Performance module

Abstract

Power module, featuring: an insulating substrate; a heat dissipation element that is integrally integrated into the insulating substrate; and a sealing component that seals the insulating substrate and part of the heat dissipation component.

Description

BACKGROUND Technical area

[0001] The present disclosure relates to a power module and in particular a power module that is able to improve the heat dissipation performance by reducing the thermal resistance. State of the art

[0002] A power semiconductor device is a semiconductor device consisting of a power switching device and an integrated circuit (IC) that plays a role in converting, dissipating, and managing the energy supplied to an electronic device.

[0003] Power semiconductors require higher voltage and greater reliability compared to general semiconductor devices. The demand for power semiconductor devices is increasing, particularly due to the development of hybrid and electric vehicles. The power conversion modules used in hybrid and electric vehicles can consist of power semiconductor devices that convert direct current (DC) to alternating current (AC) or vice versa.

[0004] The power modules are realized using key technologies such as module integration design technology for power semiconductor devices and package materials, manufacturing process technology, property testing, and reliability assessment technology. In particular, the power modules used in environmentally friendly vehicles such as hybrid and electric vehicles require high reliability, as they operate in harsh environments such as high temperatures and strong vibrations.

[0005] The technology underlying the present disclosure is disclosed in Korean patent application No. 10-2277800 (filed on July 16, 2021, entitled “INTEGRATED POWER MODULE FOR HEAT LOCK AND MANUFACTURING METHOD FOR IT”). SUMMARY

[0006] Various designs relate to a power module that can improve heat dissipation performance by reducing thermal resistance.

[0007] A power module according to an embodiment of the present disclosure may comprise an insulating substrate, a heat dissipation part integrally provided on the insulating substrate, and a sealing part sealing the insulating substrate and part of the heat dissipation part.

[0008] The heat dissipation part can have a first heat dissipation part that is integrally provided on a first surface of the insulating substrate, and a second heat dissipation part that is integrally provided on a second surface of the insulating substrate that points in a direction opposite to the first surface, wherein the sealing part can seal the entirety of the insulating substrate and the first heat dissipation part and a part of the second heat dissipation part.

[0009] The first heat dissipation part and the second heat dissipation part can have different volumes.

[0010] The volume of the first heat dissipation part and the volume of the second heat dissipation part can be the same size.

[0011] The second heat dissipation part can have a first heat dissipation body section that touches the second surface and does not touch the sealing part, a second heat dissipation body section that extends from the first heat dissipation body and is able to touch the second surface and the sealing part, and heat dissipation fin sections that extend from the first heat dissipation body section parallel to a first direction and are arranged so that they are spaced apart from each other along a direction parallel to a second direction intersecting the first direction.

[0012] The first heat dissipation body section can be provided on a first part of the second heat dissipation body section, the second heat dissipation body section can be provided on a second part of the second heat dissipation body section except for the first part, and the height of the second heat dissipation body section parallel to the first direction and the height of the heat dissipation fin section parallel to the first direction can be the same.

[0013] The thickness of the first heat dissipation part parallel to the first direction and the thickness of the first heat dissipation body section parallel to the first direction can be different from each other.

[0014] The thickness of the first heat dissipation part parallel to the first direction can be greater than the thickness of the first heat dissipation body section parallel to the first direction.

[0015] The second heat dissipation body section may have an exposed surface that does not touch the sealing part, wherein an outer surface of the sealing part adjacent to the exposed surface and the exposed surface may be arranged so that they form the same plane.

[0016] Several insulating substrates and heat dissipation parts can be arranged such that they are spaced apart from each other along a direction parallel to a first direction, with the several heat dissipation parts being arranged so that they point in opposite directions.

