Inlay for an electronic document, method for producing an electronic document with such an inlay, and this electronic document

Description

[0001] The invention relates to an inlay for an electronic document, which comprises at least one substrate and a zigzag metal wire embedded in an upper face of the substrate.

[0002] An “inlay” means a layer configured to be inserted into a thickness of the body of an electronic document.

[0003] The invention also relates to a method of manufacturing an electronic document comprising such an inlay, for example such as a card, such as a smart card, or an identity document.

[0004] More particularly, the invention relates to a method for manufacturing an electronic document comprising a body, in a thickness of which an inlay is inserted, comprising a cavity open on one face of the body, and a module inserted in the cavity.

[0005] In such a document, the body generally comprises an inlay having a wire, for example forming an antenna, two ends of which open into the cavity, and the module traditionally comprises a microprocessor and two connection terminals which are electronically connected on the one hand to the microprocessor and on the other hand to the ends of the wire.

[0006] Such an inlay comprises, for example, a substrate and the wire, forming, for example, the antenna, which is embedded in the substrate. Such an inlay is, for example, manufactured by extending the conductive metal wire over the substrate by means of a tool, such as a sonotrode, moving above the substrate and distributing the wire. The wire is embedded in the substrate by means of ultrasonic vibrations transmitted to the wire from the tool. The vibrations are transmitted perpendicular to the substrate to embed the wire in the thickness of the substrate. The wire is, for example, surrounded by an insulating sheath which is heated, for example for a very short time, to improve the adhesion of the sheath to the substrate. The tool is controlled to define the path for laying the wire.It is thus possible to wind the wire in several turns and / or to lay it along lines of various shapes, for example a sinuous line, such as a zigzag, which alternates between straight segments and detours.

[0007] Within an electronic document, the inlay is interposed between at least two layers, which are therefore arranged on either side of the inlay, thus forming the body of the document. These at least two layers and the inlay are, for example, assembled together by lamination.

[0008] Then, the cavity is formed by machining, for example by milling; at least one of the layers is then machined, and in such a way that the ends of the wire open into a bottom of the cavity, in particular on a counterbore of the cavity, also called a step. However, at the time of machining the cavity, inserting the module and the electrical connection between the module and the ends of the inlay wire, several problems can arise.

[0009] For example, if the machining is not deep enough, poor contact may be established between the ends of the wire and the module because a thickness of material, generally plastic, may remain on the wire of the inlay.

[0010] Or for example, if the machining is too deep, the machining tool, for example the milling cutter, may tear off part of the wire from the inlay. As a result, a portion of the wire may present a significant risk of being dislodged from the substrate in which it was initially embedded. When this portion of wire is removed, it positions itself randomly in the cavity. This creates a risk of malfunction of the electronic document. In particular, when the detached portion of wire is located in the cavity, it may come into contact with conductive portions located on an internal face of the module, such as current leads, thus creating a significant risk of short circuit. Similarly, when the removed portion of wire is found on a contact area with the connection terminals connected to the microprocessor, this results in excess wire thickness, and therefore a reduced contact area.

[0011] Furthermore, during mechanical testing of such an electronic document, for example torsion tests, or during the life of the electronic document, poor connectivity generally results in malfunction of the electronic document.

[0012] These problems are therefore due to various tolerances linked, for example, to the machining depth, the thickness of the inlay wire, the thickness of the different layers of materials constituting the electronic document, or even the position of the inlay in the thickness of the body of the electronic document.

[0013] The patent application published under number FR3093228 describes an electronic document in which the ends of an antenna which open into the cavity are arranged in a zigzag shape.

[0014] To reduce the risk of the wire being pulled out, the patent application published under number FR3026530 describes an electronic document in which the ends of an antenna which open into the cavity are arranged in a zigzag shape, the rectilinear segments of which are inclined by approximately 6° relative to an edge of the cavity.

