Photovoltaic module comprising an encapsulation structure based on at least one polymer material and locally softened

Abstract

Photovoltaic module (1) comprising: - a photovoltaic unit (6) comprising several photovoltaic cells (3) electrically connected in series and spaced apart from each other, the adjacent photovoltaic cells being electrically connected two by two by a metal interconnector (4) which extends at least partly in an interconnection space (2) separating said adjacent photovoltaic cells, - an encapsulation structure (8) made of a polymer-based encapsulation material sandwiching the opposite faces of the photovoltaic cells, defining a cell overlap zone (10), and the interconnector in the interconnection space, defining an interconnector overlap zone (11), a shim (12) incorporated in the encapsulation structure and partially superimposed on the interconnector in the interconnector overlap zone, the shim being made of material having, at least at a temperature of -40 °C,a modulus of elasticity lower than the modulus of elasticity of the encapsulating material.,

Description

Title of the invention: Photovoltaic module comprising an encapsulation structure based on at least one polymer material and locally softened Technical field

[0001] The present invention relates to the resistance to thermal cycling of photovoltaic modules comprising photovoltaic cells integrated in an encapsulation structure based on at least one polymer material. Prior art

[0002] The integration of photovoltaic modules in buildings, infrastructures or in vehicles is a way to simply increase the surface area for capturing solar radiation for mass energy production.

[0003] However, this integration approach requires an adaptation of the shape and aesthetics of the photovoltaic modules, as well as a reduction in their mass, while guaranteeing a level of performance and durability in accordance with regulations and being part of an approach to reducing the environmental footprint in order to achieve the objective of net zero carbon by 2035.

[0004] Thermoplastic polymer materials have low cost, good mechanical properties, low density and good recyclability, which make them good candidates for the manufacture of lightweight photovoltaic modules. They can thus be used to cover photovoltaic cells and hold them together in a rigid structure.

[0005] However, these materials are polymers. As such, they have a high ability to deform under the effect of temperature, characterized by a high coefficient of thermal expansion (CTE). Each polymer has a CTE that is specific to it and which depends on its composition and its production process. In particular, the CTE of many polymers is approximately ten times greater than the CTE of many metals and up to one hundred times greater than the CTE of silicon.

[0006] [Fig.l] illustrates a first example of degradation of such a type of photovoltaic module 1, called curvature effect, following the implementation of manufacturing by lamination. The curvature effect is a flatness defect of the photovoltaic module which develops during cooling of the photovoltaic module following lamination. It is generally caused by a difference in the coefficient of thermal expansion between the front face and the rear face of the photovoltaic module.

[0007] [Fig.2] illustrates several examples of degradation of these photo modules voltaic, appearing after thermal cycling, which are observed at the level of areas 2 where the electrical interconnectors cover the photovoltaic cells 3. Under the effect of high thermal stresses, delamination appears between the photovoltaic cells and / or the interconnectors and the polymer encapsulant. The polymer materials are also torn, which indicates the high level of stress reached in these areas.

[0008] The difference between, on the one hand, the CTE of the silicon, constituting the photovoltaic cells 4, or the CTE of the metals such as copper, used to form the interconnectors which electrically connect the photovoltaic cells of the module, and on the other hand the CTE of the polymer(s) of the photovoltaic module can lead to severe localization of thermal stresses in the metal parts of the modules. This leads to degradations which greatly affect the performance of the modules.

[0009] A recurring problem observed in thermal cycling is the breakage of the interconnectors 4 which connect the photovoltaic cells, which in fact leads to an extinction, i.e. an inability to produce electricity, of the photovoltaic module. [Fig. 3] shows photographs acquired by optical microscopy illustrating breakages of interconnectors 2. An example of extinction after 60 thermal deformation cycles of a photovoltaic module comprising 8 units of photovoltaic cells is shown in [Fig. 4], because of the breakages of interconnectors illustrated in [Fig. 3].

[0010] To avoid the occurrence of these degradations, it has already been tested to reduce the thickness of the polymer encapsulation structure, but this can lead to an inability of the photovoltaic module to successfully pass regulatory certification tests, in particular impact and bending resistance tests. It has also been considered to reinforce the polymer encapsulation structure with fibers or fabrics in order to make the module more rigid and more resistant to thermal cycling. However, this involves significantly modifying the implementation processes, which complicates and slows down the industrial development of these composite modules. In addition, the presence of fibers modifies the optical properties and degrades the energy efficiency of the photovoltaic module.

