Half-bridge module having parallel supply lines connected to insulated terminal pads between two strip portions and to one of the strip portions of a conductor path layer

Abstract

A half-bridge module is equipped with a first power supply line (Z-), a second power supply line (Z+), a phase supply line (PZ) and a carrier (T). The carrier (T) has a conductor path layer (LS) which has terminal pads (P) in an intermediate portion (ZA) which is located between a first and a second transistor strip portion (LA, HA) of the conductor path layer (LS). The terminal pads (P) are each circumferentially insulated in the conductor path layer. The first power supply line (Z-) is connected to the terminal pads (P) and leads away therefrom. The second power supply line (Z+) is connected to at least one contact point (3) within the second transistor strip portion (HA) and leads away therefrom. The phase supply line (PZ) is connected to at least one contact point (1, 1') within the intermediate portion (ZA) or within the first transistor strip portion (LA) and leads away therefrom.

Description

[0001] Description

[0002] Half-bridge module with parallel supply lines connected to insulated connection surfaces between two strip sections and to one of the strip sections of a conductor layer

[0003] Electric vehicles have electrical machines whose windings are supplied with switchable current. In order to achieve the required power outputs, which are often more than 100 kW, high currents of frequently more than 100 amperes and operating voltages of frequently more than 100 V, in particular 800 V, are used. Power transistors are used for switched current supply to the windings; these generate switching edges with high current swings in a short time. Extremely fast switching transistors such as SiC transistors are used, particularly to achieve even shorter switching edges or higher rise rates of the transistors. A very low-inductance circuit is required to use such fast switching transistors effectively. Furthermore, with fast switching transistors, the signal propagation times caused by the circuitry must be taken into account to ensure reliable switching of the transistors.It is an object of the invention to show a possibility with which high-performance transistors can be connected to half-bridges in a low-induction manner.

[0004] This object is achieved by the half-bridge module according to claim 1. Further properties, features, embodiments, and advantages are revealed by the dependent claims, the description, and the figures.

[0005] A half-bridge module is described with a first supply lead, a second supply lead, and a phase lead. The leads can also be referred to as busbars or power rails. The half-bridge module further comprises a carrier having a conductor track layer. The carrier can be formed with one or more layers. The conductor track layer is one side of the carrier and is not an embedded layer. The conductor track layer is an uncovered conductor track layer (i.e. not covered by insulator layers of the carrier). The conductor track layer is formed as a structured, conductive layer and thus has surfaces that are not connected to one another via the conductor track layer. This structuring results in a layout.

[0006] The carrier or the conductor track layer is divided into three strips. The three strips can relate to the entire carrier or the conductor track layer, or to a region thereof. The strips are preferably located directly next to one another. The strips are a geometric division and are not necessarily an electrical subdivision with electrical separation from one another. The strips are therefore a geometric subdivision of an area. The division into strips does not relate to a conductor-like subdivision of the conductor track layer; in particular, the electrical subdivision or the layout can deviate from this, at least in sections. The strips comprise a first and a second strip section, as well as an intermediate section located between these two. The strips extend along their larger dimension in the same longitudinal direction.The conductor layer itself can also be rectangular, for example, with the longer side of the rectangle extending along the longitudinal direction. This direction is also referred to as the first longitudinal direction.

[0007] The first and second strip sections are each designed to be populated with transistors or other semiconductors, so that they are also referred to as transistor strip sections. In the intermediate section there are connection areas as individual pads. The connection areas are electrically insulated from the remaining, surrounding conductor layer within the conductor layer itself. The connection areas are thus preferably surrounded by a channel or groove or even a trench which extends through the entire thickness of the conductor layer. For this reason, the connection areas are surrounded by recesses in the conductor layer which electrically separate the connection areas within the conductor layer. The connection areas are insulated all the way around in the conductor layer. If connection areas are located on the edge of the carrier or.Conductor track layer, then this is also continuously insulated where it is surrounded by the further conductor track layer. In the case of connection surfaces located at the edge, the conductor track layer is therefore partially insulated all the way around within the conductor track layer (and thus all the way around except for the area of ​​the connection surfaces that are located at the edge), whereby connection surfaces inside the conductor track layer are completely insulated all the way around. The geometric subdivision into the first strip section and the intermediate section differs in particular from an electrical subdivision into areas that are located within these sections or from the layout that is located in the two sections. The geometric subdivision into the second strip section on the one hand and the intermediate section on the other hand can correspond to an electrical subdivision into areas that are located within these sections ormay correspond to the layout that electrically separates the (conductive) surface of the second strip section from the (conductive) surfaces of the intermediate section.

[0008] The first supply lead is connected to the connection surfaces, for example by a direct mechanical attachment (soldered connection, welded connection, in particular friction welded connection, sintering, screwing, press-fit connection, etc.). The supply lead leads away from the connection surfaces. This allows the potential of a supply voltage to be fed into the intermediate region of the conductor layer, while the (two) further supply leads can be led into the strip sections (or into a strip section and the intermediate region) in order to be connected there to surfaces of the conductor layer. By using connection surfaces within the intermediate section, it is therefore possible to mechanically connect all three supply leads to corresponding (each single or multiple) contact points of the conductor layer, i.e. to the same conductive layer.Therefore, no additional layers are necessary, since the supply line can be fixed within the intermediate section or connected to the connection surface present there.

[0009] In addition, the track layout of the track layer allows

[0010] Contact points for the supply lines, all located in the conductor layer (albeit in electrically separated areas or surfaces of the conductor layer). This results in a negative and cost-effective connection technology that also enables short signal propagation times. The three supply lines can be connected in the same way to the corresponding contact points of the conductor layer, allowing the supply lines to be designed with low inductance and low interference.

[0011] Flat conductors, such as metal sheets or similar, that extend away from the conductor layer are particularly suitable as supply lines. For example, the two supply lines can be arranged close to one another, whereby a low-inductance connection is possible due to the small area between the supply lines. Due to the connection of the first supply line to the connection surfaces (in the intermediate section) and the attachment of the second supply line within the second strip section, these are contacted closely to one another on the conductor layer and can thus be routed away in close proximity to one another.Starting from the contact point where the supply leads are connected to the conductor layer, one supply lead extends to the other (for example, the second lead to the first or vice versa, or both extend toward each other), so that both leads can extend along the same path away from the carrier. The two leads can be placed on top of each other (preferably with an insulating layer between them).