[0017] The present disclosure can reduce the thermal resistance of a power module by configuring a heat dissipation part that is integrally provided on an insulating substrate, thereby improving the heat dissipation performance of the power module and simplifying the components that form the power module as well as the construction of the power module. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a perspective view of a power module according to a first embodiment of the present disclosure, viewed from one direction. Fig. 2 is a perspective view of the performance module of Fig. 1. Viewed from a different direction. Fig. 3 is a cross-sectional view along a line III-III in Fig. 1. Fig. Figure 4 is a perspective view of a power module according to a second embodiment of the present disclosure, viewed from one direction. Fig. 5 is a perspective view of the performance module of Fig. 4. Viewed from a different direction. Fig. 6 is a cross-sectional view along a line VI-VI in Fig. 4. DETAILED DESCRIPTION

[0018] The following describes an embodiment of a power module according to the present disclosure with reference to the accompanying drawings. For the sake of clarity and simplicity, the line thickness and component sizes in the drawings may be exaggerated. Furthermore, the terms to be described below are defined in relation to the functions in the present disclosure and may vary depending on the user's or operator's intent or custom. Therefore, the definition of these terms should be based on the overall content of the specification.

[0019] Fig. Figure 1 is a perspective view of a power module according to a first embodiment of the present disclosure, viewed from one direction, Fig. 2 is a perspective view of the performance module of Fig. 1. Viewed from a different direction, and Fig. 3 is a cross-sectional view along a line III-III of Fig. 1.

[0020] With reference to Fig. 1 to Fig. 3 The power module 1 according to the first embodiment of the present disclosure comprises an insulating substrate 110, a heat dissipation part 120 and a sealing part 130, which are described in more detail below.

[0021] The insulating substrate 110 can be a direct bonded copper (DBC) substrate. The insulating substrate 110 consists of a highly conductive metal layer, such as copper (Cu), on both sides of a ceramic substrate and can have at least one or more laminated layers. An electrically conductive pattern can be formed on one surface of the insulating substrate 110.

[0022] The insulating substrate 110 has a first surface 110a (an upper surface based on Fig. 3) and a second surface 110b (a lower surface based on Fig. 3) which is arranged in a direction opposite to one of the first areas 110a.

[0023] The power module 1 according to this embodiment further comprises a chip 11 and a terminal 13. The chip 11 can, for example, be a semiconductor device. The chip 11 can be configured in a structure in which several semiconductor devices are connected in parallel by a metal compound formed on a predetermined substrate. The chip 11 is electrically connected to the insulating substrate 110.

[0024] Terminal 13 can be used to electrically connect chip 11 to an adjacent chip 11. If several chips 11 are arranged in parallel, terminal 13 can be connected to each of at least two or more parallel chips 11.

[0025] An adhesive layer 12 is arranged between the terminal 13 and the chip 11. The adhesive layer 12 can comprise a heat-dissipating adhesive or a thermally conductive material (TIM material).

[0026] A heat dissipation element 120 is integrally integrated onto the insulating substrate 110. The heat dissipation element 120 is in direct contact with the insulating substrate 110. The heat dissipation element 120 can dissipate the heat transferred from the insulating substrate 110 to the outside of the power module 1 in order to cool the insulating substrate 110. The heat dissipation element 120 can be made of a copper material (Cu) with high thermal conductivity.

[0027] The heat dissipation part 120 has a first heat dissipation part 121 and a second heat dissipation part 122.

[0028] The first heat dissipation part 121 can have the form of a flat plate. The first heat dissipation part 121 can have the form of a polygon with angled corners, such as forming a circle, an ellipse, or a square in cross-section.

[0029] The first heat dissipation element 121 is provided on a first surface 110a of the insulating substrate 110. Specifically, the first heat dissipation element 121 is integrally provided on the first surface 110a of the insulating substrate 110. One surface (a lower surface based on Fig. 3) of the first heat dissipation part 121, which is opposite the first surface 110a of the insulating substrate 110, can be in direct contact with the first surface 110a of the insulating substrate 110.

[0030] Chip 11 is mounted on the first heat dissipation part 121. Specifically, chip 11 is located on the other surface (an upper surface based on Fig. 3) of the first heat dissipation part 121 is mounted. The adhesive layer 12 is located between the first heat dissipation part 121 and the chip 11. The adhesive layer 12 can comprise a heat-dissipating adhesive or a TIM.

[0031] The second heat dissipation element 122 is spaced parallel to the first direction from the first heat dissipation element 121. The second heat dissipation element 122 is provided on the second surface 110b of the insulating substrate 110. Specifically, the second heat dissipation element 122 is integrally provided on the second surface 110b of the insulating substrate 110. One surface (an upper surface based on Fig. 3) of the second heat dissipation part 122, which is opposite the second surface 110b of the insulating substrate 110, is in direct contact with the second surface 110b of the insulating substrate 110.

