PCB stack element

Abstract

The invention relates to a PCB stack element (1) which is suitable for arranging electric and electronic components (4) on a circuit board (10). The PCB stack element (1) has a first circuit board (10) which extends in a first (X) and second (Y) direction, and the top side (11) and bottom side (12) of which are suitable for being populated with electric and electronic components (4). The PCB stack element (1) has at least two legs (13) which extend substantially perpendicularly to the first (X) and second (Y) direction of the circuit board (10) in a third direction (Z), wherein the legs (13) are suitable for supporting the circuit board (10) and for electrically contacting a second circuit board (2) such that the PCB stack element (1) is suitable for population on the second circuit board (2) and, with the first circuit board (10) of the PCB stack element (1) and with the second circuit board (2) populated with the PCB stack element (1), a PCB stack (100) is provided the first circuit board (10) and second circuit board (2) of which are arranged substantially parallel to one another and in particular one above the other.

Description

[0001] Applicant: HARTING AG

[0002] Title: PCB stack element

[0003] The invention relates to a PCB stack element intended for arranging electrical and electronic components on a printed circuit board. The invention particularly relates to a PCB stack (printed circuit board stack) formed on the printed circuit board using the PCB stack element.

[0004] The invention also relates in particular to a method for increasing the component density of a printed circuit board and / or a method for extending the functionality of the printed circuit board without significantly impairing its component density in the plane of the printed circuit board.

[0005] Such elements and methods are used for efficient, space-saving operation of electrical and electronic equipment.

[0006] State of the art

[0007] Multilayer printed circuit boards enable the implementation of complex circuits in a small installation space. However, the number of components that can be assembled / soldered on a circuit board is limited by the surface area of ​​the circuit board. This is because even with an increasing number of layers, the surface area that can be assembled does not increase. Particularly in applications where space is limited, complex designs with flexible circuit boards, soldered circuit boards, or additionally connected circuit boards must be created to increase the assembly area, resulting in complicated and costly solutions. It is known from the state of the art to assemble circuit boards with electrical components automatically. This can be done, in particular, using the widely used SMT (surface-mounted technology).

[0008] A major problem with automated PCB assembly is that these components often have individual connections. This complicates both the PCB layout and the assembly flexibility with regard to subsequent component selection. In particular, the automation of PCB assembly with alternative components that would be quite attractive in terms of functionality and price can be hindered or even impossible.

[0009] Due to their temperature sensitivity, many electrical components are not readily suitable for SMT soldering.

[0010] Furthermore, the limited installation space on printed circuit boards is considered problematic for almost all circuit designs. This means that there is a fundamental need to utilize the available installation space as effectively as possible to enable the highest possible functionality with the least possible space. Furthermore, the operation of high-performance electronic components, such as microprocessors, can cause problems with their temperature development, necessitating the use of heat sinks and / or fans, which in turn further increases the space requirements.

[0011] The prior art known from WO 2021 / 156793 A1 is directed to a component carrier for arranging electrical components on a printed circuit board, which is intended to be suitable for making the geometric arrangement of electrical components on a printed circuit board more flexible, whereby special component carriers made of MID-compatible plastic are proposed, which can have a standardized footprint for connection to the printed circuit board and can be adapted to the connections and the geometric arrangement of the components, in particular also in the LDS process, by means of individually applied conductor tracks.

[0012] The above-mentioned known component carrier extends upwards essentially perpendicular to the circuit board from a base component arranged on the circuit board and disadvantageously designed with a large area to provide a plurality of electrical contacts with the circuit board. In particular, with its disadvantageously large area base component, the component carrier is unsuitable for a space-saving expansion of the functionality of a circuit board and, in particular, for an efficient increase in the component density of a circuit board.

[0013] Task

[0014] The object of the invention is to provide a component suitable for many applications which enables an increase in the component density of a printed circuit board and / or an extension of the functionality of a printed circuit board without impairing the component density of the components present on the printed circuit board, in particular in the plane of the printed circuit board.

[0015] In particular, the invention also aims to provide a method suitable for the intended use of the component. This object is achieved by the subject matter of the independent claim. Advantageous embodiments are mentioned in the subclaims and in the description.

[0016] The invention particularly relates to a PCB stack element comprising a first circuit board extending in a first and second direction, and whose top and bottom sides are suitable for mounting electrical and electronic components.

[0017] The PCB stack element suitably comprises at least two legs that extend substantially perpendicular to the first and second directions of the circuit board in a third direction. The legs are designed to support the first circuit board and to electrically contact a second circuit board. The PCB stack element is thus particularly advantageously suited for assembly on the second circuit board.

