Electronic assembly, specifically configured for integration into an inverter

Abstract

Title: Electronic assembly, in particular configured for integration into an inverter. The invention relates to an electronic assembly (1), in particular configured for integration into an inverter (100), the electronic assembly (1) comprising: a first cooling device (10) having plates configured to form at least one circulation channel (16) for a heat transfer fluid, one of the plates defining a thermal contact face (11), a second cooling device (50) having a thermal contact face (51), a power electronic module (80) having a first face (81) and a second face (82), in particular parallel to each other,the first face (81) of the power electronic module (80) being in thermal contact with the thermal contact face (11) of the first cooling device (10) and the second face (82) of the power electronic module (80) being in thermal contact with the thermal contact face (51) of the second cooling device (50). Figure for the abbreviation: Fig. 6,

Description

Title of the invention: Electronic assembly, in particular configured to be integrated into an inverter

[0001] The present invention relates in particular to an electronic assembly, in particular configured to be integrated into an inverter.

[0002] Patent application WO2022248427 discloses a cooling structure comprising stacked plates forming a network of openings and chambers for the flow of a cooling fluid. This structure is placed in a conduit, and this conduit is closed by a base plate of a power electronic module. The cooling fluid flows through a meander within this structure.

[0003] The invention aims to propose a new type of thermal regulation device.

[0004] The invention thus relates to an electronic assembly, in particular configured to be integrated into an inverter, the electronic assembly comprising: - a first cooling device comprising plates configured to form at least one circulation channel for a heat transfer fluid, one of the plates defining a thermal contact face, - a second cooling device having a thermal contact face, - a power electronic module having a first face and a second face, in particular parallel to each other, the first face of the power electronic module being in thermal contact with the thermal contact face of the first cooling device and the second face of the power electronic module being in thermal contact with the thermal contact face of the second cooling device.

[0005] The invention is particularly advantageous because it allows the power electronic module to be cooled on both sides, thus allowing a greater amount of heat to be dissipated.

[0006] In the invention, the electronic power module(s) are sandwiched between the first cooling device and the second cooling device.

[0007] The first cooling device being a heat transfer fluid circulation device, this allows the heat released by the power electronic module during its operation to be evacuated more efficiently.

[0008] According to one aspect of the invention, the second cooling device comprises plates configured to form at least one circulation channel for a heat transfer fluid, one of the plates defining a thermal contact face.

[0009] In this case, the first cooling device and the second cooling device are of similar construction, namely with a heat transfer fluid channel formed by plates.

[0010] In another embodiment of the invention, the second cooling device is a heat sink, in particular formed by a block of material, for example aluminum.

[0011] In this case, no heat transfer fluid circulates within this second cooling device and heat is mainly dissipated by conduction through the material of this second cooling device.

[0012] According to one aspect of the invention, the first cooling device comprises a solid end plate forming the thermal contact face and, opposite, another solid end plate, and, between these two solid end plates, is disposed at least one channel plate.

[0013] According to one aspect of the invention, the channel plate is perforated so as to form the channel for circulating heat transfer fluid.

[0014] According to one aspect of the invention, the canal plate can be in the form of a strip of material which defines the perimeter of this canal plate.

[0015] According to one aspect of the invention, the first cooling device may comprise a plurality of channel plates, in particular identical ones, stacked one on top of the other, and placed between the two solid end plates.

[0016] According to one aspect of the invention, the second cooling device may comprise a plurality of channel plates, in particular identical ones, stacked one on top of the other, and placed between the two solid end plates.

[0017] According to one aspect of the invention, the solid end plates and the channel plate(s) are made, for example, of metal, for example, of aluminum.

[0018] According to one aspect of the invention, the plates may have undergone one or more cuts to give them the final shape.

[0019] According to one aspect of the invention, the solid end plates and the channel plate(s) are sealed together. For example, the solid end plates and the channel plate(s) are brazed together.

[0020] According to one aspect of the invention, the heat transfer fluid circulation channel of the first cooling device and / or the second cooling device has an overall straight shape.

