Wiring structure and heat storage system

Abstract

A wiring structure, characterized in that the wiring structure comprises a wiring body (10), a housing (20), a cover plate (30), a sealing layer (40), and an insulating filling layer (50), wherein the housing (20) is provided with a receiving space and has two ends arranged opposite each other along a first direction (X), wherein two ends of the housing (20) are provided with openings, wherein the cover plate (30) is connected to the opening, wherein the sealing layer (40) is attached between the cover plate (30) and the opening and is provided for sealing the receiving space; wherein the wiring body (10) is arranged in a penetrating manner in the housing (20), wherein the insulating filling layer (50) is filled into the receiving space and is located between the housing (20) and the wiring body (10).

Description

TECHNICAL AREA

[0001] The present application belongs to the field of electrical connection technology and specifically relates to a wiring structure and a heat storage system. STATE OF THE ART

[0002] Due to its advantages such as high conductivity, high temperature resistance, excellent chemical stability and mechanical strength, the wiring structure in the heat storage system can achieve stable current transmission in environments with extreme temperatures, thus ensuring the overall efficiency of the heat storage system and reducing energy loss.

[0003] However, the wiring structure in relevant technology has a relatively complex design, which not only makes the assembly and maintenance process cumbersome, but also brings with it the problem of poor sealing. CONTENTS OF THE PRESENT USE SAMPLE

[0004] The aim of the present application is to provide a wiring structure and a heat storage system to solve the problems of cumbersome assembly and maintenance as well as the poor sealing effect of the existing wiring structure.

[0005] To solve the aforementioned technical problems, the present application is implemented as follows: In a first aspect, the present application discloses a wiring structure, wherein the wiring structure comprises a wiring body, a housing, a cover plate, a sealing layer and an insulating filler layer; wherein the housing is provided with a receiving space and has two ends arranged oppositely along a first direction, wherein two ends of the housing are provided with openings, wherein the cover plate is connected to the opening, wherein the sealing layer is placed between the cover plate and the opening and is provided or arranged to seal the receiving space; The wiring body is arranged to extend through the housing, and the insulating filler layer is filled into the receiving space and is located between the housing and the wiring body.

[0006] Optionally, the sealing layer can be a heat-resistant sealant adhesive layer.

[0007] Optionally, the cover plate is provided with a through-hole, whereby the wiring body runs through the through-hole and is in press fit with the through-hole.

[0008] Optionally, the cover plate is provided to comprise a main body section and an extension section, wherein the main body section is connected to the opening, and the extension section extends from the main body section along a first direction and into the receiving space.

[0009] Optionally, the extension section is provided with a first snap-in section and the housing with a second snap-in section, whereby when the cover plate is connected to the housing, the first snap-in section is clamped to the second snap-in section.

[0010] Optionally, the cross-section of the wiring body can be rectangular along the second direction, with the second direction intersecting the first. Alternatively, the wiring body can be configured as a solid structure with a rectangular cross-section.

[0011] Optionally, the wiring body can be a high-temperature resistant wiring rail made of stainless steel.

[0012] Optionally, the insulating filler layer can be an aluminum-silicon filler layer.

[0013] Optionally, the housing can be made of ceramic.

[0014] Optionally, the housing can be a cylindrical structure. Optionally, a wiring groove can be provided at one end of the wiring body, and this groove can be used for a press fit with the heating wire.

[0015] In a second aspect, the present application further discloses a heat storage system comprising a heating wire and a wiring structure according to one of the claims, wherein the wiring body is provided with a wiring groove, wherein the heating wire is at least partially connected in the wiring groove, and wherein the heating wire can be fitted or is fitted into the notch of the wiring groove by press fit.

[0016] In the embodiments of the present application, the housing is provided with a receiving chamber for receiving the wiring body, wherein the housing can offer a certain degree of protection for the wiring body, the insulating filler layer filled between the wiring body and the inner wall of the housing insulating the wiring body and thereby preventing electrical faults such as short circuits and leakages; the cover plate is connectable to, or already connected to, the opening of the housing. Since a sealing layer is provided between the cover plate and the opening, the sealing layer can seal the receiving chamber, thereby improving the sealing performance in the receiving chamber and effectively preventing the escape of high-temperature gas into the receiving chamber.The wiring structure in the embodiments of the present application not only has a simple structure, but also exhibits good sealing properties as well as high safety and reliability.

[0017] Additional aspects and advantages of the present application are partly set out in the following description, and some will be evident from the following description or can be learned through practical application of the present application. BRIEF DESCRIPTION OF THE DRAWING

[0018] The above-mentioned and / or additional aspects and advantages of this application will be made clear and easily understandable by means of the description of the exemplary embodiments in conjunction with the following drawings. Fig. Figure 1 is a schematic structural representation of a wiring structure in an embodiment of the present application; Fig. Figure 2 is a first schematic structural representation of a cover plate in an embodiment of the present application; Fig. Figure 3 is a second schematic structural representation of a cover plate in an embodiment of the present application; Fig. Figure 4 is a schematic structural representation of a wiring structure in another embodiment of the present application; Fig. Figure 5 is an enlarged schematic representation of location A in Fig. 4.

[0019] Reference symbols: 10- wiring body, 101-wiring groove, 102-wiring opening, 20-housing, 201-second snap-in section, 30-cover plate, 301-through hole, 31-main body section, 32-extension section, 321-first snap-in section, 40-sealing layer, 50-insulating filler layer, X-first direction, Y-second direction. DETAILED DESCRIPTION

[0020] The embodiments of this application are described in detail below, with the examples being illustrated in the drawings and identical or similar reference numerals denoting identical or similar elements or elements with identical or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and serve only to illustrate this application; they are not to be understood as limiting this application. All other embodiments that a person skilled in the art in this field obtains from the embodiments of this application without creative effort fall within the scope of protection of this application.

