Modular assembly for on-board equipment

Abstract

The invention relates to a modular assembly (100) intended for installation in embedded equipment, characterized in that said modular assembly comprises: a printed circuit board (10) adapted to receive, on a first face (11), electronic and / or optical components (13), a wire element management device (20) comprising: a tray (30), wire element management modules (40) for the wire elements (70), the tray being arranged opposite all or part of the first face of the printed circuit board and having a plurality of ports (31) for receiving the wire element management modules. Figure 1

Description

Title of the invention: Modular assembly for on-board equipment Technical field of the invention

[0001] The present invention relates to on-board equipment.

[0002] The invention more specifically relates to a new internal arrangement of on-board equipment allowing in particular the management of optical fibers and electrical cables.

[0003] The invention finds an advantageous application in the aeronautical field, in particular for equipping an aircraft. Prior art

[0004] Currently, in on-board equipment, the routing of electrical cables and optical fibers is only carried out after the installation of the printed circuit boards. The electrical cables and optical fibers are then usually held mechanically by bands or clamps. However, on-board equipment has a fairly limited internal volume and the handling of these electrical cables and optical fibers is complicated. The constant increase in the number of electrical cables and optical fibers in on-board equipment makes their management increasingly complex. It also remains difficult to manage the manufacturing margins of electrical cables and optical fibers.

[0005] Furthermore, the use of optical fibers generates additional constraints. For example, optical fibers are more fragile than electrical cables and are particularly more sensitive to bending, which complicates the management of excess lengths, even small ones, and corner crossings.

[0006] At the same time, passive cooling of electronic and / or optical components on printed circuit boards is also becoming complex due to the increase in flow rates which requires ever more power. Passive heat sinks are thus occupying more and more space in the internal volume of on-board equipment. Presentation of the invention

[0007] The present invention aims to remedy the aforementioned drawbacks.

[0008] To this end, the present invention proposes a modular assembly intended to be installed in on-board equipment, characterized in that said modular assembly comprises: - a printed circuit board adapted to receive, on a first face, electronic and / or optical components, - a wired element management device comprising: • a tray, • wireframe element management modules,

[0009] the tray being arranged opposite all or part of the first face of the printed circuit board and having a plurality of orifices for receiving the wire element management modules.

[0010] By wire element is meant any elongated element which makes it possible to electrically or optically connect two elements together.

[0011] In preferred examples, the wire element may be an electrical cable, a cable bundle, a flat ribbon cable (multiplanar cable), a radiofrequency coaxial cable or even an optical fiber.

[0012] Each wireframe management module is configured to provide a specific function.

[0013] Depending on the number of electronic and / or optical components and wire elements to be managed, an operator is able to define the number of wire element management modules required, the function of each of them and their locations on the board.

[0014] Such a modular assembly advantageously makes it possible to maintain and guide the wire elements on the board, by the wire element management modules.

[0015] According to particular embodiments, the modular assembly according to the invention also meets the following characteristics, implemented separately or in each of their technically operational combinations.

[0016] In preferred embodiments of the invention, each wire element management module comprises a fixing element intended to cooperate with a receiving orifice of the tray. Thus, the modular assembly provides wire element management modules with a fixing element to the tray standardized in terms of mechanical fixing.

[0017] In preferred embodiments of the invention, the wire element management modules are chosen from a wire element guidance module, a wire element holding module, a wire element overlength management module. Thus, the wire element management modules make it possible to adapt to the operator's needs and facilitate the operations of integrating the wire elements.

[0018] In preferred embodiments of the invention, the wire element management modules are manufactured by 3D printing. 3D printing advantageously makes it possible to produce complex shapes for the wire element management modules, depending on their dedicated function.

[0019] In preferred embodiments of the invention, the tray has a part, called the support part, intended to rest fixedly on the first face of the card. printed circuit board.

[0020] In preferred embodiments of the invention, the modular assembly comprises a heat sink. The tray has a part, called the support part, intended to be attached to one or more electronic and / or optical components of the printed circuit board. Said support part is made of a thermally conductive material and is fixedly connected to said heat sink. The modular assembly thus advantageously makes it possible to combine both the management of the wire elements and the dissipation of the heat created by the electronic and / or optical components attached to said support part towards the heat sink.

