Curing agent for epoxy resins, which curing agent has diphenolic acid

Abstract

The invention relates to a curing agent for epoxy resins, the curing agent comprising: at least one amine A1, which is liquid at room temperature and has 6 to 15 C atoms and two primary amino groups; at least one diphenolic acid of formula (I); and optionally at least one diluent. The curing agent according to the invention is very simple to prepare, has low viscosity, and provides coatings which: can be applied at ambient temperatures; have good processability; have surprisingly rapid curing; have a high final hardness; have a qualitatively high-grade surface; and have a surprisingly low tendency towards yellowing.

Description

[0001] HARDENER FOR EPOXY RESINS WITH DIPHENOLIC ACID

[0002] Technical area

[0003] The invention relates to hardeners for room temperature curing epoxy resin compositions, in particular for coatings.

[0004] State of the art

[0005] Room-temperature-curing epoxy resin-based polymer compositions are widely used in the construction industry, for example as coatings, adhesives, or injection resins. They consist of liquid resin and hardener components that are mixed prior to application and cure at ambient temperatures to form a high-strength and durable material. However, in cool ambient conditions, such as the temperature range from 15 to almost 0 °C, such systems often cure slowly and are prone to surface defects such as cloudiness, stains, roughness, or stickiness, which is also referred to as "blushing" and occurs particularly in high humidity. These disadvantages are highly undesirable, especially in coating applications where high surface quality and hardness are crucial, and often lead to costly rework.

[0006] Combinations of primary diamines, such as isophoronediamine and salicylic acid, are known as hardeners for room-temperature-curing epoxy resin coatings. These hardeners typically also contain benzyl alcohol. Such hardeners are very easy to produce and enable rapid curing to produce high-quality surfaces, but they also have disadvantages. The curing speed could be improved, especially in cold temperatures; the final hardnesses achieved are rather low, and there is a significant tendency toward yellowing after curing. Furthermore, salicylic acid was recently classified as reproductive toxic, which complicates its use.

[0007] Diphenolic acid (DPA, 4,4-bis(4-hydroxyphenyl)pentanoic acid) is a bisphenol that is solid at room temperature. Diphenolic acid is known to be used as a hardener for heat-curing epoxy resin products, for example, as described in US Pat. No. 6,562,482. Furthermore, the use of diphenolic acid as a starting material for the production of epoxy resins has been described, for example, in Progress in Polymer Science 108 (2020) 101287.

[0008] Description of the invention

[0009] The object of the present invention is to provide a hardener for room temperature curable epoxy resin compositions which is suitable for coatings applicable at ambient temperatures and overcomes the disadvantages of the prior art.

[0010] This object is achieved with a hardener as described in claim 1. The hardener contains an amine A1 having 6 to 15 carbon atoms and two primary amino groups, which is liquid at room temperature, a diphenolic acid, and preferably additionally a thinner, such as benzyl alcohol. Compared to known hardeners containing salicylic acid, the hardener according to the invention surprisingly enables faster curing, higher final hardness, and surprisingly little tendency to yellowing. The diphenolic acid acts as an accelerator and can also reduce blushing.

[0011] The inventive hardener is easy to produce, has a low viscosity, and enables coatings with good processability, rapid curing, and high final hardness, with a high-quality surface and low tendency to yellowing. Furthermore, the inventive hardener exhibits toxicological advantages and is particularly sustainable, especially when a diphenolic acid based on renewable raw materials is used.

[0012] The hardener is particularly suitable for epoxy resin coatings that are processed at ambient temperatures, such as floor coatings.

[0013] Further aspects of the invention are the subject of further independent claims. Particularly preferred embodiments of the invention are the subject of the dependent claims.

[0014] Ways to implement the invention

[0015] The invention relates to a hardener for epoxy resins comprising

[0016] - at least one amine A1 having 6 to 15 C atoms and two primary amino groups which is liquid at room temperature, - at least one diphenolic acid of the formula (I), where m and n independently represent 0, 1 or 2, and

[0017] R 1 and R 2 independently of one another represent an alkyl, alkenyl or alkoxy radical having 1 to 10 C atoms or hydroxyl or a linear hydrocarbon radical having 15 C atoms,

[0018] - and if necessary at least one thinner.

[0019] A “thinner” is a substance that is soluble in an epoxy resin and reduces its viscosity, but which is not chemically bound into the epoxy resin polymer during curing.

[0020] A “primary amino group” is an amino group that is bonded to a single organic residue and carries two hydrogen atoms; a “secondary amino group” is an amino group that is bonded to two organic residues, which may also together be part of a ring, and carries one hydrogen atom; and a “tertiary amino group” is an amino group that is bonded to three organic residues, which may also be part of one or more rings in twos or threes, and does not carry a hydrogen atom.

[0021] The hydrogen atoms of primary and secondary amine groups are called “amine hydrogen”.

[0022] The "amine hydrogen equivalent weight" is the mass of an amine or amine-containing compound containing one molar equivalent of amine hydrogen. It is expressed in the unit "g / eq."

[0023] The "epoxide equivalent weight" is the mass of an epoxy-containing compound or composition that contains one molar equivalent of epoxy groups. It is expressed in the unit "g / eq." Substance names beginning with "poly," such as polyamine or polyepoxide, refer to substances that formally contain two or more of the functional groups mentioned in their name per molecule.

[0024] The term “molecular weight” refers to the molar mass (in grams per mole) of a molecule. The term “average molecular weight” refers to the number average M n a polydisperse mixture of oligomeric or polymeric molecules, which is usually determined by gel permeation chromatography (GPC) against polystyrene as a standard.

[0025] The term “pot life” refers to the maximum period of time from the mixing of the components and the application of an epoxy resin composition in which the mixed composition is in a sufficiently flowable state and can wet the substrate surfaces well.

[0026] The “gel time” is the period of time from the mixing of the components of an epoxy resin composition until they gel.

[0027] “Room temperature” is defined as a temperature of 23 °C.

[0028] All industry standards and norms mentioned in this document refer to the versions valid at the time of filing the initial application, unless otherwise stated.

[0029] Percentages by weight (% by weight) refer to the mass fraction of a component of a composition relative to the total composition, unless otherwise stated. The terms "mass" and "weight" are used synonymously in this document.

[0030] The at least one amine A1 which is liquid at room temperature is also referred to below as amine A1.

