High-power buried peak optoelectronic component

Abstract

The invention relates to an optoelectronic component comprising a stack of layers on a substrate along a stacking direction; said stack comprising: a ridge heterostructure including a base and a guide ribbon extending along a guide direction orthogonal to the stacking direction, the guide ribbon being configured to propagate a confined light wave; a nitride coating layer in which said guide ribbon is embedded. Figure for the abstract: Fig. 2

Description

Title of the invention: High-power buried peak optoelectronic component

[0001] The invention relates to the field of active optoelectronic devices with buried strip comprising an active zone made of III-V semiconductor. This type of component, which can be a laser, an amplifier, a modulator or a detector, is for example used in the field of telecommunications.

[0002] Ridge optoelectronic devices are optical components used in optoelectronic devices such as semiconductor lasers and optical amplifiers. These structures are characterized by a narrow, elongated active region (typically a few micrometers wide and several hundred micrometers long) surrounded by layers of lower refractive index materials. The term "ridge" refers to the shape of the active region, which is often ridge- or ribbon-shaped. This shape helps confine light to a small area, which is essential for achieving laser emission from a semiconductor. Ridge optoelectronic devices are typically fabricated using lithography and etching techniques to sculpt the semiconductor layers into a ridge or ribbon shape.Electrodes are then deposited on the active region to allow the injection of electric current and the excitation of light in the active region. Ridge optoelectronic components are widely used in semiconductor optical devices due to their ability to produce narrow, high-quality light beams with high efficiency and low power consumption.

[0003] A more advanced development of ridge optoelectronic components is the buried ridge structure. The buried ridge structure consists of a narrow, elongated active region (as in the case of the conventional ridge structure) that is buried under a layer of lower refractive index material called a "coating layer". The advantage of the buried ridge structure is that it allows for better control of the spatial distribution of light and more stable laser emission than in a conventional ridge structure. In addition, this structure can also reduce light losses and improve energy conversion efficiency. The fabrication of the buried ridge structure typically involves lithography, etching, and epitaxial layer deposition techniques to create the ridge-shaped active region and the buried layer surrounding it.

[0004] Optoelectronic devices, generally speaking, produce a lot of heat when they are subjected to an electric current during their operation. This heat must be dissipated efficiently to avoid overheating which can degrade the performance of the device or even damage the device.

[0005] In this sense, several problems have been clearly identified with the buried ridge structures known in the state of the art. Indeed, current coating layers do not present satisfactory results in terms of heat dissipation for high power optoelectronic devices.

[0006] We will begin by introducing the solutions known to those skilled in the art presenting materials used to produce the coating layer in buried peak optoelectronic components.

[0007] A first known solution concerns the production of the benzo-cyclobutene (BCB) coating layer which has high electrical insulation and a relative refractive index making it possible to improve the guidance of the electromagnetic wave confined in the active zone. However, the benzo-cyclobutene (BCB) coating layer has low thermal conductivity, which degrades the thermal dissipation of the heat produced by the optoelectronic component.

[0008] A second known solution involves making the coating layer from a metal-doped semiconductor, such as iron-doped InP. This solution provides good thermal conductivity to dissipate the heat produced. However, the proposed solution has insufficient electrical insulation. This leads to a degradation in the performance of the optoelectronic component with an increase in loss currents and the creation of parasitic capacitances.

[0009] To overcome the limitations of existing solutions, the invention proposes an optoelectronic component, a heterostructure with a ridge buried in a nitride coating layer, more particularly aluminum nitride or boron nitride. The optoelectronic component according to the invention has considerable advantages in terms of improvement, heat dissipation and electrical insulation compared to state-of-the-art solutions.

[0010] Furthermore, the optoelectronic component according to the invention is compatible with the “flip-chip” type assembly (or “returned chip” in French) with at least one external circuit.

[0011] The invention further relates to a manufacturing method thus making it possible to manufacture a ridge heterostructure buried in a nitride coating layer, without resorting to a localized etching operation of said coating layer. This makes it possible to avoid the use of aggressive etching solutions which can damage the ridge heterostructure. The method according to the invention thus makes it possible to overcome the manufacturing problems linked to the difficulty of etching a nitride coating layer.

[0012] The subject of the invention is an optoelectronic component comprising a stack of layers on a substrate in a stacking direction; said stack comprising: - a hetero structure with a crest comprising a base and a guide strip extending in a guiding direction orthogonal to the stacking direction, the guiding strip being configured to propagate a confined light wave; - a nitride coating layer, in which said guide strip is buried.

[0013] According to a particular aspect of the invention, the coating layer is made of aluminum nitride or boron nitride.

[0014] According to a particular aspect of the invention, the optoelectronic component has a thickness greater than the height of the guide strip.

[0015] According to a particular aspect of the invention, the coating layer has a flat upper surface.

