Integrated circuit enclosure with heat dissipation

Abstract

According to one aspect, an integrated circuit package (ICF) is proposed comprising: - a substrate (SUB) having a mounting face (FM), - an electronic chip (CHP) having a rear face (FS1) and a front face (FL1), the chip (CHP) being mounted on the mounting face (FM) such that the front face (FL1) is electrically connected to the mounting face (FM) of the substrate (SUB), and - a deformable thermally conductive film (FLM) configured to cover at least a portion of the rear face (FS1) of the chip (CHP) such that the film (FLM) is in contact with the rear face (FS1). Figure for the abstract: Fig 1

Description

Title of the invention: PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION

[0001] Implementation and embodiment methods relate to the field of microelectronics, in particular the field of packaging of integrated circuits, and more particularly the means of heat dissipation in integrated circuit packages.

[0002] The heat dissipation means are typically provided to dissipate the heat generated by one side of the electronic chip containing integrated circuits present in a package.

[0003] These heat dissipation means conventionally comprise a heat sink, for example a copper plate, fixed to this face of the electronic chip by means of a layer of thermal interface material, for example a mixture of silicone and copper, well known to those skilled in the art (usually designated by the English term “Thermal Interface Material”).

[0004] In particular, the layer of thermal interface material makes it possible to carry out a thermal transfer between the chip and the heat sink so that the heat sink can evacuate the heat to the outside of the package and so that the temperature of the integrated circuits does not reach a value leading to their degradation.

[0005] That being said, the thermal interface material is a weak point in the thermal chain since it has a lower thermal conductivity than the heat sink.

[0006] In this regard, it is appropriate to reduce the thickness of the thermal interface material layer to improve the heat dissipation of the package. However, the adhesive power of the thermal interface material layer is known to be limited and reducing the thickness of the thermal interface material layer may deteriorate the mechanical strength of the heat sink on the chip.

[0007] Furthermore, the thermal material layer may deteriorate over the lifetime of the package and may exhibit imperfections such as pits that may affect the mechanical strength of the heat sink and degrade the thermal performance of the package.

[0008] There is therefore a need to improve the thermal performance of the integrated circuit package.

[0009] According to one aspect, there is provided an integrated circuit package comprising: - a support plate having a mounting face, - an electronic chip having a back face and a front face, the chip being mounted on the mounting face so that the front face is electrically connected to the mounting face of the carrier plate, - a deformable thermally conductive film, for example made of metal, configured to cover and be in contact with at least a portion of the rear face of the chip.

[0010] The thermally conductive film is deformable and adapts to the shape of the chip or other components mounted on the carrier plate.

[0011] Such a film therefore does not require a thermal interface material to be fixed to the chip and therefore makes it possible to improve heat dissipation within the package. The film also guarantees mechanical strength over the entire lifetime of the package, which avoids the risk of degradation of the thermal performance of the package.

[0012] Furthermore, the film in the case of total coverage of the chip can act like the heat sink of the prior art while advantageously being thinner than the sink. Thus, the film is less expensive in manufacturing cost than the heat sink and makes it possible to make the package compact in this case.

[0013] Therefore, the housing according to this aspect benefits from improved thermal performance over its entire lifetime.

[0014] According to one embodiment, the thermally conductive film is welded to at least a portion of the rear face of the chip.

[0015] The film is held on the back face of the chip and allows heat to be directly evacuated without intermediaries between the film and the chip such as the layer of thermal interface material.

[0016] According to one embodiment, the thermally conductive film is fixed to at least a portion of the rear face of the chip by an adhesive.

[0017] The adhesive is typically a glue or a double-sided adhesive tape allowing the film to be fixed on the back side of the chip while having better thermal conductivity than the thermal interface material for a given thickness.

[0018] According to one embodiment, the support plate comprises an opening passing through the thickness of the support plate until it opens onto the mounting face, the thermally conductive film further covering the mounting face and closing said opening.

[0019] The opening forms a passage in the support plate allowing vacuum lamination to be carried out during the manufacture of the package. Vacuum lamination is a suitable technique for fixing the film on the chip so as to avoid the presence of air between the adhesive and the back face of the chip and therefore improves the retention of the film on the chip.