[0032] The second heat dissipation element 122 can have the shape of a polygon with angled corners, e.g., forming a circle, an ellipse, or a square in cross-section. An embodiment in which the cross-section of the second heat dissipation element 122 is a quadrilateral is described below.

[0033] The second heat dissipation part 122 has a first part 122a and a second part 122b.

[0034] The first part 122a can refer to a central part of the second heat dissipation part 122, and the second part 122b can refer to an edge of the second heat dissipation part 122, excluding the first part 122a.

[0035] The first heat dissipation part 121 and the second heat dissipation part 122 can have different volumes. Specifically, the amount of copper (Cu) in the first heat dissipation part 121 and the amount of copper (Cu) in the second heat dissipation part 122 can differ. Accordingly, the first heat dissipation part 121 and the second heat dissipation part 122 can have different weights.

[0036] In another embodiment, the first heat dissipation part 121 and the second heat dissipation part 122 can have the same volume. Specifically, the amount of copper (Cu) forming the first heat dissipation part 121 and the amount of copper (Cu) forming the second heat dissipation part 122 can be equal. Accordingly, the first heat dissipation part 121 and the second heat dissipation part 122 can have the same weight.

[0037] The first heat dissipation part 121 and the second heat dissipation part 122 have different volumes or the same volume, so that the load on the insulating substrate 110 acting parallel to the first direction and / or parallel to the second direction due to the thermal expansion of the first heat dissipation part 121 and the second heat dissipation part 122 can be minimized.

[0038] The sealing element 130 is arranged to protect the chip 11 from heat, shocks, and contamination, and can seal the insulating substrate 110 and part of the heat dissipation element 120. The sealing element 130 can seal the entire insulating substrate 110. The sealing element 130 can incorporate an epoxy resin molding compound (EMC). As shown in Fig. As shown in Figure 3, the top and side surfaces of the insulating substrate 110 are completely enclosed by the sealing part 130, while the bottom surface is completely covered by the top surface of the second heat dissipation part 122, whose side surfaces are enclosed by the sealing part 130. Thus, the insulating substrate 110 is completely surrounded by the sealing part 130. In other words, the sealing part 130 seals the entire insulating substrate 110.

[0039] The sealing element 130 seals the insulating substrate 110 and the first heat dissipation element 121. Therefore, the insulating substrate 110 and the first heat dissipation element 121 are not exposed. The first heat dissipation element 121 is attached to the insulating substrate 110 by the sealing element 130, and contact between the insulating substrate 110 and the first heat dissipation element 121 is maintained. The chip 11 and the terminal 13 are also sealed by the sealing element 130, so they are not exposed.

[0040] The sealing element 130 can seal part of the second heat dissipation element 122. Therefore, the remaining part of the second heat dissipation element 122, which is not sealed by the sealing element 130, may be exposed.

[0041] According to this embodiment, the second heat dissipation part 122 has a first heat dissipation body section 1221, a second heat dissipation body section 1222 and heat dissipation fin sections 1223.

[0042] The first heat dissipation body section 1221 is provided on the first part 122a of the second heat dissipation part 122. The first heat dissipation body section 1221 is in contact with the second surface 110b of the insulating substrate 110. One surface (an upper surface based on Fig. 3) of the first heat dissipation body section 1221, which is opposite the second surface 110b of the insulating substrate 110, can be in direct contact with the second surface 110b of the insulating substrate 110.

[0043] The first heat dissipation body section 1221 is not in contact with the sealing part 130. Specifically, the first heat dissipation body section 1221 is exposed because it is not sealed by the sealing part 130.

[0044] The second heat dissipation body section 1222 extends from the first heat dissipation body section 1221. The second heat dissipation body section 1222 is provided on the second part 122b of the second heat dissipation part 122. A portion of the second heat dissipation body section 1222 may be in contact with the sealing part 130. Specifically, an outer surface (a left surface based on Fig. 3) of the second heat dissipation body section 1222, which is arranged in one direction parallel to the second direction, is sealed by the sealing part 130 by contacting the sealing part 130.

