TEMPERATURE CONTROL UNIT WITH FILLING SYSTEM, ITS USE AND FILLING METHOD

Description

Field of the invention

[0001] The invention relates to a temperature control device for controlling the temperature of an external process and a method for filling a line system of a temperature control device. State of the art

[0002] Temperature control devices for controlling the temperature of external processes are known from the state of the art. For example, process thermostats are used in which a temperature-controlled heat transfer fluid is pumped in a closed circuit to an external application. A temperature control medium tank or an expansion tank is often provided within the temperature control device, particularly for accommodating a change in the fluid's volume depending on the operating temperature.

[0003] In the current state of the art, temperature control units, and in particular the expansion tank of the temperature control unit, are filled from above, for example, using a filling funnel. For this purpose, a canister filled with a temperature control medium is usually lifted onto the unit to facilitate filling. However, temperature control units can be 1.5 m, 2 m, or even more high. Therefore, a ladder or crane is often required to lift the canister onto the unit. Filling the temperature control unit is therefore complex, especially with tall units. Furthermore, filling from above is very slow, and the fill level must be constantly monitored.

[0004] Another option for filling temperature control units is to provide a liquid pump to draw in the temperature control medium. However, this is costly, and the liquid pump must be extensively cleaned before each change when using different temperature control media.

[0005] EP 2 979 763 A1 describes a temperature control device with a temperature-controlled bath. DE 200 20 391 U1 describes a temperature control system. DE 10 2015 007400 A1 describes a heating water refill device external to the domestic water network. Disclosure of the invention

[0006] The object of the invention is to provide a temperature control device for controlling the temperature of an external process that is improved compared to the prior art, as well as an improved method for filling a piping system of a temperature control device. In particular, the object of the invention is to enable a less labor-intensive, simplified, fast, clean, and defined filling of temperature control devices.

[0007] The object is achieved, for example, by a temperature control device for controlling the temperature of an external process according to claim 1 or by a method for filling a line system of a temperature control device according to claim 11. Further developments of the method or the device are specified in the dependent claims.

[0008] One aspect relates to a temperature control device for controlling the temperature of an external process, comprising a piping system comprising a filling valve for connecting a filling tank and a compensation tank. The temperature control device also has a gas connection arranged on the compensation tank for optionally pressurizing the compensation tank with gas under excess pressure during normal operation, as well as a filling system for drawing a liquid temperature control medium into the piping system via the filling valve, comprising a vacuum device fluidly connected to the gas connection for generating a negative pressure in the piping system during a filling operation.

[0009] In typical temperature control devices, the piping system includes a heat exchanger for controlling the temperature of the liquid temperature control medium in the piping system during normal operation. The temperature control device can be one of the following devices: process thermostat, chiller, and temperature control station. The temperature control device is preferably a process thermostat. Further embodiments include a piping system with a heater and / or a cooler for controlling the temperature of the temperature control medium.

[0010] The temperature control device is designed to be connected to an external device to form an external temperature control circuit, and thus to control the temperature of the external process. The temperature control circuit is formed by the piping system and the external device. The piping system can have a supply connection and a return connection for connecting to the external device. The piping system can further include a heater for heating the temperature control medium, a heat exchanger, and / or a liquid pump for conveying the temperature control medium in the temperature control circuit.

[0011] For some applications, the temperature control circuit is operated at high temperatures, at which the temperature control medium can have a high vapor pressure. The temperature control device, and in particular the piping system and the compensation tank, are typically designed to form a high-pressure temperature control circuit. In other words, the piping system, and in particular the compensation tank, is pressure-resistant. Typically, the temperature control circuit can be pressurized with a pressure of up to 4.5 bar above atmospheric pressure. The compensation tank is preferably arranged above the other components of the piping system, such as the heater, the liquid pump, the heat exchanger and a supply line and a return line of the piping system. The compensation tank is a reservoir for providing temperature control medium to the piping system orthe temperature control circuit and can be designed to compensate for a volume change of the temperature control medium in the temperature control circuit in the event of a temperature change. Typically, the expansion tank is connected to the supply line and / or the return line, and thus also fluidly connected to the temperature control circuit.