[0031] Particularly suitable as amine A1 are 1,5-diamino-2-methylpentane (MPMD), 2-butyl-2-ethyl-1,5-pentanediamine (C11-neodiamine), 1,6-hexanediamine, 2,5-dimethyl-1,6-hexanediamine, 2,2(4),4-trimethyl-1,6-hexanediamine (TMD), isophoronediamine (IPDA), 1,2-, 1,3- or 1,4-diaminocyclohexane, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, bis(4-aminocyclohexyl)methane, bis(4-amino-3-methylcyclohexyl)methane, 2(4)-methyl-1,3-diaminocyclohexane, 2,5(2,6)-bis(amino- methyl)bicyclo[2.2.1 ]heptane (NBDA), 3(4),8(9)-bis(aminomethyl)tricyclo[5.2.1 .0 26]- decan, 1 ,4-Diamino-2,2,6-trimethylcyclohexan (TMCDA), 1 ,8-Menthandiamin, 3,9- Bis(3-aminopropyl)-2,4,8, 10-tetraoxaspiro[5.5]undecan, 1 ,3-Bis(aminomethyl)ben- zol (MXDA), 1 ,4-Bis(aminomethyl)benzol, Diethylentriamin (DETA), Triethylen- tetramin (TETA), Tetraethylenpentamin (TEPA), Pentaethylenhexamin (PEHA), Dipropylentriamin (DPTA), N-(2-Aminoethyl)-1 ,3-propandiamin (N3-Amin), N,N'- Bis(3-aminopropyl)ethylendiamin (N4-Amin), N,N'-Bis(3-aminopropyl)-1 ,4-diamino- butan, N5-(3-Aminopropyl)-2-methyl-1 ,5-pentandiamin, N3-(3-Aminopentyl)-1 ,3- pentandiamin, N5-(3-Amino-1-ethylpropyl)-2-methyl-1 ,5-pentandiamin, N,N'-Bis(3- amino-1-ethylpropyl)-2-methyl-1 ,5-pentandiamin, 3-(2-Aminoethyl)aminopropyl- amin, Bis(2-aminoethyl)ether, 3,6-Dioxaoctan-1 ,8-diamin, 4,7-Dioxadecan-1 ,10- diamin, 4,7-Dioxadecan-2,9-diamin, 4,9-Dioxadodecan-1 ,12-diamin, 5,8-Dioxa- dodecan-3,10-diamin, 4,7,10-Trioxatridecan-1 ,13-diamin, Polyoxyalkylendi- oder - triamine,in particular polyoxypropylenediamines or polyoxypropylenetriamines such as Jeffamine® D-230 (from Huntsman), 2,5-bis(aminomethyl)furan, 2,5-bis(aminomethyl)tetrahydrofuran, bis(5-aminomethylfuran-2-yl)methane, bis(5-aminomethyltetrahydrofuran-2-yl)methane, 2,2-bis(5-aminomethylfuran-2-yl)propane or 2,2-bis(5-aminomethyltetrahydrofuran-2-yl)propane.

[0032] Preferably, the amine A1 is selected from the group consisting of 1,5-diamino-2-methylpentane (MPMD), 2-butyl-2-ethyl-1,5-pentanediamine (C11-neodiamine), 2,2(4),4-trimethyl-1,6-hexanediamine (TMD), isophoronediamine (IPDA), 1,2-diaminocyclohexane, 1,3-bis(aminomethyl)cyclohexane, bis(4-aminocyclohexyl)methane, bis(4-amino-3-methylcyclohexyl)methane, 2(4)-methyl-1,3-diaminocyclohexane, 2,5(2,6)-bis(aminomethyl)bicyclo[2.2.1]heptane (NBDA), 1,3-bis(aminomethyl)benzene (MXDA), 1,4-bis(aminomethyl)benzene, 2,5-bis(aminomethyl)furan, 2,5-bis(aminomethyl)tetrahydrofuran, bis(5-aminomethylfuran-2-yl)methane, bis(5-aminomethyltetrahydrofuran-2-yl)methane, 2,2-bis(5-aminomethylfuran-2-yl)propane and 2,2-bis(5-aminomethyltetrahydrofuran-2-yl)propane.

[0033] Of these, IPDA, 1,2-diaminocyclohexane, 1,3-bis(aminomethyl)cyclohexane, 2(4)-methyl-1,3-diaminocyclohexane, or MXDA are preferred. Isophoronediamine (IPDA) is most preferred as amine A1. IPDA enables the inventive hardeners to have particularly high final hardness and particularly low yellowing.

[0034] Isophoronediamine (3-aminomethyl-3,5,5-trimethylcyclohexylamine) is a cycloaliphatic primary diamine which exists as a mixture of cis- and trans-isomers and is commercially available, for example as Vestamin® IPD (from Evonik).

[0035] In a preferred embodiment of the invention, isophoronediamine is made from acetone from a renewable source. This enables particularly sustainable hardeners for epoxy resins.

[0036] In a preferred embodiment, the hardener contains, in addition to the amine A1 isophoronediamine, at least one further amine A1, in particular in a weight ratio of isophoronediamine to further amine A1 of 50 / 50 to 90 / 10.

[0037] In a preferred embodiment of the invention, the hardener contains isophoronediamine and 1,3-bis(aminomethyl)benzene as amine A1, in particular in a weight ratio of isophoronediamine to 1,3-bis(aminomethyl)benzene of 50 / 50 to 90 / 10, preferably 60 / 40 to 80 / 20. Such a hardener enables particularly rapid curing with high final hardness and little yellowing.

[0038] The hardener also contains at least one diphenolic acid of formula (I), where m and n independently represent 0, 1 or 2, and R 1 and R 2independently of one another represent an alkyl, alkenyl or alkoxy radical having 1 to 10 C atoms or hydroxyl or a linear hydrocarbon radical having 15 C atoms.

[0039] Particularly preferably, m and n are both 0. This diphenolic acid is 4,4-bis(4-hydroxyphenyl)pentanoic acid. It is particularly easily accessible and enables fast-curing epoxy resin compositions with particularly good processability. It is particularly obtainable from the reaction of phenol with 4-oxopentanoic acid (levulinic acid).