[0016] According to a particular aspect of the invention, the ridge heterostructure comprises: • a lower containment structure made of a first semiconductor material; • an active zone made of at least one second semiconductor material; • an upper containment structure made of a third material microconductor; The active zone being confined between the upper confinement structure and the lower confinement structure; said active zone being designed to generate photons by recombination of charge carriers injected into the upper and lower confinement structures. The guide strip being formed by at least a portion of the upper confinement structure.

[0017] According to a particular aspect of the invention, the optoelectronic component comprises a first electrode made of a conductive material having at least a first portion deposited on the upper surface of the guide strip.

[0018] According to a particular aspect of the invention, the optoelectronic component comprises a second electrode made of a conductive material connected to the lower confinement structure through a via passing through the coating layer.

[0019] According to a particular aspect of the invention, each of the electrodes has at least a second part deposited on the upper surface of the coating layer.

[0020] According to a particular aspect of the invention, the upper confinement structure is N-doped and the lower confinement structure is P-doped or vice versa.

[0021] According to a particular aspect of the invention, the ridge heterostructure comprises an etching stop layer for carrying out selective etching of said third material. semiconductor forming the guide strip. Said etch stop layer being confined between the base and the guide strip.

[0022] According to a particular aspect of the invention, the etching stop layer has a thickness of less than 20 nm.

[0023] According to a particular aspect of the invention, the optoelectronic component further comprises an ohmic contact layer deposited on the upper surface of the guide strip. The ohmic contact layer is made of a fourth semiconductor material having an energy gap smaller than that of the third semiconductor material.

[0024] The invention also relates to a method for manufacturing an optoelectronic device, comprising the following steps:

[0025] i) manufacturing a stack of semiconductor layers deposited on a substrate in a stacking direction; said stack being called “initial stack”;

[0026] ii) manufacturing a first intermediate ribbon and a second intermediate ribbon by partially etching the initial stack; each intermediate ribbon being covered by a sacrificial layer; each intermediate ribbon being arranged on a base formed by the non-etched layers of said initial stack; each intermediate ribbon extending in a guiding direction orthogonal to the stacking direction;

[0027] iii) depositing a nitride coating layer so as to encapsulate the first intermediate ribbon and the second intermediate ribbon;

[0028] iv) planarizing the coating layer to obtain a flat upper surface of the coating layer and so as to uncover the sacrificial layer of the first intermediate ribbon and the second intermediate ribbon;

[0029] v) completely removing the sacrificial layer by etching to obtain at least one guide strip buried in the nitride coating layer from the first intermediate strip.

[0030] According to a particular aspect of the invention, the initial stacking process comprises, in order starting from said substrate: - a first N or P doped layer of a first semiconductor material intended to form a lower confinement structure; - at least one second layer made of a second semiconductor material having an energy gap lower than that of the first semiconductor material intended to form an active zone; - at least a third layer having a doping opposite to that of the first layer, produced by a third semiconductor material having an energy gap greater than that of the second semiconductor material and intended to be part of a higher containment structure; - an ohmic contact layer made of a fourth semiconductor material having an energy gap lower than that of the third semiconductor material; - a sacrificial layer made of a fifth material allowing selective etching to be carried out with respect to the ohmic contact layer;

[0031] According to a particular aspect of the invention, step ii) is carried out by partially etching the sacrificial layer, the ohmic contact layer and the at least one third layer;

[0032] According to a particular aspect of the invention, the method further comprises the following steps:

[0033] vi) fabricating at least one through via to the first layer by fully or partially etching the second intermediate ribbon and partially at least the second layer;

[0034] vii) depositing a first electrode of a conductive material having at least a first portion deposited on the upper surface of the guide strip and a second electrode of a conductive material having at least a first portion deposited on the second layer through the at least one via.

[0035] According to a particular aspect of the invention, the planarization step iv) is carried out by polishing via an abrasive surface comprising balls having a diameter of less than 5 μm.

[0036] Other characteristics and advantages of the present invention will appear better on reading the description which follows in relation to the following appended drawings.

[0037] [Fig-1] [Fig. 1] illustrates a partial view of a ridge optoelectronic component according to the state of the art.

[0038] [Fig.2] [Fig.2] represents a sectional view of an optoelectronic component with buried ridge according to the invention.

[0039] [Fig.3a] [Fig.3a] illustrates the first step of the component manufacturing process optoelectronics according to the invention.

[0040] [Fig.3b] [Fig.3b] illustrates the second step of the manufacturing process of the optoelectronic component according to the invention.

[0041] [Fig.3c] [Fig.3c] illustrates the third step of the component manufacturing process optoelectronics according to the invention.

[0042] [Fig.3d] [Fig.3d] illustrates the fourth step of the manufacturing process of the optoelectronic component according to the invention.

[0043] [Fig.3e] [Fig.3e] illustrates the fifth step of the manufacturing process of the optoelectronic component according to the invention.

