Cooling device for cooling an electrical and / or electronic assembly
Patent Information
- Application Number
- EP2023730381
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-06-07
- Filing Date
- 2023-05-25
- Publication Date
- 2025-04-16
AI Technical Summary
Existing cooling devices for electrical and electronic assemblies, such as those in hybrid or electric vehicles, face inefficiencies in heat dissipation due to bypass flows around turbulators, which reduce the effectiveness of heat transfer.
A cooling device design featuring a deep-drawn base plate with an embossing on the edge of the turbulator area, allowing the turbulator to fill a larger area within the cooling channel and minimizing bypass flow by using solder to fill gaps between the turbulator and the base plate, thereby enhancing heat transfer efficiency.
The design significantly increases the cooling efficiency by blocking or restricting bypass flows, allowing more cooling fluid to interact with the turbulator, thus effectively dissipating heat from electrical and electronic assemblies.
Smart Images
Figure 1.1
Abstract
Description
[0001] Description
[0002] title
[0003] State of the art
[0004] The present invention relates to a cooling device for cooling an electrical and / or electronic assembly and an electronic arrangement.
[0005] Power modules such as inverter structures or converter structures are used in hybrid or electric vehicles. For example, inverters are used to operate an electric machine; they provide phase currents for the electric machine. The power modules can, for example, comprise a carrier substrate with conductor tracks on which, for example, power semiconductors are arranged, which together with the carrier substrate form an electronic unit. During operation, the electronic unit generates heat that must be dissipated to a cooling device. For this purpose, the electronic unit is thermally connected to the cooling device. It is known to provide cooling devices with cooling channels through which a cooling fluid can flow, dissipating the heat from the heat sink. So-called turbulators can be provided in the cooling channels; these ensure better heat dissipation from the cooling device to the cooling fluid flowing through the cooling device.The turbulators create turbulent flows and increase the cooling surface.
[0006] Disclosure of the invention According to the invention, a cooling device for cooling an electrical and / or electronic assembly is proposed. The cooling device comprises a cover plate and a base plate, wherein the base plate is designed as a deep-drawn component with a recess, wherein the cover plate and the base plate are arranged such that a cooling channel is formed between the cover plate and the base plate through the recess, wherein the cover plate and the base plate are connected to one another at a contact region outside the recess, wherein a cooling fluid flow can flow through the cooling channel, wherein the cooling device further comprises at least one turbulator which is arranged within the recess of the cooling channel, wherein the turbulator rests against a base surface in the recess of the base plate, wherein the base surface faces the cover plate. The base plate has an embossing in a bending region on the edge of the base surface.
[0007] Advantages of the invention
[0008] Compared to the prior art, the cooling device with the features of the independent claim is particularly efficient in cooling the electrical and / or electronic assembly to be cooled. The embossing allows a bypass flow to be blocked or severely restricted through a bypass region at the edge of the turbulator. The embossing enlarges the recess in the base plate. Because the embossing is in the bending region at the edge of the base surface, the recess in the bending region at the edge of the base surface is enlarged. The edge of the base surface, which was rounded by deep-drawing the base plate, loses its roundness due to the embossing. The turbulator can therefore fill a larger area in the recess and thus in the cooling channel.The deep-drawn base plate is thus subsequently adapted to the shape of the turbulator in order to keep the distance between the turbulator and the base plate, and thus the bypass flow, as small as possible. The turbulator thus protrudes into the embossing and advantageously fills a large area in the cooling channel. This advantageously reduces the need for a bypass area next to the turbulator. This allows a bypass flow to be blocked or severely restricted by a bypass area at the edge of the turbulator. Further advantageous embodiments and refinements of the invention are enabled by the features specified in the subclaims.
[0009] According to an advantageous embodiment, a radius in the bending area of the floor plate at the edge of the floor surface is reduced by the embossing. Thus, the radius of the bending area at the edge of the floor surface inside the cooling channel can advantageously be small, and the bending area can be formed, for example, essentially rectangular due to the embossing inside the cooling channel. Thus, the turbulator can advantageously extend far into the bending area, and the bypass flow in the bypass area can be advantageously reduced.
