Optical phase modulator and associated method and systems

Abstract

One aspect of the invention relates to an optical phase modulator (1) comprising: a first layer (21) made of dielectric material with a waveguide (11) and a heater (12) extending therein; - at least one upper trench (41) arranged above the heater and side trenches (42, 43) arranged on either side of the waveguide and the heater; and - a second layer (22) made of dielectric material extending over the first layer made of dielectric material and covering each first, second and third trench.

Description

DESCRIPTION TITLE: OPTICAL PHASE MODULATOR, METHOD AND ASSOCIATED SYSTEMS TECHNICAL FIELD OF THE INVENTION

[0001] The technical field of the invention is that of optical phase modulators which can be used in a phased antenna array and / or in a laser remote sensing system, known as “LIDAR” for “Light Detection and Ranging” in English. TECHNOLOGICAL BACKGROUND OF THE INVENTION

[0002] A phase modulator is intended for use in optical phased array (OPA) circuits. It is proposed in the context of remote sensing systems or LiDAR (Light Detection and Ranging).

[0003] There are many types of phase modulators exploiting different physical effects (Pockels, Kerr, plasma dispersion, etc.) which have in common the modification of the refractive index of the material in which they are present if an electric field is applied to it (electro-optical modulation). If an optical signal is passed through a material whose refractive index is modified, the light will move faster (or slower depending on the direction of variation of the refractive index), which results in a modification of the phase of this signal. Modulators exploiting these effects offer very good performance in terms of consumption and bandwidth, however their integration is complex (specific materials, doping, etc.). In addition, phase modulation is intrinsically accompanied by a modulation of the amplitude of the optical signal (absorption of part of the optical power), which, in the context of an OPA, is not desirable.This is why the majority of OPAs made in silicon photonics are generally based on thermo-optic modulators which exploit the dependence of the refractive index of a material on temperature (thermo-optic coefficient).

[0004] Thus, by heating (or cooling) this material, its refractive index will be modified which, as for electro-optical modulators, results in a change in the phase for a signal propagating in this material.

[0005] Thermo-optic modulators are generally made by placing a Ti / TiN heater (above the waveguide) in which an electric current is circulated which will heat this heater (and therefore the guide) by Joule effect. This type of modulator has the advantage of being relatively simple to implement, and in particular of offering a "pure" phase modulation (no amplitude modulation) which is particularly interesting in the context of an OPA. In addition, they are relatively compact both in width and length thanks to the high thermo-optic coefficient of the materials used in photonics (Si, SiN ...).

[0006] These modulators are generally coated in a dielectric material and are therefore integrable. Additional manufacturing steps can be carried out without degrading the modulator's performance.

[0007] However, these modulators still have some drawbacks. Apart from a bandwidth limited to a few tens of kHz, the main drawback of thermo-optical modulators is their efficiency. Indeed, the heat generated will diffuse in all directions, which will greatly limit the efficiency of the modulator. It is generally measured in mW / n, which corresponds to the electrical power injected into the TiN heater to obtain a TT phase shift of the optical signal.

[0008] To address this problem, isolation trenches are typically added on either side of the modulator. This will confine the heat produced by the heater and thus maximize the temperature variation across the guide (and therefore the phase variation) for a given electrical power. To further improve heat confinement, it is possible to suspend the thermo-optical modulator by etching the substrate beneath the waveguides.

[0009] However, the isolation trenches remain open and do not allow the modulator to be integrated. Additional manufacturing steps could block the trenches and cancel their effect.

[0010] There is a need to provide a high-performance optical phase modulator that can be integrable. SUMMARY OF THE INVENTION

[0011] The invention addresses the aforementioned problem in that it proposes an optical phase modulator comprising: a first layer of dielectric material extending in a plane, in which extends, in a first direction parallel to the plane, at least one waveguide and at least one heater, said at least one heater being arranged above said at least one waveguide and thermally coupled to a portion of said at least one waveguide, the first layer of dielectric material comprising, for each waveguide: at least one first trench, extending in a second direction, parallel to the plane and perpendicular to the first direction, arranged above the heater thermally coupled to the waveguide;a second trench and a third trench each extending in the first direction, on either side of the waveguide and the heater thermally coupled to the waveguide, said at least one first trench arranged above the heater thermally coupled to the waveguide opening into the second trench and into the third trench; a second layer of dielectric material extending parallel to the plane and on the first layer of dielectric material and covering each first, second and third trench.;

[0012] By the term "a layer in which an element extends" is meant that said element is included in the layer and is at least partially coated by it.

[0013] A "heater" means a conductive track intended to generate a quantity of heat when an electric current passes through it.

[0014] The terms "above" and "under" relate to a direction perpendicular to the plane.

