Electrical conductor device and method for producing an electrical conductor device
Patent Information
- Application Number
- EP2024700968
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-02-15
- Filing Date
- 2024-01-16
- Publication Date
- 2025-12-24
AI Technical Summary
Existing electrical conductor devices face challenges in providing effective shielding and electromagnetic wave transport, particularly at higher frequencies, due to the mismatch in expansion coefficients between packages and circuit boards, leading to increased radiation losses and undesirable couplings between high-frequency transmission channels.
The electrical conductor device features a conductor unit with a predetermined pattern of contacts forming a continuous contact path area, which includes soldering points and soldering material, creating a dense and closed metallic plane for improved shielding and reduced radiation losses, while maintaining a consistent height between components to minimize inhomogeneities and enhance electromagnetic compatibility.
This configuration significantly improves electromagnetic shielding and transport properties by reducing radiation escape and couplings between high-frequency channels, maintaining efficient signal transmission with reduced losses, even at higher frequencies, without requiring special housing designs.
Smart Images
Figure EP2024050847_22082024_PF_FP
Abstract
Description
[0001] Description
[0002] title
[0003] Electrical conductor device and method for producing an electrical conductor device
[0004] The present invention relates to an electrical conductor device and a method for producing an electrical conductor device.
[0005] State of the art
[0006] Currently, ball grid array (BGA) or land grid array (LGA) packages can be used for high-frequency chips. BGA packages are typically used for very large chips, while LGA packages can be used for smaller first-level packages for automotive applications. However, larger packages can also be used for industrial applications.
[0007] It should be noted that different expansion coefficients of the packages relative to the conductor device (circuit board) may be possible within an operating temperature range.
[0008] Typically, a galvanic approach with shielding / shielding ring (on the conductor device) and an electromagnetic approach using high-frequency antennas (launchers) on / in the first-level package can be used for high-frequency transmission.
[0009] EP 1 722 614 B1 describes a printed circuit board and a method for its production. Disclosure of the invention
[0010] The present invention provides an electrical conductor device according to claim 1 and a method for producing an electrical conductor device according to claim 10.
[0011] Preferred further training is the subject of the subclaims.
[0012] Advantages of the invention
[0013] The idea underlying the present invention is to provide an electrical conductor device and a method for producing an electrical conductor device, wherein shielding properties of contact areas (for example at interfaces and / or transitions) can be improved.
[0014] According to the invention, the electrical conductor device comprises a conductor unit having a top side and an arrangement of conductor contacts on the top side, wherein the arrangement corresponds to a predetermined pattern and forms a contact path region along a region of the predetermined pattern; an electronic component having soldering points and soldering material on a bottom side of the electronic component, wherein the soldering points can be placed onto the conductor contacts with the soldering material, wherein the soldering points placed onto the conductor contacts form a contact point with the soldering material running along the contact path region.
[0015] Advantageously, a so-called first-level package with improved electromagnetic (EM / EMC) shielding properties and improved EM wave transport properties can be achieved.
[0016] For example, integrated circuits such as high-frequency ICs can be used as electronic components, for example, for radio technology, communications, sensing, radar, and other applications. According to the invention, it can be achieved that even for higher frequencies (with a shorter wavelength), the contact point surrounding the high-frequency transport path (this can comprise one or more sub-areas) can provide shielding, advantageously a shield that is as homogeneous and closed or dense as possible.
[0017] In this way, an influence according to the usual distances in the ball solder joint array and the height between the components and the resulting openings, in which high-frequency radiation can then escape or be radiated in the usual way, can be reduced or avoided.
[0018] The occurrence of unwanted coupling between adjacent high-frequency transmission channels in a package can then be reduced or avoided.
[0019] Furthermore, a transport loss that usually occurs at higher frequencies can be reduced, since the (ball) contacts surrounding the high-frequency transport path (usually at ground potential) no longer represent a homogeneous waveguide, which can, however, be reduced by the continuous contact area of the invention.
[0020] Since openings are usually created with spaced contacts, determined by the distance between the contacts and the height between the components (between the conductor device and the electronic device, which can be referred to as "stand offs"), and as a result the electromagnetic wave can no longer propagate homogeneously, this can lead to increased transport losses.
