BENDING DEVICE AND BENDING METHOD FOR TWO-DIMENSIONAL BENDING OF AN ELECTRICAL CONDUCTOR

Description

[0001] The invention relates to a bending device for the two-dimensional bending of an electrical conductor in or parallel to a bending plane. Furthermore, the invention relates to a bending method for the two-dimensional bending of an electrical conductor in or parallel to a bending plane. Furthermore, the invention relates to a computer program product with control instructions for performing such a bending method.

[0002] Embodiments of the invention relate to devices and methods for carrying out a forming step of an electrical conductor during the series production of a component of an electrical machine.

[0003] For the state of the art and technological background, please refer to the following literature: [1] DE 10 2018 103 926 A1 [2] DE 10 2018 114 875 A1 [3] DE 10 2018 106 980 A1 [4] US 2018 / 0182544 Al [5] DE 10 2018 106 980 A1 [6] JP ​​6423931 B1 [7] Wikipedia article "Drop bending", downloaded from https: / / de.wikipedia.org / wiki / Gesenkbiegen, on 07.07.2020 [8] US 2014 / 300236 A1 [9] JP 2011 036874 A

[10] US 2011 / 278980 A1

[11] DE 11 2014 006245 T5

[0004] References [1] and [2] describe examples of series production of a component of an electrical machine with conductors that are formed in one of several forming steps according to the two-dimensional bending process under discussion here. The conductors are bent into a hairpin shape. Due to their hairpin shape, the conductors are also called hairpins. The term "pin," derived from "hairpin," is also used below as a synonym for conductor. Embodiments of the invention deal with the two-dimensional bending, in particular of U-shaped or I-shaped conductors, which are also referred to below as U-pins and I-pins, respectively.

[0005] References [3] and [4] disclose devices and methods for so-called rotary draw bending, in which a conductor is bent around a bending surface in a single bending unit by means of a detection element moving on a circular path.

[0006] References [5] and [6] as well as [9] disclose devices and methods in which conductors are bent into wave-shaped wires by means of a bending chain.

[0007] References [7],

[10] , and

[11] describe forming by die bending, in which forming occurs between a movable punch and a die, with a forming surface on the punch and a complementary forming surface on the die. Die bending is typically used for bending sheet metal. According to references

[10] and

[11] , die bending with the fixed forms on the punch and forming surface can also be used for bending conductors during the production of a stator winding coil.

[0008] In reference [8], which discloses the features of the preamble of the independent claims, a conductor is formed on bending units with preforms. Outer first and second bending units each have a gripping element for bending the conductor around the preforms. The gripping elements perform only linear movements toward the preform. The preforms are described as fixed points that are stationary during the bending process. A fixed, complex shape of a winding head of a stator winding can be repeatedly produced on a number of conductor pieces.

[0009] The object of the invention is to provide a bending device and a bending method for the two-dimensional bending of an electrical conductor in or parallel to a bending plane, with which the bending can be carried out at high cycle rates and relatively quickly, yet adaptable to different dimensions and bending shapes.

[0010] To achieve this object, the invention provides a bending device and a bending method according to the independent claims.

[0011] Advantageous embodiments are the subject of the subclaims.

[0012] According to a first aspect thereof, the invention provides a bending device for the two-dimensional bending of an electrical conductor in or parallel to a bending plane, comprising a first and a second bending unit and a relative movement device for the relative movement of the first and second bending units in or parallel to the bending plane, wherein each bending unit has a forming surface body extending transversely to the bending plane with a peripheral surface designed as a forming surface for forming a bending region of the conductor, wherein the first bending unit has a first detection element and a second detection element and the second bending unit has a first detection element and a second detection element,wherein the first and second detection elements of the first bending unit are movable relative to one another and are each movable along a movement path around the circumferential surface of the forming surface body of the first bending unit for detecting a first bending region and for bending the first bending region around the forming surface body of the first bending unit, wherein the first detection element and the second detection element of the second bending unit are movable relative to one another and are each movable along a movement path around the circumferential surface of the forming surface body of the second bending unit for detecting a second bending region and for bending the second bending region around the forming surface body of the second bending unit.

[0013] It is preferred that a third bending unit is provided, which also has a forming surface body extending transversely to the bending plane with a peripheral surface designed as a forming surface for forming a third bending region of the conductor and a first detection element or a first and a second detection element, wherein the detection element(s) are movable along a movement path around the peripheral surface or with at least one directional component parallel to a tangent on the peripheral surface for detecting and / or bending the third bending region around the forming surface body of the third bending unit, wherein the relative movement device is designed for the relative movement of the first to third bending units in or parallel to the bending plane.

[0014] It is preferred that the relative movement device comprises a first movement device for moving the first bending unit in the bending plane.

[0015] It is preferred that the relative movement device comprises a second movement device for moving the second bending unit in the bending plane.

[0016] It is preferred that the relative movement device comprises a third movement device for moving the third bending unit in the bending plane.

[0017] It is preferred that the relative movement device is designed for linearly moving at least one, several or all of the bending units.

[0018] It is preferred that the relative movement device comprises first to third movement units which are designed to move relative to one another, wherein the first bending unit is arranged on the first movement unit, the second bending unit is arranged on the second movement unit and the third bending unit is arranged on the third movement unit.

[0019] It is preferred that each bending unit has the forming surface body as a bending element and its detection elements are designed as rotation elements rotatable about a central axis of the forming surface body.

[0020] It is preferred that the peripheral surface has a circular or circular segment-shaped contact surface, seen in axial plan view with respect to a central axis of the shaped surface body, the center of which corresponds to the center of the bend.

[0021] According to the invention, it is provided that the first and second detection elements of a respective bending unit are movable relative to one another.

[0022] It is preferred that the first and second detection elements are movable to bend the conductor around the forming surface body.

[0023] It is preferred that the first and / or the second detection element have a flat detection surface for holding and / or shaping the conductor.

[0024] It is preferred that the first and second detection elements of at least one of the bending units abut one another in a basic position and are movable away from one another from the basic position.

[0025] According to the invention, it is provided that the movement path of the first and / or second detection element of at least one, several or all of the bending units is a curved curve leading around the circumferential surface.

[0026] It is preferred that the movement path of the first and / or second detection element of at least one, several or all of the bending units leads in an angular range of more than 180° around the forming surface body.

[0027] It is preferred that the first and / or second detection element of at least one, several, or all of the bending units is movable by 360° around the forming surface body. It is preferred that the first detection element is circularly movable around a central axis of the forming surface body. The curved movement path of the first forming surface body, thus configured as a circular path, further preferably extends by more than 180°, in particular by 360°, around the forming surface body.

[0028] It is preferred that the second detection element is circularly movable around a central axis of the forming surface body. The curved movement path of the second forming surface body, thus configured as a circular path, further preferably extends by more than 180°, in particular by 360°, around the forming surface body.

[0029] The term "trajectory" of the sensing elements refers to the possible trajectory along which the sensing elements can move. The sensing elements are guided in such a way that they can move more than 180° around the mold surface. This allows a wide range of bends to be achieved. Of course, the entire trajectory does not have to be utilized during bending processes; for example, bending processes can be programmed where the sensing elements only use a portion of their possible trajectory.

[0030] It is preferred that the first and third bending units are movable toward and away from each other along a first linear movement direction and that the second bending unit arranged between the first and third bending units is movable in a second linear movement direction extending transversely to the first movement direction.

[0031] It is preferred that the movement of the detection elements of different bending units can be moved and / or controlled differently.

[0032] According to a further aspect, the invention provides a bending method for the two-dimensional bending of an electrical conductor in or parallel to a bending plane, comprising: inserting the conductor into a bending device according to one of the preceding embodiments, which is in a basic position, and bending the conductor by relatively moving the bending units and moving the detection elements of the bending units along the movement path.

[0033] In a first preferred embodiment, which preferably serves for bending a U-shaped conductor, the bending method preferably comprises the step: a) Setting the basic position such that all forming surface bodies of the first to third bending units are arranged on one side of the conductor to be bent and all detection elements of the first to third bending units are arranged on the other side of the conductor to be bent.