[0040] In a preferred embodiment of the invention, m and n both represent 1 and R 1 and R 2represent a radical selected from the group consisting of methyl, methoxy, ethyl, ethoxy, propyl, isopropyl, butyl, tert-butyl, pentyl, allyl, hydroxyl, and linear aliphatic C15H25-3i hydrocarbon radicals. Such diphenolic acids are obtainable in particular from the reaction of appropriately substituted phenols with 4-oxopentanoic acid (= levulinic acid).

[0041] Cardanol is a particularly good phenol substituted with linear aliphatic C15H25-31 hydrocarbon residues. Cardanol is a renewable raw material and is primarily obtained from cashew shells. Cardanol mainly contains a mixture of phenols substituted in the 3-position by a linear aliphatic C15H25, C15H27, C15H29, or C18H31 hydrocarbon residue.

[0042] Particularly preferred diphenolic acids of the formula (I) are selected from the group consisting of 4,4-bis(4-hydroxyphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-methylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-ethylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-isopropylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-butylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-tert-butylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-pentylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-allylphenyl)pentanoic acid, 4,4-bis-(4-hydroxy-3,5-dimethylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3,5-diisopropylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3,5-di-tert.butylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-methyl-5-isopropylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-2-methylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-2-ethylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-methoxyphenyl)pentanoic acid, 4,4-bis(3,4-dihydroxyphenyl)pentanoic acid, 4,4-bis(2,4-dihydroxyphenyl)pentanoic acid and 4,4-bis(4-hydroxy-2-(C15H25-31 linear hydrocarbon)phenyl)pentanoic acids.

[0043] Of these, 4,4-bis(4-hydroxyphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-methylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-allylphenyl)pentanoic acid, 4,4-bis(4-hydroxy-3-methoxyphenyl)pentanoic acid, 4,4-bis(3,4-dihydroxyphenyl)pentanoic acid or 4,4-bis(2,4-dihydroxyphenyl)pentanoic acid is preferred.

[0044] Most preferred is 4,4-bis(4-hydroxyphenyl)pentanoic acid.

[0045] Particularly preferred is the use of a diphenolic acid that is at least partially produced from renewable raw materials. This enables particularly sustainable hardeners for epoxy resins.

[0046] The weight ratio between the diphenolic acid of formula (I) and the amine A1 is preferably in the range of 0.025 to 0.5, especially 0.05 to 0.25. Such a hardener is easy to prepare, has a low viscosity, and enables good processability, rapid curing, and high final hardness.

[0047] The hardener preferably contains, based on the total hardener, 1 to 10% by weight, preferably 2 to 8% by weight, of diphenolic acid of the formula (I).

[0048] To prepare the hardener, the amine A1 is preferably initially introduced and heated, in particular to a temperature in the range of 40 to 80 °C, in particular 50 to 70 °C, and then the diphenolic acid is slowly added and dissolved with thorough stirring.

[0049] In the event that the hardener contains a thinner, the preparation is preferably carried out in such a way that the thinner or a mixture of thinner and amine A1 is initially introduced and heated, in particular to a temperature in the range of 40 to 80 °C, in particular 50 to 70 °C, and then the diphenolic acid is slowly added and dissolved with thorough stirring.

[0050] The hardener preferably contains at least one thinner.

[0051] Geeignete Verdünner sind insbesondere n-Propanol, Isopropanol, n-Butanol, Isobutanol, tert.Butanol, 1-Pentanol, 2-Pentanol, 3-Pentanol, 2-Methyl-1 -butanol, 3- Methyl-1 -butanol, 3-Methyl-2-butanol, n-Hexanol, 2-Ethylhexanol, Xylol, 2-Metho- xyethanol, Dimethoxyethanol, 2-Ethoxyethanol, 2-Propoxyethanol, 2-lsopropoxy- ethanol, 2-Butoxyethanol, 2-Phenoxyethanol, 2-Benzyloxyethanol, Benzylalkohol, Ethylenglykol, Ethylenglykoldimethylether, Ethylenglykoldiethylether, Ethylenglykoldibutylether, Ethylenglykoldiphenylether, Diethylenglykol, Diethylenglykolmonomethylether, Diethylenglykolmonoethylether, Diethylenglykolmono-n-butylether, Diethylenglykoldimethylether, Diethylenglykoldiethylether, Diethylenglykoldi-n- butylylether, Propylenglykolbutylether, Propylenglykolphenylether, Dipropylenglykol, Dipropylenglykolmonomethylether, Dipropylenglykoldimethylether, Dipro- pylenglykoldi-n-butylether, 2,2,4-T ri methyl- 1 ,3-pentandiolmonoisobutyrat, Diphenylmethan, Diisopropylnaphthalin,Isopropyl biphenyls, petroleum fractions such as Solvesso® types (from Exxon), alkylphenols such as tert. butylphenol, nonylphenol, dodecylphenol, cardanol, styrenated phenol, liquid aromatic hydrocarbon resins, especially phenol group-containing types, alkoxylated phenol, especially ethoxylated or propoxylated phenol, adipates, sebacates, phthalates, benzoates, organic phosphoric or sulfonic acid esters or sulfonamides.

[0052] Aromatic thinners with a boiling point of more than 200 °C are preferred.

[0053] The diluent is preferably selected from the group consisting of benzyl alcohol, styrenated phenol, ethoxylated phenol such as, in particular, 2-phenoxyethanol, ethoxylated benzyl alcohol such as, in particular, 2-benzyloxyethanol, phenol-containing aromatic hydrocarbon resins such as, in particular, the Novares® types LS 500, LX 200, LA 300, or LA 700 (from Rütgers), diisopropylnaphthalene, isopropylbiphenylene, and cardanol. Benzyl alcohol is most preferred.

[0054] Preferably, the thinner is present in such an amount that the weight ratio between thinner and amine A1 is in the range of 0.15 to 1.5, in particular 0.3 to 1.2. Such a hardener enables epoxy resin coatings with a particularly low tendency toward blushing effects and thus particularly attractive surfaces.

[0055] The hardener preferably contains 10 to 60% by weight, in particular 20 to 50% by weight, of thinner, based on the total hardener.

[0056] A particularly preferred hardener contains, based on the total hardener

[0057] - 30 to 80% by weight of amine A1,

[0058] - 1 to 10% by weight, preferably 2 to 8% by weight, of diphenolic acid of formula (I), and

[0059] - 10 to 60% by weight, preferably 20 to 50% by weight, thinner.