[0011] There is therefore a need to improve the thermal cycling resistance of photovoltaic modules comprising a polymer-based encapsulation structure. Summary of the invention

[0012] The invention proposes a photovoltaic module comprising: - a photovoltaic unit comprising several photovoltaic cells electrically connected in series and spaced apart from each other, the adjacent photovoltaic cells being electrically connected two by two by a metal interconnector which extends at least partly into an interconnection space separating said cells adjacent photovoltaic panels, - an encapsulation structure, based on at least one polymer encapsulation material, sandwiching the opposite faces of the photovoltaic cells, defining a cell overlap zone, and the interconnector in the interconnection space, defining an interconnector overlap zone, a shim incorporated in the encapsulation structure and partially superimposed on the interconnector in the interconnector overlap zone, the shim being made of a material having, at least at a temperature of -40°C, a modulus of elasticity lower than the modulus of elasticity of the encapsulation material.

[0013] During a temperature variation representative of a thermal cycle to which the PV module may be subjected in use, for example as defined in the IEC61215 standard, the shim deforms more easily than the interconnector to accommodate the thermally induced deformations of the encapsulation structure. This thus makes it possible to limit the concentration of stresses in the interconnector, and reduces the risk of breakage and extinction of the PV module.

[0014] Preferably, the material of the shim has a modulus of elasticity more than 2 times, preferably more than 5 times, or even more than 10 times lower than the modulus of elasticity of the encapsulation material at a temperature of -40°C.

[0015] Preferably, the shim material has a modulus of elasticity lower than the modulus of elasticity of the encapsulating material at a temperature of 20°C, preferably at any temperature between -40°C and 20°C.

[0016] The modulus of elasticity is measured according to standard NF EN ISO 527-1.

[0017] The shim material may have a modulus of elasticity, measured at -40°C, less than 1 GPa. Preferably, the shim material has a modulus of elasticity, measured at -40°C, of ​​between 0.1 MPa and 300 MPa, preferably of between 1 MPa and 10 MPa.

[0018] Preferably, the material of the shim has a coefficient of thermal expansion measured at -40°C of between 107 K 1 and 10 4 K1.

[0019] Preferably, the ratio between the CTE of the shim material and the CTE of the encapsulation material is between 0.1 and 1, the CTEs being measured at -40°C.

[0020] The coefficient of thermal expansion is measured according to the international standard ISO 11359-2.

[0021] The material of the shim can be composite or polymer.

[0022] Preferably, the material of the shim is an elastomer, in particular chosen from silicone elastomers, rubbers, fluorinated elastomers, thermoplastic elastomers and their mixtures. For example, the material of the shim is a translucent alkoxy-based silicone.

[0023] Preferably, the shim has a thickness of between 100 μm and 1500 μm.

[0024] Preferably, it has a width of between 100 μm and 1500 μm.

[0025] Preferably, the ratio of the width of the shim to the width of the space interconnection is between 0.1 and 0.5.

[0026] The width of the shim and the width of the interconnection space are measured perpendicular to the facing faces of the adjacent PV cells. The width of the interconnection space is for example between 0.2 and 10 mm.

[0027] The wedge may have the shape of a ribbon, in particular of rectangular or square section.

[0028] The shim may extend from one side to the other over the entire length of the interconnection space between the adjacent photovoltaic cells, said length being measured parallel to the lateral faces facing said adjacent cells.

[0029] The shim may not be superimposed on the cellular covering area.

[0030] Preferably, the shim is fully superimposed on the interconnection space.

[0031] The shim may be contained between the planes in which the opposite faces of the photovoltaic cells extend.

[0032] Preferably, the shim is entirely incorporated into the mass of the encapsulation structure. In particular, the outer face(s) of the shim are in contact with the encapsulation structure.

[0033] The distance between the shim and the interconnector is less than or equal to 1 mm, said distance being measured perpendicular to the median plane in which the PV module extends.

[0034] According to a variant, at least a portion of the shim may be in contact with the interconnector.

[0035] The PV module may comprise several shims at least partially covering the interconnector in the interconnector overlap area.

[0036] In particular, in the thickness of the PV module, at least two of the shims are arranged on either side of the interconnector. In other words, at least one of the shims is arranged between a first face of the PV module and the interconnector and another of the shims is arranged between the interconnector and a second face of the PV module opposite the first face. This allows the shims to better accommodate thermal deformations of the encapsulation structure.