[0021] Thus the heat transfer fluid circulates in a substantially straight line between a fluid inlet and a fluid outlet, in particular by making a single pass within the cooling device.

[0022] Alternatively, the first or second cooling device may each include one or more channels configured to make the heat transfer fluid perform a multitude of passes within the cooling device.

[0023] According to one aspect of the invention, the first cooling device and the second cooling device are configured to be fluidly connected to each other.

[0024] According to one aspect of the invention, the first cooling device has a fluid outlet port connectable to a fluid inlet port of the second cooling device and the second cooling device has a fluid outlet port connectable to a fluid inlet port of the first cooling device.

[0025] According to one aspect of the invention, the first cooling device further comprises a heat transfer fluid supply port and a heat transfer fluid discharge port.

[0026] Thus, the heat transfer fluid entering through the supply port of the first cooling device is distributed between the channel of the first cooling device and the channel of the second cooling device. These two channels join at their outlet to allow the heat transfer fluid to be discharged through the outlet port on the first cooling device.

[0027] In other words, the heat transfer fluid is subdivided into two flows to remove heat on the two opposite faces of the electronic power module.

[0028] In the case where the two cooling devices are of the plate type with a heat transfer channel, the fact that the fluid is used to cool the two opposite faces of the electronic module makes it possible to remove a large amount of heat produced by this power electronic module.

[0029] According to one aspect of the invention, the ports to be connected between the first cooling device and the second cooling device are connectable by a "cylinder in cylinder" type connection.

[0030] According to one aspect of the invention, the connection includes a sealing gasket between the cooling devices.

[0031] According to one aspect of the invention, a fluid fitting is placed between the first and second cooling devices.

[0032] According to one aspect of the invention, this fitting can be made of metal. It is called a "spigot" in English.

[0033] According to one aspect of the invention, the connection port of one of the cooling devices is of the male type and the other connection port on the other cooling device is of the female type.

[0034] According to one aspect of the invention, the heat transfer fluid circulation channel is configured to receive a device for disturbing the flow of heat transfer fluid within the channel.

[0035] This disturbance device makes it possible to create disturbances in the flow and to increase the heat exchange coefficient.

[0036] According to one aspect of the invention, the flow disturbance element comprises a corrugated structure.

[0037] According to one aspect of the invention, the corrugated structure is made of metal.

[0038] According to one aspect of the invention, the corrugated structure may include orifices or windows, to create more turbulence in the flow.

[0039] According to one aspect of the invention, the disturbance element is formed by one or more reliefs on the channel.

[0040] According to one aspect of the invention, a thermal interface material (for example, in English, "gap filler" or thermal paste or thermal grease or a film) is present between the face of the power electronic module and the thermal contact face of the first cooling device.

[0041] According to one aspect of the invention, such a thermal interface material is also present on the side of the second face of the electronic module in thermal contact with the other cooling device.

[0042] According to one aspect of the invention, the electronic assembly may comprise two or three or more power electronic modules, in particular arranged in a row, sandwiched between the first cooling device and the second cooling device.

[0043] According to one aspect of the invention, the electronic assembly includes a support configured to receive the electronic power module(s).

[0044] According to one aspect of the invention, this support for the electronic power module(s) is configured to be sandwiched between the first cooling device and the second cooling device.

[0045] According to one aspect of the invention, the support is made of metal or plastic.

[0046] According to one aspect of the invention, the support comprises one or more seats for receiving the electronic power module(s).

[0047] According to one aspect of the invention, the support has a frame shape defining the different seats.

[0048] According to one aspect of the invention, the support comprises one or more tabs configured to bear on the first cooling device and the second cooling device.

[0049] According to one aspect of the invention, these legs are configured to hold along the Z axis, the stack formed by the first cooling device, the support with the power electronic module(s), and the second cooling device.

[0050] According to one aspect of the invention, the first cooling device and / or the second cooling device comprises an ear, in particular a plurality of ears configured for maintaining the stack.

[0051] According to one aspect of the invention, each ear has a hole to allow the passage of a screw, for example, to fix the assembly.