[0018] With the first circuit board of the PCB stack element and the second circuit board populated with the PCB stack element, an advantageous PCB stack is provided, the first circuit board and second circuit board of which are arranged one above the other and, in particular, are arranged substantially parallel to one another. Particularly advantageously, components on the second circuit board can be arranged below the first circuit board, and, in particular, components provided on a top and / or bottom side of the first circuit board can also be arranged.

[0019] The components provided on the first circuit board thus contribute to a desirable increase in the assembly density of electrical and, in particular, electronic components on the second circuit board, without adversely affecting the assembly density of the arrangement parallel to the second circuit board. The protruding PCB stack element can, in particular, be designed as a standard extension element suitable for a variety of applications. For contacting the second circuit board, the ends of its legs have contacts that are suitable and designed accordingly for soldering to predetermined connection points provided on the second circuit board.

[0020] The dimensions of the PCB stack element, as well as the number of its legs and the number of contacts, as well as the height of the PCB stack element in the third direction and the thickness of the first circuit board are each designed to correspond to the mountable area of ​​the top side of the first circuit board, wherein the mountable area of ​​the circuit board is suitably 9mm 2 up to 10,000mm 2 and preferably 16mm 2 up to 625mm 2 and especially preferably 25mm 2 up to 400mm 2 can amount to.

[0021] A protruding standard extension element, which is suitable for many applications, can be provided by means of an advantageous first embodiment of the PCB stack element, which is limited to a mountable area of ​​the first printed circuit board of 9mm 2 up to 64mm 2 and preferably from 16mm 2 up to 36mm 2The first embodiment of the PCB stack element can suitably have two legs, each with, for example, three contacts. The first embodiment of the PCB stack element can furthermore particularly preferably have a component surface of its printed circuit board of approximately 25 mm 2be designed, and in particular have a total of six contacts, which can be evenly distributed between the two legs, so that each leg has three contacts. It is clear that the number of contacts also depends on the end application for which the PCB stacking element is intended, according to which more or fewer than three contacts can be formed on one or both legs. A further standard extension element, which is suitable for many applications, can also be provided by means of an advantageous second embodiment of the PCB stacking element, which is limited to a mountable area of ​​the first printed circuit board of 64 mm 2 up to 225mm 2 and preferably from 64mm 2 up to 144mm 2The second embodiment of the PCB stack element can suitably have four legs, each with a number of three to four contacts, and advantageously three contacts. The second embodiment of the PCB stack element can furthermore particularly preferably be designed to have a component surface of approximately 100 mm 2 and have a total of twelve contacts, which can be evenly distributed across the four legs, so that each leg has three contacts. Of course, even with the second design of the PCB stack element, the number of contacts also depends on the end application for which the PCB stack element is intended, according to which more or fewer than three or four contacts can be formed on one or all legs.

[0022] A further standard extension element, which is suitable for many applications, can also be provided by means of an advantageous third embodiment of the PCB stack element, which is limited to a mountable area of ​​the first printed circuit board of 225mm 2 up to 10,000mm 2 and preferably from 225mm 2 up to 625mm 2 The third embodiment of the PCB stack element can suitably have four legs, each with a number of four to eight contacts. The third embodiment of the PCB stack element can furthermore particularly preferably have a component area of ​​its printed circuit board of approximately 400 mm 2and have a total of twenty-four contacts, which can be evenly distributed across the four legs, so that each leg has six contacts. The above statement regarding the first and second versions also applies to the number of contacts in the third version, whereby the number of contacts also depends on the end application for which the PCB stack element is intended, meaning that fewer than four or more than eight contacts can be formed on one or all legs.

[0023] From the above description of the essential features of the preferred embodiments of the PCB stack element, it is clear that the above-described first, second, and third embodiments of the PCB stack element differ in particular in their equippable area and the number of their legs and contacts. Further differences between the first, second, and third embodiments, namely in the thickness of the first circuit boards, the thickness, length, and arrangement of the legs, which each advantageously correspond in particular to the equippable area, are described below, in particular with reference to Fig. 3. A selected suitable contact shape of the contacts provided for contacting the second circuit board at the ends of the legs is described below with reference to Figs. 6A and 6B.

[0024] In particular, for a desirable stability and rigidity or flexibility also with regard to temperature influences, a protruding PCB stack element can be suitably designed symmetrically, wherein particularly preferably the populatable surface of the upper side of the circuit board can be designed square.

[0025] In this context, reference is also made to the following description with reference to Fig. 5. The above first, second and third embodiments of the PCB stack element have, with their preferred square mountable area of ​​approximately 25mm 2 , 100mm 2 and 400mm 2 a width of approximately 5mm, 10mm and 20mm respectively.

[0026] A protruding PCB stack element naturally also suitably has conductor tracks which extend from the contacts provided on the legs for contacting the second circuit board to the equippable surface of the top and / or bottom of the first circuit board.