[0015] By "trench in a layer" is meant a cavity dug from the surface of said layer and to a certain depth. By "trench extends in a direction parallel to the plane" is meant that the dug cavity has a constant depth in said direction. By "cavity" is meant that it is free of any solid body. It is empty or contains a gas or air.

[0016] By "trenches extending on either side of the waveguide" is meant that the trenches extend on either side of the waveguide and at least the entire height of the waveguide (measured perpendicular to the plane).

[0017] The heater, thermally coupled to the waveguide, allows its optical index to be modulated. The phase of an optical beam passing through the waveguide can therefore be modulated. Each first, second and third trench thermally isolates each heater and each waveguide from the external environment. In this way, the heat generated by the heater that is not transferred to the waveguide is reduced. A substantial portion of the heat generated by each heater is therefore transferred to a waveguide, which improves the modulation efficiency of the waveguide index and therefore makes it a high-performance modulator.

[0018] The second layer of dielectric material closes the trenches and thus prevents them from being filled with a material (e.g. a liquid, an oxide or a metal) during integration steps. Each heater and each waveguide therefore remains thermally insulated and therefore operational after integration steps. The modulator is therefore also integrable.

[0019] Advantageously, for each waveguide, the second trench and the third trench are discontinuous and each comprise sections separated from each other by the dielectric material of the first layer, aligned in the first direction. A distance separating two consecutive sections is preferably less than 100 pm, or even less than or equal to 5 pm. Preferably, each first trench arranged above the heater thermally coupled to the waveguide opens into a section of the second trench and into a section of the third trench.

[0020] Advantageously, the modulator comprises a semiconductor substrate on which the first layer of dielectric material extends, the semiconductor substrate comprising, for each waveguide, a fourth trench extending in the first direction and arranged under said waveguide, each second trench and each third trench on either side of the waveguide opening into the fourth trench.

[0021] Advantageously, for each waveguide, a distance separating two first consecutive trenches in the first direction is less than 5 pm.

[0022] Alternatively, for each waveguide, the first layer of dielectric material comprises a single first trench whose width, measured in the first direction, is greater than 50% of the length of the heater thermally coupled to the waveguide.

[0023] Advantageously, the modulator comprises at least ten waveguides and preferably at least one hundred waveguides.

[0024] The invention also relates to a method for manufacturing an optical phase modulator, comprising the following steps: forming a first layer of dielectric material extending in a plane, in which extends, in a first direction parallel to the plane, at least one waveguide and at least one heater, said at least one heater being arranged above said at least one waveguide and thermally coupled to a portion of said at least one waveguide; etching the first layer of dielectric material so as to form, for each waveguide, at least one first trench, extending in a second direction, parallel to the plane and perpendicular to the first direction, arranged above the heater thermally coupled to the waveguide;etching the first layer of dielectric material so as to form, for each waveguide, second and third trenches each extending in the first direction, on either side of the waveguide and the heater thermally coupled to the waveguide, each first trench arranged above the heater thermally coupled to the waveguide opening into the second trench and into the third trench; forming a second layer of dielectric material extending parallel to the plane and over the first layer of dielectric material and covering each trench.

[0025] Advantageously, the step of forming the second layer of dielectric material comprises, before the step of etching the second and third trenches, the following sub-steps: filling each first trench with a sacrificial material; depositing the second layer of dielectric material on the first layer of dielectric material and covering the sacrificial material in each first trench; the step of etching the second and third trenches being carried out through the second layer of dielectric material, the step of forming the second layer of dielectric material also comprising, after the step of etching the second and third trenches, the following sub-steps: removing the sacrificial material from each first trench arranged above each heater; and thickening the second layer of dielectric material so that it covers each second and third trenches.

[0026] Preferably, the step of thickening the second layer of dielectric material is carried out by depositing a low density oxide.

[0027] The invention also relates to a phased antenna array comprising: a plurality of antennas, aligned in a direction and distributed along this direction according to a constant pitch; a power divider configured to divide the optical power of an incident coherent optical beam, the incident optical beam having a wavelength greater than or equal to the constant pitch; the phased antenna array being remarkable in that it comprises: an optical phase modulator according to the invention, said modulator comprising a plurality of waveguides, each waveguide of the modulator forming part of the optical path between the power divider and one of the plurality of antennas; or a plurality of optical phase modulators according to the invention, each modulator comprising a single waveguide, the waveguide of each modulator forming part of the optical path between the power divider and one of the plurality of antennas.

[0028] The invention also relates to a laser remote sensing system comprising a phased antenna array according to the invention.

[0029] The invention and its various applications will be better understood by reading the following description and examining the accompanying figures. BRIEF DESCRIPTION OF THE FIGURES

[0030] The figures are presented for information purposes only and in no way limit the invention. Unless otherwise specified, the same element appearing in different figures has a single reference.

