Housing unit for a semiconductor power module and semiconductor power module

Abstract

Housing unit (2) for a semiconductor power module (1), comprising: - a molded body (3) configured to enclose electrical components of the semiconductor power module (1), and - at least one terminal (10) partially integrated into and embedded in the molded body (3), such that the at least one terminal (10) extends through the molded body (3) and an end section (11) of the at least one terminal (10) is exposed on a top surface (6) of the molded body (3) with respect to a stacking direction (A) of the semiconductor power module (1), wherein the at least one terminal (10) further comprises at least one sealing structure (13, 14) arranged in a boundary region (5) between the exposed end section (11) and a mold edge (4) of the molded body (3), wherein the sealing structure (13, 14) is configured to limit an upper extension of the molded body (3), and wherein the sealing structure comprises at least one recess (13).which is formed on an outer surface (15) of the at least one connection, and wherein the at least one recess (13) comprises a height (H) with a value of 0.1-2.0 mm with respect to the stacking direction (A) and / or a width (W) with a value of 0.1-2.0 mm with respect to the lateral direction (B, C) and in each case with respect to the outer surface (15) of the at least one connection (10) next to the respective sealing structure (13, 14).

Description

The present disclosure relates to a package unit for a semiconductor power module and a corresponding package unit manufacturing method. The present disclosure further relates to a semiconductor power module including such a package unit.Conventional power modules form a technology for power semiconductor packages and typically include housings and electrical components mounted therein. It is a challenge to provide a stable package that contributes to reliable operation of a power module.Embodiments of the present disclosure may provide a package assembly for a semiconductor power module that enables stable operation for high voltage power module applications and that can be reliably manufactured. Further embodiments of the present disclosure may provide a semiconductor power module and a manufacturing method of a package unit for a semiconductor power module.According to one embodiment, a housing unit for a semiconductor power module comprises a molded body which is designed to enclose electronics and / or electrical components of the semiconductor power module. The housing unit further comprises at least one terminal which is at least partially integrated into the molded body and embedded therein, such that the at least one terminal extends through the molded body. An end portion of the at least one terminal constitutes an uppermost portion of the terminal, and is partially exposed at least on an upper side of the molded body with respect to the stacking direction of the semiconductor power module. The at least one terminal further includes at least one sealing structure disposed in a boundary region between the exposed end portion and a mold edge of the molded body. The sealing structure is formed to restrict an upper extension of the molded body during its formation by molding.Due to the described configuration of the package unit, the one or more terminals extending through the molded body are securely sealed and may provide a reliable electrical connection with further components of the semiconductor power module. Thus, the package unit counteracts an undesired leakage of molding compound into the area of the respective end portion of the corresponding terminal and thus contributes to a reliable operation of the semiconductor power module for low, medium, and even for high voltage power module applications and large format modules. The described arrangement with its uncontaminated upper end portion enables a secure electrical contact to external busbars or signal connections. The end portion of the respective terminals may be formed as a nut of the terminal.The special sealing structure attached to the connection enables a reliable sealing even in the case of vertically arranged connections, for example with a round or square shape. In this regard, terms such as "vertical", "upper(r)", or "lower(r)" refer to orientations or orientations of elements as provided in a normal operating state of the semiconductor power module. Thus, the stacking direction can also be referred to as a vertical direction, and corresponding lateral directions can also be referred to as horizontal directions and generally extend over the main extension plane.According to an embodiment, the sealing structure is formed on an outer surface of the at least one terminal such that it partially or completely surrounds the terminal with respect to the lateral direction or a radial direction perpendicular to the stacking direction. The terminal may include a terminal foot and an elongated terminal shaft or body, an upper end forming the terminal end portion. The connection shaft extends through the molded body and may have different shapes, such as a round, rectangular, oval or any other shape with respect to a cross section along the plane of the lateral directions. Within the housing, the respective terminals may have a different or any shape. Thus, the at least one connection can be formed with a cylindrical, cuboidal and ellipsoidal shape. The at least one connection can furthermore be solid or hollow with a tubular shape. The sealing structure forms a boundary for the molding compound of the molded body and can be designed in sections or as a closed ring around the connection