Sleeve with integrated chip
Patent Information
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2026-04-08
AI Technical Summary
The existing production process for booklets like biometric passports requires multiple layers and phases, leading to material wastage, increased energy consumption, and a larger carbon footprint due to the need for separate chip inserts and additional manufacturing steps.
A sleeve with an integrated chip (E-sleeve) that combines a chip carrier, binding layer, and sleeve, reducing the number of layers and production phases by eliminating the need for a separate chip insert and additional gluing steps, using high-quality synthetic materials for the storage media carrier and hot melt adhesive as a compensation layer.
This solution minimizes material usage, reduces production phases, enhances flexibility, increases production capacity, decreases energy consumption, and lowers the carbon footprint by integrating the chip directly into the booklet, resulting in a more efficient and environmentally friendly manufacturing process.
Smart Images
Figure SI2024050020_05122024_PF_FP_ABST
Abstract
Description
[0001] SLEEVE WITH INTEGRATED CHIP
[0002] The subject of the invention is a sleeve with an integrated chip (hereinafter referred to as the »E-sleeve«), which represents the process of optimisation in the production of a booklet, e.g. of a biometric passport, seeing as it reduces the necessary production phases. The unique structure consists of a sleeve, a storage media carrier and a binding layer (hot melt adhesive), which also represents the compensation layer for any unevenness of the storage media and of the antenna.
[0003] Classic inserts are currently being manufactured, meaning that they consist of a chip carrier, a compensation layer and a layer intended to cover said compensation layer which represents an additional phase of the production of the booklet (biometric passport), e.g. manufacturing the book block, glueing the chip insert to the book block, and glueing the sleeve to the book block.
[0004] The sleeve with integrated chip pursuant to the invention enables the use of fewer layers, meaning that less material is also used for the creation of the insert, since it consists of a chip carrier, glue, and sleeve. This is why the production of the booklet (biometric passport) only consists of the manufacturing of the book block and of the glueing of the E-sleeve to the book block, which makes the booklet more flexible.
[0005] These material savings in the installation of the chip into the booklet (biometric passport) and the reduction of the number of booklet (biometric passport) production phases also signifies an increase in the production capacities and a decrease of scrap, which consequently consumes less energy and produces a reduced carbon footprint in the production of the booklet. The details of this invention will be explained on the basis of the implementation example and figures, of which:
[0006] Figure 1 depicts the composition of the E-sleeve
[0007] Figure 2 depicts the cross-section of the composition of the E-sleeve.
[0008] The implementation of the E-sleeve pursuant to the invention enables a unique structure consisting of sleeve A, storage media carrier D and antenna, as well as the electronic storage media C with antenna and binding layer B, which also represents the compensation layer for any unevenness of the storage media and of the antenna. The binding layer B can be hot melt adhesive.
[0009] The electronic storage media carrier D is made of high-quality synthetic materials such as synthetic paper, paper with synthetic coating or other plastic materials, and is compatible with all types of security papers and sleeves which can be made out of synthetic materials, paper or textile, which provides seamless protection of the built-in electronic storage media and the antenna. The E-sleeve pursuant to this invention is one of the thinnest products available on the market. Various implementations of electronic storage media and antennae are available, according to the requirements of the customer.
[0010] The E-sleeve differs from other existing similar implementations in that it uses less material and also requires less production phases for manufacturing a booklet with a built-in storage media in the sleeve, such as a biometric passport.
Claims
PATENT CLAIMS1 .Sleeve with integrated chip, characterized in that the sleeve (A) and the storage media carrier (D) are connected to one another through a binding layer (B), which also represents the compensation layer for any unevenness of the electronic storage media (C) and antenna.
2. Sleeve with integrated chip of claim 1 , characterized in that the binding layer (B) is hot melt adhesive.