[0034] In the first preferred embodiment, the bending method preferably comprises the step: b) moving the first and third bending units towards each other in a first direction of movement and moving the second bending unit arranged between the first and third bending units away from the first and third bending units in a second direction of movement running transversely to the first direction of movement.

[0035] In the first preferred embodiment, the bending method preferably comprises the step of: c) rotating the first and second detection elements of the second bending unit away from each other in opposite directions of rotation.

[0036] In the first preferred embodiment, the bending method preferably comprises the step: d) removing the finished bent conductor.

[0037] In the first preferred embodiment, the bending method preferably comprises the step: e) returning the bending device to the basic position after removal of the completely bent conductor.

[0038] Preferably, the first embodiment of the bending method comprises all of the above-mentioned steps a) to e). Preferably, in the first embodiment, the bending method is performed in the sequence of steps a) to e) and then repeated with a new conductor.

[0039] In a second preferred embodiment, which preferably serves for bending a particularly bent I-shaped conductor, the bending method preferably comprises the step: i) Setting the basic position such that the forming surface body of the first bending unit and the detection elements of the second bending unit are arranged on one side of the conductor to be bent and the forming surface body of the second bending unit and the at least one detection element of the first bending unit are arranged on the other side of the conductor to be bent.

[0040] In a second preferred embodiment, which preferably serves for bending a particularly bent I-shaped conductor, the bending method preferably comprises the step: ii) moving the first bending unit in a first direction of movement towards the second bending unit and moving the second bending unit away from the first bending unit in a second direction of movement running transversely to the first direction of movement.

[0041] In a second preferred embodiment, which preferably serves for bending a particularly bent I-shaped conductor, the bending method preferably comprises the step: iii) rotating the at least one detection element of the first bending unit, in particular by rotating the first and second detection elements of the first bending unit away from each other in opposite directions of rotation, and rotating the first and second detection elements of the second bending unit away from each other in opposite directions of rotation.

[0042] In a second preferred embodiment, which preferably serves for bending a particularly bent I-shaped conductor, the bending method preferably comprises the step: iv) rotating the at least one detection element of the first bending unit opposite to the rotation of the detection elements of the second bending unit.

[0043] In a second preferred embodiment, which preferably serves for bending a particularly bent I-shaped conductor, the bending method preferably comprises the step: v) removing the elements of the third bending unit, if present on the bending device, from the bending path of the conductor for the entire bending process.

[0044] In a second preferred embodiment, which preferably serves for bending a particularly bent I-shaped conductor, the bending method preferably comprises the step: vi) removing the finished bent conductor.

[0045] In a second preferred embodiment, which preferably serves for bending a particularly bent I-shaped conductor, the bending method preferably comprises the step of: returning the bending device to the basic position after removal of the completely bent conductor.

[0046] The second embodiment of the bending method preferably comprises all of the above-mentioned steps i) to vi). In the second embodiment, the bending method is preferably carried out in the sequence of steps v), i) to iv) and vi), wherein the sequence of steps i) to iv) and vi) is then preferably repeated with a new conductor. If the bending method according to the second embodiment is carried out with a bending device which, in the basic position, has a middle and two outer bending units, one of the two outer bending units can optionally serve as the first bending unit, the middle one as the second bending unit, and the other outer bending unit as the third bending unit. Depending on the selection of one or the other outer bending unit as the first bending unit, a bend can occur on one side or the other.

[0047] Preferably, the first and second detection elements of the respective bending unit abut one another in the basic position according to one or more of the previously explained embodiments of the bending method.

[0048] Preferably, a bending device according to one of the embodiments described above comprises a controller which is configured to control the bending device to carry out the bending method according to one of the preceding embodiments.

[0049] Preferably, the movement units of the relative movement device each have their own actuator, with which the movement of one of the bending units is driven, and the at least one detection element of each bending unit is driven by a further actuator, and the controller is designed to control each of the actuators.

[0050] According to a further aspect, the invention provides a computer program product comprising machine-readable control instructions which, when loaded into a controller of a bending device according to one of the embodiments described above, cause the bending device to carry out the bending method according to one of the preceding embodiments.

[0051] Advantages of preferred embodiments of the invention are explained in more detail below.

[0052] Embodiments of the invention relate to devices and methods for synchronously bending wire for the production of machine elements of electrical machines.

[0053] A preferred embodiment of the bending device has three movement units that move relative to one another. A bending unit is located on each movement unit. The bending units are thus moved relative to one another by means of the respective movement unit. Each bending unit has a forming surface body and a first and a second detection element. In some embodiments, a middle bending unit has the first and the second detection element, while one or both of the outer bending units have only one detection element. The detection elements are preferably constructed as rotary elements that can rotate about a rotational axis.

[0054] The forming surface preferably has a round contact surface—the peripheral surface, which serves as the forming surface—and a center point that corresponds to the center of the bend. The wire is formed during the process around the forming surface, which acts as a bending element.

[0055] The first and second engagement elements, preferably designed as rotating elements, can move relative to each other. The center of rotation of the two rotating elements preferably corresponds to the center of the forming surface. The engagement elements form the wire around the forming surface, which acts as a bending element. The engagement elements are designed to bend the wire and / or hold it in place to prevent undesired deformation of the wire.

[0056] The movements of the movement units and the movements of the detection elements are not mechanically coupled to one another, but are preferably individually adjustable or programmable. The bending device preferably has at least one actuator per movement unit and at least one further actuator per movement unit for the detection element(s). Preferably, a first detection element actuator is provided for moving the first detection element and a second detection element actuator is provided for moving the second detection element.

[0057] Advantages of preferred embodiments of the invention are: Very short cycle times are possible because all bends are made simultaneously and the stroke of the movement units is very small. Preferably, the maximum stroke of the movement units corresponds to the stroke in a comparable bending process using a die bending process known from [7]. Maximum flexibility: for example, U-pins and I-pins in a wide variety of dimensions can be produced on a preferred system. The bending device can be easily integrated into a larger production system for manufacturing a component. In particular, the coordinate axes of the bending device and the production system can be easily combined. For example, in a preferred embodiment of the bending device, the horizontal coordinate axis is at the height of the two leg bends (x-axis), and the vertical coordinate axis is at the roof peak (y-axis). Repeatable bending at the defined forming points is possible.There is only minimal relative movement between the tool and the workpiece. This reduces or eliminates the risk of damage to the conductor or its insulation. Adjustments, e.g., during commissioning, are possible without modification, but simply by adjusting the bending parameters in the stored control software. Thus, the bending devices and the bending process according to embodiments of the invention are very user-friendly during commissioning and during operation.

[0058] In contrast to previously known bending processes, such as those described in [8], with multiple bending elements, several gripping elements each move along a path around the circumferential surface of the forming surface body. This enables precise bends with great flexibility.

[0059] Similar cycle times can be achieved as with die bending, and only a short stroke is required, as with die bending. Also, similar to die bending, a very high level of repeatability can be achieved. However, the bending process according to embodiments of the invention is much more flexible than die bending; for example, other shapes or dimensions of the formed conductor can be achieved simply by changing the bending parameters - in particular the movement stroke of movement units and detection elements. Furthermore, relative movements can be avoided. In embodiments of the invention, the structure is simple, yet undercuts in the pin geometry and overbends can also be achieved without high tooling costs.Unlike die bending, where each change must be made using a new tool, embodiments of the invention can easily achieve changes and corrections in the geometry of the bent conductors simply by changing the movement parameters of the bending units and detection elements.

