Cooling device for cooling an electrical and / or electronic assembly

Abstract

The invention relates to a cooling device for cooling an electrical and / or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component having a depression (40), the top plate (3) and the bottom plate (4) being positioned in such a manner that a cooling duct (5) is formed between the top plate (3) and the bottom plate (4) by the depression (40), the top plate (3) and the bottom plate (4) being connected to one other at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling duct (5) along the longitudinal direction (11), the cooling device (1) also comprising at least one turbulator (6) that is located inside a turbulator section (56) of the cooling duct (5). According to the invention, a turbulence region (61) for generating local turbulence in the flow of the cooling fluid and a blocking region (62) for locally blocking the flow of the cooling fluid are formed on the turbulator (6).

Description

[0001] Description

[0002] title

[0003] Cooling device for cooling an electrical and / or electronic

[0004] State of the art

[0005] The present invention relates to a cooling device for cooling an electrical and / or electronic assembly and an electronic arrangement.

[0006] Power modules such as inverter structures or converter structures are used in hybrid or electric vehicles. For example, inverters are used to operate an electric machine; they provide phase currents for the electric machine. The power modules can, for example, comprise a carrier substrate with conductor tracks on which, for example, power semiconductors are arranged, which together with the carrier substrate form an electronic unit. During operation, the electronic unit generates heat that must be dissipated to a cooling device. For this purpose, the electronic unit is thermally connected to the cooling device. It is known to provide cooling devices with cooling channels through which a cooling fluid can flow, dissipating the heat from the heat sink. So-called turbulators can be provided in the cooling channels; these ensure better heat dissipation from the cooling device to the cooling fluid flowing through the cooling device.The turbulators create turbulent flows and increase the cooling surface.

[0007] Disclosure of the invention According to the invention, a cooling device for cooling an electrical and / or electronic assembly is proposed. The cooling device comprises a cover plate and a base plate, wherein the base plate is designed as a deep-drawn component with a recess, wherein the cover plate and the base plate are arranged such that a cooling channel is formed between the cover plate and the base plate through the recess, wherein the cover plate and the base plate are connected to one another at a contact region outside the recess, wherein a cooling fluid flow can flow through the cooling channel along the longitudinal direction, wherein the cooling device further comprises at least one turbulator which is arranged within a turbulator section of the cooling channel.A turbulence region for generating local turbulence in the flow of the cooling fluid and a blocking region for locally blocking the flow of the cooling fluid are formed on the turbulator.

[0008] Advantages of the invention

[0009] Compared to the prior art, the cooling device with the features of the independent claim exhibits particularly high efficiency with regard to cooling the electrical and / or electronic assembly to be cooled. The blocking region on the turbulator blocks or severely restricts a bypass flow through a bypass region at the edge of the turbulator. Thus, the flow of the cooling fluid through the heat sink is guided through the turbulence region of the turbulator. The turbulence region of the turbulator is arranged, for example, beneath the electrical and / or electronic assembly to be cooled. The turbulence region of the turbulator is designed such that the cooling fluid flowing through the turbulence region of the turbulator is swirled there. The blocking region of the turbulator, on the other hand, blocks the flow adjacent to the turbulence region, so that the cooling fluid cannot flow past the turbulence region there.When flowing through the cooling channel, the cooling fluid can therefore only flow through the turbulence area of ​​the turbulator and not past it.

[0010] Further advantageous embodiments and refinements of the invention are made possible by the features specified in the subclaims. According to an advantageous embodiment, the blocking region extends from an edge of the turbulence region into a bypass region of the cooling channel between the base plate and the cover plate. At the edge of the recess, the base plate tapers toward the cover plate towards the contact region, so that the cooling channel is tapered in this direction. The blocking region extends into this tapered region, so that it is at least partially closed by the blocking region.

[0011] According to an advantageous embodiment, the blocking region of the turbulator extends from the turbulence region of the turbulator to the contact region between the cover plate and the base plate. Thus, the region between the turbulence region and the contact region is closed, and the cooling fluid cannot flow past the turbulence region of the turbulator. Thus, the cooling fluid flows exclusively through the cooling channel in the turbulence region of the turbulator. Thus, no flow is lost at the edges of the cooling channel due to the cooling fluid. The electrical and / or electronic assembly to be cooled can be cooled particularly effectively.

