Housing for an electronic device

Abstract

The invention relates to a housing (1) for an electronic device, comprising a first housing part (10) which is designed to accommodate the electronic device (90), and a second housing part (20) which is designed to fully accommodate the first housing part (10) in itself. An intermediate space (30) formed between the first housing part (10) and the second housing part (20) is sealed by the two housing parts (10, 20) and filled with a potting compound (32), while an interior space (12) of the first housing part (10) that accommodates the electronic device (90) is not filled with the potting compound (32). The first housing part (10) is designed as a part which is separate from the second housing part (20) and is spaced apart from the second housing part (20) by a number of spacers (11) in order to form the intermediate space (30). The first housing part (10) including the spacers (11) is dimensioned in relation to the second housing part (20) so that the first housing part can be inserted, in sliding contact between the spacers (11) and the second housing part (10), into a fixed spatial position within the second housing part (20) before a step of potting the potting compound, the potting compound (32) substantially fully enclosing the first housing part (10).

Description

[0001] HOUSING FOR AN ELECTRONIC DEVICE

[0002] DESCRIPTION

[0003] Technical area

[0004] Various embodiments relate to a housing for an electronic device. They particularly also relate to housings for electrical ballasts used to operate semiconductor light sources.

[0005] background

[0006] Electronic devices, particularly electronic ballasts for operating light sources, are often installed in housings specially adapted for the application. These offer a certain degree of protection against contact with body parts, or the ingress of dirt, water, moisture, etc. and also allow mechanical installation in the vicinity of the respective light sources. In addition to conventional applications in domestic (residential) areas or offices with power consumptions of, for example, 10 - 100 W, such devices are also used in industrial areas, where power consumptions of, for example, up to 500 W or more. The requirements for heat dissipation and fire protection, for example, are increasing here, and the corresponding housings are dimensioned accordingly and made of suitable materials. For special applications, such as in larger greenhouses or similar.Ballasts with even higher power consumption can be considered, without restricting the general public, e.g. 600 W or 1200 W.

[0007] Especially when using electrical ballasts to operate light sources in greenhouses – as is the case in all outdoor areas, but frequently also indoors – the question of the suitability of electrical equipment for the respective environmental conditions arises. The housing should be configured to provide protection, in particular, against the ingress of moisture or water. The goal is to protect people from hazards and to protect the corresponding circuit components or the devices they operate from failure, e.g., due to water ingress, corrosion, or a conductive film of moisture. Impairments due to mechanical influences (shocks, etc.) must also be taken into account to ensure reliable function and safe use of the device.

[0008] To make it easier for users to select devices suitable for their specific applications, so-called IP protection classes (IP = ingress protection) were introduced, which are also defined in standards such as DIN EN 60529 or ISO 20653. For example, the relevant protection classes for humidity are IP64, IP65, IP66, IP67, and IP68. The first number, "6," indicates dust tightness and complete protection against contact. The second number, "4" (IP64), indicates protection against splash water from all directions, the number "5" (IP65) indicates protection against jets of water from a nozzle at any angle, the number "6" (IP66) indicates protection against powerful jets of water, the number "7" indicates protection against temporary submersion, and the number "8" (IP68) indicates protection against permanent submersion (usually up to 1 m).These protection classes IP64 to IP68 therefore indicate, in a graduated manner, approximately the scope of requirements that must be met by the appropriately designed enclosures for the specific areas of application specified above (greenhouses, plantations, parks or gardens, outdoor areas, industrial applications, including indoor areas, etc.).

[0009] This is usually achieved using encapsulated housings. For example, a housing containing a complete electronic assembly is filled with a potting compound that, once cured, is solid or viscous, so that the electronic components are embedded in the potting compound. This can reduce phenomena such as discharges between live components, absorb shocks and vibrations, and, in particular, prevent the penetration of water, moisture, or corrosive agents from the outside. Thermosetting plastics or silicone rubber gels are generally used as potting compounds (as in the exemplary embodiments described below). Epoxy resins are also considered and are also very common. During the potting process, an electronic assembly is inserted into a prefabricated housing, the openings in which, for example, for cable feedthroughs, etc., are then filled.- except for the filling opening - are sealed to prevent the potting compound from escaping before it hardens. The still-liquid potting compound is then poured into the filling opening.

[0010] When encapsulating a housing that contains an electronic ballast with electronic components mounted on a circuit board (e.g. in SMD design), encapsulating compounds with a low glass transition temperature such as polyurethane or silicone are preferably used because the forces that arise during the shrinking process during the cooling or curing following filling, and which could then act on the components, are lower in this case.

[0011] However, these advantages of complete encapsulation are offset by aspects of reduced sustainability, increased costs in terms of the encapsulation material, and increased weight. Regarding sustainability, it should be noted that when components are encapsulated in the encapsulation compound, recycling the materials is problematic due to their separation after the device's useful life. Regarding material costs and weight, it should be noted that with appropriately adapted housings, the volume occupied by the interior could potentially be reduced. However, this would no longer allow the use of inexpensive standard components such as extruded profiles, so an increase in costs is to be expected in this regard.

[0012] However, the materials mentioned above and commonly used for potting compounds provide a suitable connection to the outside for heat dissipation from electronic components that heat up during operation, such as chokes or power semiconductors. If, for the reasons mentioned above, the potting compound is simply omitted, other suitable heat dissipation measures would have to be taken instead, which, however, could potentially result in higher costs.

[0013] Consequently, there is a need to reduce assembly costs and effort, as well as to ensure reliable heat dissipation from electronic components that heat up during operation. Furthermore, improving assembly accuracy may be a challenge.

[0014] Presentation of various aspects

[0015] According to one aspect, this can be taken into account by proposing a housing for an electronic device, comprising the first housing part, which is configured to accommodate the electronic device, and a second housing part, which is configured to completely accommodate the first housing part. An intermediate space is formed between the first inner housing part and the second housing part, which is sealed by both housing parts and filled with a potting compound, while an interior space of the first housing part, which accommodates the electronic device, is not filled with the potting compound.

[0016] The first housing part is formed as a separate part from the second housing part and is spaced from the second housing part by a number of spacers to form the intermediate space. The spacers can be provided on the first inner housing part, on the second outer housing part, or as separate parts from both. Without limiting the generality, it is also possible for the spacers to be introduced only temporarily during casting to define the intermediate space, and then removed during curing or cooling, so that no spacers (or, depending on the case, fewer spacers than before) are present in the finished product.The first housing part including the spacers is dimensioned with respect to the second housing part in such a way that, before a step of casting the casting compound, it can be inserted into a fixed spatial position within the second housing part in sliding contact between the spacers and the second housing part, wherein the casting compound essentially completely encloses the first housing part.

[0017] The proposed housing therefore has a double-shell structure due to the two separate housing parts, whereby the space between the two housing parts is filled with the potting compound, while the interior of the inner (first) housing part only accommodates the electronic device and is not filled with the potting compound, or is filled with only small, ineffective amounts. The intermediate space and the interior are hermetically sealed from one another by the inner (first) housing part in order to prevent the potting compound from running in during the potting process. The potting compound itself serves, in its finished state - e.g., when cured or simply cooled below the glass transition temperature - to protect the interior from moisture or water, which it achieves by essentially completely enclosing the inner (first) housing part."Substantially" here means that individual projections, such as the spacers intended to establish at least a sliding contact between the two housing parts, or a channel (also described below) that accommodates a valve that allows moisture to escape from the interior after sealing but not enter, may still extend through the potting compound, or even should to achieve the respective purpose. It is advantageous if there are no air holes in the potting compound that would allow the inner (first) housing part and the outer (second) to face each other, or if they even touch directly (without spacers or channels designed for dehumidification).

