housing 10, a plurality of lens elements 11 and 12, a plurality of light-blocking elements 13, a spacer 14, a holder 15, and a filter 16. Moreover, the lens elements 11 and 12, the light-blocking elements 13, the spacer 14, and the holder 15 are housed in the housing 10, the filter 16 is disposed between the lens element 12 and the image surface IMG, and an optical axis of the imaging lens 1 passes through the optical components. After entering the housing 10, the light passes through the lens elements 11 and 12, the light-blocking elements 13 and the filter 16 and becomes imaging light that forms an image on the image surface IMG.

[0031] The lens element 11 includes a substrate 110, two anti-reflection films 111, and two matte structures 112 and 113. The substrate 110 has two aspherical surfaces AS1 and AS2 and a reflective surface RS1. Light passes through the aspherical surfaces AS1 and AS2, and the reflective surface RS1 is configured to reflect light. The anti-reflection films 111 are disposed on the aspherical surfaces AS1 and AS2. Note that in Fig. 2, the anti-reflection films 111 are shown separated from the substrate 110 for clarity only. However, the connection between the anti-reflection films 111 and the substrate 110 is not limited to the representation shown in the figure.

[0032] As in Fig. 9 and Fig. As shown in Figure 10, each of the anti-reflection films 111 includes a nanostructure layer 1110 and an intermediate layer 1111, and the intermediate layer 1111 is disposed between the nanostructure layer 1110 and the substrate 110.

[0033] The main component of the nanostructure layer 1110 is aluminum oxide, and the main component of the intermediate layer 1111 is silicon dioxide. Furthermore, the nanostructure layer 1110 includes a plurality of ridge-like protrusions RLP extending in a non-directional manner and a plurality of metallic dopants MDA. As shown in Fig. 9, a bottom surface BPS of the ridge-like protrusions RLP is closer to the substrate 110 than a top surface TPS of the ridge-like protrusions RLP, and the ridge-like protrusions RLP gradually taper from the bottom surface BPS to the top surface TPS.

[0034] The main component of the metallic dopants MDA is titanium oxide, and at least a portion of the metallic dopants MDA is distributed within the ridge-like protrusions RLP, and at least another portion of the metallic dopants MDA is distributed on a surface of the ridge-like protrusions RLP. Furthermore, the at least portion of the metallic dopants MDA distributed within the ridge-like protrusions RLP gradually tapers in a direction away from the substrate 110.

[0035] The matte structures 112 and 113 are formed integrally with the substrate 110, and the matte structures 112 and 113 are located on one or more surfaces of the substrate 110 and are arranged outside an optically active region of the lens element 11. Furthermore, each of the matte structures 112 and 113 has a wave-like shape. In particular, as shown in Fig. 2 to Fig. 5, the matte structure 112 is formed on an object-side surface of the substrate 110, and the matte structure 112 has a plurality of protrusion portions 1120 that are regularly arranged. In addition, the protrusion portions 1120 are each triangular in shape, and the height of the protrusion portions 1120 is 75 µm. As shown in Fig. 2, Fig. 3, Fig. 6 and Fig. As shown in Figure 7, the matte structure 113 is located on an image-side surface of the substrate 110, and the matte structure 113 has a plurality of curved protrusion portions 1130 arranged regularly. In addition, the curved protrusion portions 1130 are arranged as concentric circles on the surface of the substrate 110, and the height of the curved protrusion portions 1130 is 50 µm.

[0036] As in Fig. As shown in Figure 8, an average structural height H1 of the ridge-like protrusions RLP is 266.2 nm.

[0037] As in Fig. As shown in Figure 8, the coverage thickness D1 of the metallic dopants MDA on the surface of the ridge-like protrusions RLP is 12.6 nm.