[0021] The terms “first” and “second” in the description and claims of this application may expressly or implicitly include one or more features. In the description of this application, “several” means two or more unless otherwise specified. Furthermore, “and / or” in the description and claims denotes at least one of the combined objects, while the sign “ / ” generally indicates an “or” relationship between the preceding and subsequent combined objects.

[0022] In the description of this application, it should be noted that the terms "middle", "longitudinal", "transverse", "length", "width", "thickness", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. refer to the directions or positions shown in the accompanying drawings and serve only to simplify the description of this application and are not to be understood as an indication or suggestion that the designated devices or elements have a particular orientation or must be designed and operated in a particular orientation, and are therefore not to be understood as a limitation of this application.

[0023] In the description of this application, it should be noted that the terms "installed," "connected," and "linked" are to be understood in the broadest sense, unless expressly stated otherwise and limited. For example, they may refer to a fixed connection, a detachable connection, or an integrated connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection via an intermediate medium; or a connection between two elements. For a person skilled in the art, the specific meaning of the above terms in this application is understandable from the specific circumstances.

[0024] In an era where concepts like efficient energy use, environmental protection, and energy conservation are gaining popularity, thermal storage systems, as technical devices for the efficient storage and release of thermal energy, offer a wide range of applications in many sectors, such as industrial waste heat recovery, solar thermal energy use, and building heating. Thermal storage systems store heat when there is a surplus of energy and release it during peak energy demand, thereby achieving a temporal transfer and efficient use of energy, balancing energy supply and demand, reducing energy consumption peaks, and improving the overall stability and economic efficiency of the energy system.The electric high-temperature solid-state thermal energy storage system is a technical system that uses electrical energy to heat solid materials to high temperatures, store thermal energy, and then release it as needed. The system converts electrical energy into thermal energy via an electric heating element and stores it in a high-temperature-resistant solid thermal storage medium, thus enabling temporal and spatial energy transfer. This offers the advantages of high efficiency, environmental protection, and flexibility, and provides broad application possibilities in industrial heating, building heating, peak load management, and other areas.

[0025] During the operation of the high-temperature solid-state electric thermal energy storage system, the wiring structure is a key component that connects the thermal energy storage system to the external circuit and enables power transmission and control, the performance of which is directly related to the safety, reliability, and operational efficiency of the thermal energy storage system. Due to its advantages such as high conductivity, high-temperature resistance, excellent chemical stability, and mechanical strength, the wiring structure in the high-temperature solid-state electric thermal energy storage system can achieve stable power transmission in extreme temperature environments, thus ensuring the overall efficiency of the thermal energy storage system and reducing energy loss.However, the wiring structure in relevant technologies has a relatively complex design, which not only makes assembly and maintenance cumbersome but also leads to the problem of poor sealing. Specifically, the wiring structure of existing thermal storage systems is often complex and typically composed of several components using sophisticated connection methods. These components include conductive rails, insulating sleeves, mounting brackets, wiring connectors, and the like, requiring precise fitting and installation, and placing extremely high demands on the production process and assembly accuracy. This complex structure not only increases the production costs and manufacturing effort of the wiring structure but also requires significant personnel and time during installation, maintenance, and overhaul processes.For example, when assembling a wiring structure, professional technicians must follow strict assembly steps, individually assembling and debugging each component. Deviations at any stage can cause the wiring structure to malfunction. Furthermore, if a wiring structure fails, its complex design makes it difficult for maintenance personnel to quickly and accurately locate the fault, and investigation and repair are time-consuming, seriously impacting the normal operation of the thermal storage system. Additionally, the insulation performance of the current thermal storage system's wiring structure is generally inadequate.The thermal storage system typically operates in harsh environments with high temperatures and humidity, which exposes the wiring structure to various factors such as thermal radiation and water vapor erosion. This leads to aging of the insulating material and a deterioration of its insulating performance. Simultaneously, the complex wiring structure creates numerous connection points between components, and these connections tend to form weak insulation joints. Over time, these joints are susceptible to insulation breakdowns, leaks, and other faults. An insulation failure not only renders the thermal storage system inoperable but can also lead to safety hazards such as electrical fires and electric shocks, endangering life and property.

[0026] For the reasons stated above, embodiments of the present application provide a wiring structure that can be used in an electrical high-temperature heat storage system, wherein the wiring structure is simpler and has good sealing performance, and the insulation performance and reliability are improved, thereby ensuring the normal operation of the heat storage system.

[0027] The wiring structure in the embodiments of the present application is described in more detail below, together with the accompanying drawings and specific implementation methods. In the embodiments of the present application, the first direction is indicated by the arrow X in Fig. The first direction is specified, which can specifically be the longitudinal direction of the wiring structure, while the second direction is that indicated by the arrow Y in Fig. The first direction is given, and the second direction Y intersects the first direction X.

[0028] As in Fig. As shown in Figure 1, the wiring structure in an embodiment of the present application can in particular comprise a wiring body 10, a housing 20, a cover plate 30, a sealing layer 40 and an insulating filler layer 50; wherein the housing 20 is provided with a receiving space and has two ends arranged oppositely along a first direction X, wherein two ends of the housing 20 are provided with openings, wherein the cover plate 30 is connected to the opening, wherein the sealing layer 40 is placed between the cover plate 30 and the opening and is used to seal the receiving space; wherein the wiring body 10 is arranged extending through the housing 20, wherein the insulating filler layer 50 is filled into the receiving space and is located between the inner wall of the housing 20 and the wiring body 10.