[0037] The encapsulation structure is preferably self-supporting. A self-supporting structure is sufficiently rigid so as not to deform substantially under the effect of its own weight.

[0038] The encapsulation structure sandwiches the photovoltaic cells and the interconnector. Preferably, it completely covers the photovoltaic cells and the interconnector. Preferably, it is in contact over the entire surface area of ​​the photovoltaic cells and over the entire surface area of ​​the interconnector.

[0039] The encapsulation material is polymer-based, i.e. it comprises for more than 70% of its mass, preferably for more than 80% of its mass, preferably for more than 90% of its mass, preferably for more than 95% of its mass, preferably for 100% of its mass, a polymer material. The polymer material is suitable for a photovoltaic application, i.e. it has a transmittance suitable for incident solar radiation to be transmitted to activate the electrical production of the photovoltaic cells.

[0040] Preferably, the polymer material is transparent to solar radiation.

[0041] The encapsulation material may have a modulus of elasticity of between 10 MPa and 10 GPa, at a temperature of -40°C. It may have a Young's modulus of between 0.001 GPa and 1 GPa, at a temperature of 20°C.

[0042] Preferably, the polymer material is thermoplastic. It may have a glass transition temperature greater than -150°C.

[0043] Preferably, the polymer material is chosen from ethylene-vinyl acetate, an ethylene-methyl acrylate copolymer, low density polyethylene terephthalate, polyamide 11, polycarbonate, polyethylene glycol terephthalate, polymethyl methacrylate, polypropylene, polypropylene copolymer, polypropylene homopolymer, polytetrafluoroethylene, styrene-acrylonitrile copolymer, thermoplastic polyurethane, acrylonitrile butadiene styrene, polyethylene and mixtures thereof.

[0044] The encapsulation structure may be homogeneous, i.e., it consists of the encapsulation material whose composition is identical in any area of ​​the encapsulation structure. As will be described later, a homogeneous encapsulation structure may result from thermoforming a lower layer and an upper layer both made of the homogeneous polymeric material.

[0045] Alternatively, the encapsulation structure is multi-layered, at least two layers of the encapsulation structure being made of different encapsulation materials. Preferably, the multi-layer encapsulation structure comprises one or more inner layers that completely cover and are in contact with the photovoltaic cells and the interconnector, and lower and upper layers that sandwich the inner layers, the inner layer(s) and the lower and upper layers being made of different encapsulation materials. The lower and upper layers may be made of the same encapsulation material, and may further comprise reinforcing fibers, for example glass fibers.

[0046] Preferably, at a temperature of -40°C, and preferably at a temperature of 20°C, the modulus of elasticity of the encapsulating material constituting the inner layer(s) is lower than the modulus of elasticity of the encapsulating material constituting the lower layer and / or the upper layer. The lower layers and higher thus provide the photovoltaic module with bending rigidity and impact resistance, and the inner layer(s) allow better distribution of thermal stresses in the photovoltaic module.

[0047] Preferably, the thickness of the photovoltaic module is constant in the cell covering zone.

[0048] Preferably, the thickness of the photovoltaic module is constant, except in the interconnector overlap area.

[0049] Preferably, the thickness of the photovoltaic module is between 0.75 mm and 10 mm.

[0050] The interconnector may be made of a metal chosen from copper, silver, tin, lead and their alloys.

[0051] The interconnector connects two adjacent cells of the photovoltaic unit. Preferably, it is fixed, for example welded or glued with an electrically conductive adhesive on each of the adjacent cells. Preferably, it is fixed on a lower face of one of the adjacent photovoltaic cells and on an upper face of the other adjacent photovoltaic cell, in order to connect the positive and negative poles of the photovoltaic cells so as to circulate the photoelectric current.

[0052] Preferably, the interconnector extends in the thickness of the photovoltaic module between the adjacent cells which it electrically connects.

[0053] The interconnector may have a thickness of between 50 pm and 500 pm and / or a width of between 200 pm and 2000 pm.

[0054] Preferably, the photovoltaic module extends along a median surface which may be flat or curved.

[0055] The photovoltaic cells preferably extend along the median surface.

[0056] The photovoltaic unit may comprise more than two photovoltaic cells, in particular at least three, or even at least five, or even at least ten photovoltaic cells.