[0044] [Fig.3f] [Fig.3f] illustrates the sixth step of the component manufacturing process optoelectronics according to the invention.

[0045] [Fig.3g] [Fig.3g] illustrates the seventh step of the manufacturing process of the optoelectronic component according to the invention.

[0046] [Fig.4] [Fig.4] illustrates a flowchart of the manufacturing process of the optoelectronic component according to the invention.

[0047] [Fig.l] illustrates a three-dimensional view of an example of a D0 peak optoelectronic component according to the state of the art in order to facilitate the understanding of the basic structure of a peak optoelectronic component.

[0048] The D0 peak optoelectronic component is produced on a SUB substrate. The substrate may be a solid substrate made of a IILV type semiconductor material or a stack of several assembled semiconductor materials. The D0 peak optoelectronic component comprises a peak heterostructure made of a first semiconductor material and comprising an active layer 12' confined between an upper confinement structure 13', 15' and a lower confinement structure 11'. The D0 peak optoelectronic component further comprises a first electrode 3' and a second electrode 4' made of electrically conductive layers.

[0049] The lower confinement structure 11' is made of a layer 11' of a semiconductor material. The lower confinement structure 11' is P or N doped. The upper confinement structure 13', 15' is made of a layer 13' on which rests a strip 15' made of a semiconductor material. The strip 15' extends in the direction Y orthogonal to the stacking direction Z. The upper confinement structure 13', 15' is doped oppositely to the lower confinement structure 11'. The active layer 12' is made of an intrinsic material having an energy gap smaller than the energy gaps of the materials constituting the lower confinement structure 11' and the upper confinement structure 13', 15'. The first electrode 3' is deposited directly on the upper surface of the strip 15' so as to be electrically connected to the upper confinement structure 13', 15'.The second electrode 4' is deposited on the lower face of the substrate SUB so as to be electrically connected to the lower confinement structure 11'.

[0050] The first electrode 3' and the second electrode 4' are intended to be connected to an external electrical generator not shown. The application of an electrical voltage between the two electrodes 3' and 4' injects positive charge carriers (holes) into the volume of the upper confinement structure 13', 15' (P-doped) and negative charge carriers (electrons) into the volume of the lower confinement structure 11' (N-doped). The charge carriers of opposite signs are confined in the intrinsic active layer 12' with a small gap, to recombine. The re combination of electrons and holes in the active layer 12' induces the emission of photons at a wavelength corresponding to the energy gap of the material constituting said active layer 12'. The photons emitted by recombination of injected charge carriers are confined in said layers and form an electromagnetic wave which propagates along the guiding direction Y of the strip 15'.

[0051] As previously indicated, when the DO peak optoelectronic device operates at high frequency and / or high power, the heat produced by the device poses a problem affecting the performance and reliability of the device.

[0052] [Fig.2] represents a sectional view of an optoelectronic component DI according to the invention, making it possible to solve the problems previously described.

[0053] The optoelectronic component DI comprises a stack of layers on a substrate SUB in a stacking direction Z. The substrate SUB is made by a solid wafer of a type IILV semiconductor material alone.

[0054] Alternatively, the SUB substrate is made by a solid wafer of a type IILV semiconductor material assembled to another silicon, or SOI or SiO2 substrate deposited on silicon. Alternatively, the SUB substrate is made by a layer of a type IILV semiconductor material deposited on another silicon, or SOI or SiO2 substrate deposited on silicon. By way of non-limiting example, the type IILV semiconductor material is indium phosphide InP or gallium arsenide GaAs.

[0055] Said stack of layers comprises a ridge heterostructure 1 for generating and / or guiding an electromagnetic wave, a coating layer 2, a first electrode 3 and a second electrode 4.

[0056] The ridge heterostructure 1 comprising an active zone 12 confined between an upper confinement structure 13a, 14, 15a and a lower confinement structure 11. The lower confinement structure 11 comprises at least a first layer 11 made of a first semiconductor material. Advantageously, the first semiconductor material is of type IILV, for example InP or GaAs. The first semiconductor material has a first energy gap value Egb

[0057] The active zone 12 is made of a second semiconductor material having a second energy gap value Eg2. Advantageously, the active zone 12 is made of a ternary or quaternary alloy of type IILV, for example InGaAsP or InGaAlAs. Alternatively, the active zone 12 is made by a stack of alternating layers of different compositions of ternary or quaternary alloys of type IILV. The thickness of each layer of said stack is from a few nm to around ten nm so as to form a series of quantum wells (translation of the English expression “multi-quantum well layers”).

[0058] The upper containment structure 13a, 14, 15a comprises a planar base 13a, 14 along a plane orthogonal to the stacking direction Z; and a guide strip 15a arranged on said base. The guide strip 15a extends longitudinally along a guide direction Y orthogonal to the stacking direction Z. The planar base comprises a layer 13a made of a third semiconductor material having a third energy gap value Eg3. The guide strip 15a is made of said third semiconductor material. Advantageously, the third semiconductor material is identical to the first semiconductor material. This makes it possible to facilitate the epitaxial growth of the ridge heterostructure.