[0029] The two ends of the wiring body 10 are exposed outside the housing 20 and are used for connection to the power source and the heating wire, respectively. When one end of the wiring body 10 is connected to a power source, the heating wire can be energized, allowing it to convert and store electrical energy as heat energy. It should be noted that when selecting the material for the wiring body 10, the conductor performance should first be ensured, and a material with low resistance should be chosen to minimize heat generation. Secondly, since the wiring body 10 operates in a high-temperature environment with high corrosion resistance, it should possess a certain degree of corrosion resistance to withstand the complex chemical environment of the high-temperature electrical heat storage system.For example, the wiring body 10 can be made of copper, copper alloy, stainless steel, and other materials, and those skilled in the art can flexibly choose according to actual requirements, and the material of the wiring body 10 is not particularly restricted in the present application. Specifically, the connection between the wiring body 10 and the cable can be made by clamping, welding, screwing, or the like, and in actual applications, the connection can be flexibly selected according to the specifications of the external circuit cable and the structure of the wiring body. For example, in one embodiment of the present application, the wiring body 10 is attached to the cable by bolts. As in . Fig. As shown in Figure 1, a wiring opening 102 is provided at one end of the wiring body 10, and the wiring opening 102 is used for passing cables and fasteners through it. In practical applications, the cable can be passed through the wiring opening 102 and secured with a fastener to establish a reliable electrical connection between the wiring body 10 and the cable. The distance between the wiring opening 102 and the edge of the wiring body 10 is 15 to 35 mm, ensuring that the requirements for connection strength and electrical safety are met and a reliable connection between the wiring body 10 and the cable is guaranteed.It is understandable that microcracks can form at the edge of the wiring body 10 due to the effects of the manufacturing process, and that stress concentrations can occur in the wiring opening 102 due to the need to establish a connection with the cable. These stress concentrations intensify crack propagation, and in severe cases, the cracks propagate to the wiring opening, impairing the reliability of the connection between the cable and the wiring body 10. By appropriately designing the distance between the wiring opening 102 and the edge of the wiring body 10, the risk of cracking in the wiring opening 102 can be reduced, and the connection between the cable and the wiring body 10 can be ensured, thereby guaranteeing the reliability of the power supply to the thermal storage system.

[0030] The other end of the wiring body 10 is used for connection to the heating wire, and the heating wire and the wiring body 10 can be joined by welding or clamping. The clamping connection method is more convenient for assembly and allows for easy disassembly for maintenance, but care should be taken to ensure the quality of the clamp connection to avoid the problem of an incorrect connection. The welding connection method can allow for lower contact resistance, better vibration resistance, and a more reliable connection. However, with this connection method, the heating wire and the wiring body cannot be disassembled, which is inconvenient for subsequent maintenance and repair. Furthermore, the wiring body 10 can also be provided with a wiring groove 101 to increase the contact area with the heating wire, although this is not specifically limited in the present application.

[0031] The housing 20 is an insulating enclosure located on the outer circumference of the wiring body 10. This provides electrical and structural protection for the wiring body 10 and prevents it from corroding in challenging environments such as high temperatures, high humidity, and corrosive conditions. The cross-section of the housing 20 can be any shape, for example, circular, rectangular, or triangular. Preferably, the cross-section of the housing 20 is circular, meaning the housing 20 is a completely cylindrical structure with a hollow interior for the wiring body 10. Furthermore, the housing 20 is provided with an internal receiving space, which can be used to hold insulating material, thermal insulation, or the like.For example, in one embodiment of the present application, the receiving space is filled with an insulating filler layer 50, and the provision of the insulating filler layer 50 further improves the insulation performance of the wiring structure. The outer wall of the housing 20 is in direct contact with the thermal barrier layer of the heat storage system, thereby insulating and protecting the wiring body 10 and ensuring its electrical safety. In practical applications, the material of the housing 20 must meet requirements for high temperature resistance, insulation, sealing, mechanical strength, explosion protection, and the like. Specifically, the housing 20 can be made of a high-temperature resistant material such as stainless steel (e.g., 304, 316, 310s, 347H), a ceramic (e.g., oxides, nitrides, carbides, or the like), or a composite material (e.g.,The housing 20 is manufactured from glass fiber reinforced resin to withstand high-temperature environments. In the structural design of the housing 20, the outer surface should be as smooth as possible to reduce heat concentration in local areas, improve the temperature uniformity of the housing 20, and reduce the formation of stress concentrations, thereby ensuring its structural strength.

[0032] An insulating filler layer 50 is also arranged in the housing 20 and around the wiring body 10. It is important to note that when providing the insulating filler layer 50 between the housing 20 and the wiring body 10, it must be ensured that the housing 20 and the wiring body 10 are completely separated by the insulating filler layer 50. This ensures that the insulating filler layer 50 can perform an additional insulating function on the wiring body 10, thereby ensuring the insulation performance and electrical safety of the wiring body 10.The insulating filler layer 50 and the insulating housing 20 work together to form a double protective barrier for the wiring body 10, thereby blocking current leakage and ensuring that the wiring body 10 maintains stable dielectric properties under high-temperature conditions, thus guaranteeing safe and reliable operation of the heat storage system. The insulating filler layer 50 effectively insulates the wiring body 10 from the housing 20, improving the safety of the heat storage system. Furthermore, the insulating filler layer 50 reduces the heat transfer rate and protects the wiring body 10 within the housing 20 from adverse effects of high temperatures.The insulating filler layer 50 can be detachably connected between the housing 20 and the wiring body 10 to facilitate assembly, maintenance, and replacement. For material selection, an inorganic insulating material such as aluminum oxide ceramic fiber, mica tape / mica sheet, or glass fiber reinforced resin, or an organic insulating material such as polyimide (PI), silicone rubber, fluoropolymer (such as PTFE), or a composite insulating material such as nanocomposites and aerogel composites can be chosen. It should be noted that the aforementioned insulating materials all exhibit high chemical stability and high-temperature resistance, enabling their use in the high-temperature electrical thermal storage system and ensuring reliability and safety under long-term operating conditions. Preferably, the insulating filler layer 50 is an aluminum-silicon filler layer.