[0020] According to one embodiment, the package comprises a molding resin disposed on the mounting face of the support plate such that the resin coats the chip and uncovers the rear face of the chip, the thermally conductive film also being configured to cover an upper face of the molding resin.

[0021] The film is also compatible with housings including a casting resin allowing the electronic chip to be protected by leaving the back face of the chip exposed so that it is in contact with the thermally conductive film.

[0022] According to one embodiment, the chip is configured to have hot spots releasing heat during operation, the thermally conductive film being configured to cover the hot spots of the chip.

[0023] Thermal simulation tools or, alternatively, thermal sensors are used to detect hot spots, i.e., areas of the chip that may exhibit temperature peaks during operation. The positions of these hot spots, once identified, can be taken into account in order to define the shape of the film. Thus, identifying the hot spots of the chip makes it possible to shape the film so that it covers these hot spots while limiting the amount of material used to manufacture the film.

[0024] According to one embodiment, the film has a thickness of between 5 μm and 0.5 mm.

[0025] This range of film thickness typically makes it possible to make the housing more compact and can be defined according to the choice of material used for the film so as to make it deformable.

[0026] According to one embodiment, the modulus of elasticity of the thermally conductive film is between 105 and 100 GPa.

[0027] Therefore, a film having these elastic modulus values ​​is sufficiently deformable to adapt to the morphology of the chip without risk of detachment.

[0028] According to one embodiment, the thermally conductive film also covers the mounting face of the support plate and is connected to thermally conductive elements of the support plate.

[0029] Thermally conductive elements such as solder balls, the interconnection network and the electrical contacts of the plate can advantageously serve to form an additional passage with the film for the evacuation of heat under the package.

[0030] According to one embodiment, the housing comprises a component mounted on the mounting face of the support plate, wherein the thermally conductive film also covers the mounting face of the support plate and comprises an opening adapted to contain the component.

[0031] Openings may be made in the thermally conductive film according to the design constraints of the package linked for example to the presence of surface-mounted components. Such openings therefore make it possible to affix the film to the chip and the mounting face of the plate without covering these components and without hindering their subsequent operation.

[0032] According to one embodiment, the thermally conductive film also covers at least part of the side face of the electronic chip.

[0033] The film may for example cover at least part of the rear face of the chip and extend to the edges of the chip to optimize heat dissipation.

[0034] According to another aspect, there is provided a method of manufacturing an integrated circuit package comprising a carrier plate having a mounting face, the method comprising: - a mounting on the mounting face of the carrier plate of an electronic chip having a rear face and a front face such that the front face is electrically connected to the mounting face, - covering part of the rear face of the chip with a deformable thermally conductive film so that the film is in contact with the rear face.

[0035] According to one embodiment, the covering of a portion of the rear face by the thermally conductive film comprises fixing the film to at least a portion of the rear face of the chip by an adhesive.

[0036] According to one embodiment, the method comprises forming an opening passing through the thickness of the support plate until it opens onto the mounting face, in which the fixing of the film on at least a portion of the rear face is carried out by using the opening to create a vacuum between the film and the support plate so that the film covers the mounting face and closes said opening.

[0037] According to one embodiment, the film has a thickness of between 5 μm and 0.5 mm.

[0038] According to one embodiment, the thermally conductive film is a metal.

[0039] According to one embodiment, the modulus of elasticity of the thermally conductor is between 105 and 100 GPa.

[0040] According to one embodiment, the covering of a portion of the rear face by the thermally conductive film comprises a chemical vapor deposition of the wire on at least a portion of the rear face of the chip.

[0041] According to one embodiment, the method comprises forming a molding resin on the mounting face of the support plate so that the molding resin coats the chip and uncovers the rear face, the thermally conductive film covering an upper face of the molding resin.

[0042] According to one embodiment, it comprises an identification of hot spots of the chip by a thermal simulation of the chip in operation, in which the covering of a portion of the rear face by the thermally conductive film is carried out so that the film covers the hot spots of the chip.

[0043] According to one embodiment, the method further comprises connecting the film to thermally conductive elements of the support plate.

[0044] According to one embodiment, the method comprises mounting a component on the mounting face of the support plate and forming an opening in the thermally conductive film such that said opening contains the component after said covering of a portion of the rear face by the thermally conductive film.

