Connection of components

Abstract

The invention relates to a method for connecting a first component (2) to a second component (3), said method comprising: a) providing the first component (2) and the second component (3); b) bringing the first component (2) and the second component (3) together; and c) heating, wherein, by means of steps b) and c), a secondary region (10) of the surface of the first component (2) and a secondary region (10) of the surface of the second component (3) are connected to one another via a connecting substance (9), and contact regions (8) of the surface (4) of the first component (2) and contact regions (8) of the surface (5) of the second component (3) are connected to one another in pairs via a plurality of nanowires (7).

Description

[0001] Connecting components

[0002] The invention relates to a method for connecting two components and a corresponding arrangement of two interconnected components. The invention can be used in particular in the technical field of electronics to electrically and / or thermally connect electronic components to one another.

[0003] Hybrid bonding is a well-known method for connecting two components, particularly in the technical field of electronics. In this process, contacts, for example made of copper, are applied to both components to be joined, and the gaps between the contacts are filled with an adhesive. When the two components are brought together, the contacts of the components come into contact with each other in pairs. The adhesive bonds the components together. This creates a mechanically stable connection that secures the components. Annealing is then performed. This process heats the components so that the contacts also bond with each other.

[0004] Hybrid bonding has the disadvantage that the components are exposed to a comparatively high temperature for a comparatively long time during annealing. Temperature-sensitive components such as semiconductor chips can be damaged as a result. Furthermore, annealing requires particularly high levels of contact surface cleanliness. A speck of dust between two contacts can prevent the two contacts from being connected as desired by annealing. Therefore, hybrid bonding is usually performed under strict cleanroom conditions. In particular, transporting the components from one cleanroom to another at a different location between the application of the contacts and the joining of the contacts is generally avoided.

[0005] Furthermore, fusion bonding, for example, which is regularly performed as part of hybrid bonding, requires a particularly smooth surface on the components to be joined. In addition to cleanroom conditions, this often requires additional polishing steps, such as chemical mechanical polishing (CMP). These steps are complex and expensive. In particular, the often required cleaning of the surfaces after polishing is expensive. In general, the effort required for hybrid bonding is comparatively high.

[0006] As an alternative to hybrid bonding, numerous other methods are known for connecting components, particularly in the technical field of electronics. Compared to hybrid bonding, however, these methods have the disadvantage that the contact surfaces of the components to be connected must be comparatively large and / or arranged relatively far apart. Thus, a comparatively large pitch is required. This is the case, for example, with wire bonding. Such methods are generally less precise than hybrid bonding.

[0007] Even outside the technical field of electronics, there are applications where two components need to be joined together, and where the known methods have similar disadvantages. This applies, for example, to precision mechanical components.

[0008] The object of the present invention is to connect two components together in a simple, precise, and gentle manner. Furthermore, an arrangement of such interconnected components is to be presented.

[0009] These objects are achieved by the method and arrangement according to the independent claims. Further advantageous embodiments are specified in the dependent claims. The features presented in the claims and in the description can be combined with one another in any technologically expedient manner.

[0010] According to the invention, a method for connecting a first component to a second component is presented. The first component and the second component each have a surface with a plurality of electrically conductive contact regions, which are arranged at a distance from one another and are electrically insulated from one another. The method comprises: a) providing the first component, wherein a respective plurality of electrically conductive nanowires is located on the surface of the first component in the contact regions, and providing the second component, wherein a connecting substance is located on the surface of the second component outside the contact regions in a secondary region, wherein the connecting substance is suitable for connecting the components to one another via the connecting substance, b) bringing the first component and the second component together, so that

[0011] ■ the nanowires in the contact areas of the surface of the first component come into contact with one of the contact areas of the surface of the second component, and

[0012] ■ a connection to a secondary region of the surface of the first component is formed with the connecting substance on the second component, wherein the secondary region of the surface of the first component is arranged outside the contact regions of the surface of the first component, c) heating at least the nanowires and the contact regions of the surface of the second component to a temperature of at least 90°C, and / or

[0013] Acting by means of plasma activation at least on the nanowires and the contact regions of the surface of the second component, wherein by steps b) and c) the contact regions of the surface of the first component and the contact regions of the surface of the second component are connected to one another in pairs via a respective plurality of nanowires.