[0027] A PCB stack element described above can be suitably manufactured from a base body provided using a suitable mold by thermoplastic injection molding or additive manufacturing, particularly advantageously using a 3D MID (molded interconnect device) process. The conductor tracks can be easily manufactured using an LDS (laser direct structuring) process. The PCB stack element can be made of a suitable plastic, in particular LCP (liquid crystalline copolyester), PPA (polyphthalamide), or PPS (polyphenylene sulfide). MID stands for "Molded Interconnect Device" or "Mechatronic Integrated Device." These are injection-molded circuit carriers made of plastic onto which metallic conductor tracks are applied.Using 3D-MID, it is possible to combine electronic and mechanical functions in a three-dimensional component and, in particular, to provide a MEMS component (microelectromechanical system).

[0028] Electrical or electronic components suitable for mounting on the PCB stack element can be, in particular, microprocessors, LEDs, diodes, antennas, sensors or, as already mentioned above, MEMS components or even another PCB stack element.

[0029] For a required flexible geometric alignment of the components, in particular not only parallel to the first circuit board, but also perpendicular to the first circuit board, which is particularly advantageous for antennas, acceleration sensors and MEMS components, the PCB stack element can also have at least one carrier element which extends substantially perpendicular to the first and second direction of the circuit board in the opposite direction to the third direction and provides a corresponding additional assembly area for electrical or electronic components.

[0030] The legs of the PCB stack element can particularly advantageously each be arranged at an edge of the circuit board and extend from the edge of the circuit board substantially in the third direction, whereby the PCB stack element has an advantageously stable design. The above statements regarding the legs also apply to the support element, which, like the legs, can also be arranged at an edge of the circuit board and, starting from the edge of the circuit board, can extend substantially in the opposite direction to the third direction.

[0031] As described above, a standardized extension element, which may be suitable for many applications, may be provided by means of a PCB stack element in a first, second or third embodiment, which differ in particular in their dimensions of the respective mountable area of ​​the first circuit board and the number of their contacts with the second circuit board.

[0032] For particularly flexible use of the first, second, and third embodiments and for extensive coverage of a multitude of different applications, a predetermined number of prefabricated base bodies, in particular of the first, second, and third embodiments, can therefore be kept in a component set according to one embodiment of the invention, so that they are advantageously available for rapid and flexible use and individual adaptation in accordance with their intended use and in accordance with a corresponding second circuit board. The invention also relates in particular to a PCB stack with a second circuit board described above, provided as the base plate of the PCB stack, and at least one protruding PCB stack element, which can in particular also be selected from a protruding component set, wherein the second circuit board is equipped with the PCB stack element.The second circuit board provides a base plate of the PCB stack, which extends substantially in the first and second directions. The first circuit board of the PCB stack element provides a cover plate of the PCB stack, which extends substantially parallel to the base plate, wherein the circuit board layout of the base plate corresponds to the PCB stack element and its intended assembly.

[0033] The invention therefore also relates in particular to a method for providing a protruding PCB stack for a predetermined application, wherein, in a first step, a suitable printed circuit board is selected as the base plate of the PCB stack. Particularly advantageously, a printed circuit board can be selected whose functions are to be further expanded by integrating additional components, and which can be arranged at least partially one above the other on a protruding PCB stack element.

[0034] In a second step, at least one prefabricated PCB stack element suitable for the predetermined application is selected, in particular from a preceding component set.

[0035] In a third step, a corresponding design of the circuit board layout of the base plate and the PCB stack element, which is suitable for the above application, as well as the number and arrangement of the contacts of the PCB stack element described above are determined and specified, after which, in a fourth step, suitable conductor tracks are formed on the base plate and the PCB stack element in accordance with the circuit board layout of the base plate and the PCB stack element specified in the third step.

[0036] Finally, in a fifth step, the base plate and the PCB stack element are populated with the components provided in the third step, and subsequently, in a sixth step, the base plate is populated with the PCB stack element, after which a PCB stack according to an embodiment of the invention is provided, which has the base plate and the PCB stack element arranged on the base plate.

[0037] As described above, the method is in particular also a method for increasing the component density of the base plate and / or a method for extending the functionality of the base plate.

[0038] Examples of implementation

[0039] Embodiments of the invention are illustrated in the drawings and explained in more detail below. They show:

[0040] Fig. 1A is a schematic perspective view of a PCB stack element according to an embodiment of the invention;

[0041] Fig. 1 B shows a schematic section through a PCB stack element according to an embodiment of the invention;

[0042] Fig. 2 is a schematic perspective view of a PCB stack element according to an embodiment of the invention from above and below;

[0043] Fig. 3 shows the PCB stack element of Fig. 1 A and 2, each in a reduced view, together with a PCB stack element according to a further embodiment of the invention;

[0044] Fig. 4A shows a PCB stack provided by two PCB stack elements of Fig. 2 stacked on top of each other;

[0045] Fig. 4B Modifications of the PCB stack element of Fig. 2;

[0046] Fig. 5 schematic representations of the PCB stack elements of Fig. 3 from below together with further embodiments of a PCB stack element according to the invention;

[0047] Fig. 6A shows enlarged views of a leg of the PCB stack element of Fig. 2 from below, each with differently designed selected contacts;

[0048] Fig. 6B shows section A of Fig. 6A in an enlarged view from a different perspective; and

[0049] Fig. 7 shows a schematic flow diagram of process steps for producing a PCB stack according to an embodiment of the invention.