[0012] This parallel, close routing of the two adjacent supply lines results in a low-inductance connection. The inventive approach allows the phase supply line to be routed away from the two supply lines. Thus, starting from the contact point where the phase supply line is connected to the conductor layer, the phase supply line can be routed away from the supply lines, particularly from the contact points where the supply lines are connected to the conductor layer. This minimizes interference from the phase supply line to the supply lines, and vice versa.

[0013] In one direction along the conductor layer (in the longitudinal direction, in particular in a direction perpendicular to the direction in which the sections run or perpendicular to the direction in which the connecting surface sections and the contact surfaces alternate), the supply lines can be arranged as follows: second supply supply line (which is attached to the second strip section), first strip section (which is attached to the contact surfaces or in the intermediate section) and, subsequently, phase supply line, which is connected in particular to the conductor layer in the first strip section or to surfaces connected thereto (connecting surface sections) in the intermediate section. In particular, the contact surfaces allow such an order in which the two supply supplies follow one another, followed by the phase supply line, in order to also physically separate the phase supply line from the supply supplies.

[0014] The phase supply line can thus extend from the conductor layer across one side of the half-bridge module, while the supply lines extend away from the opposite side of the carrier. The supply lines on the one hand and the phase supply line on the other hand thus extend in opposite (generally: different) directions away from the carrier. No additional connecting elements are required to ensure that the phase supply line is not located between the supply lines.

[0015] One aspect is that the half-bridge module has at least a first and at least a second supply lead. The first supply lead is preferably assigned a negative potential, wherein the second supply lead can be assigned a positive potential. The two potentials are preferably potentials of a DC supply voltage. The second supply lead is connected to the second surface. The first supply lead is connected to the connection surfaces. The second supply lead is connected to the conductor layer at points located in the second strip section, while the points of contact between the first supply lead and the conductor layer are located in the intermediate section. In a direction starting from the second strip section towards the first strip section, the connection point of the second supply lead is thus provided first, followed by the connection point of the first supply lead.The connection point is the point where the supply line connects to the conductor layer. The path of a phase supply line continues away from the conductor layer along the specified direction, which leads from the second to the first strip section.

[0016] The area between the supply leads is free of the phase lead. The phase lead extends beyond the area between the phase leads. The connection surfaces and their connection to the first lead ensure that the phase lead does not run between the supply leads, but can extend away from them without crossing them.

[0017] First connectors are provided which are connected to the connection surfaces and in particular originate from them. These first connectors extend from the connection surfaces into the first strip section. In particular, the first connectors extend from the connection surfaces to the first surface, in particular to the part of the first surface which extends into the first strip section. The first connectors extend from edge regions of the connection surfaces which border on the first surface (within the first strip section) into the first strip section (for example as far as transistor contact points or corresponding contact surfaces). The first connectors extend in particular as far as component area regions in the first surface or in the first strip section. This results in short distances for the connectors since the connection surfaces border directly on the first strip section.Second connectors may be provided which extend from connecting surface sections to component mounting areas in the second surface. In populated half-bridge modules, first transistors are mounted in the first strip section, in particular on the part of the first surface which is present in the first strip section. The first connectors extend from the connection surfaces to a contact surface or another contact element of the transistors which are located in the first strip section. The contact surface or the contact element can be part of the transistor or can be directly connected thereto. The first transistors can be present as bare components. This also applies to second transistors which can be mounted in the second strip section or on or in the second surface.

[0018] The transistors may each have a first contact surface with which they are mounted on the first or second surface, or are otherwise directly electrically connected thereto. The first contact surface is located on the underside of the transistors. The transistors may have a second contact surface connected to connectors. The second contact surface is located on the top side of the transistors. The first connectors may be connected to the second contact surfaces of the first transistors. In particular, the connectors extend from the connection surfaces to the second contact surfaces of the transistors. The contact surfaces are assigned to electrodes of the power path of the transistors and may be assigned to the source, drain, collector, or emitter of the transistor. A connection surface may be connected to multiple transistors (via at least one of the first connectors) or to just one transistor.

[0019] In an unpopulated semiconductor module, component mounting areas are provided which are located in the first and second strip sections, respectively. In other words, the component mounting areas are located on the first and second surfaces. The component mounting areas are lined up in particular along the longitudinal direction or the first direction of the carrier and spaced apart from one another. The first component mounting areas are located in the first strip section. The transistors in the first strip section can be lined up in one or more rows which extend along the first direction or longitudinal direction. One or more rows of component mounting areas which extend along the longitudinal direction or the first direction can be located on a second surface. The component mounting areas are designed, in particular, for mounting transistors, for example using SMD technology.For this purpose, they can have a component layer, for example, a metal layer to improve sintering or soldering properties, a sintered layer, or a tinned layer. The component areas can be configured for sintering or soldering transistors.

[0020] The first surface extends in the first strip section as a continuous surface. Essentially, the first surface completely covers the first strip section. In particular, in the longitudinal direction, there are no electrical separations of the first surface within the first strip section. Continuous surfaces are defined as mechanically continuous surfaces and also surfaces that are electrically continuous, i.e., surfaces that have the same potential. This also includes surfaces that are divided into individual surface sections that are, however, directly connected to one another. Connecting surface sections extend in the intermediate section. These are connected to the first surface in the first strip section. This can be provided by electrical connecting elements.Preferably, however, the connecting surface sections are parts of the first surface that extend into the intermediate section, while the first surface also extends into the first strip section. In other words, connecting surface sections can extend from the part of the first surface located within the first strip section into the intermediate section. The first surface thus extends into the first strip section and further includes the connecting surface sections in the intermediate section.

[0021] The connecting surface sections preferably extend from the first to the second strip section or border on them. In other words, the first surface extends to the second strip section or reaches up to the second surface (but is electrically separated from it). The first surface extends from the first strip section. The connecting surface sections border on the second surface or the second strip section. The connecting surface sections thus extend from the first to the second strip section. The conductor track layer provides electrical separation between the connecting surface sections (i.e. between the first surface) and the second surface (within the second strip section). The conductor track layer also provides electrical separation between the connecting surface sections (i.e. between the first surface) and the connection surfaces.