shaft. Alternatively or additionally, the sealing structure can be designed to enclose the connection shaft in a spiral shape. The one or more ports may include, for example, a plurality of rings.According to an embodiment, the sealing structure comprises at least one recess formed on an outer surface of the at least one port. The recess can be formed such that the shaped edge of the molded body extends into the at least one recess. The mold edge can realize a local uppermost section of the molded body next to the connection. Thus, the recess can form a predetermined notch under cooperation with a corresponding molding tool for receiving and holding molding compound in order to prevent undesired bleeding into the region of the end section.Alternatively or additionally, the sealing structure may include at least one protrusion formed on an outer surface of the at least one port. Such a protrusion may limit an upper extension of the mold edge of the molded body with respect to the stacking direction. Thus, the protrusion may form a predefined barrier for blocking molding compound flowing out, under cooperation with a corresponding molding tool, in order to prevent undesired contamination of the end section.According to a further embodiment, the one or more terminals comprise two or more sealing structures which are formed in the boundary region between the exposed end section and the mold edge of the molded body. Each of the sealing structures may include one or more recesses and / or one or more protrusions formed on an outer surface of the respective terminal. The sealing structure may include, for example, only protruding or recessed portions or a combination of alternating protruding and recessed portions. An arrangement of one or more sealing sections can surround the respective connection completely or partially or in sections.The sealing structure may realize an additional element separate from the elongated body of the terminal or may be integrally formed integrally with the terminal. With respect to a vertical cross section along the stacking direction, the sealing structure may be formed in at least one of a square, rectangular, trapezoidal, semicircular, and triangular shape. Furthermore, the sealing structure may have a height with a value of 0.1-2.0 mm and / or a width with a value of 0.1-2.0 mm with respect to a vertical cross section along the stacking direction. The height refers to a vertical direction along the stacking direction, and the width refers to a corresponding vertical horizontal direction. The horizontal direction may also be referred to as a lateral direction, and the width may also be referred to as a depth of the recess or a thickness of the protrusion or the sealing structure. The height and the width are each adjusted with respect to an outer surface of the associated connection adjacent to the respective sealing structure. Thus, the height may refer to a length of a protrusion or recess along the stacking direction.For example, in the case of a round or cylindrical connector, a projection forming the sealing feature and having a width of up to 2 mm can project radially beyond the adjacent outer surface of the connector. With respect to a cylindrical fitting, a recess forming the sealing feature may protrude a width or depth of up to 2 mm radially behind the adjacent outer surface of the fitting. It is a realization within the scope of the present disclosure that such a dimension can contribute reliably to preventing undesired escape of molding compound during the formation of the molded body and thus of an outer region of the nut or of the end section of the respective connection.According to an embodiment, a semiconductor power module comprises an embodiment of the package unit and electrical and / or electronic components arranged within the package unit. The semiconductor power module may further include an insulated metal substrate structure having an upper metal layer, a lower metal layer, and a dielectric layer therebetween. The dielectric layer may be formed in the form of a sheet of resin or a molded resin layer. The insulated metal substrate structure is electrically coupled to the package unit by coupling the at least one terminal to the metallic cover layer. The upper metal layer may form a metallization made of a foil and / or a sheet of copper and / or aluminum and / or an alloy of copper and / or an alloy of aluminum. This can also apply to the lower metal layer, which can be formed, for example, as a copper and / or aluminum plate and / or a corresponding alloy. Because the described semiconductor power module comprises an embodiment of the aforementioned package unit, the described features and properties of the package unit are also disclosed for the semiconductor power module and vice versa.Alternatively, the semiconductor power module may include a substrate or a base plate coupled to the package unit. Preferably, the substrate is an insulated substrate. The substrate may comprise an insulation sheet made of ceramic material and at least one metallization layer on which power semiconductor devices are mounted and optionally a back side metallization. Alternatively or additionally, the semiconductor power module may comprise a substrate in the form of a leadframe, a ceramic-based substrate such as an LTCC substrate. The substrate may be mounted on a base plate.According to an embodiment, a method for manufacturing a package assembly for a semiconductor power module comprises providing a molding compound configured to form a molded body of the package assembly to enclose electrical or electronic components of the semiconductor power module. The method further