[0010] According to an advantageous embodiment, the embossing creates a particularly rectangular shape in the bending area at the edge of the floor surface. Thus, the turbulator, which itself has a bend, for example, in an area facing the bending area of the floor panel, can advantageously extend far into the embossing and the bypass area.
[0011] According to an advantageous embodiment, solder is arranged between the turbulator and the base plate in the embossed region, and the turbulator is connected to the base plate in the embossed region by means of the solder. The solder can advantageously be easily drawn into the minimized gap between the turbulator and the base plate in the embossed region by means of capillary action. Bypass flow between the turbulator and the base plate in the embossed region can thus be advantageously reduced.
[0012] Cooling device according to one of the preceding claims, characterized in that a gap between the turbulator and the base plate in the embossed region is completely filled with solder. The area between the turbulator and the base region in the embossed region is thus completely closed and blocked from bypassing the cooling fluid past the turbulator. The solder can advantageously be easily drawn into the gap by capillary action.
[0013] Cooling device according to one of the preceding claims, characterized in that in a region in which the cover plate is spaced from the base plate, solder is arranged between the cover plate and the base plate and / or in a region outside the embossing, solder is arranged between the turbulator and the base plate. Thus, by additional solder in the cooling device, which is not needed, for example, to connect the base plate, cover plate, and turbulator to one another, the bypass region in the cooling channel is further closed. Thus, more cooling fluid flows through the turbulator and less past the turbulator, so that the cooling device has increased efficiency for cooling the electrical and / or electronic assembly. Here, too, the solder can advantageously be drawn into the corresponding gaps simply by means of capillary action.
[0014] Cooling device according to one of the preceding claims, characterized in that the turbulator is formed from a bent sheet metal, wherein the sheet metal has a bend with a radius of the turbulator in a region of the turbulator facing the bending region of the base plate. Such a turbulator can advantageously be manufactured simply by cutting and forming a sheet metal, for example by punching and bending, for example in the same way as the cover plate and the base plate.
[0015] According to an advantageous embodiment, a radius in the bending area of the floor plate at the edge of the floor surface is smaller than the radius of the turbulator in the area of the turbulator facing the bending area of the floor plate. Thus, the turbulator can advantageously extend far into the embossing and be in contact with the floor surface and a side area of the floor plate and / or be attached to it, for example, by soldering it.
[0016] Cooling device according to one of the preceding claims, characterized in that the embossing at the edge of the base surface is recessed relative to the base surface. Thus, a notch is punched into the base surface at the edge of the base surface. This advantageously prevents overlaps between the parts and ensures that the turbulator can protrude into the embossing. Furthermore, an enlarged gap can be formed between the turbulator and the base plate in the embossing, which gap can advantageously be well filled with solder.
[0017] Furthermore, the cooling device can be comprised of an electronics arrangement, wherein the electronics arrangement further comprises at least one electrical and / or electronic assembly to be cooled, wherein the electronic component is arranged on the cover plate or on the base plate.
[0018] Short description of the drawings
[0019] Embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description.
[0020] Figure 1 shows a cross section through an embodiment of an electronic arrangement with a cooling device,
[0021] Figure 2 is an enlarged section of the embodiment of the electronic arrangement with the cooling device,
[0022] Figure 3 shows a section of a second embodiment of the electronic arrangement.
[0023] Embodiments of the invention
[0024] Fig. 1 shows a sectional view through an embodiment of an electronics assembly 50. The electronics assembly 50 comprises a cooling device 1 and an electrical and / or electronic assembly mounted on the cooling device 1. Fig. 2 shows an enlarged section of the embodiment of the cooling device 1 from Fig. 1. Fig. 3 shows a second embodiment of the cooling device 1.