[0060] In a preferred embodiment, the hardener contains at least one further accelerator which is not a diphenolic acid of formula (I).

[0061] Suitable further accelerators are in particular nitrates such as calcium nitrate, phenols, in particular bisphenols, phenol resins such as phenol-formaldehyde resins, also called novolaks, or Mannich bases such as 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol or polymers of phenol, formaldehyde and N,N-dimethyl-1,3-propanediamine, phosphites such as di- or triphenyl phosphites, or compounds containing mercapto groups.

[0062] Phenol-formaldehyde resins, calcium nitrate, or Mannich bases are preferred. 2,4,6-tris(dimethylaminomethyl)phenol is most preferred.

[0063] The hardener may contain other amines other than Amine A1. Suitable such further amines are in particular alkylated amines such as in particular N-benzyl-1,2-ethanediamine, N-benzyl-1,2-propanediamine, N-benzyl-1,3-bis(aminomethyl)benzene, N-(2-ethylhexyl)-1,3-bis(aminomethyl)benzene, N-furfuryl-1,2-ethanediamine or N-tetrahydrofurfuryl-1,2-ethanediamine, furthermore 3-dimethylaminopropylamine (DMAPA), 3-(3-(dimethylamino)propylamino)propylamine (DMAPAPA) or N-aminoethylpiperazine, higher molecular weight polyoxypropylenediamines or -triamines such as in particular Jeffamine® D-400 or Jeffamine® T-403 (both from Huntsman), phenalkamines or -amides, which are reaction products of cardanol with aldehydes, in particular formaldehyde, and polyamines, amines which are solid at room temperature, such as in particular 1,12-dodecanediamine or bis(hexamethylene)triamine (BHMT), or amine-functional adducts of these amines or of the above-mentioned amines A1 with mono- or polyepoxides, in particular aromatic epoxy resins.

[0064] Particularly suitable additional amines are selected from the group consisting of N-benzyl-1,2-ethanediamine, amine-functional adducts of IPDA with aromatic epoxy resins, amine-functional adducts of MXDA with aromatic epoxy resins, and amine-functional adducts of N-benzyl-1,2-ethanediamine with aromatic epoxy resins. Preferred aromatic epoxy resins are bisphenol A diglycidyl ether or bisphenol F diglycidyl ether.

[0065] The hardener can be water-based and contain water in the range of 15 to 90% by weight, preferably 20 to 80% by weight, based on the total hardener.

[0066] The hardener is preferably not water-based. It preferably contains less than 15% by weight, especially less than 10% by weight, of water, based on the total hardener. Such a hardener is particularly suitable for non-aqueous epoxy resin products.

[0067] In a preferred embodiment, the hardener contains a small amount of water, in particular 0.5 to 9% by weight, preferably 1 to 5% by weight, of the total hardener. Such hardeners enable particularly attractive surfaces.

[0068] The hardener may contain other components, in particular

[0069] - further adducts, in particular adducts of 1,2-ethanediamine or 1,2-propanediamine with cresyl glycidyl ether or aromatic epoxy resins, in which unreacted 1,2-ethanediamine or 1,2-propanediamine was removed by distillation after the reaction,

[0070] - monoamines such as benzylamine or furfurylamine,

[0071] - polyamidoamines, in particular reaction products of a mono- or polybasic carboxylic acid or its ester or anhydride, in particular a dimer fatty acid, with a polyamine used in stoichiometric excess, in particular DETA or TETA,

[0072] - Mannich bases,

[0073] - aromatic polyamines such as in particular 4,4'-, 2,4' and / or 2,2'-diaminodiphenylmethane, 2,4(6)-toluenediamine, 3,5-dimethylthio-2,4(6)-toluenediamine or 3,5-diethyl-2,4(6)-toluenediamine,

[0074] - Compounds containing mercapto groups, in particular liquid mercaptan-terminated polysulfide polymers, mercaptan-terminated polyoxyalkylene ethers, mercaptan-terminated polyoxyalkylene derivatives, polyesters of thiocarboxylic acids, 2,4,6-trimercapto-1,3,5-triazine, triethylene glycol dimercaptan or ethanedithiol,

[0075] - surface-active additives, in particular defoamers, deaerators, wetting agents, dispersing agents or leveling agents, or

[0076] - Stabilizers, especially stabilizers against oxidation, heat, light or UV radiation.

[0077] Another object of the invention is an epoxy resin composition comprising

[0078] - a resin component comprising at least one epoxy resin and

[0079] - a hardener component comprising the previously described hardener. A suitable epoxy resin is obtained in a known manner, in particular from the reaction of epichlorohydrin with polyols, polyphenols, or amines.

[0080] Suitable epoxy resins are in particular aromatic epoxy resins, in particular the glycidyl ethers of:

[0081] - Bisphenol A, bisphenol F, or bisphenol A / F, where A is acetone and F is formaldehyde, which served as starting materials for the production of these bisphenols. In the case of bisphenol F, positional isomers may also be present, in particular those derived from 2,4'- or 2,2'-hydroxyphenylmethane;

[0082] - Dihydroxybenzene derivatives such as resorcinol, hydroquinone or pyrocatechol;

[0083] - weiteren Bisphenolen oder Polyphenolen wie Bis(4-hydroxy-3-methylphenyl)- methan, 2,2-Bis(4-hydroxy-3-methylphenyl)propan (Bisphenol-C), Bis(3,5-di- methyl-4-hydroxyphenyl)methan, 2,2-Bis(3,5-dimethyl-4-hydroxyphenyl)propan, 2,2-Bis(3,5-dibromo-4-hydroxyphenyl)propan, 2,2-Bis(4-hydroxy-3-tert.butyl- phenyl)propan, 2,2-Bis(4-hydroxyphenyl)butan (Bisphenol-B), 3,3-Bis(4-hydro- xyphenyl)pentan, 3,4-Bis(4-hydroxyphenyl)hexan, 4,4-Bis(4-hydroxyphenyl)- heptan, 2,4-Bis(4-hydroxyphenyl)-2-methylbutan, 2,4-Bis(3,5-dimethyl-4-hydro- xyphenyl)-2-methylbutan, 1 ,1-Bis(4-hydroxyphenyl)cyclohexan (Bisphenol-Z),