[0022] The connecting surface sections and the connection surfaces both extend into the intermediate section. The connection surfaces are electrically separated from the first surface and thus also from the connecting surface sections (within the conductor track layer). The connection surfaces and the connection surface sections are also electrically separated from the second surface and thus from the second strip section within the conductor track layer. The connection surfaces and the connection surface sections are arranged alternately in the intermediate section. The connection surfaces and the connection surface sections are arranged alternately or alternately along a direction that corresponds to the longitudinal direction or first direction. The first strip section, the intermediate section, and the second strip section each extend along the first direction.

[0023] The first strip section, the intermediate section, and the second strip section are aligned along a direction perpendicular to this direction (i.e., along the width of the carrier). However, the connecting surface sections and the terminal surfaces are aligned along the first direction (in other words, perpendicular to the direction in which the strip sections and the intermediate section extend). This also applies to the mounting surface areas of the transistors, or to the transistors themselves in the case of a mounted half-bridge module.

[0024] Second connectors are provided which are connected to the connecting surface sections. These second connectors extend into the second transistor strip section. In particular, the second connectors extend from the connecting surface sections into the second strip section, in particular to component mounting area regions on the second surface or as far as the second contact surfaces of transistors located on or in the second surface. One or more connectors can lead away from the connecting surface sections. Furthermore, one or more first connectors can extend away from a connection surface. A connecting surface section can be connected to one or more second transistors via one or more second connectors. The connecting surfaces extend as far as the second surface, so that the second connectors can be kept very short.The first connectors can also be made very short, since the connection surfaces reach up to the first strip section or to the part of the first surface that is located in the first strip section. The first connectors are preferably connected to an edge region of the connection surfaces that reaches up to the first strip section or to the part of the first surface that is located in the first strip section. The second connectors are preferably connected to the connection surface sections at an edge region that is opposite the second surface. The connectors can be conductors, in particular bonding strips or bonding ribbons, bridge connectors or connecting elements that comprise pins or the like. The connectors can be made of a conductive material, preferably of an aluminum or a copper material.

[0025] The first supply lead is connected to the connection surfaces in the intermediate section at contact points. This allows the first supply lead to be routed in direct proximity to the second supply lead, which is led out approximately from the second surface. The phase lead is connected to the conductor layer at contact points located in the intermediate section or in the first transistor strip section. With the first option, the contact points of the phase lead are approximately the same distance from the first and second transistors. This allows them to be connected to the phase lead symmetrically with regard to resistance and phase delay. With the second option, the phase lead can be routed at a large distance from the supply leads in order to avoid interference.What both options have in common is that the supply lines can be routed to one side, while the phase line is routed to the opposite side. In particular, it is possible that the phase line does not need to be routed between the supply lines.

[0026] Embodiments provide that the phase supply line is connected to the conductor layer at contact points located in the intermediate section. These contact points are located with a deviation in the middle between a row of transistor mounting surfaces in the first transistor strip section and a row of transistor mounting surfaces in the second transistor strip section, wherein the deviation is not more than 20 mm, 15 mm, 10 mm, or 5 mm. In other words, the contact points at which the phase supply line is connected to the conductor layer are located essentially in the middle between the first and second strip sections or between the mounting surfaces present there. According to the aforementioned first possibility, a symmetrical supply line results. In a populated half-bridge module, the transistor mounting surfaces are populated with transistors.The transistor mounting surfaces correspond in particular to the component mounting surface areas mentioned above. With this approach, the phase supply line leads away from the intermediate section. The first supply line also leads away from the intermediate section, but from different surfaces (namely, the connection surfaces) than the phase supply line, which extends away from the connection surface sections, i.e., parts of the first surface located in the intermediate section.

[0027] Further embodiments provide that the phase supply line is connected to the conductor layer at first contact points located in the first strip section or in the intermediate section. The first supply supply line is connected to the connection surfaces at second contact points. The second supply supply line is connected to the conductor layer at third contact points. The third contact points are located in the second strip section or on the second surface. The first contact points are located on the first surface, in particular in the region of the first surface that extends into the first strip section.

[0028] The first and second supply leads as well as the phase lead each have discharge sections which, along the course of the leads, are opposite the contact points mentioned. Therefore, the leads run in such a way that they start from the contact points, possibly run over further sections and then lead to respective discharge sections which are suitable for the external connection of the half-bridge module. The discharge sections of the supply leads on the one hand and the phase lead on the other hand extend in opposite directions away from the carrier. The leads extend in particular in a direction perpendicular to the first direction or to the longitudinal direction. The leads can extend in particular along a plane which is essentially parallel to the carrier or to the conductor track layer. The leads extend over the component mounting area or over the mounting surfaces.This particularly applies to the supply leads, whereby the first contact points can also be located at an outer edge of the intermediate section such that they do not extend over the mounting surfaces themselves. In this case, the first contact points are provided at an outer edge region of the carrier, while the mounting surfaces or component area regions are located closer toward the intermediate section.

[0029] At least one row of third contact points can be provided in a direction perpendicular to the first direction and along the conductor layer. These can be followed by a row of second contact points in the intermediate section. The first contact points can be provided further along (perpendicular to the first direction) after the second contact points, or can also be provided at the height of the second contact points. The latter is possible in particular by providing the first and second contact points alternately in the longitudinal direction or along the first direction, namely alternately on the connection surfaces and the connecting surface sections.

[0030] In the course of the second supply lead and starting from the third contact points, a connecting section can follow the contact points or at the point at which this lead is mechanically connected to the third contact points. Within the connecting section and along the course starting from the contact points, the lead leads away from the carrier or from the conductor track layer. An approach section of the lead, which follows the connecting section, can also extend away from the carrier, but can also run parallel to it or extend (but not completely) towards it. In the approach section, the second supply lead approaches the first supply lead. In the approach section, the second supply lead extends along a first transverse direction, which is in particular parallel to the carrier and leads to the intermediate section (or to a region above it).

[0031] In particular, the second supply line extends along a first transverse direction, which points toward a region provided above the second contact point. The first transverse direction thus leads to a half-space above the second contact point or above the intermediate region. "Above" here means that this space extends away from the carrier (starting from the conductor layer).