[0060] Although rotary draw bending according to [3] and [4] allows for greater flexibility and less relative movement than die bending, this can only be achieved with a much longer cycle time depending on the number of bends to be performed. In addition, coordinate axes and the information obtained from coordinates via the pin shape are difficult to integrate into an overall component manufacturing process. These disadvantages of a rotary draw bending process are overcome by embodiments of the invention. Embodiments of the invention thus combine the advantages of die bending and rotary draw bending without having their disadvantages. As with rotary draw bending, preferred embodiments of the invention enable a very flexible forming process in which each bending parameter can be very easily adjusted by changing the control system. Adjustment options are possible during commissioning without modification.The relative movements between the tool and the wire are very small. Forming is only applied where required. Nevertheless, high cycle times are possible, especially because multiple bends can be applied at once.

[0061] As with bending chains, all bends can be performed simultaneously with embodiments of the invention, and a wire for forming can be guided continuously. The bends with embodiments of the invention are also highly repeatable. However, compared to bending with bending chains, far greater flexibility can be achieved. Individual U-pins and I-pins with different dimensions can also be produced on one system without any modifications. Furthermore, the mechanical outlay is much lower, and the bending device according to embodiments of the invention is easier to integrate into an overall manufacturing system - particularly due to the advantageous possibility of optimally selecting the coordinate axes. Relative movements between the tool and the wire are also much smaller compared to bending chains with embodiments of the invention.Ejecting the finished bent wire is much easier with embodiments of the invention, and the wire is less likely to jam as in a bending chain.

[0062] An exemplary embodiment is explained in more detail below with reference to the attached drawings. They show: Fig. 1 a plan view of two differently dimensioned conductors for a component of an electrical machine, which have been formed into a U-shape or hairpin shape in a bending device, wherein the conductors are shown in a coordinate system of the bending device in an xy plane which represents a bending plane for forming the conductors; Fig. 2a plan view of a first embodiment of the bending device in a view onto the xy plane in a basic position in which a conductor to be formed into the U-shape has just been received in a first to third bending unit of the bending device, as a first step of a bending method for 2D bending the U-shape; Fig. 3 an enlarged plan view of one of the bending units of the bending device of Fig. 2 in a second position; Fig. 4 an enlarged detail from Fig. 2 with a representation of possible movements of the bending units and the xy plane; Fig. 5 a representation like Fig. 3 with a representation of possible movements of detection elements of the bending units; Fig. 6 a representation as in Fig. 4 , in which the possible movements of the bending units and their detection elements are shown; Fig. 7 a representation as in Fig. 4, wherein the bending device is shown in the second position for performing a step of the bending method for forming the conductor into the U-shape; Fig. 8 a top view of the bending device as in Fig. 2 , wherein the bending device is shown in a third position during a further step of the bending process; Fig. 9 a representation comparable to Fig. 5 , wherein the bending device is in a final position during a further step of the bending process in which the conductor receives its final U-shape; Fig. 10 a plan view, viewed on the xy plane, of the first to third bending units of the first embodiment in a basic position for receiving a conductor to be formed into an I-shape (with offset) as a first step of a bending method for 2D bending the I-shape; Fig. 11a plan view of the bending device in a second position for performing a further step of the bending method for 2D bending the I-shape; Figs. 12 and 13 further positions of the bending device for carrying out further steps of the I-shape bending process; and Fig. 14 to 16 Top views of the bending units of the bending device in different positions for performing a variant of the I-shape bending process.

[0063] Fig. 1shows two differently dimensioned examples of a U-pin 14, 14.1, 14.2 as examples of a conductor 12 to be formed in a coordinate system of a bending device 10. A smaller U-pin 14.1 and a larger U-pin 14.2 are shown, both of which can be formed without modifications, simply by changing control parameters in the bending device 10. The other figures show different embodiments of the bending device 10 for two-dimensionally bending the conductor 12 during different steps of different bending methods for two-dimensionally bending the conductor 12 according to embodiments of the invention.

[0064] Embodiments of the invention accordingly relate to a forming step of an electrical conductor 12. It is preferred that the electrical conductor 12 be a continuous material or a material section, for example a wire. The forming step can be carried out essentially independently of the cross-section of the conductor 12. The cross-section can be, for example, rectangular, square, round, oval, etc. In particular, the bending device 10 and the bending method according to embodiments of the invention serve to form an electrical conductor 12 that is later to be used in an electrical machine. Particularly preferably, all shapes of pins can be produced. Due to a preferred field of application in the field of hairpin technology, the focus of preferred embodiments of the invention is on U-pins 14 and I-pins 16.

[0065] Embodiments of the invention are intended in particular to be used in manufacturing processes for the series production of a component of an electrical machine. In preferred manufacturing processes, such as for the production of a stator or rotor of an electric motor to be used as a traction motor for electric vehicles, a distinction is made between several forming steps. This does not rule out the possibility that the forming steps listed below can also be combined in the process or can be introduced into the workpiece at the same time. Nevertheless, the forming steps in the field of hairpin technology (for an explanation of the term and further details of a manufacturing process for a component of an electrical machine using hairpin technology, reference is made to literature references [1] and [2]) can be divided into three steps. The forming steps relate to U-pins 14 and I-pins 16 (with I-pins, jump bending is often omitted).The order of these three forming steps can also vary: The following description refers to the following order: "2D bending" - "jump bending" - "3D bending".

[0066] 2D bending: Usually, three bends (more bends are also possible) are introduced into the starting material at bending areas 36.1, 36.2, 36.3, which transform the conductor 12 - in particular wire - into a U-shaped pin - U-pin 14 - with a roof area 18 with a roof peak 20. For forming I-pins 16 with a bend (see Fig. 13 and 16 ), two bends are performed at bending areas 36.1 and 36.2. All bends are performed in only one dimension, e.g., in the XY plane—referred to below as bending plane 22—hence the designation "2D bend."

[0067] Jump bend:In the 2D formed pin 14, 16, a bend is usually introduced in the roof area 20, which offsets the two legs 24.1, 24.2 of the pin 14, 16 by at least one layer. Layers are the positions of the legs 24.1, 24.2 in the component, for example designed as a stator. Example: If there are four pins in a slot of a stator, the stator has four layers. This means that the first leg 24.1 of the pin 14, 16 in question can be in a different layer than the second leg 24.2 of the same pin 14, 16. This different positioning of the two legs 24.1, 24.2 of a pin 14, 16 is introduced by a further forming step - jump bending - usually in the area of ​​the roof tip 20 of a U-pin 14. The direction of the offset can vary from pin to pin. This forming step is usually omitted for I-pins 16 or layer pins, because jump bending often offers no advantages for these types of pins.Embodiments of devices and methods for jump bending are described and shown in DE 10 2018 106 978 A1, to which reference is expressly made for further details.

[0068] 3D bending:In a further forming step – 3D bending – the roof area 18 of the U-pin 14 or the I-pin 16 ("half" roof) is adapted to the curvature or diameter of the electrical machine. The diameter also depends on the position of the respective pin 14, 16 in the electrical machine (layer of the pin in question). If the pin 14, 16 in question is located further inward, it can be assumed that its diameter must be smaller than a pin 14, 16 located further outward. In other words: Pins 14, 16 of a further inward layer have a lesser curvature in the roof area 18 than pins 14, 16 of a further outward layer. Embodiments of devices and methods for 3D bending are described in DE 10 2018 108 656 A1 and in German patent application 10 2019 134 785.8, to which reference is expressly made for further details.

[0069] These three forming steps allow all pins 14 and 16 of an electrical machine to be arranged very close to one another or positioned within the electrical machine. This influences the efficiency of the electrical machine and also its size (installation space).

[0070] The exemplary embodiments of bending devices 10 and the bending methods that can be carried out therewith, explained in more detail below, deal exclusively with the forming step of 2D bending listed first here, for example, the production of the roof geometry of a U-pin 14 or I-pin 16. The bending device 10 is designed in particular such that it can be adapted to different pin shapes and dimensions without modification and can be integrated particularly well into the aforementioned process chain for producing a component of an electrical machine. In particular, the parameters of the bent pins can already be easily mapped using values ​​of the coordinate system, and the corresponding data can be easily reused. Nevertheless, the structure of the bending device 10 is relatively simple.

[0071] In the Fig. 2 to 16Embodiments of the bending device 10 are shown in different positions for performing bending processes for forming U-pins 14 and I-pins 16.