[0031] [Fig. 1a], [Fig. 1b] and [Fig. 1c] schematically represent, in three sections, a first embodiment of an optical phase modulator according to the invention.

[0032] [Fig. 2a] and [Fig. 2b] schematically represent, in two sections, a second embodiment of the optical phase modulator according to the invention.

[0033] [Fig. 3a] and [Fig. 3b] schematically represent, in two sections, a third embodiment of the optical phase modulator according to the invention.

[0034] [Fig. 4a] and [Fig. 4b] schematically represent, in two sections, a fourth embodiment of the optical phase modulator according to the invention.

[0035] [Fig. 5a], [Fig. 5b], [Fig. 5c] and [Fig. 5d] schematically represent, in four sections, a fifth embodiment of the optical phase modulator according to the invention.

[0036] [Fig. 6] schematically represents an embodiment of a manufacturing method according to the invention.

[0037] [Fig. 7] schematically represents an alternative embodiment of the manufacturing process of [Fig. 6],

[0038] [Fig. 8a], [Fig. 8b], [Fig. 8c], [Fig. 8d], [Fig. 8e] and [Fig. 8f] schematically represent, in two sections, steps of the embodiment of the manufacturing process of [Fig. 7],

[0039] [Fig. 9] schematically represents an example of an optical phase modulator capable of being obtained by implementing the manufacturing method of [Fig. 7],

[0040] [Fig. 10] schematically represents a first embodiment of a phased antenna array according to the invention.

[0041] [Fig. 11] schematically represents a second embodiment of the phased antenna array according to the invention. DETAILED DESCRIPTION

[0042] [Fig. 1 a], [Fig. 1 b] and [Fig. 1 c] schematically represent, along three sections AA, BB, CC, an optical phase modulator 1 according to a first embodiment according to the invention.

[0043] The modulator 1 comprises two layers 21, 22 made of dielectric material. The first layer 21 extends in a plane P. The plane P corresponds for example to the surface of a semiconductor substrate 30 on which the first layer 21 extends. The second layer 22 also extends in the plane P (i.e. parallel to this plane P). It extends over the first layer 21. The two layers 21, 22 are for example made of SiO2. The substrate 30 is for example made of Si.

[0044] The modulator 1 comprises a waveguide 11 and a heater 12, each extending parallel to the plane P and more particularly in the same first direction X. The waveguide 11 has, in this example, a sufficiently large length, greater than 1000 pm, so that it can be considered infinite. The heater 12 has a length L12, measured in the first direction, of between 100 pm and 500 pm. The heater 12 is arranged above the waveguide 11, that is to say vertically (in the direction Z) to the waveguide 11. In particular, the heater 12 is arranged between the waveguide 11 and the second layer 22 of dielectric material (in other words, directly above the waveguide 11, between the waveguide and the upper surface of the first layer 21). For example, considering the upper surface 210 of the first layer as being a reference height, measured perpendicular to the plane P, then the heater 12 is located for example at a height Z12 (one can also speak of depth) between 1 pm and 9 pm below the upper surface 210. The waveguide can be located at a depth Z11 between 4 pm and 10 pm.

[0045] The heater 12 may have a thickness, measured along the Z direction, of between 50 nm and 200 nm. It may have a width W12, measured along the Y direction, of between 300 nm and 1000 nm.

[0046] The waveguide 11 may have a thickness of between 100 nm and 1000 nm and a width of between 100 nm and 1000 nm.

[0047] The heater 12 is configured to heat a portion of the waveguide 11 so as to raise its temperature and modify its optical index. The waveguide 11 then advantageously has a temperature-dependent optical index. The waveguide 11 is for example a semiconductor material such as Si or a nitride such as SiN. The heater 12 is preferably an electrical conductor and for example made of Ti or TiN. The heater 12 is thermally coupled to a portion of the waveguide 11. This is for example a portion along the waveguide located under the heater 12, therefore having a length equal to the length L12 of the heater 12. The thermal coupling between the heater 12 and the waveguide 11 is achieved by means of the dielectric material forming the first layer 21. A different dielectric material, having better thermal properties, could also be used.

[0048] The heater 12 is preferably electrically connected to vias 121, 122 allowing an electric current to circulate in the heater 12.

[0049] In this embodiment, the waveguide 11 and the heater 12 extend in the first layer 21. That is to say, they are coated in the dielectric material forming the first layer 21. The first layer 21 is particular in that it comprises a plurality of trenches making it possible to isolate the waveguide 11 and the heater 12 from the external environment, and in particular from the external thermal bath.