[0033] Two cover plates 30 are provided, namely an upper cover plate 30 and a lower cover plate 30. The upper cover plate 30 and the lower cover plate 30 are used as locking elements and are each connected to the openings at the upper and lower ends of the receiving space. The arrangement of the cover plate 30 and the sealing layer 40 can prevent the insulating filler layer 50 from escaping and simultaneously prevent heat from flowing through the wiring structure in the heat storage system, thereby ensuring the heat storage performance of the heat storage system. The sealing layer 40 can be made of rubber, foam, or sealant, without any particular restriction in the present application. Furthermore, the cover plate 30 can be configured as a layered structure and comprise a main body layer, an insulating layer, a heat dissipation layer, and the like.Specifically, the main body layer can be made of high-temperature resistant metal (such as 316L stainless steel) or composite material (such as ceramic fiber-reinforced resin) with a thickness of ≥3 mm to ensure mechanical strength. The surface of the main body layer can be coated with a nanoceramic insulating coating (50–100 µm thick) to increase the dielectric strength to over 10 kV. On the side facing away from the sealing layer 40, the cover plate 30 can additionally be provided with a heat dissipation fin to increase the heat dissipation area, and the cover plate 30 can interact with the housing 20 and the insulating filler layer 50 to improve the insulation performance of the wiring structure.

[0034] It should be noted that in high-temperature electrical thermal storage systems, the wiring structure must ensure a tight seal to prevent electrical failures, avoid media leaks, and improve system efficiency. These systems typically operate in complex environments.If the wiring structure is not sealed, the wiring body 10 within the housing 20 will easily corrode due to moisture, dust, or similar substances, leading to reduced insulation performance and causing short circuits, leaks, and other faults. Furthermore, poor sealing of the housing 20 can lead to oxidation corrosion of the internal metal parts, impairing electrical conductivity and even causing equipment damage. Since the electrical thermal storage system may also involve high-temperature liquids or gases, sealing the wiring structure prevents the medium from penetrating the electrical components and causing short circuits or equipment damage. Ensuring the sealing performance of the wiring structure also prevents heat loss in the electrical thermal storage system, thus improving the system's thermal efficiency.

[0035] In one embodiment of the present application, a sealing layer 40 is also provided between the cover plate 30 and the opening, wherein a sealing surface can be formed by the direct contact of the sealing layer 40 with the opposite surface of the opening, and the sealing performance of the interior of the housing 20 is ensured by the contact pressure between the cover plate 30 and the housing 20.Optionally, the sealing layer 40 can be sealed with an insert, for example, a washer made of rubber, metal, or composite material, which is compressed and deformed by the preload force of the screw to fill the gap; an O-ring seal can also be used, for example, a rubber ring with a circular cross-section, wherein a groove is formed on the end face of the housing opening, and the rubber ring is filled into the groove by compression deformation; preferably, the sealing layer 40 consists of a sheet-like sealant, that is, the sealing layer 40 is formed into an elastic sealing layer by curing the liquid sealant, and this method is suitable for a precisely fitting surface and has a better sealing effect.

[0036] In one embodiment of the present application, the housing 20 is provided with a receiving chamber for receiving the wiring body 10, and the housing 20 can provide a certain degree of protection for the wiring body 10, wherein the insulating filler layer 50, which is filled between the wiring body 10 and the inner wall of the housing 20, insulates the wiring body 10 and thereby prevents electrical faults such as short circuits and leakages; the cover plate 30 is connected to the opening of the housing 20. Since a sealing layer 40 is provided between the cover plate 30 and the opening, the sealing layer 40 can seal the receiving chamber, thereby improving the sealing performance in the receiving chamber and effectively preventing the escape of high-temperature gas in the receiving chamber.The wiring structure in the embodiments of the present application not only has a simple structure, but also exhibits good sealing properties as well as high safety and reliability.

[0037] In some optional embodiments, the sealing layer 40 is a heat-resistant sealant adhesive layer.

[0038] Since the heat storage system operates in a high-temperature environment, it is understandable that the wiring structure is also affected by thermal radiation. If the sealing layer 40 is exposed to high temperatures for an extended period, its material can age and impair the reliability of the wiring structure; therefore, the selection of the sealing layer 40 is of great importance for the stable operation of the wiring structure and even the heat storage system. In one embodiment of the present application, the sealing layer 40 consists of a heat-resistant sealant.On the one hand, the sealing layer 40, with its heat-resistant performance, can maintain stable sealing performance in high-temperature environments over extended periods, thus preventing conventional sealing materials such as rubber and silicone from charring, cracking, or failing at high temperatures. Since corrosive media are frequently used in heat storage systems, the heat-resistant sealant also exhibits high chemical stability, thereby reducing the risk of corrosion. In practical applications, the sealing layer 40 can be formed by curing a liquid heat-resistant sealant. The heat-resistant sealant can accelerate the movement of the sealant molecules through heating, promoting the curing reaction and thus accelerating the curing process and improving assembly efficiency.Furthermore, the amount of hardening agent in the sealant adhesive can be increased accordingly to increase the curing speed.

[0039] Optionally, a through-hole 301 is provided on the cover plate 30, and the wiring body 10 runs through the through-hole 301 and is in press fit with the through-hole 301.

[0040] As in the Fig. 2 and Fig. As shown in Figure 3, the through-hole 301 penetrates the cover plate 30 along the vertical direction of the cover plate 30, and the shape of the through-hole 301 corresponds to the cross-sectional shape of the wiring body 10, and the size of the through-hole 301 is smaller than the cross-sectional size of the wiring body 10.In this way, the wiring body 10 can be guided through the through-hole 301 by press fit, thereby eliminating the gap between the outer circumference of the wiring body 10 and the inner wall of the through-hole 301. This prevents the gap between the wiring body 10 and the through-hole 301 from impairing the sealing performance of the wiring structure. This not only effectively prevents dust, moisture, and corrosive media from penetrating the interior of the device along the gap between the wiring body 10 and the cover plate 30, but also effectively prevents heat from the heat storage system from escaping through the gap, which would lead to a reduction in heat storage performance.Furthermore, the press fit forms a mechanical lock between the wiring body 10 and the through-hole 301 of the cover plate 30, effectively preventing axial or radial displacement of the wiring body 10 due to vibrations or external forces and significantly improving the overall structure's stability. This also simplifies the assembly process, as no additional fasteners (such as screws and nuts) are required. The wiring body 10 and the cover plate 30 can be assembled simply by pressing the wiring body 10 into the through-hole 301, saving assembly time and contributing to production cost savings.The physical fastening method of press fit avoids the problem of increased contact resistance due to aging and loosening of the colloid and ensures the reliability of the current transmission path, thereby reducing the risk of fire due to overheating, reducing the number of additional components for conductor fixing and reducing the volume of the wiring structure, making it suitable for space-constrained heat storage systems.