[0045] The second heat dissipation body section 1222 has an exposed surface 1222a that is not in contact with the sealing element 130 and is not sealed by the sealing element 130. The exposed surface 1222a is arranged so that it points in a direction parallel to the first direction. The exposed surface 1222a can be a plane.

[0046] An O-ring or metal gasket is mounted on the exposed surface 1222a, and an O-ring or metal gasket is inserted between a housing part (not shown) accommodating the power module 1 and the exposed surface 1222a, thus allowing a space between the second heat dissipation body section 1222 and the housing part to be hermetically sealed.

[0047] An outer surface 130a of the sealing element 130, adjacent to the exposed surface 1222a, and the exposed surface 1222a are arranged such that they form the same plane. Specifically, the exposed surface 1222a of the second heat dissipation body section 1222 and the outer surface 130a of the sealing element 130 can have the same height.

[0048] The heat dissipation fin sections 1223 extend from the first heat dissipation body section 1221 along a direction parallel to the first direction, with several heat dissipation fin sections 1223 arranged at intervals from one another in a direction parallel to the second direction. A cooling path 1224 is formed between the several heat dissipation fin sections 1223. A cooling fluid can flow through the cooling path 1224.

[0049] The height of the second heat dissipation body section 1222 parallel to the first direction and the height of the heat dissipation fin section 1223 parallel to the first direction can be the same.

[0050] The heat dissipation fin sections 1223, which are parallel to the second heat dissipation body section 1222, and the second heat dissipation body section 1222 are spaced apart from each other. Accordingly, the cooling path 1224 can be formed between the second heat dissipation body section 1222 and the heat dissipation fin sections 1223. The cooling fluid can flow through the cooling path 1224.

[0051] The thickness T1 of the first heat dissipation part 121 parallel to the first direction and the thickness T2 of the first heat dissipation body section 1221 parallel to the first direction can be different from each other.

[0052] The thickness T1 of the first heat dissipation part 121 and the thickness T2 of the first heat dissipation body section 1221 are different from each other, so that the load on the insulating substrate 110 due to the thermal expansion of the first heat dissipation part 121 and the second heat dissipation part 122, which acts parallel to the first direction and / or parallel to the second direction, can be minimized.

[0053] In another embodiment, the thickness T1 of the first heat dissipation part 121 parallel to the first direction can be thicker than the thickness T2 of the first heat dissipation body section 1221 parallel to the first direction.

[0054] The thickness T1 of the first heat dissipation part 121 and the thickness T2 of the first heat dissipation body section 1221 are equal, so that the load on the insulating substrate 110 due to the thermal expansion of the first heat dissipation part 121 and the second heat dissipation part 122, which acts parallel to the first direction and / or parallel to the second direction, can be minimized.

[0055] Fig. Figure 4 is a perspective view of a power module according to a second embodiment of the present disclosure, viewed from one direction. Fig. 5 is a perspective view of the performance module of Fig. 4 viewed from a different direction, and Fig. 6 is a cross-sectional view along a line VI-VI of Fig. 4.

[0056] In Fig. 4 to Fig. 6 the power module 2 according to the second embodiment of the present disclosure comprises an insulating substrate 210, heat dissipation parts 220 and a sealing part 230.

[0057] The insulating substrate 210 can be a DBC substrate (Direct Bonded Copper substrate). The insulating substrate 210 consists of a highly conductive metal layer, e.g., copper, on both sides of a ceramic substrate and can have at least one or more laminated layers. An electrically conductive pattern can be formed on one surface of the insulating substrate 210.

[0058] Several insulating substrates 210 can be provided. At least one pair of insulating substrates 210 can be spaced apart from each other along a direction parallel to a first direction.

[0059] The insulating substrate 210 has a first surface 210a and a second surface 210b, which is arranged in a direction opposite to that of the first surface 210a.

[0060] The power module 2 according to this embodiment further comprises a chip 21. The chip 21 can, for example, be a semiconductor device. The chip 21 can be configured in a structure in which several semiconductors are connected in parallel by a metal compound formed on a predetermined substrate. The chip 21 is electrically connected to the insulating substrate 210.