[0050] The figures contain partially simplified, schematic representations. In some cases, identical reference symbols are used for identical, but possibly not identical, elements. Different views of identical elements may be scaled differently. Not all reference symbols are shown in all drawings.

[0051] Fig. 1 shows a schematic perspective view of a PCB stack element 1 according to an embodiment of the invention, which is intended to be arranged on a printed circuit board 2 to provide a PCB stack 100 according to an embodiment of the invention, wherein the printed circuit board 2 forms the base plate 2 of the PCB stack 100 and a printed circuit board 10 of the PCB stack element 1 forms the cover plate 10 of the PCB stack 100.

[0052] The circuit board 10 of the PCB stack element extends in a first direction X and a second direction Y parallel to the circuit board 2. At the edge of the square circuit board 10, four legs 13 extend perpendicular to the plane of the circuit board 10 in a third direction Z. At the ends of the legs 13, three contacts 130 are provided, which are soldered to suitable contact points on the circuit board 2.

[0053] Conductor tracks 3 extend from the contacts 130 of the legs 13 to the top side 11 of the printed circuit board 10 and are connected to further conductor tracks 3 provided there, the top side 11 equipped with electrical and electronic components 4.

[0054] The components 4 can in particular also be microprocessors, LEDs, diodes, antennas, sensors or MEMS components (microelectromechanical systems) or another PCB stack element 1.

[0055] The PCB stack element 1 of Fig. 1A provides a PCB stack element 1 according to a second embodiment A2 of the invention, which has a square circuit board 10 and four legs 13, each with a number N1 of three contacts, and thus a total number N of 12 contacts. The PCB stack element 1 according to the second embodiment A2 of the invention is described in detail below, particularly with reference to Fig. 3, in comparison to further embodiments A1 and A3 of the PCB stack element 1.

[0056] It is clear that the printed circuit board 2, like the printed circuit board 10 of the PCB stack element 1, is also provided with conductor tracks 3 and equipped with components 4 for its intended use, which are not shown here for the sake of clarity and overview, whereby components 4 can also advantageously be arranged below the printed circuit board 10 and can be covered by the printed circuit board 10. Fig. 1 B shows a schematic section through a PCB stack element 1 according to an embodiment of the invention along the first direction X and in the second direction Z.

[0057] The PCB stack element 1 is also arranged on a printed circuit board 2 and, together with the printed circuit board 2, forms a PCB stack 100 according to an embodiment of the invention.

[0058] Here, three components 4 are arranged, for example, on the top side 11 of the circuit board 10, and the bottom side 12 of the circuit board 10 is equipped, for example, with one component 4. Also, for example, three components 4 are arranged on the base plate 2 below the circuit board 10, which forms a cover plate 10 of the base plate 2 in the PCB stack 100.

[0059] For the intended operation of the PCB stack element 1 with the components 4, the printed circuit board 10 has a suitable thickness D, so that the PCB stack element 1 has a desirable stability. The above applies equally to the thickness D of the legs 13, which suitably essentially corresponds to the

[0060] Thickness D of the cover plate 10, and for the height H of the PCB stack element 1, as well as the length L of the legs 13 corresponding to the height H. In particular, the height H and length L are selected to be suitable for thermally safe operation of the PCB stack element 1 and the components 4.

[0061] Fig. 2 shows a schematic perspective view of a PCB stack element 1 according to a first embodiment A1 of the invention, viewed from above onto the top side 11 of the printed circuit board 10, and from below onto the underside 12 thereof. Like embodiment A2 of Fig. 1A, the substantially square printed circuit board 10 with a width B and the corresponding dimensions BxB also has a correspondingly square, populatable top side 11. Unlike the second embodiment A2 of the PCB stack element 1 of Fig. 1A, the first embodiment A1 of the PCB stack element 1 has only two opposing legs 13, each with a number N1 of three contacts 130, with conductor tracks 3 extending from the three contacts 130 on the outside of the legs 13 to the top side 11 of the printed circuit board 10. The first embodiment A1 therefore has a total number N of six contacts 130.

