High-precision printed structures and methods of making
Patent Information
- Application Number
- EP2023726874
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-09-28
- Filing Date
- 2023-05-04
- Publication Date
- 2025-03-19
AI Technical Summary
Current methods for transferring electronically active components from one substrate to another lack precision and accuracy, leading to inefficiencies in forming denser and smaller electronic systems, particularly in applications like flat-panel displays and solar cells, where precise alignment is crucial for optimal performance.
The method involves using a transfer element, such as a viscoelastic stamp, to move components from a native source wafer to a non-native target substrate, allowing for precise alignment and adhesion of components to the substrate, with the ability to move both vertically and horizontally to ensure accurate positioning within micrometer distances.
This approach enables the creation of high-precision printed structures with components aligned to within micrometer distances, enhancing the performance and density of electronic systems by reducing conversion and connection losses, and allowing for the use of smaller, more integrated systems.
Smart Images
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