[0015] Furthermore, document FR3015733 describes a document in which a contact means consists of a wire electrically connected to one end of an antenna, and arranged so that the wire develops from the end of the antenna by drawing a loop defining consecutive lines directed alternately in opposite directions, and being further from the end of the antenna than the line preceding it and being connected to it by a detour, the contact means being made flush with the bottom of the cavity and comprising at least a first detour arranged outside the cavity. Thus, whatever the direction of arrival of a milling cutter, it will first machine peripheral lines furthest from the end of the antenna, thus reducing the risk of tearing off the lines located near the end of the antenna.

[0016] Consideration was also given to optimizing the machining depth, so that it is deep enough to have good contact between the module's connection terminals and the inlay's contact pads, for example by removing as much plastic as possible from the inlay's wires, but also shallow enough not to tear the inlay's wires.

[0017] The patent application published under number EP2178032 describes an electronic document comprising a body, in a thickness of which is inserted an inlay, comprising a cavity open on one face of the body, and a module inserted in the cavity.

[0018] An objective of the present invention is thus to at least partially mitigate the aforementioned drawbacks, which may also lead to other advantages.

[0019] For this purpose, according to a first aspect, there is proposed an inlay comprising at least one substrate and at least one first zigzag portion formed from a metal wire embedded in an upper face of the substrate.

[0020] In the context of this description, the qualifiers "first" or "second" are only indicative to distinguish elements which they qualify, but do not imply an order between them.

[0021] Said first zigzag portion is arranged at least in part in an area of the upper face of the substrate configured to form a counterbore of a cavity.

[0022] A zigzag wire here refers to a wire that is, for example, laid in successive back and forth motions, thus forming straight segments connected to each other by detours forming loops. The straight segments are, for example, parallel to each other, and two adjacent straight segments are, for example, connected to each other by a portion that is most often curved, for example in an arc. A zigzag wire makes it possible, in particular, to cover a larger surface area to establish electrical contact with relatively little material.

[0023] The zigzag wire is made of copper, for example.

[0024] Thus, here, the first zigzag portion alternately comprises rectilinear segments and detours, a detour connecting two successive rectilinear segments. According to an interesting characteristic of the invention, at least one of the rectilinear segments of the first zigzag portion is arranged, at least in part, in an area of the upper face of the substrate configured to form a counterbore of a cavity of an electronic document.

[0025] And according to another interesting characteristic of the invention, the inlay comprises a connecting wire configured to connect together at least the rectilinear segments of the first zigzag portion.

[0026] The connecting wire thus designates a wire configured to electrically connect at least rectilinear segments of the first zigzag portion.

[0027] The connecting wire is, for example, a separate wire from the embedded metal wire.

[0028] The connecting wire is therefore an electrically conductive wire, for example also metallic.

[0029] Such an inlay is for example configured to be used in a method as described below.

[0030] Such an inlay is thus configured to provide more reliable electrical contact between an embedded module and the inlay wires when they are assembled into an electronic document.

[0031] Such an arrangement improves resistance to tearing of the inlay wire during cavity machining.

[0032] In addition, such an arrangement of the wires also provides better resistance of the inlay, or even of the electronic document around the module during the life of the electronic document.

[0033] It is thus possible to have a reduction in the manufacturing constraints of the electronic document by reducing the impact of the different manufacturing tolerances.

[0034] In one exemplary embodiment, the bonding wire includes a portion that intersects at least the first zigzag portion outside an area of the top face of the substrate configured to form a deep portion of the cavity.

[0035] The area of the upper face of the substrate configured to form the deep part of the cavity is for example surrounded by the area of the upper face of the substrate configured to form the counterbore of the cavity.

[0036] In one exemplary embodiment, the connecting wire comprises a portion that intersects at least the first zigzag portion in an area of the upper face of the substrate configured to be outside the cavity.

[0037] For example, this is an area of the substrate configured to remain covered by at least one layer when the inlay is assembled between layers to form an electronic document body.

[0038] In one exemplary embodiment, the connecting wire comprises at least one portion arranged next to the first zigzag portion.

[0039] For example, the portion of the connecting wire, which is arranged next to the first zigzag portion, has at least one end arranged in the area of the upper face of the substrate configured to form the deep portion of the cavity.

