Integrated circuit suitable for radio signal processing, associated radio signal processing system and associated motor vehicle

The integrated circuit with a processing and memory chip on a single substrate addresses space and noise issues in motor vehicles, improving radio signal processing efficiency and reducing digital noise.

FR3151164A1Pending Publication Date: 2025-01-17FAURECIA CLARION ELECTRONICS EUROPE
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Patent Information

Application Number
FR2023007520
Authority / Receiving Office
FR · FR
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-07-13
Publication Date
2025-01-17

AI Technical Summary

Technical Problem

Integration of radio signal processing systems in motor vehicles faces challenges due to limited space and noise interference, particularly digital noise from synchronized signals, which complicates reception and reproduction of low-level radio signals.

Method used

An integrated circuit with a substrate that integrates a processing chip and a memory chip on the same surface, connected via flip-chip technology, reducing clutter and digital noise, and allowing efficient radio signal processing.

Benefits of technology

This configuration enhances radio signal processing efficiency by minimizing noise and reducing hardware footprint, enabling better reception and reproduction of radio signals in vehicles.

✦ Generated by Eureka AI based on patent content.

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Abstract

Integrated circuit adapted for radio signal processing, associated radio signal processing system and associated motor vehicle. The present invention relates to an integrated circuit adapted for radio signal processing comprising a substrate (12) having a first surface (14) and a second surface (16), the first surface (14) being adapted to receive at least one chip and the second surface (16) comprising connection elements adapted for connection to an electronic card (6), characterized in that said first surface (14) of said substrate (12) has at least one processing chip (18) configured for the reception and demodulation of radio signals and a memory chip (20), said memory chip (20) being connected to said processing chip (18) via said substrate (12). Figure for the abstract: Figure 1
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Description

Title of the invention: Integrated circuit adapted for processing radio signals, associated radio signal processing system and associated motor vehicle

[0001] The present invention relates to an integrated circuit suitable for processing radio signals, a radio signal processing system comprising such an integrated circuit and a motor vehicle comprising a radio reception system comprising such a radio signal processing system.

[0002] The invention lies in the field of radio reception and reproduction systems, also called tuners, and finds a particular application in the automotive field.

[0003] Radio signal processing systems are known which integrate software radios or SDR (for "Software Defined Radio" in English), comprising in particular a device for receiving and demodulating radio signals produced partly by hardware and partly by software, using a microprocessor dedicated to digital signal processing (or DSP for Digital Signal Processor). One of the advantages of such a system is that it allows adaptation, by software programming, to changes in format or radio standard.

[0004] It is advantageous to integrate such a radio signal processing system incorporating a software radio into a motor vehicle, in order to ensure reception and reproduction of radio signals in the vehicle, for example in the dashboard of the vehicle.

[0005] However, several problems and constraints arise in the context of the integration of radio signal processing systems in motor vehicles.

[0006] On the one hand, since many functionalities are envisaged, the space available, for example in a dashboard of a motor vehicle, is limited, and generally very reduced. On the other hand, in a motor vehicle, elements present are likely to add noise, for example acoustic noise and electronic or digital noise, while the radio signals are of low level, which makes the reception and reproduction of good quality radio signals particularly difficult.

[0007] Conventionally, it is known to integrate a radio signal processing system into a motor vehicle, either via a dedicated device which is connected to the dashboard, or via an electronic card (or printed circuit card) integrated into the vehicle cabin.

[0008] In general, such an electronic card comprises on the one hand an integrated circuit dedicated to the processing of radio signals, also called ASIC for "Application Specific Integrated Circuit", dedicated to the processing of radio signals, and on the other hand, an electronic memory unit, called remote, for example a RAM memory unit (for "Random Access Memory"), which is relatively large, separate and remote from the ASIC, on the electronic card. For specific software processing, the internal memory of the dedicated ASIC is not sufficient, and the remote electronic memory unit is used. This requires connections and transmissions of numerous signals between the remote memory unit and the dedicated ASIC, which induces various drawbacks, in particular digital noise.In fact, the radiation induced by the signals (more than ten), all synchronized on the same clock signal (which allows the contributions of each signal to be added because they occur at the same time) creates a digital noise whose main frequency is the frequency of use of the memory (and its sub-harmonics). This noise is both radiated by the tracks of the printed circuit and conducted by the ground plane.

[0009] The object of the invention is to overcome the drawbacks of the state of the art.

[0010] To this end, the invention proposes, according to one aspect, an integrated circuit suitable for processing radio signals, comprising a substrate comprising a first surface and a second surface, the first surface being suitable for receiving at least one chip and the second surface comprising connection elements suitable for connection to an electronic card. The first surface of said substrate (12) comprises at least one processing chip configured for receiving and demodulating radio signals and a memory chip, said memory chip being connected to said processing chip via said substrate.