[0072] As particularly in Fig. 2 As shown, the bending device 10 for forming a pin with three bending regions 36.1, 36.2, 36.3 has a first to third bending unit 26.1, 26.2, 26.3 and a relative movement device 28 for moving the first to third bending units 26.1, 26.2, 26.3 relative to or parallel to the bending plane 22. If more than three bending regions are to be bent, the bending device 10 can also have more than three bending units. If only two bending regions are to be formed, a configuration with only a first and a second bending unit 26.1, 26.2 is also possible.

[0073] In the Fig. 2 to 16In the embodiments shown, the first to third bending units 26.1, 26.2, 26.3 are constructed essentially correspondingly to one another or identically. To explain the construction of the bending units 26.1, 26.2, 26.3 of the Fig. 2 to 16 In the embodiment of the bending device 10 shown, the second bending unit 26.2 is in Fig. 3 shown enlarged.

[0074] As from Fig. 2As can be seen, each bending unit 26.1, 26.2, 26.3 has a shaped surface body 30 and at least one detection element 32, 32.1, 32.2. In the illustrated embodiments, each bending unit 26.1, 26.2, 26.3 has a first and a second detection element 32.1, 32.2, but embodiments (not shown) are also conceivable in which only two of the bending units 26.1, 26.2 have a first and a second detection element 32.1, 32.2, while a preferably outer third bending unit 26.3 has only one of the detection elements 32.1, 32.2, namely preferably the detection element 32.1, 32.2 which in the Fig. 2 shown basic position is arranged further away from the middle bending unit 26.2.

[0075] The forming surface body 30 extends transversely to the bending plane 22 and has a circumferential surface 38 designed as a forming surface 34 for forming one of the bending regions 36.1, 36.2, 36.3 of the conductor 12.

[0076] The peripheral surface 38 extends at least over part of the circumference around the forming surface body 30. More particularly, the peripheral surface 38 extends completely around the forming surface body 30. The forming surface body 30 can be formed from one or more parts. In one embodiment not shown, the forming surface body is divided along at least one plane extending in the z-direction. In embodiments not shown, individual parts of the forming surface body 30 can also be positioned in different positions relative to one another in order to enable different configurations of the bend. For example, a first part and a second part of the forming surface body divided along the plane oriented in the z-direction can lie against one another in a first position and be positioned spaced from one another perpendicular to the parting plane in a second position.A controllable actuator can be provided for positioning the parts of the mold surface body.

[0077] In particular, the shaped surface body 30 is designed as a circular-cylindrical projection protruding in the z-direction from a base 40 of the bending unit 26.1, 26.2, 26.3. However, different shapes and, in particular, curvatures of the circumferential surface 40 deviating from the circular shape would also be conceivable.

[0078] As can be seen from the Fig. 5 and 6 As can be seen, the detection elements 32.1, 32.2 are each movable along a movement path RE A, RE B, RE1.1, RE1.2, RE2.1, RE2.2, RE3.1, RE3.2 around the circumferential surface 40 and serve to detect and / or bend the bending area 36.1, 36.2, 36.3 around the forming surface body 30.

[0079] In the Fig. 2 to 16In the embodiment of the bending device 10 shown, the movement path RE A, RE B, RE1.1, RE1.2, RE2.1, RE2.2, RE3.1, RE3.2 of the detection elements 32.1, 32.2 is curved around the forming surface body 30 and extends in an angular range of more than 180°, in particular completely - by 360° - around the forming surface body 30. In particular, the movement path RE A, RE B, RE1.1, RE1.2, RE2.1, RE2.2, RE3.1, RE3.2, on which the at least one detection element 32.1, 32.2 of the respective bending unit is movable, is guided in a closed ring around the forming surface body.

[0080] The movement paths RE A, RE B, RE1.1, RE1.2, RE2.1, RE2.2, RE3.1, RE3.2 of the first and second detection elements are preferably concentric with one another or superimposed. They are designed such that the first and second detection elements 32.1, 32.2 can be adjacent to one another in one position, preferably a home position, and can move away from one another. This allows a very wide range of bends to be achieved with very good bending results.

[0081] In the Fig. 2 to 16In the illustrated embodiment of the bending device 10, the detection elements 32.1, 32.2 are designed as rotation elements 42.1, 42.2, which are rotatable about the center point M of the circumferential surface 40, so that the movement path RE A, RE B, RE1.1, RE1.2, RE2.1, RE2.2, RE3.1, RE3.2 is each a movement curve, here, for example, circular. The movement curve extends in particular around at least a large part of the angular range around the forming surface body 30 and is more particularly designed in the shape of a closed circular ring.

[0082] In the following, a possible construction of the bending device 10 is described using the first embodiment with reference to the Fig. 2 to 6 explained in more detail.

[0083] As from Fig. 2As can be seen, the relative movement device 28 comprises a first movement device 44.1 for moving the first bending unit 26.1, a second movement device 44.2 for moving the second bending unit 26.2 and a third movement device 44.3 for moving the third bending unit 26.3.

[0084] The movement devices 44.1, 44.2, 44.3 each have a movement unit 45.1, 45.2, 45.3, here in the form of a linearly movable carriage or slide 46, and a linear actuator (not shown) for driving a linear movement of the movement unit 45.1, 45.2, 45.3. The bending unit 26.1, 26.2, 26.3 is arranged on the carriage or slide 46. In particular, the base 40 is attached to the carriage or slide 46.

[0085] As already described above, the forming surface body 30 protrudes from the base 40 as a bending element. Furthermore, a first ring 48.1 and a second ring 48.2 are arranged concentrically with the forming surface body 30 in the base 40 and are rotatably mounted about the central axis M of the forming surface body 30, which is directed in the z-direction. Extensions 50.1, 50.2 protrude from the rings 48.1, 48.2. The upper surfaces of the base 40, the rings 48.1, 48.2, and the extensions 50.1, 50.2 are flush with one another and form a support surface on which the conductor 12 to be formed can be supported from below. At the end region of the extensions 50.1, 50.2, a bending finger 52.1, 52.2 of the respective detection element 32.1, 32.2 protrudes in the z-direction. A rotary actuator (not shown) is attached to each ring 48.1, 48.2 to drive a rotary movement of the respective ring 48.1, 48.2.

[0086] The bending fingers 52.1, 52.2 form further bending elements of the bending unit 26.1, 26.2, 26.3 for bending the conductor 12. They are mirror-symmetrical to one another and have a flat detection surface 54 on the side facing the center point M, which at one end region merges into a detection surface 56, for example, circularly curved. The curved detection surface 56 forms the end of the bending finger 52.1, 52.2 directed away from the other bending finger 52.2, 52.1 in the circumferential direction. The ends 58 of the bending fingers 52.1, 52.2 directed towards one another in the circumferential direction are flat or - in other embodiments not shown - otherwise complementary, so that the bending fingers 52.1, 52.2 with these ends 58 acting as a stop in the Fig. 2 shown basic position can lie close together.

[0087] Furthermore, the bending device 10 has a controller 60 that can individually control actuators of the bending device 10, in particular the linear actuators and the rotary actuators, according to adjustable control parameters. Software with control instructions is loaded into the controller 60, by means of which the bending device 10 is caused to perform the bending processes explained below.

[0088] The bending device 10 thus has three movement units 45.1, 45.2, 45.3, which move relative to each other.

[0089] On each movement unit 45.1, 45.2, 45.3 there is a bending unit 26.1, 26.2, 26.3. The bending units 26.1, 26.2, 26.3 are thus moved relative to each other by means of the respective movement unit 45.1, 45.2, 45.3.

[0090] In the first embodiment of the bending device 10, the bending unit 26.1, 26.2, 26.3 comprises the forming surface body 30 as a bending element and two rotation elements 42.1, 42.2.

[0091] The forming surface body 30 preferably has a round contact surface—forming surface 34—and has a center point M that corresponds to the center of the bend. The conductor 12, which may be formed as a wire, for example, is formed around the forming surface body 30 during the process.