[0059] The lower confinement structure 11 is P or N doped. The upper confinement structure 13a, 14, 15a is doped in the opposite manner to the lower confinement structure 11. In the remainder of the description, it is considered that the lower confinement structure 11 is N doped and that the upper confinement structure 13a, 14, 15a is P doped, for non-limiting illustration purposes.

[0060] In the case of an active zone made by a massive layer, the second energy gap value Eg2 of the material constituting the active zone 12 is lower than the first energy gap value Egi of the lower confinement structure 11. The second energy gap value Eg2 of the material constituting the active zone 12 is lower than the third energy gap value Eg3 of the upper confinement structure 13a, 14, 15a. The active zone 12 is intrinsic, in the undoped sense.

[0061] In the case of an active zone produced by stacking alternating layers, the materials constituting the layers of the alternating stack each have an energy gap value lower than the first energy gap value Egi of the lower confinement structure 11.

[0062] The first electrode 3 is a microstructure made of a conductive material having at least a first portion deposited on the upper surface of the guide strip 15a to create an electrical path between the electrode and the upper confinement structure 13a, 14, 15a. The second electrode 4 is a microstructure made of a conductive material having at least a first portion deposited on the lower confinement structure 11 through a via VI passing through the coating layer 2. The internal walls of the via VI are passivated by a passivation layer 41 made of dielectric. The passivation layer 41 deposited on the internal walls of the via VI can be made of silica or silicon nitride. Advantageously, the passivation layer 41 deposited on the internal walls of the via VI has a thickness of 100 nm. Said passivation layer 41 makes it possible to isolate the second electrode 4 from at least the active zone 12.

[0063] The first electrode 3 and the second electrode 4 are intended to be connected to an external electrical generator not shown. The application of an electrical voltage between the two electrodes 3 and 4 makes it possible to inject positive charge carriers (holes) in the volume of the upper confinement structure and negative charge carriers (electrons) in the volume of the lower confinement structure. The opposite-sign charge carriers are confined in the intrinsic active zone 12 with a small gap, to recombine. The recombination of electrons and holes in the active zone 12 allows the emission of photons at a wavelength corresponding to the second energy gap value Eg2. The photons emitted by recombination of injected charge carriers are confined in said layers and form an electromagnetic wave which propagates along the guiding direction Y of the strip 15a.

[0064] The ridge heterostructure 1 is buried in the coating layer 2. The coating layer 2 is made of a nitride having good thermal conductivity and good electrical insulation. Advantageously, the coating layer 2 is made of aluminum nitride or boron nitride. The thermal characteristics of the nitride coating layer 2 make it possible to improve the thermal dissipation of the heat produced by the ridge heterostructure 1. This makes it possible to achieve high-frequency and high-power operation. In addition, the choice of nitrides to make the coating layer 2 makes it possible to ensure good electrical insulation of the ridge heterostructure 1, which implies an improvement in the emission and guidance performance of the optoelectronic component DI. Advantageously, the coating layer 2 has a thickness greater than the height of the guide strip 15a.Thus, the side walls of the guide strip 15a extending in the guide direction Y are in contact with the coating layer 2. This makes it possible to increase the heat exchange interface between the coating layer 2 and the ridge heterostructure 1 and thus improve the heat dissipation in the component according to the invention.

[0065] Advantageously, the coating layer 2 has a planar upper surface 201. The planar upper surface 201 is parallel to the plane (X,Y) orthogonal to the stacking direction Z. The planarity of the upper surface 201 of the coating layer 2 makes it possible to have a planar mechanical support for the deposition of the electrodes 3, 4. Each of the electrodes 3, 4 has at least one part deposited on the planar upper surface 201 of the coating layer 2. A planar mechanical support allows the assembly of the optoelectronic component DI with at least one external circuit by the “flip-chip” technique. It is recalled that the “flip-chip” assembly technique requires a face-to-face arrangement of a planar external surface of the component DI comprising contact electrodes with an external surface of another circuit also having contact electrodes.

[0066] Advantageously, the base of the upper confinement structure comprises an etch stop layer 14 for carrying out selective etching of the third material. semiconductor forming the guide strip 15a. The etch stop layer 14 is confined between the base formed by the layer 13a and the guide strip 15a. For example, when the guide strip 15a is formed by the indium phosphide InP, the etch stop layer 14 is made by the alloy GalnAsP to allow selective etching of the InP in order to manufacture the ridge heterostructure 1. For example, when the guide strip 15a is formed by the gallium arsenide GaAs, the etch stop layer 14 is made by the alloy GalnP to allow selective etching of the GaAs in order to manufacture the ridge heterostructure 1. The thickness of the etch stop layer must be less than 20nm, preferably equal to 10nm, so as not to cause an optical disturbance of the electromagnetic wave guided by the guide strip 15a.