[0038] As in Fig. 9 and Fig. 10, the number of the intermediate layers 1111 is one and a thickness D2 of the intermediate layer 1111 is 92.85 nm. 2. Embodiment

[0039] Fig. 11 is a cross-sectional view of an imaging lens according to the second embodiment of the present disclosure, Fig. 12 is a cross-sectional view of an optical component of the Fig. 11 shown imaging lens, Fig. 13 is a perspective view of the Fig. 11 shown optical component of the imaging lens and Fig. Figure 14 is a schematic view of the stacking relationship between a nanostructure layer, three intermediate layers and a substrate of the optical component of the imaging lens shown in Fig. 11 is shown.

[0040] In this embodiment, an imaging lens 2 is provided. The imaging lens 2 is a telephoto imaging lens, and the imaging lens 2 includes a plurality of optical components and an image surface IMG. The optical components include a housing 20, a lens assembly 21, a holder 25, and a prism 27. Furthermore, the lens assembly 21, the holder 25, and the prism 27 are housed in the housing 20, and an optical axis of the imaging lens 2 passes through the optical components. After entering the housing 20, the light passes through the lens assembly 21 and the prism 27 and becomes imaging light, forming an image on the image surface IMG. Note that the components inside the housing 20 are not limited to the shape shown in the figures.

[0041] The prism 27 includes a substrate 270, an anti-reflection film 271, a matte structure 272, and at least one light-blocking layer 274. The substrate 270 has a light incident surface LS1, three reflection surfaces RS1, RS2, and RS3, and a light exit surface LS2. The reflection surfaces RS1, RS2, and RS3 are configured to reflect light. The anti-reflection film 271 is disposed on the light incident surface LS1 of the substrate 270. Note that in Fig. 12, the anti-reflection film 271 is shown separated from the substrate 270 for clarity only. However, the connection between the anti-reflection film 271 and the substrate 270 is not limited to the representation shown in the figure.

[0042] As in Fig. 14, the anti-reflection film 271 comprises a nanostructure layer 2710 and three intermediate layers 2711, 2712, and 2713, and the intermediate layers 2711, 2712, and 2713 are disposed between the nanostructure layer 2710 and the substrate 270.

[0043] The main component of the nanostructure layer 2710 is aluminum oxide, and the nanostructure layer 2710 includes a plurality of ridge-like protrusions extending in a non-directional manner and a plurality of metallic dopants. A bottom surface of the ridge-like protrusions is located closer to the substrate 270 than a top surface of the ridge-like protrusions, and the ridge-like protrusions gradually taper from the bottom surface to the top surface. The metallic dopants include at least one of titanium, vanadium, chromium, tantalum, zirconium, niobium, titanium oxide, vanadium oxide, chromium oxide, tantalum oxide, zirconium oxide, or niobium oxide, and at least a portion of the metallic dopants is distributed within the ridge-like protrusions.

[0044] The main component of the intermediate layer 2711 is silicon dioxide, the main component of the intermediate layer 2712 is aluminum oxide, and the main component of the intermediate layer 2713 is titanium oxide. Furthermore, the main components of the intermediate layer 2712 and the intermediate layer 2713 are the same as one of the components forming the nanostructure layer 2710.

[0045] The matte structure 272 is formed integrally with the substrate 270, and the matte structure 272 is located on the surface of the substrate 270 and is arranged outside an optically active region of the prism 27. Furthermore, the matte structure 272 has a wave-like shape. As shown in Fig. 12 and Fig. As shown in Figure 13, the matte structure 272 is disposed on the surface of the substrate 270 adjacent to the reflection surface RS2 and includes a plurality of curved protrusion portions 2720 arranged regularly. The curved protrusion portions 2720 extend along an S-shaped path on the surface of the substrate 270, and the height of the curved protrusion portions 2720 is 300 µm.

[0046] The light-blocking layer 274 is located on a bonding surface CS1 of the substrate 270 and is configured to block the transmission of light. Furthermore, the bonding surface CS1 is connected to the light incident surface LS1, the reflection surfaces RS1, RS2, and RS3, and the light exit surface LS2.

[0047] An average height of the ridge-like protrusions is greater than 108 nm and less than 368 nm.