[0040] This part is thus configured to be cut during the machining of the cavity.

[0041] In an exemplary embodiment, at least one of the rectilinear segments of the first zigzag portion forms an angle of between 80° and 100° relative to a boundary between the area of the upper face of the substrate configured to form the counterbore of the cavity and the area of the upper face of the substrate configured to form the deep part of the cavity.

[0042] In an exemplary embodiment, at least one of the rectilinear segments of the first zigzag portion comprises at least one end, called the first end, which extends into the area of the upper face of the substrate configured to be outside the cavity.

[0043] In an exemplary embodiment, at least one of the rectilinear segments of the first zigzag portion comprises an end, called the second end, which extends into the area of the upper face of the substrate configured to form the deep part of the cavity.

[0044] In an exemplary embodiment, the inlay further comprises at least a second zigzag portion, formed of metal wire, arranged, at least in part, in the area of the upper face of the substrate configured to form the countersink of the cavity.

[0045] The second zigzag portion, for example, has all or part of the characteristics of the first zigzag portion described above.

[0046] The first zigzag portion and at least the second zigzag portion may be formed from the same wire, or each from its own wire.

[0047] In other words, in an exemplary embodiment, the inlay comprises a metal wire comprising at least the first zigzag portion and the second zigzag portion. For example, the metal wire of the inlay is then configured to produce all the connections of an electronic document on its own; i.e. a single metal wire may, for example, comprise all the zigzag portions of the inlay.

[0048] In another exemplary embodiment, the inlay comprises at least two metal wires, each of the at least two metal wires comprising at least one zigzag portion, or even a single zigzag portion.

[0049] In one exemplary embodiment, the connecting wire is further configured to connect together at least the first zigzag portion and the second zigzag portion. Thus, a single test can verify all of the connections.

[0050] Also provided, according to another aspect, is a method of manufacturing an electronic document comprising: A step of providing a body of the electronic document, the body comprising at least: ∘ an inlay, as described above; and ∘ at least one upper layer which covers the upper face of the substrate of the inlay, and a lower layer, the substrate of the inlay being disposed between the upper layer and the lower layer; A step of forming a cavity in the body, comprising at least one step of machining at least the upper layer of the body by means of a machining tool, in which the machining tool has a cutting direction forming an angle of between 80° and 100° relative to a rectilinear segment of the first zigzag portion.

[0051] To limit the risk of the wire being pulled out of the inlay, it is preferable for the machining tool, for example a milling cutter, to possibly encounter a wire depending on its width, i.e. its diameter. In this case, a cut may occur.

[0052] An angle formed between the wire and the tool preferably remains within a value range to limit the risk of the wire being pulled out.

[0053] Thanks to the presence of the connecting wire, the number of cut(s) is not important, the zigzag portions being connected to each other by this connecting wire.

[0054] Thus, according to an example of implementation of the method, the angle between the tool and a straight segment of a zigzag portion is approximately 90 degrees, + / -10°.

[0055] In an exemplary implementation, the step of forming the cavity in the body includes a step of forming a deep portion of the cavity in which the area of the top face of the substrate configured to form the deep portion of the cavity is machined.

[0056] According to one example, the second end of at least one of the rectilinear segments of the first zigzag portion is then cut by the machining tool.

[0057] In another example, the end of the part of the connecting wire, which is arranged next to the first zigzag portion, is then cut off by the machining tool.

[0058] In parallel, the straight segments that have been cut remain connected by the connection wire. It is thus possible to increase the contact surface between the first zigzag portion of the inlay and a connection terminal of a module that will be inserted into the cavity according to the different tolerances.

[0059] In an exemplary embodiment, the rectilinear segments of the first zigzag portion are arranged orthogonally to an edge between the counterbore and the deep part of the cavity, i.e. forming an angle of between 80° and 100° relative to the edge (i.e. 90° + / -10°).