[0032] Since the first supply lead originates from the intermediate section, i.e., from contact points or connection surfaces within the intermediate section, the proximity section results in the second supply lead being brought closer to the first supply lead. Consequently, the cross-sectional area between the supply leads is smaller, resulting in lower inductance. Alternatively, or in combination with this, the first supply lead can also extend from the respective contact points (second contact points) over a proximity section, in which the first supply lead extends to the second strip section or to a region above the second strip section.In other words, for example, the first supply lead can, starting from the connection surfaces, first be led away from the carrier through a first bend, and then through a second bend parallel to the carrier over the second strip section. This results in a space between the second strip section and the first supply lead, within which the second supply lead extends to a section of the first supply lead in which the first supply lead extends above the carrier and away from it. In other words, the second supply lead is initially bent parallel to the carrier towards the first lead, and then (from a point where the supply leads join) is led away at a short distance from the first lead along the course of the first lead. The point at which the second lead meets the first lead (i.e.The connecting point (the point of junction) is therefore not located above the third contact points, but rather above the intermediate section or an edge area of ​​the second strip section adjacent to the intermediate section. The supply leads are not routed above the phase lead, nor above contact points where the phase lead is connected to the conductor layer (or to the first surface).

[0033] The first and second supply leads are preferably largely parallel and closely spaced, i.e., for example, at a distance of less than 10, 5, 3, 2, or 1 mm from one another. In particular, the first and second supply leads are superimposed over most of their length and separated only by an insulating layer or layer. This particularly also applies to the portion of the supply leads that results after the point at which these leads join. The insulating layer can comprise at least one layer of lacquer and / or has a strip of electrically insulating material. In particular, from the proximity section (as viewed from the carrier), the first and second supply leads run adjacent to one another, i.e., electrically insulated from one another, but physically close to one another (in particular, at a distance of less than 5, 3, 2, or 1 mm).Preferably, an insulating tape or an insulating layer is provided between the supply leads with a thickness of less than 10, 5, 3, 2 or 1 mm.

[0034] The phase lead has first contact sections at which it is connected in a planar manner to the surface of the first transistor strip section or to the connecting surface sections. The first contact sections are connected in particular to the first surface, for example to its connecting surface sections or to the part of the first surface that extends (continuously) in the transistor strip section. The contact sections can be formed by a curvature of the phase lead, which leads to the first contact sections being guided parallel to the first surface. The first contact sections are thus parallel to the first surface and preferably have an underside that is connected in a planar manner to the first surface or to the connecting surface sections or to the surface of the first transistor strip section.

[0035] The supply leads can also have contact sections that run parallel to the conductor track layer and are connected to it over a wide area. The supply leads can also have a curvature that leads to the contact sections and aligns them parallel to the conductor track layer. The contact sections of the supply leads also have undersides that are connected over a wide area to the respective surfaces or surface sections of the conductor track layer. Two of the contact sections of the first supply lead are connected over a wide area to the connection surfaces, i.e. to surfaces in the intermediate section that are electrically insulated from the first surface within the conductor track layer. The second supply lead can have third contact sections at which it is connected to the second surface or to a surface within the second strip section.The contact sections can each extend along the conductor layer. In particular, the conductor sections extend in the same plane. This plane corresponds in particular to the surface of the conductor layer. The contact sections are thus connected to the same conductor layer. One aspect is that the second supply lead has contact sections (in particular the third contact sections) at which this lead is connected to the connection surfaces in a planar manner.

[0036] In general, the supply lines preferably each have a plurality of contact sections that contact the conductor layer at a plurality of locations. These contacting points or contact sections can be provided for each supply line along a row extending along the first direction or longitudinal direction. The plurality of first contact points of the phase supply line are connected to one another via the first surface. The plurality of third contact points of the second supply supply line are connected to one another via the second surface. The plurality of second contact points of the first supply supply line are connected to one another via this supply line itself.

[0037] The supply leads and / or the phase lead each have multiple contact sections arranged in a row along the first direction. For each lead having multiple contact sections, the contact sections are (electrically) connected by the lead itself. In other words, multiple contact sections of the lead extend from a single-piece section of the lead to the corresponding contact points.

[0038] The contact sections each extend along the conductor layer. The contact sections extend in a direction of the supply line, which leads away from the carrier, toward the intermediate section. A connecting section follows the contact sections (in the course of the supply line). In this connecting section, the supply line extends away from the conductor layer.

[0039] After the contact sections are followed by connecting sections of the supply line in the course of the second supply line, the connecting sections are preferably followed by (side-by-side) proximity sections or a proximity section of the supply line. This particularly applies to the second supply line and / or the first supply line. The proximity sections extend toward a region above the intermediate section. The proximity section (of the second supply line) further preferably extends parallel to the conductor track layer toward the first supply line. In this case, the proximity section extends toward a section of the first supply line that extends essentially perpendicularly away from the carrier.

[0040] The approach section is followed by a reversing bend. In the reversing bend, the direction of the supply line is reversed. This reversal results in a direction that leads away from the area above the intermediate section. The reversing bend is preferably followed by a discharge section (of the supply line). The discharge section extends away from the area above the intermediate section. Further on, the discharge section extends away from the carrier. The discharge section is designed to be connected to a conductor carrying external potential. The connection can be direct or can lead via a discharge connector that is connected to the discharge section. This makes it possible to adapt the supply line to the surrounding application by adjusting the discharge connector, in particular to achieve predetermined dimensions.

[0041] The supply lines preferably each have multiple contact sections. In each supply line, the contact sections are combined in a direction leading away from them to form a common section. Thus, the supply lines can have junctions in which the individual contact sections, or the individual sections leading thereto, are combined to form a single section of the supply line. These junctions can be provided in a connecting section of a supply line, in an approach section of the supply line (particularly in the case of the second supply supply line), or can be provided in a return bend, or even only in a discharge section.The contact sections can already be joined in the subsequent section of the supply line, but they can also be joined in the approach section or in the return bend, or in a section following a preceding section in which the supply line extends away from the conductor layer within a half-space above the conductor layer, for example, essentially perpendicularly. The supply lines can thus each have junctions, wherein in sections before this junction, which lead to the carrier, the supply line is divided or spread out into several individual (side-by-side) supply line parts, and wherein in or after the junction, the supply line is provided by a single conductor, for example, by a sheet metal strip.