includes providing and positioning at least one port including an end portion and at least one sealing structure formed adjacent the end portion. The method further comprises forming the molded body by forming the at least one terminal with the molding compound provided such that the at least one terminal is integrated into the molded body and at least partially embedded therein and extends through the molded body. The molded body is formed, in cooperation with the at least one terminal, so as to expose the end portion on an upper side of the molded body with respect to a stacking direction of the semiconductor power module. The at least one sealing structure is disposed in a boundary region between the exposed end portion and a mold edge of the molded body, thereby limiting an upper extension of the molded body during its formation.Because the described method enables the production of an embodiment of the aforementioned package unit for a semiconductor power module, the described features and properties of the package unit are also disclosed for the production method and vice versa. Thus, the present disclosure encompasses a plurality of aspects, wherein each feature described with respect to one of the aspects is also disclosed herein with respect to the other aspect, even if the respective feature is not expressly mentioned in connection with the specific aspect.According to one embodiment of the method, the molding compound comprises a thermoplastic or thermosetting resin formed with filler made of particles and / or fibers for injection molding or transfer molding, and the molded body is formed by injection molding or transfer molding with the thermoplastic or thermosetting resin.According to a further embodiment of the method, the step of providing and positioning at least one terminal comprises providing the at least one sealing structure with a recess and / or a protrusion formed on an outer surface of the terminal. The method includes positioning the terminal extending into a cavity of a mold such that the recess and / or protrusion limits an upper height of the cavity before the mold is formed by molding. The one or more sealing structures of the connections can be formed in coordination with corresponding structures of the molding tool, in order to enable, for example, a very precise and reliable sealing.The described configurations of the housing unit allow mounting of a terminal block, wherein main power and / or auxiliary terminals used for signal wiring, for example, may be an integral part of the molded housing. For example, the terminal block includes a plurality of vertically disposed and embedded terminals, portions of which are exposed from the molded body, and the vertically disposed terminals each having at least one sealing feature adjacent the edge of the molded body. Connecting sections within the housing or within the molded body can have any desired shape and can also have horizontal sections. The described configurations of the housing unit allow positioning vertically arranged terminals and forming the enclosing mold body, for example, even when a mold has two clamping shells but terminals are present at positions other than at an interface between the shells of the mold. This can also relate to a situation in which a large part of the connections is arranged horizontally with respect to clamping of a molding tool, but connections arranged vertically can additionally be present.The terminals may include, for example, a base material made of copper or a copper alloy. Additionally, one or more terminals may comprise a coating made of or comprising nickel, gold, silver, or any other metal. The terminals may comprise a coating on a bottom side of one or more layers made of or comprising nickel, gold, silver and / or other metals. Alternatively or additionally, further parts or the entire connections can be coated. The one or more terminals are specifically configured to securely seal their upper parts and prevent contamination of the upper end portions of the terminals to be exposed from the underlying molded body.The terminal block may provide a complete module housing or may implement a portion of the housing. The molded body may be made of or comprise thermoplastic or thermosetting resin or any other resin material. The molded body can be produced by injection molding, transfer molding or any other applicable molding process. A corresponding molding composition may comprise fillers such as particles or fibers.By the special seal structure formed on the terminals, contamination of exposed portions such as each end portion of vertically arranged main and / or auxiliary terminals arranged in the molded body constituting the terminal block can be prevented. The terminals extending vertically from the terminal block may have horizontal or oblique portions inside the molded body. The respective sealing feature thus counteracts bleeding of resin components in the formation of the molded article by molding. The sealing structure can completely or at least partially surround the shank of the terminals adjacent to the edge of the molded part which is in contact with the terminal. Thus, covering or contamination of terminal portions to be exposed from the terminal block by molding material can be reliably prevented.The production of such terminal blocks or housing parts with integrated power and / or additional terminals can have an advantageous effect on the mounting of corresponding semiconductor power modules. The mounting of the semiconductor power module can be simplified if at least a part of the housing and one or more connections form a common component such as the housing