[0012] According to an advantageous embodiment, the turbulator is formed from a bent sheet metal, wherein the sheet metal is bent such that the blocking region is oriented flat against the longitudinal direction. Such a turbulator can advantageously be manufactured simply and cost-effectively. For example, the same sheet metal or a similar sheet metal can be used for the base plate, the cover plate, and the turbulator. The turbulence region and the blocking region of the turbulator can then be formed in the turbulator, for example, by cutting and forming the sheet metal, for example, by punching and bending.

[0013] According to an advantageous exemplary embodiment, the blocking region of the turbulator extends at least partially flat in a plane perpendicular to the longitudinal direction. In this way, the flow at the edge of the cooling channel is particularly well blocked. The flow thus strikes the blocking region at the edge of the cooling channel, for example, perpendicularly, and is thus blocked by it. According to an advantageous exemplary embodiment, the blocking region of the turbulator has a shape adapted to a geometry of the base plate, in particular to an edge of the recess. In this way, the blocking region can be connected to the base plate up to the contact region and is, for example, connected to the base plate up to the contact region. In this way, a flow of the cooling fluid next to the turbulence region of the turbulator can advantageously be well blocked.

[0014] According to an advantageous embodiment, it is provided that the blocking area extends flatly from the turbulence area to the contact area between the cover plate and the base plate.

[0015] According to an advantageous embodiment, several, particularly similarly designed, blocking regions are formed on the turbulator. This allows cooling fluid flowing from the turbulator region toward the contact region to be blocked at various locations. For example, if a flow of cooling fluid forms again downstream of a blocking region due to cooling fluid flowing out of the turbulator region, this flow can be blocked by the next blocking region of the turbulator.

[0016] According to an advantageous embodiment, the blocking regions are formed at opposite edges of the turbulence region. Thus, the bypasses can be closed on both sides of the cooling channel in the contact area.

[0017] Furthermore, the cooling device can be comprised of an electronic arrangement, wherein the electronic arrangement further comprises at least one electrical and / or electronic assembly to be cooled, wherein the electronic component is arranged on the cover plate or on the base plate.

[0018] Short description of the drawings

[0019] Embodiments of the invention are illustrated in the drawings and explained in more detail in the following description. Figure 1 shows a cross-section through an embodiment of an electronic arrangement with a cooling device,

[0020] Figure 2 shows a section of the base plate and the turbulator of the cooling device from Fig. 1,

[0021] Figure 3 shows a section of the base plate and the turbulator of the cooling device from Fig. 1.

[0022] Embodiments of the invention

[0023] Figure 1 shows a sectional view through an exemplary embodiment of an electronics assembly 50. The electronics assembly 50 comprises a cooling device 1 and an electrical and / or electronic assembly mounted on the cooling device 1. Figures 2 and 3 show representations of the base plate 4 and the turbulator 6 of the cooling device 1 without the cover plate 3 for clarity.

[0024] The cooling device 1 is provided for cooling the electrical and / or electronic assembly 2, for example a power circuit. This can be, for example, power circuits, such as inverter structures or converter structures, of hybrid vehicles or electric vehicles. The electrical and / or electronic assembly 2 can, for example, be designed as a power module and, for example, comprise a carrier substrate with conductor tracks, on which, for example, power semiconductors are arranged, which together with the carrier substrate form an electronic unit. During operation, the electrical and / or electronic assembly 2 generates heat, which must be dissipated to a cooling device 1. For this purpose, the electrical and / or electronic assembly 2 is arranged on the cooling device 1, for example on a support surface of a cover plate 3 or a base plate 4.Between the cooling device 1 and the electrical and / or electronic assembly 2, one or more layers for fastening and thermally connecting the electrical and / or electronic assembly 2 on the heat sink 1 can be arranged. For example, on the electrical and / or electronic assembly.

[0025] A copper coating may be provided on the support surface of the cover plate 3 facing the cooling device 1. As in the illustrated embodiments, several electrical and / or electronic assemblies 2 can be arranged on the cooling device 1, for example, side by side, on the cover plate 3 of the cooling device 1. Thus, each of the electrical and / or electronic assemblies 2 is thermally connected to the cooling device 1 and attached thereto.

[0026] The base plate 4 and the cover plate 3 form outer walls of the cooling device 1. The base plate 4 forms a bottom side of the cooling device 1. The cover plate

[0027] 3 forms a top side of the cooling device 1. The base plate 4 and the cover plate 3 can be formed, for example, from a material with high thermal conductivity, for example from a metal, for example aluminum. The base plate 4 and the cover plate 3 are formed from sheet metal. The base plate 4 and / or the cover plate 3 each have a constant thickness, for example. The base plate 4 and the cover plate 3 can, for example, have the same thickness. However, the base plate 4 and the cover plate 3 can also have different thicknesses.