[0014] The method can be used to connect two components together. The components are preferably electronic components. For example, a circuit board as the first component can be connected to a semiconductor chip as the second component, or vice versa. However, the method only concerns the connection between the components. The advantages of the method described here can therefore be achieved regardless of the design of the components. Whether the components fall under the definition of electronic components or not is irrelevant. If two components are to be connected to each other in a technical field outside of electronics, the described method can also be used for this purpose.

[0015] The process can be used, in particular, to mechanically connect the components. After the process is completed, the components therefore hold firmly together. In addition, the process creates multiple electrically conductive connections between the components. These are independent of one another, i.e., electrically separated. For example, a computer chip with multiple pins, as the first component, can be connected via a corresponding number of electrically conductive connections to a circuit board with a corresponding number of contacts, as the second component, or vice versa. The components can also be thermally conductively connected to one another using the process. In particular, the electrically conductive connections can also be thermally conductive.

[0016] Electrical and / or thermal conductivity in the sense used here is particularly present in metals such as copper, which are generally referred to as "electrically conductive" or synonymously as "electrically conductive" or "thermally conductive" or "thermally conductive." In particular, materials generally considered to be electrically or thermally insulating should not be considered electrically or thermally conductive here.

[0017] The first component and the second component each have a surface with a plurality of electrically conductive contact regions, which are arranged at a distance from one another and are electrically insulated from one another. The first component thus has a surface with a plurality of electrically conductive contact regions, wherein the electrically conductive contact regions of the surface of the first component are arranged at a distance from one another and are electrically insulated from one another. The second component has a surface with a plurality of electrically conductive contact regions, wherein the electrically conductive contact regions of the surface of the second component are arranged at a distance from one another and are electrically insulated from one another.

[0018] Using the described method, the contact areas of the surface of the first component and the contact areas of the surface of the second component can be electrically conductively connected to one another in pairs. Connecting the contact areas in pairs means that a first contact area of ​​the surface of the first component is connected to a first contact area of ​​the surface of the second component, a second contact area of ​​the surface of the first component is connected to a second contact area of ​​the surface of the second component, and so on. In general, an nth contact area of ​​the surface of the first component is connected to an nth contact area of ​​the surface of the second component, which applies to all n between 1 and the total number of contact areas per component. Each contact area of ​​the first component is therefore assigned exactly one of the contact areas of the second component, and vice versa.The fact that the contact areas are connected in pairs implies that the same number of contact areas is used on both components for the process. It also implies that the contact areas of the two components are positioned and dimensioned accordingly.

[0019] In step a) of the process, the first component and the second component are provided. On the surface of the first component provided in this process, a plurality of electrically conductive nanowires are located in the contact areas. On the surface of the second component provided in step a), a connecting substance is located outside the contact areas in a secondary area. After completion of step a), the first component and the second component are thus available in the described form for the further process.

[0020] The term "secondary area" was chosen to linguistically differentiate it from the contact areas. The secondary area can be considered subordinate to the contact areas in that the secondary area only serves to electrically connect the components. Alternatively, the contact area could also be neutrally referred to as a first-type area, or the contact areas as first-type areas, and the secondary area as a second-type area, or the secondary areas as second-type areas.

[0021] A nanowire is understood here to be any material body that has a wire-like shape and a size in the range from a few nanometers to a few micrometers. A nanowire can, for example, have a circular, oval, or polygonal base area. In particular, a nanowire can have a hexagonal base area. The nanowires preferably have a length in the range of 100 nm (nanometers) to 100 μm (micrometers), in particular in the range of 500 nm to 30 μm. Furthermore, the nanowires preferably have a diameter in the range of 10 nm to 10 μm, in particular in the range of 30 nm to 2 μm. The term "diameter" refers to a circular base area; if the base area differs from this, a comparable definition of a diameter must be applied. It is particularly preferred that all nanowires used have the same length and diameter.