[0060] Also proposed, according to another aspect, is an electronic document comprising: a body, which comprises: a cavity hollowed out in a part of a thickness of the body, the cavity comprising a deep central part and a peripheral part formed by a countersink, less deep than the deep central part, and surrounding the deep central part, and an inlay comprising at least one substrate and at least one first zigzag portion formed by a metal wire embedded in an upper face of the substrate, the first zigzag portion comprising alternately rectilinear segments and detours, a detour connecting two successive rectilinear segments, the first zigzag portion forming a connection pad, exposed on the countersink, the electronic document further comprising a module, inserted in the cavity, and comprising at least one connection terminal in electrical contact with the first zigzag portion of the inlay,and the electronic document being characterized in that the inlay comprises at least one connection wire connecting together and electrically connecting the rectilinear segments of the first zigzag portion.

[0061] Such an electronic document is, for example, a card, for example a chip card, with and / or without contact (for example a dual card).

[0062] The body of the electronic document, for example, complies with current standards, notably ISO 7810 and ISO 7816.

[0063] According to ISO 7816, the body can have several formats, also standardized. Four standardized formats, known by the following designations (see in particular ETSI TS 102 221 and ISO 7816), are mainly used: ID-1 having a length of 85.6 mm, a width of 54 mm, and a thickness of 0.76 mm; this format is sometimes referred to as 1FF (for "first form factor"); ID-000 (also called Plug-in UICC, or GSM SIM card) having a length of 25 mm, a width of 15 mm, and the same thickness of 0.76 mm; this format is sometimes referred to as 2FF (for "second form factor"); Mini-UICC (sometimes also called SIM card), with a length of 15 mm, a width of 12 mm, and the same thickness of 0.76 mm; this format is sometimes referred to as 3FF (for "third form factor"); A fourth, even smaller format, called nano-SIM or 4FF (for "fourth form factor"), the body then measuring 12.3 mm x 8.8 mm x 0.67 mm.

[0064] The concepts of length and width are defined here with reference to the orientation of the microcircuit.

[0065] The tolerances of all the bodies described here are of the order of 0.1 mm, or even 0.05 mm.

[0066] In an exemplary embodiment, the cavity has an apparent surface with dimensions approximately equal to 13.2 mm * 12 mm (+ / - 0.05 mm) for a cavity for receiving a secure element, for example a secure element configured to implement a payment transaction according to the EMV standard (“Europay, Mastercard and Visa, for example in its version 4.3”), or 16.3 mm x 16.3 mm (+ / - 0.05 mm) for a cavity configured to receive a biometric sensor. Any other cavity dimensions may also be suitable.

[0067] The electronic document module comprises, for example, at least one support, also called a carrier film, or, depending on the case, an insulating substrate, or sticker, or flexible plate.

[0068] The film has one side, called the external side, because it is intended to be accessible from the outside of the electronic document equipped with this module, and one side, called the internal side, opposite the external side, and intended to be oriented towards the inside of the cavity made in the body to receive the module.

[0069] The external face of the module includes, for example, an external interface.

[0070] The external interface includes, for example, external contact interfaces according to a well-defined configuration, for example by the ISO 7816 standard.

[0071] The external interface may also include a sensor, such as a biometric sensor.

[0072] The inner face carries, for example, connection terminals electrically connected to at least part of the external interface of the outer face.

[0073] Furthermore, at least one connection terminal is configured to be in contact with a zigzag portion, forming a connection pad, of the inlay of the electronic document body.

[0074] The module also generally includes a microprocessor, fixed on the internal face of the support.

[0075] For example, the module complies with the ISO 7816 standard.

[0076] Thus, when the module is inserted into the cavity, while the connection terminals are in contact with the counterbore, the microprocessor is located in the deep part of the cavity.

[0077] The invention, according to an exemplary embodiment, will be well understood and its advantages will appear better on reading the detailed description which follows, given for information purposes and in no way limiting, with reference to the appended drawings in which: there figure 1 schematically represents a traditional electronic document; the figure 2 schematizes a movement of a machining tool relative to a portion of wire according to different configurations; the figure 3 presents a first example of embodiment of the invention; the figure 4 presents a second exemplary embodiment of the invention; and the figure 5 presents an example of an option for carrying out the invention.