[0012] The temperature control unit can be configured to be pressurized with a gas under excess pressure during normal operation, particularly in high-temperature applications. The pressurized gas can be, for example, compressed air or nitrogen. A gas connection is provided on the expansion tank for applying the pressurized gas. Typically, the gas connection is located on the top side of the expansion tank, particularly in an upper wall section of the expansion tank.

[0013] Furthermore, a filling operation is provided for the temperature control device. The temperature control device has a filling system designed to fill the expansion tank and thus the temperature control circuit with the temperature control medium. The filling system is fluidly connected to the gas connection of the expansion tank. The filling system has a vacuum device designed to generate a negative pressure in the expansion tank. When a filling tank is connected to the filling valve, the negative pressure generated in the expansion tank can suck the temperature control medium from the filling tank into the temperature control circuit and the expansion tank, in particular via components of the piping system, such as sections of the supply line and / or the return line of the piping system.

[0014] The filling valve and / or a filling connection of the piping system for connecting the filling container can be arranged on an underside or a side wall of the temperature control device. Typically, the filling valve and / or the filling connection is arranged on a lower section of the side wall of the temperature control device. Advantageously, with the temperature control device disclosed herein, it is possible to dispense with lifting the filling container onto the temperature control device during a filling operation. In particular, it is possible to dispense with placing the filling container on a top side or lid of the temperature control device. Thus, according to the present disclosure, no crane or ladder is required to fill the temperature control circuit and the compensation tank. Instead, the filling container can be arranged laterally next to or at a distance from the temperature control device.According to the present disclosure, the filling process can be carried out significantly faster than with prior art temperature control devices. With prior art temperature control devices, spillage of the temperature control medium can easily occur during the filling process. According to the present disclosure, spillage is significantly less likely because only the filling tank is connected. The filling process disclosed herein is thus "cleaner." By filling the compensation tank using negative pressure, the amount of air or gas in the piping system, particularly in the temperature control circuit and / or the supply and return lines, is significantly reduced, so that subsequent venting or degassing during commissioning is almost completely eliminated. This results in additional time savings and reduced effort.

[0015] Typically, the filling system has a suction line that establishes a fluid connection between the vacuum device and the gas connection of the expansion tank. The vacuum device can be one selected from a vacuum ejector, a vacuum pump, an electric vacuum generator, or a vacuum blower. Preferably, the vacuum device is a vacuum ejector. The vacuum ejector is configured to build up a negative pressure in the suction line and at the gas connection of the expansion tank when gas under excess pressure is supplied to the vacuum ejector. The vacuum device, and in particular the vacuum ejector, is configured to generate a negative pressure (relative to the ambient pressure) of at least 0.1 bar, preferably at least 0.2 bar, and even more preferably at least 0.3 bar in the expansion tank.

[0016] In one embodiment, the filling system has a gas connection line for connection to a gas source. The gas source can be, for example, a compressed air source or a nitrogen source with an overpressure, preferably of at least 3 bar, more preferably at least 4.5 bar. The gas connection line can establish a fluid connection between the vacuum device, in particular the vacuum ejector, and the gas source.

[0017] In one embodiment, the filling system has a gas outlet line for discharging the pressurized gas and the gas drawn from the expansion tank. The gas outlet line is fluidly connected to the vacuum device, in particular the vacuum ejector.

[0018] According to one embodiment, the vacuum ejector has a jet nozzle arranged between the gas supply line and the gas outlet line. A cross-section of the jet nozzle narrows, in particular continuously, in the direction of flow. Furthermore, the vacuum ejector can have a chamber downstream of the jet nozzle, with a cross-section of the chamber widening in the direction of flow. The chamber can be connected to the intake line via an intake connection. According to one embodiment, the vacuum ejector can also be a multi-stage vacuum ejector.

[0019] Advantageously, the vacuum ejector requires no additional electronic components, is cost-effective, and requires little maintenance. Furthermore, if the gas source is used to pressurize the expansion tank with the overpressured gas during normal operation, the same gas source can also be used for filling operations. Thus, only a few additional components are required for temperature control units that require gas to be applied during normal operation. The temperature control unit can have an additional gas line that fluidically connects the gas source to the gas connection of the expansion tank to pressurize the expansion tank with the overpressured gas during normal operation.