[0022] The fact that the first component is provided in step a) can be achieved by configuring the first component as described before the start of the method. In this case, the nanowires are already arranged in the contact regions of the surface of the first component on the surface of the first component before the start of the method. This is possible, for example, by purchasing an appropriately prepared component from a supplier. Alternatively, the first component can also be configured as described as part of the method. In this case, in step a), the plurality of nanowires can be provided in the contact regions of the surface of the first component on the surface of the first component. This is possible, for example, by galvanic growth.

[0023] The fact that the second component is provided in step a) can be achieved by configuring the second component as described before the start of the method. In this case, the bonding substance is already arranged on the surface of the second component in the adjacent region of the surface of the second component before the start of the method. This is possible, for example, by purchasing an appropriately prepared component from a supplier. Alternatively, the second component can also be configured as described as part of the method. In this case, the bonding substance can be provided on the surface of the second component in step a) in the adjacent region of the surface of the second component.

[0024] The connecting substance is suitable for connecting the components to one another via the connecting substance. For example, the connecting substance can be an adhesive, in particular a PI adhesive. However, the described method is not limited to the use of an adhesive. The components can also be connected to one another using other substances that do not fall under the definition of an adhesive. For example, the connecting substance can be an oxide such as silicon oxide. If the surface in the secondary region is formed from an oxide, the oxide used as the connecting substance can be connected to the surface by fusion bonding. It is therefore preferred that the connecting substance is an oxide, that the surface of the first component in the secondary region is formed from an oxide and / or that the surface of the second component in the secondary region is formed from an oxide.

[0025] It is sufficient for the components to initially hold together weakly via the bonding substance. This can be considered a preliminary bond. In the case of an oxide such as silicon oxide, such a bond may already be formed before fusion bonding. As the process continues, the bond created with the bonding substance can be further strengthened. This can be achieved, particularly in the case of an oxide such as silicon oxide as the bonding substance, through fusion bonding.

[0026] It is sufficient that the bonding substance is arranged in the secondary region of the second component provided in step a). After step a), there is preferably no bonding substance on the first component that falls under the definition of the term bonding substance used herein. This simplifies the process in that the bonding substance does not have to be applied to the first component as well. The bonding substance then only comes into contact with the first component in step b). Alternatively, however, the bonding substance can also be arranged in the corresponding secondary region in both the first component provided in step a) and the second component provided in step a). In step b), the bonding substance on the second component then comes into contact with the bonding substance on the first component.

[0027] The first component provided in step a) has multiple contact areas, and the second component provided in step a) has multiple contact areas and a secondary area. During the course of the method, a secondary area is also formed on the surface of the first component at the latest. It is sufficient for the first component and the second component to each have exactly one secondary area. In this case, the secondary area of ​​the first component and the secondary area of ​​the second component form a pair. This case will be discussed below. However, it is also possible for the first component and the second component to each have several separate secondary areas. In this case, there are several pairs, each consisting of a secondary area of ​​the first component and a secondary area of ​​the second component. For these, what has been said here for the exactly one pair of secondary areas applies accordingly.

[0028] In step b), the two components are brought together. First, the nanowires in the contact areas of the surface of the first component each come into contact with one of the contact areas of the surface of the second component. At the latest at the end of the process, the contact areas of the surface of the first component and the contact areas of the surface of the second component are connected to each other in pairs via a respective plurality of nanowires. At the latest at the end of the process, a first contact area of ​​the surface of the first component is connected to a first contact area of ​​the surface of the second component via a first plurality of nanowires, a second contact area of ​​the surface of the first component is connected to a second contact area of ​​the surface of the second component via a second plurality of nanowires, and so on.In general, at the end of the process at the latest, an n-th contact area of ​​the surface of the first component is connected to an n-th contact area of ​​the surface of the second component via an n-th plurality of nanowires, which applies to all n between 1 and the total number of contact areas per component.