[0042] If the supply lines are provided as a conductive strip, for example, as sheet metal strips such as sheets or similar, then the supply lines are wider in the section(s) where they are provided as individual conductors than in sections where the supply lines are or are converged. Particularly in a section where the convergence is located, the overall width of the supply line decreases in a direction leading away from the conductor layer.

[0043] Particularly at the contact points, the supply lines can each be provided as individual tongues. Further along, as the supply line leads away from the conductor track, these tongues are brought together or lead to a single conductor section, via which the contact sections are brought together. This merging corresponds to a direct electrical connection between the individual tongues. Particularly in the respective discharge section, the supply lines are designed as a single (and continuous in width) conductor, which is preferably narrower than the width of the contact tongues or

[0044] Contact points. This allows access to the individual contact tongues or contact points from above the carrier, since the upper derivation section is narrower and does not cover the tongues, seen from above. These tongues correspond in particular to the contact sections of the respective supply line. A further aspect is that the supply lines are divided into several parts starting from the conductor layer. In the direction of travel, one part follows the next. A physically independent derivation connector can be provided which is electromechanically connected to the derivation section. The several parts are preferably connected to one another via connecting links, wherein the parts can be screwed or riveted together, for example, or can also be sintered, soldered or preferably welded together.The multi-part design makes it possible to geometrically adapt the connection of the half-bridge module to external conditions.

[0045] The supply lines and / or the connectors and / or the conductor layer are made of electrically conductive material, in particular of a metal or an alloy, such as copper or a copper alloy or aluminum or an aluminum compound. The material can be formed as a piece of sheet metal, in particular as a stamped piece of sheet metal. The connectors are preferably designed for bonding, sintering, soldering, or gluing (electrically conductive); the connectors are particularly designed for friction welding, sintering, gluing (electrically conductive), or soldering. The transistors are power transistors, preferably MOSFETs or IGBTs, in particular SiC power semiconductors such as SiC MOSFETs. Other power semiconductors such as diodes can also be provided on the conductor layer, in particular in combination with the transistors.The supply leads are leads for two direct current supply potentials of a supply voltage (DC), in particular a high-voltage voltage with a nominal value of more than 60 V or of at least 200 V, 400 V, 600 V, 800 V or more. The phase lead is used to connect to a phase of a load and can therefore also be referred to as a load lead. An inverter module, such as a traction inverter module, can have multiple half-bridge modules and multiple phase connections, each of which is electrically connected to a specific one of the phase leads. The inverter module (or the half-bridge module) can have a heat sink surface. The carrier(s) is / are attached to this heat sink surface, in particular with an underside that is opposite the conductor layer. The inverter module or the half-bridge module is a power module and is designed in particular for nominal power outputs of at least 10 kW, 100 kW, or 250 kW.

[0046] The carrier is designed, in particular, as a substrate or printed circuit board, for example, as a PCB, DCB, or IMS. The carrier can have a layer for heat dissipation opposite the conductor layer, which layer is preferably made of a metal material (and is electrically insulated from the conductor layer via the insulation layer). The conductor layer forms an outer side of the carrier and, in particular, is not covered by an insulation layer of the carrier. The half-bridge module shown can be overmolded (with insulation material that is not part of the carrier) and / or can be covered with an insulation lacquer layer (that is not part of the carrier).

[0047] Figures 1 to 3 are schematic representations of features of the half-bridge module and serve to explain exemplary embodiments in more detail.

[0048] Figure 1 is a cross-section through a populated half-bridge module. The cross-section runs along the width of the carrier T and extends perpendicularly through the carrier. The carrier T comprises a conductor layer LS, which can be geometrically divided into a first strip section LA, an intermediate section ZA, and a second strip section HA. This subdivision serves to further explain the individual functions and is a conceptual division that does not necessarily have an electrical equivalent. Since the strip sections can also be populated with transistors HT, LT or are intended for this purpose, the strip sections are also referred to as transistor strip sections.

[0049] Shown is an example of a populated embodiment of a half-bridge module, wherein in an unpopulated half-bridge module the transistors LT, HT are replaced by mounting surfaces which are formed on the top side of the conductor track layer LS. The intermediate section ZA is provided between the strip sections HA, LA, wherein the sections HA, ZA and LA are arranged next to one another in this order (in a direction perpendicular to a longitudinal direction R1, as shown in Figure 2). In the strip section LA there is a first surface F1 of the conductor track layer LS, wherein the surface F1 is continuous perpendicular to the plane of the drawing (i.e. along the direction R1, as shown in Figure 2). In the second strip section HA there is a second surface of the conductor track layer LS, which is also shown in Figure 2 as the second surface F2. This second surface is separated from the intermediate section ZA or LA via a gap L.separated from the surface structures (cf. Figure 2, reference symbols VF and P) of the conductor layer LS.

[0050] A first connector V is shown, which connects a top or upper contact surface of the transistor LT to a surface located in the intermediate section. This surface corresponds to the connection surface P shown in Figure 2. A second connector V' connects a transistor HT, located in the second strip section HA, to a surface in the intermediate section ZA. This is another surface in the intermediate section ZA, namely a part of the first surface, also referred to as the connection surface section VF (see Figure 2).

[0051] The conductor layer LS is attached to a continuous insulating layer IS. The underside of the conductor layer LS faces the insulating layer IS. Leads Z+, Z-, and PZ are connected to the conductor layer LS. These are connected to the upper side of the conductor layer LS, which faces away from the insulating layer IS.

[0052] A first and a second supply line Z-, Z+ are shown on the left-hand side above the conductor layer LS, with a third supply line, namely a phase supply line, denoted by the reference symbol PZ. It can be seen that the ends of the supply lines pointing away from the carrier T extend in opposite directions. The two supply lines Z-, Z+ extend in a direction opposite to the direction in which the phase supply line PZ extends. This applies in particular to the downstream sections AA+, AA- and PA. The downstream section AA- is a section of the first supply line, the downstream section AA+ is a section of the second supply line and the section PA is a downstream section of the phase supply line PZ. The downstream sections are used for connection to external components.The supply leads are used to connect to a DC voltage supply, for example, to a DC voltage vehicle electrical system or to a battery. The phase lead PA is used to connect to a load or to a phase of a component, for example, an electrical machine.