[0041] Furthermore, this press-fit structure can be easily disassembled, allowing the wiring body 10 and the cover plate 30 to be quickly separated using a special tool (such as a press-fit / disassembly tool) during maintenance of the wiring structure. In this way, the wiring body 10 can be removed from the cover plate 30 without damage, which not only improves maintenance efficiency but also reduces maintenance costs. To further ensure the sealing of the wiring structure in practical applications, a sealant can be applied around the through-hole 301 after the cover plate 30 and the wiring body 10 have been press-fitted, filling any gap that may exist between the wall of the through-hole 301 and the wiring body 10 with the sealant.In the case where the perforation wall of the through-hole 301 is in close contact with the wiring body 10, the sealing adhesive structure can be omitted, thus simplifying the assembly process. For example, in some embodiments of the present application, the cross-section of the wiring body 10 is rectangular. Accordingly, as in . Fig. Figure 3 shows the through-hole 301 in the cover plate 30 as a rectangular hole adapted to the wiring body 10, the length and width of which are both smaller than the length and width of the wiring body 10. This ensures that the four edges of the wiring body 10 are in a press fit circumferentially with the inner wall of the through-hole 301 on the cover plate 30, eliminating the gap between the wiring body 10 and the through-hole 301 and ensuring a seal between the cover plate 30 and the wiring body 10 after assembly. In practical applications, the interior of the housing 20 must be filled with an insulating filler layer 50.When the cover plate 30 and the wiring body 10 are assembled, the lower cover plate can first be connected to both ends of the housing 20, and then the static insulating filler layer 50 can be filled into the receiving space of the housing 20. Next, the upper cover plate is connected to the housing 20, and finally, the wiring body 10 is pushed into the receiving space of the housing 20 by one of the upper or lower cover plates and passed through it until the wiring body passes through the other of the upper or lower cover plates, with both ends exposed outside the housing 20. As shown in . Fig. As shown in Figure 3, in some optional embodiments the cross-section of the wiring body 10 is rectangular along the second direction Y, thereby improving the heat dissipation capacity of the wiring body 10.

[0042] Specifically, the wiring body 10 is configured as a solid structure with a rectangular cross-section. This rectangular solid structure typically exhibits high mechanical strength and structural stability, can withstand large external forces, is suitable for various vibration or shock environments, and is appropriate for the complex operating environment in the high-temperature electrical thermal storage system. Since the wiring body 10 is also used to supply current to the heating wire, the current flowing through it when the wiring body 10 is switched on causes a temperature increase within the wiring body 10. This increases the resistance within the wiring body 10 and further increases the power loss. Furthermore, if the temperature of the wiring body 10 becomes too high, the insulation performance of the outer casing 20 is impaired, leading to a risk of short circuits.If the cross-section of the wiring body 10 is rectangular along the second direction Y, the heat dissipation capacity of the wiring body 10 is improved, thereby maximizing power transmission efficiency. At the same time, it prevents safety accidents such as short circuits and electric shocks due to insulation faults, ensuring the safety of personnel and equipment. This rectangular regular shape exhibits high dimensional accuracy and reduces processing difficulty, thus enabling easy large-scale production and consequently lowering production costs.

[0043] In some optional embodiments of the present application, the wiring body 10 is a high-temperature resistant wiring rail made of stainless steel, which can ensure the stability and safety of the wiring body 10 when the wiring structure is in a high-temperature environment for a long time.

[0044] For example, the wiring body 10 can be made of 310S stainless steel. This type of stainless steel can be used for extended periods at high temperatures from 800°C to 1100°C, exhibits good chemical stability, and does not deform or oxidize easily at high temperatures. This ensures that the resistance of the wiring body 10 remains stable and improves the efficiency of electrical energy use. The wiring body 10 can also be made of 309S stainless steel. This type of stainless steel exhibits excellent strength and acid resistance at high temperatures, remains stable even after prolonged exposure to high temperatures, and has a heat resistance of up to 1050°C. It can also be repeatedly heated to 980°C.Furthermore, the wiring body 10 can also be made of another high-temperature-resistant stainless steel, such as stainless steel 321H, stainless steel 409, stainless steel 316Ti, stainless steel 304H, or the like. The present application does not specifically restrict the specifications and models of the high-temperature-resistant stainless steel. In practical applications, the selection can be made taking into account the operating environment, machining performance, cost factors, and the like. Preferably, in an embodiment of the present application, the wiring body 10 is made of stainless steel 310S, since this has a high nickel (Ni) and chromium (Cr) content. Therefore, in addition to excellent high-temperature resistance, the wiring body also exhibits good corrosion resistance as well as acid and alkali resistance and is suitable for high-temperature electrical heat storage systems.

[0045] Furthermore, the wiring body 10 can also be made of conductive materials such as copper and aluminum, whereby the conductive materials such as copper and aluminum must meet the current-carrying requirements. A surface treatment of the wiring body 10, for example by tinning, silver plating, or the like, can improve its corrosion resistance and conductivity. When designing the size of the wiring body 10, the rectangular cross-sectional area should be determined according to the current and voltage level to ensure safe current conduction and adequate insulation distance. It is understood that in a high-temperature electrical thermal storage system, the wiring body 10 must be selected according to parameters such as current, voltage, and temperature to meet the relevant system operating requirements.For example, a high-power heating element may require a wiring body 10 with a high current rating, while a high-temperature environment requires that the material of the wiring body 10 exhibit high-temperature resistance, such as ceramics, special plastics, or the like. In practical applications, the material of the wiring body 10 is not limited to that shown in the embodiments of the present application, and engineers can choose it flexibly; the present application does not provide for any specific restriction in this regard.