[0029] The nanowires each have two ends. A respective first end of the nanowires is preferably firmly connected to the surface of the first component in the corresponding contact area of ​​the surface of the first component at the latest by the end of step a). A respective second end of the nanowires comes into contact with the surface of the second component in the corresponding contact area of ​​the surface of the second component by step b). Preferably, the respective first end of the nanowires is perpendicular to the surface of the first component and / or the respective second end of the nanowires is perpendicular to the surface of the second component. However, it is not important that the nanowires be arranged precisely as described in this paragraph. In particular, it does not pose a problem for the described method if nanowires have grown unevenly and are not all oriented in the same way, as is often the case in practice.

[0030] The nanowires on the first component are arranged in the contact regions of the surface of the first component. The nanowires are already connected to the surface of the first component by the end of step a) at the latest. This can be achieved, for example, by growing the nanowires in step a) or before the start of the process by galvanic growth in the contact regions of the surface of the first component onto the surface of the first component. However, it is also conceivable that the nanowires are first produced separately in step a) or before the start of the process, for example by galvanic growth, and then transferred to the surface of the first component so that the nanowires in the contact regions of the surface of the first component are connected to the surface of the first component. The nanowires are preferably made of the same material as the surface of the first component in the contact regions.This allows the nanowires to adhere particularly well to the surface of the first component. Preferably, the nanowires and the surface of the first component are each formed from a metal, in particular copper, in the contact regions. The contact regions of the surface of the first component are defined in particular by the fact that the nanowires are arranged in these regions at the latest by the end of step a). However, the fact that the contact regions of the surface of the first component are arranged spaced apart from one another and are electrically insulated also implies that the surface of the first component between the contact regions is formed from a different, electrically insulating material. In this respect, the contact regions of the surface of the first component can already be identified as such before the nanowires are grown.

[0031] After step b), the nanowires in the contact areas of the surface of the second component are in contact with the surface of the second component. This may be a loose contact. This means that the nanowires are touching the surface of the second component but are not yet firmly connected to it. In this case, such a firm connection is only created later in the process. However, it cannot be ruled out that the nanowires are already connected to the surface of the second component at the end of step b). In this case, this connection is strengthened later in the process.

[0032] The contact areas of the surface of the second component are defined in particular by the fact that the nanowires are in contact with the surface of the second component in this area at the latest at the end of step b). However, the fact that the contact areas of the surface of the second component are spaced apart from one another and electrically insulated also implies that the surface of the second component between the contact areas is formed from a different, electrically insulating material. In this respect, the contact areas of the surface of the second component can already be recognized as such before the nanowires come into contact with the surface of the second component in step b).

[0033] The nanowires are preferably made of the same material as the surface of the second component in the contact areas. This allows the nanowires to adhere particularly well to the surface of the second component. Preferably, the nanowires and the surface of the second component in the contact areas are each made of a metal, in particular copper.

[0034] Second, the bonding substance on the second component forms a connection between the secondary area of ​​the surface of the first component and a secondary area of ​​the surface of the first component. If the bonding substance is an adhesive, this connection is an adhesive bond. If the bonding substance is an oxide such as silicon oxide and the corresponding surface in the secondary area is formed from an oxide, this connection is an oxide bond.

[0035] If the connecting substance is arranged in the secondary region only on the second component provided in step a), but not on the first component provided in step a), the connection is formed only with this connecting substance.

[0036] The bonding substance on the second component is arranged in the secondary region of the surface of the second component. The bonding substance is already bonded to the surface of the second component at the latest by the end of step a). This can be achieved, for example, by applying the bonding substance to the surface of the second component in step a) or before the start of the method in the secondary region of the surface of the second component. The secondary region of the surface of the second component is defined by the bonding substance being arranged in this region at the latest by the end of step a). Furthermore, the secondary region of the surface of the second component does not have to be recognizable as a separate region. The latter is also possible, however, for example by forming the surface of the second component from a different material in the secondary region than outside the secondary region.In particular, the secondary region can be formed by the part of the surface of the second component that does not belong to any of the contact regions of the second component. The contact regions can be electrically insulated from one another by the surface of the second component being electrically insulating in the secondary region.

[0037] After step b) at the latest, the bonding substance in the adjacent area of ​​the surface of the first component is in contact with the surface of the first component. To this extent, the two components can be bonded to each other via the bonding substance.