[0050] In the embodiment of [Fig. 1 a], [Fig. 1 b] and [Fig. 1 c], the first layer 21 comprises a plurality of first trenches 41, which will also be designated as “upper trenches”, extending in a second direction Y, parallel to the plane P and perpendicular to the first direction X. The upper trenches are arranged vertically to the heater 12 and are distributed along the first direction X. The upper trenches 41 are for example the result of an anisotropic etching step in the first layer 21. They have for example a depth Z41 constant to within + / - 20% and sides perpendicular to the plane P to within + / - 20°. The upper trenches 41 are arranged between the heater 12 and the second layer 22. They therefore make it possible to isolate the heater 12 from the second layer 22.

[0051] Each trench 41 may have a depth Z41, measured from the upper surface 210 of the first layer 21, of between 100 nm and 1000 nm. Each trench 41 may also have a depth Z41 allowing it to reach the heater 12 and partially expose it.

[0052] The upper trenches 41 are preferably distributed along the first direction X and distant from each other. They are therefore separated by portions 211 of the first layer 21. These portions 211 extend vertically between each upper trench 41 and are oriented along the second direction Y. They thus form walls, also called “low walls”, separating the upper trenches 41 from each other. The low walls 211 are also distributed along the direction X.

[0053] The thermal leakage between the heater 12 and the second layer 22 depends in part on the width W211 of the walls separating two consecutive upper trenches 41. In order to guarantee reduced thermal leakage, the walls preferably have widths W211 less than 5 μm and preferably greater than 100 nm, since they define one of the dimensions of a thermal contact between the heater 12 and the second layer 22. The number of upper trenches 41 and the width W41 (measured along the first direction X) of these trenches 41 are then advantageously sized to minimize the width W211 of the walls 211 and therefore minimize the thermal leakage between the heater 12 and the second layer 22. For example, a large number of upper trenches 41 (which may have a small width W41) or a small number of upper trenches 41 but having a large width W41 will be chosen.

[0054] In the case where the first layer 21 comprises several upper trenches 41, for example around ten, then the width W41, measured along the first direction X, can be between 10 pm and 200 pm. In this embodiment, the number of upper trenches 41 is limited by the vias 121, 122. A different arrangement of the vias could be envisaged to increase the number of upper trenches so that they are distributed over the entire length of the heater 12.

[0055] [Fig. 2a] and [Fig. 2b] schematically represent, in two sections, a second embodiment of the modulator 1. Unlike [Fig. 1 a], [Fig. 1 b], [Fig. 1 c], the first layer 21 comprises only one upper trench 41 but sufficiently wide to effectively isolate the heater 12 from the second layer 22. There is therefore no wall 211 making thermal contact between the heater 12 and the second layer 22. The upper trench 41 has for example a width W41 equal to 85% of the length L12 (measured along X) of the heater 12. The upper trench 41 has for example a width W41 equal to between 100 pm and 500 pm. In this embodiment, the width W41 of the upper trench 41 is limited by the vias 121, 122.A different arrangement of the vias could allow the width of the upper trench 41 to be further extended until the upper trench 41 extends the entire length of the heater 12.

[0056] The walls 211 may prove to be of interest since they can support the second layer 22, for example transferring the mechanical stresses applied to the second layer 22 to the underlying structure (including, among other things, the heater 12 and the waveguide 11). They therefore make it possible to prevent the second layer 22 from collapsing and filling the trenches 41, 42, 43.

[0057] In a manner common to [Fig. 1 a], [Fig. 1 b], [Fig. 1 c] and [Fig. 2 a], [Fig. 2 b], the first layer 21 also comprises second and third trenches 42, 43, which will also be referred to as “lateral trenches”, extending on either side of the waveguide 11 and the heater 12. The lateral trenches 42, 43 extend in the first direction X. These trenches 42, 43 isolate the waveguide 11 and the heater 12 from the rest of the first layer 21. In order to provide adequate thermal insulation, the lateral trenches 42, 43 have depths Z42, Z43, measured from the second layer 22, greater than or equal to the depth Z11 of the waveguide 11. Thus, these trenches form an insulated channel between the heater 12 and the waveguide 11 making it possible to transfer a substantial part of the heat generated by the heater 12. In order to reduce the thermal leakage from the waveguide 11, it is advantageous for the lateral trenches to have depths Z42, Z43 greater than or equal to 150% of the depth Z11 of the waveguide 11. They are for example between 6000 nm and 15000 nm.

[0058] The lateral trenches 42, 43 are for example the result of an anisotropic etching step in the first layer 21. They have for example depths Z42, Z43 constant to within + / - 20% and sides perpendicular to the plane P to within + / - 20°.

[0059] The lateral trenches 42, 43 advantageously extend at least over the entire length L12 of the heater 12 so as to minimize the thermal leakage in the first direction X. They may also have widths W42, W43, measured in the second direction Y, respectively between 100 nm and 1000 nm. The wider the lateral trenches 42, 43, the better the thermal decoupling of the heater 12 and the waveguide 11 with the external thermal bath.

