ELECTRONICS MODULE WITH A PULSE CULSING HEATPIPE

Description

[0001] The invention relates to an electronic module having a pulsating heat pipe.

[0002] With the increasing miniaturization of microelectronics, the power density of electronic modules and thus the heat flux density generated by the electronic modules are increasing. High-performance electrical components such as power semiconductors already generate thermal losses with heat flux densities exceeding 100 W / cm², and this trend is rising. To prevent electronic failures due to thermal overload, increasingly effective concepts for cooling electrical components are needed.

[0003] US 2018 / 0158756 A1 discloses an integrated circuit device comprising at least one semiconductor device arranged on a substrate, wherein the substrate has a pulsating heat pipe formed therein.

[0004] A pulsating heat pipe (PHP), also known as an oscillating heat pipe (OHP), is a heat transfer device with a closed channel structure containing a heat transfer medium that alternates between vapor and liquid segments along the channel structure due to the surface tension of the heat transfer medium. These vapor and liquid segments are caused to pulsate or oscillate by a temperature gradient. At a heat source, the vapor segments expand due to the higher temperature; moreover, the liquid heat transfer medium boils there, absorbing latent heat. At a heat sink, the vapor segments shrink due to condensation of the gaseous heat transfer medium, releasing latent heat. The local temperature and pressure differences drive the constant pulsation or oscillation of the vapor and liquid segments.

[0005] The prior art is described in documents EP3336471 A1 and US5268812 A.

[0006] The invention is based on the object of providing an improved electronic module with a pulsating heat pipe.

[0007] The object is achieved according to the invention by an electronic module having the features of claim 1 and a method for producing such an electronic module having the features of claim 14.

[0008] Advantageous embodiments of the invention are the subject of the subclaims.

[0009] An electronic module according to the invention comprises a pulsating heat pipe with a channel structure in which a heat transport medium is arranged, and at least one electrical component which is in direct contact with the heat transport medium and / or is connected to an electrically conductive contact element which is in direct contact with the heat transport medium.

[0010] A pulsating heat pipe exhibits a significantly higher effective thermal conductivity than, for example, a comparably sized solid heat sink. Furthermore, a pulsating heat pipe operates independently of its position and is purely passive, requiring no moving components such as pumps or a power supply. This ensures high operational safety and reliability. Furthermore, a pulsating heat pipe can be designed very flat and compact, for example, with a maximum thickness of 3 mm. These properties make a pulsating heat pipe particularly suitable for heat dissipation from electrical components with a high power density, such as power semiconductors.In an electronic module according to the invention, the heat transfer medium of a pulsating heat pipe is in direct contact with at least one electrical component and / or with an electrically conductive contact element connected to at least one electrical component. This improves the thermal contact of the heat transfer medium with the electrical component and increases the heat dissipation from the electrical component through the pulsating heat pipe.

[0011] In one embodiment of the invention, the pulsating heat pipe is plate-shaped. In another embodiment of the invention, the channel structure has at least one meandering channel. In another embodiment of the invention, the channel structure is planar. These embodiments of the invention enable a high heat spreading effect of the pulsating heat pipe through a large-area design of the pulsating heat pipe or its channel structure.

[0012] In a further embodiment of the invention, the pulsating heat pipe comprises at least one ceramic body that forms the walls of the channel structure, separating the channel sections of the channel structure from one another. Forming the channel structure by at least one ceramic body advantageously enables an electrically insulating design of the base body of the pulsating heat pipe with good thermal properties in terms of thermal conductivity and thermal resistance of the base body.

[0013] In a further embodiment of the invention, the pulsating heat pipe has an electrically conductive cover element in contact with the heat transport medium, on which at least one electrical component is arranged and which closes the channel structure in a cover-like manner, at least in an area surrounding the electrical component. The cover element can simultaneously achieve high heat spreading and heat transfer to the heat transport medium of the pulsating heat pipe for dissipating heat from an electrical component arranged on the cover element, and electrical contact with the electrical component. The pulsating heat pipe with the cover element can in particular form a so-called DCB structure (DCB = direct copper bonded) for at least one electrical component, in which the base body of the pulsating heat pipe functions as the substrate and a cover element made of copper functions as the electrically conductive structure.