[0021] In preferred embodiments of the invention, the modular assembly comprises a heat sink, and in which the tray has a part, called the support part, intended to be attached to one or more electronic and / or optical components of the printed circuit board, said tray is made of a thermally conductive material and is fixedly connected to said heat sink via said support part.

[0022] The combination of this dual function, management of wired elements on the one hand and dissipation on the other hand, in the modular assembly advantageously allows space saving and consequently better integration of the modular assembly in the on-board equipment.

[0023] In preferred embodiments of the invention, the heat sink is a plate with dissipation fins and is arranged opposite a second face of the printed circuit board.

[0024] The invention also relates to on-board equipment comprising at least one modular assembly as defined above in at least one of its embodiments. The modular assembly is directly installed in the on-board equipment, with the routing of the wire elements carried out, advantageously making it possible to simplify the assembly operations. Brief description of the figures

[0025] The invention will be better understood on reading the following description, given by way of non-limiting example, and made with reference to the figures which represent:

[0026] [Fig.l] is a schematic representation, in section, of an example of a modular assembly according to the invention,

[0027] [Fig. 2] is a schematic representation, in section, of a variant of a modular assembly according to the invention,

[0028] [Fig. 3] illustrates a schematic representation, in top view, of a tray constituting the modular assembly according to the invention,

[0029] [Fig.4] illustrates a schematic representation, in section, of a part of the board constituting the modular assembly according to the invention on which two wire element management modules are arranged,

[0030] [Fig. 5] illustrates a schematic representation, in section, of on-board equipment comprising two examples of modular assemblies according to the invention. Description of the embodiments

[0031] The present invention relates to a modular assembly 100 intended for the management of wired elements in on-board equipment 200.

[0032] It is clear that any wired element, whether electrical or optical, can be managed by the modular assembly. In a preferred example, the wired element is an electrical cable, a radiofrequency coaxial cable or even an optical fiber.

[0033] Figures 1 and 2 illustrate in a very schematic manner, and in section, two examples of a modular assembly 100 according to the invention.

[0034] [Fig. 5] illustrates in a very schematic manner, and in section, an on-board equipment 200 comprising two examples of modular assemblies 100 according to the invention.

[0035] The on-board equipment 200 can generally equip any means of transport, in particular those in the aeronautical, railway, naval or automobile fields, without this being restrictive of the invention.

[0036] The invention is described in the particular context of one of its preferred fields of application in which the on-board equipment is arranged in an aircraft, whether civil or military. However, nothing precludes the on-board equipment from being arranged in any other means of transport.

[0037] The modular assembly 100 comprises a printed circuit board 10.

[0038] The printed circuit board 10 is generally commonly referred to as a PCB board, from the English acronym Printed Circuit Board.

[0039] The printed circuit board 10 is a mechanical support for receiving electronic and / or optical components, called components 13.

[0040] The printed circuit board 10 includes in particular tracks made of conductive material which allow the components 13 to be electrically connected to each other and potentially to elements external to the printed circuit board.

[0041] The printed circuit board 10 preferentially receives the components 13 at a first face 11.

[0042] The printed circuit board 10 can also receive the components 13 at a second face 12, opposite the first face 11, as illustrated in FIGS. 1 and 2.

[0043] Some of the components 13 of the printed circuit board 10 can be connected to elements external to the on-board equipment, by means of wire elements 70. Likewise, some of the components 13 can be connected, by means of wired elements 70, with components of another printed circuit board located in the same on-board equipment.

[0044] Each wire element 70 is thus preferentially connected, at a first end, to a component 13 of a printed circuit board 10 of a modular assembly 100, and at a second end to: - either to a component 13 of another printed circuit board located in the same on-board equipment, said other printed circuit board being able to form part of another modular assembly, - either to a connector 210 located in one of the walls 220 of the on-board equipment 200, and allowing said component 13 to be connected to an element external to said on-board equipment.