[0025] The cooling device 1 is provided for cooling the electrical and / or electronic assembly 2, for example a power circuit. This can be, for example, power circuits, such as inverter structures or converter structures, of hybrid vehicles or electric vehicles. The electrical and / or electronic assembly 2 can, for example, be designed as a power module and, for example, comprise a carrier substrate with conductor tracks, on which, for example, power semiconductors are arranged, which together with the carrier substrate form an electronic unit. During operation, the electrical and / or electronic assembly 2 generates heat, which must be dissipated to a cooling device 1. For this purpose, the electrical and / or electronic assembly 2 is arranged on the cooling device 1, for example on a support surface of a cover plate 3 or a base plate 4.One or more layers for fastening and thermally connecting the electrical and / or electronic assembly 2 to the heat sink 1 can be arranged between the cooling device 1 and the electrical and / or electronic assembly 2.
[0026] For example, on the electrical and / or electronic assembly
[0027] A copper coating may be provided on the contact surface of the cover plate 3 facing the cooling device 1. Several electrical and / or electronic assemblies 2 can also be arranged on the cooling device 1, for example, side by side, on the cover plate 3 of the cooling device 1. Thus, each of the electrical and / or electronic assemblies 2 is thermally connected to the cooling device 1 and secured thereto.
[0028] The base plate 4 and the cover plate 3 form outer walls of the cooling device 1. The base plate 4 forms a bottom side of the cooling device 1. The cover plate
[0029] 3 forms a top side of the cooling device 1. The base plate 4 and the cover plate 3 can be formed, for example, from a material with high thermal conductivity, for example from a metal, for example aluminum. The base plate 4 and the cover plate 3 are formed from sheet metal. The base plate 4 and / or the cover plate 3 each have a constant thickness, for example. The base plate 4 and the cover plate 3 can, for example, have the same thickness. However, the base plate 4 and the cover plate 3 can also have different thicknesses.
[0030] A recess 40 is formed in the base plate 4. The base plate 4 is thus essentially trough-shaped. The cover plate 3 is arranged on the base plate 4 such that the recess 40 in the base plate 4 is covered by the cover plate 3. The base plate 4 and the cover plate 3 are arranged on one another such that the recess 40 forms a cooling channel 5 between the base plate 4 and the cover plate 3. The cooling channel 5 runs between the base plate 4 and the cover plate 3. The base plate 4 and the cover plate 3 form walls that delimit the cooling channel 5. The base plate 4 is designed as a deep-drawn part. An edge 41 of the base plate 4, which is formed, for example, in one plane, is connected to an edge 31 of the cover plate 3. The region in which the base plate 4 is connected to the cover plate 3 is referred to as the contact region 8. The edge 41 of the base plate 4 runs all the way around the recess 40 in the base plate 4.The edge 41 of the base plate 4 rests, for example, directly or with the interposition of an intermediate layer on the edge 31 of the cover plate 3. The edge 41 of the base plate 4 is firmly connected, in particular soldered, to the edge 31 of the cover plate 3. The edge 41 of the base plate 4 can be connected, in particular soldered, to the edge 31 of the cover plate 3 directly or with the interposition of one or more intermediate layers or intermediate elements. The edge 41 of the base plate 4 is connected to the edge 31 of the cover plate 3, for example by means of a brazing process. The edge 41 of the base plate 4 is connected, in particular soldered, to the edge 31 of the cover plate 3 all the way around.
[0031] In the region of the recess 40, the base plate 4 is spaced from the cover plate 3, so that a flow-through cavity is formed between the base plate 4 and the cover plate 3, in which cavity the cooling channel 5 runs. As in this exemplary embodiment, the edge 41 of the base plate 40 can extend flatly in a first plane. Furthermore, a sheet metal section 42 of the base plate 40, which forms, for example, a base of the recess 40, can extend flat in a second plane, which runs in particular parallel to the first plane. Thus, the edge 41 of the base plate 40 and the sheet metal section 42 of the base plate 4 are each flat and arranged parallel to one another. The cover plate 3 can, for example, be flat or also be designed as a deep-drawn part. The recess 40 and thus the cooling channel 5 can be elongated with respect to the base plate 4, in particular at least partially with a rectangular shape.The cooling channel 5 extends at least partially along a longitudinal direction. When viewed from a sheet metal plane of the cover sheet 3, the cooling channel 5 preferably has an elongated region, in particular with a rectangular geometry, which extends along the longitudinal direction, which is defined in particular by a straight line.