[0053] The contact sections KA+, KA-, and KAP are shown in cross-section in Fig. 1. They belong to the respective supply lines Z+, Z-, and PZ and, in particular, form their ends, which are attached to the conductor layer LS. As can be seen, among other things, from Figure 2, there are several contact points 1, 2, and 3, to which the contact sections KA+, KA-, and KAP are attached, distributed on the conductor layer LS (or corresponding surfaces F1, F2, P, or surface sections thereof, such as the surface sections VF).

[0054] In particular in the intermediate section ZA, the connection surfaces P and the connecting surface sections VF alternate in the longitudinal direction R1, as can be seen from Figure 2. In order to contact these multiple connection surfaces P and connecting surface sections VF, at least the supply lines AA-, PZ have individual conductor sections or tongues that contact the individual contact points 1, 2. The conductor sections are arranged at a distance from one another in the first direction or in the longitudinal direction R1 (“lined up next to one another”, corresponding to the individual contact points) and are lined up next to one another along this direction. These individual conductor sections or split line routing can extend over the connecting sections VA-, VA2-. In particular, the individual conductor sections can extend up to the bend by means of which the supply lines Z- and PZ again extend parallel to the carrier.The conductor sections can be brought together in the bend; a junction can be located within the bend. The individual conductor sections can extend as far as the downstream sections PA, AA-, so that junctions are provided there. The supply lines can therefore have a junction or a junction point at which the conductor sections are brought together to form a common conductor. From this junction point onwards, the conductor is preferably narrower than at the sections where the individual conductor sections are present. Webs or tongues can be provided between the individual conductor sections or tongues that relate to the same supply line. The second supply line Z+ can also be provided as several conductor sections at the contact sections KA+. These can also be continued individually along the sections VA and NA, in particular also within the reversing bend UB.Within the reversing bend UB, or at a point directly following it, the individual conductor sections can be brought together to form a common conductor. Here, too, webs can be provided between the conductor sections. The respective potentials of the supply lines Z-, Z+ and PZ can be distributed along the direction R1 on the conductor layer LS or can be arranged in a row using the conductor sections. This results in a symmetrical connection of the various transistors. When connecting the connection surfaces P and the connecting surface sections VF, the merging within the supply lines (supply lines Z- and PZ) also has an electrical function, since the merging of the individual conductor sections and thus also the individual connection surfaces or

[0055] Connecting surface sections are electrically connected to one another. This connection corresponds to a short circuit and allows the potential of the relevant supply line to be supplied to the various surfaces P and VF. Since the connection surfaces P are insulated from one another, bringing the conductor sections together along the first supply line Z- ensures potential equality or a direct connection between the connection surfaces. In the case of the connecting surface sections VF or the contact points 3 on the second surface, this bringing together is not absolutely necessary since there is already a direct connection between the individual surfaces due to the continuous routing of the second surface F2 in the second strip section HA or the continuous routing of the first surface in the first strip section LA.Figure 3 shows examples of supply lines which are divided into individual conductor sections on the conductor track layer, which are located next to each other (lined up along the direction R1 ), and which are each combined to form a complete conductor via junctions.

[0056] Figure 2 is a plan view of a support T and serves to provide a better understanding of the half-bridge module described here. The support T is divided into three longitudinal sections or strip sections shown one above the other, namely the first strip section LA, the intermediate section ZA and the second strip section HA. All three extend along the first direction R1 and are arranged in a row perpendicular to the direction R1, as shown. Part of the first surface F1 is located in the first strip section LA, with further connecting surface sections VF of the first surface F1 extending individually into the intermediate section ZA (up to the strip section HA).

[0057] In the strip section LA, transistors LT are mounted on the first surface, which have surface contact OK. These transistors are contacted by means of connectors V, which lead to connection pads P located in the intermediate section ZA. The intermediate section ZA has connection surface sections VF belonging to the first surface F1, as well as connection pads P that are insulated from the first surface (and also from the second surface F2). The connection pads P extend between the two strip sections LA, HA. Along the first direction R1, connection surface sections VF of the first surface F1 and connection pads P alternate. First contact points are located on the connection surface sections VF. Alternatively, first contact points can be provided at the edge section of the first strip section LA, as denoted by the reference symbol T, wherein this edge section comprises an outer edge of the first strip section LA.The contact points 1' are also located on the part of the first surface F1 located in the strip section LA. It is shown that the alternative first contact points T are essentially offset between the transistors LT or upwardly offset therefrom. The alternative first contact points 1' are offset from the transistors LT toward the outer edge opposite the strip section HA.

[0058] Further transistors HT are provided in the second strip section HA. Like the transistors LT, which are arranged in a row in the direction of R1 in the first strip section, the transistors HT are also mounted on the second surface F2 and arranged in a row along the second strip section HA. The transistors are arranged at a distance from one another to prevent the formation of hot spots. The transistors each have signal contacts SK, which are provided on one side of the transistors facing the outer edge of the carrier T opposite the strip section HA.

[0059] Second connectors V connect the connecting surface sections VF to surface contacts OK' of the transistors HT. By attaching the transistors to the first and second surfaces F1, F2, second surface contacts (on the underside of the transistors) are located directly on the first and second surfaces, respectively, and are attached thereto, for example, by means of a solder or sintered connection. The connectors V, V can, in particular, be bonding strips made of metallic material, for example, aluminum or copper.

[0060] A gap L separates the area F2 from the

[0061] Connecting surface sections VF and the connection surfaces P, on the other hand, which extend up to the second surface. The connection surfaces P are thus also separated from the second surface F2 (within the conductor layer LS).

[0062] Figure 1 shows that the first contact surfaces 1 (cf. Figs. 1 and 2) are connected to the phase supply line PZ. This can also apply to the contact surfaces T. The contact sections KAP are part of the phase supply line PZ. The contact sections KAP (cf. Figure 1) are applied flat to the first contact points 1 or T and connected to them (for example by means of a welded connection, e.g. a friction welded connection, by means of a sintered connection, by means of a soldered connection or by means of an adhesive connection). Since there are several contact points 1, namely one contact point on each intermediate section, the phase supply line PZ has a number of conductor sections or tongues at the contact section which are isolated in the direction R1 and are then brought together in the further course of the phase supply line PZ.With the merging, the phase supply line PZ narrows so that, for example, after the second bend, i.e. in the discharge section PA, the phase supply line has a smaller width than the width of all conductor sections at the contact section KAP (i.e. the width along which the first contact points 1, 1' are distributed in the direction R1).