[0061] Several heat dissipation elements 220 can be provided. At least one pair of heat dissipation elements 220 can be spaced apart from each other along a direction parallel to the first direction and pointing in opposite directions.

[0062] The heat dissipation elements 220 are integrally integrated with the insulating substrate 210. The heat dissipation elements 220 are in direct contact with the insulating substrate 210. The heat dissipation elements 220 transfer the heat transferred from the insulating substrate 210 to the outside of the power module 2 in order to cool the insulating substrate 210. The heat dissipation element 220 can be made of a copper material (Cu) with high thermal conductivity.

[0063] The heat dissipation parts 220 have a first heat dissipation part 221 and a second heat dissipation part 222.

[0064] The first heat dissipation part 221 can have the form of a flat plate. The first heat dissipation part 221 can have the form of a polygon with angled corners, such as forming a circle, an ellipse, or a square in cross-section.

[0065] The first heat dissipation element 221 is provided on a first surface 210a of the insulating substrate 210. Specifically, the first heat dissipation element 221 is integrally provided on the first surface 210a of the insulating substrate 210. A surface of the first heat dissipation element 221 that faces the first surface 210a of the insulating substrate 210 can be in direct contact with the first surface 210a of the insulating substrate 210.

[0066] The chip 21 is mounted on the first heat dissipation part 221. Specifically, the chip 11 is mounted on one of the first heat dissipation parts 221 from the pair of first heat dissipation parts 221, which are spaced apart from each other along the direction parallel to the first direction. An adhesive layer 22 is located between the first heat dissipation part 221 and the chip 21. The adhesive layer 22 can comprise a heat-dissipating adhesive or a TIM.

[0067] The power module 2 according to this embodiment further comprises a spacer 23. The spacer 23 is arranged between the first heat dissipation part 221, on which the chip 21 is not mounted, the pair of first heat dissipation parts 221, which are spaced apart from each other along the direction parallel to the first direction, and the chip 21, and can be used to insulate the chip 21.

[0068] The adhesive layer 22 is arranged between the spacer 23 and the first heat-radiating part 221, on which the chip 21 is not mounted. The adhesive layer 22 can comprise a heat-dissipating adhesive or a TIM.

[0069] The second heat dissipation element 222 is arranged parallel to the first heat dissipation element 221 and spaced apart from it. The second heat dissipation element 222 is located on the second surface 210b of the insulating substrate 210. Specifically, the second heat dissipation element 222 is integrally integrated onto the second surface 210b of the insulating substrate 210. A surface of the second heat dissipation element 222 facing the second surface 210b of the insulating substrate 210 is in direct contact with that surface.

[0070] The second heat dissipation element 222 can have the shape of a polygon with angled corners, e.g., forming a circle, an ellipse, or a square in cross-section. An embodiment in which the cross-section of the second heat dissipation element 222 is a quadrilateral is described below.

[0071] The second heat dissipation part 222 has a first part 222a and a second part 222b.

[0072] The first part 222a can refer to a central part of the second heat dissipation part 222, and the second part 222b can refer to an edge of the second heat dissipation part 222, excluding the first part 222a.

[0073] The first heat dissipation part 221 and the second heat dissipation part 222 can have different volumes. Specifically, the amount of copper (Cu) in the first heat dissipation part 221 and the amount of copper (Cu) in the second heat dissipation part 222 can differ. Accordingly, the first heat dissipation part 221 and the second heat dissipation part 222 can have different weights.

[0074] In another embodiment, the first heat dissipation part 221 and the second heat dissipation part 222 can have the same volume. Specifically, the amount of copper (Cu) forming the first heat dissipation part 221 and the amount of copper (Cu) forming the second heat dissipation part 222 can be equal. Accordingly, the first heat dissipation part 221 and the second heat dissipation part 222 can have the same weight.

[0075] The first heat dissipation part 221 and the second heat dissipation part 222 have different volumes or the same volume, so that the stress on the insulating substrate 210 due to the thermal expansion of the first heat dissipation part 221 and the second heat dissipation part 222, which acts parallel to the first direction and / or parallel to the second direction, can be minimized.