[0046] In some optional embodiments of the present application, the insulating filler layer 50 is an aluminium-silicon filler layer.

[0047] Specifically, the insulating filler layer 50 is an aluminum-silicon oxide filler layer with a granular structure. It is filled and compacted between the insulating housing 20 and the wiring body 10. This filler provides both insulating and heat retention performance. On the one hand, it works in conjunction with the insulating housing 20 to achieve double insulation of the wiring structure, effectively preventing electrical failures and ensuring the electrical stability of the wiring structure. On the other hand, this filler has good heat retention performance, thereby reducing heat loss from the heat storage system, ensuring heat storage efficiency, and improving the energy utilization rate.

[0048] In some optional embodiments of the present application, the housing 20 is a ceramic housing 20 which has high temperature resistance, good insulation and thermal shock stability.

[0049] Specifically, the housing 20 is a cylindrical structure with a hollow interior, and it serves as the outermost structure of the wiring system and is in direct contact with the thermal insulation layer of the heat storage system. The cylindrical structure ensures thermal uniformity of the housing 20 in the circumferential direction, and this smooth structure reduces stress concentration.Since the thermal storage system exhibits the characteristics of high temperatures and high voltage, the high-temperature resistance of the ceramic housing 20 allows it to retain its structural stability when exposed to a high-temperature environment for extended periods, thus ensuring the safety of the internal wiring body 10. Good insulation effectively isolates high-voltage currents and prevents the risk of leakage and short circuits in the thermal storage system. Furthermore, the ceramic housing 20's good thermal shock resistance reduces the risk of cracking due to temperature changes and extends its service life. In practical applications, the ceramic housing 20 can be made of alumina ceramic or silicon nitride ceramic.

[0050] It should be noted that the thermal storage system typically operates in harsh environments such as high temperatures and high humidity. This exposes the wiring structure to various factors like thermal radiation and water vapor erosion, leading to aging of the insulation material and a deterioration of insulation performance. With prolonged operation, this can easily result in insulation breakdowns, leaks, and other faults. An insulation failure not only renders the thermal storage system inoperable but can also lead to safety hazards such as electrical fires and electric shocks.In one embodiment of the present application, the ceramic housing 20 and the aluminum-silicon filler layer can play a dual role as insulation protection. The ceramic housing 20 exhibits extremely high insulation resistance, enabling it to effectively insulate high-voltage currents and prevent leakage and short circuits, while the aluminum-silicon filler, as a non-conductive material, can form a good insulating barrier to further improve the insulation effect. Furthermore, the high-temperature resistance of the ceramic housing 20 and the structural stability of the aluminum-silicon filler at high temperatures can ensure the structural stability of the entire wiring structure under high-temperature operating conditions.

[0051] As in Fig. As shown in Figure 2, the cover plate 30 comprises a main body section 31 and an extension section 32, wherein the main body section 31 is connected to the opening, and the extension section 32 extends from the main body section 31 along a first direction X and into the receiving space. The provision of the extension section 32 increases, on the one hand, the connection strength between the cover plate 30 and the housing 20, and on the other hand, it also increases the contact area between the cover plate 30 and the housing 20, thereby improving the sealing effect between them.

[0052] Specifically, two cover plates 30 are provided, namely an upper cover plate 30 and a lower cover plate 30. The upper cover plate 30 and the lower cover plate 30 have the same structure and are symmetrically connected to the upper and lower openings of the housing 20 in order to jointly block the receiving space of the housing 20. The size of the main body section 31 is not smaller along the radial direction of the housing 20 than the maximum size of the housing 20, so that the main body section 31 can completely block the opening of the receiving space.The main body section 31 has two sides facing away from each other along the first direction X, and the extension section 32 is arranged on one side of it. The extension section 32 extends outwards from the main body section 31 and projects from it. The area of ​​the extension section 32 is essentially the same as the opening area of ​​the receiving space of the housing 20, thus enabling a good fit with the opening. The sealing layer 40 is arranged around the outer circumference of the extension section 32 and is connected between the main body section 31 and the housing 20. In practical applications, the extension section 32 can be in a press fit with the opening of the housing 20, thereby reducing or even eliminating the gap between the cover plate 30 and the inner wall of the housing 20.The sealing performance of the wiring structure is further improved by the provided sealing layer 40. In a further development, a heat dissipation rib can also be provided on the side of the main body section 31 facing away from the extension section 32, thereby increasing the heat dissipation area of ​​the cover plate 30 and improving the heat dissipation capacity of the entire wiring structure.

[0053] Optionally, the cover plate 30 is made of high-temperature resistant stainless steel to ensure the stability and safety of the cover plate 30 when the wiring structure is in a high-temperature environment for a longer period of time.

[0054] For example, cover plate 30 is made of 310S stainless steel. This type of stainless steel withstands high temperatures above 1000°C and can be used continuously at temperatures up to 1200°C. It exhibits good chemical stability and does not deform or oxidize easily at high temperatures, thus ensuring that the resistance of cover plate 30 remains stable and improving the efficiency of electrical energy use. Furthermore, cover plate 30 can also be manufactured from 309S stainless steel, 316 stainless steel, 321H stainless steel, 316Ti stainless steel, or similar materials. In actual applications, its design can be tailored to the ambient temperature of the wiring structure.Specifically, the cover plate 30 can also be made of stainless steel 309S, a type of stainless steel that exhibits excellent strength and acid resistance at high temperatures, remains stable even under prolonged exposure to high temperatures, and has a heat resistance of up to 1050°C, and can be repeatedly heated to 980°C. Furthermore, the cover plate 30 can also be made of another high-temperature-resistant stainless steel, such as stainless steel 321H, stainless steel 409, stainless steel 316Ti, stainless steel 304H, or the like, and the present application does not specifically limit the specifications and types of high-temperature-resistant stainless steel. In practical applications, the selection can be made taking comprehensive account of the operating environment, machining performance, cost factors, and the like.Preferably, in an embodiment of the present application, the cover plate 30 is made of stainless steel 310S, since this has a high nickel (Ni) and chromium (Cr) content; therefore, in addition to excellent high-temperature resistance, the wiring body also has good corrosion resistance as well as acid and alkali resistance and is suitable for high-temperature electrical heat storage systems.