[0021] According to the invention, it can advantageously be achieved that the effect and occurrence of such inhomogeneities can be eliminated or reduced, which can lead to improved shielding and transmission behavior in ball grid arrangements. The conductor unit can comprise a printed circuit board or circuit card, and the electronic component can comprise a chip, an encapsulation with an interposer and the solder joints and solder material on an underside of the electronic component. The interposer can be a distribution plane (usually also a printed circuit card that is molded into the chip housing). The interposer can be used to wire a chip / semiconductor contact area to the larger BGA / LGA layout (ball or land grid array).
[0022] The electronic component can have the chip in the middle or in a central region of the encapsulation and / or the interposer, wherein on the underside of the interposer the region with the soldering points can extend beyond the area of the chip or can be arranged only outside the chip area.
[0023] The conductor contacts may comprise coaxial lines and / or microstrip lines, which may run on and / or through the conductor unit.
[0024] Typically, closed or semi-open solder (ring) profiles are not implemented beyond a contact area, such as a ball contact; a U-shape, for example, is unusual. According to the invention, this limitation can be eliminated for contact points, advantageously in ball contact arrays. Radiation from the electronic component into neighboring components, as well as radiation coupling, can be reduced or avoided, as the shielding effect can be improved. Shielding and RF transport properties can also be significantly improved.
[0025] For the solder joints and the solder material, such as the balls in a ball grid arrangement, a specific spacing between the solder joints (such as the balls) and a thickness of these solder joints (such as the balls) can be provided. The contiguous contact area and the contact point extending therefrom can provide improved shielding and reduce unwanted coupling to neighboring RF connections on the package. According to a preferred embodiment of the electrical conductor device, the conductor unit comprises a printed circuit board or a printed circuit board.
[0026] The circuit board can be a printed circuit board (PCB).
[0027] According to a preferred embodiment of the electrical conductor device, the conductor contacts represent a ball grid arrangement.
[0028] The ball grid array can have predetermined spacing, which can affect both the conductor contacts as land contacts on the conductor unit and the solder joints as mating contacts on the electronic component. These mating contacts can then represent so-called ball contacts with the solder material in a spherical shape. The ball contacts and the conductor contacts can have a specific radius.
[0029] According to a preferred embodiment of the electrical conductor device, the contact point consists of the solder material and forms a continuous contact wall between the top side of the conductor unit and the bottom side of the electronic component and has electromagnetic shielding properties.
[0030] According to a preferred embodiment of the electrical conductor device, the predetermined pattern is a grid arrangement and the area of the predetermined pattern forms a completely closed or open rectangle for the contact area.
[0031] The contact area can, for example, have a U-shape and can laterally surround the soldering points of the electronic component, at least in some areas.
[0032] According to a preferred embodiment of the electrical conductor device, the region of the predetermined pattern for the contact pattern area forms an open rectangle and has an opening on a specific side of the conductor unit, wherein the conductor unit comprises a waveguide extending through the opening to the open rectangle or into it. The contact pattern area can achieve an improved shielding effect on its closed side, but can be reduced on the open side, and radiation can be oriented in / from this direction, which can be utilized by an existing waveguide to improve the waveguiding there.
[0033] According to a preferred embodiment of the electrical conductor device, the conductor contacts for the contact area have a smaller surface area than the conductor contacts outside the contact area.
[0034] If all solder joints have the same amount and dimension of solder material, then when the solder joints are placed on the land contacts / conductor contacts, a formation of the contact point running along the contact path area can be achieved, so that less solder material is required per solder joint to create the contact there than for the other contact points outside the contact path area and therefore the path area between the separated or connected conductor contacts and solder joints in the contact path area can be compensated over the area with solder material.
[0035] The ball grid housing for encapsulating the electronic component with an internal chip can advantageously be provided with solder balls. The size of these balls can be varied depending on the solder quantity required.