[0057] Within the photovoltaic unit, the photovoltaic cells may be identical. Preferably, they are aligned along an alignment axis in the median surface, the interconnection space between two adjacent photovoltaic cells extending perpendicular to the alignment axis. Their lateral faces may be parallel, in particular aligned along the alignment axis.

[0058] In the variant where the photovoltaic unit comprises more than two photovoltaic cells, the interconnector can electrically connect the adjacent photovoltaic cells in series in pairs. In particular, it can have a portion in contact with one face of a photovoltaic cell, which extends from one edge to another opposite edge of the photovoltaic cell, and which is extended on one side by a portion extending into the interconnection space which connects the photovoltaic cell to one of the adjacent cells.

[0059] Photovoltaic cells may comprise, or even consist of, silicon. They may be of the perovskite / silicon tandem type.

[0060] Each photovoltaic cell preferably has a plate shape, for example rectangular or square example. At least one of the photovoltaic cells, in particular each photovoltaic cell, may have a thickness of between 0.05 mm and 0.3 mm.

[0061] The photovoltaic module may comprise several photovoltaic units, which can be arranged relative to each other in a tiling manner along the median surface, for example along the alignment axis or along two perpendicular axes.

[0062] The invention also relates to a method of manufacturing a photovoltaic module according to the invention, the method comprising: - the provision of a multilayer stack comprising a photovoltaic unit comprising photovoltaic cells electrically connected in series and spaced apart from each other, the adjacent photovoltaic cells being electrically connected two by two by an interconnector which extends at least partly in an interconnection space separating said adjacent photovoltaic cells, a shim superimposed at least partially on the interconnector in the interconnection zone, and at least two encapsulation layers which sandwich the photovoltaic unit and - thermoforming of the multi-layer stack until the photovoltaic module is obtained.

[0063] Thermoforming can be carried out by thermocompression or lamination.

[0064] Preferably, the thermoforming is carried out by laminating the mul stack layer between a heated lower lamination plate and a membrane to which fluid pressure is applied.

[0065] The method may comprise a prior step of forming the multilayer stack, said step comprising the placement of a shim between the interconnector and at least one encapsulation layer made of the encapsulation material. Furthermore, the invention also relates to a device chosen from a building, a motor vehicle, a train, an airplane and a building, the device integrating on an external surface the photovoltaic module according to the invention. The external surface may be curved. The external surface of the device is for example a hood or a roof of a car, a wall or a roof of a building. Brief description of the drawings

[0066] [Fig.l] and [Fig.2] are photographs of state-of-the-art photovoltaic modules prior,

[0067] [Fig.3] is an optical microscopy photograph of a broken interconnector of a photovoltaic module of the prior art,

[0068] [Fig.4] are images acquired in electroluminescence of photo modules voltaic, from left to right, according to the prior art after lamination, 30 cycles, and 60 thermal cycles,

[0069] [Fig.5] schematically represents a top, front and side view of a example of a photovoltaic module according to the invention,

[0070] [Fig.6] is a schematic, sectional view of the photovoltaic module at the level of a interconnector overlap area,

[0071] [Fig.7] schematically illustrates an example of a manufacturing process by the mination of the photovoltaic module according to the invention,

[0072] [Fig.8] is a view of a finite element mesh of a part of a module according to the invention as illustrated in [Fig.6], at the interconnector overlap area,

[0073] [Fig.9] are images of the von Mises stress distribution in a reference mesh and in the mesh of [Fig.6] after a thermomechanical numerical simulation of a thermal cycle,

[0074] [Fig. 10] is a graph illustrating the evolution of the stress in the von Mises sense along the path illustrated in [Fig.6],

[0075] [Fig. 11] is a graph illustrating, for different meshes, the evolution of the maximum stress in the interconnector as a function of the modulus of elasticity of the shim material and the reduction, expressed as a percentage of said stress compared to the reference mesh without shim,

[0076] [Fig. 12] is a graph illustrating, for different meshes, the evolution of the maximum stress in the interconnector as a function of the width of the shim and the reduction, expressed as a percentage of said stress compared to the reference mesh without shim, and

[0077] [Fig. 13] is a graph illustrating, for different meshes, the evolution of the maximum stress in the interconnector as a function of the thickness of the shim and the reduction, expressed as a percentage of said stress compared to the reference mesh without shim. Detailed description

[0078] Figures 1 to 4 have been described previously.