[0014] In a further embodiment of the invention, the cover element has at least one recess in the region of at least one electrical component arranged thereon, through which the channel structure of the pulsating heat pipe is connected to a surface of the electrical component, so that the heat transfer medium is in direct contact with the surface of the electrical component. Such a recess in the cover element advantageously increases the heat transfer from an electrical component to the heat transfer medium through the direct contact of the heat transfer medium with the electrical component.

[0015] In the embodiment of the invention, the cover element is made of a metal, in particular copper, or an alloy. This advantageously allows for simultaneous good thermal and electrical conductivity of the cover element.

[0016] In a further embodiment of the invention, the pulsating heat pipe has a support element that closes the channel structure on a side opposite the cover element. In particular, the support element can be made of the same material as the cover element. This can advantageously prevent or reduce, for example, bending of the pulsating heat pipe due to different thermal expansion coefficients of the cover element and the base body of the pulsating heat pipe.

[0017] In a further embodiment of the invention, at least one electrical component is arranged in the channel structure of the pulsating heat pipe, so that the heat transfer medium flows around it. This embodiment of the invention enables particularly efficient heat dissipation of an electrical component through large-area contact between the electrical component and the heat transfer medium.

[0018] In a further embodiment of the electronic module (not claimed), the pulsating heat pipe has a circuit board that closes at least one region of the channel structure in a lid-like manner and has at least one conductor track that is electrically connected to an electrical component arranged in the channel structure. Such a circuit board advantageously enables the electrical contacting of an electrical component arranged in the channel structure.

[0019] In a further embodiment of the invention, the heat transfer medium is an electrically non-conductive fluid, in particular perfluoro-N-alkylmorpholine. Designing the pulsating heat pipe with an electrically non-conductive heat transfer medium prevents electrical connections between electrical components or with other electrical components through the heat transfer medium. Due to its high thermal conductivity, boiling point, and dielectric properties, perfluoro-N-alkylmorpholine is suitable as a heat transfer medium for an electronic module according to the invention.An electrically conductive fluid, such as water, acetone or methanol, can only be used as a heat transport medium if electrical components are not electrically connected to one another by the heat transport medium, for example if a separate channel of the channel structure is provided for each electrical component that is not connected to the channels of other electrical components.

[0020] In a further embodiment of the invention, at least one electrical component is a power semiconductor. This embodiment of the invention takes into account that power semiconductors have particularly high power densities and therefore require particularly good heat dissipation.

[0021] In the method according to the invention for producing an electronic module according to the invention, the pulsating heat pipe is filled with the heat transfer medium through at least one filling opening after all electrical components have been mounted, and each filling opening is closed after filling. The method takes into account that the pulsating heat pipe may not withstand the high process temperatures during the assembly of electrical components and is therefore advantageously filled only after all electrical components have been mounted. If the pulsating heat pipe has an electrically conductive cover element, each filling opening is preferably formed in the cover element and is closed after filling, for example by soldering or laser welding.This embodiment of the method takes into account that a filling opening in the lid element can be hermetically sealed more easily than, for example, a filling opening in a ceramic body, where hermetic sealing at moderate temperatures that do not damage the ceramic body represents a challenge.

[0022] In a further embodiment of the method according to the invention, the pulsating heat pipe is at least partially produced by 3D printing. If the pulsating heat pipe has at least one ceramic body, each ceramic body is produced by 3D printing, for example. If the pulsating heat pipe has a cover element, the cover element can also be produced by 3D printing (alternatively or additionally). This embodiment of the method enables, in particular, the production of geometrically complex channel structures that cannot be produced using conventional manufacturing processes or can only be produced with considerable effort.

[0023] The above-described properties, features, and advantages of this invention, as well as the manner in which they are achieved, will become clearer and more readily understood in connection with the following description of exemplary embodiments, which are explained in more detail in conjunction with the drawings. FIG 1 shows a first embodiment of an electronic module in a first sectional view, FIG 2 shows Figure 1 shown electronic module in a second sectional view, FIG 3 a second embodiment of an electronic module in a sectional view, FIG 4 a third embodiment of an electronic module in a sectional view.

[0024] Corresponding parts are provided with the same reference numerals in the figures.

[0025] Figure 1 (FIG 1 ) and Figure 2 (FIG 2) show a first embodiment of an electronic module 1 according to the invention in two sectional views with mutually orthogonal sectional planes. The electronic module 1 comprises a pulsating heat pipe 3 and an electrical component 5.