[0084] 1,1-Bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane (Bisphenol-TMC), 1,1-Bis(4-hydroxyphenyl)-1-phenylethane, 1,4-Bis[2-(4-hydroxyphenyl)-2-propyl]-benzene (Bisphenol-P), 1,3-Bis[2-(4-hydroxyphenyl)-2-propyl]benzene (Bisphenol-M), 4,4'-dihydroxydiphenyl (DOD), 4,4'-dihydroxybenzophenone, bis(2-hydroxy-naphth-1-yl)methane, bis(4-hydroxynaphth-1-yl)methane, 1,5-dihydroxynaphthalene, Tris(4-hydroxyphenyl)methane, 1, 1,2,2-T etrakis(4-hydroxyphenyl)ethane, bis(4-hydroxyphenyl)ether or Bis(4-hydroxyphenyl)sulfone;

[0085] - novolaks, which are in particular condensation products of phenol or cresols with formaldehyde or paraformaldehyde or acetaldehyde or crotonaldehyde or isobutyraldehyde or 2-ethylhexanal or benzaldehyde or furfural;

[0086] - aromatic amines, such as aniline, toluidine, 4-aminophenol, 4,4'-methylenediphenyldiamine, 4,4'-methylenediphenyldi-(N-methyl)amine, 4,4'-[1,4-phenylenebis(1-methylethylidene)]bisaniline (bisaniline-P) or 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisaniline (bisaniline-M).

[0087] Other suitable epoxy resins are aliphatic or cycloaliphatic polyepoxides, in particular

[0088] - Glycidyl ethers of saturated or unsaturated, branched or unbranched, cyclic or open-chain di-, tri- or tetrafunctional C2 to C50 alcohols, in particular ethylene glycol, propylene glycol, butylene glycol, hexanediol, octanediol, polypropylene glycols, dimethylolcyclohexane, neopentyl glycol, dibromoneopentyl glycol, castor oil, trimethylolpropane, trimethylolethane, pentaerythrol, sorbitol or glycerol, or alkoxylated glycerol or alkoxylated trimethylolpropane;

[0089] - a hydrogenated bisphenol A, F or A / F liquid resin, or the glycidylation products of hydrogenated bisphenol A, F or A / F;

[0090] - an N-glycidyl derivative of amides or heterocyclic nitrogen bases, such as triglycidyl cyanurate or triglycidyl isocyanurate, or reaction products of epichlorohydrin with hydantoin.

[0091] Other suitable epoxy resins are epoxy resins obtained from the reaction of bio-based hydroxy-functional raw materials with epichlorohydrin, especially epichlorohydrin derived from bio-based glycerin. Vanillin-based epoxy resins, such as diglycidyl ethers of vanillin alcohol, and glycerin-based epoxy resins, such as triglycidyl ethers of bio-based glycerin, are particularly preferred.

[0092] Preferably, the epoxy resin is a liquid resin or a mixture containing two or more epoxy liquid resins.

[0093] An “epoxy liquid resin” is a technical polyepoxide with a glass transition temperature below 25 °C.

[0094] The resin component may also contain portions of solid epoxy resin. The epoxy resin is, in particular, an aromatic liquid resin based on a bisphenol or novolak, particularly with an average epoxy equivalent weight in the range of 156 to 210 g / eq.

[0095] Bisphenol A diglycidyl ether and / or bisphenol F diglycidyl ether, such as those commercially available from Olin, Huntsman, or Momentive, are particularly suitable. These liquid resins have a low viscosity for epoxy resins and enable rapid curing and high hardness. They can contain portions of bisphenol A solid resin or novolak epoxy resins.

[0096] Particularly preferred is a bisphenol A diglycidyl ether obtained from the reaction of bisphenol A with bio-based epichlorohydrin. This enables particularly sustainable epoxy resin compositions.

[0097] Also particularly suitable are phenol-formaldehyde novolak glycidyl ethers, in particular with an average functionality in the range of 2.3 to 4, preferably 2.5 to 3. They may contain proportions of other epoxy resins, in particular bisphenol A diglycidyl ether or bisphenol F diglycidyl ether.

[0098] Also particularly suitable are diglycidyl ethers of vanillin alcohol or triglycidyl ethers of glycerol, in particular diglycidyl ethers of vanillin alcohol.

[0099] Particularly preferably, the resin component comprises at least one epoxy resin selected from the group consisting of bisphenol A diglycidyl ethers, bisphenol F diglycidyl ethers, phenol-formaldehyde novolak glycidyl ethers with an average functionality of 2.3 to 4, preferably 2.5 to 3, vanillin alcohol diglycidyl ethers and combinations of two or more of the epoxy resins mentioned.

[0100] The resin component preferably contains at least one reactive diluent containing epoxy groups.

[0101] Suitable reactive diluents are, in particular, butanediol diglycidyl ether, hexanediol diglycidyl ether, trimethylolpropane di- or triglycidyl ether, phenyl glycidyl ether, cresyl glycidyl ether, guaiacol glycidyl ether, 4-methoxyphenyl glycidyl ether, pn-butylphenyl glycidyl ether, p-tert. butylphenyl glycidyl ether, 4-nonylphenyl glycidyl ether, 4-dodecylphenyl glycidyl ether, cardanol glycidyl ether, benzyl glycidyl ether, allyl glycidyl ether, butyl glycidyl ether, hexyl glycidyl ether, 2-ethylhexyl glycidyl ether, or glycidyl ethers of natural alcohols, such as, in particular, Cs to C10 or C12 to C14 or C13 to C18 alkyl glycidyl ethers.

[0102] The epoxy resin composition preferably contains at least one further component selected from surface-active additives, fillers and pigments.

[0103] Suitable surface-active additives are in particular defoamers, deaerators, wetting agents, dispersants, leveling agents and / or dispersed paraffin waxes.

[0104] Suitable fillers include, in particular, ground or precipitated calcium carbonate, optionally coated with fatty acids, especially stearates, barite (barite), talc, quartz powder, quartz sand, silicon carbide, iron mica, dolomite, wollastonite, kaolin, mica (potassium aluminum silicate), molecular sieves, aluminum oxide, zinc oxide, aluminum-doped zinc oxide, aluminum hydroxide, magnesium hydroxide, silica, cement, gypsum, fly ash, carbon black, graphite, metal powders such as aluminum, copper, iron, zinc, silver, or steel, PVC powder, or hollow spheres. Preferred fillers are calcium carbonate, barite, quartz powder, talc, aluminum powder, or a combination thereof.