[0078] Identical elements shown in the above figures are identified by identical reference numerals.

[0079] There figure 1 schematically illustrates an electronic document 1.

[0080] The electronic document 1 for example has a body 10.

[0081] The body 10 here comprises a cavity 11 hollowed out in a part of a thickness of the body.

[0082] The cavity 11 comprises a deep, central part 12 and a counterbore 13, less deep, and surrounding the deep part 12.

[0083] The body 10 traditionally comprises at least one connection pad 14, arranged on the counterbore 13, configured to come into electrical contact with a connection terminal 21 of a module 20 inserted in the cavity 11; a microprocessor of the module 20 then being arranged in the deep part 12 of the cavity.

[0084] For this purpose, the connection area 14 is usually formed in an inlay 30, laminated into the body.

[0085] An "inlay" means a layer configured to be inserted into a thickness of the body of an electronic document, and incidentally, where appropriate, an intermediate layer which is inserted into the thickness of the body of the electronic document. This cavity therefore makes it possible, for example, to position the module in the electronic document, and to access the wires of the inlay which is located in the body, and therefore to electrically connect the module to the body of the document.

[0086] In such an electronic document, the cavity is usually manufactured by machining, for example by milling.

[0087] However, during the production of such an electronic document, several problems can arise, such as the wires of the inlay being torn off when the machining tool passes over it, or poor contact between the inlay and the module if the machining is not deep enough.

[0088] To limit tearing problems, as illustrated by the figure 2 A) , it appeared preferable that the machining tool 16 approaches a wire 15 according to its diameter d, as shown diagrammatically by the arrow 17.

[0089] However, as illustrated by the figure 2 B) , in practice, a zigzag wire 18 forming a connection area is arranged with its rectilinear segments arranged parallel to an edge 19 of the counterbore 13, or with a small angle α, so that the machining tool 16 is more likely to travel along the rectilinear segments according to their length.

[0090] There figure 2 C) thus illustrates a trajectory T of a machining tool 16 having a small angle α, of a few degrees, for example equal to or less than 6° with a rectilinear segment, while the figure 2 D) thus illustrates a trajectory T' of a machining tool 16 having a significant angle α, for example greater than 6°; for example approximately 35° with a rectilinear segment. In the latter case, more wires 18 can be torn off, which results in a connection gap, and a reduction in the useful surface area of the connection area.

[0091] There figure 3 presents a detail of inlay 40 according to a first exemplary embodiment of the invention.

[0092] The inlay 40 comprises at least one substrate 41.

[0093] The substrate 41 is for example formed from a sheet configured to be laminated with at least one other layer to form a card body.

[0094] It mainly comprises an upper face 43, in which at least one metal wire is embedded. The upper face 43 is initially considered to be flat.

[0095] The upper face 43 of the substrate 41 comprises several zones delimited here by dotted lines for illustrative purposes: a central zone 44, configured to form a deep part of the cavity; a peripheral zone 45, configured to form a counterbore of a cavity of an electronic document, which surrounds the central zone 44; and a zone 46 configured to be outside the cavity, which, here, surrounds the peripheral zone 45 and the central zone 44.

[0096] In order to establish connections with a module, the inlay 40 also comprises here at least a first zigzag portion 42 formed of a metal wire embedded in the upper face 43 of the substrate 41.

[0097] Said zigzag portion 42 is arranged at least partly in the zone 45 of the upper face 43 of the substrate 41 configured to form a counterbore of a cavity.

[0098] Said zigzag portion 42 comprises a wire 421 which is deposited in successive back and forth movements: it thus comprises rectilinear segments 422 connected to each other by detours 423 forming loops. The rectilinear segments 422 are here parallel to each other.