[0045] According to one embodiment, the method comprises covering a portion of the side face of the electronic chip with the thermally conductive film at the same time as covering a portion of the rear face with the film.

[0046] Other advantages and characteristics of the invention will appear on examining the detailed description of embodiments and implementations, which are in no way limiting, and the appended drawings in which:

[0047] [Fig.l],

[0048] [Fig.2],

[0049] [Fig.3],

[0050] [Fig.4],

[0051] [Fig.5],

[0052] [Fig.6],

[0053] [Fig.7],

[0054] [Fig. 8],

[0055] [Fig.9],

[0056] [Fig. 10],

[0057] [Fig. 11],

[0058] [Fig. 12] and

[0059] [Fig. 13] schematically illustrate embodiments of the invention.

[0060] [Fig.l] schematically illustrates a sectional view of a BT integrated circuit package according to a first embodiment of the invention.

[0061] The BT package comprises a CHP electronic chip containing one or more integrated circuits and a SUB support plate having an FM mounting face. The SUB support plate may be a support substrate for example. Such a SUB support plate may comprise an INTCNX interconnection network and PAD electrical contacts located on the FM mounting face and electrically connected to the INTCNX interconnection network.

[0062] The CHP chip comprises a rear face FS1 and a front face FL1 comprising integrated circuit components such as transistors for example.

[0063] The CHP chip is mounted on the FM mounting face of the SUB carrier plate in a "flip chop" type assembly.

[0064] More particularly, the front face FL1 of the CHP chip can be electrically connected to the electrical contacts PAD of the support plate SUB by by means of SLD1 solder balls embedded in an UNDFLL underfill material known to those skilled in the art (designated by the English term “underfill”).

[0065] In addition, the SUB support plate may be provided with SLD2 solder balls fixed on a face of the SUB support plate opposite the FM mounting face and making it possible to connect the BT package to a printed circuit board (not shown in the figure) for example. The INTCNX interconnection network of the SUB support plate is typically configured to electrically couple the PAD electrical contacts to the SLD2 solder balls and transmit signals between the CHP electronic chip and circuits on the printed circuit board.

[0066] However, the integrated circuits of the CHP chip generate heat which can diffuse through the rear face FS1, and also on side faces EDG of the CHP chip during operation of the CHP chip. The heat emitted by the CHP chip contributes to the increase in temperature within the BT package and is likely to degrade the integrated circuits if it exceeds a certain value.

[0067] In this regard, the BT housing advantageously comprises a deformable thermally conductive film FLM, for example made of metal such as copper (Cu) or aluminum (Al). The FLM film may also be a copper film which has a face coated with nickel (Ni), a nickel-platinum alloy (NiPd) or even aluminum.

[0068] The FLM film is configured to cover and be in contact with the rear face FS1 of the CHP chip, for example by being fixed on this part of the rear face FS1 by an adhesive GL as illustrated in [Fig.l].

[0069] The thermally conductive film FLM adapts to the shape of the chip or other components mounted on the carrier plate SUB and can be fixed to the chip CHP by an adhesive GL whose thermal conduction can be

[0070] The thermal performance of the housing is thus improved. The film also guarantees mechanical strength over the entire lifetime of the housing, which avoids the risk of degradation of the thermal performance of the housing.

[0071] The FLM film here completely covers the rear face FS1 of the CHP chip and acts as a conventional heat sink by protecting the chip and evacuating the heat towards the outside of the BT package while being thinner and less expensive than the heat sink of the prior art.

[0072] Furthermore, the FLM film also covers at least part of the EDG side faces of the CHP chip through which the heat can also diffuse and thus makes it possible to optimize heat dissipation.

[0073] Furthermore, the FLM film has a thickness between 5 μm and 0.5 mm. This range of film thickness can be defined according to the choice of the material used for the film. so as to make it deformable and allows, in the case where the film replaces the heat sink, to make the BT box more compact. The person skilled in the art will know how to adapt the thickness of the film according to the material used so as to make the film deformable.

[0074] The thermally conductive FLM film also has a modulus of elasticity between 105 and 100 GPa.

[0075] Consequently, a film having these elastic modulus values ​​is sufficiently deformable to adapt to the morphology of the chip without risk of the film detaching, in particular in the case where the film is fixed by means of the GL adhesive.