[0038] If the bonding substance is an adhesive, the adhesive can cure at any time after step b). The fact that the adhesive is not already cured when the two components are joined in step b) is, of course, due to the fact that an adhesive bond is formed.

[0039] The secondary region of the surface of the first component is defined by the fact that the bonding substance is in contact with the surface of the first component in this region at the end of step b) at the latest. Furthermore, the secondary region of the surface of the first component does not have to be recognizable as a separate region. In particular, the secondary region of the surface of the first component does not have to be recognizable as such before step b). It is sufficient that the secondary region of the surface of the first component is formed by the bonding substance coming into contact with this part of the surface of the first component in step b). However, it is also possible for the secondary region of the surface of the first component to be recognizable as a separate region already before step b), for example by the surface of the first component being made of a different material in the secondary region than outside the secondary region.In particular, the secondary region can be formed by the part of the surface of the first component that does not belong to any of the contact regions of the first component. The contact regions can be electrically insulated from one another by electrically insulating the surface of the first component in the secondary region.

[0040] If the bonding substance is arranged in the corresponding secondary region of both the first component provided in step a) and the second component provided in step a), a mechanical connection to a secondary region of the surface of the first component is formed with the bonding substance on the second component, to the extent that the bonding substance on the second component participates in the formation of this connection. Furthermore, the bonding substance on the first component also participates in the formation of this connection.

[0041] Using the described method, the two components can be joined together in two ways. Firstly, a connection between the components can be created using the bonding substance. If an adhesive is used as the bonding substance, it is sufficient for the adhesive to cure after step b). Secondly, multiple nanowire connections can be created between the components using the nanowires. The nanowire connections are created by step c) at the latest. The connection formed with the bonding substance serves the particular purpose of firmly bonding the two components together so that the two components no longer shift relative to each other until the nanowire connections are finally formed. In this respect, this connection is an aid used during the process. In addition, this connection also serves the purpose of permanently mechanically bonding the two components together.In this respect, this connection serves a purpose even after the process is completed. In addition to the bond formed by the bonding substance, the two components are also mechanically connected by the nanowire connections.

[0042] In step c), at least the nanowires and the contact areas of the surface of the second component are heated to a temperature of at least 90°C, in particular of at least 170°C, and / or at least the nanowires and the contact areas of the surface of the second component are acted upon by means of plasma activation. The "and" case is preferred. In this case, the heating can result from the plasma activation and / or be achieved by an additional heating measure.

[0043] Through heating and / or exposure to plasma activation, the nanowires bond to the surface of the second component—if not already bonded. It was previously described that after step b), only loose contact may exist between the nanowires and the surface of the second component, which can be strengthened during the further course of the process. This strengthening can be achieved with step c). Through heating and / or exposure to plasma activation, the nanowires and the surface of the second component can bond at the atomic level. The bond can be further strengthened by temporarily pressing the components together.

[0044] By step c) at the latest, nanowire connections are formed between the contact areas of the first component and the second component. These nanowire connections are particularly strong when the surface of the first component in the contact areas, the nanowires, and the surface of the second component in the contact areas are made of the same material. This is therefore preferred. This material is particularly preferably a metal, in particular copper.

[0045] To connect the nanowires to the surface of the second component, it is sufficient that the nanowires and the contact areas of the surface of the second component are heated in step c). However, it is irrelevant for the formation of this connection whether other parts of the two components are also heated. The simplest way to carry out step c) is to heat the first component and the second component together, for example by placing both components in an oven together. For the action via plasma activation in step c), it is sufficient that the nanowires and the contact areas of the surface of the second component are acted upon by the plasma activation. However, it is irrelevant for the formation of this connection whether other parts of the two components are also exposed to the plasma activation.Step c) can therefore also be performed simply by exposing the first component and the second component together to plasma activation. The plasma used for plasma activation can be used to activate both the nanowires and, for example, an oxide on the contact surfaces. The latter can be used to form oxide-oxide bonds.

[0046] A comparatively low temperature is sufficient for the heating in step c). Satisfactory results can be achieved at as little as 90°C. In particular, for the described process, heating to a temperature that is considerably lower than the temperatures typically required for hybrid bonding is sufficient. Furthermore, it is sufficient for the heating in step c) to be brief. In particular, for the described process, heating over a period of time that is considerably shorter than the periods typically required for hybrid bonding is sufficient.