[0060] Each lateral trench 42, 43 may be made in such a way that it exposes one side of the heater 12 and / or one side of the waveguide 11 (illustrated for example for the heater 12c and the waveguide 11c in [Fig. 3a]). According to an alternative, each lateral trench 42, 43 is distant from the heater 12 by a distance T12, measured in the second direction Y, of between 100 nm and 1000 nm and / or from the waveguide 11 by a distance T11, also measured in the second direction Y, of between 100 nm and 1000 nm.

[0061] In order to best insulate the heater 12 from the first and second layers 21, 22, each upper trench 41 extends in the second direction Y so as to open into each lateral trench 42, 43. Thus, there is no thermal bridge between the different trenches 41, 42, 43, making it possible to best insulate the heater 12 and the waveguide 11.

[0062] The second layer 22 extends in the plane P and on the upper surface 210 of the first layer 21. In this way it seals the trenches 41, 42, 43 and the volume insulating the heater 12 and the waveguide 11. The second layer 22 thus delimits an interior volume, that of the trenches 41, 42, 43, from an exterior volume, above the second layer 22 in which integration steps of the modulator 1 can take place. The second layer 22 extends parallel to the plane P and rests on the upper surface 210 of the first layer 21. Thus, the second layer 22 does not fill the trenches 41, 42, 43.

[0063] The modulator 1 according to the invention thus makes it possible to reduce the power P n necessary to modulate the phase of an optical beam of n. In a modulator according to the prior art, not including any trench, the power required is estimated at P AA= 20 mW. The modulator 1 according to the invention makes it possible to obtain a power P n = 5 mW, reduced by a factor of 4.

[0064] [Fig. 3a] and [Fig. 3b] schematically represent a third embodiment of the modulator 1. It differs from the embodiment of [Fig. 1a], [Fig. 1b], [Fig. 1c] in that the modulator 1 comprises a plurality of waveguides 11 . In this example, the modulator comprises three waveguides 11 a, 11 b, 11 c and three heaters 12a, 12b, 12c. It is entirely conceivable that the modulator 1 comprises a larger number of waveguides 11 , such as around ten waveguides 11 , or even an even larger number, for example between one hundred and one thousand waveguides 11 .

[0065] Each waveguide 11 ac extends parallel to the plane P. The three waveguides 11 ac extend, for example, in the same plane, at a constant depth Z11 relative to the upper surface of the first layer. The three heaters 12a-c also extend in the same plane, at a depth Z12. Each heater 12a-c is arranged vertically (along the Z direction) to one of the waveguides 11 ac. Each waveguide 11 ac is therefore arranged under a single heater 12a-c.

[0066] Each waveguide 11 ac has second and third trenches 42, 43, extending in the first direction X and on each side of a waveguide 11 ac. The first layer 21 therefore comprises three second trenches 42 and three third trenches 43. In this particular embodiment, a second trench 42 may be combined with a third trench 43. For example, the third trench 43 of a first waveguide 11 a is combined with the second trench 42 of a second waveguide 11 b.

[0067] In this embodiment, all the waveguides 11 and all the heaters 12 are in the same chamber formed by all the trenches. In this embodiment, the first layer 21 advantageously comprises, for each waveguide 11, a plurality of upper trenches 41. In other words, the first layer 21 comprises, for each waveguide 11, at least one portion 211, called “walls”, providing mechanical support for the second layer 22. Thus, even when the modulator 1 comprises a large number of waveguides 11 (for example a thousand), the second layer 22 does not present any risk of collapse.

[0068] According to a development of this embodiment, the second trench 42 of the second waveguide 11 b can be separated from the third trench 43 of the first waveguide 11 a, for example by means of an unetched part of the first layer 21, forming a wall between the two trenches 42, 43. This wall can also provide mechanical support to the second layer 22. However, this development has an increased lateral size, due to the additional walls.

[0069] [Fig. 4a] and [Fig. 4b] schematically represent a fourth embodiment of the modulator 1. This embodiment differs from the embodiment of [Fig. 3a] and [Fig. 3b] in that the portions 211 of the first layer 21, called “walls”, only partially separate the upper trenches 41. Each wall 211 has, for example, a length L211, less than the length L41 of the upper trenches 41 that it separates. In this way, the thermal leakage between the heater 12 and the second layer 22 is further reduced while ensuring mechanical support for the second layer 22.