[0036] Before soldering the components, the circuit board can be wetted with solder and flux only at the points to be soldered. This selective wetting can be prepared by placing a perforated stencil on the circuit board (the thickness of the stencil influences the amount of solder). A solder paste can then be spread over the stencil using a squeegee. The stencil can then be removed and the components (e.g., the ball grid array with the electronic component / BGA) can be placed on the circuit board (with the squeegeed solder deposits). The entire assembly can then be sent to a soldering oven. The height between the electronic component and the conductor unit can advantageously remain the same throughout.
[0037] According to a preferred embodiment of the electrical conductor device, the electronic component is configured to emit and / or receive electromagnetic radiation.
[0038] According to a preferred embodiment of the electrical conductor device, a predetermined distance is maintained between the top side of the conductor unit and the bottom side of the electronic component.
[0039] Overall, the electronic component can be provided with solder joints and solder material in standard dimensions, and with the adapted dimensions of the conductor unit with the conductor contacts, a bridge to the nearest solder joint can be established using standardized soldering processes. The contact point running along the contact area can create a dense and / or closed metallic conductive layer or wall, achieving very good shielding of the RF path. In this way, a shielding ring can be created laterally around the electronic component, at least in part, using a closed or partially open shape, such as a rectangle. This shielding ring can be connected to a ground potential, for example.When an EM wave occurs, the damping and / or transport properties can be improved, whereby no special housings or special designs in the package are required, but are also possible.
[0040] Furthermore, the geometries of the solder joints and / or the conductor contacts (land areas) on the conductor unit and / or the package itself can be adapted to the gap and diameter of the solder joints. Layout adjustments on the conductor unit, including the diameter of the ball contacts (if present), can be made, thus allowing for easy optimization of the bridge connection.According to the invention, the method for producing an electrical conductor device comprises providing a conductor unit having a top side and an arrangement of conductor contacts on the top side, wherein the arrangement corresponds to a predetermined pattern and forms a contact progression region along a region of the predetermined pattern; and providing an electronic component having soldering points and soldering material on a bottom side of the electronic component, wherein the soldering points are placed onto the conductor contacts with the soldering material, wherein a contact point running along the contact progression region is formed with the soldering points placed on the conductor contacts with the soldering material, advantageously during soldering.
[0041] According to a preferred embodiment of the method, the contact point is formed from the solder material and a continuous contact wall is formed between the top side of the conductor unit and the bottom side of the electronic component.
[0042] According to a preferred embodiment of the method, the region of the predetermined pattern for the contact progression region is formed as a completely closed or open rectangle.
[0043] The electrical conductor device can also be characterized by the features and advantages mentioned in connection with the method and vice versa.
[0044] Further features and advantages of embodiments of the invention will become apparent from the following description with reference to the accompanying drawings.
[0045] Short description of the drawings
[0046] The present invention is explained in more detail below with reference to the exemplary embodiments shown in the schematic figures of the drawing.
[0047] 1 shows a schematic representation of a plan view of an upper side of a conductor unit in an electrical conductor device according to an embodiment of the present invention before arranging an electronic component with solder joints;
[0048] Fig. 2 is a schematic representation of the conductor unit from Fig. 1;
[0049] Fig. 3 is a schematic representation of a plan view of a top side of a
[0050] Conductor unit in an electrical conductor device according to another embodiment of the present invention;
[0051] Fig. 4 is a schematic representation of the conductor unit when arranging an electronic component according to an embodiment of the present invention; and
[0052] Fig. 5 is a block diagram of method steps of the method for producing an electrical conductor device according to an embodiment of the present invention.
[0053] In the figures, the same reference symbols denote the same or functionally identical elements.
[0054] Fig. 1 shows a schematic representation of a plan view of an upper side of a conductor unit in an electrical conductor device according to an embodiment of the present invention before arranging an electronic component with solder joints.
[0055] The top view of the upper side 1a of the conductor unit 1 is shown schematically with the pattern of the conductor contacts 2. Furthermore, after subsequent positioning (shown symbolically), the chip of the electronic component 4 is located in an area in the middle above the conductor unit (here only the chip is marked with the symbol "4"). An arrangement of conductor contacts 2 can correspond to a predetermined pattern, which in this case represents a grid. In an inner region of the grid arrangement, a contact progression region KV can be present, which can advantageously form a rectangle. This contact progression region KV is shown only as a trajectory in this case, since a contact wall can only be present along this trajectory after the solder material of the soldering points has run (not shown). In Fig.In Figure 1, the right row of conductor contacts 2 shows what their dimensions (dimensions, radius) might look like without the solder joint material. The remaining conductor contacts 2 shown also show an overlay with the solder joint material, especially in relative size comparison. The solder joints and the conductor contacts can advantageously be a ball grid array.