unit. On the one hand, instead of several individual parts, only a large part is to be implemented on the module assembly. All terminals may be properly aligned for a subsequent joining process of soldering or welding the terminals to a substrate, such as an insulated metal substrate. On the other hand, the terminal block or the housing unit may be used as a holder for supporting a joining process. In addition, pre-manufacturing a terminal block with integrated terminals as described enables implementation of main and / or auxiliary vertical terminals in the semiconductor power module. Alternatively or additionally, one or more terminals embedded in the molded body may have a predetermined inclination or other orientations with respect to a vertical direction or the stacking direction.In the context of the present disclosure, it turns out that in conventional terminals integrated into a molded part, there is the risk that parts of the terminals which are to be exposed by the molded part are partially covered with a molding material or contaminated. Such a risk can be reduced by using complex and expensive dies, which die must ensure proper sealing at the terminals to prevent the exposed portions of the terminals from being covered with molding material or contaminants by bleeding out components of the molding material.For example, in leadframe-based packages that are subjected to an injection molding process using a mold consisting of top and bottom parts, sealing may be effected by forming a dam bar on the leadframe, which mechanically connects all terminals oriented in the horizontal direction, such that the two parts of the mold may provide sealing by clamping on both sides of the dam bar. However, such a method for sealing terminals does not ensure leakage prevention and does not apply to vertically disposed terminals, particularly when the terminals have a round cross-sectional shape, but also not in the case where terminals are located at other locations of the module body, sealing by a dam bar being impossible. In such a case, when a molding die includes two clamping shells, but terminals are provided at positions other than an interface between the shells, a clamping and sealing method does not function properly because the vertically disposed terminal cannot be securely enclosed by the molding die.By using the described housing unit and the specially designed and securely sealing structures on the connections, it is possible with little effort to prevent or at least counteract an undesired escape of molding compound into the region of the exposed end sections. The described housing unit thus contributes to reliable operation of the semiconductor power module and can be produced with little outlay without complex and expensive molding apparatuses. The housing unit also contributes to simple installation in a customer application. The package unit can be used for large semiconductor power modules and power modules for higher voltage classes. This enables, for example, the production of the semiconductor power module with a lateral side length or width of 34 mm by 100 mm or even up to 140 mm by 190 mm. In this case, the lateral side length or lateral width extends in lateral directions perpendicular to the stacking direction of the semiconductor power module.The intentional introduction of sealing structures to prevent or at least reduce contamination of exposed portions of terminals by molding material has at least some of the following advantages for a manufacturer, but also for customer acceptance:• Increased yield rate at supplier → Lower part cost due to less scrap or less labor• Reduced tolerances for supplementary end portions → lower parts price• Clean visual appearance of a final product compared to undefined bleed / burr line → improved customer acceptance• Additional design freedom degrees → more space for the customer gate unitThe described housing unit can be applied to all power modules with a housing with integrated main and / or additional connections with a molded body.Exemplary embodiments are explained below with reference to schematic drawings and reference numerals. The figures show: FIG. 1 shows an embodiment of a semiconductor power module with a housing unit in a perspective view; FIGS. 2-6 show embodiments of a connection and a molded body of the housing unit in schematic cross-sectional views; and FIG. 7 is a flow chart of a method of manufacturing an embodiment of the package assembly for the semiconductor power module.The appended figures are intended to provide a better understanding. It is understood that the embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale. Like reference numerals designate elements or components having identical functions. Insofar as elements or components in different figures correspond to one another in terms of their function, their description is not repeated for each of the following figures. For clarity, elements may not appear with corresponding reference numerals in all figures.FIG. 1 illustrates a perspective view of an embodiment of a semiconductor power module 1. according to further embodiments, the semiconductor power module 1 may include alternative shapes as those shown in FIG. 1. The semiconductor power module 1 comprises a package unit 2 with a molded body 3 configured to enclose electrical components of the semiconductor power module 1, such as power semiconductor devices, conductive plates or traces. The housing unit 2 further comprises at least one terminal 10 which is at least partially integrated into the molded body 3 and embedded therein. According to FIG. 1, the housing unit 2 of the semiconductor power module 