[0055] As in Fig. 4 and Fig. Figure 5 shows a wiring structure in another embodiment of the present application. The extension section 32 of the cover plate 30 is provided with a first snap-in section 321, and the end of the housing 20 is provided with a second snap-in section 201. When the cover plate 30 is connected to the housing 20, the first snap-in section 321 is clamped to the second snap-in section 201 to prevent structural damage caused by the separation of the cover plate 30 from the housing 20, thereby improving the connection stability between the cover plate 30 and the housing 20 and ensuring the reliability of the entire wiring structure.It should be noted that in the embodiments of the present application, the cover plate 30 is a high-temperature-resistant cover plate 30 made of stainless steel, and the housing 20 is a ceramic housing 20, both of which exhibit high rigidity. Therefore, the dimensions of the first snap-in section 321 and the second snap-in section 201 can be designed to be very small in the second direction to ensure clamping and contact between the two. To clearly show the interaction between the two, the dimensions of the first snap-in section 321 and the second snap-in section 201 are shown in [ ]. Fig. 4 and Fig. 5 enlarged, which can be flexibly designed in actual applications.

[0056] Optionally, a wiring groove 101 is provided at one end of the wiring body 10, and the wiring groove 101 is used for an interference fit with the heating wire to improve the connection strength between the wiring body 10 and the heating wire. Specifically, the wiring groove 101 has a notch whose size is smaller than the diameter of the heating wire, and the cross-section of the wiring groove 101 can comprise one or more trapezoids, circles, rectangles, polygons, or the like. Furthermore, the cross-sections of the wiring groove 101 can be the same or different at various positions along the longitudinal direction of the wiring groove 101, and the present application does not specifically restrict the cross-sectional shape of the wiring groove 101.It is understandable that by designing the notch to be smaller than the diameter of the heating wire, an interference fit between the heating wire and the notch can be achieved, thereby improving the connection strength between the heating wire and the wiring body 10. In a further development, the contact area between the wiring body 10 and the heating wire can also be increased by redesigning the wiring groove 101, thereby reducing contact resistance and power loss. It should be noted that the heating wire typically has a cylindrical structure and, when connected to the wiring body 10, can be considered a point contact in terms of its cross-section.If a wiring groove 101 is provided on the wiring body 10, the heating wire is fitted into the wiring groove 101 by press fit, thereby increasing the contact area between the heating wire and the wiring groove 101, reducing the current density per unit area and reducing the resistance loss, and increasing the current path area, thereby improving conductivity and preventing safety accidents due to overheating.

[0057] In one embodiment of the present application, the wiring body 10 is made of 310S stainless steel. With this material, the wiring groove 101 can be machined by laser cutting, plasma cutting, mechanical processing such as milling, planing, grinding, and other machining processes. In practical applications, after the heating wire has been pressed into the wiring groove 101, the terminal can be welded using resistance welding or high-frequency induction welding to achieve a reliable connection between the heating wire and the wiring body 10.

[0058] The assembly process of the wiring structure in an embodiment of the present application is described below: S1: the housing 20 and the lower cover plate 30 are assembled: a heat-resistant sealant is applied to the lower end face of the housing 20, and the lower cover plate 30 is pressed into the lower opening of the housing 20, so that the extension section 32 of the lower cover plate 30 projects into the receiving space of the housing 20, and the main body section 31 of the lower cover plate 30 is connected to the lower end face of the housing 20 with the heat-resistant sealant and the heat-resistant sealant is cured; S2: Pre-assembly of the filler layer: the aluminum-silicon filler layer is evenly filled into the receiving chamber and vibrated and compacted. S3: Mounting the upper cover plate 30: a heat-resistant sealant is applied to the upper end face of the housing 20, and the upper cover plate 30 is pressed into the upper opening of the housing 20, so that the extension section 32 of the upper cover plate 30 projects into the receiving space of the housing 20, and the main body section 31 of the upper cover plate 30 is connected to the upper end face of the housing 20 with the heat-resistant sealant and the heat-resistant sealant is cured; S5: Inserting the wiring body 10: the wiring body 10 is pressed successively from top to bottom into the through hole 301 on the upper cover plate 30 and the lower cover plate 30, so that the wiring body 10 is brought into the target position and the wiring opening 102 and the wiring groove 101 are exposed outside the housing 20; S6: Clamping the heating wire: Contaminants are removed from the surface of the heating wire and the wiring groove 101 to ensure that the contact surface is clean, with the heating wire being pressed evenly into the wiring groove 101 to form a tight fit with the wiring groove 101, with the contact parts being welded to ensure that there are no defects such as cold solder joints and cracks in the solder joint, with the contact resistance value being less than 5% of the unwelded area.

[0059] It should be noted that the assembly process described above serves only as an illustration and does not represent a limitation of the assembly steps for the wiring structure. In actual operation, technicians can flexibly design the assembly steps based on the material properties, structural features, assembly conditions, and the like of the components. In summary, the wiring structure provided by embodiments of this application can offer at least the following advantages: In the embodiments of the present application, the housing is provided with a receiving chamber for receiving the wiring body, and the housing can offer a certain degree of protection for the wiring body. The insulating filler layer inserted between the wiring body and the inner wall of the housing can insulate the wiring body, thereby preventing electrical faults such as short circuits and leakage. The cover plate is connected to the opening of the housing. Since a sealing layer is arranged between the cover plate and the opening, the sealing layer can seal the receiving chamber, thereby improving the sealing performance in the receiving chamber and effectively preventing the escape of high-temperature gas into the receiving chamber.The wiring structure in the embodiments of the present application not only has a simple structure, but also exhibits good sealing properties as well as high safety and reliability.