[0079] An example of a photovoltaic module 1 according to the invention is illustrated in [Fig. 5]. The photovoltaic module comprises two photovoltaic units 6 each comprising four photovoltaic cells 3, in the form of plates, which are spaced apart from each other.

[0080] Each photovoltaic cell is separated from the photovoltaic cell adjacent to it by an interconnection space 2.

[0081] The number of photovoltaic units 6 and photovoltaic cells 3 is not limiting and other arrangements can be envisaged.

[0082] The photovoltaic module further comprises connection terminals 7, in the form of metal strips, between which the photovoltaic units are arranged in parallel and are electrically connected, in order to collect the generated current.

[0083] Within each photovoltaic unit 6, the adjacent photovoltaic cells 3 are connected two by two in series by metal interconnectors 4, for example made of copper, which extend in the direction y, from one side to the other between the electrical terminal blocks 7.

[0084] Each metal interconnector 4 comprises portions 4a in contact with one face of a photovoltaic cell which are connected to each other by portions 4b which each extend into the interconnection space provided between the photovoltaic cells 3. The metal interconnector 4 is subsequently in contact with one face of a photovoltaic cell then with an opposite face of the adjacent photovoltaic cell. Thus, when observed along the sectional plane (x,z) illustrated in [Fig.6], the interconnector winds from one connection terminal to the other, between the photovoltaic cells 3.

[0085] The photovoltaic module further comprises an encapsulation structure 8 based on at least one polymer material within which the photovoltaic units 6 are fully immersed.

[0086] The encapsulation structure 8 completely covers the opposite faces 9a, 9b of the photovoltaic cells 3, thus defining with each photovoltaic cell 3 a cell covering zone 10.

[0087] Furthermore, the encapsulation structure 8 covers the interconnectors in the different interconnection spaces 2 between the adjacent photovoltaic cells, thus defining with the interconnector 4 an interconnector overlap zone 11. In the example illustrated in [Fig.6], shims 12 are incorporated en masse in the encapsulation structure 8. They are arranged on either side of the interconnector in each interconnection space 2 between the lower 13i and upper 13s faces of said incorporation structure 8 and the interconnector 4.

[0088] Within each interconnection space 2, the shims 12 may extend from one side to the other over the entire length of the facing faces of the adjacent photovoltaic cells, and parallel to said faces. They may also be superimposed on one another or be offset relative to one another along the y axis, as illustrated in [Fig.6].

[0089] The shims are also superimposed on the interconnector 4 in each interconnection space 2, at the level of the interconnector overlap zone, as can be seen in a sectional view along a plane (y,z) in [Fig.6].

[0090] The shims are for example an elastomer tape whose modulus of elasticity is between 0.1 MPa and 300 MPa.

[0091] In order to manufacture the photovoltaic module illustrated in [Fig. 5], a multilayer stack 20 can be prepared in the following manner. The photovoltaic units 6, the connection strips 7 and the shims 12 are arranged between lower 21i and upper 21s sheets made of a soft polymer material, with a low modulus of elasticity, for example between 10 MPa and 10 GPa at -40°C. The sheets 21i,s thus completely cover the photovoltaic units 6, the connection strips 7 and the shims 12. The assembly thus formed can be arranged, optionally, between lower 22i and upper 22s external sheets made of another rigid polymer material, with a high modulus of elasticity, for example between 1 GPa and 100 GPa at -40°C to form the multilayer stack 20.After lamination between a lower lamination plate 24i and a membrane 25, a photovoltaic module 1 is thus obtained having a multi-layer encapsulation structure having a flexible internal encapsulation layer in which the photovoltaic units are immersed, optionally sandwiched between lower and upper rigid external encapsulation layers.

[0092] The lamination of the multilayer stack 20 is conventionally carried out by heating the multilayer stack to a temperature suitable for a flow of the polymer materials and under a pressure applied to the membrane 25 in order to heat-seal the different sheets 21i,s, optionally 22i,s and the photovoltaic units 6 together, then by cooling until the photovoltaic module is obtained.

[0093] The effect of the shim in the interconnection space is illustrated below.

[0094] A 2D finite element mesh 30 of a portion of the photovoltaic module including the interconnection space 2 was produced, as illustrated in [Fig.8]. Quadrangle finite elements were chosen so that the thickness e; of the interconnector is discretized with at least 4 finite elements.