[0067] The optoelectronic component DI further comprises an ohmic contact layer 16a confined between the upper surface of the guide strip 15a and the first electrode 3. The ohmic contact layer 16a is made of a fourth semiconductor material having an energy gap Eg4 lower than that of the third semiconductor material Eg3. This makes it possible to obtain an ohmic contact with the first electrode 3 and not a Schottky contact.

[0068] Optionally, the external walls of the guide strip 15a are covered with an adhesion layer, not shown, making it possible to improve the mechanical adhesion of the coating layer 2 with the upper confinement structure. The adhesion layer is a dielectric layer, for example SiO2, having a thickness of less than 0.5 μm.

[0069] Generally speaking, the DI device according to the invention has a ridge structure 1 buried in a coating layer 2 of nitride, preferably aluminum nitride AIN, or boron nitride BN. These materials have many advantages as a coating layer. First of all, they are corrosion resistant, which makes them an ideal choice for applications in aggressive environments. In addition, they are thermally stable, which makes it possible to maintain the mechanical robustness of the layer even at high temperatures. In addition, the listed materials are also electrically insulating materials, but also have excellent thermal conductivity, which makes them an ideal choice for heat dissipation applications where good heat management is essential to maintain the performance and reliability of the optoelectronic component.

[0070] However, the manufacture of a nitride coating layer, and more particularly of AIN, or BN, presents several technical constraints due to the mechanochemical properties of said materials. Indeed, these are very hard and corrosion-resistant materials, which makes them difficult to etch with conventional etching methods of a microtechnical manufacturing process. In addition, these materials have very high xN binding energies which makes their wet or plasma etching very difficult. In addition, the use of very concentrated etching solutions risks damaging the other structures and more particularly the ridge heterostructure. For these reasons, the invention further proposes a method for manufacturing the optoelectronic component according to the invention making it possible to resolve the aforementioned problems. More particularly, the method according to the invention does not require an etching operation of the coating layer 2 made of ultra-resistant nitrides at the level of the zone occupied by the ridge heterostructure 1. Figures 3a to 3g illustrate the steps of the method for manufacturing an optoelectronic component according to the invention.

[0071] [Fig.3a] illustrates the first step i) of the method for manufacturing the optoelectronic component DI according to the invention. The first step i) consists of manufacturing on the substrate SUB described above a stack of layers in the stacking direction Z comprising, starting from said substrate: - a first N or P doped layer 11 made from the first semiconductor material; - a second layer 12 made of the second semiconductor material having an energy gap lower than that of the first layer 11. The second layer 12 is intended to form the active zone 12. Alternatively, the second layer 12 is replaced by a stack of alternating layers of different compositions of ternary or quaternary alloys of type III-V. The materials constituting the alternating stack layers each have an energy gap value lower than that of the first layer 11. The alternating stack is intended to form the active zone 12. In the following, we will describe the embodiment with an active zone made of the second layer 12. The steps of the method are compatible with an active zone 12 made of a solid layer 12 or a stack of alternating layers; - at least a third layer 13, having a doping opposite to that of the first layer 11 and made of the third semiconductor material. The third layer 13 intended to form part of the base of the upper confinement structure; - an etching stop layer 14 designed to carry out selective etching of the third semiconductor material; - a fourth layer 15, having a doping opposite to that of the first layer 11 and made of the third semiconductor material. The third layer 13 intended to be part of the guide strip of the upper confinement structure; - an ohmic contact layer 16 made of a fourth semiconductor material having an energy gap lower than that of the third semiconductor material; - a sacrificial layer 17 made of a fifth material allowing selective etching to be carried out with respect to the ohmic contact layer 16;

[0072] According to a first example, the first layer 11 is made of N-doped InP with a thickness of 1pm to 5pm, the second layer 12 is made of a ternary or quaternary alloy of intrinsic Indium with a thickness of 100nm to 400nm, the third layer 13 and the fourth layer 15 are made of P-doped InP with a thickness of 1pm to 2pm, the etching stop layer 14 is made of GalnAsP, the ohmic contact layer 16 is made of P-doped GalnAs with a thickness of 100nm to 300nm, the sacrificial layer 17 is made of InP with a thickness greater than 1pm, preferably greater than 5pm.

[0073] The first step can be carried out by growing thin layers by epitaxy or by sputtering deposition.

[0074] [Fig.3b] illustrates the second step ii) of the method of manufacturing the optoelectronic component DI according to the invention. The second step ii) consists of manufacturing a first intermediate ribbon 17a, 16a, 15a and a second intermediate ribbon 17b, 16b, 15b by locally etching the sacrificial layer 17, the ohmic contact layer 16 and the third layer 15. Each intermediate ribbon extends longitudinally in a guide direction Y orthogonal to the stacking direction Z. The first intermediate ribbon consists of a first unetched portion 15a of the fourth layer 15, a first unetched portion 16a of the ohmic contact layer 16, and a first remaining portion 17a of the sacrificial layer 17. The second intermediate ribbon consists of a second unetched portion 15b of the fourth layer 15, a second unetched portion 16b of the ohmic contact layer 16, and a second remaining portion 17b of the sacrificial layer 17.