[0076] The sealing element 230 is arranged to protect the chip 21 from heat, shocks, and contamination, and can seal the insulating substrate 210 and part of the heat dissipation element 220. The sealing element 230 can seal the entire insulating substrate 210. The sealing element 230 can contain an epoxy resin molding compound (EMC). Fig. 6. The first surface 210a and the side surfaces of the insulating substrate 210 are completely enclosed by the sealing part 230, while the second surface 210b is completely covered by the surface of the second heat dissipation part 222 opposite the insulating substrate 210. The side surfaces of the second heat dissipation part 222 are also enclosed by the sealing part 230. Thus, the insulating substrate 210 is completely surrounded by the sealing part 230. In other words, the sealing part 230 seals the entire insulating substrate 210.

[0077] The sealing element 230 seals the insulating substrate 210 and the first heat dissipation element 221. Therefore, the insulating substrate 210 and the first heat dissipation element 221 are not exposed. The first heat dissipation element 221 is attached to the insulating substrate 210 by the sealing element 230, thus maintaining contact between the insulating substrate 210 and the first heat dissipation element 221. The chip 21 and the spacer 23 are also sealed by the sealing element 230 and must not be exposed.

[0078] The sealing element 230 can seal part of the second heat dissipation element 222. Therefore, the remaining part of the second heat dissipation element 222, which is not sealed by the sealing element 230, may be exposed.

[0079] According to this embodiment, the second heat dissipation part 222 has a first heat dissipation body section 2221, a second heat dissipation body section 2222 and heat dissipation fin sections 2223.

[0080] The first heat dissipation body section 2221 is provided on the first part 222a of the second heat dissipation part 222. The first heat dissipation body section 2221 is in contact with the second surface 210b of the insulating substrate 210. A surface of the first heat dissipation body section 2221, which faces the second surface 210b of the insulating substrate 210, is in direct contact with the second surface 210b of the insulating substrate 210.

[0081] The first heat dissipation body section 2221 is not in contact with the sealing parts 230. Specifically, the first heat dissipation body section 2221 is exposed because it is not sealed by the sealing part 230.

[0082] The second heat dissipation body section 2222 extends from the first heat dissipation body section 2221. The second heat dissipation body section 2222 is provided on the second part 222b of the second heat dissipation part 222. A portion of the second heat dissipation body section 2222 can be in contact with the sealing part 230. Specifically, an outer surface of the second heat dissipation body section 2222, which is arranged in one direction parallel to the second direction, can be sealed by the sealing part 230 by contacting the sealing part 230.

[0083] The second heat dissipation body section 2222 has an exposed surface 2222a that is not in contact with the sealing element 230 and is not sealed by the sealing element 230. The exposed surface 2222a is arranged parallel to the first direction. The exposed surface 2222a can be a plane.

[0084] An O-ring or metal gasket is mounted on the exposed surface 2222a, and an O-ring or metal gasket is inserted between a housing part (not shown) accommodating the power module 2 and the exposed surface 2222a, thus allowing a space between the second heat dissipation body section 2222 and the housing part to be hermetically sealed.

[0085] An outer surface 230a of the sealing element 230, adjacent to the exposed surface 2222a, and the exposed surface 2222a are arranged such that they form the same plane. Specifically, the exposed surface 2222a of the second heat dissipation body section 2222 and the outer surface 230a of the sealing element 230 can have the same height.

[0086] The heat dissipation fin sections 2223 extend from the first heat dissipation body section 2221 along the direction parallel to the first direction, with several heat dissipation fin sections 1223 arranged at intervals parallel to the second direction. A cooling path 2224 is formed between the several heat dissipation fin sections 2223. A cooling fluid can flow through the cooling path 2224.

[0087] The height of the second heat dissipation body section 2222 parallel to the first direction and the height of the heat dissipation fin section 2223 parallel to the first direction can be the same.

[0088] The heat dissipation fin sections 2223, which are parallel to the second heat dissipation body section 2222, and the second heat dissipation body section 2222 are spaced apart from each other. Accordingly, the cooling path 2224 can be formed between the second heat dissipation body section 2222 and the heat dissipation fin sections 2223. The cooling fluid can flow through the cooling path 2224.