[0020] According to one embodiment, the filling system includes a first valve arranged in the gas connection line for controlling a gas supply. Controlling the first valve enables a gas flow through the vacuum device, in particular the vacuum ejector, and thus a negative pressure in the intake line to be set. This can initiate the intake of the temperature control medium and adjust the intake speed. Preferably, the first valve is arranged between the gas source and the vacuum ejector.

[0021] Additionally or alternatively, the filling system can include a second valve arranged in the intake line. The second valve can control the suction of liquid temperature control medium from the expansion tank. The second valve allows the suction of the temperature control medium to be initiated and a suction speed to be adjusted. The second valve is preferably arranged between the vacuum ejector and the gas connection of the expansion tank. For example, the first valve and / or the second valve can be a solenoid valve.

[0022] Typically, the piping system further comprises a filling line with the filling valve and / or the filling connection arranged therein. For example, the filling line can be connected to the supply line and / or the return line of the piping system. Optionally, the piping system can have a check valve arranged in the filling line to prevent the temperature control medium from flowing back to the filling container. During filling operation, the temperature control device can be configured to fully open the filling valve and / or to set a constant opening angle for the filling valve.

[0023] According to one embodiment, the temperature control device comprises a control unit. The control unit is configured to at least partially open the first valve and / or the second valve for filling the expansion tank. The control unit can further be configured to open and close the filling valve, and in particular to open and close all valves of the temperature control device. The control unit can further be configured to control a gas supply from the gas source; for example, the control unit can be configured to control an opening valve and / or a pressure reducer of the gas source.

[0024] Additionally, the control unit can be configured to control some or even all components of the temperature control unit. For example, the control unit can be configured to control the pump, the cooling, and / or the heating.

[0025] In one embodiment, the temperature control device has a sensor for detecting a fill level of the expansion tank.

[0026] The control unit can further be configured to close the first valve and / or the second valve upon reaching a target fill level of the expansion tank. The target fill level is a fill level that can be freely selected by the user, particularly during each filling operation, or is predefined within the limits of a minimum permissible fill level and a maximum permissible fill level. Furthermore, the control unit can be configured to close the filling valve after the first valve and / or the second valve have closed.

[0027] In one embodiment, the control unit is configured to automatically fill the expansion tank. This involves connecting the components, such as the filling tank, to the system by a user (specialist personnel). However, the filling process itself—in particular, opening the valves, creating the vacuum in the expansion tank, filling the expansion tank, and closing the valves when the target fill level is reached—is performed automatically by the control unit. All that is required is for the user to initiate the automatic filling process, for example, using a software program or manual input on a control unit.

[0028] Advantageously, the temperature control device according to the present disclosure enables automatic filling of the expansion tank without user interaction and without the user having to regularly observe or check the filling process and the fill level. Furthermore, the filling system and / or the control unit can achieve significantly faster filling than a filling process performed manually by skilled personnel. The automatic filling operation also enables better-controlled filling of the expansion tank.

[0029] Compared to temperature control devices based on the provision of a liquid pump for drawing the temperature control medium into the expansion tank, the temperature control devices disclosed herein are significantly lower in cost. Furthermore, cleaning is eliminated or significantly more user-friendly. In addition, the temperature control devices disclosed herein enable safe operation. The piping system cannot be overfilled and / or overfilled, as filling is controlled and terminated when the target fill level is reached.

[0030] In one embodiment, the liquid temperature control medium contains water and / or glycol. For example, a water-glycol mixture can be used at temperatures significantly above 100°C. Alternatively, the liquid temperature control medium can preferably also contain one selected from the group consisting of silicone oil, fluorinated liquids, and thermal oil.

[0031] In one embodiment, the filling system is detachably connected to the temperature control device. Typically, the filling system is arranged within the housing, for example, on or near a top surface (lid) or an upper section of the side wall of the housing. The gas connection line and / or the gas outlet line can, for example, be integrated into the housing of the temperature control device.

[0032] A further aspect relates to a method for filling a line system of a temperature control device, in particular a temperature control device according to an embodiment of the present disclosure. The method comprises the steps: i) generating a negative pressure by operating a vacuum device at a gas connection of an expansion tank of the piping system; and ii) sucking a liquid temperature control medium into the piping system via a filling valve of the piping system while the vacuum device is operated at the gas connection.