[0095] The modeled encapsulation structure 8 thus comprises lower and upper layers made of polyamide 11, the modulus of elasticity of which at -40°C is equal to 1620 MPa and the CTE is equal to 10 4 K1. The thickness of each of the lower and upper layers is 400 μm.

[0096] The internal layer 15, with a thickness of 1200 μm, is made of thermoplastic polyolefin, the modulus of elasticity of which at -40°C is 590 MPa and the CTE is equal to 5* 10 4 K1.

[0097] The photovoltaic cell 3, with a thickness equal to 150 pm, is made of silicon, the modulus of elasticity is equal to 166 GPa and CTE is equal to 2.6* 106 K1.

[0098] The interconnector 4, with a thickness equal to 200 pm, is made of copper and has a modulus of elasticity equal to 130 GPa and a CTE equal to 1.4*105 K

[0099] The shims 12 have a thickness ecaie and a width lcaie which are parameters modified according to the simulations carried out, as well as the modulus of elasticity of the shim material.

[0100] The simulations were carried out assuming a plane deformation state, with thermoelastic material behavior models, and using the ABAQUS simulation software. A stress-free state at 25°C was considered in each finite element, then cooling to a temperature of -40°C of the photovoltaic module was calculated, this temperature being that of thermal cycling as established in the IEC6215 standard.

[0101] A reference mesh, such as that illustrated in [Fig.8] was produced without any shim being present.

[0102] A comparative mesh was established, in which the modulus of elasticity of the shim material is 100 GPa, which is more than 160 times higher than the encapsulating material of layer 15 and the encapsulating material of layers 14i and 14s. The width lcaie was 1 mm and the thickness ecaie was equal to 200 pm.

[0103] A mesh of a PV module according to the invention was established, this being identical to the comparative mesh except that the modulus of elasticity at -40°C of the material of the shim is 1 MPa.

[0104] [Fig.9] illustrates the effect of thermal expansions between 20°C and -40°C which induces von Mises stresses which are higher in the interconnector in the absence of a shim (mesh 35). The shim, less rigid than the encapsulation material, softens the interconnector overlap zone, the von Mises stresses being locally lower in the interconnector (mesh 36).

[0105] This observation is confirmed by [Fig. 10] which represents the evolution of the von Mises stresses o, expressed in MPa, as a function of the abscissa S (in mm) along the path 37 illustrated in [Fig.8] for the reference mesh 35 (without shim) (curve 40), for the comparative mesh (curve 41) and for the mesh according to the invention (curve 42). The presence of a shim having too high a rigidity, greater than the rigidity of the encapsulation materials, reinforces the concentration of stresses in the interconnector in the central part of the latter. The maximum von Mises stress is 39% higher than in the reference mesh without shim. On the contrary, a shim that is more flexible than the encapsulation materials makes it possible to limit this stress concentration, by reducing the maximum value of the von Mises stress in the interconnector by 52%.

[0106] [Fig. 11] is a graph showing the maximum value of von Willebrand stress Places along path 37 for meshes in which the wedges all have a square section (same width lcale of 200 pm and same thickness ecaie of 200 pm), the modulus of elasticity varying from 0.1 MPa to 330 MPa. A general increase in the von Mises stress is observed with an increase in the modulus of elasticity.

[0107] [Fig. 12] illustrates the evolution of the maximum value of the von Mises stress in the interconnector, for meshes in which the elastic modulus at -40 °C of the shim material is 1 MPa, the thickness ecaie is 200 pm and the width lcaie varies from 200 pm to 1000 pm (the case lcaie=0 corresponds to the reference case without shim). It is observed that an increase in the width of the shim induces a decrease of up to more than 50% of the maximum value of the von Mises stress in the interconnector, compared to the reference case.

[0108] [Fig. 13] illustrates the evolution of the maximum value of the von Mises stress in the interconnector, for meshes in which the elastic modulus at -40 °C of the shim material is 1 MPa, the width lcaie is 1000 pm and the thickness ecaie varies from 100 pm to 400 pm (the case ecaie=0 corresponds to the reference case without shim). It is observed that an increase in the thickness of the shim induces a decrease of up to more than 80% of the maximum value of the von Mises stress in the interconnector, compared to the reference case.

[0109] As appears from reading the present description, the invention therefore reduces the risks of breakage of the interconnector during thermal cycling.

[0110] By “between A and B” is meant strictly equivalently “greater than or equal to A and less than or equal to B”.