[0063] The first supply line Z- also has a contact section KA-, in which it is divided into individual conductor sections in order to contact the individual connection surfaces P or the contact surfaces 2 provided there (without making contact with the first surface F1 or with the second surface F2). The second contact surfaces 2 are distributed along the direction R1, so that the individual conductor sections of the supply line Z- are led off from these second contact points 2. The conductor sections are thus lined up in the longitudinal direction R1 and spaced from one another in this direction. The spacing of the conductor sections that contact the contact surfaces 1 or 2 is such that no contact is established between the potentials of the supply lines.

[0064] The second supply lead Z+ is also equipped with individual conductor sections for contacting the third contact surfaces 3. There, too, the conductor sections are essentially routed parallel along the conductor layer LS and rest on it. In the second supply lead Z+, too, the individual conductor sections are joined along the course of this lead away from the contact points 3, whereby this joining is accompanied by a reduction in the width of the lead. The width is, in particular, a dimension of the respective lead in the direction R1.

[0065] In the direction of travel, the supply lines Z+, Z-, and PZ have contact sections, with each contact section fanning out into adjacent conductor sections or tongues to contact several similar (i.e., associated with the same potential) contact surfaces 1, 2, or 3. As they extend away from the conductor layer, the conductor sections are joined. This is also illustrated in Figure 3 as an example for the supply lines Z+ and Z-.

[0066] Figure 3 shows in more detail that a narrowing of the supply lines due to the merging of the conductor sections (in the direction of travel away from the contact sections) results in the individual (side-by-side, fanned-out) conductor sections or contact sections being accessible from above. It can be seen that the contact sections KA+ and KA- extend in opposite directions. These contact sections KA+, KA- of the two supply lines Z+, Z- enable easy attachment of the contact sections to the respective surfaces, for example, by friction welding. This allows for connection types in which the contact sections are attached to the conductor layer by machining from above.

[0067] As shown, the contact sections KA-, KA+ are implemented as individual conductor sections that are joined further along the supply lines Z+, Z- and each merge into a common conductor. This common conductor is present particularly in the downstream sections AA+, AA-. Furthermore, it is shown that no conductor sections or contact sections KA+ are provided below these joined supply lines Z+, Z- or below the downstream sections, thus allowing access from above, for example, for fastening by friction welding.

[0068] Figure 3 also shows a plurality of second transistors HT located beneath the supply leads Z+, Z-. It is also shown that the contact sections KA-, i.e., their individual conductor sections, are connected to the terminal pads P. Furthermore, it is shown that connecting surface sections VF, which belong to the first area F1, are provided between the individual terminal pads. Finally, it can be seen that trenches are provided in the conductor layer, which, for example, completely enclose the terminal pads P in order to separate the terminal pads P from the connecting surface sections VF, and to separate the connecting surface sections and the terminal pads P from the second area F2.This separation takes place within the conductor layer LS and enables the conduction of different potentials in the connection surfaces, in the connection surface sections VF and in the second surface F2, which are all provided in the same conductor layer LS.

[0069] It can be seen, particularly from the perspective view in Figure 3, that the connection surfaces P, the connecting surface sections VF, and the second surface F2, which represent the connection potentials and the phase potential, are formed within the same conductor layer. Furthermore, it can be seen that no additional connecting elements are required to establish a connection between the supply lines and the respective potential surfaces of the conductor layer LS.

[0070] The transistors shown in the figures form an electrical half-bridge with a high-side transistor element and a low-side transistor element. The high-side transistor element is formed by the transistors HT connected in parallel, and the low-side transistor element is formed by the transistors LT connected in parallel. The parallel connection is created by the common surfaces F1 and F2 to which the transistors are connected, as well as by the merging of the connecting surface sections VF via the first surface (in the first strip section) and by the discharge of the potentials of the connection surfaces via the same supply lead Z-. The connection point between the transistor elements of the half-bridge is represented by the first surface F1. The connection point or the first surface F1 is connected to the phase lead PZ.The outer ends of the half-bridge are formed by the connection surfaces P on the one hand and the second surface F2 on the other. The connection surfaces P form a negative supply connection of the half-bridge. The second surface F2 forms the positive supply connection of the half-bridge. The half-bridge module shown is preferably designed as a power half-bridge module, in particular for power outputs of significantly more than 10 kW, in particular more than 50 kW. The half-bridge module is designed in particular as a high-voltage half-bridge module with nominal voltages of more than 60 V and of at least 200, 400 or 800 V. The half-bridge module shown is preferably used in a traction inverter of a vehicle, but can also be used in a DC-DC converter (preferably on the vehicle side). Other possible applications include stationary inverters and the like.

[0071] Especially when used as a traction inverter, multiple phases are required, so a corresponding inverter has at least one half-bridge module per phase. A three-phase inverter therefore requires at least three half-bridge modules (with individual phase leads). The supply leads Z+ and Z- can be implemented together or individually and electrically connected.

[0072] The half-bridge module shown in the figures is based on a rectangular carrier T. The sections LA, ZA, HA shown can completely divide the carrier T, or can completely divide a power range of the carrier T.

[0073] The sections LA, ZA, and HA preferably directly adjoin one another, wherein the distances between the respective dashed rectangles shown in the figures are merely provided to better identify the individual sections. The gap L shown relates to the physical separation of the second area F2 from the connection areas P and the supply area sections VF within the conductor layer and represents an actual physical separation (within the conductor layer). The carrier is preferably designed as a printed circuit board, for example as a ceramic printed circuit board or ceramic carrier, for example in the form of a DCB or another carrier with at least one copper layer or a ceramic insulator layer IS.The underside of the carrier (not shown) can be connected to a heat sink, with the insulator layer IS being connected to the heat sink either directly or via a heat-conducting layer, such as a copper layer. Furthermore, the carrier shown can have a populated underside and / or can have conductive intermediate layers and / or connecting elements such as vias. However, it should be noted that all essential connecting elements and components of the power path of the half-bridge module are located on one side of the carrier, which simplifies current routing. Figure 3 shows the very close routing of the supply leads Z+, Z- made possible in this way to reduce disadvantageous inductive properties and further shows that a phase lead can be provided at a distance from the two supply leads Z+, Z-.In Figure 3, a phase supply line could follow further on at the top left, showing that the two supply lines are on one side of the carrier, while the phase supply line is on an opposite side of the carrier.