[0026] The pulsating heat pipe 3 has a planar channel structure 7 in which a heat transport medium 9 is arranged. The channel structure 7 is designed as a meandering, closed channel. Along the channel, the heat transport medium 9 forms alternating vapor segments 11, in which the heat transport medium 9 is present in a gaseous phase, and liquid segments 13, in which the heat transport medium 9 is present in a gaseous phase. The vapor segments 11 and liquid segments 13 are excited to pulsating or oscillating movements in the channel by temperature gradients. For example, the heat transport medium 9 is perfluoro-N-alkylmorpholine.

[0027] The channel structure 7 is formed by two ceramic bodies 15, 16, an electrically conductive cover element 17, and a support element 18. The ceramic bodies 15, 16 form walls of the channel structure 7, which separate the channel sections from one another. The channel has, for example, a cross-section with a diameter of at most 1 mm. The walls between adjacent, parallel channel sections have, for example, a thickness of at most 0.1 mm. Furthermore, a ceramic body 15 forms an outer frame of the channel structure 7. The cover element 17 closes the channel structure 7 in a cover-like manner on one side of the pulsating heat pipe 3. The cover element 17 is made, for example, of copper and designed as a copper layer, copper plate, or copper foil. The support element 18 closes the channel structure 7 on a side of the pulsating heat pipe 3 opposite the cover element 17.The carrier element 18 is also made of copper, for example, and is designed as a copper layer, copper plate or copper foil.

[0028] The electrical component 5 is, for example, a power semiconductor, e.g., a MOSFET or an IGBT. The electrical component 5 is arranged on the cover element 17 and is electrically conductively and materially connected to the cover element 17 by a solder connection 20. The cover element 17 is in direct contact with the heat transfer medium 9 below the electrical component 5, thereby enabling good heat conduction from the electrical component 5 to the heat transfer medium 9. The heat transfer medium 9 absorbs heat generated by the electrical component 5, in particular in the form of latent heat by evaporation of liquid heat transfer medium 9, and conducts the heat to a heat sink at another location in the channel structure 7, where the heat transfer medium 9 releases heat, in particular in the form of latent heat by condensation of gaseous heat transfer medium 9.

[0029] The cover element 17 has a filling opening 19 through which the channel structure 7 is filled with the heat transfer medium 9. After the channel structure 7 has been filled, the filling opening 19 is closed with a filling material 21, for example by soldering or laser welding.

[0030] Figure 3 (FIG 3 ) shows a second embodiment of an electronic module 1 according to the invention in a Figure 1 analog sectional view. This embodiment differs from the one shown in the Figures 1 and 2 illustrated embodiment merely in that the cover element 17 has two recesses 23, 24 in the region of the electrical component 5, through which the channel structure 7 is connected to a surface 25 of the electrical component 5, so that the heat transport medium 9 is in direct contact with the surface 25.

[0031] Figure 4 (FIG 4) shows a third embodiment of a non-claimed electronic module 1 in the area of ​​an electrical component 5 in a Figure 1 analog sectional view. The electronic module 1 has, as shown in the Figures 1 to 3 In addition to the electrical component 5, the embodiments shown comprise a pulsating heat pipe 3 with a channel structure 7 and a heat transport medium 9 arranged in the channel structure 7 for absorbing and transporting away heat generated by the electrical component 5. In contrast to the embodiments shown in the Figures 1 to 3 However, in the embodiments shown, the electrical component 5 is arranged in the channel structure 7 of the pulsating heat pipe 3, so that it is surrounded by the heat transport medium 9. Another difference to the embodiments shown in the Figures 1 to 3A feature of the embodiments shown is that the channel structure 7 is closed by a circuit board 27 instead of an electrically conductive cover element 17. The circuit board 27 has conductor tracks 29, 30, 31 that are electrically connected to the electrical component 5. The electrical component 5 is arranged on an electrically conductive carrier 33, which is connected to the carrier element 18 by fastening pins 35 and is made of copper, for example. The carrier element 18 is made of a metal.