[0032] In the recess 40 of the floor panel 4, the floor panel 4 has an embossing 7. At the embossing 7, the floor panel 4 is deformed by embossing. The floor panel 4 is embossed inside the recess. The embossing 7 is arranged on an edge of a bottom surface 44 of the floor panel. The bottom surface 44 of the floor panel 4 extends, in particular flat, on the sheet metal section 42. The bottom surface 44 is a surface of the floor panel 4 facing the cooling channel 5 and the cover panel 3. The bottom surface 44 forms the bottom of the cooling channel 5 on the floor panel 4. The embossing 7 is arranged on the edge of the bottom surface 44. The edge of the bottom surface 44 is the region in which the floor panel 4 is deformed out of the plane of the bottom surface 44 in the direction of the cover panel 3. The edge of the bottom surface 44 is arranged in a bending region 43 of the bottom plate 4, in which the bottom plate 4 is bent at the edge of the flat sheet section 42 in the direction of the cover plate 3.Due to the embossing 7, a radius R4 of the bending region 43 inside the recess 40 is reduced compared to the radius in the bending region 43 before the embossing. The recess 40 and thus also the cooling channel 5 are enlarged in the bending region 43 by the embossing 7. The embossing 7 is embossed into the bending region 43, for example, as a substantially rectangular corner. At the edge of the bottom surface 44, for example, a rectangular shape is embossed into the bending region 43 of the floor panel 4. Thus, the flat sheet metal section 42 at the edge of the bottom surface 44 inside the recess 40 merges into the bending region 43 of the floor panel 4 at an angle, in particular at a right angle. The bottom surface 44 is arranged at an angle, in particular a substantially right angle, to a side surface that adjoins the bottom surface 44 inside the recess 40.The radius R4 of the bend in the floor panel 4 between the floor surface 44 and the side surface is reduced by the embossing 7. The embossing 7 creates an angle, in particular a substantially right angle, in the bending region 43 of the floor panel 4. The embossing 7 can, for example, as in the first exemplary embodiment of the cooling device 1 in Fig. 2, adjoin the floor surface 44 in a flush manner. The floor surface 44 is thus widened by the embossing 7. However, the embossing 7 can also be recessed compared to the floor surface 44, for example, as a notch on the edge of the floor surface 44. This is shown in the second exemplary embodiment of the cooling device 1 in Fig. 3.
[0033] For example, an intermediate plate can also be arranged between the cover plate 3 and the base plate 4. For example, such an intermediate plate can provide additional clearance from the upper side of the base plate 4 in order to adjust the height of the cooling channel 5. Alternatively, as in the exemplary embodiment illustrated in the figures, the cover plate 3 and the first sheet metal section 41 of the base plate 4 can also be directly adjacent to one another.
[0034] Furthermore, the cooling device 1 comprises an inlet opening (not shown in the figures), through which a cooling fluid can be supplied to the cooling channel 5 in the cooling device 1. Furthermore, the cooling device 1 comprises an outlet opening, through which the cooling fluid can flow out of the cooling channel 5 and the cooling device 1. The cooling fluid can be water, for example. The inlet opening and / or the outlet opening can be formed, for example, by openings in the recess 40 of the base plate 4. The openings can be, for example, breakthroughs in the base plate 4. For example, an inlet nozzle can also be arranged or formed at the inlet opening. Likewise, an outlet nozzle can be arranged or formed at the outlet opening. A cooling fluid flow can flow through the cooling channel 5 from the inlet opening to the outlet opening.A cooling fluid can flow through the inlet opening of the cooling device 1 into the cooling channel 5 and flow out of the cooling channel 5 of the cooling device 1 through the outlet opening of the cooling device 1. The cooling channel 5 is designed to conduct cooling fluid through the cooling device 1. The cooling channel 5 in the cooling device 1 extends from the inlet opening to the outlet opening. A cooling fluid flow can flow through the cooling channel 5 along the longitudinal direction from the inlet opening to the outlet opening.