Claims

Claims

1. Photovoltaic module (1) comprising: - a photovoltaic unit (6) comprising several photovoltaic cells (3) electrically connected in series and spaced apart from each other, the adjacent photovoltaic cells (3) being electrically connected two by two by a metal interconnector (4) which extends at least partly in an interconnection space (2) separating said adjacent photovoltaic cells, - an encapsulation structure (8) based on at least one polymer encapsulation material, sandwiching the opposite faces of the photovoltaic cells, defining a cell overlap zone (10), and the interconnector (4) in the interconnection space (2), defining an interconnector overlap zone (11), a shim (12) incorporated in the encapsulation structure (8) and partially superimposed on the interconnector (4) in the interconnector overlap zone (11),the shim (12) being made of a material having at least, at a temperature of -40°C, a modulus of elasticity lower than the modulus of elasticity of the encapsulating polymer material.,

2. Photovoltaic module according to claim 1, the material of the shim (12) having a modulus of elasticity more than 2 times, preferably more than 5 times, or even more than 10 times, lower than the modulus of elasticity of the encapsulating polymer material at a temperature of -40°C.

3. Photovoltaic module according to any one of claims 1 and 2, the material of the shim (12) having a modulus of elasticity lower than the modulus of elasticity of the encapsulation material at a temperature of 20°C, preferably at any temperature between -40°C and 20°C.

4. Photovoltaic module according to any one of the preceding claims, the material of the shim (12) having a modulus of elasticity, measured at -40°C, of ​​between 0.1 MPa and 300 MPa, preferably of between 1 MPa and 10 MPa.

5. Photovoltaic module according to any one of the preceding claims, the material of the shim (12) being an elastomer, in particular chosen from silicone elastomers, rubbers, fluorinated elastomers, thermoplastic elastomers and their mixtures.

6. Photovoltaic module according to any one of the preceding claims, the shim having a thickness of between 100 μm and 1500 pm and / or a width between 100 pm and 1500 pm.

7. Photovoltaic module according to any one of the preceding claims, the wedge (12) having the shape of a ribbon, in particular of rectangular or square section.

8. Photovoltaic module according to any one of the preceding claims, the wedge (12) extending from one side to the other over the entire length of the interconnection space between the adjacent photovoltaic cells, said length being measured parallel to the lateral faces facing said adjacent cells.

9. Photovoltaic module according to any one of the preceding claims, the photovoltaic module comprising several wedges (12) at least partially covering the interconnector (4) in the interconnector covering area (11).

10. Photovoltaic module according to the preceding claim, in the thickness of the PV module, at least two of the wedges (12) being arranged on either side of the interconnector.

11. Photovoltaic module according to any one of the preceding claims, the encapsulation material comprising for more than 70% of its mass, preferably for more than 80% of its mass, preferably for more than 90% of its mass, preferably for more than 95% of its mass, preferably for 100% of its mass, a polymer material.

12. Photovoltaic module according to the preceding claim, the polymer material being chosen from ethylene-vinyl acetate, an ethylene-methyl acrylate copolymer, low density polyethylene terephthalate, polyamide 11, polycarbonate, polyethylene glycol terephthalate, polymethyl methacrylate, polypropylene, polypropylene copolymer, polypropylene homopolymer, polytetrafluoroethylene, styrene-acrylonitrile copolymer, thermoplastic polyurethane, acrylonitrile butadiene styrene, polyethylene and mixtures thereof.

13. A PV module according to any preceding claim, the encapsulating material may have a modulus of elasticity of between 10 MPa and 10 GPa, at a temperature of -40°C.

14. A method of manufacturing a photovoltaic module according to any one of the preceding claims, the method comprising: - providing a multilayer stack (20) comprising a photovoltaic unit (6) comprising photovoltaic cells (3) electrically connected in series and spaced apart from each other, the photovoltaic cells adjacent photovoltaic cells being electrically connected two by two by an interconnector (4) which extends at least partly into an interconnection space (2) separating said adjacent photovoltaic cells, a wedge (12) superimposed at least partially on the interconnector in the interconnection space (2), and at least two encapsulation layers (21i,21s) which sandwich the photovoltaic unit and - thermoforming of the multi-layer stack until the photovoltaic module is obtained.

15. Method according to the preceding claim, according to which the thermoforming is carried out by laminating the multi-layer stack between a heated lower lamination plate (24i) and a membrane (25) on which a fluid pressure is applied.

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