HEAT DISSIPATION STRUCTURE AND POWER SUPPLY MODULE
The annular groove heat dissipation structure addresses warping in power supply modules by releasing thermal stress, improving structural reliability through strategic groove configurations.
Patent Information
- Application Number
- FR2023005710
- Authority / Receiving Office
- FR · FR
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-02-09
- Filing Date
- 2023-06-07
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2043-06-07
AI Technical Summary
Power supply modules experience warping due to thermal deformation caused by different thermal expansion coefficients of materials during reflow, affecting structural reliability.
A heat dissipation structure with an annular groove on the substrate surface, dividing it into configuration and peripheral zones, and optionally including heat dissipation fins, auxiliary grooves, and secondary grooves to release stress and reduce warping.
The heat dissipation structure effectively reduces warping during reflow, enhancing the structural reliability of power supply modules by managing thermal stress.
Smart Images
Figure 00000009_0000 
Figure 00000010_0000 
Figure 00000011_0000
Abstract
Description
Title of the invention: HEAT DISSIPATION STRUCTURE AND POWER SUPPLY MODULE technical field
[0001] The disclosure relates to a heat dissipation structure and a power supply module, and in particular a heat dissipation structure capable of preventing warping during reflow and a power supply module adopting the heat dissipation structure. STATE OF THE ART
[0002] Power supply modules are currently used in various products as the main basic equipment for power conversion, and power supply components are incorporated therein. When the heat dissipation substrate in the power supply module is connected to the direct copper-coated (DBC) ceramic substrate chip printed circuit board, due to the different coefficients of thermal expansion of each material, the amount of thermal deformation caused by the high-to-low temperature drop during reflow is also different, thus causing warping of the heat dissipation substrate and affecting the overall structural reliability. PRESENTATION OF THE INVENTION
[0003] The disclosure proposes a heat dissipation structure that can reduce warping during reflow.
[0004] The disclosure also proposes a power supply module including the aforementioned heat dissipation structure, which can effectively reduce warping of the overall structure and improve structural reliability.
[0005] The heat dissipation structure of the disclosure includes a substrate and an annular groove. The substrate has an upper surface and a lower surface opposite each other. The annular groove is configured on the upper surface of the substrate to divide the substrate into a configuration zone and a peripheral zone. The annular groove is located between the configuration zone and the peripheral zone. The depth of the annular groove is less than or equal to half the thickness of the substrate.
[0006] In one embodiment of the disclosure, the aforementioned heat dissipation structure further includes multiple heat dissipation fins configured separately on the lower surface of the substrate.
[0007] In one embodiment of the disclosure, the aforementioned heat dissipation structure further includes multiple first auxiliary grooves communicating with the annular groove to divide the configuration area into at least three configuration sub-zones.
[0008] In one embodiment of the disclosure, the aforementioned heat dissipation structure further includes multiple secondary auxiliary grooves communicating with the annular groove and extending respectively to four corners of the peripheral area.
[0009] In one embodiment of the disclosure, the depth of the aforementioned annular groove is between 5% and 50% of the substrate thickness.
[0010] The power supply module of the disclosure includes a heat dissipation structure, multiple layered substrates, and multiple chips. The heat dissipation structure includes a substrate and an annular groove. The substrate has an upper surface and a lower surface opposite each other. The annular groove is configured on the upper surface of the substrate to divide the substrate into a configuration zone and a peripheral zone. The annular groove is located between the configuration zone and the peripheral zone. The depth of the annular groove is less than or equal to half the thickness of the substrate. The layered substrate is configured on the heat dissipation structure and is located within the configuration zone of the substrate. The chips are respectively configured on the layered substrates and electrically connected to the layered substrates.
[0011] In one embodiment of the disclosure, the aforementioned heat dissipation structure further includes multiple heat dissipation fins configured separately on the lower surface of the substrate.
[0012] In one embodiment of the disclosure, the aforementioned heat dissipation structure further includes multiple first auxiliary grooves communicating with the annular groove to divide the configuration area into at least three configuration sub-zones, and the layered substrates are arranged respectively corresponding to the configuration sub-zones.
[0013] In one embodiment of the disclosure, the aforementioned heat dissipation structure further includes multiple secondary auxiliary grooves communicating with the annular groove and extending respectively to four corners of the peripheral area.
[0014] In one embodiment of the disclosure, the depth of the aforementioned annular groove is between 5% and 50% of the substrate thickness.
[0015] Based on the above, according to the design of the heat dissipation structure in the disclosure, the annular groove is configured on the upper surface of the substrate. The depth of the annular groove is less than or equal to half the thickness of the substrate, so that the stress generated by the substrate during reflow can be released. Therefore, the heat dissipation structure The disclosure can reduce warping during reflow, and the power supply module adopting the heat dissipation structure of disclosure can effectively reduce warping of the overall structure and improve structural reliability.
[0016] In order to make the aforementioned features and advantages of the disclosure easier and clearer to understand, the following embodiments are given and described in detail with accompanying drawings as follows. PRESENTATION OF FIGURES
[0017] Fig. 1A is a schematic perspective view of a heat dissipation structure according to one disclosure embodiment.