[0035] The cooling device 1 further comprises at least one turbulator 6. The turbulator 6 is arranged within the cooling channel 5. The turbulator 6 is arranged in a turbulator section 56 of the cooling channel 5 extending along the longitudinal direction. The turbulator 6 is arranged between the cover plate 3 and the base plate 4. The turbulator 6 can extend from the cover plate 3 to the base plate 4 completely through the cooling channel 5. In particular, the turbulator 6 is in indirect and / or direct heat-conducting contact with the cover plate 3 and the base plate 4. The turbulator 6 is attached to the cover plate 3 and / or to the base plate 4, for example by means of a brazing process. The turbulator 6 rests against the base surface 44 of the base plate 4 and / or is connected to the base surface 44, in particular by soldering. The turbulator 6 extends on the bottom surface 44. The turbulator 6 extends into the embossing 7.Cooling fluid flows through the turbulator 6 in the longitudinal direction, parallel to the, for example, flat cover plate 3 and / or to the, for example, flat sheet metal section 42 of the base plate 4. The turbulator 6 has a surface-enlarging, flow-guiding, and heat-transferring structure. The turbulator 6 is made, for example, from a metal with good thermal conductivity, such as aluminum. The turbulator 6 can also have a coating, for example. The turbulator 6 can be designed, for example, as a structured sheet metal. In order to achieve the highest possible cooling efficiency, the largest possible portion of the flow cross-section of the cooling channel 5 between the base plate 4 and the cover plate 3 is filled by the turbulator 6. The turbulator 6 extends, for example, essentially plane-parallel to the cover plate 3 and / or to the, for example, flat sheet metal section 42 of the base plate 4.The turbulator 6 has, for example, substantially the same surface area as the support surface on the cover plate 3 on which the electrical and / or electronic assembly 2 is arranged.
[0036] The turbulator 6 is, for example, formed in one piece. The turbulator 6 is manufactured from a sheet metal, for example by cutting and deforming, in particular by punching and bending. The turbulator 6 is intended to generate turbulent flow in the cooling fluid. The turbulator 6 is structured to generate turbulent flow in the cooling fluid. On the turbulator 6, for example, a plurality of turbulence sections are formed, which are arranged at an angle to the flow direction, in particular to the longitudinal direction, of the cooling fluid through the cooling channel 5. The turbulence sections serve to swirl the cooling fluid flowing through the cooling channel 5. This allows the heat to be dissipated particularly effectively. The turbulence sections can, for example, be wave-like or jagged or can be designed as periodically recurring elevations and / or depressions in the turbulator.The turbulence sections in the turbulator 6 can be formed, for example, by cutting and forming, for example punching and bending, the sheet metal from which the turbulator 6 is made.
[0037] In order to achieve high cooling efficiency, the largest possible part of the flow cross-section of the cooling channel 5 is covered by the turbulator 6. Since the base plate 4 is a deep-drawn component, a draft angle and radii at the edge of the recess 40 are required for the demolding process during deep drawing. These radii, which arise from the deep drawing, are reduced by the embossing 7. The turbulator 6 is arranged below the electrical and / or electronic assembly 2. At the edge of the cooling channel 5, to the side next to the turbulator 6 and between the turbulator 6, the base plate 4 and the cover plate 3, bypass regions 55 are provided. The bypass regions 55 are arranged next to the electrical and / or electronic assembly 2 in the plane of the support surface for the electrical and / or electronic assembly 2. In the bypass region 55, the cooling channel 5 is tapered. In the bypass areas 55 there is no turbulence in the cooling fluid flow.Due to the embossing 7, the turbulator 6 can protrude into the embossing 7 with an unchanged extension from the base plate 4 to the cover plate 3 and advantageously fill a large part of the cooling channel 5. In a region of the turbulator 6 facing the bending region 43 of the base plate 4, the turbulator 6 is bent and has a radius R6 of the turbulator. The radius R4 designates the radius of the bending region 43 at the edge of the base surface 44. The radius R6 of the turbulator 6 is larger than the radius R4 in the bending region 43 at the edge of the base surface 44. Thus, the turbulator 6 can protrude far into the embossing 7 and advantageously fill a large part of the cooling channel 5.