[0048] As in Fig. As shown in Figure 14, the number of intermediate layers 2711, 2712, and 2713 is three. A thickness D21 of the intermediate layer 2711 is 12.6 nm, a thickness D22 of the intermediate layer 2712 is 37.2 nm, and a thickness D23 of the intermediate layer 2713 is 19.4 nm. 3. Embodiment

[0049] Fig. 15 is a cross-sectional view of an imaging lens according to the 3rd embodiment of the present disclosure, Fig. 16 is a cross-sectional view of an optical component of the Fig. 15 shown imaging lens, Fig. 17 is a perspective view of the optical component of the Fig. 15 shown imaging lens, Fig. 18 is a partially enlarged cross-sectional view of the optical component of the Fig. 15 shown imaging lens, Fig. 19 is a sectional view of the Fig. 17 shown optical component, Fig. 20 is a view of the top of the Fig. 17 shown optical component and Fig. 21 is an enlarged view of the Fig. 20 shown area EL21.

[0050] In this embodiment, an imaging lens 3 is provided. The imaging lens 3 is a telephoto imaging lens and includes a plurality of optical components and an image surface IMG. The optical components include a housing 30, a lens assembly 31, a holder 35, and a prism 37. Moreover, the lens assembly 31, the holder 35, and the prism 37 are housed in the housing 30, and an optical axis of the imaging lens 3 passes through the optical components. After entering the housing 30, the light passes through the lens assembly 31 and the prism 37 and becomes imaging light, forming an image on the image surface IMG. Note that the components within the housing 30 are not limited to the shapes shown in the figures.

[0051] The prism 37 includes a substrate 370, an anti-reflection film 371, a plurality of matte structures 372 and 373, and a light-blocking layer 374. The substrate 370 has a light incident surface LS1, three reflection surfaces RS1, RS2, and RS3, and a light exit surface LS2. The reflection surfaces RS1, RS2, and RS3 are configured to reflect light. In addition, the reflection surface RS2 can reflect light through a highly reflective coating or through total internal reflection principles. The anti-reflection film 371 is disposed on the light incident surface LS1, the reflection surface RS2, and the light exit surface LS2 of the substrate 370. Note that in Fig. 16, the anti-reflection film 371 is shown separated from the substrate 370 for clarity only. However, the connection between the anti-reflection film 371 and the substrate 370 is not limited to the representation shown in the figure.

[0052] As in Fig. 18, the anti-reflection film 371 includes a nanostructure layer 3710 and an intermediate layer 3711, and the intermediate layer 3711 is disposed between the nanostructure layer 3710 and the substrate 370.

[0053] The main component of the nanostructure layer 3710 is aluminum oxide, and the nanostructure layer 3710 includes a plurality of ridge-like protrusions RLP extending in a non-directional manner and a plurality of metallic dopants MDA. A bottom surface BPS of the ridge-like protrusions RLP is located closer to the substrate 370 than a top surface TPS of the ridge-like protrusions RLP, and the ridge-like protrusions RLP gradually taper from the bottom surface BPS to the top surface TPS.

[0054] The main component of the metallic dopants MDA is titanium oxide, and at least a portion of the metallic dopants MDA is distributed within the ridge-like protrusions RLP, and at least another portion of the metallic dopants MDA is distributed on a surface of the ridge-like protrusions RLP. Furthermore, the at least a portion of the metallic dopants MDA distributed within the ridge-like protrusions RLP gradually tapers in a direction away from the substrate 370.

[0055] The main component of the intermediate layer 3711 is aluminum, titanium, vanadium, chromium, oxides of the aforementioned elements, silicon dioxide, or combinations thereof, and the main component of the intermediate layer 3711 is the same as one of the components forming the nanostructure layer 3710.