[0011] Advantageously, the integration of a memory chip and at least one processing chip configured for the reception and demodulation of radio signals on a first surface of the substrate of the integrated circuit makes it possible both to reduce the size and to reduce the digital noise. Thus, such an integrated circuit is particularly suitable for a motor vehicle radio signal processing system.

[0012] The integrated circuit adapted for processing radio signals according to the invention may also have one or more of the characteristics below, taken independently or in any technically conceivable combination.

[0013] The memory chip is a dynamic memory chip with a capacity greater than or equal to 64 Mega Bytes, preferably greater than or equal to 128 Mega Bytes.

[0014] The memory chip is connected by flip chip technology on said substrate, or by a direct wire bond or bridging.

[0015] The first surface of the substrate comprises a first processing chip dedicated to the reception of analog or digital radio signals and the conversion of said radio signals into sampled digital signals and a second processing chip dedicated to the demodulation of the sampled digital signals.

[0016] The circuit comprises a single processing chip configured for receiving and demodulating radio signals.

[0017] According to another aspect, the invention relates to a radio signal processing system comprising an integrated circuit adapted for processing radio signals as briefly described above.

[0018] The radio signal processing system according to the invention may also have one or more of the characteristics below, taken independently or in any technically conceivable combination.

[0019] This radio signal processing system comprises at least one antenna adapted to receive radio signals.

[0020] This radio signal processing system comprises two antennas adapted to receive radio signals.

[0021] According to another aspect, the invention relates to a housing adapted to house a radio signal processing system as briefly described above.

[0022] According to another aspect, the invention relates to a motor vehicle comprising a radio signal processing system as briefly described above.

[0023] The invention will appear more clearly on reading the description which follows, given solely by way of non-limiting example, and made with reference to the drawings in which:

[0024] [Fig-1] [Fig.l] is a schematic representation of a motor vehicle comprising a radio signal processing system according to one embodiment;

[0025] [Fig.2] [Fig.2] is a block diagram of an integrated circuit for processing radio signals according to one embodiment.

[0026] [Fig. 1] schematically represents a motor vehicle 2 in which a radio signal processing system 4 is integrated, for example in the dashboard (not shown).

[0027] The radio signal processing system 4 is configured to cooperate with an antenna 5 for receiving radio signals, and comprises, in the illustrated embodiment, an electronic card 6 (or printed circuit card), on which various electronic components are connected, by means of connection pads, conductive tracks and through vias, so as to produce electrical circuits suitable for various applications.

[0028] According to a variant, the radio signal processing system 4 comprises several antennas 5 for receiving radio signals.

[0029] In one embodiment, the radio signal processing system 4 comprises two antennas 5 for receiving radio signals.

[0030] The electronic card 6 comprises in particular an integrated circuit 10 adapted for processing radio signals, also called an application-specific integrated circuit (ASIC).

[0031] In one embodiment, the radio signal processing system 4 is encapsulated in a housing of suitable dimensions, and forms a discrete electronic component. Preferably, the encapsulation in a housing is carried out with a cooling system integrated in the housing, making it possible to evacuate the heat generated by the internal chips when they are powered.

[0032] The integrated circuit 10 comprises a substrate 12 (in English, “substrate”), the substrate 12 comprising a first surface 14, visible in [Fig.l], and a second surface 16, not visible in [Fig.l], opposite the first surface 14.

[0033] The substrate 12 is a package substrate, for example produced in the same way as a PCB substrate, but with specific constraints in terms of track fineness, etching and via.

[0034] The second surface 16 comprises connection elements (not shown) adapted for connection of the integrated circuit 10 to the electronic card 6.

[0035] On the first surface 14 are respectively produced a chip 18 (in English "die"), called processing chip, configured for the reception of radio signals, analog or digital, the conversion of radio signals into sampled digital signals and the demodulation of the sampled digital signals, and a memory chip 20.

[0036] The processing chip 18 is, in one embodiment, configured to perform both the reception of radio signals received by the antenna 5, their digitization and their demodulation by software processing. Furthermore, the processing chip 18 implements a filtering of the received and demodulated signals, making it possible to obtain baseband signals which are then digitally processed.

[0037] The memory chip 20 is a dynamic memory chip with a capacity greater than or equal to 64 Mega Bytes, preferably greater than or equal to 128 Mega Bytes.

[0038] Advantageously, the dynamic memory chip is a synchronous dynamic memory chip (or SDRAM for “Synchronous Dynamic Random Access Memory” in English).