[0047] In steps b) and c), the two components are connected to each other via the nanowires and the connecting substance. Steps b) and c) are therefore carried out in such a way that, in addition to the connection formed with the connecting substance, several nanowire connections are created between the surface of the first component and the surface of the second component.

[0048] The heating in step c) is preferably carried out to a temperature of 90 to 300°C, in particular to 170°C. Preferably, the temperature of the two components is below 300°C, in particular below 200°C, throughout the entire process.

[0049] The heating in step c) is preferably carried out for a period of 1 to 10 minutes, in particular 2 minutes. Preferably, the temperature of the two components is not above a value of 50°C for more than 10 minutes during the entire process.

[0050] Regardless of the actual temperature selected and the actual heating time, the described process is advantageous, especially compared to hybrid bonding. In general, the nanowires bond better to the surface of the second component than, for example, solid metal contacts bond together in hybrid bonding. Heating a solid metal contact to a desired temperature requires a greater heat input than is the case with a nanowire. This corresponds to a higher temperature and / or a longer heating time. The described process is therefore particularly gentle, especially compared to hybrid bonding.

[0051] Furthermore, the described process is particularly simple, especially compared to hybrid bonding. It has been found that the cleanroom requirements for the described process are lower and easier to maintain. This is primarily due to the use of nanowires. While a speck of dust, for example, can prevent contact between two contacts in hybrid bonding, this is only the case for the directly affected nanowires in the described process. The nanowires adjacent to the speck of dust can still form the connection.

[0052] The described method is particularly precise, especially compared to alternative methods to hybrid bonding. Conventional methods often only allow the connection of relatively large and / or relatively widely spaced contacts. In the described method, however, the contact areas can be made particularly small and / or arranged very close together. This is possible thanks to the bonding substance, which allows the two components to be firmly bonded together before the nanowire connections are formed.

[0053] In a preferred embodiment of the method, the contact areas of the surface of the first component are raised relative to the secondary area of ​​the surface of the first component.

[0054] The nanowires can have a negligible length compared to the size of the connecting substance. Due to the raised contact areas, the nanowires can still connect the surfaces of the two components. Particularly in the described embodiment, the surface of the second component can be flat.

[0055] The contact areas of the surface of the first component can be raised above the adjacent area of ​​the surface of the first component by forming the contact areas of the surface on a respective contact that is placed on the remaining first component. The contact can be a metal pad, for example. In such a case, the metal pad is considered part of the first component. The surface of the first component is thus formed in the area of ​​the metal pad by the surface of the metal pad.

[0056] There are numerous alternatives to the described embodiment. For example, it is conceivable that the secondary area of ​​the second component is recessed and the surface of the first component is flat.

[0057] In a further preferred embodiment of the method, in the second component provided in step a), the surface in the contact regions is metallized with a metallization layer, wherein the metallization layer also extends at least partially over a lateral edge of the connecting substance on the second component.

[0058] The nanowires can bond particularly well to a metal. This is especially true if the nanowires are also made of a metal, especially if the nanowires and the metallization layer are made of the same metal. The metallization layer can enable the electrical conductivity of the surface of the second component in the contact areas.

[0059] As a further aspect of the invention, an arrangement is presented. The arrangement comprises a first component and a second component, wherein the first component and the second component each have a surface with a secondary region and a plurality of electrically conductive contact regions formed outside the secondary region, wherein the contact regions are each arranged at a distance from one another and are electrically insulated from one another, and wherein the first component and the second component are connected to one another by

[0060] - the contact areas of the surface of the first component and the contact areas of the surface of the second component are connected to each other in pairs via a respective plurality of nanowires, and

[0061] - the secondary region of the surface of the first component and the secondary region of the surface of the second component are connected to one another via a connecting substance. The described advantages and features of the method are applicable and transferable to the arrangement, and vice versa. The method is preferably configured for producing the arrangement. The arrangement is preferably produced using the method.