[0092] The two rotational elements 42.1, 42.2 can move relative to each other. Preferably, the center of the rotational movement RE A, RE B of the two rotational elements 42.1, 42.2 corresponds to the center M of the forming surface body 30. The rotational elements 42.1, 42.2 form the conductor 12 around the forming surface body 30. The rotational elements 42.1, 42.2 have the task of bending the conductor 12 and / or counter-holding the conductor 12 to prevent undesired deformation of the conductor 12.

[0093] The distance between the forming surface body 30 and the bending fingers 52.1, 52.2 of the rotation elements 42.1, 42.2 corresponds to the width of the conductor 12 (wire width) plus a defined allowance in order to feed the conductor 12 in a process-reliable manner.

[0094] The design of the bending device 10 is such that the number of axes (i.e., the combination of actuators and the units or elements driven thereby to achieve a respective degree of freedom of movement of the bending device) can be accommodated in a small installation space. In the first embodiment, this is achieved in particular by the arrangement of carriage / slide 46 and the rings 48.1, 48.2. Although these multiple axes or actuators can be controlled individually by the controller 60, they are coordinated with one another in such a way that the following sequences are achieved in order to obtain the desired pin. This can be achieved by appropriate software with setting options for entering the desired pin parameters. For example, the coordinates of the center points of the bending areas 36.1, 36.2, 36.3 can be set as in Fig. 1 clarified, entered.

[0095] It will now Fig. 4 to 6Reference is made to illustrate the movements BE1, BE2, BE3 of the movement units 26.1, 26.2, 26.3 driven by the linear actuators. As can be seen, the first movement unit 45.1, designed, for example, as a carriage or slide 46, is designed to move the first bending unit 26.1 back and forth in the x-direction; the movement of the first bending unit 26.1 is identified as BE1 in the figures. The second movement unit 45.2, also designed as a carriage or slide 46, is designed to move the second bending unit 26.2 back and forth in the y-direction; the movement of the second bending unit 26.2 is identified as BE2 in the figures. The third movement unit 45.3, also designed as a carriage or slide 46, is designed to move the third bending unit 26.3 back and forth in the x-direction; The movement of the third bending unit 26.3 is marked as BE3 in the figures.These movements BE1, BE2, BE3 are controlled by the control 60.

[0096] How Fig. 4 shows, the first and third movement units 45.1, 45.3 move parallel to each other and preferably independently of each other (X-movement), while the second movement unit 45.3 can move at right angles to it (Y-movement).

[0097] Fig. 5 shows how the rotational movements RE A of the first detection element 32.1, designed here as the first rotational element 42.1, and RE B of the second detection element 32.2, designed here as the second rotational element 42.2, are controlled by the controller 60. In Fig. 6 The movements of the bending units (BE) 26.1, 26.2 and the rotation elements (RE) 42.1, 42.2 that can be controlled by the control system 60 are shown in an overview using the corresponding movement paths BE1, BE2, BE3, RE1.1, RE1.2, RE2.1, RE2.2, RE3.1 and RE3.2.

[0098] If you look at Fig. 6, the interaction of motion units 45.1, 45.2, 45.3 and bending units 26.1, 26.2, 26.3 with rotation elements 42.1, 42.2 can be described in more detail. The first and third motion units 45.1, 45.3 can move in the X direction, while the second motion unit 45.2 can move in the Y direction. All rotation elements 42.1, 42.2 of the respective bending units 26.1, 26.2, 26.3 can be moved synchronously around the respective forming surface body 30.

[0099] At the same time, Fig. 6 also those in Fig. 2 The basic position shown is used to carry out a first step of a bending process for two-dimensionally bending the conductor 12 in the bending plane 22 shown here by the xy plane into a U-shape, in order to form the U-pin 14, 14.1, 14.2. This bending process for forming the U-pin 14, 14.1, 14.2 is described below with reference to the illustrations of the Fig. 2 , 3 , 6-9 explained.

[0100] In the Fig. 2 and 6 In the basic position shown, the bending units 26.1, 26.2, and 26.3 are aligned with each other in the x-direction. In particular, the centers M of the circumferential surfaces 40 of the bending units 26.1, 26.2, and 26.3 lie on a line, in particular the x-line (y=0). The center M of the middle bending unit 26.2 in the basic position forms the origin of the coordinate system (x=0, y=0).

[0101] In the Fig. 2 and 6 In the basic position shown, the first and second detection elements 32.1, 32.2 of the respective bending unit 26.1, 26.2, 26.3 are close to one another and preferably lie against one another.

[0102] The engagement elements 32.1, 32.2 are all located on one side of the bending units 26.1, 26.2, 26.3, so that a receiving channel 62 extending in the x-direction is formed between all engagement elements 32.1, 32.2 of the bending units 26.1, 26.2, 26.3 on one side and the forming surface bodies 30 of the bending units 26.1, 26.2, 26.3 on the other side. The second bending unit 26.2 forms the middle bending unit, which is received between the first and second bending units 26.1, 26.3. The first and second bending units 26.1, 26.3 form the outer bending units, whereby it is irrelevant which of the outer bending units is referred to as the first and which as the third bending unit.

[0103] In particular, in the first to third bending units 26.1, 26.2, 26.3, the first and second rotation elements 42.1, 42.2 are in the basic position at 12 o'clock with respect to the forming surface body 30.

[0104] A first step of the bending process involves inserting a wire section as the conductor 12 to be bent using a feed unit (not shown). The outer movement units 45.1, 45.3 are already in the correct X-position: the distance between the outer bending units 26.1, 26.3 defines the leg lengths of the subsequent hairpin. The X-position is defined accordingly.

[0105] In an optional second step of the bending process, the controller 60 controls the rotation actuators such that the rotation elements 42.1, 42.2 of the bending units 26.1, 26.2, 26.3 are rotated away from each other in opposite directions until the bending fingers 52.1, 52.2 grasp and fix the conductor 12. This position is shown in the Fig. 3 and 7shown. In this optional second step (this step is not necessarily relevant), the wire section can be fixed in the bending device 10 by adjusting the rotation elements 32.1, 32.2 (rotational movement) and thus taken over by the feed unit without the wire section losing its position.

[0106] Then, as described in Fig. 8 As shown, the second bending unit 26.2 moves along the y-axis away from the x-axis on which the first and third bending units 26.1, 26.3 move. The first and third bending units 26.1, 26.3 are moved toward each other along the x-axis in the x-direction. This forms the bending regions 36.1, 36.2, 36.3 on the forming surfaces 34. The rotation elements 42.1, 42.2 are adjusted in such a way that they continue to fix and / or reshape the conductor 12.

[0107] In particular, the second bending unit 26.2 is moved in the direction facing the side of the conductor 12 engaged by the gripping elements 32.1, 32.2. Furthermore, the first and second gripping elements 32.1, 32.2 of the middle second bending unit 26.2 are rotated away from each other in opposite directions to assist in forming the roof peak 20 at the second bending region 36.2. The gripping elements 32.1, 32.2 of the first bending unit 26.1 are rotated in one direction to support and guide the first leg 24.1 and the region of the conductor 12 between the first and second bending regions 36.1, 36.2, and eventually to form the first bending region 36.1 around the forming surface 34 of the first bending unit 26.1. The movement of the detection elements 32.1, 32.2 of the third bending unit 26.3 is a mirror image of the movement of the detection elements 32.1, 32.2 of the first bending unit 26.1.

[0108] These previously based on Fig. 8 explained movements are continued until the Fig. 9 shown end position is reached, in which the conductor 12 is bent to the U-pin 14.