[0018] Fig.1B is a schematic perspective view of the heat dissipation structure of Fig.1A from another viewpoint.
[0019] [Fig.1C] is a schematic cross-sectional view along line II of [Fig.1A].
[0020] Fig. 2 is a schematic perspective view of a power supply module according to one disclosure embodiment.
[0021] Fig. 3 is a schematic perspective view of a power supply module according to another disclosure embodiment.
[0022] Fig. 4 is a schematic perspective view of a power supply module according to another disclosure embodiment. DETAILED DESCRIPTION OF THE INVENTION
[0023] Figure [1A] is a schematic perspective view of a heat dissipation structure according to one disclosure embodiment. Figure [1B] is a schematic perspective view of the heat dissipation structure of Figure [1A] from another viewpoint. Figure [1C] is a schematic cross-sectional view along line II of Figure [1A].
[0024] Reference should be made to [Fig. 1A], [Fig. 1B], and [Fig. 1C] simultaneously. In the embodiment, a heat dissipation structure 100a includes a substrate 110 and an annular groove 120. The substrate 110 has an upper surface 111 and a lower surface 113 opposite each other. The annular groove 120 is configured on the upper surface 111 of the substrate 110 to divide the substrate 110 into a configuration zone A and a peripheral zone P. The annular groove 120 is located between the configuration zone A and the peripheral zone P. A depth D of the annular groove 120 is less than or equal to half a thickness T of the substrate 110.
[0025] In detail, in the embodiment, the substrate material 110 is, for example, a metal, such as copper or aluminum, but not limited to this. The shape of the substrate 110 is, for example, a rounded rectangle, and the shapes of the annular groove 120 and substrate 110 are presented as arranged in a conforming manner. The annular groove 120 does not penetrate the substrate 110, and preferably, the depth D of the annular groove 120 is between 5% and 50% of the thickness T of the substrate 110. In other words, there is a height difference between the bottom of the annular groove 120 and the upper surface 111 of the substrate 110, and this height difference is the depth D of the annular groove 120. As shown in [Fig. 1B], in order to achieve a more favorable heat dissipation effect, the heat dissipation structure 100a of the embodiment may optionally include multiple heat dissipation fins 130 configured separately on the lower surface 113 of the substrate 110. In one embodiment, the orthographic projection of the heat dissipation fin 130 onto the substrate 110 overlaps, but is not limited to, the configuration area A of the substrate 110.In another embodiment not shown, the heat dissipation structure may not include the heat dissipation fin and still falls within the scope of disclosure protection.
[0026] In short, since the annular groove 120 is configured on the upper surface 111 of the substrate 110, the depth D of the annular groove 120 is less than or equal to half the thickness T of the substrate 110, so that the stress generated by the substrate 110 during reflow can be released. Therefore, the heat dissipation structure 100a of the embodiment can reduce warping during reflow.
[0027] Figure 2 is a schematic perspective view of a power supply module according to an embodiment of the disclosure. Reference should be made to Figure 2. In the embodiment, a power supply module 10a includes the heat dissipation structure 100a mentioned above, multiple layered substrates 200 (three are shown schematically), and multiple chips 300 (three are shown schematically). The layered substrates 200 are configured separately on the heat dissipation structure 100a and are located in configuration area A of the substrate 110. The layered substrate 200 is, for example, a direct bonded copper (DBC) substrate, but is not limited to such substrates. The chips 300 are configured on the layered substrates 200 and electrically connected to them, respectively.Here, the chip 300 is electrically connected to the layered substrate 200 via, for example, a wire 400, but not limited to this.
[0028] Since the shape of the annular groove 120 allows the heat dissipation structure 100a of the embodiment to release the stress generated by the substrate 110 during reflowing so as to reduce warping, the power supply module 10a uses the heat dissipation structure 100a of the embodiment This implementation can effectively reduce the warping of the overall structure and improve structural reliability.
[0029] It should be noted here that the following embodiments continue to use the component reference numbers and some of the content of the preceding embodiments, in which the same reference numbers are used to designate the same or similar components, and the description of the same technical content is omitted. For the description of the omitted part, reference may be made to the preceding embodiments, and the details are not repeated here.
[0030] Figure 3 is a schematic perspective view of a power supply module according to another disclosure embodiment. Reference should be made to Figures 2 and 3. A power supply module 10b of this embodiment is similar to the power supply module 10a of Figure 2. The difference between the two is that in this embodiment, a heat dissipation structure 100b further includes multiple first auxiliary grooves 140 communicating with the annular groove 120 to divide the configuration area A into at least three configuration sub-areas A1, A2, and A3. This means that the configuration sub-areas A1, A2, and A3 are separated by the first auxiliary groove 140. In top views, the annular groove 120 and the first auxiliary groove 140 are presented in the form of the word Mu, i.e., a groove in the shape of the word Mu.The 200 stratified substrates are arranged respectively corresponding to the sub-zones of configuration Al, A2 and A3. The areas of the sub-zones of configuration Al, A2 and A3 are slightly larger than the areas of the 200 stratified substrates.