[0089] The thickness T1 of the first heat dissipation part 221 parallel to the first direction and the thickness T2 of the first heat dissipation body section 2221 parallel to the first direction can be different from each other.

[0090] The thickness T1 of the first heat dissipation part 221 and the thickness T2 of the first heat dissipation body section 2221 are different from each other, so that the load on the insulating substrate 210 due to the thermal expansion of the first heat dissipation part 221 and the second heat dissipation part 222, which acts parallel to the first direction and / or parallel to the second direction, can be minimized.

[0091] In another embodiment, the thickness T1 of the first heat dissipation part 221 parallel to the first direction can be thicker than the thickness T2 of the first heat dissipation body section 2221 parallel to the first direction.

[0092] The thickness T1 of the first heat dissipation part 221 and the thickness T2 of the first heat dissipation body section 2221 are equal, so that the load on the insulating substrate 210 due to the thermal expansion of the first heat dissipation part 221 and the second heat dissipation part 222, which acts parallel to the first direction and / or parallel to the second direction, can be minimized.

[0093] The power modules 1 and 2 according to the embodiments of the present disclosure can reduce the thermal resistance through the configurations of the heat dissipation parts 120 and 220, which are integrally provided on the insulating substrates 110 and 210, thereby improving the heat dissipation performance and simplifying components and structures.

[0094] Although exemplary embodiments of the disclosure have been disclosed for illustrative purposes, these are merely exemplary, and it is clear to the person skilled in the art that various modifications, additions, and substitutions are possible without deviating from the scope of protection and spirit of the disclosure as defined in the appended claims. Therefore, the actual technical scope of the disclosure should be defined by the following claims.

Claims

[1] Power module comprising: an insulating substrate; a heat dissipation element that is integrally integrated into the insulating substrate; and a sealing component that seals the insulating substrate and part of the heat dissipation component. [2] Power module according to claim 1, wherein the heat dissipation part comprises: a first heat dissipation element that is integrally provided on a first surface of the insulating substrate; and a second heat dissipation part, which is integrally provided on a second surface of the insulating substrate, which points in a direction opposite to that of the first surface, wherein the sealing part seals the entirety of the insulating substrate and the first heat dissipation part as well as part of the second heat dissipation part. [3] Power module according to claim 2, wherein the first heat dissipation part and the second heat dissipation part have different volumes. [4] Power module according to claim 2 or 3, wherein the volume of the first heat dissipation part and the volume of the second heat dissipation part are equal. [5] Power module according to one of claims 2 to 4, wherein the second heat dissipation part comprises: a first heat dissipation body section that touches the second surface and is not in contact with the sealing part; a second heat dissipation body section extending from the first heat dissipation body section and capable of contacting the second surface and the sealing part; and one or more heat dissipation fin sections extending from the first heat dissipation body section parallel to a first direction and spaced apart from each other along a direction parallel to a second direction intersecting the first direction. [6] Power module according to claim 5, wherein the first heat dissipation body section is provided on a first part of the second heat dissipation body section, wherein the second heat dissipation body section is provided on a second part of the second heat dissipation body section with the exception of the first part, and where the height of the second heat dissipation body section parallel to the first direction and the height of the heat dissipation fin section parallel to the first direction are the same. [7] Power module according to claim 5 or 6, wherein the thickness of the first heat dissipation part parallel to the first direction and the thickness of the first heat dissipation body section parallel to the first direction are different from each other. [8] Power module according to one of claims 5 to 7, wherein a thickness of the first heat dissipation part parallel to the first direction is thicker than a thickness of the first heat dissipation body section parallel to the first direction. [9] Power module according to any one of claims 5 to 8, wherein the second heat dissipation body section has an exposed surface that does not touch the sealing part, and wherein an outer surface of the sealing part adjacent to the exposed surface and the exposed surface are arranged such that they form the same plane. [10] Power module according to any one of claims 1 to 9, wherein several insulating substrates and heat dissipation parts are arranged spaced apart from each other along a direction parallel to a first direction, and wherein the several heat dissipation parts are arranged pointing in opposite directions.

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