[0109] In a concrete embodiment of the bending process, in the third step - forming step - according to the Fig. 8 and 9 The following movements are performed. All of the following movements are coordinated and preferably run simultaneously: Forming step from wire section to U-pin: The first movement unit 45.1 moves in the positive X direction. The first rotation element 42.1 of the first bending unit 26.1 moves counterclockwise - leading in comparison to the second rotation element 42.2 of the first bending unit - around the forming surface body 30 of the first bending unit 26.1. The second rotation element 42.2 of the first bending unit 26.2 moves counterclockwise - lagging in comparison to the first rotation element 42.1 of the first bending unit 26.1 - around the forming surface body 30 of the first bending unit 26.1. The second movement unit 45.2 moves in the positive Y direction. The first rotation element 42.1 of the second bending unit 26.2 moves counterclockwise around the forming surface body 30 of the second bending unit 26.2. The second rotation element 42.2 of the second bending unit 26.2 moves clockwise around the forming surface body 30 the second bending unit 26.2 the third movement unit 45.3 moves in the negative X-direction the first rotation element 42.1 of the third bending unit 26.3 moves clockwise - lagging in comparison to the second rotation element 42.2 of the third bending unit 26.3 - around the forming surface body 30 of the third bending unit 26.3 the second rotation element 42.2 of the third bending unit 26.3 moves clockwise - leading in comparison to the first rotation element 42.1 of the third bending unit 26.3 - around the forming surface body 30 of the third bending unit 26.3.

[0110] Following the Fig. 9 The following steps are carried out in the situation shown: Removing the finished bent pin All axes move to the home position (different between U-pin and I-pin) Next wire section can be inserted.

[0111] Each bending unit 26.1, 26.2, 26.3 essentially represents a rotary draw-bend unit, although in the present embodiment of the bending device 10, at least two rotary elements 42.1, 42.2 are provided per bending unit 26.1, 26.2, 26.3. The possible functions of the second rotary element 42.1, 42.2 are explained below: Forming the conductor

[0112] In particular, in the second bending unit 26.2, the second rotation element 42.2, in cooperation with the first rotation element 42.1, serves to form the conductor 12, starting from the basic position, simultaneously on both sides around the forming surface body 30. In this case, the first and second rotation elements 42.1, 42.2 move as indicated by RE2.1 and RE2.2 in Fig. 9indicated in opposite directions and thereby form the conductor 12 around the corresponding forming surface body 30. The second movement unit 45.2 compensates for this bending by a movement in the positive Y direction. and / or Counterhold:

[0113] In particular, in the first and third bending units 26.1, 26.3, the further rotation element 42.2, 42.1 can serve as a counter-holder. In this case, the first and second rotation elements 42.1, 42.2 move as indicated by RE1.1, RE1.2, RE3.1 and RE3.2 in Fig. 9 indicated in the same direction but at different speeds. One of the two rotation elements 42.1, 42.2 forms the bend around the forming surface body 30, while the other of the rotation elements 42.1, 42.2 performs a rotational movement in the same direction, but at a slower speed. The respective lagging rotation element - which are in the example of Fig. 9the second rotation element 42.2(26.1) of the first bending unit 26.1 and the first rotation element 42.1(26.3) of the third bending unit 26.3 - has the task, on the one hand, of counteracting an undesired deformation of the conductor 12 as a result of the bending of the leading rotation element 42.1(26.1), 42.2(26.3) (function as a counter-holder) and, on the other hand, of compensating the movements of the movement units 45.1, 45.3.

[0114] How easy it is to Fig. 2 to 16As can be seen, with this bending device 10 and the bending process, the position of the bending areas 36.1, 36.2, 36.3 and the extent of the bending, and thus the parameters of the roof area 18, can be easily changed by adjusting the movement parameters in the controller 60, so that both the smaller U-pin 14.1 and the larger U-pin 14.2 can be formed on the same bending device 10 without any modifications. For this purpose, the controller 60 controls the individual actuators of the bending device 10 individually, but according to a sequence plan specified according to the bending parameters, in order to carry out the aforementioned bending process.

[0115] For removal, according to Fig. 9After the bending of the bending areas 36.1, 36.2, 36.3 has been completed, whereby a certain amount of overbending can also be achieved by means of the bending elements - shaped surface body 30 and detection elements 32.1, 32.2 - in order to prevent backbending, the movement units 45.1, 45.2, 45.3 are moved slightly in their other direction of movement and the detection elements 32.1, 32.2 are moved slightly away from the conductor 12. Subsequently, the bending device 10 is returned to the position shown in Fig. 2 and 6 shown basic position in order to pick up the next conductor 12 to be bent. This allows several conductors 12 to be bent one after the other at a very fast rate.

[0116] However, with the same bending device 10, an I-pin 16 can also be formed instead of a U-pin 14, 14.1, 14.2. An exemplary bending method for bending an I-pin is described below using the Fig. 10 to 13 explained.

[0117] Fig. 10shows the basic position. With an I-pin 16, only a first and a second bending area 36.1, 36.2 need to be bent. Therefore, only the first and second bending units 26.1, 26.2 are required. For this purpose, before inserting the conductor 12, the detection elements 32.1, 32.2 of the third bending unit 26.3 are moved to the half or side of the third bending unit 26.3 on which the conductor 12 will not lie. The detection elements 32.1, 32.2 of the first bending unit 26.1 are moved to their basic position, in which they form the receiving channel 62 for inserting the still straight conductor 12 between themselves and the forming surface body 40, for example, lying against one another. The shaped surface body 30 of the first bending unit 26.1 lies on a first side - here the side directed in the negative y-direction - of the conductor 12 and the bending fingers 52.1, 52.2 of the detection elements 32.1, 32.2 of the first bending unit 26.1 lie on the second side—here, the side facing in the positive y-direction. The second bending unit 26.2 is used to take the position shown in . Fig. 10 From the initial position set before inserting the conductor 12, the first bending unit 26.2 is moved in the y-direction until its shaped surface body comes to rest on the second side of the conductor 12, and the detection elements 32.1, 32.2 of the second bending unit 26.2 are moved until they come to rest on the first side of the conductor 12. In other words, the shaped surface bodies 30 of the bending units 26.1, 26.2 engage on different sides of the conductor 12, and the detection elements 32.1, 32.2 of the bending units 26.1, 26.2 engage on different sides of the conductor 12.

[0118] Accordingly, I-pins 16 can also be produced on the same bending device 10. The basic position of the axes involved differs slightly from the production of U-pins.

[0119] Concrete example of the basic position for I-Pin: The first bending unit 26.1 is in the same basic position as when forming U-Pins 14: the rotation elements 42.1 and 42.2 are at 12 o'clock with respect to the forming surface body 30.

[0120] In the second bending unit 26.2, the rotation elements 42.1 and 42.2 move by 180° to 6 o'clock with respect to the forming surface body 30 before inserting the wire as the conductor 12 to be bent - at the same time, the second movement unit 45.2 moves in the positive Y direction so that the conductor 12 can be inserted between the rotation elements 42.1, 42.2 and the forming surface body 30.

[0121] The third bending unit 26.3 is not required for forming I-pins 16, therefore its rotation elements 42.1, 42.2 move by 180° to 6 o'clock with respect to the forming surface body 30.

[0122] After inserting the conductor 12, the Fig. 10shown situation. Subsequently, the detection elements 32.1, 32.2 of the bending units 26.1, 26.2 involved in the bending process of the I-pin are moved towards the conductor 12 in order to press it against the forming surface bodies 30 and thus fix it. This is shown in Fig. 11 shown. As the Figs. 12 and 13 As shown, the second bending unit 26.2 is then moved in the positive y-direction, and the first bending unit 26.1 is moved toward the second bending unit 26.2 in the x-direction—here, the positive x-direction. This causes the conductor 12 to bend. The detection elements 32.1, 32.2 are moved in order to further fix the conductor 12 and / or to perform or support its reshaping.

[0123] Fig. 13shows the final position with the fully bent conductor 12. After an optional loosening of the bending elements 40, 32.1, 32.2 by appropriate retraction, the I-pin 16 can be removed, and the bending device 10 moves to receive the next conductor 12 in the Fig. 12 shown basic position.