[0075] The manufacture of the intermediate ribbons can be carried out by a succession of lithography and etching operations.

[0076] According to a first alternative, it is possible to carry out a selective chemical etching of the stack 15, 16, 17 layer by layer in the following manner: For example, to etch the sacrificial layer 17 and the fourth layer 15 in InP, a solution comprising hydrochloric acid HCl or hydrobromic acid HBr diluted in pure water or buffered with phosphoric acid H3PO4 is used. To etch the ohmic contact layer 16, a solution comprising sulfuric acid H2SO4, hydrogen peroxide H2O2 and pure water, or a solution comprising phosphoric acid H3PO4, hydrogen peroxide and pure water is used. A lithography mask is used to define the pattern of the ribbon during etching.

[0077] According to a second alternative, it is possible to carry out non-chemical etching selective of the stack 15,16,17. For example, non-selective chemical etching is carried out by a solution comprising hydrobromic acid HBr, hydrogen peroxide H2O2 and pure water.

[0078] According to a third alternative, it is possible to carry out non-selective plasma etching of the stack 15, 16, 17.

[0079] [Fig.3c] illustrates the third step iii) of the method for manufacturing the optoelectronic component DI according to the invention. The third step iii) consists of depositing a coating layer 2 of nitride so as to encapsulate the first intermediate strip 17a, 16a, 15a and the second intermediate strip 17b, 16b, 15b. Preferably, the coating layer 2 is made of aluminum nitride or boron nitride. Advantageously, the deposition is carried out by sputtering to remain within temperature ranges compatible with IILV type semiconductors constituting the layers of the component being manufactured.

[0080] [Fig.3d] illustrates the fourth step iv) of the method for manufacturing the optoelectronic component DI according to the invention. The fourth step iv) consists of planarizing the coating layer 2 to obtain a flat upper surface of the coating layer 2 and so as to uncover the sacrificial layer 17a, 17b of the first intermediate strip and of the second intermediate strip. The level of the coating layer 2 is lowered and flattened via a mechanical polishing treatment or a combination of chemical and mechanical treatment (chemical-mechanical polishing) to obtain a flat, smooth and uniform upper surface. The polishing must reach at least the upper part of the sacrificial layers 17a and 17b. Thus, a uniform surface is obtained revealing the upper surfaces of the sacrificial layers of the two intermediate strips.This gives a structuring of the coating layer 2 without destructive etching of the semiconductor layers of the structure being manufactured. The layers 11, 12, 13, 14, 15a intended to form the ridge heterostructure (active element of the component) are protected by the sacrificial layer 17a which is planarized (with the coating layer 2) by the treatment of step iv). Advantageously, the planarization step is carried out by polishing via an abrasive surface comprising diamond or aluminum balls having a diameter of less than 5 pm. Advantageously, the planarization step is followed by a polishing step using an abrasive comprising A12O3 or colloidal silica balls having a diameter of less than or equal to 0.02 pm to level off the last micron of the layer 17.

[0081] [Fig.3e] illustrates the fifth step v) of the method for manufacturing the optoelectronic component DI according to the invention. The fifth step v) consists of fully etching the remaining parts of the sacrificial layer 17a and 17b to obtain at least one guide strip 16a, 15a buried in the nitride coating layer 2. The etching solution is chosen to etch only the sacrificial layer 17a without damage the ohmic contact layer 16a. For this, an etching solution is used that is selective with respect to the ohmic contact layer 16 and comprises hydrochloric acid HCl or hydrobromic acid HBr, for example.

[0082] [Fig.3f] illustrates the sixth step vi) of the method for manufacturing the optoelectronic component DI according to the invention. The sixth step vi) consists of manufacturing at least one via V1 passing through the upper surface 201 of the coating layer 2 to the first layer 11. According to a first alternative, a single via V1 is manufactured and it extends parallel to the guide strip (along Y). Alternatively, it is possible to produce several vias VI which form a row which extends parallel to the guide strip. During this step, the layers 16a and 15a are protected by a mask made of dielectric, or resin or metal.

[0083] According to a first alternative, it is possible to carry out a selective chemical etching of the stack 16b, 15b, 14, 13, 12 layer by layer in the following manner: For example, to etch the fourth layer 15b and the third layer 13 in InP, a solution comprising hydrochloric acid HCl or hydrobromic acid HBr is used. To etch the ohmic contact layer 16b and the active zone 12, a solution comprising sulfuric acid H2SO4 is used. To etch the etch stop layer 14, a solution comprising hydrochloric or hydrobromic acid is used.