[0033] Preferably, the vacuum device is a vacuum ejector. Operating the vacuum device may include or consist of supplying pressurized gas to the vacuum device. The liquid temperature control medium is sucked in by means of a negative pressure generated at the gas connection.

[0034] The method is preferably carried out with a vacuum device, and in particular the filling system, according to one of the embodiments disclosed herein.

[0035] The suction of the liquid tempering medium in step ii) preferably comprises at least one of the following steps: at least partially opening the first valve to control the gas supply to the vacuum device; and / or at least partially opening the second valve to control the suction of temperature control medium.

[0036] The first valve is arranged in a gas connection line fluidly connected to the vacuum device. The second valve is preferably contained in a suction line arranged between the vacuum device and the gas connection. Step ii) may further comprise at least partially opening a filling valve. The filling valve is preferably arranged between the line system and a filling container filled with a liquid temperature control medium.

[0037] The method may further comprise the step: iii) interrupting the suction of the liquid tempering medium when a target filling level of the compensation tank is reached.

[0038] Step iii) is preferably performed after steps i) and ii). Suction is preferably interrupted by closing the first valve for controlling a gas supply to the vacuum device and / or by closing the second valve for controlling the suction of the temperature control medium. Step iii) may further comprise closing the filling valve.

[0039] The method may comprise at least one of the following steps: iv) connecting the filling system, comprising the vacuum device, to the gas connection of the expansion tank; and / or v) connecting the filling tank filled with the temperature control medium to the piping system, in particular to the filling valve of the piping system.

[0040] Steps iv) and / or v) are performed prior to steps i), ii), and iii). Step iv) may further comprise connecting the gas source to the gas supply line.

[0041] A further aspect relates to a temperature control device. The temperature control device comprises a control unit, in particular according to one of the embodiments disclosed herein. The control unit is configured to control a method for filling a line system of a temperature control device according to one of the embodiments disclosed herein. In particular, the control unit is configured to at least partially open the first valve and / or the second valve for filling the compensation tank. The control unit can further be configured to open and close the filling valve, and in particular to open and close all valves of the temperature control device. The control unit can further be configured to control a gas supply through the gas source; for example, the control unit can be configured to control an opening valve and / or a pressure reducer of the gas source.In addition, the control unit can be configured to control some or all components of the temperature control unit.

[0042] A further aspect relates to the use of a filling system with a vacuum device for filling an equalizing tank of a temperature control device, in particular comprising the filling system according to one of the embodiments disclosed herein and / or the temperature control device according to one of the embodiments disclosed herein. Short description of the drawing

[0043] Further advantages and features of preferred embodiments of the invention are explained below with reference to the accompanying drawing, in which the figure shows: Fig. 1 is a schematic view of the temperature control device for temperature control of an external process according to an embodiment of the invention. Description of the embodiment shown in the figure

[0044] Typical embodiments are described below with reference to the figure, whereby the invention is not limited to the embodiments, but rather the scope of the invention is determined by the claims.

[0045] In the Fig. 1 A temperature control device 200 for temperature control of an external process is shown schematically.

[0046] The temperature control device 200 has a piping system 230. The piping system 230 contains a heat exchanger 231 for controlling the temperature of a liquid temperature control medium present in the piping system 230 during normal operation. The refrigeration system present on a secondary side of the heat exchanger 231 in typical embodiments is not shown for clarity.

[0047] In the Fig. 1The heat exchanger 231 shown is a plate heat exchanger. The piping system 230 further includes a pump 220 and a heater 232. The piping system 230 includes a return connection 233 and a flow connection 234 for connection to an external device. An external device can also mean an external piping system. Fig. 1Next to the return connection 233 and the flow connection 234, two dashed arrows are drawn, indicating the connection to the external equipment. The section of the piping system between the return connection 233 and the pump 220 can also be referred to as the return line. The section of the piping system between the pump 220 and the flow connection 232 can also be referred to as the flow line. A temperature control circuit is formed by the external equipment; the flow connection 234 and the flow line; the return connection 233 and the return line; and by the pump 220, the heater 232, and the heat exchanger 231.