[0039] The processing chip 18 and the memory chip 20 are connected via the substrate 12, they communicate via links shown schematically in [Fig.l]. The number of links illustrated in [Fig.l] may vary, the representation in [Fig.l] being provided for information purposes.

[0040] Preferably the memory chip 20 is connected by flip chip technology (in English "Flipchip") on said substrate. Preferably, all the chips integrated on said substrate are connected by flip chip technology on said substrate. Alternatively, the chips are integrated and connected by a direct wire bond or wire-bonding.

[0041] [Fig.2] illustrates a second embodiment of an integrated circuit 10 suitable for processing radio signals.

[0042] In this second embodiment, the integrated circuit 10 comprises the memory chip 20, for example of the SDRAM type, as well as two radio signal processing chips, respectively a first processing chip 22 dedicated to the reception of analog or digital radio signals and their conversion into sampled digital signals, and a second processing chip 24 dedicated to the demodulation of the radio signals.

[0043] The connection between the first processing chip 22, also called the receiving chip 22, and the second processing chip 24, also called the demodulation chip, is a digital connection via the substrate 12 comprising control signals and data.

[0044] The number of links illustrated in [Fig.2] is given for information purposes only and may vary in practice.

[0045] Advantageously, the separation between the reception of radio signals and the demodulation of sampled digital radio signals makes it possible to use one chip technology for the RF part ("Radio Frequency" in English) and another chip technology for the demodulation part.

[0046] Furthermore, this separation allows easier modifications of the integrated circuit comprising the various processing chips. For example, a less noisy technology can be used on the receiving chip 22 (for example FD-SOI (“Fully Depleted Silicon On Insulator”) and in the same way it is possible to use a finer technological node (i.e. the minimum half-distance between two lithographed patterns) on the processing chip 28 because the latter is composed solely of digital elements.

[0047] Advantageously, the integration of a memory chip, preferably SDRAM, in the dedicated integrated circuit makes it possible to process weak radio signals more efficiently, due to the proximity between the memory chip and the processing chip(s).

[0048] Furthermore, advantageously, the overall power consumption is reduced. Indeed, in the case where the electronic memory unit is external to the integrated circuit dedicated to the reception of radio signals, it is necessary to amplify the radio signals more. In the proposed implementation, such amplification can be avoided.

[0049] Furthermore, advantageously, such an integrated circuit dedicated to the processing of radio signals is easier to integrate on a printed circuit board of an electronic card, less compatibility tests are required at the time of integration on a printed circuit board than when the electronic memory unit is external.

[0050] Finally, advantageously, the hardware footprint for processing radio signals is reduced, space is freed up by the memory chip on the printed circuit and can be used for implementing other functionalities. This is particularly advantageous for integration into a radio reception system for a motor vehicle.

Claims

Claims

1. Integrated circuit adapted for processing radio signals comprising a substrate (12) comprising a first surface (14) and a second surface (16), the first surface (14) being adapted to receive at least one chip and the second surface (16) comprising connection elements adapted for connection to an electronic card (6), characterized in that said first surface (14) of said substrate (12) comprises at least one processing chip (18, 22, 24) configured for receiving and demodulating radio signals and a memory chip (20), said memory chip (20) being connected to said processing chip (18, 22, 24) via said substrate (12).

2. Integrated circuit according to claim 1, wherein said memory chip (20) is a dynamic memory chip with a capacity greater than or equal to 64 Mega Bytes, preferably greater than or equal to 128 Mega Bytes.

3. An integrated circuit according to claim 1 or 2, wherein said memory chip (20) is connected by flip chip technology to said substrate (12), or by a direct wire bond or bridge.

4. Integrated circuit according to one of claims 1 to 3, wherein said first surface (14) of the substrate (12) comprises a first processing chip (22) dedicated to the reception of analog or digital radio signals and to the conversion of said radio signals into sampled digital signals and a second processing chip (24) dedicated to the demodulation of the sampled digital signals.

5. Integrated circuit according to one of claims 1 to 3, comprising a single processing chip (18) configured for the reception and demodulation of radio signals.

6. Radio signal processing system (4) comprising an electronic card (6) on which is connected an integrated circuit (10) adapted for processing radio signals according to claims 1 to 5.

7. A radio signal processing system (4) according to claim 6, comprising at least one antenna (5) for receiving radio signals.

8. A radio signal processing system (4) according to claim 7, comprising two antennas (5) for receiving radio signals.

9. Housing adapted to house a radio signal processing system (4) according to one of claims 7 or 8.

10. Motor vehicle comprising a signal processing system radio (4) according to one of claims 7 or 8.

Citation Information

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