[0028] A recess 40 is formed in the base plate 4. The base plate 4 is thus essentially trough-shaped. The cover plate 3 is arranged on the base plate 4 such that the recess 40 in the base plate 4 is covered by the cover plate 3. The base plate 4 and the cover plate 3 are arranged on one another such that the recess 40 forms a cooling channel 5 between the base plate 4 and the cover plate 3. The cooling channel 5 runs between the base plate 4 and the cover plate 3. The base plate 4 and the cover plate 3 form walls that delimit the cooling channel 5. The base plate 4 is designed as a deep-drawn part. An edge 41 of the base plate 4, which is formed, for example, in one plane, is connected to an edge 31 of the cover plate 3. The region in which the base plate 4 is connected to the cover plate 3 is referred to as the contact region 8. The edge 41 of the base plate 4 runs all the way around the recess 40 in the base plate 4.The edge 41 of the base plate 4 rests, for example, directly or with the interposition of an intermediate layer on the edge 31 of the cover plate 3. The edge 41 of the base plate 4 is firmly connected, in particular soldered, to the edge 31 of the cover plate 3. The edge 41 of the base plate 4 can be connected, in particular soldered, to the edge 31 of the cover plate 3 directly or with the interposition of one or more intermediate layers or intermediate elements. The edge 41 of the base plate 4 is connected to the edge 31 of the cover plate 3, for example by means of a brazing process. The edge 41 of the base plate 4 is connected, in particular soldered, to the edge 31 of the cover plate 3 all the way around.

[0029] In the region of the recess 40, the base plate 4 is spaced from the cover plate 3, so that a flow-through cavity is formed between the base plate 4 and the cover plate 3, in which cavity the cooling channel 5 runs. As in this exemplary embodiment, the edge 41 of the base plate 40 can extend flatly in a first plane. Furthermore, a sheet metal section 42 of the base plate 40, which forms, for example, a base of the recess 40, can extend flat in a second plane, which runs in particular parallel to the first plane. Thus, the edge 41 of the base plate 40 and the sheet metal section 42 of the base plate 4 are each flat and arranged parallel to one another. The cover plate 3 can, for example, be flat or also be designed as a deep-drawn part. The recess 40 and thus the cooling channel 5 can be elongated with respect to the base plate 4, in particular at least partially with a rectangular shape.The cooling channel 5 extends at least in sections along a longitudinal direction 11. When viewed on a sheet metal plane of the cover sheet 3, the cooling channel 5 preferably has an elongated region, in particular with a rectangular geometry, which extends along the longitudinal direction 11, which is defined in particular by a straight line.

[0030] For example, an intermediate plate can also be arranged between the cover plate 3 and the base plate 4. For example, such an intermediate plate can provide additional distance to an upper side of the base plate 4 in order to adjust the height of the cooling channel 5. Alternatively, as in the exemplary embodiment shown in the figures, the cover plate 3 and the first sheet metal section 41 of the base plate 4 can also lie directly against one another. Furthermore, the cooling device 1 comprises an inlet opening (not shown in the figures), through which a cooling fluid can be supplied to the cooling channel 5 in the cooling device 1. Furthermore, the cooling device 1 comprises an outlet opening through which the cooling fluid can flow out of the cooling channel 5 and the cooling device 1. The cooling fluid can be water, for example. The inlet opening and / or the outlet opening can be formed, for example, by openings in the recess 40 of the base plate 4.The openings can, for example, be through-holes in the base plate 4. An inlet nozzle can, for example, also be arranged or formed at the inlet opening. An outlet nozzle can likewise be arranged or formed at the outlet opening. A cooling fluid flow can flow through the cooling channel 5 from the inlet opening to the outlet opening. A cooling fluid can flow through the inlet opening of the cooling device 1 into the cooling channel 5 and flow out of the cooling channel 5 of the cooling device 1 again through the outlet opening of the cooling device 1. The cooling channel 5 is designed to conduct cooling fluid through the cooling device 1. The cooling channel 5 in the cooling device 1 extends in the cooling device 1 from the inlet opening to the outlet opening. A cooling fluid flow can flow through the cooling channel 5 along the longitudinal direction 11 from the inlet opening to the outlet opening.