[0056] The matte structures 372 and 373 are formed integrally with the substrate 370, and the matte structures 372 and 373 are located on one or some surfaces of the substrate 370 and are arranged outside an optically active region of the prism 37. In addition, the matte structures 372 and 373 each have a wave-like shape. In particular, as shown in Fig. 17 and Fig. 19 to Fig. As shown in FIG. 21, the matte structure 372 is disposed on the bonding surface CS1 of the substrate 370, and the matte structure 372 has a plurality of triangular protrusion portions 3720 regularly arranged. The height H2 of the triangular protrusion portions 3720 is 100 μm. Furthermore, the bonding surface CS1 is connected to the light incident surface LS1, the reflection surfaces RS1, RS2, and RS3, and the light exit surface LS2. Furthermore, the matte structure 373 is disposed on a recessed surface PS1 of the substrate 370, and the matte structure 373 has a plurality of curved protrusion portions 3730 regularly arranged. A height of the curved protrusion portions 3730 is 150 μm.

[0057] The light-blocking layer 374 is located on some surfaces of the substrate 370 and is configured to block the transmission of light. In particular, the light-blocking layer 374 is, as shown in Fig. 17, arranged on surfaces of the substrate 370 adjacent to the light incidence surface LS1, the reflection surface RS2 and the light exit surface LS2 and is located outside the optically active region of the prism 37. In addition, as shown in Fig. 18, a part of the anti-reflection film 371 is disposed on the light-blocking layer 374 so that a part of the light-blocking layer 374 is located between the anti-reflection film 371 and the substrate 370.

[0058] An average height of the ridge-like protrusions RLP is greater than 108 nm and less than 368 nm. A coverage thickness of the metallic dopants MDA on the surface of the ridge-like protrusions RLP is greater than 1 nm and less than 40 nm.

[0059] As in Fig. 18, the number of the intermediate layer 3711 is one. In addition, the prism 37, as shown in Fig. 17, Fig. 19 and Fig. 20, a plurality of gate tracks GT1 are provided at appropriate positions to achieve better forming efficiency for the prism 37. 4. Embodiment

[0060] Fig. 22 is a cross-sectional view of an imaging lens according to the 4th embodiment of the present disclosure, and Fig. 23 is a cross-sectional view of an optical component of the Fig. 22. In this embodiment, an imaging lens 4 is similar to the imaging lens 1 of the first embodiment, as described above. The same or similar reference numerals indicate the same or similar components, and the functions and effects provided by these components are the same as described above, so explanation thereof will not be repeated.

[0061] The imaging lens 4 is an ultra-wide-angle imaging lens, and the imaging lens 4 includes a plurality of optical components and an image surface IMG. The optical components include a housing 40, a plurality of lens elements 41 and 42, a light-blocking element 43, and a holder 45. Furthermore, the lens elements 41 and 42, the light-blocking element 43, and the holder 45 are housed in the housing 40, and an optical axis of the imaging lens 4 passes through the optical components. After entering the housing 40, the light passes through the lens elements 41 and 42 and the light-blocking element 43 and becomes imaging light, forming an image on the image surface IMG.

[0062] The lens element 41 includes a substrate 410 and an antireflection film 411. The substrate 410 has an aspherical surface AS1, and light passes through the aspherical surface AS1. The antireflection film 411 is disposed on the aspherical surface AS1. Note that in Fig. 23, the anti-reflection film 411 is shown separated from the substrate 410 for clarity only. However, the connection between the anti-reflection film 411 and the substrate 410 is not limited to the representation shown in the figure. Furthermore, the components inside the housing 40 are not limited to the shapes shown in the figures. 5. Embodiment

[0063] Fig. 24 is a cross-sectional view of an imaging lens according to the 5th embodiment of the present disclosure, and Fig. 25 is a cross-sectional view of an optical component of the Fig. 24 shown imaging lens.

[0064] In this embodiment, an imaging lens 5 is provided. The imaging lens 5 is a wide-angle imaging lens and includes a plurality of optical components and an image surface IMG. The optical components include a housing 50, a plurality of lens elements 51 and 52, a plurality of light-blocking elements 53, and a holder 55. Moreover, the lens elements 51 and 52, the light-blocking elements 53, and the holder 55 are housed in the housing 50, and an optical axis of the imaging lens 5 passes through the optical components. After entering the housing 50, the light passes through the lens elements 51 and 52 and the light-blocking elements 53 and becomes imaging light, forming an image on the image surface IMG.