[0070] [Fig. 5a], [Fig. 5b], [Fig. 5c] and [Fig. 5d] schematically represent a fifth embodiment of the modulator 1. This embodiment differs from the embodiment of [Fig. 2a] and [Fig. 2b] in that the semiconductor substrate 30 on which the first layer 21 rests comprises a fourth trench 44, also referred to as the “lower trench”. The lower trench 44 extends under at least a portion of the waveguide 11. It is arranged directly above the portion of the waveguide 11 thermally coupled with the heater 12. It is therefore advantageously arranged directly above the heater 12. The lower trench 44 makes it possible to further decouple the waveguide 11 and the heater 12. of the external environment. The lower trench 44 preferably extends along the first direction X. For example, it has a length L44, measured along the first direction X, greater than 50% of the length L12 of the heater 12, or even strictly greater than this length L12. Preferably, the lower trench 44 extends over the same length as the lateral trenches 42, 43. In this way, it forms, with the lateral trenches 42, 43, an insulated channel between the heater 12 and the waveguide 11, making it possible to transfer a substantial part of the heat generated by the heater 12 to the waveguide 11.

[0071] In the illustrated embodiment, each lateral trench 42, 43 opens into the fourth trench 44, making it possible to form an empty volume (or one comprising air or another gas) completely surrounding the assembly comprising the heater 12 and the waveguide 11.

[0072] In the absence of sufficient mechanical support (for example provided by the walls 221), the part of the first layer 21 comprising the waveguide 11 and the heater 12 may collapse into the lower trench 44. Indeed, in the embodiments of [Fig. 1 a] to [4b], the waveguide(s) 11 as well as the heater(s) 12 are carried by the first layer 21 which itself finds support on the substrate 30. In the absence of support on the substrate 30, the waveguide 11 and the heater 12, The risk of collapse increases with the length L44 of the lower trench 44. To avoid this collapse, the lower trench 44 may be discontinuous (in the manner of a discontinuous line). It then comprises successive sections, distant from each other, aligned along the first direction X. These sections are, for example, distributed at a constant pitch along the first direction X.Two consecutive sections are then separated by a portion of the first layer 21 (similar to the walls 211). Each portion of the first layer 21 separating the sections of the lower trench 44 then provides mechanical support to the part of the first layer 21 comprising the waveguide 11 and the heater 12.

[0073] According to a development, the lateral trenches 42, 43 may also be discontinuous. Each of the lateral trenches 42, 43 also comprises successive sections 42a-e, 43a-e, in the manner of a discontinuous line. Two consecutive sections 42a-e, 43a-e are separated by portions 212, 213 of the dielectric material of the first layer 21, which will also be designated as “fins”. The fins 212, 213 extend parallel to a plane {Y; Z} and are distributed along the first direction. The fins 212, 213 thus provide mechanical support for the waveguide 11 and the heater 12.

[0074] In order to limit the thermal leakage through the fins 212, 213, they preferably have a thickness, measured along the first direction X, of less than 5 μm, for example between 100 nm and 2 μm. They extend, along the direction Z, over a height Z213 greater than or equal to the height between the heater 12 and the waveguide 11. Preferably, they extend over the entire height of the dielectric material of the first layer 21 coating the heater 12 and the waveguide 11, so as to ensure reliable mechanical contact.

[0075] [Fig. 6] schematically represents an embodiment of a manufacturing method 100 for obtaining the modulator 1 according to the invention. It is described with reference to [Fig. 8a] to [Fig. 8f]. The method 100 firstly comprises a step 101 of forming a first layer 21 of dielectric material, as illustrated by [Fig. 8a]. At this step, the first layer 21 does not yet comprise the different trenches 41, 42, 43 as described above. The first layer 21 is deposited on a semiconductor substrate 30 and it comprises a waveguide 11 and a heater 12 thermally coupled to a portion of the waveguide 11. The dielectric material forming the first layer 21 may be a semiconductor oxide such as SiO2. The waveguide 11 and the heater 12 are coated (or encapsulated) in the dielectric material.

[0076] The formation of the waveguide 11 can be carried out from a silicon-on-insulator or “SOI” type substrate. An SOI substrate then comprises the semiconductor substrate 30 of the future device 1 as such, a silicon layer in which the waveguide 11 can be etched, and a layer of dielectric material 21 arranged between the silicon layer and the semiconductor substrate 30.

[0077] The method 100 also comprises a step 102 of etching the first layer 21, as illustrated by [Fig. 8b], so as to form a plurality of first trenches 41 arranged above the heater 12. This is for example an anisotropic etching through a previously deposited hard mask.

[0078] The method 100 then comprises another step 103 of etching the first layer 21, as illustrated by [Fig. 8e], so as to form a second trench 42 and third trench 43 on either side of the waveguide 11 and the heater 12. It may also be an anisotropic etching carried out in the Z direction, through a hard mask. The etching 103 is carried out so as to intersect each first trench 41 so that they open into the second trench 42 and into the third trench 43.

[0079] The method 100 finally comprises a step 104 of forming a second layer of dielectric material, as illustrated by [Fig. 8f], extending parallel to the upper surface of the first layer 21. The dielectric material forming the second layer 22 may also be a semiconductor oxide such as SiO2. It is formed by depositing or bonding a layer of dielectric material on the first layer 21 so as to cover each trench 41, 42, 43.