[0031] Since the shapes of the annular groove 120 and the first auxiliary groove 140 can allow the heat dissipation structure 100b of the embodiment to release the stress generated by the substrate 110 during reflowing in order to reduce warping, the power module 10b using the heat dissipation structure 100b of the embodiment can effectively reduce the warping of the overall structure and improve structural reliability.
[0032] Figure 4 is a schematic perspective view of a power supply module according to another disclosure embodiment. Reference should be made to Figures 3 and 4. A power supply module 10c of this embodiment is similar to the power supply module 10b of Figure 3. The difference between the two is that in this embodiment, a heat dissipation structure 100c further includes multiple secondary auxiliary grooves 150 communicating with the annular groove 120 and extending respectively to four corners C of the peripheral area P. In top views, the annular groove 120 and the first auxiliary groove 140 are represented by the word Mu, i.e., a groove in shape of the word Mu, and the second auxiliary branch 150 is a four-sided groove extending to corner C.
[0033] Since the shapes of the annular groove 120, the first auxiliary groove 140 and the second auxiliary groove 150 can allow the heat dissipation structure 100c of the embodiment to release the stress generated by the substrate 110 during reflowing in order to reduce warping, the power module 10c using the heat dissipation structure 100c of the embodiment can effectively reduce the warping of the overall structure and improve structural reliability.
[0034] In summary, according to the design of the heat dissipation structure of the disclosure, the annular groove is configured on the upper surface of the substrate. The depth of the annular groove is less than or equal to half the thickness of the substrate, so that the stress generated by the substrate during reflow can be released. Therefore, the heat dissipation structure of the disclosure can reduce warping during reflow, and the power module adopting the heat dissipation structure of the disclosure can effectively reduce the warping of the overall structure and improve structural reliability.
[0035] Although the disclosure has been described with reference to the embodiments above, the embodiments are not intended to limit the disclosure. Any person skilled in the art may make changes and modifications without departing from the spirit and scope of the disclosure. Therefore, the scope of the disclosure will be defined in the attached claims.
Claims
Demands
1. Heat dissipation structure (100a, 100b, 100c), comprising: a substrate (110), having an upper surface (111) and a lower surface (113) opposite each other; an annular groove (120), configured on the upper surface (111) of the substrate (110) to divide the substrate (110) into a configuration zone (A) and a peripheral zone (P), in which the annular groove (120) is located between the configuration zone (A) and the peripheral zone (P), and a depth (D) of the annular groove (120) is less than or equal to half a thickness (T) of the substrate (110); a plurality of first auxiliary grooves (140), communicating with the annular groove (120) to divide the configuration zone (A) into at least three configuration sub-zones (A1, A2, A3);and a plurality of secondary auxiliary grooves (150), communicating with the annular groove (120) and extending up to and connecting respectively four corners (C) of the peripheral zone (P) of the substrate (110).;
2. Heat dissipation structure (100a, 100b, 100c) according to claim 1, further comprising: a plurality of heat dissipation fins (130), configured separately on the lower surface (113) of the substrate (110).
3. Heat dissipation structure (100a, 100b, 100c) according to claim 1, wherein the depth (D) of the annular groove (120) is between 5% and 50% of the thickness (T) of the substrate (110).
4. Power supply module (10a, 10b, 10c), comprising: a heat dissipation structure (100a, 100b, 100c), comprising: a substrate (110), having an upper surface (111) and a lower surface (113) opposite each other; and an annular groove (120), configured on the upper surface (111) of the substrate (110) to divide the substrate (110) into a configuration zone (A) and a peripheral zone (P), wherein the annular groove (120) is located between the configuration zone (A) and the peripheral zone (P), and a groove depth (D) annular (120) is less than or equal to half a thickness (T) of the substrate (110); a plurality of stratified substrates (200), configured on the heat dissipation structure (100a, 100b, 100c), and located in the configuration zone (A) of the substrate (110); a plurality of first auxiliary grooves (140), communicating with the annular groove (120) to divide the configuration zone (A) into at least three configuration sub-zones (Al, A2, A3), in which the stratified substrates (200) are arranged respectively corresponding to the configuration sub-zones (Al, A2, A3); a plurality of secondary auxiliary grooves (150), communicating with the annular groove (120) and extending to and connecting respectively four corners (C) of the peripheral zone (P) of the substrate (110); and a plurality of chips (300), respectively configured on the layered substrates (200), and electrically connected with the layered substrates (200), respectively.
5. Power supply module (10a, 10b, 10c) according to claim 4, wherein the heat dissipation structure (100a, 100b, 100c) further comprises: a plurality of heat dissipation fins (130), configured separately on the lower surface (113) of the substrate (110).
6. Power supply module (10a, 10b, 10c) according to claim 4, wherein the depth (D) of the annular groove (120) is between 5% and 50% of the thickness (T) of the substrate (110).