[0065] The lens element 51 includes a substrate 510 and an anti-reflection film 511. The substrate 510 has an aspherical surface AS1, and light passes through the aspherical surface AS1. The anti-reflection film 511 is disposed on the aspherical surface AS1. Note that in Fig. 25, the anti-reflection film 511 is shown separated from the substrate 510 for clarity only. However, the connection between the anti-reflection film 511 and the substrate 510 is not limited to the representation shown in the figure. Furthermore, the components inside the housing 50 are not limited to the shapes shown in the figures. 6. Embodiment

[0066] Fig. 26 is a perspective view of an electronic device according to the 6th embodiment of the present disclosure, and Fig. 27 is another perspective view of the Fig. 26 shown electronic device.

[0067] In this embodiment, the electronic device 6 is a smartphone that includes a plurality of imaging lenses, a flash module 61, a focus assist module 62, an image signal processor 63, a display module (user interface) 64, an image software processor (not shown), and an image sensor (not shown).

[0068] These imaging lenses include an ultra-wide-angle imaging lens 60a, a high-pixel imaging lens 60b, a telephoto imaging lens 60c, and a telephoto imaging lens 60d. Furthermore, the imaging lens 60a includes, for example, the imaging lens 4 of the fourth embodiment described above; the imaging lens 60c includes, for example, the imaging lens 2 of the second embodiment or the imaging lens 3 of the third embodiment described above; and the imaging lens 60d includes, for example, the imaging lens 1 of the first embodiment described above. The image sensor is arranged on the image surface of the imaging lenses 60a, 60b, 60c, and 60d.

[0069] The image captured by the ultra-wide angle imaging lens 60a has a characteristic of multiple imaged objects. Fig. 28 is an image taken by the ultra-wide angle imaging lens 60a.

[0070] The image captured by the high-pixel density imaging lens 60b is characterized by high resolution and less distortion, and the high-pixel density imaging lens 60b can convert a part of the image into Fig. Record 28. Fig. Figure 29 is an image taken by the high pixel density imaging lens 60b.

[0071] The image captured by the telephoto imaging lens 60c or 60d is characterized by a high optical magnification, and the imaging lens 60c or 60d can convert part of the image into Fig. 29 capture. Fig. 30 is an image captured by the telephoto imaging lens 60c or 60d. Furthermore, the maximum field of view of the imaging lens corresponds to the field of view in Fig. 30.

[0072] When a user captures images of an object, the light beams converge in the ultra-wide-angle imaging lens 60a, the high-pixel-density imaging lens 60b, the telephoto imaging lens 60c, or the telephoto imaging lens 60d to create images, and the flash module 61 is activated for light supplementation. The focus assist module 62 detects the distance of the imaged object to achieve fast automatic focusing. The image signal processor 63 is configured to optimize the captured image to improve image quality and provide a zoom function. The light beam emitted by the focus assist module 62 can be either conventional infrared light or laser light.The display module 64 may include a touchscreen, and the user can interact with the display module 64 to adjust the viewing angle and switch between different imaging lenses. The image software processor has multiple functions for image acquisition and complete image processing. Alternatively, the user can capture images using a physical button. The image processed by the image software processor can be displayed on the display module 64. 7. Embodiment

[0073] Fig. 31 is a perspective view of an electronic device according to the 7th embodiment of the present disclosure.