[0056] The double circles represent a schematic representation of the conductor contacts 2 with the solder joints of the electronic component placed on them. To illustrate the size, a conductor contact 2 is symbolically shown in the right-hand area of the contact path area KV without the sphere of the solder joint. The size dimensions of the double circle representation can also be reversed; in this case, the conductor contact can have a larger radius than the solder joint.
[0057] However, the contact path area KV can also comprise metallic conductors or profiles that can run between the conductor contacts 2 for the contact path area and can better absorb or distribute the running solder material.
[0058] The electronic component 4 can have the chip in the middle or in a central region of the encapsulation and / or the interposer, wherein on the underside of the interposer the region with the soldering points can extend beyond the region of the chip or, as shown in Fig. 1, can be arranged only outside the chip region (interposer and encapsulation are not shown). For the sake of clarity, only the chip is marked in Fig. 1 as part of the electronic component 4; the regions of the encapsulation and / or the interposer with the soldering points above the conductor contacts 2 are also part of the electronic component 4, but are not shown in Fig. 1. Figures 2 and 3 also symbolically show the position of the chip as part of the electronic component 4 above the conductor unit 1.
[0059] Fig. 2 shows a schematic representation of the conductor unit from Fig. 1 .
[0060] Fig. 2 shows how the arrangement of conductor contacts 2 can be configured. The surface area of those conductor contacts 2 in the contact area KV can be smaller than outside the contact area KV in order to ensure sufficient solder material for forming the contact point KS.
[0061] Fig.2 advantageously shows the conductor track structures on the conductor unit 1, which can advantageously be wetted with solder in the manufacturing process, whereby a shadow mask and a squeegee can be used.
[0062] Fig. 3 shows a schematic representation of a plan view of an upper side of a conductor unit in an electrical conductor device according to a further embodiment of the present invention.
[0063] Fig. 3 shows a similar arrangement to the embodiment shown in Fig. 1, but the contact region KV forms a rectangle open on one side, in contrast to Fig. 1, in which the contact region KV forms a closed rectangle. According to Fig. 3, a waveguide WL can further extend in or on the conductor unit 1 from one side into the rectangular area of the contact region KV.
[0064] According to Fig. 3, for example, an RF signal can be routed out of the package via the waveguide WL. The waveguide WL can be a coaxial waveguide, and the contact point can be a solder ring for feeding the waveguide on a circuit board.
[0065] Fig. 4a - d each show a schematic representation of the conductor unit during the arrangement of an electronic component according to an embodiment of the present invention. Figures 4a - 4d show a sequence for placing the electronic component 4 onto the conductor unit 1.
[0066] The conductor unit 1 has a top side 1a with an arrangement of conductor contacts 2 on the top side 1a. According to Fig. 4a, this can be a ball grid arrangement. Solder joints 3 can be formed on the bottom side 4a of the electronic component 4, for example as ball contacts, and can be placed (approximated) on the conductor contacts 2 and on the contact area KV.
[0067] Fig. 4b shows how the soldering points 3 are placed on the conductor contacts 2 (KV) and how soldering of the contacts (Fig. 4c) begins.
[0068] Fig. 4c shows how, as the solder joints are brought closer together and soldered to the conductor unit 1, the solder material can flow along the contact area KV. This can be achieved by using the remaining material of the solder joints as solder contacts, which results from the smaller conductor contact areas. The solder can melt in a soldering furnace and flow as shown in Fig. 4d.
[0069] The contact point KS consists of the solder material and forms a continuous contact wall between the top side 1a of the conductor unit 1 and the bottom side 4a of the electronic component 4, which is shown in Fig. 4d.