[0062] If the underside 12 of the circuit board 10 is also populated with components 4, correspondingly suitable conductor tracks 3 (not shown in the drawing) can be laid from the top side 11 over the edge of the circuit board 10 to the underside 12. This also applies to the second embodiment A2 described above and the third embodiment A3 of the PCB stack element 1 according to the invention, described below with reference to Fig. 3 together with the first embodiment A1 and the second embodiment A2.

[0063] It is clear that alternatively or in addition to this measure, conductor tracks 3 may also be provided from the underside 12 on the opposite sides of the legs 13, which extend from the underside 12 to the contacts 130.

[0064] The thickness D of the circuit board 10 and the legs 13, like the height H of the PCB stack element 1, is also selected to correspond to the width B in such a way that a desirably stable PCB stack element 1 is provided, which enables thermally safe operation, in particular of its components 4. This also applies to the width and central arrangement of the legs 13 on two opposite edges of the circuit board 10.

[0065] Fig. 3 shows in a synopsis the above-described first embodiment A1 of the PCB stack element 1 of Fig. 2 and the second embodiment A2 of Fig. 1 A, each in a reduced view together with a PCB stack element 1 according to a third embodiment A3 of the invention, wherein the first A1, second A2 and third A3 embodiments differ in particular in their dimensions BxB of their equippable area of ​​the top side 11 of the respective printed circuit board 10.

[0066] The smallest first version A1 of a PCB stack element 1, unlike the second A2 and third A3 versions as described above with reference to Fig. 2, has only two legs 13, each of which has, by way of example, a number N1 of three contacts. It is clear that a modified PCB stack element 1 of version A1, intended for a specific application, as described above, can also have fewer or more contacts 130. Version A1 has an advantageously square printed circuit board 10 with a dimension WxW of 9 mm. 2 up to 64mm 2 and preferably 16mm 2 up to 36mm 2 and advantageously about 25mm 2 The width B of the PCB stack element 1 is approximately 5 mm and the height is advantageously approximately 2.5 mm. The thickness D of the printed circuit board 10 and the legs 13 of the first embodiment A1 is suitably 0.6 mm and 0.5 mm, respectively.

[0067] The second embodiment A2 of a PCB stack element 1, unlike the first embodiment A1 described above, has four legs 13, each of which has, for example, a number N1 of three contacts. As with all embodiments described with reference to Fig. 3, the same applies to embodiment A2 that a modified PCB stack element 1 of embodiment A2 intended for a specific application can also have more or fewer contacts 130. The embodiment A2 also has an advantageously square printed circuit board 10 with a dimension WxW of 64 mm. 2 up to 225mm 2 and preferably from 64mm 2 up to 144mm 2 and advantageously about 100mm 2, according to which the width B of the square PCB stack element 1 is approximately 10 mm. Suitably, the height H is approximately 4 mm, and the thickness D of the printed circuit board 10 of the second embodiment A2 is suitably 0.8 mm, while the thickness of the legs 13 in the area of ​​the contacts 130 is slightly less at 0.6 mm.

[0068] The third embodiment A3 of a PCB stack element 1, like the second embodiment A2 described above, also has four legs 13, each of which has, for example, a number N1 of six contacts. The third embodiment therefore has a total of N = 24 contacts 130. As for all embodiments described with reference to Fig. 3, the third embodiment A3 also applies that a modified PCB stack element 1 of the third embodiment A3 intended for a specific application can also have fewer or more contacts 130. The third embodiment A3 also has an advantageously square printed circuit board 10 with a dimension W x W of 225 mm. 2 up to 10,000mm 2 and preferably from 225mm 2 up to 625mm 2 and advantageously about 400mm 2, according to which the width B of the square PCB stack element 1 is suitably approximately 20 mm. Advantageously, the height H is approximately 4 mm. The thickness D of the circuit board 10 of the third embodiment A3 is suitably 1.1 mm, while the thickness of the legs 13 in the area of ​​the contacts 130 can be slightly less at 0.82 mm.

[0069] The printed circuit boards 10 of the above-described first A1, second A2, and third A3 embodiments of a PCB stack element 1 are each advantageously square, and the legs 13 are each evenly distributed at the edges of the printed circuit board 10, whereby the PCB stack elements 1 have a preferably compact and stable design. It is clear that, corresponding to selected applications, the printed circuit boards 10 can also be rectangular, for example, and / or at least one of the legs 13 can also be arranged at a distance from the edge of the printed circuit board 10.The above embodiments A1, A2 and A3, which differ essentially in their dimensions, are each provided for individual applications for providing a PCB stack 100 on a base plate 2 and can therefore advantageously be kept in a component set 5, wherein the number of embodiments A1, A2 and A3 present in the component set 5 can suitably be in a ratio to one another that corresponds to their current use.