[0105] Suitable pigments include, in particular, titanium dioxide, iron oxide, chromium(III) oxide, organic pigments, carbon black, or anticorrosive pigments, especially phosphates, orthophosphates, or polyphosphates, which contain, in particular, chromium, zinc, aluminum, calcium, strontium, or a combination of these metals as counterions. Titanium dioxide is particularly suitable.

[0106] The epoxy resin composition may contain other auxiliary substances and additives, in particular the following:

[0107] - other reactive diluents, in particular epoxidised soybean oil or linseed oil, compounds containing acetoacetate groups, in particular acetoacetylated polyols, butyrolactone, carbonates, aldehydes, isocyanates or silicones containing reactive groups, - solvents,

[0108] - Polymers, in particular polyamides, polysulfides, polyvinyl formal (PVF), polyvinyl butyral (PVB), polyurethanes (PUR), polymers with carboxyl groups, polyamides, butadiene-acrylonitrile copolymers, styrene-acrylonitrile copolymers, butadiene-styrene copolymers, homo- or copolymers of unsaturated monomers, in particular from the group comprising ethylene, propylene, butylene, isobutylene, isoprene, vinyl acetate or alkyl (meth)acrylates, in particular chlorosulfonated polyethylenes or fluorine-containing polymers or sulfonamide-modified melamines,

[0109] - fibres, in particular glass fibres, carbon fibres, metal fibres, ceramic fibres or plastic fibres such as polyamide fibres or polyethylene fibres,

[0110] - Nanofillers, especially carbon nanotubes;

[0111] - Rheology modifiers, especially thickeners or anti-settling agents,

[0112] - adhesion promoters, especially organoalkoxysilanes,

[0113] - flame-retardant substances, in particular the fillers already mentioned: aluminum hydroxide or magnesium hydroxide, antimony trioxide, antimony pentoxide, boric acid (B(OH)s), zinc borate, zinc phosphate, melamine borate, melamine cyanurate, ammonium polyphosphate, melamine phosphate, melamine pyrophosphate, polybrominated diphenyl oxides or diphenyl ethers, phosphates such as in particular diphenyl cresyl phosphate, resorcinol bis(diphenyl phosphate), resorcinol diphosphate oligomer, tetraphenylresorcinol diphosphite, ethylenediamine diphosphate, bisphenol A bis(diphenyl phosphate), tris(chloroethyl)phosphate, tris(chloropropyl)phosphate, tris(dichloroisopropyl)phosphate, tris[3-bromo-2,2-bis(bromomethyl)propyl]phosphate, tetrabromobisphenol A, bis(2,3-dibromopropyl ether) of bisphenol A, brominated epoxy resins, ethylene bis(tetrabromophthalimide), ethylene bis(dibromonorbornanedicarboximide), 1,2-bis(tribromophenoxy)ethane, tris(2,3-dibromopropyl)isocyanurate, tribromophenol, hexabromocyclododecane,Bis(hexachlorocyclopentadieno)cyclooctane or chlorinated paraffins, or,

[0114] - Stabilizers against oxidation, heat, light or UV radiation or biocides.

[0115] The epoxy resin composition preferably contains less than 5% water by weight. Such a non-water-based epoxy resin composition is particularly versatile and particularly water-resistant. The resin and hardener components of the epoxy resin composition are stored in separate containers.

[0116] A suitable container for storing the resin or hardener components is, in particular, a drum, a hobbock, a bag, a bucket, a can, a cartridge, or a tube. The components are storable, meaning they can be stored for several months up to a year or longer before use without their respective properties changing to an extent relevant to their intended use.

[0117] The resin and hardener components are mixed shortly before or during application. The mixing ratio is preferably selected so that the molar ratio of the groups reactive toward epoxy groups to the epoxy groups is in the range of 0.5 to 1.5, particularly 0.7 to 1.2. In parts by weight, the mixing ratio between the resin and hardener components is typically in the range of 1:2 to 20:1.

[0118] The components are mixed continuously or batchwise using a suitable process, ensuring that there is not too much time between mixing the components and application and that the application occurs within the pot life. Mixing and application can take place at ambient temperature, which typically ranges from approximately 5 to 40°C, preferably approximately 10 to 35°C.

[0119] With the mixing of the components, the curing of the epoxy resin composition begins through a chemical reaction. Primary and secondary amino groups, and any other epoxy-reactive groups present, react with the epoxy groups, causing their ring opening. As a result of these reactions, the composition polymerizes and thus cures.

[0120] Curing typically takes several hours to several days. The duration depends, among other things, on the temperature, the reactivity of the components, their stoichiometry, the type and amount of diphenolic acid of formula (I), and any other amines and / or accelerators present.

[0121] In the freshly mixed state, the epoxy resin composition has a low viscosity. The viscosity 5 minutes after mixing the resin and hardener components at 20 °C is preferably in the range of 0.1 to 10 Pa s, preferably 0.2 to 5 Pa s, particularly preferably 0.3 to 2 Pa s, measured using a cone-plate viscometer at a shear rate of 10 s -1 .

[0122] The epoxy resin composition is preferably applied to at least one substrate.

[0123] Particularly suitable as substrates are:

[0124] - Glass, glass ceramics, concrete, mortar, cement screed, fiber cement, brick, tile, plaster or natural stones such as granite or marble;

[0125] - Repair or levelling compounds based on PCC (polymer-modified cement mortar) or ECO (epoxy resin-modified cement mortar);

[0126] - Metals or alloys such as aluminum, iron, steel, copper, other non-ferrous metals, including surface-treated metals or alloys such as galvanized or chrome-plated metals;

[0127] - asphalt or bitumen;

[0128] - leather, textiles, paper, wood, wood materials bonded with resins, for example phenolic, melamine or epoxy resins, resin-textile composites or other so-called polymer composites;

[0129] - Plastics such as rigid and soft PVC, polycarbonate, polystyrene, polyester, polyamide, PMMA, ABS, SAN, epoxy resins, phenolic resins, PUR, POM, TPO, PE, PP, EPM or EPDM, each untreated or surface-treated, for example by means of plasma, corona or flames;

[0130] - Fiber-reinforced plastics, such as carbon fiber reinforced plastics (CFRP), glass fiber reinforced plastics (GRP) and sheet molding compounds (SMC);

[0131] - Insulating foams, in particular made of EPS, XPS, PUR, PIR, rock wool, glass wool or foamed glass (foam glass); - Coated or painted substrates, in particular painted tiles, painted concrete, powder-coated metals or alloys or painted sheets;

[0132] - Coatings, paints or varnishes, in particular coated floors, which are covered with another layer of floor covering.