[0060] The embodiments of the present application further provide a heat storage system comprising a heating wire and one of the above-mentioned wiring structures, and the wiring body 10 is provided with a wiring groove 101, and the heating wire is at least partially connected in the wiring groove 101, and the heating wire and the notch of the wiring groove 101 are connected to each other by interference fit.

[0061] It should be noted that in the embodiments of the present application, the wiring structure is the same as the wiring structure of one of the embodiments mentioned above, and that their advantageous effects are also similar, which will not be discussed in detail here.

[0062] The wiring structure is the core component of the electrical connection responsible for supplying the external power source to the system and distributing electrical energy to the heating wire. The wiring body 10 is connected to the heating wire to form a complete circuit. The heating wire is a direct heat source for the thermal storage system and has an interference fit with the notch of the wiring groove 101 on the wiring body 10, thus establishing an electrical connection with the wiring structure to allow current to flow and convert electrical energy into heat energy through the thermal effect of the current. The thermal storage system also includes a thermal storage body. When current flows through the heating wire, heat can be transferred to the thermal storage body by direct contact or radiative heat transfer.The thermal storage element's function is to store the heat energy generated by the heating wire and release the heat to the load (e.g., heating system, industrial plant) as needed via natural convection, forced circulation, or conduction. Within the thermal storage system, the wiring structure, the heating wire, and the thermal storage element form a closed loop of "electrical energy-thermal energy-heat storage." The wiring structure is the central component for electrical energy transfer, the heating wire is the core component for heat energy generation, and the thermal storage element is the carrier for heat energy storage.

[0063] It should be noted that the material (e.g., nickel-chromium alloy, iron-chromium-aluminum alloy) and structure (e.g., spiral, corrugated) of the heating wire directly affect its heating performance and lifespan. Similarly, the material (e.g., ceramic, metal oxides) and structure (e.g., honeycomb, plate-like) of the heat storage element determine its heat storage density and thermal conductivity, which in turn influences the heating efficiency of the heating wire and the overall performance of the system.

[0064] In the description of this instruction, terms such as "an embodiment," "some embodiments," "illustrative embodiment," "example," "concrete example," or "some examples" refer to the specific features, structures, materials, or properties described in connection with the embodiment or example and included in at least one embodiment or example of this application. In this description, the aforementioned terms do not necessarily refer to the same embodiments or examples. Furthermore, the described specific features, structures, materials, or properties may be combined appropriately in one or more embodiments or examples.

[0065] Although embodiments of the present application have been shown and described, it will be clear to the person skilled in the art that these embodiments can undergo various changes, modifications, replacements and variations without deviating from the principle and purpose of the present application, the scope of which is limited by the claims and their equivalents.

Claims

[1] Wiring structure, characterized by , that the wiring structure comprises a wiring body (10), a housing (20), a cover plate (30), a sealing layer (40) and an insulating filler layer (50), wherein the housing (20) is provided with a receiving space and has two ends arranged oppositely along a first direction (X), wherein two ends of the housing (20) are provided with openings, the cover plate (30) being connected to the opening, the sealing layer (40) being placed between the cover plate (30) and the opening and being provided for sealing the receiving space; wherein the wiring body (10) is arranged extending through the housing (20), the insulating filler layer (50) being filled into the receiving space and being located between the housing (20) and the wiring body (10). [2] Wiring structure according to claim 1, characterized by, that the sealing layer (40) is a heat-resistant sealant adhesive layer. [3] Wiring structure according to one of the preceding claims, characterized by , that a through hole (301) is provided on the cover plate (30), wherein the wiring body (10) passes through the through hole (301) and is in press fit with the through hole (301). [4] Wiring structure according to one of the preceding claims, characterized by , that the cover plate (30) comprises a main body section (31) and an extension section (32), wherein the main body section (31) is connected to the opening, wherein the extension section (32) extends from the main body section (31) along a first direction (X) and extends into the receiving space. [5] Wiring structure according to one of the preceding claims, characterized by, that the extension section (32) is provided with a first snap-in section (321) and the housing (20) is provided with a second snap-in section (201), wherein when the cover plate (30) is connected to the housing (20), the first snap-in section (321) is clamped to the second snap-in section (201). [6] Wiring structure according to one of the preceding claims, characterized by , that the cross-section of the wiring body (10) is rectangular along the second direction (Y), with the second direction (Y) intersecting the first direction (X). [7] Wiring structure according to claim 6, characterized by , that the wiring body (10) is configured as a solid structure with a rectangular cross-section. [8] Wiring structure according to any one of claims 1 to 5, characterized by , that the wiring body (10) is a high temperature resistant wiring rail made of stainless steel. [9] Wiring structure according to any one of claims 1 to 5, characterized by , that the insulating filler layer (50) is an aluminium silicon filler layer. [10] Wiring structure according to any one of claims 1 to 5, characterized by , that the case (20) is a ceramic case (20). [11] Wiring structure according to any one of claims 1 to 5, characterized by , that the housing (20) is a cylindrical structure. [12] Wiring structure according to any one of claims 1 to 5, characterized by , that a wiring groove (101) is provided at one end of the wiring body (10), wherein the wiring groove (101) is provided for press fit with the heating wire. [13] Heat storage system, characterized by, that the heat storage system comprises a heating wire and a wiring structure according to one of the preceding claims, wherein the wiring body (10) is provided with a wiring groove (101), wherein the heating wire is at least partially connected in the wiring groove (101), and wherein the heating wire can be fitted into the notch of the wiring groove (101) by press fit.

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