[0099] In the present exemplary embodiment, at least one of the rectilinear segments 422 comprises a portion 424 arranged in the zone 45 configured to form the counterbore of a cavity, as well as a first end 425 which extends into the zone 46 configured to be outside the cavity, and a second end 426 which extends into the zone 44 configured to form the deep portion of the cavity.

[0100] Here, the rectilinear segments 422 are arranged at an angle of between 80° and 100° (i.e. 90° + / -10°; i.e. substantially orthogonally) relative to a boundary 441 between the zone 44 and the zone 45, as well as to a boundary 442 between the zone 45 and the zone 46. The boundary 441 represents a future edge 19 between the counterbore and the deep part of the cavity and the boundary 442 represents a future edge between the counterbore and a part outside the cavity when the inlay is rolled into a body and machined to form the cavity.

[0101] In the present embodiment, the inlay comprises a total of eight zigzag portions which all have the same characteristics as the first zigzag portion 42.

[0102] The eight zigzag portions are arranged regularly at least partly in the area 45 configured to form the counterbore of the cavity.

[0103] Here, the eight zigzag portions are arranged two by two along four sides of a rectangle to form a rectangular cavity.

[0104] On the figure 3 , the inlay 40 further comprises a connecting wire 47.

[0105] The connecting wire 47 is configured to connect together at least the straight segments 422 of the first zigzag portion 42.

[0106] For this, the connecting wire 47 comprises a part 471 which intersects at least the first zigzag portion 42 outside the zone 44 configured to form a deep part of the cavity.

[0107] This makes it possible to limit, or even eliminate, the risk of cutting part 471 when the inlay is machined to form the deep part of the cavity.

[0108] In the present embodiment, the part 471 which intersects the first zigzag portion 42 is even located in the zone 46 configured to be outside the cavity.

[0109] It is thus located in an area which is theoretically not machined.

[0110] For example, this is an area of the substrate configured to remain covered by at least one layer when the inlay is assembled between layers to form an electronic document body.

[0111] The connecting wire also comprises here at least one part 472 arranged next to the first zigzag portion 42, and which comprises at least one end 473 arranged in the zone 44 configured to form the deep part of the cavity.

[0112] This part is thus configured to be cut during the machining of the cavity.

[0113] Further, in the present embodiment, all eight zigzag portions are connected by the connecting wire 47.

[0114] Thus, the connecting wire 47 comprises eight parts 471, and eight parts 472, so that once their end 473 is cut, the eight zigzag portions are isolated from each other, but the connections of their rectilinear segments between them remain ensured by the parts 471.

[0115] The example of the realization of the figure 4 differs from that of the figure 3 by an arrangement of certain parts 471 of the connecting wire 47 which each intersect one of the zigzag portions, and by an arrangement of certain parts 472 which nevertheless comprise at least one end 473 arranged in the zone 44 configured to form the deep part of the cavity.

[0116] The path of the connection wire 47 is, for example, optimized here to obtain a maximum number of connections.

[0117] Thus, for example, parts 472a and 472b form fewer meanders here than on the figure 3 .

[0118] For example, part 471a, part 471c and part 471d are here arranged in zone 45 configured to form a counterbore, and no longer in zone 46 like part 471b.

[0119] In addition, the part 471a and the part 471b here comprise a zigzag whose rectilinear segments are arranged orthogonally to the rectilinear segments of the corresponding zigzag portion 42a or 42b.

[0120] For part 471a, the straight segments are then configured to be arranged parallel to a path of a machining tool.

[0121] Furthermore, part 471a and part 471c are further located so as to come into contact with connection terminals 21 of a module when the corresponding electronic document is manufactured, while part 471d is configured to bypass a future corresponding connection terminal 21.

[0122] Thus, from such an inlay 40, for example as shown figure 3 ou figure 4 , an electronic document 1 is produced according to a process comprising, for example, the following steps: A step of providing a body 10 of the electronic document, the body comprising at least: ∘ an inlay 40, as described above; and ∘ at least one upper layer which covers the upper face of the substrate of the inlay, and a lower layer, the substrate of the inlay being arranged between the upper layer and the lower layer; A step of forming a cavity 11 in the body 10, comprising at least one step of machining at least the upper layer of the body by means of a machining tool 16, in which the machining tool 16 has a cutting direction forming an angle α of between 80° and 100° relative to a rectilinear segment 422 of the first zigzag portion 42.

