3D Capacitor-Submersible Mechanical Barrier

Abstract

Mechanical barrier under 3D capacitor. This description relates to an electronic device (200) comprising: - at least one copper pad (102); - a dielectric layer (104) formed on the copper pad (102), the dielectric layer (104) having a trench (108) opening onto the copper pad (102); - a metallic layer (110) on the lateral sides and in the bottom of the trench (108); and - a conductive layer (120) interfacing between the copper pad (102) and the metallic layer (110) at the bottom of the trench (108), the conductive layer (120) being in contact, by its lower face, with the upper face of the copper pad (102), and, by its upper face, with the lower face of the metallic layer (110). Figure for the abbreviation: Fig. 2