Claims

Patent claims 1. Half-bridge module with a first power supply line (Z-), a second power supply line (Z+) and a phase supply line (PZ) and with a carrier (T) having a conductor layer (LS) which has contact pads (P) in an intermediate section (ZA) located between a first and a second transistor strip section (LA, HA) of the conductor layer (LS), each of which is insulated around the conductor layer, wherein the first power supply line (Z-) is connected to and leads away from the contact pads (P), the second power supply line (Z+) is connected to and leads away from at least one contact point (3) within the second transistor strip section (HA), and the phase supply line (PZ) is connected to and leads away from at least one contact point (1, T) within the intermediate section (ZA) or the first transistor strip section (LA).

2. Half-bridge module according to claim 1, wherein first connectors (V) are provided which are connected to the terminal surfaces (P) and which extend from these terminal surfaces (P) into the first transistor strip section (LA).

3. Half-bridge module according to claim 1 or 2, wherein a first surface (F1 ) of the conductor layer (LS) extends as a continuous surface in the first transistor strip section (LA) and further extends as individual connecting surface sections (VF) between the terminal surfaces (P) in the intermediate section (ZA), wherein the connecting surface sections (VF) extend from the first transistor strip section (LA) to the second transistor strip section (HA).

4. Half-bridge module according to claim 3, wherein second connectors (V') are provided which are connected to the connecting surface sections (VF) and extend from these connecting surface sections (VF) into the second transistor strip section (HA).

5. Half-bridge module (M) according to one of the preceding claims, wherein the first supply line (Z-) is connected to contact points (2) with the The terminal surfaces (P) are connected, which are located in the intermediate section (ZA), and the phase supply line (PZ) is connected at contact points (1) to the conductor layer (LS) which are located in the intermediate section (ZA) or in the first transistor strip section (LA).

6. Half-bridge module (M) according to one of the preceding claims, wherein the phase supply line (PZ) is connected to the conductor layer (LS) at contact points (1) located in the intermediate section (ZA), wherein these contact points (1) are located with a deviation in the middle between a series of transistor mounting surfaces in the first transistor strip section (LA) and a series of transistor mounting surfaces in the second transistor strip section (LA), and the deviation is not more than 20 mm, 15 mm, 10 mm or 5 mm.

7. Half-bridge module (M) according to one of the preceding claims, wherein the phase supply line (PZ) is connected at at least one first contact point (1, T) to the conductor layer (LS) located in the first transistor strip section (LA) or in the intermediate section (ZA), the first supply supply line (Z-) is connected at at least one second contact point (2) to the terminal pads (P), and the second supply supply line (Z+) is connected at at least one third contact point (3) to the conductor layer (LS), wherein the at least one third contact point (3) is located in the second transistor strip section (HA), and wherein the first and second supply supply lines (Z-, Z+) and the phase supply line (PZ) each have derivation sections (AA-, AA+, PA) which are opposite the first, second and third contact points (1, 2, 3) in the course of the supply lines, wherein the derivation sections (AA-,AA+) of the supply lines (Z-, Z+) on the one hand and the phase supply line (PZ) on the other hand extend in opposite directions away from the carrier (T).

8. Half-bridge module (M) according to claim 7, wherein in the course of the second supply line (Z+) starting from the at least one third contact point (3) an approach section (NA) follows, which extends in the direction of an area above the second contact points (2) and the first and the second supply lines (Z-, Z+) run adjacent to each other from the approach section (NA) at least up to the derivation sections (AA-, AA+) of the first and second supply lines (Z-, Z+). Half-bridge module (M) according to claim 8, wherein, in the course of the second supply lead (Z+), a connecting section (VA) follows the third contact points (3) and leads to the proximity section (NA), wherein in the connecting section the second supply lead (Z+) extends away from the carrier (T) and in the proximity section (NA) the second supply lead (Z+) extends along a first transverse direction (QR1) which points substantially parallel to the carrier (T) in the direction of the area above the second contact point (2). Half-bridge module (M) according to any of the preceding claims, wherein the phase lead (PZ) has first contact sections (KAP) at which it is planarly connected to the surface (F1) of the first transistor strip section (LA) or to the connecting surface sections (VF), and the first supply lead (Z-) has second contact sections (KA-) at which it is planarly connected to the connection surfaces (P).and the second supply line (Z+) has third contact sections (KA+) at which it is planarly connected to the connection surfaces (P), wherein the contact sections (KAP, KA-, KA+) each extend along the conductor layer (LS). Half-bridge module (M) according to one of the preceding claims, wherein the second supply line (Z+) has contact sections (KA+) at which it is planarly connected to the connection surfaces (P), and the contact sections (KA+) each extend along the conductor layer (LS) in the direction of the intermediate section (ZA), in the course of the second supply line (Z+) a connecting section (VA) of the supply line (Z+) follows the contact sections (KA+), extending away from the conductor layer (LS), and following the connecting sections (VA) a proximity section (NA) of the supply line (Z+),which extends in the direction of an area above the intermediate section (ZA) or extends parallel to the conductor layer (LS) towards the first supply lead (Z-), and the approach section (NA) is followed by a reversal arc (UB) in which the direction of the lead (Z+) is reversed to a direction leading away from the area above the intermediate section (ZA), and the reversal arc (UB) is followed by a derivation section (AA-) of the second supply lead (Z+) which extends away from the area above the intermediate section (ZA) and subsequently from the carrier (T).

12. Half-bridge module (M) according to one of the preceding claims, wherein the leads (Z, Z+, PZ) are each attached to the conductor layer (LS) via several contact sections (KAP, KA-, KA+) and in each lead the contact sections (KAP, KA-, KA+) are located in one of the contact sections (KAP, KA-, KA+) leading away from the source are joined together to form a subsequent connecting section (VA, VA', VA") of the supply lines.

13. Half-bridge module according to one of the preceding claims, wherein the Leads (Z-, Z+, PZ) are divided into several parts along the route starting from the conductor layer (LS), which are connected to each other via connecting elements.

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