[0070] Fig. 4A shows a PCB stack 100 provided by two PCB stack elements 1 stacked one above the other, which may be advantageous for selected applications. Naturally, the lower PCB stack element 1 is intended for placement on a predetermined, selected base plate. The PCB stack 100 shown in the drawing is formed, by way of example, by two PCB stack elements 1 of the first embodiment A1. The legs 13 of the PCB stack elements 1 are arranged one above the other, by way of example, in the opposite direction to the third direction Z.

[0071] It is clear that the upper PCB stack element 1 can also be arranged on the lower PCB stack element 1 rotated by 90° relative to the lower PCB stack element 1, and that in particular a PCB stack element 1 of embodiment A1 can also be arranged centrally on a larger PCB stack element 1 of embodiment A3.

[0072] Fig. 4B shows modifications of the PCB stack element 1 of the first embodiment A1 of Fig. 2, each having two support elements 14 arranged opposite one another on the edge of the circuit board 10, each extending from the circuit board 10 in the opposite direction to the third direction Z. The support elements 14 are designed to correspond to the legs 13 and provide additional mounting surfaces for electrical or electronic components 4, which can extend perpendicular to the circuit board 10 in the first direction X and the third direction Z, or which can extend in the second direction Y and the third direction Z.

[0073] The support elements 14 are particularly advantageous for a possibly required flexible geometric alignment of the components 4, in particular not only parallel to the circuit board 10, but also perpendicular to the circuit board 10, which is particularly advantageous for antennas, acceleration sensors, and MEMS components. It is clear that the embodiments A2 and A3 can also have such suitably designed and arranged support elements 14.

[0074] Fig. 5 shows schematic representations of the PCB stack elements 1 of the embodiments A1, A2 and A3 of Fig. 3 from below together with further embodiments A4 and A5 of a PCB stack element 1 according to the invention.

[0075] The additional versions A4 and A5 shown in the drawing may have different dimensions, like the versions A1, A2, and A3 described above, but are all scaled to one dimension for easier comparison. Therefore, versions A2 and A3, which are otherwise identical, are shown together in one illustration.

[0076] The embodiments A1 to A4 have an advantageously square circuit board 10 as described above, and the embodiment A5 has a circular circuit board 10.

[0077] While the A2 and A3 versions have a comparatively high

[0078] Symmetry of four mirror planes S and a point symmetry of 90, the version A1 has two mirror planes S and a point symmetry of 180°, and the versions A4 and A5 have no mirror plane S and only a point symmetry of 90° and 120° respectively.

[0079] However, with their above point symmetries, the embodiments A4 and A5 also have a particularly suitable thermal stability and rigidity or flexibility for a PCB stack element 1 according to an embodiment of the invention, in particular since the circular plane of the circuit board 10 is completely defined with the three legs 13 of the embodiment A5, and the arrangement of the four legs 13 of the embodiment A4 is merely shifted in the same counterclockwise direction to the corners of the circuit board 10 compared to the legs 13 of the embodiments A2 and A3.

[0080] The fourth A4 and fifth A5 embodiments described above are each exemplary modifications of the first, A1, second A2 and third A3 embodiments, which can each be designed to correspond to selected applications, wherein for possible further modifications not shown in Fig. 5, reference is made here to what has been said above with reference to Fig. 3.

[0081] Fig. 6A shows enlarged views of a leg 13 of the PCB stack element 1 of Fig. 2 from below, each with differently designed selected contacts 130, and Fig. 6B shows section A of Fig. 6A in an enlarged view and from a different perspective.

[0082] The rounded contact shape of the contacts 130 shown on the left side of the drawing advantageously extends over both sides of the leg 13 and corresponds to the advantageous contact shape of the design A1 of Fig. 2. With an advantageously variable contact size, metallization of the side surfaces and inspection of the soldered assembly is possible.

[0083] The rounded semicircular contact shape of the contacts 130 at the end of the leg 13 suitably has a radius R which corresponds to half the thickness D of the leg 13, which is shown schematically in the enlarged view of section A of Fig. 6B.

[0084] The contact shape of the contacts 130 shown on the right in the drawing Fig. 6A, like the advantageous rounded contact shape above, also extends over both sides of the end of the leg 13, also enables visual inspection and requires an advantageously small space requirement for solder pads corresponding to the contacts 130 on the base plate 2

[0085] However, unlike the above preferred rounded contact shape, this contact shape has thin wall thicknesses at the end of the leg 13, which makes it difficult to design for injection molding during manufacture and poses a risk of damage during manufacture and handling.

[0086] Fig. 7 shows in a schematic flow diagram the steps S1 to S6 of a method V for producing a PCB stack 100 for a predetermined application according to an embodiment of the invention.

[0087] First, in a first step S1, a suitable printed circuit board 2 is selected as the base plate 2 of the PCB stack 100, wherein advantageously, in particular, a printed circuit board 2 can be selected whose functions are to be expanded by integrating further components 4, wherein the corresponding components 4 can be arranged at least partially one above the other on a PCB stack element 1 according to an embodiment of the invention.