[0076] The GL adhesive may be glue such as the non-conductive glue EA6900 marketed by the company DOW or the electrically conductive glue 2100A marketed by the company Henkel. The GL adhesive may also be a double-sided adhesive tape such as the adhesive tape PC07 marketed by the company Boyd. The GL adhesive is preferably thermally conductive and typically offers better adhesion than the thermal interface material.

[0077] [Fig.2] schematically illustrates a sectional view of a LV box according to a second embodiment. The elements common to the box of [Fig.l] bear the same references and will not all be detailed again.

[0078] The thermally conductive film FLM is welded to the rear face FS1 of the CHP chip and completely covers the rear face FS1 for example. Alternatively, the thermally conductive film FLM may also have been formed on the rear face FS1 using chemical vapor deposition of a thin metal layer by cathodic sputtering.

[0079] The rear face FS1 and the side faces EDG of the chip are therefore directly covered by the FLM film without intermediate layers, thus reducing the thermal chain between the CHP chip and the exterior of the BT package. Consequently, heat dissipation is improved.

[0080] The thermally conductive film FLM is also welded or formed on the FM mounting face of the SUB support plate. The FLM film is connected to thermally conductive elements of the SUB support plate, for example to non-functional PAD electrical contacts, i.e., those not used to transmit electrical signals, which are coupled to the SLD2 solder balls by the INTCNX interconnect network.

[0081] The SLD2 solder balls, the INTCNX interconnection network and the PAD electrical contacts can advantageously be used to form an additional passage with the FLM film for the evacuation of heat under the BT housing and thus contribute to improving the heat dissipation of the BT housing.

[0082] [Fig.3] schematically illustrates a sectional view of a LV box according to a third embodiment. The elements common to the box of [Fig.l] bear the same references and will not all be detailed again.

[0083] The support plate SUB comprises an opening FNT1 passing through the thickness of the plate SUB until it opens onto the mounting face FM.

[0084] The FLM film is also fixed to the support plate SUB by the adhesive GL so as to cover the plate SUB and to close the opening FNT1.

[0085] The FNT1 opening forms a passage in the SUB support plate allowing the FLM film to be fixed using vacuum lamination carried out during the manufacture of the BT housing.

[0086] Thus, the presence of air between the adhesive GL and the rear face FS1 and the side faces EDG of the CHP chip is reduced and consequently the retention of the FLM film on the CHP chip as well as the heat dissipation is improved.

[0087] [Fig.4] schematically illustrates a sectional view of a BT box according to a fourth embodiment. The elements common to the box of [Fig.l] bear the same references and will not all be detailed again.

[0088] The CHP chip may in certain cases have hot spots during operation releasing heat in a more localized manner on the rear face FS1 or the side faces EDG of the CHP chip.

[0089] The thermally conductive film FLM is fixed on the rear face FS1 of the CHP chip and covers a part of the rear face FS1, in particular the hot spots of the CHP chip located on this part of the rear face FS1.

[0090] The BT package also comprises a heat sink, made of copper for example, fixed to the support plate SUB by an adhesive GL2, for example similar to the adhesive GL described previously, and fixed to the rear face FS1 of the chip CHP and to the film FLM by a layer of thermal interface material TIM.

[0091] In particular, a first thickness of the layer of thermal interface material TIM covers the part of the rear face FS1 which is not covered by the film FLM and a second thickness, less than the first thickness, of the layer of thermal interface material TIM covers the film FLM.

[0092] The BT package then benefits from more efficient heat dissipation on the part of the CHP chip generating the most heat thanks to the FLM film.

[0093] [Fig.5] schematically illustrates a top view of a BT housing according to a fifth embodiment. The elements common to the housing of [Fig.l] bear the same references and will not all be detailed again. The BT housing includes CPT heat sink and the thermal interface material layer have not been shown in [Fig.5].

[0094] The PC hotspots of the CHP chip shown in [Fig.5] can for example be detected using thermal simulation tools, such as the Simcenter Flotherm software from Siemens, or thermal sensors (not shown).

[0095] The positions of these PC hot spots, once identified, can be taken into account in order to define the shape of the FLM film. The FLM film is for example to be manufactured or formed by chemical vapor deposition so as to cover the PC hot spots while limiting the amount of material of the FLM film.