[0018] This design with moisture protection allows for the more demanding protection classes IP67 or even IP68 to be achieved. At the same time, however, other advantages can also be achieved, such as, most importantly, a significant savings in potting compound, which no longer needs to fill the interior. According to exemplary embodiments, a material savings of 70% or more in potting compound can be achieved compared to the conventional case, in which the housing only comprises the second (outer) housing part proposed here, thus omitting the first (inner) housing part.

[0019] Due to its material properties, silicone is particularly suitable as a potting compound for a wide range of applications, where the aforementioned IP67 or IP68 protection ratings are achieved. Given the market prices of silicone, the proposed aspects can achieve significant cost reductions while maintaining the protection ratings. Other materials such as plastics, especially thermosets, are also possible, such as epoxy resins, cross-linkable polyurethanes, unsaturated polyester resins, tar, etc.

[0020] At the same time, the material savings also lead to a weight reduction of the finished component. On the one hand, this in turn allows for cost savings in transport during production and especially in distribution. On the other hand, according to specific example designs relating to applications in the industrial sector and beyond, for example, in greenhouses, etc., this also results in advantages in that, with the total weights typically involved in this field in the single- or double-digit kilo range, the load-bearing capacity of the structures, for example on the rails or beams in the ceiling area to which the components are to be attached, is reduced. In the specific example of greenhouses, these structures can also be steel profile scaffolding with defined load limits. The material and weight savings also broaden the area of ​​application.Furthermore, a reduction in the total combustible mass can also be a particular advantage.

[0021] Furthermore, the aspects proposed here can also significantly reduce the development time of the measures required for assembly.

[0022] A further advantage can be improved sustainability if, after the component's useful life has expired, the electronic components can be easily separated from the housing components during disposal. Because the electronic components are housed in the empty interior of the first (inner) housing section, they can be easily removed after disassembly and disposed of appropriately, saving considerable time and money. Electronic components contaminated with hazardous substances such as arsenic can thus be very easily identified and individually treated, for example, without leaving silicone residue on them.

[0023] According to one embodiment, the first inner housing part comprises a substantially cuboid-shaped base section with an opening and a cover section placed onto this opening, which closes off the interior. The cover section can be flat and optionally have ribs or similar structures that reinforce the shape of the cover section and / or assist heat radiation. In a simple, optional case, the structure can be proposed similar to a shoebox principle. The opening can, for example, correspond to one of the cuboid surfaces. During assembly, the structure allows easy insertion of, for example, a relevant circuit board with the electronic components and, if applicable, thermal pads on the top side of the electronic components of the circuit board. The cover can be used to quickly and securely close the base section. For automated production, this means very little effort.

[0024] According to an embodiment of an electronic device based thereon, both the base section and the cover section are provided with spacers. When the cover section is in place and when the first (inner) housing part is inserted (in the second, outer housing part), at least some of the spacers of the base section and the cover section are in contact with opposing inner walls of the second housing part. In particular, the cover section can be held pressed against the base section. The spacers can be, for example, flat, plate-like sections protruding from the surface of the base and cover sections. They can protrude vertically or at an angle. They can also be formed integrally with the base and / or cover section.The spacers can have a certain degree of flexibility or resilience to resiliently contact the opposite inner wall of the second outer housing part. An excess dimension is not absolutely necessary – what is relevant in this embodiment is that the first inner housing part assumes a secure and stable position within the second outer housing part thanks to the spacers, allowing the predetermined gap to be essentially achieved all around, while maintaining the ability of the first inner housing part to move relative to the second outer housing part through smooth sliding contact.

[0025] According to a further optional refinement, in the housing for an electronic device according to one of the two aforementioned exemplary embodiments, recesses extending from a respective edge can be provided in the base section and / or in the cover section, into which recesses sliding elements (sliders) are inserted, which are designed to seal the recesses, e.g. as in a tongue and groove connection and optionally additionally with a sealing ring, e.g. made of rubber, inserted into the groove. Passages, again with sealing elements, are provided in the sliding elements for the feedthroughs of electronic cables, which are configured for the power supply or output of the electronic device. The sliding elements can be pre-slid onto the cables during production. This design achieves a secure seal and, at the same time, simple assembly of the component.

[0026] In the exemplary embodiments, the cover section may comprise a plate, preferably made of metal, in particular aluminum, which plate essentially seals the opening tightly. For this purpose, a seal (O-ring) or a seal with a different cross-sectional shape made of rubber may also be provided.

[0027] In such a case, the lid section can optionally have a holding frame, preferably made of plastic, which encompasses the plate. The holding frame carries the relevant spacers of the lid section and further has fastening elements which are able to fix the lid section to the base section during assembly. Alternatively, the corresponding snap hooks or locking elements can also be formed on the tray formed by the base section. In this way, the plate can essentially seal the container tightly and at the same time serve to dissipate heat, while the holding frame takes on mechanical functions (defining the gap and fixing the lid to the base section or pressing it against it). The holding frame can optionally be made of just one plastic, like the base section, for example. A multi-part holding frame and the use of other materials such as metal or ceramic is also possible.

[0028] The plate, however, can be connected to thermally conductive elements of the electronic device directly or indirectly via thermally conductive pads, pastes, or adhesives, or via additional metal elements, in particular plates and / or screws, to dissipate the heat. The heat is transferred from the inside—generated in the electronic components on the circuit board—e.g., via the thermal pads or thermal grease, to the aluminum plate, and from there to the potting compound (here, silicone) to the outer casing. The silicone adjacent to the filling (if used) can have a sufficient thermal conductivity coefficient for the application, ensuring adequate cooling of the electronic components during operation.

[0029] According to one embodiment, the second housing part comprises a hollow tubular profile and two end plates that can be attached to the two tube openings on the opposite end. As indicated above, the first (inner) housing part can thus be inserted through one of the two tube openings into its predetermined spatial position, with the spacers sliding on the inner surface of the tube. Assembly is therefore very simple, and easily cut and very inexpensive stand components can be used. This applies in particular if, for example, an extrusion or continuous casting profile, particularly made of aluminum, is used for the hollow tubular profile. Optionally, the hollow tubular profile can also have a substantially rectangular cross-section, into which the cuboid-shaped first (inner) housing part proposed above can be inserted along its longitudinal axis.The outer and / or inner surface may have a structure (ribbing, etc.) for better cooling.

[0030] Furthermore, the second outer housing part can have one or more flanges for attachment to an external structure (building wall, greenhouse scaffolding, etc.). According to a special design, a longitudinally extending bracket can also be provided on the outside of the tubular profile, which is plugged or slid onto a bracket on the scaffolding or wall with a complementary cross-sectional profile, e.g., a T-shape.

[0031] Furthermore, at least one of the end plates can optionally have additional sealing cable bushings for the electronic cables of the electronic device, the position of which, in the assembled state, is opposite the sliding elements inserted into the recesses of the base section.

[0032] According to a particular aspect, an outwardly projecting passage channel can be formed in an end-side outer wall of the base section or the cover section, which in the assembled state extends through the intermediate space to one of the two end plates and is open through this to the outside, wherein a valve for pressure equalization and the possibility of removing air moisture from the interior of the assembly is provided in the passage channel, which valve is permeable to air in both directions but permeable to moisture only in one direction to the outside.