[0074] In this embodiment, the electronic device 7 is a smartphone that includes an imaging lens 70, an imaging lens 70a, an imaging lens 70b, an imaging lens 70c, an imaging lens 70d, an imaging lens 70e, an imaging lens 70f, an imaging lens 70g, an imaging lens 70h, a flash module 71, an image signal processor, a display module, an image software processor (not shown), and an image sensor (not shown). The imaging lens 70, the imaging lens 70a, the imaging lens 70b, the imaging lens 70c, the imaging lens 70d, the imaging lens 70e, the imaging lens 70f, the imaging lens 70g, and the imaging lens 70h are arranged on the same side of the electronic device 7, while the display module is arranged on the opposite side of the electronic device 7.Furthermore, the imaging lens 70d includes, for example, the imaging lens 1 of the first embodiment as described above; the imaging lens 70c includes, for example, the imaging lens 2 of the second embodiment or the imaging lens 3 of the third embodiment as described above; the imaging lens 70 and the imaging lens 70g each include the imaging lens 4 of the fourth embodiment as described above; and the imaging lens 70e and the imaging lens 70f each include the imaging lens 5 of the fifth embodiment as described above. The image sensor is arranged on the image surface of the imaging lenses 70, 70a, 70b, 70c, 70d, 70e, 70f, 70g, and 70h.

[0075] The imaging lens 70 is an ultra-wide-angle imaging lens, the imaging lens 70a is a telephoto imaging lens, the imaging lens 70b is a telephoto imaging lens, the imaging lens 70c is a telephoto imaging lens, the imaging lens 70d is a telephoto imaging lens, the imaging lens 70e is a wide-angle imaging lens, the imaging lens 70f is a wide-angle imaging lens, the imaging lens 70g is an ultra-wide-angle imaging lens, and the imaging lens 70h is a ToF (Time of Flight) imaging lens.In this embodiment, imaging lens 70, imaging lens 70a, imaging lens 70b, imaging lens 70c, imaging lens 70d, imaging lens 70e, imaging lens 70f, and imaging lens 70g have different fields of view, so that electronic device 7 can have different magnification ratios to meet the requirements of optical zoom functionality. Furthermore, imaging lens 70a and imaging lens 70b are each a telephoto imaging lens with a light folding element configuration. Additionally, imaging lens 70h can determine depth information of the imaged object. In this embodiment, the electronic device 7 includes a plurality of imaging lenses 70, 70a, 70b, 70c, 70d, 70e, 70f, 70g, and 70h, but the present disclosure is not limited to the number and arrangement of the imaging lenses.When a user captures images of an object, the light rays converge in the imaging lens 70, the imaging lens 70a, the imaging lens 70b, the imaging lens 70c, the imaging lens 70d, the imaging lens 70e, the imaging lens 70f, the imaging lens 70g, or the imaging lens 70h to form an image(s), and the flash module 71 is activated to amplify the light. Furthermore, the subsequent processes are performed in a similar manner to the above-mentioned embodiments, so the details thereof will not be repeated. 8. Embodiment

[0076] Fig. 32 is a perspective view of an electronic device according to the 8th embodiment of the present disclosure, Fig. 33 is a side view of the Fig. 32 shown electronic device and Fig. 34 is a view of the top of the Fig. 32 shown electronic device.

[0077] In this embodiment, the electronic device 8 is an automobile. The electronic device 8 includes a plurality of automotive imaging lenses 80, and the imaging lenses 80 each include the imaging lens of the present disclosure. The imaging lenses 80 can serve, for example, as in-car panoramic view cameras, dashboard cameras, and vehicle rearview cameras.

[0078] As in Fig. For example, as shown in Figure 32, the imaging lenses 80 are arranged around the automobile to capture peripheral images of the automobile, which is advantageous for obtaining external traffic information to achieve an autopilot function. Furthermore, the image software processor can stitch the peripheral images into a panoramic image so that the driver can check every corner around the automobile, facilitating parking and driving.

[0079] As in Fig. As shown in Figure 33, the imaging lenses 80 are arranged, for example, at the lower portion of the side mirrors. A maximum field of view of the imaging lenses 80 can be 40 degrees to 90 degrees to capture images in areas in the left and right lanes.

[0080] As in Fig. 34, the imaging lenses 80 may also be arranged on the lower part of the side mirrors and inside the front and rear windshields, respectively, to provide external information to the driver and also to provide more viewing angles to reduce blind spots and thereby improve driving safety.