[0032] The exemplary embodiments of an electronic module 1 according to the invention shown in the figures can be modified in various ways to form further exemplary embodiments. For example, instead of just one electrical component 5, the electronic module 1 can each have several electrical components 5, each as shown in Figure 1 via an electrically conductive cover element 17 or as in the Figures 3 or 4are in direct thermal contact with the heat transport medium 9, wherein in particular one or more of the electrical components 5 can also be in direct thermal contact with the heat transport medium 9 via a cover element 17 and one or more of the electrical components 5 can be in direct thermal contact with the heat transport medium 9. Furthermore, the pulsating heat pipe 3 can be closed on the underside by a ceramic body 15, 16 instead of by a support element 18, which also forms walls of the channel structure 7. In particular, the pulsating heat pipe 3 can have only one ceramic body 15, 16, which forms both the bottom and the walls of the pulsating heat pipe 3. Alternatively, the pulsating heat pipe 3 can have more than just two ceramic bodies 15, 16, in particular in order to realize a geometrically complex channel structure 7. Furthermore, the Figures 1 to 3The embodiments shown can be modified in such a way that the channel structure 7 is only partially closed on the upper side by at least one electrically conductive cover element 17, while other areas of the channel structure 7 are each closed by an electrically insulating element or the ceramic body(s) 15, 16 are designed to be closed on the upper side in these areas. Furthermore, the channel structure 7 can be designed differently than in Figure 2 For example, the channel structure 7 can have multiple channels and / or one or more star-shaped or rosette-shaped channels.

Claims

1. Electronic module (1), comprising - a pulsating heat pipe (3) with a channel structure (7), in which a heat transport medium (9) is arranged, and - at least one electrical structural element (5), which is in direct contact with the heat transport medium (9) and / or is connected to an electrically conductive contact element (17,33) that is in direct contact with the heat transport medium (9), characterised in that the channel structure (7) is formed of ceramic bodies (15, 16), a metallic cover element (17) and a metallic carrier element (18).

2. Electronic module (1) according to claim 1, wherein the pulsating heat pipe (3) is embodied in a plate-like manner.

3. Electronic module (1) according to claim 1 or 2, wherein the channel structure (7) has at least one channel running in a meandering manner.

4. Electronic module (1) according to one of the preceding claims, wherein the channel structure (7) is embodied in a planar manner.

5. Electronic module (1) according to one of the preceding claims, wherein the pulsating heat pipe (3) has at least one ceramic body (15,16), which forms walls of the channel structure (7) that separate the channel sections of the channel structure (7) from one another.

6. Electronic module (1) according to one of the preceding claims, wherein the pulsating heat pipe (3) has an electrically conductive cover element (17), which is in contact with the heat transport medium (9) and on which at least one electrical structural element (5) is arranged and which, at least in a surrounding area of the electrical structural element (5), closes off the channel structure (7) in the manner of a cover.

7. Electronic module (1) according to claim 6, wherein the cover element (17) has, in the region of at least one electrical structural element (5) arranged on it, at least one recess (23,24), through which the channel structure (7) of the pulsating heat pipe (3)is connected to a surface (25) of the electrical structural element (5), meaning that the heat transport medium (9) is in direct contact with the surface (25) of the electrical structural element (5).

8. Electronic module (1) according to claim 6 or 7, wherein the cover element (17) is made of a metal, in particular copper, or an alloy.

9. Electronic module (1) according to one of claims 6 to 8, wherein the pulsating heat pipe (3) has a carrier element (18), which closes off the channel structure (7) on a side opposite the cover element (17).

10. Electronic module (1) according to claim 9, wherein the carrier element (18) is made of copper.

11. Electronic module (1) according to one of the preceding claims, wherein at least one electrical structural element (5) is arranged in the channel structure (7) of the pulsating heat pipe (3), meaning that the heat transport medium (9) is able to flow around it.

12. Electronic module (1) according to one of the preceding claims, wherein the heat transport medium (9) is an electrically non-conductive fluid, in particular perfluoro-N-alkyl-morpholine.

13. Electronic module (1) according to one of the preceding claims, wherein at least one electrical structural element (5) is a power semiconductor.

14. Method for producing an electronic module (1) embodied according to one of the preceding claims, wherein the pulsating heat pipe (3) is filled with the heat transport medium (9) through at least one filling opening (19) once all electrical structural elements (5) have been installed, and each filling opening (19) is closed off after the filling.

15. Method according to claim 14, wherein the pulsating heat pipe (3) is at least partially produced by 3D printing.