[0062] In a preferred embodiment of the arrangement, the contact areas of the surface of the first component each border the secondary area of ​​the surface of the first component and / or the contact areas of the surface of the second component each border the secondary area of ​​the surface of the second component. The "and" case is preferred.

[0063] In this embodiment, the surfaces of both components can be used particularly efficiently.

[0064] The invention is explained in more detail below with reference to the figures. The figures show a particularly preferred embodiment, to which the invention is not limited, however. The figures and the proportions depicted therein are merely schematic. They show:

[0065] Fig. 1: a first component and a second component which can be connected to one another by a method according to the invention, so that an arrangement according to the invention is formed,

[0066] Fig. 2: the arrangement according to the invention, which can be obtained with the components from Fig. 1.

[0067] Fig. 1 shows a first component 2 and a second component 3. The two components 2, 3 are intended to be connected to each other.

[0068] In three contact regions 8 of a surface 4 of the first component 2, a plurality of nanowires 7 is located on the surface 4 of the first component 2. In a secondary region 10 of a surface 5 of the second component 3, a connecting substance 9 is located on the surface 5 of the second component 3. Outside the plane of the drawing, the parts of the secondary region 10 of the surface 4 of the second component 2, which can be seen in Fig. 1, are connected to one another, so that a coherent secondary region 10 is formed. Between the contact regions 8 of the surface 4 of the first component 2, the surface 4 of the first component 2 has a secondary region 10. Outside the plane of the drawing, the parts of the secondary region 10 of the surface 4 of the first component 2, which can be seen in Fig. 1, are connected to one another, so that a coherent secondary region 10 is formed.In this region, a connecting substance 9 located on the second component 3 can be brought into contact with the surface 4 of the first component 2. Between the visible parts of the secondary region 10 of the surface 5 of the second component 3, the surface 5 of the second component 3 has three contact regions 8. In these regions, the nanowires 7 on the first component 2 can be brought into contact with the surface 5 of the second component 3. Thus, the components 2, 3 can be connected to one another via the nanowires 7 and the connecting substance 9.

[0069] The contact areas 8 of the surface 4 of the first component 2 are raised relative to the secondary area 10 of the surface 4 of the first component 2 by an elevation 6.

[0070] In the second component 3, the surface 5 in the contact areas 8 is metallized with a metallization layer 11. The metallization layer 11 also extends at least partially over a lateral edge 12 of the connecting substance 9 on the second component 3.

[0071] The surface 4 of the first component 2 is formed from an electrically conductive material in the contact regions 8 of the surface 4 of the first component 2. The nanowires 7 are formed from an electrically conductive material. The surface 5 of the second component 3 is formed from an electrically conductive material in the contact regions 8 of the surface 5 of the second component 3.

[0072] The two components 2 and 3 can be connected to each other using a method which comprises the following steps: a) Providing the components 2, 3 shown in Fig. 1, b) Bringing together the first component 2 and the second component 3, so that

[0073] ■ the nanowires 7 in the contact regions 8 of the surface 4 of the first component 2 come into contact with one of the contact regions 8 of the surface 5 of the second component 3, and ■ a connection to a secondary region 10 of the surface 4 of the first component 2 is formed with the connecting substance 9 on the second component 3, wherein the secondary region 10 of the surface 4 of the first component 2 is arranged outside the contact regions 8 of the surface 4 of the first component 2, c) heating at least the nanowires 7 and the contact regions 8 of the surface 5 of the second component 3 to a temperature of at least 90°C, and / or

[0074] Acting by means of plasma activation at least on the nanowires 7 and the contact regions 8 of the surface 5 of the second component 3, wherein by steps b and c the contact regions 8 of the surface 4 of the first component 2 and the contact regions 8 of the surface 5 of the second component 3 are connected to one another in pairs via a respective plurality of nanowires 7.