[0038] As shown in the figures, solder 20 can also be provided at various locations in the cooling device 1. The solder 20 can, for example, be drawn into narrow spots in the cooling device 1 by capillary action. The solder 20 can, for example, be arranged between the turbulator 6 and the base plate 4 in the region of the embossing 7 and / or in the embossing 7. In this case, for example, gaps between the turbulator 6 and the base plate 4, in particular in the embossing 7, can be filled with the solder 20. Areas in the cooling device 1 in which the cover plate 3 is spaced from the base plate 4 can also be filled with the solder 20. Furthermore, the solder 20 can also be arranged in areas between the base plate 4 and the turbulator 6 outside the embossing 7. The solder 20 closes off areas where the cooling fluid can flow past the turbulator 6.Thus, a bypass flow of the cooling fluid past the turbulator 6 is reduced or prevented and the efficiency of cooling of the electrical and / or electronic assembly 2 by the cooling device 1 is improved.
[0039] Of course, further embodiments and mixed forms of the embodiments shown are possible.
Claims
Claims 1. Cooling device for cooling an electrical and / or electronic assembly (2), comprising a cover plate (3) and a base plate (4), wherein the base plate (4) is designed as a deep-drawn component with a recess (40), wherein the cover plate (3) and the base plate (4) are arranged such that a cooling channel (5) is formed between the cover plate (3) and the base plate (4) by the recess (40), wherein the cover plate (3) and the base plate (4) are connected to each other at a contact area (8) outside the recess (40), wherein the cooling channel (5) is permeable to a cooling fluid flow, wherein the cooling device (1) further comprises at least one turbulator (6) which is arranged within the recess (40) of the cooling channel (5), wherein the turbulator (6) bears against a bottom surface (44) in the recess (40) of the base plate (4), wherein the bottom surface (44) faces the cover plate (3). is characterized bythat the base plate (4) has an embossing (7) in a bending area (43) at the edge of the base surface (44).
2. Cooling device according to claim 1, characterized in that a radius (R4) in the bending area (43) of the base plate (4) at the edge of the base surface (44) is reduced by the embossing (7).
3. Cooling device according to one of the preceding claims, characterized in that the embossing (7) forms a particularly rectangular shape in the bending area (43) at the edge of the base surface (44).
4. Cooling device according to one of the preceding claims, characterized in that a solder (20) is arranged between the turbulator (6) and the base plate (4) in the embossing (7) and the turbulator (6) is connected to the base plate in the embossing (7) by means of the solder (20).
5. Cooling device according to one of the preceding claims, characterized in that a space between the turbulator (6) and the base plate (4) in the embossing (7) is completely filled with solder (20). Cooling device according to one of the preceding claims, characterized in that in a region where the top plate (3) is spaced apart from the bottom plate (4), a plumb line (20) is arranged between the top plate (3) and the bottom plate (4), and / or in a region outside the embossing (7), a plumb line (20) is arranged between the turbulator (6) and the bottom plate (4). Cooling device according to one of the preceding claims, characterized in that the turbulator (6) is formed from a bent sheet, wherein the sheet has a bend with a radius (R6) of the turbulator (6) in a region of the turbulator (6) facing the bending region (43) of the bottom plate (4). Cooling device according to claim 7, characterized in that a radius (R4) in the bending area (43) of the base plate (4) at the edge of the base surface (44) is smaller than the radius (R6) of the turbulator (6) in the area of the turbulator (6) facing the bending area (43) of the base plate (4).Cooling device according to one of the preceding claims, characterized in that the embossing (7) at the edge of the base surface (44) is recessed relative to the base surface (44). Electronic arrangement comprising: - a cooling device (1) according to one of the preceding claims, and - at least one electrical and / or electronic assembly (2) to be cooled, wherein the electrical and / or electronic assembly (2) is arranged on the cover plate (3) or on the bottom plate (4).