[0033] The valve fulfills two functions: firstly, the valve acts through a membrane to relieve excess pressure in the interior (i.e., pressure equalization with the environment) when the electronic assembly within the first (inner) housing section heats up during operation. Secondly, through the same or an additional membrane, it prevents the accumulation of moisture inside due to the resulting negative pressure when the electronic assembly cools down (even after curing). Otherwise, moisture accumulating inside the first (inner) housing section could, under certain circumstances, lead to a loss of functionality and safety of the circuit board and the installed electronic components.

[0034] According to a further aspect, which can be combined with some or all of the above examples and aspects, a housing for an electronic device is proposed, in which the proportion of the volume of the filled space in the total volume composed of the space and the interior—excluding the volume occupied by the electronic device—is 50% or less, preferably 40% or less, more preferably 30% or less, up to 20% or less. The smaller the proportion of the filled space, the greater the material, cost, and weight savings.

[0035] The aforementioned aspects and embodiments prove particularly advantageous when the housing contains an electronic device comprising a circuit board with electronic components mounted thereon, wherein the electronic device is preferably an electronic ballast for semiconductor light sources, more preferably with a power consumption of 500 watts or more. Clear advantages can also be seen with power consumptions of only 300 watts or more.

[0036] A particularly preferred specific embodiment of the above-mentioned aspects of a housing according to the invention provides for at least one aperture to be formed in the first inner housing part. This aperture can define a partial space of the intermediate space filled by the potting compound, which is located, for example, within the contours of the inner housing part, but does not belong to its unfilled interior space, but rather is separate from it and filled with the potting compound. The partial space is defined or delimited by lateral end walls of the first inner housing part and a surface of a heat sink and / or circuit board extending at least partially into the interior space. The partial space is open towards the intermediate space.

[0037] According to this aspect, it is particularly possible to improve the dissipation of heat from the heat sources occurring during operation of the electronic device. The access of the encapsulating compound to the heat sources, provided by the at least one aperture, allows direct and, above all, large-area contact of the encapsulating compound with the heat sources or with heat sinks connected to them. By determining the geometric shape of the first inner housing part, the subspace can be specifically designed so that it is only dimensioned to reach the heat source. As a result, only a small portion of the unfilled interior space of the inner housing part is "lost," and the weight increase remains manageable. At the same time, the heat can be efficiently dissipated thanks to the sufficient thermal conductivity coefficient of the encapsulating compound.The measures provided for in some of the above-mentioned aspects or embodiments can be omitted, so that the overall number of parts can even be reduced. For example, the support frame and the metal plate of the cover section can now be designed as a single piece and as an inexpensive plastic component.

[0038] In the event that the partial space defined by the at least one aperture is delimited by the circuit board, at least one electronic component, in particular a choke, a power transistor, or an integrated circuit, of the electronic device can be mounted on the circuit board and be in direct, thermally conductive contact with the potting compound. This is particularly the case if the partial space is defined such that the electronic component is positioned within it and is thus preferably completely or partially enclosed by the potting compound. For example, a partial region of the surface of the circuit board can form a low-lying closure at the bottom of the aperture (or form the bottom itself), starting from the outer surface of the inner first housing part.All components mounted in this sub-area on the same side of the circuit board are then automatically located in the sub-space defined by the aperture and are surrounded or enclosed by the potting compound, thus providing contact over a large area.

[0039] In the case where the partial space defined by the at least one aperture is delimited by the heat sink, at least one electronic component, here again in particular a choke, a power transistor, or an integrated circuit, of the electronic device can be mounted on the circuit board, but still be located in the unfilled interior space. This is where the heat sink comes into play: the electronic component can then be in direct, heat-conducting contact with the heat sink. The heat sink transports the heat from this contact area to that with the encapsulating compound in the partial space defined by the aperture.

[0040] It should be noted that the term heat sink can also include the circuit board itself, although heat sinks or metal surfaces are more obvious options. While the circuit board is made of an electrically non-conductive, generally fire-resistant material, such as FR-4 or another fiberglass material, the heat sources mounted on it are connected via pins, leads, and solder joints to pads and traces, as well as larger and / or distributed metal surfaces on the circuit board, so that the generated heat is quickly transferred to them. If the circuit board is in direct contact with the potting compound, this dissipated heat is also quickly transported through the relatively thin circuit board substrate or directly through a wafer-thin surface passivation layer—depending on which side the potting compound is adjacent to. The circuit board thus functions as a heat sink.

[0041] According to one embodiment, the electronic component is mounted on the circuit board using through-hole (PTH) technology. This means that connection pins are inserted through holes in the circuit board and soldered, for example, by wave soldering on the back side using solder paste to pads provided there. These designs are suitable for both the alternative of encapsulation in the space defined by the aperture and for thermal coupling with a heat sink.

[0042] Another embodiment involves attaching the electronic component to the circuit board using surface mounting technology (SMT). This process particularly involves reflow soldering with a single oven step. One advantage is that the electronic components can be attached to both sides of the circuit board. Sensitive SMT components can be attached to the same side as the PTH components, since the opposite side of the circuit board is primarily affected by wave soldering.

[0043] Through the targeted use of apertures, aspects of the invention can now define apertures in the first inner housing part on both sides of the circuit board. These apertures help create sub-chambers filled with potting compound, through which heat from these components can be dissipated from both sides of the circuit board where necessary. In the first embodiment, the effort required for this would be significantly greater.

[0044] According to a further embodiment, the lateral end walls completely enclose the partial space defined by the at least one aperture and are in sealing contact with the heat sink and / or circuit board extending within the interior space via a sealing ring. This prevents unwanted ingress of potting compound into the interior space. The end walls can preferably be formed integrally with the first inner housing part and extend inward from its outer surface.

[0045] For the purpose of sealing, the end walls can have a groove running all the way around at their end facing the interior, into which the sealing ring is inserted or injected.

[0046] The at least one aperture can be formed in the or in a cover section of the first housing part. Conversely, the at least one aperture can also be formed in the or in a base section of the first housing part. Thus, access to the components is possible from both sides.

[0047] Furthermore, at least two of the apertures can be provided, wherein one aperture is formed in the or in a cover portion of the first housing part, and one aperture is formed in the or in a base portion of the first housing part.

[0048] Furthermore, the circuit board can be equipped with electronic components on both sides and extend from the cover section and from a bottom of the base section through sub-chambers defined by the apertures and filled with the encapsulating compound to the circuit board, in order to enclose at least one electronic component with the encapsulating compound. This results in the advantages described above.

[0049] Further advantages, features, and details of the various aspects emerge from the claims, the following description of preferred embodiments, and the drawings. In the figures, like reference numerals designate like features and functions.