[0081] The smartphones, panoramic car cameras, dashboard cameras, and vehicle rearview cameras in the embodiments are only examples of the optical component and imaging lens of the present disclosure installed in an electronic device, and the present disclosure is not limited thereto. The optical component and imaging lens can optionally be applied to optical systems with a moving focus. Furthermore, the imaging lens features good aberration correction capability and high image quality and can be applied to 3D image sensing (three-dimensional image sensing) applications in products such as digital cameras, mobile devices, digital tablets, smart TVs, network monitoring devices, multi-camera devices, image recognition systems, motion-sensitive input devices, wearable devices, and other electronic imaging devices.

[0082] The foregoing description has been described with reference to specific embodiments for the purpose of illustration. It should be noted that the present disclosure shows different data of the various embodiments; however, the data of the various embodiments are obtained from experiments. The embodiments were chosen and described in order to best explain the principles of the disclosure and their practical applications, to enable others skilled in the art to best utilize the disclosure and various embodiments with various modifications as are suited to their particular use. The above-illustrated embodiments and the accompanying drawings are exemplary and not intended to be exhaustive or to limit the scope of the present disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teachings.

Claims

[1] Optical component (11) comprising: a substrate (110) having an aspherical surface (AS1, AS2), wherein light passes through the aspherical surface (AS1, AS2); and an anti-reflection film (111) disposed at least on the aspherical surface (AS1, AS2), the anti-reflection film (111) comprising: a nanostructure layer (1110) comprising a plurality of ridge-like protrusions (RLP) extending in an undirected manner, wherein a bottom surface (BPS) of the plurality of ridge-like protrusions (RLP) is arranged closer to the substrate (110) than a top surface (TPS) of the plurality of ridge-like protrusions (RLP), wherein the plurality of ridge-like protrusions (RLP) gradually taper from the bottom surface (BPS) to the top surface (TPS), and an average structural height (H1) of the plurality of ridge-like protrusions (RLP) is greater than 108 nm and less than 368 nm; and at least one intermediate layer (1111) arranged between the nanostructure layer (1110) and the substrate (110); wherein a main component of the nanostructure layer (1110) is aluminum oxide, the nanostructure layer (1110) further comprises a metallic dopant (MDA), at least a portion of the metallic dopant (MDA DA) is distributed within the plurality of ridge-like protrusions (RLP), and the metallic dopant (MDA) comprises at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide. [2] The optical component (11) according to claim 1, wherein a main component of the at least one intermediate layer (1111) is silicon dioxide. [3] The optical component (11) according to claim 1, wherein a main component of the at least one intermediate layer (1111) is the same as one of the components constituting the nanostructure layer (1110). [4] The optical component (11) of claim 1, wherein the at least a portion of the metallic dopant (MDA) distributed within the plurality of ridge-like protrusions (RLP) gradually tapers in a direction away from the substrate (110). [5] The optical component (11) according to claim 1, wherein at least another portion of the metallic dopant (MDA) is distributed on a surface of the plurality of ridge-like projections (RLP). [6] The optical component (11) according to claim 5, wherein a coverage thickness (D1) of the metallic dopant (MDA) on the surface of the plurality of ridge-like protrusions (RLP) is greater than 1 nm and less than 40 nm. [7] The optical component (11) according to claim 6, wherein the coverage thickness (D1) of the metallic dopant (MDA) on the surface of the plurality of ridge-like protrusions (RLP) is greater than 1 nm and less than 30 nm. [8] The optical component (11) according to claim 1, wherein a main component of the metallic dopant (MDA) is titanium oxide. [9] The optical component (11) according to claim 1, further comprising a mat structure (112, 113), wherein the mat structure (112, 113) is formed integrally with the substrate (110), and the mat structure (112, 113) is located on one or some surfaces of the substrate (110) and has a wave-like shape. [10] The optical component (11) according to claim 9, wherein the matte structure (112, 113) has a plurality of protrusion portions (1120, 