1 comprises six vertically arranged terminals 10 which extend through the molded body 3 on its upper side, such that a respective end section 11 of the associated terminal 10 is at least partially exposed on an upper side 6 of the molded body 3.In this specification, terms such as "vertical", "horizontal", "upper(r)" or "lower(r)" refer to orientations or orientations of elements provided in a normal operating state of the semiconductor power module 1 as illustrated in FIG. 1. Thus, a stacking direction A realizes a vertical direction, and corresponding lateral directions B and C realize horizontal directions and extend over the main extension plane of the semiconductor power module 1.The semiconductor power module 1 may further include a substrate or a base plate having a substrate soldered thereon. The substrate may be realized as an insulated substrate or as an insulated metal substrate structure comprising an upper metal layer, a lower metal layer and a dielectric layer therebetween.The terminals 10 further comprise at least one sealing structure in the form of a recess 13 (see FIGS. 2 and 3 ) or a protrusion 14 (see FIGS. 4 and 5 ) which are arranged on an outer surface 15 of the respective terminal 10. The respective sealing structure is arranged in a boundary region 5 and / or defines the generation of the boundary region 5 between the exposed part or end section 11 and a mold edge 4 of the molded body 3 during its formation by molding. The respective sealing structure is thus formed such that it reliably delimits an upper extent of the molded body 3 during a corresponding molding process.FIGS. 2-6 show enlarged cross-sectional views of the border region 5 and possible embodiments of the sealing structure attached or formed on the outer surface 15 of the terminal 10. Referring to FIGS. 2 and 3, the sealing structure may be formed as a recess 13 that may completely enclose an elongated shaft 12 of the terminal 10. Thus, the recess 13 can be formed as a circumferential groove with a funnel or trench shape. In view of the cross-section shown, the recess 13 may be bounded by the remaining outer surface 15 of the terminal 10 having a square, rectangular, trapezoidal, semi-circular and / or triangular shape.The recess 13 forms a free volume to receive and hold the molding compound during the formation of the molded body 3. The shaped edge 4 is thus formed on the shank 12 and projects into the recess 13. The recess 13 or the sealing structure in general can be formed in accordance with a corresponding molding tool which is required for carrying out the molding process for producing the molded body 3. As a result, the remaining outer surface of the end section is not contaminated by a molding material, so that the upper extension of the molded body is limited.Alternatively, referring to Figures 4 and 5, the sealing structure may be formed as a protrusion 14 which may fully enclose the elongate shaft 12 of the terminal 10. Thus, the projection 14 can be designed as a circumferential ring with a wedge-shaped, bead-shaped or hump-shaped form. In view of the cross-section shown, the protrusion 14 may be formed through the outer surface 15 of the terminal 10 to have a square, rectangular, trapezoidal, semi-circular, and / or triangular shape. The protrusion 14 forms a barrier for the molding compound and delimits an upper extension of the mold edge 4 with respect to the stacking direction A. Furthermore, one or more connections 10 can comprise a sealing structure with one or more recesses 13 and / or one or more protrusions 14.FIG. 6 illustrates possible dimensions of the sealing structure in the form of a rectangular recess 13, but the dimensions can also apply to other shapes of the recess 13 and also to possible shapes of the projection 14. With respect to the illustrated cross-sectional view, the recess 13 has a height H along the vertical or stacking direction A and a depth or width W along the radial or transverse direction B, C. For example, the height H may have a value of 0.1-2.0 mm and the width W may have a value of 0.1-2.0 mm. Depending on the intended application, the height H and / or the width W of the recess 13 or of the projection 14 can alternatively have larger values.The described and illustrated configurations of the housing unit 2 with its terminals 10 contribute to preventing contamination of exposed portions of vertical main and / or auxiliary terminals 10 by resin material or bleeding of resin components into the region of the exposed end portions 11 in order to provide reliable electrical connections to further components. Thus, it is possible to suppress covering of terminal portions to be exposed from the molded body 3 by molding material. The connectors 10 may have a solid or hollow or tubular shape with a round or angular shape. With regard to a finished molded body 3, the recess 13 or the projection 14 is arranged next to the mold edge 4 of the molded body 3 in the boundary region 5.Steps of a corresponding manufacturing method may follow the flow chart shown in FIG. 7. In a step S 1, a molding compound is provided which is designed to form a raw material for the molded body 3 of the housing unit 2. The molding compound can be a thermoplastic and / or a thermosetting resin with filler, which is produced from particles or fibers, for example.In a further step S 2, one or more connections 10 are provided and positioned in a molding tool. The terminals 10 each comprise an upper end portion 11 and the lower shaft 12 and at least one sealing structure in the form of a recess 13 or a protrusion 14 formed adjacent to the end portion 11. The terminals 10 may be purchased with the