[0050] Short description of the drawings

[0051] They show:

[0052] Fig.1 shows a perspective view of a base section of a first inner housing part of a housing according to a first embodiment;

[0053] Fig. 2 shows a partial perspective view of the process of placing an electronic device in the first inner housing part of Fig. 1; Fig. 3 shows a perspective view of the state after completion of the placement in Fig. 2;

[0054] Fig. 4 shows in perspective the process of providing a sealing ring;

[0055] Fig. 5 is a perspective view showing the placement of a plate of a cover portion of the first inner housing part onto the base portion as shown in Fig. 4;

[0056] Fig. 6 shows a perspective view of the placement of a holding frame on the plate and its subsequent snapping onto the edge of the opening of the base section;

[0057] Fig. 7 is an enlarged, partial cross-sectional view through the assembled first inner housing part with details of the fixation of the cover section to the base section, from the perspective of the front side;

[0058] Fig. 8 like Fig. 7, but as a side view, from the perspective of the front side;

[0059] Fig. 9 shows a perspective view of a process of inserting the assembled first inner housing part into a tubular profile of a second outer housing part according to the embodiment;

[0060] Fig. 10 shows a perspective view of an outer side of a first end plate for closing the tubular profile shown in Fig. 9;

[0061] Fig. 11 shows a perspective view of an inner side of the first end plate from Fig. 10;

[0062] Fig. 12 shows a perspective view from the top side of the first end plate attached to the tubular profile; Fig. 13 shows a perspective view from the bottom side of the first end plate attached to the tubular profile;

[0063] Fig. 14 shows, in a perspective section, the housing assembled from the first inner housing part and the second outer housing part according to the exemplary embodiment with a valve for pressure equalization and the possibility of removing air humidity from the interior of the assembly, in an enlarged view;

[0064] Fig. 15 shows a side sectional view of the assembled housing with the potting compound filled in it (the figure shows the surface at the top which is inclined to the longitudinal axis);

[0065] Fig. 16 shows an enlarged perspective section through the housing of Fig. 15;

[0066] Fig. 17 is a perspective external view of the assembled housing according to the embodiment;

[0067] Fig. 18 shows a perspective view of a first inner housing part of a housing according to a second embodiment, with several apertures formed in the cover section;

[0068] Fig. 19 shows a perspective cross-sectional view of a section along the longitudinal axis through the first inner housing part of Fig. 18;

[0069] Fig. 20 is a partial enlargement of the cross-sectional view of Fig. 19 with focus on a second of the apertures formed in the lid section;

[0070] Fig. 21 is a section similar to Fig. 19 along the longitudinal axis through the first inner housing part of Fig. 18, but laterally offset in the direction perpendicular to the longitudinal axis; Fig. 22 is a partial enlargement of the cross-sectional view of Fig. 21, focusing on a first of the apertures formed in the cover section;

[0071] Fig. 23 is a perspective view of the first inner housing part of the housing according to the second embodiment of Fig. 18, but viewed from the rear, with a third aperture formed in the bottom of the base portion;

[0072] Fig. 24 similar to Fig. 19 and 21 a section along the longitudinal axis through the first inner housing part from Fig. 18, but again laterally offset in the direction perpendicular to the longitudinal axis;

[0073] Fig. 25 is a partial enlargement of the cross-sectional view of Fig. 24 with focus on the third aperture;

[0074] Fig. 26 the same perspective section from Fig. 25, but viewed from below;

[0075] Fig. 27 is a perspective sectional view through the assembled housing according to the second embodiment parallel to and along the longitudinal axis with the first inner housing part and the second outer housing part and filling of the intermediate space;

[0076] Fig. 28 like Fig. 27, but with a slightly laterally offset cut;

[0077] Fig. 29 is a partial enlargement of the cross-sectional view from Fig. 28 with focus on the first aperture with throttle in the filled state.

[0078] Preferred embodiment(s) of the invention

[0079] In the following description of preferred embodiments, it should be understood that the present disclosure of the various aspects is not limited to the details of the construction and arrangement of the components as shown in the following description and in the figures. The embodiments may be practiced or carried out in a variety of ways. It should also be understood that the phraseology and terminology used herein is for the purpose of specific description only and should not be construed as limiting by those skilled in the art.Furthermore, in the following description, the same reference numerals in the various embodiments or figures designate the same or similar features or objects, so that in some cases a repeated detailed description of the same is omitted in order to maintain the compactness and clarity of the illustration.

[0080] Figures 12-17 show a first embodiment of a housing 1 in various perspectives and sections, while for clarity, Figures 1-11 reflect individual steps of assembling the housing 1, starting with the provision of a base section 13 of a first inner housing part 10. For the sake of clarity of the individual components, the description of the assembly begins.

[0081] Fig. 1 shows a perspective view of an initially provided base section 13 of a first inner housing part 10 (hereinafter referred to only as the "inner housing part"), wherein the base section 13 has a box-shaped or cuboid-shaped structure with a rectangular base 132 and four perpendicular or parallel, upright side walls 133, 134. The side walls 133 extend parallel to a longitudinal axis L (cf. Fig. 9), and the end side walls 134 extend substantially perpendicular to the longitudinal axis L. The side walls 133, 134 have a substantially identical height and form an edge on the side facing away from the base 132, through which edge an opening 131 is formed in the cuboid shape.

[0082] The base 132 and the four side walls 133, 134 form an interior space 12 in which—as indicated in Fig. 1 without reference numerals—reinforcing structures can be arranged, for example, at the transition points between the walls or filigree support structures distributed over the surface of the base 132 to support the printed circuit board 95 to be inserted later. U-shaped recesses 15 are provided on the front side, i.e., in the side walls 134, starting from the edge forming the opening 131; their function is described below. Furthermore, projections serving as spacers 11 are arranged at regular intervals from one another on the outer surfaces of the side walls 133 and at least one front side wall 134. The base section 13 shown in Fig. 1 can be manufactured in one piece, for example by injection molding, from a plastic or resin.

[0083] Fig. 2 shows the process of placing an electronic device 90 in the inner housing part 10 from Fig. 1, at least for a front-end section of the base section 13. The electronic device 90 can be an electronic ballast (EB) for operating lights, for example with semiconductor light sources (LEDs). Such ECGs are largely known in the technical field, so that at this point reference can be made to relevant literature with regard to the components. In the example, the ECG is designed for a power of 1200 W, for example. The electronic device 90 comprises a printed circuit board 95, on which the electronic components (e.g. chokes, capacitors, resistors, integrated circuits comprising transistors, etc.) are arranged and interconnected in a known manner.

[0084] In Fig. 2, two electrical cables 91 and one cable 94 are shown purely as an example, which form corresponding outgoing cable strands for supplying the lighting devices, usually LEDs (not shown) with power as well as with control and regulating elements.

[0085] Sliders 16 are placed over the cables 91, which, when viewed from above, have a U-shape that matches the corresponding U-shape of the recesses 15. A groove is formed in the outer circumference of the U-shape of the sliding elements 16, into which groove the corresponding wall section of the front side surface 134 enters in the region of the recesses 15, so that the sliding elements can be inserted into the recesses 15 with a form-fitting fit when the electronic device 90 is inserted into the interior 12 of the base section 13. For the cable feedthrough, the sliding elements 16 have suitably shaped, for example round, passages 161, optionally with tightly fitting rubber sealing rings. With the help of the sliding elements 16, the electrical cables 91 are received in the corresponding recesses 15 of the base section 13.

[0086] In Fig. 2, it can also be seen that the edge forming the opening 131 of the base section 13 has a circumferential groove 135, which is interrupted by the recesses 15. However, this gap in the groove 135 is closed again by the sliding elements 16, because these also have a correspondingly configured groove section.

[0087] Fig. 3 shows the state after completion of the placement of the electronic device 90 with the circuit board 95 toward the bottom 132 of the base section 13 (downward). It should be noted that on the opposite end face of the base section 13, the corresponding recess 15 is also closed in a similar manner with a matching sliding element 16 and associated electrical cable 92 (power supply, for example, with mains voltage).

[0088] In Fig. 4, a sealing ring (O-ring) 145 is provided, which is configured to fit precisely into the closed circumferential groove 135 of the frame of the opening 131. The sealing ring 145 can be prefabricated from rubber or silicone in a suitable rectangular or round shape, etc. Alternatively, the seal can also be created, for example, using a silicone syringe.