[0088] In a subsequent second step S2, at least one prefabricated PCB stack element 1 suitable for the predetermined application is selected.

[0089] Following this, in a third step S3, a corresponding design of the circuit board layout of the base plate 2 and the PCB stack element 1, which is suitable for the above application, as well as the number and arrangement of the contacts 130 of the PCB stack element 1 are determined and specified, after which in a fourth step S4, according to the circuit board layout of the base plate 2 and the PCB stack element 1 determined in step S3, suitable conductor tracks 3 are formed on the base plate 2 and the PCB stack element 1, as well as the contacts 130.

[0090] Finally, the base plate 2 and the PCB stack element 1 are populated with their components 4 provided in the third step S3 in a fifth step S5 of method V. Subsequently, in a sixth step S6, the base plate 2 is populated with the PCB stack element 1, after which a PCB stack 100 according to an embodiment of the invention is provided, which comprises the base plate 2 and the PCB stack element 1 arranged on the base plate 2. Applicant: HARTING AG

[0091] Title: PCB stack element

[0092] List of reference symbols

[0093] 1 PCB stack element

[0094] 10 Printed circuit board, cover circuit board

[0095] 11 Top

[0096] 12 Bottom

[0097] 13 Leg

[0098] 130 Contact

[0099] 14 support element

[0100] 100 PCB stacks

[0101] 2 circuit board, base plate

[0102] 3 conductor track

[0103] 4 electrical or electronic component,

[0104] Microprocessor, LED, diode, antenna, sensor, MEMS component

[0105] 5 component set

[0106] A section

[0107] A1 , A2,

[0108] A3, A4, A5 version

[0109] B Width

[0110] WxB area, dimensions

[0111] D Thickness, strength

[0112] H Height

[0113] L length

[0114] N, N1 Number S Symmetry, Mirror Plane

[0115] S1 , S2,

[0116] S3, S4, S5, S6 step

[0117] R radius

[0118] V Procedure

[0119] X, Y, Z direction

Claims

Applicant: HARTING AG Title: PCB stack element Claims 1 . PCB stack element (1) for arranging electrical and electronic components (4) on a printed circuit board (10), having the features: the PCB stack element (1) has a first printed circuit board (10) which extends in a first (X) and second (Y) direction, and whose top side (11) and bottom side (12) are suitable for mounting electrical and electronic components (4);and the PCB stack element (1) has at least two legs (13) which extend substantially perpendicular to the first (X) and second (Y) directions of the printed circuit board (10) in a third direction (Z), wherein the legs (13) are suitable for supporting the printed circuit board (10) and for electrically contacting a second printed circuit board (2), so that the PCB stack element (1) is designed to be suitable for assembly on the second printed circuit board (2), and with the first printed circuit board (10) of the PCB stack element (1) and the second printed circuit board (2) assembled with the PCB stack element (1), a PCB stack (100) is provided, the first printed circuit board (10) and second printed circuit board (2) of which are arranged substantially parallel to one another and in particular one above the other.

2. PCB stack element (1) according to claim 1, wherein at the ends of the legs (13) contacts (130) for contacting the second printed circuit board (2), and the dimensions of the PCB stack element (1), as well as the number of legs (13) and the number (N) of contacts (130), as well as the height (H) of the PCB stack element (1) in the third direction (Z) and the thickness (D) of the printed circuit board (10) are each designed to correspond to the equippable area (WxW) of the top side (11) of the printed circuit board (10); and wherein the equippable area (WxW) of the printed circuit board (10) is suitably 9mm 2 up to 10,000mm 2 can have.

3. PCB stack element (1) according to claim 2, wherein the PCB stack element (1) according to a preferred first embodiment (A1) is designed to have a mountable area (BxB) of its printed circuit board (10) of 9mm 2 up to 64mm 2 and preferably from 16mm 2 up to 36mm 2and suitably comprises two legs (13) each with a number (N1) of three contacts (130); and wherein the PCB stack element (1) is particularly preferably designed to have a mountable area (BxB) of its printed circuit board (10) of approximately 25mm 2 and can have a number (N) of six contacts (130) in total.

4. PCB stack element (1 ) according to claim 2, wherein the PCB stack element (1 ) according to a preferred second embodiment (A2) has a mountable area (BxB) of its printed circuit board (1 ) of 64mm 2 up to 225mm 2 and preferably from 64mm 2 up to 144mm 2 and suitably has four legs (13) each with a number (N1) of three to four contacts (130); and wherein the PCB stack element (1) is particularly preferably placed on a mountable surface (BxB) of its printed circuit board (10) of about 100mm 2and can have a number (N) of twelve contacts (130) in total.