[0045] The modular assembly 100 further comprises a device for managing the wired elements, called device 20.

[0046] The device 20 is advantageously configured to manage in particular the routing and maintenance of these wire elements 70 in the on-board equipment.

[0047] The device 20 comprises a plate 30 arranged opposite all or part of the first face 11 of the printed circuit board 10.

[0048] The plate 30 is in the form of a flat and rigid support.

[0049] The plate 30 can have any geometric shape, for example an L-shape, a U-shape, a square-shape or a rectangle-shape.

[0050] The plate 30 is preferably arranged above the components 13. In other words, said components 13 are between the plate 30 and the first face 11 of the printed circuit board 10.

[0051] The plate 30 comprises a plurality of orifices 31. Said orifices 31 may or may not be through-holes, in a thickness of said plate. The orifices 31 cover all or part of the plate 30.

[0052] Preferably, said orifices are regularly spaced apart.

[0053] For example, the orifices 31 are arranged in parallel rows and columns, as illustrated in [Fig. 3], possibly in a staggered pattern.

[0054] The device 20 comprises a plurality of modules for managing the wired elements, called modules 40.

[0055] Each module 40 is intended to be fixed in at least one orifice 31 of the plate 30.

[0056] Each module 40 comprises at least one fixing element 4L. Each element of fixing 41 is intended to cooperate with an orifice 31 of the plate.

[0057] Each fixing element 41 allows the connection, reversibly or not, between module 40 and tray 30.

[0058] By reversible, we mean that the module 40 can be easily removed from the tray 30, when an intentional action and / or an appropriate effort is made by a user.

[0059] In an exemplary embodiment, the fixing of the module 40 in at least one orifice 31 of the tray is carried out by clipping. The fixing element 41 is for example formed by a snap-fastening element, elastically deformable, arranged to pass through the orifice 31 and bear on the second face 12 of the tray 10. In such an exemplary embodiment, the orifices 31 of the tray are through.

[0060] In an exemplary embodiment (not shown in the figures), the module 40 is fixed in an orifice of the plate by screwing. The fixing element 41 is a rod comprising an external thread intended to cooperate with an internal thread produced at the orifice of the plate. In such an exemplary embodiment, the orifices 31 of the plate are not necessarily through.

[0061] In the example of [Fig. 3], three modules 40 are illustrated and each of the modules comprises a plurality of fixing elements 41 cooperating with a plurality of orifices 31.

[0062] In the example of [Fig.4], two modules 40 are illustrated and each comprises a single fixing element 41 cooperating with an orifice 31. Each of the modules is fixed to the plate by clipping.

[0063] Each module 40 is configured to present a specific function.

[0064] In a preferred embodiment, a module 40 is a module for guiding one or more wire elements. In the example of [Fig. 3], two 90° guiding modules are shown.

[0065] In another preferred embodiment, a module 40 is a module for holding wire elements 70 in position. An example of such a module is shown on the right of [Fig. 4]. Such a holding module allows the wire elements, in particular the optical fibers, to be held in place to prevent them from vibrating or coming into contact with the surrounding hot electronic and / or optical components.

[0066] In another preferred embodiment, a module 40 is a module for managing the excess length of wire elements. An example of such a module is shown on the left of [Fig.4].

[0067] The management module can take different forms, depending on the wire element to be managed. For example, the management module can be configured to absorb a small excess length of an optical fiber 70, in particular by using the elasticity of the optical fiber. An example of this module is shown in [Fig. 3], between the two 90° guidance modules. In another example (not shown), the excess length management module is configured to manage excess lengths of cables with a diameter larger than that of the optical fiber, such as power cables (commonly called power cables).

[0068] In other exemplary embodiments, a module 40 may be: - an optical fiber coiling module, - an RF cable management module, the RF cable being a more rigid cable, but less fragile than so-called classic electric cables.

[0069] The modular assembly 100 can thus comprise different modules 40 having the same function and / or a different function.