[0031] The cooling device 1 further comprises at least one turbulator 6. The turbulator 6 is arranged within the cooling channel 5. The turbulator 6 is arranged in a turbulator section 56 of the cooling channel 5 extending along the longitudinal direction 11. The turbulator 6 is arranged between the cover plate 3 and the base plate 4. The turbulator 6 can extend from the cover plate 3 to the base plate 4 completely through the cooling channel 5. In particular, the turbulator 6 is in indirect and / or direct heat-conducting contact with the cover plate 3 and the base plate 4. The turbulator 6 is fastened to the cover plate 3 and / or to the base plate 4, for example by means of a brazing process. Cooling fluid flows through the turbulator 6 in the longitudinal direction 11, parallel to the, for example, flat cover plate 3 and / or to the, for example, flat sheet section 42 of the base plate 4.The turbulator 6 has, particularly in a turbulence region 61 of the turbulator 6, a surface-enlarging, flow-guiding, and heat-transferring structure. The turbulator 6 is formed, for example, from a metal with good thermal conductivity, such as aluminum. The turbulator 6 can also have a coating, for example. The turbulator 6 can be designed, for example, as a structured sheet metal. In order to achieve the highest possible cooling efficiency, the largest possible portion of the flow cross-section of the cooling channel 5 between the base plate 4 and the cover plate 3 is filled by the turbulator 6. The turbulator 6 extends, for example, essentially plane-parallel to the cover plate 3 and / or to the, for example, flat sheet metal section 43 of the base plate 4.The turbulence region 61 of the turbulator 6 has, for example, substantially the same surface area as the support surface on the cover plate 3 on which the electrical and / or electronic assembly 2 is arranged.

[0032] The turbulator 6 has a turbulence region 61 and at least one blocking region 62. The turbulator 6 is formed in one piece, with the turbulence region 61 and the blocking region 62 representing regions of the integrally formed turbulator 6. The turbulator 6 with the turbulence region 61 and the blocking region 62 are made of a single sheet metal.

[0033] The turbulence region 61 of the turbulence 6 is provided for generating turbulent flow in the cooling fluid. The turbulence region 61 is structured for generating turbulent flow in the cooling fluid. On the turbulence region 61 of the turbulence 6, for example, a plurality of turbulence sections are formed, which are arranged at an angle to the flow direction, in particular to the longitudinal direction 11, of the cooling fluid through the cooling channel 5. The turbulence sections serve to swirl the cooling fluid flowing through the cooling channel 5. This allows heat to be dissipated particularly effectively. The turbulence sections can, for example, be wave-like or jagged, or can be formed as periodically recurring elevations and / or depressions in the turbulence 6.The turbulence sections in the turbulence region 61 of the turbulator 6 can be formed, for example, by cutting and forming, for example, punching and bending, the sheet metal from which the turbulator 6 is made. To achieve high cooling efficiency, as large a portion as possible of the flow cross-section of the cooling channel 5 is covered by the turbulator 6. Since the base plate 4 is a deep-drawn component, a draft angle and radii at the edge of the recess 40 are required for the demolding process during deep drawing. The turbulence region 61 of the turbulator 6 is arranged below the electrical and / or electronic assembly 2. Bypass regions 55 are located at the edge of the cooling channel 5, laterally next to the turbulence region 61 of the turbulator 6 and between the turbulence region 61 of the turbulator 6, the base plate 4, and the cover plate 3.The bypass areas 55 are located adjacent to the electrical and / or electronic assembly 2 in the plane of the support surface for the electrical and / or electronic assembly 2. In the bypass area 55, the cooling channel 5 is tapered. There is no turbulence in the cooling fluid flow in the bypass areas 55.

[0034] In order to keep the flow through the bypass regions 55 as low as possible and thus achieve the greatest possible cooling effect of the cooling device 1, blocking regions 62 are formed on the turbulator 6. The blocking regions 62 are arranged at the edge of the turbulator 6 next to the turbulence region 61 in the bypass region 55. The blocking regions 62 are arranged next to the turbulence region 61 of the turbulator 6 with respect to the longitudinal direction 11 of the cooling channel 5. The blocking regions 62 extend from the turbulence region 61 into the bypass region 55. The blocking regions 62 extend from the turbulence region 61 to the contact region 8, in which the cover plate 4 and the base plate 3 are in contact.