[0089] Fig. 5 shows the subsequent placement of a flat plate 141 (preferably made of metal) of a cover section 14 onto the base section 13. The plate 141 can be made of aluminum or other thermally conductive materials and can have cutouts or openings. It has a rectangular shape that matches the edge of the opening 131. The edge forming the circumferential groove 135 has an inner wall and an outer wall. The outer wall protrudes slightly upwards (away from the bottom 132) relative to the inner wall. The plate 141 rests on the sealing ring 145 filling the groove 135 and its four edges abut the raised outer walls of the edge of the opening 131. As can also be seen from Fig. 5, individual electronic components of the electronic device 90 in the interior 12 of the base section 13 are provided with thermally conductive metal surfaces 96. These metal surfaces orHeat sinks 96 simultaneously form contact surfaces for the thermal pads, which are in contact with the plate 141, so that they are in contact with each other when installed. In this way, heat can be dissipated from the electronic device 90 during operation.

[0090] Fig. 6 shows the placement of a flat holding frame 142 onto the plate 141 and the edge of the base section 13. The holding frame 142, like the base section 13, can be made of plastic or metal, or even a resin. The holding frame 142 has a rectangular outer frame that fits the edge of the base section 13. The outer frame is reinforced internally, for example, by cross-arranged struts. The holding frame 142 serves to fix the plate 141 to the base section 13 and to provide further spacers 11 (see Figs. 7 and 8) with the aid of which further pressure can be exerted on the plate 141 in order to press it against the base section 13. It should be noted that the holding frame can be designed in one or more parts.

[0091] Fig. 7 shows a cross-sectional view through the now fully assembled inner housing part 10. The electronic device 90 is now located in the encapsulated interior 12 of the inner housing part 10. The plate 141 of the cover section 14 rests on the seal 145 in the groove 135 and is pressed and / or fixed by the holding frame 142, which for this purpose has a latching element 143 (latching lugs) that protrude downward and resiliently engage a corresponding projection 136 of the base section 13. This projection 136 simultaneously forms the edge of the base section 13 with the groove 135 therein.

[0092] Fig. 7 also shows that both the cover section 14 (holding frame 142) and the base section 13 (side walls 133, 134 and bottom 132) have spacers 11. Fig. 8 shows a similar section of the inner housing part 10 in the same viewing direction, but in a frontal view and not in cross-section.

[0093] Fig. 9 illustrates the process of inserting the assembled inner housing part 10 into a tubular profile 21 of a second outer housing part 20 (hereinafter referred to simply as the "outer housing part" 20) according to the exemplary embodiment. The tubular profile 21 is designed, for example, as an extruded, continuously cast aluminum profile that has been cut to a suitable length to accommodate the inner housing part 10. This cutting, similar to that used for continuous, meter-length products, significantly reduces production costs. As shown in Fig. 9, the inner housing part 10 is inserted along its longitudinal or transverse axis L into one of the two openings 22 of the raw profile 21 and is completely inserted into the tubular profile 21. The position of the inner housing part 10 within the tubular profile 21 is determined by the spacers 11.More precisely, the cross-section of the inner housing part 10 together with the spacers 11 is dimensioned such that when the inner housing part 10 is inserted into the tubular profile 21 of the outer housing part 20, the spacers 11 are in contact with the four inner sides of the tubular profile 21 with low pressure and slide along them.

[0094] Figs. 10 and 11 show an outer side and an inner side, respectively, of a first end plate 24 for closing the tubular profile shown in Fig. 9. This is the end plate 24 that, in the installed state, is opposite the end face 134 of the base section 13 that has the three recesses 15 for the cable feedthroughs, as shown in Fig. 2. Accordingly, three round cable feedthroughs 26 are shown in the appropriate positions in the first end plate 24. Furthermore, a receptacle 27 for an NFC circuit of the electronic device 90 is provided.

[0095] Figs. 12 and 13 each show a perspective view of the first end plate 24, which is subsequently attached to the tubular profile 21 by fastening means 251 (e.g., screws), with cables 91 passing through it. Fig. 14 shows a cross-sectional view of the housing according to the exemplary embodiment, assembled from the inner housing part 10 and the outer housing part 20. Between an inner side 28 of the tubular profile 21 and an outer side of the side wall 133 of the base section 13, an intermediate space 30 is formed by the spacers 11, which is encapsulated by the two housing parts 10, 20. The spacers 11, which slide during insertion, are formed on all four lateral sides (side walls 133, 134, base 132, holding frame 142 on the cover section 14) of the inner housing part 10 as well as on one of the two end faces 134. On the other of the two end faces 134 of the base section 13, however, as shown in Fig.2 - only a tubular passage 18 is formed, which is, however, designed to contact the corresponding end plate 24 and thus also to define a distance.

[0096] The passage channel 18 opens into the interior space 12 of the inner housing part 10. A valve 19 for pressure equalization and the possibility of removing humidity from the interior of the assembly is press-fitted or preferably screwed via a metric thread, or glued or welded into the outer opening of the passage channel 18. The valve 19 is permeable to air in both directions, but permeable to moisture only in one direction outwards. This allows pressure equalization at any time (during production or subsequent cooling, during operation), while keeping any moisture away from the electronic device 90.

[0097] Fig. 15 shows a side sectional view of the assembled housing with the potting compound filled therein. For filling, the housing 1 is positioned as shown with its longitudinal axis essentially upright - but still inclined at approximately 70 degrees - (valve side downwards) and is potted from the opening 22 of the tubular profile 21, which is not yet closed (second end plate 25), e.g. with silicone as potting compound 32. As a result, the intermediate space 30 is almost completely eliminated. The housing 1 can also be additionally tilted about a second axis. Fig. 16 shows the upper part of the filled housing 1 in greater detail. Finally, Fig. 17 shows a perspective external view of the assembled, completed housing according to the exemplary embodiment.

[0098] Figures 18 to 29 show a second preferred embodiment of a housing 401 according to the present invention. The steps for assembling the housing 1 described above in connection with the first embodiment (corresponding to Figures 1-7) are fundamentally also applicable analogously to the case of the housing 401, although the intermediate steps shown in Figures 5 and 6 are omitted for the second embodiment due to the different cover structure.

[0099] An external difference between the specific exemplary embodiments may also be that, while the housing 1 of the first exemplary embodiment provides an electronic cable 92 for the power supply, two electronic cables 91 for the output to the lights or semiconductor light sources, and a cable 94 for controlling the electronic device 90, which has a power consumption of 1,200 W, the housing 401 of the second exemplary embodiment provides an electronic cable 492 for the power supply, only one electronic cable 491 for the output to the lights, and one cable for controlling the electronic device 490, which in this case has a power consumption of only 600 W. However, the number of cables and the power consumption of the device can just as well be reversed or chosen entirely differently, and do not particularly distinguish the exemplary embodiments from one another.In general, the second outer housing part 20 of the first embodiment does not differ significantly from the second outer housing part 420 of the second embodiment shown in Figs. 27 - 29, taking the above-mentioned exception into account.

[0100] The first inner housing part 410 of the second embodiment, which is provided with quite different features compared to the first embodiment, will therefore be described in greater detail below with reference to Figures 18-26. The state shown is that removed from the outer housing part 420 or before encapsulation.

[0101] As in the first embodiment, the first inner housing part 410 comprises a trough-shaped base section 413 and a flat lid section 414. When assembled, the two form a box-like or cuboid-like structure. The base section 413 is provided with a rectangular bottom 432 and four perpendicular or parallel, upright side walls 433, 434. The side walls 433 extend parallel to a longitudinal axis (as in Fig. 9 with reference to the first embodiment), and the end side walls 434 extend substantially perpendicular to the longitudinal axis. The side walls 433, 434 have a substantially identical height and, on the side facing away from the bottom 432, form an edge through which an opening 431 is formed in the cuboid shape.