[0123] The step of forming the cavity further comprises a step of forming the deep part of the cavity in which the zone 44 of the substrate is machined.

[0124] Thus during this step, the second ends 426 of the rectilinear segments 422 of the zigzag portions 42 are cut, as well as the ends 473 of the parts 472 of the connecting wire 47.

[0125] However, the straight segments remain connected by the connecting wire 47 thanks to the corresponding parts 471.

[0126] As illustrated by the figure 5 , it is thus possible to increase the contact surface between a zigzag portion 420 of the inlay and a connection terminal 21 of a module which will be inserted into the cavity according to the different tolerances.

[0127] As illustrated in this figure, the zigzag portion can thus extend wider than where the connection terminal 21 is located.

[0128] This figure also shows that the rectilinear segments of the zigzag portion 420 are arranged orthogonally to an edge 19 between the counterbore 13 and the deep part 12 of the cavity 11, that is to say forming an angle of between 80° and 100° relative to the edge (i.e. 90° + / -10°).

[0129] Finally, this figure presents for illustrative purposes the zigzag portion 420 according to another exemplary embodiment.

[0130] For example, the wire path of the zigzag sections is optimized to achieve maximum connection. Its design will therefore take into account various tolerances, for example the location of the zigzag sections, milling, module layout, different wires, etc.

[0131] Such a process thus makes it possible to produce an electronic document comprising: A body 10, which comprises: a cavity 11 hollowed out in a part of a thickness of the body, the cavity comprising a deep central part 12 and a peripheral part formed by a counterbore 13, less deep than the deep part, and surrounding the deep part, and an inlay 40 comprising at least a first zigzag portion 42, forming a connection area, exposed on the counterbore 13, and comprising at least one connection wire 47 connecting together the rectilinear segments 422 of the first zigzag portion, and A module 20, inserted in the cavity 11, and comprising at least one connection terminal 21 in electrical contact with the first zigzag portion 42 of the inlay 40.

[0132] Such an electronic document is, for example, a card, for example a chip card, with and / or without contact (for example a dual card).

[0133] The electronic document module comprises, for example, at least one support, also called a carrier film, or, depending on the case, an insulating substrate, or sticker, or flexible plate, etc.

[0134] The film has one side, called the external side, because it is intended to be accessible from the outside of the electronic document equipped with this module, and one side, called the internal side, opposite the external side, and intended to be oriented towards the inside of the cavity made in the body to receive the module.

[0135] The external face of the module includes, for example, an external interface.

[0136] The external interface includes, for example, external contact interfaces according to a well-defined configuration, for example by the ISO 7816 standard.

[0137] The external interface may also include a sensor, such as a biometric sensor.

[0138] The module also generally includes a microprocessor, fixed on the internal face of the support then placed in the deep part of the cavity.

Claims

1. Inlay (40) comprising at least one substrate (41) and at least one first zigzag portion (42) formed of a metal wire (421) embedded in an upper face (43) of the substrate (41), the first zigzag portion (42) comprising, alternately, rectilinear segments (422) and bends (423), a bend (423) connecting two successive rectilinear segments (422), at least one of the rectilinear segments (422) of the first zigzag portion (42) being disposed, at least in part, in a zone (45) of the upper face (43) of the substrate (41) configured to form a spotface (13) of a cavity (11) of an electronic document (1), and the inlay (40) being characterized in that the inlay comprises a connection wire (47) configured to join together and electrically connect at least the rectilinear segments (422) of the first zigzag portion (42) .

2. Inlay (40) according to Claim 1, characterized in that the connection wire (47) comprises a part (471) which intersects at least the first zigzag portion (42) outside a zone (44) of the upper face (43) of the substrate (41) configured to form a deep part of the cavity.