[0124] In a concrete embodiment of the bending process for forming the I-pin, the following sequence occurs: In a first step, the wire section is inserted as the conductor to be bent using a feed unit (not shown). The first movement unit is already in the correct X-position. The distance between the bending units 26.1, 26.2 defines the leg lengths on the subsequent pin 16. The X-position is defined accordingly. The resulting position is shown in Fig. 10 shown.

[0125] In the optional second step, by adjusting the rotation elements 42.1, 42.2 (rotational movement), the wire section can be fixed in the bending device 10 and thus taken over by the feed unit without losing its position. The resulting situation is shown in the Fig. 10 and 14 shown.

[0126] The third step is the forming. All subsequent steps are based on the Figs. 12 and 13 The movements explained are coordinated and preferably run simultaneously: Forming step from the wire section to the I-pin the first movement unit 45.1 moves in the positive X-direction the first rotation element 42.1 of the first bending unit 26.1 moves counterclockwise - leading in comparison to the second rotation element 42.2 of the first bending unit 26.1 around the forming surface body 30 of the first bending unit 26.1 the second rotation element 42.1 of the first bending unit 26.1 moves counterclockwise - lagging in comparison to the first rotation element 42.2 of the first bending unit 26.2 around the forming surface body 30 of the first bending unit 26.1 the second movement unit 45.2 moves in the positive Y-direction the first rotation element of the second bending unit 26.2 moves counterclockwise - leading in comparison to the second rotation element 42.2 of the second bending unit 26.2 around the forming surface body 30 of the second bending unit 26.2 the second rotation element 42.2 the second bending unit 26.2 moves counterclockwise - lagging behind the first rotation element 42.1 of the second bending unit 26.2 - around the forming surface body 30 of the second bending unit 26.2 the third movement unit 45.3 is inactive the first rotation element 42.1 of the third bending unit 26.3 is inactive the second rotation element 42.2 of the third bending unit 26.3 is inactive. .

[0127] In a fourth step, the finished bent I-pin 16 is removed. All axes then return to their home position—this position differs between U-pin and I-pin. The next wire section can then be inserted.

[0128] U-pins and I-pins can be formed one after the other in a continuous process.

[0129] In the Fig. 10 to 13 In the bending method shown for bending the I-pin 16, the outer bending unit shown on the left in the figures and the middle bending unit are used. Fig. 14 to 16As shown, the bending process can also be carried out with the middle and right bending units. In this case, the right bending unit acts as the first bending unit 26.1, which is moved in the negative x-direction for bending. Otherwise, everything is analogous to the previous Fig. 10 to 13 described.

[0130] Furthermore, it is clear that if only I-pins 16 are to be produced, an embodiment of the bending device 10 can also be used which has only the first (left or right outer) bending unit 26.1 and the second bending unit 26.2.

[0131] In order to be able to carry out a bending method for 2D bending during the production of a component of an electrical machine with little mechanical effort, as gently as possible, at a high cycle rate and yet flexibly, a bending device (10) for the two-dimensional bending of an electrical conductor (12) in or parallel to a bending plane (22) has been described, which has at least one bending unit (26.1, 26.2, 26.3) per bending region (36.1, 36.2, 36.3) of the conductor (12), which are preferably individually controllable and movable relative to one another and preferably also individually controllable detection elements (32.1, 32.2) movable on a movement path (RE1.2, RE2.2; RE2.1, RE2.2; RE3.1, RE3.2) for bending around a forming surface (34) and / or counter-holding the conductor (12) during bending around the forming surface (34).In addition, bending methods for 2D bending of U-shaped and I-shaped conductors (12) that can be carried out with such a bending device (10) have been described. List of reference symbols:

[0132] 10Bending device 12Conductor 14U-pin 14.1Smaller U-pin 14.2Larger U-pin 16I-pin 18Roof area 20Roof peak 22Bending plane (XY plane) 24.1First leg 24.2Second leg 26.1First bending unit 26.2Second bending unit 26.3Third bending unit 28Relative motion device 30Shaping surface body 32.1First detection element 32.2Second detection element 34Shaping surface 36.1First bending area (to be formed by first bending unit) 36.2Second bending area (to be formed by second bending unit) 36.3Third bending area (to be formed by third bending unit) 38Circumferential surface 40Base of the bending unit 42.1First rotation element 42.2Second Rotation element 44.1First movement device 44.2Second movement device 44.3Third movement device 45.1First movement unit 45.2Second movement unit 45.3Third movement unit 46Slide 48.1First ring 48.2Second ring 50.1First boom 50.2Second boom 52.1First bending finger 52.2second bending finger 54flat detection surface 56curved detection surface 58end (stop) 60control 62receiving channel Mcenter point circumferential surface BE1movement of first bending unit BE2movement of second bending unit BE3movement of third bending unit RE Amovement path of first detection element RE Bmovement path of second detection element RE1.1movement path of first detection element of the first bending unit RE1.2movement path of second detection element of the first bending unit RE2.1movement path of first detection element of the second bending unit RE2.2movement path of second detection element of the second bending unit RE3.1movement path of first detection element of the third bending unit RE3.2Movement path of the second detection element of the third bending unit 56Curved detection surface 58End (stop) 60Control 62Receiving channel MCenter point of the circumferential surface BE1Movement of the first bending unit BE2Movement of the second bending unit BE3Movement of the third bending unit RE AMovement path of the first detection element RE BMovement path of the second detection element RE1.1Movement path of the first detection element of the first bending unit RE1.2Movement path of the second detection element of the first bending unit RE2.1Movement path of the first detection element of the second bending unit RE2.2Movement path of the second detection element of the second bending unit RE3.1Movement path of the first detection element of the third bending unit RE3.2Movement path of the second detection element of the third bending unit.

Claims

1. Bending device (10) for two-dimensional bending of an electrical conductor (12) to be carried out in a bending plane (22) or parallel to a bending plane (22), the device comprising a first bending unit (26.1) and a second bending unit (26.2), wherein the first bending unit (26.1) comprises a shaping surface body (30) extending transversely to the bending plane (22) and having a circumferential surface (38) designed as a shaping surface (34) for shaping a first bending area (36.1) of the electrical conductor (12), and the second bending unit (26.2) comprises a shaping surface body (30) extending transversely to the bending plane (22) and having a circumferential surface (38) designed as a shaping surface (34) for shaping a second bending area (36.2) of the electrical conductor (12), characterized by a relative movement device (28) for relatively moving the first bending unit (26.1) and the second bending unit (26.2) to each other in the bending plane (22) or parallel to the bending plane (22), wherein the first bending unit (26.1) comprises a first gripping element (32.1) and a second gripping element (32.2), and the second bending unit (26.2) comprises a first gripping element (32.1) and a second gripping element (32.2), wherein the first gripping element (32.1) and the second gripping element (32.2) of the first bending unit (26.1) are movable relative to each other and are movable around the circumferential surface (38) of the shaping surface body (30) of the first bending unit (26.1) along a movement path (RE A, RE B; RE1.1, RE1.2), which is an arched curve leading around the circumferential surface (38) of the shaping surface body (30) of the first bending unit (26.1), in order to grip a first bending area (36.1) and bend the first bending area (36.1) around the shaping surface body (30) of the first bending unit (26.1), wherein the first gripping element (32.1) and the second gripping element (32.2) of the second bending unit (26.2) are movable relative to each other and are movable around the circumferential surface (38) of the shaping surface body (30) of the second bending unit (26.2) along a movement path (REA, RE B; RE2.1, RE2.2), which is an arched curve leading around the circumferential surface (38) of the shaping surface body (30) of the second bending unit (26.2), in order to grip a second bending area (36.1) and bend the second bending area (36.1) around the shaping surface body (30) of the second bending unit (26.1).