[0096] Furthermore, the BT housing also comprises a COMP component, such as a passive electronic component or an antenna, on the FM mounting face of the SUB plate and the FLM film comprises an opening FNT2 capable of containing the COMP component.

[0097] Openings can in fact be made in the thermally conductive film according to the design constraints of the BT package linked for example to the presence of surface-mounted components. Such openings therefore make it possible to apply the film to the chip and the mounting face of the plate without covering these components and without hindering their subsequent operation.

[0098] [Fig.6] schematically illustrates a sectional view of a BT box according to a sixth embodiment. The elements common to the box of [Fig.1] bear the same references and will not all be detailed again.

[0099] The BT package comprises an MLD molding resin disposed on the FM mounting face of the SUB carrier plate such that the MLD resin coats the CHP chip and exposes the FS1 back face. The MLD resin is typically an epoxy resin mixed with vitreous silica or metal oxides such as alumina.

[0100] The thermally conductive film FLM is fixed on the back face FS1 of the CHP chip by the adhesive GL as previously described in relation to [Fig.l] and is also fixed on an upper face FS2 of the molding resin MLD by the adhesive GL.

[0101] The FLM film is also compatible with molded packaging packages including a molding resin to protect the electronic chip by leaving the back side of the chip exposed so that it is in contact with the thermally conductive film.

[0102] The MDL resin can also be heat conductive, in particular when the resin contains metal oxides and allows the heat generated by the EDG side faces of the CHP chip to be transferred to the FLM film.

[0103] Figures 7 to 13 illustrate steps of a method of manufacturing integrated circuit packages described previously in relation to Figures 1 to 6.

[0104] [Fig.l] illustrates a step 100 of obtaining a SUB support plate comprising an FM mounting face. The SUB support plate comprises an INTCNX interconnection network and PAD electrical contacts formed on the FM mounting face. FM mounting and electrically connected to the INTCNX interconnection network.

[0105] Additional PAD electrical contacts may be formed on the FM mounting face to enable the thermally conductive film to be connected as previously described in relation to [Fig.2]. These PAD electrical contacts are non-functional electrical contacts that are not used to transmit electrical signals.

[0106] [Fig.8] illustrates a step 101 of fixing an electronic chip CHP on the mounting face FM of the plate SUB. The chip CHP comprises a rear face FS1 and a front face FL1 connected to the electrical contacts PAD by solder balls SLD1 embedded in an underfill material UNDFLL.

[0107] [Fig.9] illustrates a step 102 of fixing a deformable thermally conductive film FLM on the rear face FS1 and the side faces EDG of the CHP chip by an adhesive GL.

[0108] The FLM film can be coated with an adhesive or can be attached to a double-sided adhesive tape for example.

[0109] In particular, the FLM film can be plated onto the CHP chip by applying pressure to the film so that it deforms to cover the rear face FS1 and the side faces EDG of the CHP chip.

[0110] Step 102 of fixing the FLM film can be followed by a step of fixing solder balls SLD2 on a face FL2 of the SUB plate opposite the FM mounting face to obtain the BT package shown in [Fig.l].

[0111] [Fig. 10] illustrates a step 103 of welding the thermally conductive film FLM as an alternative to step 102 described previously in relation to [Fig.9].

[0112] The welding of the FLM film more particularly comprises a welding of the FLM film on the rear face FS1 and on the side faces EDG of the CHP chip.

[0113] Furthermore, the FLM film is welded onto the SUB plate so as to be connected to the additional PAD electrical contacts.

[0114] Step 103 may be followed by a step of fixing solder balls SLD2 (not shown) on a face FL2 of the SUB plate opposite the FM mounting face to obtain the BT package shown in [Fig.2].

[0115] In particular, the SLD2 solder balls and the additional PAD electrical contacts are coupled together by the INTCNX interconnection network of the SUB plate in order to form an additional passage with the FLM film for the evacuation of heat under the BT housing.

[0116] [Fig. 11] illustrates a step 104 of forming an opening FNT1 and fixing the thermally conductive film FLM as an alternative to steps 102 and 103 described previously in relation to figures 9 and 10.

[0117] The thermally conductive film FLM may be the same as that described above. previously in relation to [Fig.9] and can be coated with glue or attached to double-sided adhesive tape for example.