desired sealing structures, or the sealing structures may be formed during the manufacturing process. Thus, the one or more recesses 13 may be cut, drilled, rotated, stamped, or milled into the outer surface 15 of the connector 10. The one or more protrusions 14 may be similarly formed.In a further step S 3, the molded body can be formed by forming the placed terminals 10 with the molding compound provided. The housing unit 2 with its molded body 3 and the integrated terminals 10 can be manufactured in any type of molding process such as injection molding or injection molding. Thus, the terminals 10 are integrated and embedded in the molded body 3 and extend through the molded body 3, with the end portion 11 exposed on the upper surface 6 of the molded body 3. The sealing structure limits or limits an upper extension of the molded body 3 during its formation in the boundary region 5 between the exposed end portion 11 and the mold edge 4 of the molded body 3.The embodiments shown in FIGS. 1 to 7 as indicated represent embodiments of the improved package unit 2 and the semiconductor power module 1 and the manufacturing method thereof; therefore, they do not form a complete list of all embodiments. Actual arrangements and methods may vary from the embodiments shown, for example, in relation to metal substrate structures and power modules.Reference numerals denote reference numerals1 Semiconductor power module 2 Package unit 3 Package molded body 4 Mold edge 5 Boundary region 6 Upper surface of molded body 10 Terminal 11 Terminal end portion 12 Elongated shaft of terminal 13 Terminal recess 14 Terminal protrusion 15 Terminal outer surface A Stacking direction B Lateral direction C Lateral direction H Height of sealing structure W Width of sealing structure S(i) Steps of a method for manufacturing a package unit for a semiconductor power module

Claims

A package unit (2) for a semiconductor power module (1) comprising: - a molded body (3) configured to enclose electrical components of the semiconductor power module (1), and - at least one terminal (10) partially integrated and embedded in the molded body (3) such that the at least one terminal (10) extends through the molded body (3) and an end portion (11) of the at least one terminal (10) is exposed to an upper surface (6) of the molded body (3) with respect to a stacking direction (A) of the semiconductor power module (1), wherein the at least one terminal (10) further comprises at least one sealing structure (13, 14) disposed in a boundary region (5) between the exposed end portion (11) and a molding edge (4) of the molded body (3), wherein the sealing structure (13, 14) is configured to limit an upper extension of the molded body (3), wherein the sealing structure comprises at least one recess (13) formed on an outer surface (15) of the at least one connector, and wherein the at least one recess (13) comprises a height (H) with a value of 0.1-2.0 mm with respect to the stacking direction (A) and / or a width (W) with a value of 0.1-2.0 mm with respect to the lateral direction (B, C) and each with respect to the outer surface (15) of the at least one connector (10) next to the respective sealing structure (13, 14).The housing unit (2) according to claim 1, wherein the sealing structure (13, 14) is formed on an outer surface (15) of the at least one terminal (10) such that it partially or completely surrounds the terminal (10) with respect to a lateral direction (B, C) perpendicular to the stacking direction (A).Housing unit (2) according to Claim 1 or 2, wherein the shaped edge (4) of the shaped body (3) extends into the at least one recess (13).The housing unit (2) according to any one of the preceding claims, wherein the sealing structure comprises at least one protrusion (14) formed on an outer surface (15) of the at least one terminal (10).Housing unit (2) according to claim 4, wherein the at least one protrusion (14) delimits an upper extension of the shaped edge (4) of the shaped body (3) with respect to the stacking direction (A).The housing unit (2) according to any one of the preceding claims, wherein the at least one terminal (10) comprises two or more sealing structures (13, 14) formed in the boundary area (5) between the exposed end portion (11) and the shaped edge (4) of the molded body (3), wherein each of the sealing structures (13, 14) comprises a recess (13) and / or a protrusion formed on an outer surface (15) of the at least one terminal (10).Housing unit (2) according to one of the preceding claims, wherein the sealing structure (13, 14) is formed integrally with the connection (10).The housing unit (2) according to any one of the preceding claims, wherein the sealing structure (13, 14) is formed with at least one of a square, rectangular, trapezoidal, semicircular and triangular shape with respect to a cross section along the stacking direction (A).Housing unit (2) according to one of the preceding claims, wherein the at least one connection (10) is solid or hollow and comprises an elongate shank (12) with at least one of a cylindrical, cuboidal and / or ellipsoidal shape with respect to the stacking direction (A).A semiconductor power module (1) comprising: - a package unit (2) according to any of the preceding claims, and - electrical components arranged inside the package unit (2).The semiconductor power module (1) according to claim 10, comprising an insulated substrate structure having an insulation layer and at least one metallization layer, wherein the insulated substrate structure is electrically coupled to the package unit (2) by means of the at least one terminal (10).

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