3. Inlay (40) according to Claim 2, characterized in that the connection wire (47) comprises at least one part disposed next to the first zigzag portion (42), and that part of the connection wire (47) disposed next to the first zigzag portion (42) comprises at least one end disposed in that zone (44) of the upper face (43) of the substrate (41) configured to form the deep part of the cavity.

4. Inlay (40) according to either of Claims 2 and 3, characterized in that the at least one of the rectilinear segments (422) of the first zigzag portion (42) forms an angle of between 80° and 100° with respect to a limit between that zone (45) of the upper face (43) of the substrate (41) configured to form the spotface (13) of the cavity (11) and that zone (44) of the upper face (43) of the substrate (41) configured to form the deep part of the cavity.

5. Inlay (40) according to any one of Claims 2 to 4, characterized in that the at least one of the rectilinear segments (422) of the first zigzag portion (42) comprises an end, called a second end, which extends in that zone (44) of the upper face (43) of the substrate (41) configured to form the deep part of the cavity.

6. Inlay (40) according to any one of Claims 1 to 5, characterized in that the connection wire (47) comprises a part (471) which intersects at least the first zigzag portion (42) in a zone (46) of the upper face (43) of the substrate (41) configured to be outside the cavity.

7. Inlay (40) according to Claim 6, characterized in that the at least one of the rectilinear segments (422) of the first zigzag portion (42) comprises at least one end, called a first end, which extends in that zone of the upper face (43) of the substrate (41) configured to be outside the cavity.

8. Inlay (40) according to any one of Claims 1 to 7, characterized in that the inlay (40) additionally comprises at least one second zigzag portion disposed, at least in part, in that zone (45) of the upper face (43) of the substrate (41) configured to form the spotface (13) of the cavity (1).

9. Inlay (40) according to Claim 8, characterized in that the connection wire (47) is additionally configured to join together at least the first zigzag portion (42) and the second zigzag portion.

10. Method for producing an electronic document (1), comprising: - a step of making available a body (10) of the electronic document (1), the body comprising at least: - an inlay (40), according to any one of Claims 1 to 9; and - at least one upper layer which covers the upper face (43) of the substrate (41) of the inlay (40), and a lower layer, the substrate (41) of the inlay (40) being disposed between the upper layer and the lower layer; - a step of forming a cavity (11) in the body (10), comprising at least one step of machining at least the upper layer of the body by means of a machine tool, in which step the machine tool has a cutting direction forming an angle of between 80° and 100° with respect to a rectilinear segment of the first zigzag portion (42).

11. Method according to Claim 10, characterized in that the step of forming the cavity (11) in the body (10) comprises a step of forming a deep part of the cavity, in which step that zone (44) of the upper face (43) of the substrate (41) configured to form the deep part of the cavity is machined.

12. Method according to Claim 11, characterized in that the second end of the at least one of the rectilinear segments (422) of the first zigzag portion (42) is then cut by the machine tool.

13. Method according to either of Claims 11 and 12, characterized in that the end of that part of the connection wire (47) disposed next to the first zigzag portion (42) is then cut by the machine tool.

14. Electronic document (1) comprising: - a body (10), which comprises: - a cavity (11) hollowed out in a part of a thickness of the body, the cavity comprising a deep central part (12) and a peripheral part, formed of a spotface (13), less deep than the deep central part and surrounding the deep central part (12), and - an inlay (40) comprising at least one substrate (41) and at least one first zigzag portion (42) formed of a metal wire (421) embedded in an upper face (43) of the substrate (41), the first zigzag portion (42) comprising, alternately, rectilinear segments (422) and bends (423), a bend (423) connecting two successive rectilinear segments (422), the first zigzag portion (42) forming a connection pad, exposed on the spotface (13), - the electronic document (1) further comprising a module (20), inserted into the cavity (11), and comprising at least one connection terminal (21) in electrical contact with the first zigzag portion (42) of the inlay (40), - and the electronic document (1) being characterized in that the inlay comprises at least one connection wire (47) joining together and electrically connecting the rectilinear segments of the first zigzag portion (42).