[0133] If necessary, the substrates may be pretreated before application, in particular by physical and / or chemical cleaning processes or the application of an activator or a primer.

[0134] The substrates are in particular coated and / or glued.

[0135] A further object of the invention is a cured composition obtained from the described epoxy resin composition after mixing the resin and hardener components.

[0136] The composition is preferably used as a coating, primer, adhesive, sealant, potting compound, casting resin, or impregnating resin. The composition is particularly preferably used as a coating.

[0137] The use results in an article containing the cured composition of the described epoxy resin composition.

[0138] The article is in particular a floor coating, wall coating, component coating, pipe coating, roof coating or a corrosion protection coating, or an adhesively bonded article.

[0139] Examples

[0140] The following are exemplary embodiments intended to further illustrate the described invention. Of course, the invention is not limited to these described exemplary embodiments.

[0141] “AHEW” stands for the amine hydrogen equivalent weight.

[0142] "EEW" stands for epoxy equivalent weight. A "standard climate" ("NC") is defined as a temperature of 23±1 °C and a relative humidity of 50±5%.

[0143] Unless otherwise stated, the chemicals used were from Sigma-Aldrich Chemie GmbH.

[0144] Substances and abbreviations used

[0145] Araldite® GY 250 Bisphenol A diglycidyl ether, EEW approx. 187 g / eq (from Huntsman)

[0146] Araldite® DY-E monoglycidyl ether from C12 to Cu alcohols, EEW approx. 290 g / eq (from Huntsman)

[0147] IPDA 3-aminomethyl-3,5,5-trimethylcyclohexylamine, AHEW 42.6 g / eq (Vestamin® IPD, from Evonik)

[0148] MXDA 1,3-Bis(aminomethyl)benzene, AHEW 34 g / Eq (from Mitsubishi

[0149] Gas Chemical)

[0150] BAC 1 ,3-Bis(aminomethyl)cyclohexane, AHEW 35.5 g / Eq (of

[0151] Mitsubishi Gas Chemical)

[0152] TMD 2,2(4),4-T rimethy 1-1,6-hexanediamine, AHEW 39.6 g / eq

[0153] (Vestamin® TMD, from Evonik)

[0154] Diphenolic acid-1 4,4-bis(4-hydroxyphenyl)pentanoic acid

[0155] K54 2,4,6-Tris(dimethylaminomethyl)phenol (Ancamine® K54, from

[0156] Evonik)

[0157] Production of hardeners for epoxy resins: Hardeners H-1 to H-13:

[0158] For each hardener, the amount of benzyl alcohol specified in Table 1 (in parts by weight) was added, heated to 60 °C, and the specified amount of diphenolic acid—or salicylic acid in the case of Hardener H-12 (Ref.)—was dissolved with thorough stirring. The solution was then cooled, and the other ingredients specified in Table 1 were added in the specified amounts. Mix thoroughly, and the hardener was stored away from moisture. For Hardener H-13 (Ref.), the amounts of IPDA and benzyl alcohol specified in Table 1 were mixed at room temperature, and the hardener was stored away from moisture. The viscosity of each hardener was measured at 20 °C on a thermostatted Rheotec RC30 cone-plate viscometer (cone diameter 50 mm, cone angle 1 °, cone tip-to-plate distance 0.05 mm, shear rate 10 s -1) was measured, and the appearance of the hardener was visually assessed. The hardeners designated "(Ref.)" in Table 1 are comparative examples not according to the invention.

[0159] Table 1: Composition and properties of hardeners H-1 to H-13.

[0160]

[0161] Table 1 : (continued)

[0162] Production of epoxy resin compositions Compositions Z-1 to Z-13:

[0163] For each composition, the resin component ingredients listed in Tables 2 and 3 were mixed in the specified amounts (in parts by weight) using a centrifugal mixer (SpeedMixer™ DAC 150, FlackTek Inc.) and stored in a dry, dry place. The hardeners listed in Tables 2 and 3 were then mixed with the resin component in the specified amounts (in parts by weight) using the centrifugal mixer, and the mixed composition was immediately tested as follows:

[0164] The viscosity (5') was measured 5 min after mixing the resin component and the hardener at a temperature of 20 °C on a thermostated cone

[0165] Plate viscometer Rheotec RC30 (cone diameter 50 mm, cone angle 1 °, cone tip-plate distance 0.05 mm, shear rate of 10 s -1). The setting time was determined by moving a freshly mixed amount of approximately 3 g with a spatula at regular intervals under standard conditions until the mass gelled.

[0166] The Shore D hardness was determined according to DIN 53505 on two cylindrical test specimens (diameter 20 mm, thickness 5 mm), one stored under standard conditions and one at 8 °C and 80% relative humidity. The hardness was measured after 1 day (24 h), after 2 days, and in some cases even after 3 days. Furthermore, a film with a layer thickness of 500 μm was applied to a glass plate and stored and cured under standard conditions. The Königs hardness (König pendulum hardness according to DIN EN ISO 1522) was determined on this film after 1 day, 2 days, 7 days, and 14 days (1d NK), (2d NK), (7d NK), (14d NK). After 14 days, the appearance (NK) of the film was assessed. A clear film was described as "fair" if it had a shiny and non-tacky surface without any structure. “Structure” was defined as any kind of drawing or pattern on the surface.