[0102] The floor 432 and the four side walls 433, 434 form an interior space 412 which, similar to that shown in Fig. 1, can have filigree supporting or reinforcing structures distributed at the transition points between the walls and the floor 432 for supporting the printed circuit board 495 to be described further below.

[0103] The U-shaped recesses provided in the front side walls 434 (only indicated in Figs. 18-26) correspond to those (reference numeral 15) of the first embodiment, so a detailed repetition is omitted. Here, too, sliding elements 16 can be provided that are plugged onto the cables 91, 92, 94 and can be inserted into the recesses 15 in a sealing manner. For the rest, reference is made to the above explanations (see especially Fig. 2).

[0104] Also similar to the first embodiment, projections serving as spacers 411 are arranged at regular intervals on the outer surfaces of the side walls 433 and at least one end side wall 434 (namely, the one that is first inserted into the second outer housing part 20 during assembly). The base portion 13 can be made in one piece, for example by injection molding, from a plastic or resin.

[0105] In the second exemplary embodiment, the cover section 414 is formed in one piece, unlike in the first exemplary embodiment (where it consists of an arrangement of a metal plate and a holding frame). In particular, like the base section, it can be produced by injection molding from a plastic or a resin, so that a heat-dissipating material can be dispensed with here. Instead, measures to be described further below serve to conduct heat. Furthermore, the cover section 414, similar to the base section 413, has a distribution of spacers 411 formed on its outer surface. In the second exemplary embodiment, the spacers 411 also serve in their entirety to establish a defined position of the first inner housing part 410 relative to the second outer housing part 420 in the interior thereof before the potting compound 33 is poured.

[0106] An edge forming the opening 431 of the base section 413 has a circumferential groove 435 (see Fig. 26). This groove is interrupted by the recesses 15 for receiving the cables 91, 92, 94. This gap in the groove 435 is also closed (see the first embodiment) by the sliding elements 16, which have a correspondingly configured groove section that completes the annular closure of the groove 435.

[0107] As in the first embodiment, a sealing ring (O-ring) 545 is inserted into the circumferential groove 435 (see Fig. 26), which is configured for this purpose to fit precisely into the closed circumferential groove 435. The sealing ring 545 can be prefabricated from rubber or silicone in a suitable rectangular or round shape, etc. Alternatively, the seal can also be created in situ, for example, using a silicone syringe.

[0108] The cover section 414 rests on the edge of the opening 431 and the seal 545 in the groove 135 and, for the purpose of pressing and fixing it to the base section 413, has locking elements 543 (locking lugs) that protrude downward and resiliently engage a corresponding projection 436 of the base section 413. This projection 436 simultaneously forms the edge of the base section 413 with the groove 435 therein, see Fig. 26.

[0109] As can be seen particularly in the cross-sectional views of Figures 19, 21, and 24, the first inner housing part 410 accommodates an electronic device 490 in the interior space 412. This electronic device 490 can also be an electronic ballast (EB) for operating luminaires, for example, with semiconductor light sources (LEDs). As described above, in the example, the EB of this exemplary embodiment is designed for a power of, for example, 600 W.

[0110] The electronic device 490 comprises a printed circuit board 495 on which the electronic components are arranged and interconnected in a known manner. In particular, the electronic device 490 comprises, among other things, first chokes 492, first power transistors 491 mounted on the printed circuit board using pin-through-hole (PTH) technology, second power transistors 496 mounted on the printed circuit board using surface mounting (SMT) technology, also known as surface mounted devices (SMD), and also capacitors, resistors, and integrated circuits 498 implemented as components containing transistors, etc.

[0111] Figures 19 and 20 show a cross-sectional view parallel to the longitudinal axis of the first inner housing part 410, which allows a view into the interior 412 and the electronic device 490. The cross section drawn in Figs. 19 and 20 allows, in particular, a view of one of two first chokes 492, which can also be seen from the outside in a plan view of the first inner housing part 410 in Fig. 18. The first chokes 492 are mounted freely and upright on the circuit board 495 using PTH technology. As can be seen in Fig. 20, they each comprise a ferrite core 493, around whose inner arm (only the outer arms are visible) an inductor 494 (or a coil with a number of turns) is wound. During operation, the first chokes 492 represent a relevant heat source. The heat must be dissipated to the outside in an efficient manner. In the above first embodiment, this is done, for example,via such metal surfaces or heat sinks 96 and / or thermal pads contacting the upper surface of the ferrite core 493, which in turn are in contact with the metal plate 141 of the cover section 14, so that the latter can transfer its heat to the potting compound 33 and then ultimately to the continuously cast tubular profile 21. In the present second exemplary embodiment, a further improvement is achieved by now installing apertures 440 and 441 in the cover section 414, which, for example, is now only a single piece (see Fig. 18).

[0112] When potting with the potting compound 33, which is thermally conductive as such, direct contact of the first chokes 492, and in particular their ferrite core 493 and the inductor 494, with this potting compound 33 can be achieved because the latter passes through the apertures 440, 441. In the case of the first chokes 492, access is through the second aperture 441. The second aperture 441 forms a partial space open to the outside (namely to the intermediate space 430, see Figs. 27 - 29), which is formed by end walls 442 extending laterally around the first chokes 492 and the surface of the printed circuit board 495. The first chokes 492 are thus completely enclosed by the potting compound 33 and thus form a large contact area with the potting compound 33 after potting.

[0113] The partial space defined by the end walls 442 and the surface of the circuit board 495 is separated from the interior 412. To prevent the potting compound 33 from entering the interior 412, the end walls 442 contact the surface of the circuit board 495. At the bottom end of the end walls 442 there is a circumferential groove 447 (see Fig. 20) in which a seal 499 or O-ring is inserted or injected, so that an effective seal of the interior 412 between the end walls 442 and the circuit board 495 is achieved. Figures 21 and 22 show a cross-sectional view through the first inner housing part 410, laterally offset in a direction perpendicular to the longitudinal axis L and extending parallel to the longitudinal axis L. This section provides a perspective view of a second choke 500 with a similar structure to one of the first chokes 492, including PTH mounting on the circuit board 495.It also includes a ferrite core 493 and an inductor 494. In close spatial and functional proximity to the second choke 500, a first power transistor 491 (IGBT or power MOSFET, etc.) is mounted upright on the circuit board 95 in a through-hole (PTH) configuration. This transistor is held or supported by a clamp 501.

[0114] The first power transistor 491, like the chokes 492, 500, represents a heat source during operation, the heat from which should be dissipated efficiently. The clamp 501 is itself preferably made of a heat-conducting material, e.g. a metal, and clamps or presses the first power transistor 491 against a metal surface which serves as a heat sink 502 and dissipates the heat from the first power transistor 491. The heat sink 502 has an (upside down) U-profile, with a piece of surface cut out to allow the attachment of the clamp 501. The heat sink 502 has two opposite legs which are attached to the circuit board 495 and extend vertically upwards therefrom. The ends of the legs opposite the circuit board 495 are connected to one another by a flat bridge section which is located on the upper or lower side.outer surface of the ferrite core 493 of the second choke 500 or on a thermal pad placed thereon (not shown in the figures).