[0118] The opening FNT1 passes through the thickness of the support plate SUB until it opens onto the mounting face FM. The opening FNT1 is used to create a vacuum, for example using a vacuum lamination technique known to those skilled in the art, between the FLM film and the support plate SUB so that the FLM film covers the mounting face FM and closes the opening FNT1.

[0119] Vacuum lamination is a technique for fixing the FLM film on the CHP chip in such a way as to avoid the presence of air between the GL adhesive and the back face FS1 of the chip and consequently improves the retention of the FLM film on the CHP chip.

[0120] Step 104 may be followed by a step of fixing solder balls SLD2 (not shown) on a face FL2 of the SUB plate opposite the FM mounting face to obtain the BT package shown in [Fig.3].

[0121] [Fig. 12] illustrates a step 105 of fixing the FLM film on a part of the rear face FS1 of the CHP chip.

[0122] Step 105 is preferably performed after a step of identifying hot spots (not shown) of the CHP chip and a step of manufacturing the FLM film. The step of identifying the hot spots of the CHP chip can be performed by thermal simulation of the CHP chip in operation or by thermal sensors.

[0123] The FLM film manufacturing step makes it possible to design an FLM film and give it a shape allowing the FLM film to cover the hot spots of the CHP chip during the FLM film attachment step 105. The attachment of the FLM film can be carried out in a manner analogous to the attachment step 102 as described in relation to [Fig.9],

[0124] Step 105 may be followed by a step of fixing solder balls SLD2 (not shown) on a face FL2 of the SUB plate opposite the mounting face FM and a step of fixing a heat sink (not shown) on the FLM film and the SUB plate to obtain the BT package shown in [Fig.4].

[0125] [Fig. 13] illustrates a step 106 of chemical vapor deposition of the FLM film as an alternative to steps 102 to 105 described previously in relation to figures 9 to 12.

[0126] In particular, chemical vapor deposition makes it possible to form the FLM film, typically by cathode sputtering, on the rear face FS1 and on the side faces EDG of the CHP chip.

[0127] Step 106 can also be performed using a temporary mask MSK on the back face FS1 and on the side faces EDG of the CHP chip.

[0128] In this way, the FLM film can be formed only on the part of the back face FS1 and on the side faces EDG of the CHP chip which are not covered. by the MSK mask.

[0129] Step 106 may be followed by removal of the MSK mask, a step of attaching SLD2 solder balls (not shown) to a face FL2 of the SUB plate opposite the FM mounting face, and a step of attaching a heat sink (not shown) to the FLM film and the SUB plate.

Claims

Claims

1. Integrated circuit package (BT) comprising: - a support plate (SUB) having a mounting face (FM), - an electronic chip (CHP) having a rear face (FS1) and a front face (FL1), the chip (CHP) being mounted on the mounting face (FM) such that the front face (FL1) is electrically connected to the mounting face (FM) of the support plate (SUB), and - a deformable thermally conductive film (FLM) configured to cover and be in contact with at least a portion of the rear face (FS1) of the chip (CHP).

2. Package according to claim 1, wherein the thermally conductive film (FLM) is welded to at least a portion of the back face (FS1) of the chip (CHP).

3. Package according to claim 1, wherein the thermally conductive film (FLM) is fixed on at least a part of the back face (FS1) of the chip (CHP) by an adhesive (GL).

4. Housing according to claim 3, in which the support plate (SUB) comprises an opening (FNT1) passing through the thickness of the support plate (SUB) until it opens onto the mounting face (FM), the thermally conductive film (FLM) further covering the mounting face (FM) and closing said opening (FNT1).

5. Package according to one of claims 1 to 4, comprising a molding resin (MLD) arranged on the mounting face (FM) of the support plate (SUB) so that the resin (MLD) coats the chip (CHP) and uncovers the rear face (FS1) of the chip (CHP), the thermally conductive film (FLM) also being configured to cover an upper face (FS2) of the molding resin (MLD).

6. Package according to one of the preceding claims, in which the chip (CHP) is configured to have hot spots (PC) releasing heat in operation, the thermally conductive film (FLM) being configured to cover the hot spots (PC) of the chip (CHP).