[0070] According to Fig. 4d, it is also shown that the contact area KV can also be located on the underside of the electronic component 4. Thus, the contact area KV can be arranged on the electronic component and / or on the conductor unit and can comprise only the soldering points / conductor contacts and / or connecting lines between the adjacent soldering points / conductor contacts.
[0071] Fig. 5 shows a block diagram of method steps of the method for producing an electrical conductor device according to an embodiment of the present invention. In the method for producing an electrical conductor device, a conductor unit is provided S1 with a top side and an arrangement of conductor contacts on the top side, wherein the arrangement corresponds to a predetermined pattern and along a region of the predetermined pattern a
[0072] Contact path area forms; and providing S2 an electronic component, with soldering points and soldering material on a bottom side of the electronic component, wherein the soldering points are placed on the conductor contacts with the soldering material, wherein with the soldering points placed on the conductor contacts with the soldering material a contact path along the
[0073] contact point is formed along the contact path area.
[0074] Although the present invention has been fully described above using the preferred embodiment, it is not limited thereto but can be modified in many ways.
Claims
Claims 1 . Electrical conductor device (100) comprising, - a conductor unit (1) with a top side (1a) and an arrangement of conductor contacts (2) on the top side (1a), wherein the arrangement corresponds to a predetermined pattern and forms a contact progression region (KV) along a region of the predetermined pattern; an electronic component (4) with soldering points (3) and soldering material on a bottom side (4a) of the electronic component (4), wherein the soldering points (3) can be placed onto the conductor contacts (2) with the soldering material, wherein the soldering points (3) placed onto the conductor contacts (2) form a contact point (KS) running along the contact progression region (KV) with the soldering material.
2. Electrical conductor device (100) according to claim 1, wherein the conductor unit (1) comprises a printed circuit card or a printed circuit board.
3. Electrical conductor device (100) according to claim 1 or 2, wherein the conductor contacts (2) represent a ball grid arrangement.
4. Electrical conductor device (100) according to one of claims 1 to 3, wherein the contact point (KS) consists of the soldering material and forms a continuous contact wall between the top side (1a) of the conductor unit (1) and the bottom side (4a) of the electronic component (4) and has electromagnetic shielding properties.
5. Electrical conductor device (100) according to one of claims 1 to 4, wherein the predetermined pattern is a grid arrangement and the area of the predetermined pattern for the contact path area (KV) forms a completely closed or open rectangle.
6. Electrical conductor device (100) according to claim 5, wherein the area of the predetermined pattern for the contact path area (KV) forms an open rectangle and has an opening to a specific side of the conductor unit (1), wherein the conductor unit (1) comprises a waveguide (WL) which extends through the opening to to or into the open rectangle.
7. Electrical conductor device (100) according to one of claims 1 to 6, wherein the conductor contacts (2) for the contact area (KV) have a smaller surface area than the conductor contacts (2) outside the contact area (KV).
8. Electrical conductor device (100) according to one of claims 1 to 7, wherein the electronic component (4) is configured to emit and / or receive electromagnetic radiation.
9. Electrical conductor device (100) according to one of claims 1 to 8, wherein a predetermined distance is maintained between the upper side (1a) of the conductor unit (1) and the lower side (4a) of the electronic component (4).
10. A method for producing an electrical conductor device (100), comprising the steps: - Providing (S1) a conductor unit (1) with a top side (1 a) and an arrangement of conductor contacts (2) on the top side (1 a), wherein the arrangement corresponds to a predetermined pattern and forms a contact progression region (KV) along a region of the predetermined pattern; Providing (S2) an electronic component (4) with soldering points (3) and soldering material on an underside (4a) of the electronic component (4), wherein the soldering points (3) are placed onto the conductor contacts (2) with the soldering material, wherein a contact point (KS) running along the contact area (KV) is formed with the soldering points (3) placed on the conductor contacts (2) with the soldering material.
11. The method according to claim 10, wherein the contact point (KS) is formed from the solder material and a continuous contact wall is formed between the top side (1a) of the conductor unit (1) and the bottom side (4a) of the electronic component (4).
12. The method according to claim 10 or 11, wherein the region of the predetermined pattern for the contact progression region (KV) is formed as a completely closed or open rectangle.