[0048] In other embodiments, several pumps, heat exchangers or heaters may also be present.

[0049] Furthermore, the line system 230 has an equalization tank 210. The equalization tank 210 is fluidly connected to the temperature control circuit, and in particular to the return line. The equalization tank 210 is filled with the liquid temperature control medium and serves to supply temperature control medium to the temperature control circuit, for example, to absorb a volume change of the temperature control medium from the temperature control circuit in the event of a temperature change. The equalization tank is typically arranged at an upper section of the temperature control device or directly below the top of the temperature control device. The equalization tank contains a gas connection 211. The gas connection 211 can be arranged at an upper side of the equalization tank 210, in particular in an upper wall section of the equalization tank.The gas connection 211 can be connected or connected to a gas source 150 for supplying the expansion tank 210 with gas under excess pressure during normal operation.

[0050] The piping system 230 may include an outlet valve 241 for draining the expansion tank 210. The outlet valve 241 is fluidly connected to the expansion tank 210 via a connecting line. The outlet valve 241 is typically located at a lower portion of the temperature control device to facilitate the discharge of the temperature control medium from the expansion tank 210.

[0051] Furthermore, the line system 230 can have an outlet valve 242 for draining the line system 230. The outlet valve 242 is fluidly connected to the temperature control circuit, for example, to the supply line, via a connecting line. The outlet valve 242 is typically arranged at a lower section of the temperature control device to enable complete discharge of the temperature control medium from the line system 230.

[0052] The piping system includes a filling valve 244. The filling valve 244 is connectable or connected to a filling container 160. The filling container 160 contains liquid temperature control medium with which the compensation container 210 can be filled. The filling valve 244 is typically arranged at a lower or middle section of the temperature control device 200. In Figure 1A specific arrangement of the valves 241, 242, 243 is shown schematically, but this can be changed as needed. Furthermore, the outlet valves 241, 242 are optional. In one embodiment, the temperature control device can have only the filling valve 244 and none of the outlet valves 241, 242. In this case, both the filling and the discharge of the temperature control medium can take place via the filling valve 244. The line system 230 can further have a filling line 235. The filling line 235 establishes a fluid connection between the filling valve 244 and the temperature control circuit, for example, the feed line. In one aspect, the filling line 235 can contain the outlet valve 242 for emptying the line system 230 (as in Figure 1 shown).

[0053] The temperature control device 200 has a filling system 100. In Figure 1It is indicated that the filling system 100 is located outside the housing (corresponding to the rectangular box) of the temperature control device 200. In many embodiments, however, the filling system 100 is located inside the housing of the temperature control device 200.

[0054] The filling system 100 has a vacuum device 110. In Figure 1 the vacuum device 110 shown corresponds to a vacuum ejector.

[0055] Typically, the vacuum ejector 110 has three ports: a gas inlet port, a gas outlet port, and a suction port.

[0056] The vacuum ejector 110 can be connected to a gas connection line 111 of the filling system 100 via the gas inlet connection. The gas connection line 111 can contain a first valve 120 for controlling a gas supply. The gas connection line 111 can be connectable or connected to the gas source 150. The gas source 150 serves to provide gas under excess pressure.

[0057] The vacuum ejector 110 can be connected to a gas outlet line 140 of the filling system 100 via the gas outlet connection. The gas outlet line 140 serves to discharge the pressurized gas and the gas sucked from the expansion tank 210.

[0058] The temperature control device 200 may have a supply line 201 that directly connects the gas source 150 or the gas connection line 111 of the filling system 100 to the gas connection 211. The supply line 201 may also be connected to the gas outlet line 140. The supply line 201 may have a third valve 202 for controlling a gas supply to the gas connection line 111 and / or a fourth valve 203 for controlling a gas discharge into the gas outlet line 140.