1130), and the plurality of protrusion portions (1120, 1130) are regularly arranged. [11] The optical component (11) according to claim 10, wherein a height of the plurality of protrusion portions (1120, 1130) is greater than 40 µm and less than 1000 µm. [12] Optical component (11) comprising: a substrate (110) having a reflection surface (RS1), the reflection surface (RS1) being configured to reflect light; and an anti-reflection film (111) disposed on at least one or some surfaces of the substrate (110), the anti-reflection film (111) comprising: a nanostructure layer (1110) comprising a plurality of ridge-like protrusions (RLP) extending in an undirected manner, wherein a bottom surface (BPS) of the plurality of ridge-like protrusions (RLP) is arranged closer to the substrate (110) than a top surface (TPS) of the plurality of ridge-like protrusions, wherein the plurality of ridge-like protrusions (RLP) gradually taper from the bottom surface (BPS) to the top surface (TPS), and an average structural height (H1) of the plurality of ridge-like protrusions (RLP) is greater than 108 nm and less than 368 nm; and at least one intermediate layer (1111) arranged between the nanostructure layer (1110) and the substrate (110); wherein a main component of the nanostructure layer (1110) is aluminum oxide, the nanostructure layer (1110) further comprises a metallic dopant (MDA), at least a portion of the metallic dopant (MDA) MDA) is distributed within the plurality of ridge-like protrusions (RLP), and the metallic dopant (MDA) comprises at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide. [13] Optical component (11) according to claim 12, wherein a main component of the at least one intermediate layer (1111) is silicon dioxide. [14] The optical component (27) of claim 12, wherein a main component of the at least one intermediate layer (2712, 2713) is the same as one of the components forming the nanostructure layer (2710). [15] The optical component (27) of claim 12, further comprising a light-blocking layer (274), wherein the light-blocking layer (274) is disposed on one or some surfaces of the substrate (270) and configured to block the transmission of light. [16] The optical component (37) according to claim 15, wherein the anti-reflection film (371) is further disposed on the light-blocking layer (374). [17] The optical component (11) of claim 12, wherein the at least a portion of the metallic dopant (MDA) distributed within the plurality of ridge-like protrusions (RLP) gradually tapers in a direction away from the substrate (110). [18] The optical component (11) according to claim 12, wherein at least another portion of the metallic dopant (MDA) is distributed on a surface of the plurality of ridge-like projections (RLP). [19] The optical component (11) according to claim 18, wherein a coverage thickness (D1) of the metallic dopant (MDA) on the surface of the plurality of ridge-like protrusions (RLP) is greater than 1 nm and less than 40 nm. [20] The optical component (11) according to claim 19, wherein the coverage thickness (D1) of the metallic dopant (MDA) on the surface of the plurality of ridge-like protrusions (RLP) is greater than 1 nm and less than 30 nm. [21] The optical component (11) according to claim 12, wherein a main component of the metallic dopant (MDA) is titanium oxide. [22] The optical component (11) according to claim 12, further comprising a mat structure (112, 113), wherein the mat structure (112, 113) is formed integrally with the substrate (110), and the mat structure (112, 113) is located on one or some surfaces of the substrate (110) and has a wave-like shape. [23] The optical component (11) according to claim 22, wherein the matte structure (112, 113) has a plurality of protrusion portions (1120, 1130), and the plurality of protrusion portions (1120, 1130) are regularly arranged. [24] The optical component (11) according to claim 23, wherein a height of the plurality of protrusion portions (1120, 1130) is greater than 40 µm and less than 1000 µm. [25] Imaging lens (1), comprising: the optical component (11) according to claim 1; wherein an optical axis of the imaging lens (1) runs through the optical component (11). [26] Electronic device (6) comprising: the imaging lens (1) according to claim 25; and an image sensor arranged on an image surface (IMG) of the imaging lens (1). [27] Imaging lens (1), comprising: the optical component (11) according to claim 12; wherein an optical axis of the imaging lens (1) runs through the optical component (11). [28] Electronic device (6), comprising: the imaging lens (1) according to claim 27; and an image sensor arranged on an image surface (IMG) of the imaging lens (1).

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