2. Bending device (10) according to claim 1, characterized in that a third bending unit (26.3) is provided which also comprises a shaping surface body (30) extending transversely to the bending plane (22) and having circumferential surface (38) designed as shaping surface (34) for shaping a bending area (36.3) of the conductor (12), and a first gripping element (32.1) or a first and second gripping element (32.1, 32.2), wherein the gripping element(s) (32.1, 32.2) are movable around the circumferential surface (38) along a movement path (RE A, RE B; RE3.1, RE3.2) for gripping a third bending area (36.3) and / or bending the third bending area (36.3) around the shaping surface body (30) of the third bending unit (26.3), wherein the relative movement device (28) is designed for relatively moving the first to third bending units (26.1, 26.2, 26.3) in or parallel to the bending plane (22).

3. Bending device (10) according to claim 1 or 2, characterized in that the relative movement device (28) 3.1 includes a first movement device (44.1) for moving the first bending unit (26.1) in the bending plane (22) and / or 3.2 includes a second movement device (44.2) for moving the second bending unit (26.2) in the bending plane (22) and / or 3.

3. includes a third movement device (44.3) for moving the third bending unit (26.3) in the bending plane (22) and / or 3.4 is designed for linearly moving at least one, several or all of the bending units (26.1, 26.2, 26.3).

4. Bending device (10) according to claim 2 or 3, characterized by at least one or more of the following features: 4.1 that the relative movement device (28) includes a first to third movement unit (45.1, 45.2, 45.3) that are designed for relative movement to each other, wherein the first bending unit (26.1) is arranged on the first movement unit (45.1), the second bending unit (26.2) is arranged on the second movement unit (45.2) and the third bending unit (26.3) is arranged on the third movement unit (45.3), 4.2 that each bending unit (26.1, 26.2, 26.3) has the shaping surface body (30) as a bending element and that its gripping elements (32.1, 32.2) are designed as rotation elements (42.1, 42.2) rotatable about a center axis (M) of the shaping surface body (30), 4.3 that the circumferential surface (38) has a circular or circular segment-shaped contact surface in a top view with respect to a center axis (M) of the shaping surface body (30), the center of the contact surface corresponding to the center of the bend.

5. Bending device (10) according to any one of the preceding claims, characterized by at least one or more of the following features: 5.1 that the first and second gripping elements (32.1, 32.2) are movable so that they bend the conductor (12) around the shaping surface body (30), 5.2 that the first and / or the second gripping elements (32.1, 32.2) have a flat seizing surface (54) for holding against and / or shaping the conductor, 5.3 that the first and the second gripping elements (32.1, 32.2) of at least one of the bending units (26.1, 26.2, 26.3) lie against each other in a basic position and are movable away from each other from the basic position.

6. Bending device (10) according to any one of the preceding claims, characterized by at least one or more of the following features: 6.1 that the movement path (RE A, RE B; RE1.1, RE1.2; RE2.1, RE2.2; RE3.1, RE3.2) of the first and / or second gripping elements (32.1, 32.2) of all bending units (26.1, 26.2, 26.3) is an arched curve leading around the circumferential surface (38), 6.2 that the movement path (RE A, RE B; RE1.1, RE1.2; RE2.1, RE2.2; RE3.1, RE3.2) of the first and / or second gripping elements (32.1, 32.2) of at least one, several or all of the bending units (26.1, 26.2, 26.3) leads around the shaping surface body in an angular range of more than 180°, 6.3 that the first and / or second gripping elements (32.

1. 32.2) of at least one, several or all of the bending units (26.1, 26.2, 26.3) are movable around the shaping surface body by 360°, 6.4 that the first gripping element (32.1) is movable in a circular manner around a center axis (M) of the shaping surface body (30), 6.5 that the second gripping element (32.2) is movable in a circular manner around a center axis (M) of the shaping surface body (30).

7. Bending device (10) according to claim 2 or according to claim 2 and any one of claims 3 to 6, characterized in that the first and the third bending units (26.1, 26.3) are movable to and away from each other along a first linear direction of movement (x) and the second bending unit (26.2) disposed between the first and the third bending units (26.1, 26.3) is movable in a second linear direction of movement (y) that extends transversely to the first direction of movement (x).

8. Bending device (10) according to any one of the preceding claims, characterized in that the movement of the gripping elements (32.1, 32.2) of different bending units (26.1, 26.2, 26.3) can be moved and / or controlled differently.

9. Bending method for two-dimensional bending of an electrical conductor (12) to be carried out in a bending plane (22) or parallel to a bending plane (22), the method <b>characterized by: inserting the conductor (12) into a bending device (10) according to any one of the preceding claims which is in a basic position, and bending the conductor (12) by relatively moving the bending units (26.1, 26.2, 26.3) and moving the gripping elements (32.1, 32.2) of the bending units (26.1, 26.2, 26.3) along the movement path (RE A, RE B; RE1.1, RE1.2; RE 2.1, RE2.2; RE3.1, RE3.2).

10. Bending method according to claim 9, comprising one or more of the steps: 10.1 setting the basic position in such a way that all shaping surface bodies (30) of the first to third bending units (26.1, 26.2, 26.3) are arranged on one side of the conductor (12) to be bent and all gripping elements (32.1, 32.2) of the first to third bending units (26.1, 26.2, 26.3) are arranged on the other side of the conductor (12) to be bent, 10.2 moving the first and the third bending units (26.1, 26.3) towards each other in a first direction of movement (x) and moving the second bending unit (26.2) disposed between the first and the third bending units (26.1, 26.3) away from the first and the third bending units (26.1, 26.3) in a second direction of movement (y) running transversely to the first direction of movement (x), 10.3 rotating the first and the second gripping elements (32.1, 32.2) of the second bending unit (26.2) away from each other in the opposite direction of rotation, 10.4 rotating the first gripping elements of the first and the second bending units (26.1, 26.2) away from the second bending unit (26.2) in opposite directions; 10.5 rotating the first and the second gripping elements (321, 32.2) of the first and the third bending units (26.1, 26.2) in the same direction of rotation, one of the said elements being leading and the other one trailing; 10.6 removing the finished bent conductor (12); 10.7 returning the bending device (10) to the basic position upon removal of the finished bent conductor (012).

11. Bending method according to claim 9, comprising one or more of the steps: 11.1 setting the basic position in such a way that the shaping surface body (30) of the first bending unit (26.1) and the gripping elements (32.1, 32.2) of the second bending unit (26.2) are arranged on one side of the conductor (12) to be bent and the shaping surface body (30) of the second bending unit (26.2) and the at least one gripping element (32.1, 32.2) of the first bending unit (26.1) are arranged on the other side of the conductor (12) to be bent, 11.2 moving the first bending unit (26.1) towards the second bending unit (26.2) in a first direction of movement (x) and moving the second bending unit (26.2) away from the first bending unit (26.1) in a second direction of movement (y) running transversely to the first direction of movement (x), 11.3 rotating the at least one gripping element (32.1, 32.2) of the first bending unit (26.1), in particular by rotating the first and the second gripping elements (32.1, 32.2) of the first bending unit (26.1) away from each other in the opposite direction of rotation and rotating the first and the second gripping elements (32.1, 32.2) of the second bending unit (26.2) in the opposite direction of rotation, 11.4 rotating the at least one gripping element (32.1, 32.2) of the first bending unit (26.1) oppositely to the rotation of the gripping elements (32.1, 32.2) of the second bending unit (26.2), 11.5 removing the elements (32.1, 32.2; 30) of the third bending unit (26.3), if present on the bending device (10), from the bending path of the conductor (12) for the entire bending procedure, 11.6 removing the finished bent conductor (12), 11.7 returning the bending device (10) to the basic position upon removal of the finished bent conductor (12).

12. Bending method according to any one of claims 9 to 11, characterized in that the first and the second gripping elements (26.1, 26.2) of the bending unit (26.1, 26.2, 26.3) respectively used lie against each other in the basic position.

13. Bending device (10) according to any one of claims 1 to 9, characterized by a controller (60) configured to control the bending device (10) for carrying out the bending method according to any one of claims 10 to 12.

14. Computer program product, comprising machine-readable control instructions which when loaded to a bending device (10) according to any one of claims 1 to 9 cause the bending device (10) to carry out the bending method according to any one of claims 10 to 12.