[0080] According to a variant, illustrated by [Fig. 7], the step of forming the second layer 104 may comprise four sub-steps 104a, 104b, 104c and 104d, illustrated by [Fig. 8c], [Fig. 8d] and [Fig. 8f]. This variant makes it possible in particular to ensure that the second layer 22 does not collapse into the trenches 41, 42, 43 during its formation.

[0081] Thus, the formation step 104 comprises firstly, before the etching step 103 of the second and third trenches 42, 43, a sub-step 104a of filling each first trench 41 with a sacrificial material 1041, as illustrated by [Fig. 8c]. The sacrificial material 1041 is for example SiC>2, SiN, Ge or a polymer resin. The filling step 104a also comprises the polishing of an excess of sacrificial material 1041 until reaching the upper surface of the first layer 21.

[0082] The forming step 104 also comprises a sub-step 104b of depositing the second layer 22 on the first layer 22 so as to completely cover the sacrificial material 1041 in the first trench 41. The sacrificial material 1041 thus provides a support making it possible to prevent the second layer 22 from collapsing.

[0083] In this variant, the etching step 103 of the lateral trenches 42, 43 is carried out through the second layer 22. The lateral trenches 42, 43 then open onto the upper surface of the second layer 22.

[0084] After the etching 103 of the lateral trenches, the formation step 104 also comprises the sub-step 104c of removing the sacrificial material 1041 from the first trenches 41, as illustrated by [Fig. 8f]. The openings left by the lateral trenches 42, 43 in the second layer 22 and the first trenches 41 opening into the lateral trenches 42, 43 make it possible to carry out selective etching of the sacrificial material relative to the dielectric material of the first and second layers 21, 22. The first trenches 41 are thus released and the second layer 22 rests solely on the walls 211 as described previously.

[0085] The second layer 22, which comprises an opening left by each lateral trench 42, 43, is closed during a thickening sub-step 104d of the second layer 22. A dielectric material is deposited on the second layer 22 so as to thicken the second layer 22 in a direction perpendicular to the plane of the layers. This thickening 104d progressively closes the openings in the second layer 22. In order to limit the quantity of material which falls into the lateral trenches 42, 43 during this thickening step, it advantageously implements the deposition of a low-density semiconductor oxide. The deposition of low-density oxide is described by the document [“Reducing BEOL Parasitic Capacitance Using Air Gaps”, Michael Hargrove, Oct. 2017, Semiconductor Engineering, https: / / semiengineering.com / reducing-beol-parasitic-capacitance-using-air-gaps],

[0086] [Fig. 9] shows an example of modulator 1 obtained by means of the variant of the method 100. It is a section of the modulator 1. The second layer 22 comprises two sub-layers A and B. The first sub-layer A extends over the first layer 21 and in particular over the upper surface 210 of the first layer 21. The etching 103 of the lateral trenches is for example carried out through this first sub-layer A. The second sub-layer B is deposited on the first sub-layer A so as to thicken the second layer 22 and close the openings left by the lateral trenches 42, 43. The second sub-layer B is particular in that it has, at the level of the openings of the first sub- layer A, oblique flanks, for example oriented at an angle between 10° and 45° relative to the Z direction and forming a cone above each opening.

[0087] The modulator 1 according to the invention can advantageously be implemented in a phased antenna array. [Fig. 10] illustrates an embodiment of a phased antenna array 5 comprising: a plurality of antennas 52, aligned in a direction and distributed along this direction according to a constant pitch d; and a power divider 51 configured to divide the optical power of an incident coherent optical beam, the incident optical beam having a wavelength greater than or equal to the constant pitch d.

[0088] In the embodiment of [Fig. 10], the phased array 5 comprises a plurality of modulators 1 as previously described. Each modulator 1 advantageously comprises a single waveguide 11 (as illustrated in [Fig. 1 a], [Fig. 1 b], [Fig. 1 c], [Fig. 2 a], [Fig. 2 b] or [Fig. 5 a], [Fig. 5 b], [Fig. 5 c], [Fig. 5 d]), forming part of the optical path between the power divider 51 and an antenna 52 of the plurality of antennas 52.

[0089] [Fig. 11] illustrates a second embodiment of a phased array antenna 5. Unlike the embodiment of [Fig. 10], it comprises a single modulator 1 as previously described. The modulator 1 advantageously comprises a plurality of waveguides 11 (as illustrated in [Fig. 3a], [Fig. 1b], [Fig.1c], [Fig. 2a], [Fig. 2b] or [Fig. 5a], [Fig. 5b], [Fig. 5c], [Fig. 5d]), each waveguide 11 of the modulator 1 forming part of the optical path between the power divider 51 and an antenna 52.

[0090] Said network 5 according to one of the two embodiments may belong to a laser remote sensing system.