[0115] The bridge section of the heat sink 502 lies opposite the cover section 414. At the position of the bridge section, a first aperture 440 is formed in the cover section 414, so that a portion of the metal surface 502 is exposed to the outside. The first aperture 440 also has circumferential end walls 442 formed therearound, but these do not extend as deep as those in the case of the second aperture 441. Rather, they rest on the metal surface 502, having a groove 499 opening toward the heat sink 502, into which a further sealing ring 499 or O-ring is inserted or injected, as in the case of the second aperture 441. As a result, the heat sink 502 or the corresponding cooling plate together with the end walls 442 forms a further subspace within the aperture 440, which is separated from the interior space 412.After encapsulation, this subspace is also filled with encapsulating compound 33, so that it is in extensive contact with the heat sink 502 and can absorb and further dissipate its heat. The interior space 412, on the other hand, is protected from the ingress of encapsulating compound 33 by the seal.

[0116] The function of a third aperture 443 is explained with reference to Figures 23 - 26. Figures 24 and 25 show a further cross-sectional view of the first inner housing part 410, which is again laterally offset in the direction perpendicular to the longitudinal axis L and extends parallel to the longitudinal axis L. In this cross-sectional view, it can be seen that the third aperture 443 is formed in the bottom wall 432 of the base section 413, and thereby exposes or exposes the circuit board 495, which is mounted directly or indirectly (see, for example, support or holding structures on the edge of the bottom wall 132 in Figure 1), to the outside in a partial area.

[0117] Similar to the second aperture 441, the third aperture 443 comprises a subspace which is defined by circumferential lateral end walls 442 and the circuit board

[0118] 495 and is open to the outside. When the potting compound 33 is poured, it comes into contact with the surface of the exposed portion of the circuit board 495. As can be seen in Figs. 23 and 26, two second power transistors

[0119] 496 (e.g., power MOSFETs or IGBTs, etc.) are mounted using SMT technology on the printed circuit board 495 on its lower, now outwardly exposed surface. These are enclosed by the potting compound 33 during encapsulation. Likewise, second power transistors 496 are mounted on the upper surface of the printed circuit board 495, located in the interior space 412—opposite the exposed portion on the inside. The second power transistors 496 also represent a heat source during operation of the electronic device 490.

[0120] The heat generated in the second power transistors 496 is, in the case of the external second power transistors 496, dissipated directly by the potting compound 33. In the case of the second power transistors 496 located on the side facing the interior 412, this heat is transferred via the solder joints to conductor tracks and metal surfaces formed on the circuit board 495, for example, from copper or aluminum. The circuit board 495 can be formed from a fiberglass or similar material as a supporting substrate and has a thickness of, for example, 1.6 mm, usually between 0.5 or 1 mm on the one hand and 2 or 3 mm on the other. This thickness is so small that the heat distributed via the conductor tracks or metal surfaces can be efficiently transported to the opposite surface on the outside, where it is dissipated by the potting compound 33. In the case of the third aperture, the circuit board 495 itself therefore forms a heat sink.

[0121] As can be seen in Fig. 25 or 26, the lateral end walls 442 (with a similarly shallow depth as in the case of the second apertures) also include circumferential grooves 447 at the end facing the interior space 412, into which sealing rings 499 are inserted or injected (two-component injection molding; this option also applies to all other sealing rings mentioned in the description). The sealing rings 499 rest on the outward-facing surface of the circuit board 495 and thus seal the interior space 412 from the partial space defined by the aperture 443 or the seamlessly adjoining intermediate space 430 (see Figs. 27 - 29). The sealing effect is further supported by one or more snap hooks 503, which ensure counterpressure of the circuit board 495 against the sealing rings 499 and hold the circuit board 495 in position.

[0122] Figures 27-29 show cross-sectional views of the housing 401, which includes the first inner housing part 410 and the second outer housing part 420 in the assembled state. The potting steps are analogous to those described above with reference to Figures 9 to 15. It can be clearly seen that the potting compound 33 essentially fills the intermediate space 430 formed between the first inner housing part 410 and the outer housing part 420 as well as the partial spaces formed by the apertures 440, 441 and 443 and in doing so contacts either heat sinks 502, 495 (printed circuit board) close to the component or the components (chokes 491, 492, power transistors 491, 496, etc.) themselves and can thus efficiently transport heat away to the tubular profile 421 of the second outer housing part 420.

[0123] It should be noted that the features of the second outer housing part 420 not visible in detail in Figures 27-29, such as the first and second end plates 424, 425, the tubular profile 421 with end-face openings, the mounting rail with undercut, the fastening means for the end plates, the cable feedthroughs, the receptacle for the NFC circuit, the sealing rings, the mounting flange, etc., are designed in the same way as described above in connection with the first exemplary embodiment, so that repetition is unnecessary. This also applies in particular to the feedthrough channel with a valve for ventilating and dehumidifying the interior 412 of the first inner housing part 410.

[0124] LIST OF REFERENCE SYMBOLS:

[0125] I, 401 Housing

[0126] 10, 410 first (inner) housing part

[0127] II, 411 spacers

[0128] 12, 412 interior

[0129] 13, 413 base section

[0130] 131, 431 Opening (edge) of the base section

[0131] 132, 432 Floor of the base section

[0132] 133, 433 Side outer surfaces of the base section

[0133] 134, 434 Frontal outer surfaces of the base section

[0134] 135, 435 edge groove

[0135] 136, 436 locking projection

[0136] 14, 414 cover section

[0137] 142 holding frames

[0138] 143 Snap-in element

[0139] 15 Recess

[0140] 16 sliding element (slider)

[0141] 161 Passage for cable entry

[0142] 20, 420 second (outer) housing part

[0143] 21 Pipe profile

[0144] 22 front opening in the pipe profile

[0145] 23 Mounting rail (with undercut)

[0146] 24 first front plate

[0147] 25 second front plate

[0148] 251 Fasteners for front plate (screws) Cable entries in front plate

[0149] Holder for N FC circuit

[0150] Sealing ring (for front plate mounting)

[0151] Mounting flange, 430 gap

[0152] Potting compound (silicone) 0 first aperture, in the cover section 1 second aperture, in the cover section 2 surrounding wall for cavity formed by second aperture 3 third aperture in the base section 7 groove at the lower end of the surrounding wall 9 sealing ring (O-ring) for apertures of the first power transistor

[0153] Terminal , 490 electronic device electronic cable (output to light sources) electronic cable (power supply)

[0154] Exit opening for laser beam

[0155] Cable for electronic control, 495 circuit board

[0156] Heat sink or metal surface 1 first power transistors (in PTH technology) 2 first chokes 3 ferrite core 4 inductor 6 second power transistors (in SMD technology) 7 heat sink for second choke 498 integrated circuits (components, ICs)

[0157] 499 Sealing ring (O-ring)

[0158] 500 second throttle

[0159] 501 terminal

[0160] 502 heat sink, metal surface, cooling plate

[0161] 503 clamp hooks

[0162] L Longitudinal axis (both housing parts)

Claims

Claims:

1. Housing (1) for an electronic device, comprising: a first housing part (10) configured to receive the electronic device (90), a second housing part (20) configured to fully enclose the first housing part (10), wherein a space (30) formed between the first housing part (10) and the second housing part (20) is sealed by both housing parts (10, 20) and filled with a potting compound (32), while an interior space (12) of the first housing part (10) receiving the electronic device (90) is not filled with the potting compound (32).

2. Housing (1 ) for an electronic device according to claim 1, wherein the first housing part (10) is designed as a part separate from the second housing part (20) and is spaced apart from the second housing part (20) by a number of spacers (11 ) to form the space (30).