[0084] According to a second alternative, it is possible to carry out non-selective chemical etching of the stack 16b,15b,14,13,12.

[0085] According to a third alternative, it is possible to carry out non-selective plasma etching of the stack 16b,15b,14,13,12.

[0086] [Fig.3g] illustrates the seventh step vii) of the method for manufacturing the optoelectronic component DI according to the invention. This involves depositing a first electrode 3 and a second electrode 4 made of a conductive material. The first electrode 3 has at least a first part deposited on the ohmic contact layer 16a. The second electrode 4 has at least a first part deposited on the first layer 11 through the via VI or the plurality of vias V1 depending on the design chosen in the previous step. Prior to the manufacture of the second electrode 4, the internal walls of the via VI are passivated by the deposition of a dielectric passivation layer 41 on said internal walls. The passivation layer 41 may be made of silica or silicon nitride. Advantageously, the passivation layer 41 has a thickness of 100nm. Said passivation layer makes it possible to isolate the second electrode 4 from at least the active zone 12.

[0087] More generally, [Fig.4] illustrates a flowchart of the method for manufacturing the optoelectronic component according to the invention. The first step i) consists of manufacturing a stack of semiconductor layers deposited on a substrate SUB in a stacking direction Z. Said stack being called “initial stack”.

[0088] The second step ü) consists of manufacturing a first intermediate ribbon 17a, 16a, 15a and a second intermediate ribbon 17b, 16b, 15b by partially etching the initial stack. Each intermediate ribbon is covered (or capped) by a sacrificial layer 17a, 17b. Each intermediate ribbon is arranged on a base formed by the non-etched layers of said initial stack 17a, 17b. Each intermediate ribbon extends in a guide direction Y orthogonal to the stacking direction Z.

[0089] The third step iii) consists of depositing a nitride coating layer 2 so as to encapsulate the first intermediate ribbon and the second intermediate ribbon

[0090] The fourth step iv) consists of planarizing the coating layer 2 to obtain a flat upper surface 201 of the coating layer 2 and so as to uncover the sacrificial layers 17a, 17b of the first intermediate strip 17a, 16a, 15a and of the second intermediate strip 17b, 16b, 15b. Advantageously, the planarization step iv) is carried out by polishing via an abrasive surface comprising balls having a diameter less than 5 μm. Advantageously, the planarization step iv) is followed by a polishing step using an abrasive comprising balls having a diameter less than or equal to 0.02 μm.

[0091] The fifth step v) consists of completely removing the sacrificial layers 17a, 17b by etching to obtain at least one guide strip 16a, 15a buried in the nitride coating layer 2 from the first intermediate strip 17a, 16a, 15a.

[0092] Optionally, the sixth step vi) consists of manufacturing at least one through via V1 in order to reach a lower confinement structure of the stack by fully or partially etching the second intermediate ribbon 17b, 16b, 15b.

[0093] Then, the seventh step vii) consists of depositing a first electrode 3 made of a conductive material having at least a first part deposited on the upper surface of the guide strip 13a, 14, 15a and a second electrode 4 made of a conductive material filling the via VL. Prior to the manufacture of the second electrode 4, the internal walls of the via VI are passivated by the deposition of a passivation layer 41 made of dielectric on said internal walls. The passivation layer 41 can be made of silica or silicon nitride. Advantageously, the passivation layer 41 has a thickness of 100 nm. Said passivation layer makes it possible to isolate the second electrode 4 from at least the active zone 12.

[0094] The method according to the invention thus makes it possible to manufacture a ridge heterostructure buried in a nitride coating layer, more particularly in AIN or SiN or BN, without resorting to an etching operation of the coating layer. This makes it possible to avoid the use of aggressive etching solutions which could damage the ridge heterostructure. An optoelectronic component is thus obtained which has considerable advantages in terms of improved heat dissipation and electrical insulation compared to state-of-the-art solutions.

Claims

Claims

1. Optoelectronic component (Dl) comprising a stack of layers on a substrate (SUB) in a stacking direction (Z); said stack comprising: - a ridge heterostructure (1) comprising a base (13a) and a guide strip (15a) extending in a guide direction (Y) orthogonal to the stacking direction (Z), the guide strip (15a) being configured to propagate a confined light wave; - a nitride coating layer (2), in which said guide strip (13a, 14, 15a) is buried.

2. Optoelectronic component (Dl) according to claim 1 wherein the coating layer (2) is made of aluminum nitride or boron nitride.

3. Optoelectronic component (Dl) according to any one of claims 1 or 2 wherein the coating layer (2) has a thickness greater than the height of the guide strip (15a).

4. Optoelectronic component (Dl) according to any one of claims 1 to 3 wherein the coating layer (2) has a flat upper surface.