[0035] The blocking regions 62 have a geometry that is adapted to a demolding geometry of the deep-drawn floor panel 4. The blocking regions 62 have a shape that is adapted to the demolding geometry of the floor panel 4, such that the blocking regions 62 can block as large a portion of a flow cross-section in the bypass region 55 as possible. The bypass region 55 is thus essentially completely blocked by the blocking regions 62. As a result, the cooling fluid flow, when flowing through the cooling channel 5, must essentially completely pass through the turbulence region 61 of the turbulator 6. This achieves particularly effective utilization of the cooling potential of the cooling fluid flow, and the electrical and / or electronic assembly 2 can be optimally cooled.

[0036] The blocking regions 62 extend flatly perpendicular to the, for example, flat, cover plate 3. The blocking regions 62 extend flatly perpendicular to the, for example, flat, sheet metal section 42. The blocking regions 62 thus form a flat surface against the flow of the cooling fluid in the cooling channel 5. The blocking regions 62 extend flatly, for example, perpendicular to the longitudinal direction 11. As a result, the cross section of the bypass region 55 available for flow is significantly reduced or completely filled.

[0037] The blocking regions 62 are formed from the same sheet metal as the turbulence region 61. The sheet metal for the blocking regions 62 is bent out of a plane parallel to the cover plate 3 and / or to the flat sheet metal section 42, so that it extends flatly in the blocking regions 62, for example perpendicular or obliquely to the plane. Furthermore, the sheet metal can be punched at the blocking regions 62 such that it is adapted to the geometry of the base plate 4, which runs towards the cover plate 3, in the bypass region 55. The sheet metal can be punched such that it rests against the cover plate 3 and the base plate 4 in the bypass region 55 and / or can be connected to them. This is shown in Figs. 2 and 3.

[0038] Of course, further embodiments and mixed forms of the embodiments shown are possible.

Claims

Claims 1. Cooling device for cooling an electrical and / or electronic assembly (2), comprising a cover plate (3) and a base plate (4), wherein the base plate (4) is designed as a deep-drawn component with a recess (40), wherein the cover plate (3) and the base plate (4) are arranged such that a cooling channel (5) is formed between the cover plate (3) and the base plate (4) by the recess (40), wherein the cover plate (3) and the base plate (4) are connected to each other at a contact area (8) outside the recess (40), wherein the cooling channel (5) is permeable to a cooling fluid flow along the longitudinal direction (11), wherein the cooling device (1) further comprises at least one turbulator (6) which is arranged within a turbulator section (56) of the cooling channel (5), characterized in thatthat a turbulence region (61) for generating local turbulence in the flow of the cooling fluid and a blocking region (62) for locally blocking the flow of the cooling fluid are formed on the turbulator (6).

2. Cooling device according to claim 1, characterized in that the blocking area (62) extends from an edge (65) of the turbulence area (61) into a bypass area (55) of the cooling channel (5) between the bottom plate (4) and the top plate (3).

3. Cooling device according to one of the preceding claims, characterized in that the blocking area (62) of the turbulator (6) extends from the turbulence area (61) of the turbulator (6) to the contact area (8) between the cover plate (3) and the bottom plate (4).

4. Cooling device according to one of the preceding claims, characterized in that the turbulator (6) is formed from a bent sheet metal, wherein the sheet metal is bent in such a way that the blocking area (62) is directed flat against the longitudinal direction (11). Cooling device according to one of the preceding claims, characterized in that the blocking area (62) of the turbulator (6) extends at least partially in a plane perpendicular to the longitudinal direction (11). Cooling device according to one of the preceding claims, characterized in that the blocking area (62) of the turbulator (6) has a shape adapted to the geometry of the base plate (4), in particular at an edge of the recess (40). Cooling device according to one of the preceding claims, characterized in that the blocking area (62) extends in a plane from the turbulence area (61) to the contact area (8) between the top plate (3) and the base plate (4). Cooling device according to one of the preceding claims, characterized in that several blocking areas (62), in particular of the same design, are formed on the turbulator (6).Cooling device according to claim 8, characterized in that the blocking areas (62) are formed at opposite edges (65) of the turbulence area (61). Electronic arrangement comprising: - a cooling device (1) according to one of the preceding claims, and - at least one electrical and / or electronic assembly (2) to be cooled, wherein the electrical and / or electronic assembly (2) is arranged on the cover plate (3) or on the bottom plate (4).

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