3. Housing (1 ) for an electronic device according to claim 2, wherein the first housing part (10) including the spacers (11 ) is dimensioned in relation to the second housing part (20) such that, prior to a step of potting the potting compound, it can be inserted into a defined spatial position within the second housing part (20) in sliding contact between the spacers (11 ) and the second housing part (10), wherein the potting compound (32) substantially completely surrounds the first housing part (10).

4. Housing (1 ) for an electronic device according to one of claims 1 to 3, wherein the first housing part (10) comprises a substantially cuboid base section (13) with an opening (131 ) and a cover section (14) placed on this opening (131 ) which closes off the interior (12).

5. Housing (1) for an electronic device according to claim 4, wherein Both the base section (13) and the lid section (14) are provided with spacers (11), wherein, in the case of the lid section (14) being placed on top and in the case of the first housing part (10) being inserted, at least part of the spacers of the base section (13) and the lid section (14) are in contact with opposing inner walls (201, 202) of the second housing part in such a way that the lid section (14) is held pressed against the base section (13).

6. Housing (1 ) for an electronic device according to claim 4 or 5, wherein recesses (15) extending from an edge of the respective section (13, 14) are provided in the base section (13) and / or in the cover section (14), into which sliding elements (16) sealing the recesses (15) are inserted, wherein passages (161 ) for passages of electrical cables (91 , 92) for the power supply or output of the electronic device (90) are provided in the sliding elements (16).

7. Housing (1 ) for an electronic device according to one of claims 4 to 6, wherein the cover section (14) comprises a plate (141 ), in particular made of aluminium, wherein the plate substantially seals the opening (131 ).

8. Housing (1 ) for an electronic device according to claim 7, wherein the cover section (14) comprises a retaining frame encompassing the plate (141 ). (142), preferably made of plastic, wherein the retaining frame (142) carries the relevant spacers (11) of the cover section (14) and further includes fastening elements (143) which are able to fix the lid section (14) to the base section (14) during assembly.

9. Housing (1) for an electronic device according to claim 7 or 8, wherein the plate (141) with thermally conductive elements of the electronic device is directly or indirectly connected via thermally conductive pastes, thermal pads or adhesives, or via metal elements, in particular metallic spring elements or screws, or via non-metallic elements or spring elements.

10. Housing (1 ) for an electronic device according to one of claims 2 to 9, wherein the second housing part (20) comprises a hollow tube profile (21 ) and two opposing end plates (24, 25) attached to the two tube openings (22) on the end faces, wherein the first housing part (10) is inserted into its fixed spatial position by sliding through one of the two tube openings (22) with the spacers (11 ) on the inner surface (23) of the tube.

11. Housing (1) for an electronic device according to claim 10, wherein the hollow tube profile (21) is an extrusion or continuous casting profile, in particular made of aluminium.

12. Housing (1 ) for an electronic device according to claim 10 or 1 , wherein the hollow tube profile (21 ) has a substantially rectangular cross-section.

13. Housing (1 ) for an electronic device according to one of claims 10 to 12, wherein the first housing part (10) is inserted into the hollow tube profile (21 ) along its longitudinal or transverse axis (L).

14. Housing (1 ) for an electronic device according to one of claims 10 to 13, with reference back to claim 4, wherein at least one of the end plates (24, 25) has sealing cable passages (26) for electrical cables (91 , 92), the position of which in the assembled state is opposite the sliding elements (15) inserted into the recesses (16) of the base section (13).

15. Housing (1 ) for an electronic device according to one of claims 4 to 14, wherein an outwardly projecting passage channel (18) is formed in an end-face outer wall (17) of the base section (13) or the cover section (14), which extends through the space (30) to one of the two end plates (24, 25) and is open to the outside through these, wherein a valve (19) for pressure equalization and the possibility of removing humidity from the interior of the assembly is provided in the passage channel (18), which is permeable to air in both directions but to moisture only in one direction to the outside.

16. Housing (1 ) for an electronic device according to one of the preceding claims, wherein the proportion of the volume of the filled space (30) in a total volume composed of the space (30) and the interior (12) - excluding the volume occupied by the electronic device - is 50% or less, preferably 40% or less, more preferably 30% or less.

17. Housing (1 ) for an electronic device according to one of the preceding claims, wherein the potting compound (32) is silicone, epoxy resin or tar.

18. Housing (1 ) for an electronic device according to one of the preceding claims, wherein the electronic device (90) comprises a printed circuit board with electronic components mounted thereon, wherein the electronic device (90) is preferably an electronic ballast for semiconductor light sources, further preferably with a power input of 500 watts or more.

19. Housing (1) for an electronic device according to one of the preceding claims, wherein in the first housing part (10) at least one aperture (440, 441, 443) is formed which defines a partial space of the space filled by the potting compound (33), which is defined by lateral end walls (442) of the first housing part (410) and a surface of a heat sink (502) and / or circuit board (495) extending at least partially in the interior (412).

20. Housing (1 ) for an electronic device according to claim 19, wherein, in the case that the partial space defined by the at least one aperture (440, 441 , 443) is limited by the circuit board (495), at least one electronic component, in particular an inductor (492, 500), a power transistor (491 , 496) or an integrated circuit (498), of the electronic device (490) is mounted on the circuit board (495) and is in direct thermally conductive contact with the potting compound (33), and is preferably wholly or partially enclosed by it.

21. Housing (1) for an electronic device according to claim 20, wherein, in the case that the partial space defined by the at least one aperture (440, 441, 443) is limited by the heat sink (502), at least one electronic component, in particular an inductor (492, 500), a power transistor (491, 496) or an integrated circuit (498), of the electronic device (490) is mounted on the circuit board (495) and positioned in the interior (412) and is in direct thermally conductive contact with the heat sink (502).

22. Housing (1 ) for an electronic device according to claim 20 or 21, wherein the electronic component is mounted in through-hole (PTH) mounting on the circuit board (495).

23. Housing (1 ) for an electronic device according to claim 20 or 21, wherein the electronic component is mounted on the printed circuit board (495) in surface mounting (SMT).

24. Housing (1 ) for an electronic device according to one of claims 19 to 23, wherein the lateral end walls (442) completely enclose the partial space defined by the at least aperture (440, 441 , 443) and are in sealing contact with the heat sink (502) and / or circuit board (495) extending in the interior (412) by means of a sealing ring (499).

25. Housing (1 ) for an electronic device according to claim 24, wherein the end walls (443) have a circumferential groove (447) at their end facing the interior (412), into which the sealing ring (499) is inserted or injected.

26. Housing (1 ) for an electronic device according to one of claims 19 to 25, wherein the at least one aperture (440, 441 ) is formed in the or in a cover section (414) of the first housing part (410).

27. Housing (1 ) for an electronic device according to one of claims 19 to 25, wherein the at least one aperture (443) is formed in the or in a base section (413) of the first housing part (410).

28. Housing (1 ) for an electronic device according to one of claims 19 to 27, wherein at least two of the apertures (440, 441 , 443) are provided, wherein one aperture (440, 441 ) is formed in the or in a cover section (414) of the first housing part (410), and one aperture (443) is formed in the or in a base section (413) of the first housing part (410).

29. Housing (1) for an electronic device according to claim 28, wherein the circuit board (495) is equipped with electronic components on both sides and is defined by apertures (440, 443) from the cover section (414) and from a bottom section (432) of the base section (413). and the partial spaces filled with the potting compound (33) extend to the circuit board in order to enclose at least one electronic component with the potting compound (33) in each case.

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