5. Optoelectronic component (Dl) according to any one of claims 1 to 4 wherein the ridge heterostructure (1) comprises: • a lower confinement structure (11) made of a first semiconductor material; • an active area (12) made of at least one second semiconductor material; • an upper confinement structure (13a, 14, 15a) made of a third semiconductor material; the active area being confined between the upper confinement structure (13a, 14, 15a) and the lower confinement structure (11); said active area being designed to generate photons by recombination of charge carriers injected into the upper (13a, 14, 15a) and lower (11) confinement structures; the guide strip (15a) being formed by at least a portion (15a) of the upper containment structure (13a, 14, 15a).

6. Optoelectronic component (Dl) according to claim 5 comprising a first electrode (3) made of a conductive material having at least a first portion deposited on the upper surface of the guide strip (15a).

7. Optoelectronic component (Dl) according to claim 6 comprising a second electrode (4) made of a conductive material connected to the lower confinement structure (11) through a via (VI) passing through the coating layer (2).

8. Optoelectronic component (Dl) according to claim 7 wherein each of the electrodes (3, 4) has at least a second part deposited on the upper surface (201) of the coating layer (2).

9. Optoelectronic component (Dl) according to any one of claims 5 to 8 in which the upper confinement structure (13a, 14, 15a) is N-doped and the lower confinement structure (11) is P-doped or vice versa.

10. An optoelectronic component (Dl) according to any one of claims 5 to 9 wherein the ridge heterostructure (1) comprises an etch stop layer (14) for performing selective etching of said third semiconductor material forming the guide strip (15a); said etch stop layer (14) being confined between the base (13a) and the guide strip (15a).

11. Optoelectronic component (Dl) according to claim 10 in which the etch stop layer (14) has a thickness less than 20

12. llili. Optoelectronic component (Dl) according to any one of claims 5 to 11 further comprising an ohmic contact layer (16a) deposited on the upper surface of the guide strip (15a); the ohmic contact layer (16a) being made of a fourth semiconductor material having an energy gap smaller than that of the third semiconductor material.

13. Method for manufacturing an optoelectronic device (Dl), comprising the following steps: i) manufacturing a stack of semiconductor layers deposited on a substrate (SUB) in a stacking direction (Z); said stack being called "initial stack"; ii) manufacturing a first intermediate strip (17a, 16a, 15a) and a second intermediate strip (17b, 16b, 15b) by partially etching the initial stack; each intermediate ribbon being covered by a sacrificial layer (17a, 17b); each intermediate ribbon being arranged on a base formed by the non-etched layers of said initial stack (17a, 17b); each intermediate ribbon extending in a guide direction (Y) orthogonal to the stacking direction (Z); iii) depositing a nitride coating layer (2) so as to encapsulate the first intermediate ribbon (17a, 16a, 15a) and the second intermediate ribbon (17b, 16b, 15b); iv) planarizing the coating layer (2) to obtain a flat upper surface of the coating layer (2) and so as to uncover the sacrificial layer (17a, 17b) of the first intermediate ribbon (17a, 16a, 15a) and of the second intermediate ribbon (17b, 16b, 15b); v) completely removing the sacrificial layer (17a, 17b) by etching to obtain at least one guide strip (16a, 15a) buried in the nitride coating layer (2) from the first intermediate strip (17a, 16a, 15a).

14. A method of manufacturing an optoelectronic device (Dl) according to claim 13 wherein the initial stack comprises in order starting from said substrate: • a first layer (12) doped N or P in a first semiconductor material intended to form a lower confinement structure (11); • at least one second layer (12) made of a second semiconductor material having an energy gap lower than that of the first semiconductor material intended to form an active zone (12); • at least one third layer (13, 14, 15) having a doping opposite to that of the first layer (12), produced by a third semiconductor material having an energy gap greater than that of the second semiconductor material and intended to form part of an upper confinement structure (13); • an ohmic contact layer (16) made of a fourth semiconductor material having an energy gap lower than that of the third semiconductor material; • a sacrificial layer (17) made of a fifth material allowing selective etching to be carried out with respect to the ohmic contact layer (16);

15. A method of manufacturing an optoelectronic device (Dl) according to claim 14 wherein step ii) is carried out by partially etching the sacrificial layer (17), the ohmic contact layer (16) and the at least one third layer (15);

16. A method of manufacturing an optoelectronic device (Dl) according to one of claims 14 or 15 further comprising the following steps: vi) manufacturing at least one via (VI) passing through to the first layer (11) by fully or partially etching the second intermediate strip (17b, 16b, 15b) and partially at least the second layer (12); vii) depositing a first electrode (3) made of a conductive material having at least a first portion deposited on the upper surface of the guide strip (13a, 14, 15a) and a second electrode (4) made of a conductive material having at least a first portion deposited on the first layer (11) through the at least one via (VI).

17. Method of manufacturing an optoelectronic device (Dl) according to any one of claims 13 to 16 in which the planarization step iv) is carried out by polishing via an abrasive surface comprising balls having a diameter of less than 5 pm.

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