5. PCB stack element (1) according to claim 2, wherein the PCB stack element (1) according to a preferred third embodiment (A3) has a mountable area (BxB) of its printed circuit board (10) of 225mm 2 up to 10,000mm 2 and preferably from 225mm 2 up to 625mm 2 is designed, and suitably has four legs (13) with a number (N1 ) of four to eight contacts (130) each; and wherein the PCB stack element (1 ) is particularly preferably designed to have a mountable area (BxB) of its printed circuit board (10) of approximately 400mm 2 and can have a total number (N) of 24 contacts (130).

6. PCB stack element (1) according to one of claims 1 to 5, wherein the PCB stack element (1) is symmetrical, and in particular preferably the equippable area (BxB) of the top side (11) of its circuit board (10) is square.

7. PCB stack element (1) according to one of claims 2 to 6, wherein the PCB stack element (1) has conductor tracks (3) which extend from the contacts (130) to the equippable area (BxB) of the top side (11) and / or bottom side (12) of its circuit board (10).

8. PCB stack element (1) according to one of claims 1 to 7, wherein the PCB stack element (1) comprises at least one carrier element (14) for electrical or electronic components (4), which extends from the printed circuit board (10) substantially perpendicular to the first (X) and second (Y) direction of the printed circuit board (10) in the opposite direction to the third direction (Z).

9. PCB stack element (1) according to one of claims 1 to 8, wherein the legs (13) of the PCB stack element (1) are each arranged on an edge of the circuit board (10) and extend from the edge of the circuit board (10) substantially in the third direction (Z), and / or the carrier element (14) is arranged on an edge of the circuit board (10) and extends from the edge of the circuit board (10) substantially in the opposite direction to the third direction (Z).

10. PCB stack element (1) according to one of claims 1 to 9, wherein the PCB stack element (1) is produced starting from a base body provided using a suitable mold by means of thermoplastic injection molding or by means of additive manufacturing in a 3D-MID (molded interconnect device) process, and is manufactured with its conductor tracks (3) by means of an "LDS" (laser direct structuring) process, wherein the PCB stack element (1) can be provided in particular from LCP (liquid crystalline copolyester), PPA (polyphthalamide) or PPS (polyphenylene sulfide).

11. Component set (5) for providing a PCB stack (100) on a base plate (2), with a plurality of PCB stack elements (1) according to one of claims 1 to 9, wherein the PCB stack elements (1) are prefabricated according to claim 10, and in accordance with their intended use for further individual application-related structuring and assembly with components (4) in In accordance with a corresponding circuit board layout of the base plate (2) for the selection of which to provide the PCB stack (100), the component set (5) comprising in particular PCB stack elements (1) according to their first (A1), second (A2) and third (A3) design.

12. PCB stack (100) with a second circuit board (2) provided as a base plate (2) of the PCB stack (100) and at least one PCB stack element (1) according to one of claims 1 to 10 or selected from the component set (5) according to claim 11, wherein the second circuit board (2) is equipped with the PCB stack element (1); and with the second circuit board (2) a base plate (2) of the PCB stack (100) is provided, which extends substantially in the first (X) and second (Y) direction, and with the first circuit board (10) of the PCB stack element (1) a cover plate (10) of the PCB stack (100) is provided, which extends spaced from the base plate (2) substantially parallel to the base plate (2), wherein the circuit board layout of the base plate (2) corresponds to the PCB stack element (1) and its intended assembly.

13. Method (V) for providing a PCB stack (100) according to Claim 12 for a predetermined application comprising the steps: Selecting a suitable printed circuit board (2) as the base plate (2) of the PCB stack (100) in a first step (S1); Selecting at least one prefabricated PCB stack element (1) suitable for the predetermined application in a second step (S2); Determining and specifying a corresponding design of the circuit board layout of the base plate (2) and the PCB stack element (1) as well as the number and arrangement of the contacts (130) of the PCB stack element (1), as well as their assembly with components (4) in a third step (S3); Formation of suitable conductor tracks (3) and contacts (130) according to the circuit board layout of the base plate (2) and the PCB stack element (1) in a fourth step (S4); Equipping the base plate (2) and the PCB stack element (1) with the components (4) provided in the third step (S3) in a fifth step (S5); and Equipping the base plate (2) with the PCB stack element (1) in a sixth step (S6).

14. Method (V) according to claim 13, wherein in the first step (S1) a printed circuit board (2) is selected, the functions of which are extended by integrating further components 4 are to be arranged, wherein the further components (4) are arranged at least partially one above the other on the PCB stack element (1).

15. Method (V) according to claim 13 or 14, wherein by means of the method (V) for forming a PCB stack (100) on a base plate (2) a method (V) for increasing the assembly density of the base plate (2) and / or a method (V) for extending the functionality of the base plate (2) is provided.

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