[0070] Thus, depending on the components 13 and the wire elements 70 to be managed, the number of modules 40, the function of each of the modules 40 and their locations on the board can be advantageously defined during the design phase of the printed circuit board. The wire elements 70 are thus maintained and guided optimally, in particular by avoiding any contact with the components which could potentially damage them, for example due to friction or heating of the components.

[0071] The modular assembly 100 can then be directly installed in the on-board equipment 200 and only the second ends of the wired elements 70 need to be connected. Such an arrangement of the modular assembly 100 in the on-board equipment thus advantageously increases the reliability of said on-board equipment.

[0072] The plate 30 has a part, called the support part 32, intended to rest fixedly on a support.

[0073] In the example of [Fig. 1], the support is the first face 11 of the printed circuit board 10.

[0074] Preferably, the support part 32 of the plate is assembled to the printed circuit board by screwing.

[0075] The tray 30 and each module 40 can be manufactured from a material chosen from: plastics, metals or metal alloys, composite materials.

[0076] The tray 30 and each module 40 can be manufactured using processes such as machining, forming, or even 3D printing.

[0077] Preferably, the plate 30 and each module 40 are manufactured by 3D printing. The expression “3D printing” encompasses all additive manufacturing technologies. These technologies make it possible in particular to obtain, from one or more materials, lightweight, inexpensive modules of complex shape, difficult to obtain by machining for example.

[0078] 3D printing can be plastic or metal 3D printing.

[0079] In an alternative embodiment of the modular assembly, as illustrated in [Fig.2], the modular assembly 100 may comprise a heat sink 50.

[0080] The heat sink 50 is in the form of a plate 51 made of thermally conductive material, for example aluminum, and provided with dissipation fins 52 at one of its faces.

[0081] The heat sink 50, more particularly the plate 51, is preferably arranged opposite the second face 12 of the printed circuit board 10.

[0082] In such an alternative embodiment, the printed circuit board 10 is thus included between the plate 30 and the heat sink 50. Studs 15 allow the card to be held on the plate 51 of the heat sink.

[0083] The plate 30 is dimensioned so that the support part 32 is attached to certain components 13 of the printed circuit board 10, as illustrated in [Fig.2].

[0084] In this alternative embodiment, the support part 32 of the plate 30 is advantageously made of a thermally conductive material. The plate 30 can be made either of the same thermally conductive material or of plastic material.

[0085] The support part 32 of the plate advantageously rests fixedly on the heat sink 50, more particularly on the plate 51. Thus the support part 32 of the plate 30 participates in the effort to dissipate the heat released by the components 13 attached to said support part, by conducting the heat coming from the components 13 towards the heat sink 50.

Claims

Claims

1. Modular assembly (100) intended to be installed in on-board equipment, characterized in that said modular assembly comprises: - a printed circuit board (10) adapted to receive, at a first face (11), electronic and / or optical components (13), - a device (20) for managing wired elements (70) comprising: • a tray (30), • modules (40) for managing wired elements (70), the tray (30) being arranged opposite all or part of the first face of the printed circuit board and having a plurality of orifices (31) for receiving the wired element management modules, characterized in that the modular assembly comprises a heat sink (50), in that the tray (30) has a part, called the support part (32), intended to be attached to one or more electronic and / or optical components (13) of the printed circuit board (10),said support part being made of a thermally conductive material and being fixedly connected to said heat sink.,

2. Modular assembly (100) according to claim 1 in which each module (40) for managing wire elements comprises a fixing element (41) intended to cooperate with an orifice (31) for receiving the tray (30).

3. Modular assembly (100) according to one of the preceding claims in which the modules (40) for managing wire elements (70) are manufactured by 3D printing.

4. Modular assembly (100) according to one of the preceding claims in which the modules (40) for managing wire elements (70) are chosen from a module for guiding wire elements, a module for holding wire elements, a module for managing the excess length of wire elements.

5. Modular assembly (100) according to one of claims 1 to 4 in which the heat sink (50) is a plate (51) with dissipation fins (52) and is arranged opposite a second face (12) of the printed circuit board (10).

6. On-board equipment (200) comprising a modular assembly (100) according to one of the preceding claims.

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