[0167] Another film was applied to a glass plate with a layer thickness of 500 μm. Immediately after application, this film was stored or cured for 7 days at 8°C and 80% relative humidity and then for 2 weeks under standard conditions. 24 hours after application, a polypropylene bottle cap was placed on the film, underneath which a moist sponge was placed. After a further 24 hours, the sponge and cap were removed and placed in a new location on the film, where they were removed and repositioned again 24 hours later, a total of four times. The aspect of this film was then assessed (referred to in the tables as "Aspect (8° / 80%)") in the same way as described for aspect (NK). The number and type of visible marks caused in the film by the moist sponge or the applied cap were also recorded in each case."Blushing" was defined as the number of white spots. "None" denoted a surface without any white spots. "1" denoted a clearly white spot, and "(1)" a faint white spot. "Ring" denoted the number of ring-shaped marks left by the lids sinking into the surface. "1" denoted a clearly visible mark, and "(1)" a faint mark. (A ring-shaped mark indicates that the coating is not yet suitable for walking on.) The Königs hardness was again determined on the cured films, each after 7 days at 8 °C and 80% relative humidity (Königsh. (7d 8° / 80%)), then after a further 2 days in the NK (Königsh. (+2d NK)) or 7 days in the NK (Königsh. (+7d NK)) or 14 days in the NK (Königsh. (+14d NK)).

[0168] As a measure of yellowing, the color change after exposure was also determined in a weathering tester. For this purpose, another film with a layer thickness of 500 μm was applied to a glass plate and stored or cured in a standard climate for 2 weeks. It was then tested in a Q-Sun Xenon Xe-1 weathering tester equipped with a Q-SUN Daylight-Q optical filter and a xenon lamp with a luminous intensity of 0.51 W / m 2 at 340 nm at a temperature of 65°C for 72 hours (Q-Sun (72h)). The color difference ΔE of the exposed film compared to the corresponding unexposed film was then determined using an NH310 colorimeter from Shenzen 3NH Technology Co. LTD, equipped with a Silicon Photoelectric Diode Detector, Light Source A, and Color Space Measurement Interface CIE L*a*b*C*H*. ΔE values ​​of more than 10 indicate significant yellowing.

[0169] The results are shown in Tables 2 and 3.

[0170] The compositions designated "(Ref.)" are comparative examples not according to the invention.

[0171]

[0172] Table 2: Composition and properties of Z-1 to Z-7.

[0173] 1 not measurable (too soft) "nb" stands for "not determined"

[0174]

[0175] Table 3: Composition and properties of Z-8 to Z-13.

[0176] 1 not measurable (too soft)

Claims

Patent claims: 1 . Hardener for epoxy resins comprehensive - at least one amine A1 which is liquid at room temperature and has 6 to 15 C atoms and two primary amino groups, - at least one diphenolic acid of formula (I), m and n independently represent 0, 1 or 2, and R 1 and R 2 independently of one another represent an alkyl, alkenyl or alkoxy radical having 1 to 10 C atoms or hydroxyl or a linear hydrocarbon radical having 15 C atoms, - and if necessary at least one thinner.

2. Hardener according to claim 1, characterized in that the amine A1 is selected from the group consisting of 1,5-diamino-2-methylpentane, 2-butyl-2-ethyl-1,5-pentanediamine, 2,2(4),4-trimethyl-1,6-hexanediamine, isophoronediamine, 1,2-diaminocyclohexane, 1,3-bis(aminomethyl)cyclohexane, bis(4-aminocyclohexyl)methane, bis(4-amino-3-methylcyclohexyl)methane, 2(4)-methyl-1,3-diaminocyclohexane, 2,5(2,6)-bis(aminomethyl)bicyclo-[2.2.1]heptane, 1,3-bis(aminomethyl)benzene, 1,4-bis(aminomethyl)benzene, 2,5- Bis(aminomethyl)furan, 2,5-bis(aminomethyl)tetrahydrofuran, bis(5-aminomethylfuran-2-yl)methane, bis(5-aminomethyltetrahydrofuran-2-yl)methane, 2,2-bis(5-aminomethylfuran-2-yl)propane and 2,2-bis(5-aminomethyltetrahydrofuran-2-yl)propane.

3. Hardener according to one of claims 1 or 2, characterized in that isophoronediamine is contained as amine A1.

4. Hardener according to one of claims 1 to 3, characterized in that isophoronediamine and 1,3-bis(aminomethyl)benzene are present as amine A1, in particular in a weight ratio of isophoronediamine to 1,3-bis(aminomethyl)benzene of 50 / 50 to 90 / 10, preferably 60 / 40 to 80 / 20.

5. Hardener according to one of claims 1 to 4, characterized in that m and n both represent 0.

6. Hardener according to one of claims 1 to 4, characterized in that m and n both represent 1 and R 1 and R 2 represents a radical selected from the group consisting of methyl, methoxy, ethyl, ethoxy, propyl, isopropyl, butyl, tert-butyl, pentyl, allyl, hydroxyl and linear aliphatic C15H25-31 hydrocarbon radicals.

7. Hardener according to one of claims 1 to 6, characterized in that the weight ratio between the diphenolic acid of the formula (I) and the amine A1 is in the range from 0.025 to 0.5, preferably 0.05 to 0.

25.

8. Hardener according to one of claims 1 to 7, characterized in that at least one thinner is present, in particular selected from the group consisting of benzyl alcohol, styrenated phenol, ethoxylated phenol, ethoxylated benzyl alcohol, phenol-containing aromatic hydrocarbon resins, diisopropylnaphthalene, isopropylbiphenylene and cardanol.

9. Hardener according to claim 8, characterized in that the weight ratio between the thinner and the amine A1 is in the range from 0.15 to 1.5, preferably 0.3 to 1.

2.

10. Hardener according to claim 8, characterized in that based on the total hardener - 30 to 80% by weight of amine A1, - 1 to 10% by weight of diphenolic acid of formula (I), and 10 to 60% by weight of thinner are contained. Hardener according to one of claims 1 to 10, characterized in that, based on the total hardener, 0.5 to 9% by weight, preferably 1 to 5% by weight, of water are contained. Epoxy resin composition comprising - a resin component comprising at least one epoxy resin and - a hardener component comprising the hardener according to any one of claims 1 to 11. The epoxy resin composition according to any one of claims 11 or 12, characterized in that it contains at least one further constituent selected from surface-active additives, fillers, and pigments. A cured composition obtained from the epoxy resin composition according to any one of claims 11 to 13 after mixing the resin and hardener components. Use of the composition according to any one of claims 11 to 14 as a coating, primer, adhesive, sealant, potting compound, casting resin, or impregnating resin.

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