[0059] The vacuum ejector 110 can be connected to a suction line 112 of the filling system 100 via the suction connection. The suction line 112 can contain a second valve 130 for controlling the suction of liquid temperature control medium. The suction line 112 is preferably connected to the gas connection 211 of the expansion tank 210. List of reference symbols:

[0060] 100 Filling system 110 Vacuum ejector 111 Gas connection line 112 Suction line 120 First valve 130 Second valve 140 Gas outlet line 150 Gas source 160 Filling tank 200 Temperature control unit 201 Pressurization line 202 Third valve 203 Fourth valve 210 Expansion tank 211 Gas connection 220 Pump 230 Piping system 231 Heat exchanger 232 Heater 233 Return connection 234 Supply connection 235 Filling line 241 Outlet valve for emptying the expansion tank 210 242 Outlet valve for emptying the piping system 230 243 Check valve 244 Filling valve

Claims

1. Temperature control device (200) for controlling the temperature of an external process, comprising: a line system (230) which comprises: - a filling valve (244) for connecting a filling container (160); and - an expansion tank (210); a gas connection (211) arranged on the expansion tank (210) for optionally pressurising the expansion tank (210) with gas under excess pressure during normal operation; and a filling system (100) for sucking a liquid temperature control medium into the line system (230) via the filling valve (244), comprising a vacuum mechanism (110) which is fluidly connected to the gas connection (211) for generating a negative pressure in the line system (230) during a filling operation.

2. Temperature control device (200) according to claim 1, wherein the vacuum mechanism (110) is a vacuum ejector (110) which is designed to build up a negative pressure at the gas connection (211) when gas under excess pressure is supplied to the vacuum ejector (110).

3. Temperature control device (200) according to any of the preceding claims, wherein the filling system (100) has a first valve (120) arranged in a gas connection line (111) for controlling a gas supply; and / or wherein the filling system (100) has a second valve (130) arranged in a suction line (112) for controlling a suction of liquid temperature control medium.

4. Temperature control device (200) according to any of the preceding claims, wherein a filling connection of the line system and / or the filling valve (244) is arranged on a bottom side or on a side wall of the temperature control device (200); and / or further comprising the filling container (160), wherein the filling container (160) is arranged laterally spaced from the temperature control device (200), and in particular is not arranged on an upper side of the temperature control device (200).

5. Temperature control device (200) according to any of the preceding claims, further comprising a control unit which is designed to at least partially open the first valve (120) and / or the second valve (130) for filling the expansion tank (210).

6. Temperature control device (200) according to claim 5, wherein the control unit is further designed to close the first valve (120) and / or the second valve (130) when a desired fill level of the expansion tank (210) is reached.

7. Temperature control device (200) according to any of the preceding claims, wherein the control unit is further designed to automatically fill the expansion tank (210).

8. Temperature control device (200) according to any of the preceding claims, wherein the line system (230) comprises at least one heat exchanger (231), a heater or a cooler for controlling the temperature of the liquid temperature control medium in the line system (230) during normal operation.

9. Temperature control device (200) according to any of the preceding claims, further comprising a gas source (150) connected to the filling system (100), which gas source is designed to pressurise the expansion tank (210) with a gas under excess pressure during normal operation; and which gas source is designed to supply gas under excess pressure to the vacuum ejector (110) during the filling operation.

10. Method for filling a line system (230) of a temperature control device (200), comprising the steps of: generating a negative pressure by means of operating a vacuum mechanism (110) at a gas connection (211) of an expansion tank (210) of the line system (230); and sucking a liquid temperature control medium into the line system (230) via a filling valve (244) of the line system (230) while the vacuum mechanism (110) is operated at the gas connection (211).

11. Method according to claim 10, further comprising the step of: interrupting the suction of the liquid temperature control medium, in particular by closing a first valve (120) for controlling a gas supply to the vacuum mechanism (110) and / or closing a second valve (130) for controlling a suction of the temperature control medium, when a desired filling level of the expansion tank (210) is reached.

12. Method according to any of claims 10 or 11, further comprising at least one of the following steps: connecting a filling system (100) comprising the vacuum mechanism (110) to the gas connection (211) of the expansion tank (210); and / or connecting a filling container (160) filled with the temperature control medium to the line system (230), in particular to the filling valve (244) of the line system (230).

13. Method according to any of claims 10 to 12, further comprising at least one of the following steps: at least partially opening the first valve (120) to control the gas supply to the vacuum mechanism (110); and / or at least partially opening the second valve (130), arranged in particular in a suction line (112), for controlling the suction of temperature control medium; and / or at least partially opening the filling valve (244), which is arranged in particular between the line system (230) and the filling container (160).