7. Housing according to one of the preceding claims, in which the film (FLM) has a thickness of between 5 μm and 0.5 mm.

8. A housing according to any preceding claim, wherein the thermally conductive film (FLM) is a metal.

9. Housing according to one of the preceding claims, in which the elastic modulus of thermally conductive film (FLM) is between 105 and 100 GPa

10. Housing according to one of the preceding claims, wherein the thermally conductive film (FLM) also covers the mounting face (FM) of the support plate (SUB) and is connected to thermally conductive elements (PAD, INTCNX, SLD2) of the support plate (SUB).

11. Package according to one of the preceding claims, comprising a component (COMP) mounted on the mounting face (FM) of the support plate (SUB), in which the thermally conductive film (FLM) also covers the mounting face (FM) of the support plate (SUB) and comprises an opening (FNT2) capable of containing the component (COMP).

12. Package according to one of the preceding claims, in which the thermally conductive film (FLM) also covers at least a portion of the side face (EDG) of the electronic chip (CHP).

13. Method for manufacturing an integrated circuit package (BT) comprising a support plate (SUB) having a mounting face (FM), the method comprising: - mounting on the mounting face (FM) of the support plate (SUB) an electronic chip (CHP) having a rear face (FS1) and a front face (FL1) so that the front face (FL1) is electrically connected to the mounting face (FM), - covering a portion of the rear face (FS1) of the chip (CHP) with a deformable thermally conductive film (FLM) so that the film (FLM) is in contact with the rear face (FS1).

14. Method according to claim 13, wherein the covering of a portion of the rear face (FS1) by the thermally conductive film (FLM) comprises a soldering of the film (FLM) on said portion of the rear face (FS1) of the chip (CHP).

15. The method of claim 13, wherein covering a portion of the rear face (FS1) with the thermally conductive film (FLM) comprises attaching the film (FLM) to at least a portion of the rear face (FS1) of the chip (CHP) with an adhesive (GL).

16. Method according to claim 15, comprising forming an opening (FNT1) passing through the thickness of the support plate (SUB) until it opens onto the mounting face (FM), in which the fixing of the film (FLM) on at least a part of the rear face (FS1) is performed by using the opening (FNT1) to create a vacuum between the film (FLM) and the support plate (SUB) so that the film (FLM) covers the mounting face (FM) and closes said opening (FNT1).

17. Method according to one of claims 13 to 16, in which the film (FLM) has a thickness of between 5 pm and 0.5 mm.

18. Method according to one of claims 13 to 17, in which the thermally conductive film (FLM) is a metal.

19. Method according to one of claims 13 to 18, in which the modulus of elasticity of the thermally conductive film (FLM) is between 105 and 100 GPa

20. The method of claim 13, wherein covering a portion of the back face (FS1) with the thermally conductive film (FLM) comprises chemical vapor deposition of the film (FLM) onto at least a portion of the back face (FS1) of the chip (CHP).

21. Method according to one of claims 13 to 19, comprising forming a molding resin (MLD) on the mounting face (FM) of the support plate (SUB) so that the molding resin (MLD) coats the chip (CHP) and uncovers the rear face (FS1), the thermally conductive film (FLM) covering an upper face (FS2) of the molding resin (MLD).

22. Method according to one of claims 13 to 21, comprising an identification of hot spots (PC) of the chip (CHP) by a thermal simulation of the chip (CHP) in operation, in which the covering of a part of the rear face (FS1) by the thermally conductive film (FLM) is carried out so that the film (FLM) covers the hot spots (PC) of the chip (CHP).

23. Method according to one of claims 13 to 22, further comprising a connection of the film (FLM) to thermally conductive elements (PAD, INTCNX, SLD2) of the support plate (SUB).

24. Method according to one of claims 13 to 23, comprising mounting a component (COMP) on the mounting face (FM) of the support plate (SUB) and forming an opening (FNT2) in the thermally conductive film (FLM) so that said opening (FNT2) contains the component (COMP) after said covering of a part of the rear face (FS1) by the thermally conductive film (FLM).

25. Method according to one of claims 13 to 24, comprising covering a part of the lateral face (EDG) of the electronic chip (CHP) with the thermally conductive film (FLM) at the same time while covering part of the back face (FS1) with the film (FLM).

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