[0075] Fig. 2 shows an arrangement 1 that can be obtained using this method. The arrangement 1 comprises the first component 2 and the second component 3. The first component 2 and the second component 3 each have a surface 4, 5 with a secondary region 10 and a plurality of electrically conductive contact regions 8 formed outside the secondary region 10. The contact regions 8 are each arranged at a distance from one another and are electrically insulated from one another. The first component 2 and the second component 3 are connected to one another by

[0076] - the contact regions 8 of the surface 4 of the first component 2 and the contact regions 8 of the surface 5 of the second component 3 are connected to each other in pairs via a respective plurality of nanowires 7, and

[0077] - the secondary region 10 of the surface 4 of the first component 2 and the secondary region 10 of the surface 5 of the second component 3 are connected to one another via a connecting substance 9.

[0078] The contact areas 8 of the surface 4 of the first component 2 each border on the secondary area 10 of the surface 4 of the first component 2, and the contact areas 8 of the surface 5 of the second component 3 each border on the secondary area 10 of the surface 5 of the second component 3. List of reference symbols

[0079] 1 arrangement

[0080] 2 first component 3 second component

[0081] 4 Surface of the first component

[0082] 5 Surface of the second component

[0083] 6 Survey

[0084] 7 Nanowires 8 Contact area

[0085] 9 Connecting substance

[0086] 10 Side area

[0087] 11 Metallization

[0088] 12 side edge

Claims

Claims Method for connecting a first component (2) to a second component (3), wherein the first component (2) and the second component (3) each have a surface (4, 5) with a plurality of electrically conductive contact regions (8) which are arranged at a distance from one another and are electrically insulated from one another, and wherein the method comprises: a) providing the first component (2), wherein a respective plurality of electrically conductive nanowires (7) is located on the surface (4) of the first component (2) in the contact regions (8), and providing the second component (3), wherein a connecting substance (9) is located on the surface (5) of the second component (3) outside the contact regions (8) in a secondary region (10), wherein the connecting substance (9) is suitable for connecting the components (2, 3) to one another via the connecting substance (9), b) bringing together the first component (2) and the second component (3) so that ■ the nanowires (7) in the contact areas (8) of the surface (4) of the first component (2) come into contact with one of the contact areas (8) of the surface (5) of the second component (3), and ■ a connection to a secondary region (10) of the surface (4) of the first component (2) is formed with the connecting substance (9) on the second component (3), wherein the secondary region (10) of the surface (4) of the first component (2) is arranged outside the contact regions (8) of the surface (4) of the first component (2), c) heating at least the nanowires (7) and the contact regions (8) of the surface (5) of the second component (3) to a temperature of at least 90°C, and / or Acting by means of plasma activation at least on the nanowires (7) and the contact areas (8) of the surface (5) of the second component (3), wherein, by steps b) and c), the contact regions (8) of the surface (4) of the first component (2) and the contact regions (8) of the surface (5) of the second component (3) are connected to one another in pairs via a respective plurality of nanowires (7).

2. Method according to claim 1, wherein the contact regions (8) of the surface (4) of the first component (2) are raised relative to the secondary region (10) of the surface (4) of the first component (2).

3. Method according to one of the preceding claims, wherein in the second component (3) provided in step a), the surface (5) in the contact regions (8) is metallized with a metallization layer (11), wherein the metallization layer (11) also extends at least partially over a lateral edge (12) of the connecting substance (9) on the second component (3).

4. Arrangement (1) comprising a first component (2) and a second component (3), wherein the first component (2) and the second component (3) each have a surface (4, 5) with a secondary region (10) and a plurality of electrically conductive contact regions (8) formed outside the secondary region (10), wherein the contact regions (8) are each arranged at a distance from one another and are electrically insulated from one another, and wherein the first component (2) and the second component (3) are connected to one another by - the contact regions (8) of the surface (4) of the first component (2) and the contact regions (8) of the surface (5) of the second component (3) are connected to one another in pairs via a respective plurality of nanowires (7), and - the secondary region (10) of the surface (4) of the first component (2) and the secondary region (10) of the surface (5) of the second component (3) are connected to one another via a connecting substance (9).

5. Arrangement (1) according to claim 4, wherein the contact regions (8) of the surface (4) of the first component (2) each adjoin the secondary region (10) of the surface (4) of the first component (2) and / or the contact regions (8) of the surface (5) of the second component (3) each adjoin the secondary region (10) of the surface (5) of the second component (3).

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