Claims

CLAIMS

1. Optical phase modulator (1) comprising: - a semiconductor substrate (30), - a first layer (21) of dielectric material extending over the substrate and in a plane (P), in which extends, in a first direction (X) parallel to the plane, at least one waveguide (11) and at least one heater (12), said at least one heater being arranged above said at least one waveguide and thermally coupled to a portion of said at least one waveguide, the first layer of dielectric material comprising, for each waveguide: - at least a first trench (41), extending in a second direction (Y), parallel to the plane and perpendicular to the first direction, arranged above the heater thermally coupled to the waveguide; - a second trench (42) and a third trench (43) each extending in the first direction, on either side of the waveguide and the heater thermally coupled to the waveguide, said at least one first trench arranged above the heater thermally coupled to the waveguide opening into the second trench and into the third trench; - a second layer (22) of dielectric material extending parallel to the plane and on the first layer of dielectric material and covering each first, second and third trench.

2. Modulator (1) according to the preceding claim, in which for each waveguide (11), the second trench (42a-e) and the third trench (43a-e) are discontinuous and each comprise sections (42a-e, 43a-e) separated from each other by the dielectric material (212, 213) of the first layer (21), aligned along the first direction (X).

3. Modulator (1) according to one of the preceding claims, in which the semiconductor substrate comprises, for each waveguide (11), a fourth trench (44) extending in the first direction (X) and arranged under said waveguide, each second trench (42a-e) and each third trench (43a-e) on either side of the waveguide opening into the fourth trench.

4. Modulator (1) according to one of claims 1 to 3, in which for each waveguide (11), a distance (W211) separating two first consecutive trenches (41) in the first direction (X) is less than 5 pm.

5. Modulator (1) according to one of claims 1 to 3, in which for each waveguide (11), the first layer (21) of dielectric material comprises a single first trench (41) whose width (W41), measured in the first direction (X), is greater than 50% of the length (L12) of the heater (12) thermally coupled to the waveguide. [Claim s] Modulator (1) according to one of the preceding claims, comprising at least ten waveguides (11) and preferably at least one hundred waveguides.

7. Method (100) of manufacturing an optical phase modulator (1), comprising the following steps: - forming (101), on a semiconductor substrate (30), a first layer (21) of dielectric material extending in a plane (P), in which extends, in a first direction (X) parallel to the plane, at least one waveguide (11) and at least one heater (12), said at least one heater being arranged above said at least one waveguide and thermally coupled to a portion of said at least one waveguide; - etching (102) the first layer of dielectric material so as to form, for each waveguide, at least one first trench (41), extending in a second direction (Y), parallel to the plane and perpendicular to the first direction, arranged above the heater thermally coupled to the waveguide; - etching (103) the first layer of dielectric material so as to form, for each waveguide, second and third trenches (42, 43) each extending in the first direction, on either side of the waveguide and the heater thermally coupled to the waveguide, each first trench arranged above the heater thermally coupled to the waveguide opening into the second trench and into the third trench; - forming (104) a second layer (22) of dielectric material extending parallel to the plane and on the first layer of dielectric material and covering each trench. [Claim s] Method (100) according to the preceding claim, in which the step of forming (104) the second layer (22) of dielectric material comprises, before the step of etching (103) the second and third trenches, the following sub-steps: - filling (104a) each first trench (41) with a sacrificial material (1041); - depositing (104b) the second layer of dielectric material on the first layer of dielectric material and covering the sacrificial material in each first trench; wherein the step of etching the second and third trenches is carried out through the second layer of dielectric material, wherein the step of forming the second layer of dielectric material also comprises, after the step of etching the second and third trenches, the following sub-steps: - removing (104c) the sacrificial material from each first trench placed above each heater; and - thickening (104d) the second layer of dielectric material so that it covers each second and third trench.

9. Manufacturing method (100) according to the preceding claim, in which the step of thickening (104d) the second layer (22) of dielectric material is carried out by depositing a low density oxide.

10. Array (5) of phased antennas comprising: a plurality of antennas (52), aligned in a direction and distributed along this direction according to a constant pitch (d); - a power divider (51) configured to divide the optical power of an incident coherent optical beam, the incident optical beam having a wavelength greater than or equal to the constant pitch; the phased antenna array being characterized in that it comprises: - an optical phase modulator (1) according to one of claims 1 to 6, said modulator comprising a plurality of waveguides (11), each waveguide of the modulator forming part of the optical path between the power divider and one antenna of the plurality of antennas; or - a plurality of optical phase modulators according to one of claims 1 to 6, each modulator comprising a single waveguide, the waveguide of each modulator forming part of the optical path between the power divider and one antenna of the plurality of antennas.

11. Laser remote sensing system comprising an array (5) of phased antennas according to the preceding claim.

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