[0052] According to one aspect of the invention, the power electronic module includes an electrical connection tab, in particular in the form of a plate, and the electrical connection tab protrudes on a side wall of the electronic assembly.

[0053] According to one aspect of the invention, the electronic module may include connection tabs on two parallel sides of the electronic assembly.

[0054] According to one aspect of the invention, the fluid channel(s) are rectangular in cross-section.

[0055] According to one aspect of the invention, the supply port and the discharge port of the heat transfer fluid on the first cooling device are on a face opposite to the thermal contact face.

[0056] According to one aspect of the invention, one of the cooling devices is placed in thermal contact with another electronic component which dissipates heat, against a face opposite to the power electronic module.

[0057] The invention also relates to an inverter comprising an electronic assembly as mentioned above.

[0058] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and several illustrative and non-limiting examples of embodiments given with reference to the accompanying schematic drawings on the other hand, in which:

[0059] [Fig-1] Fig. 1 is a perspective, top view, representation of a set electronics in place on an inverter base, according to an example of implementation of the invention;

[0060] [Fig.2] The [Fig.2] is a view of the electronic assembly of the [Fig.1];

[0061] [Fig. 3] [Fig. 3] is a view of the electronic assembly of [Fig. 2], on the side opposite;

[0062] [Fig.4] Fig.4 is a representation of the electronic assembly of Fig.2, in the absence of one of the cooling devices;

[0063] [Fig. 5] Fig. 5 is a representation of the cooling device of the [Fig.4], without the extimacy plate;

[0064] [Fig.6] Fig.6 is a longitudinal cross-sectional representation of the electronic assembly of [Fig.1].

[0065] The features, variants, and different embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of features, described hereafter in isolation from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0066] Figure 1 shows an electronic assembly 1 configured for integration into an inverter 100, of which a heat sink 102 (or "Heatsink") is shown in this Figure 1. The heat sink 102 is, for example, made of aluminum.

[0067] The inverter 100, in particular of the High Voltage type, is configured to be installed in a motor vehicle.

[0068] The inverter 100 includes, placed on the heat dissipation base 102, a capacitor 103 called "DC-Link" configured to stabilize the DC voltage, limiting its fluctuations which may appear in certain situations.

[0069] The other components (for example an electronic board, electrical connectors...) of the inverter 100 have not been shown.

[0070] As can be seen in Figures 2 to 5, the electronic assembly 1 comprises: - a first cooling device 10 having a thermal contact face 11 (see [Fig.4] in particular), - a second cooling device 50 having a thermal contact face 51, - power electronic modules 80 each having a first flat face 81 and a second flat face 82, parallel to each other, the first face 81 of the power electronic module 80 being in thermal contact with the thermal contact face 11 of the first cooling device 10 and the second face 82 of the power electronic module 80 being in thermal contact with the thermal contact face 51 of the second cooling device 50 (see [Fig.6] in particular).

[0071] The three power electronic modules 80 are sandwiched between the first cooling device 10 and the second cooling device 50.

[0072] The first cooling device 10 is a heat transfer fluid circulation device (for example glycol water), which allows the heat released by the power electronic module 80 during its operation to be evacuated more efficiently.

[0073] The first cooling device 10 comprises a solid end plate 12 forming the thermal contact face 11 and, opposite, another solid end plate 14, and, between these two solid end plates 12 and 14, is disposed at least one channel plate 15.

[0074] The channel plate 15 is perforated so as to form a channel 16 for the circulation of heat transfer fluid.

[0075] The canal plate 15 can be in the form of a strip of material which defines the perimeter of this canal plate 15.

[0076] The first cooling device 10 may comprise a plurality of channel plates 15, in particular identical ones, stacked one on top of the other, and placed between the two solid end plates 12 and 14. Alternatively, only one channel plate 15 is provided in the stack of plates which forms the first cooling device 10.

[0077] The solid end plate 14 which is turned away from the second cooling device 50 is covered with a thermal insulating sheet 17.

[0078] The solid end plate 12 forming the thermal contact face 11 has, at each longitudinal end along a longitudinal axis X, an orifice 19 for the inlet or outlet of fluid flowing in the channel 16. Each orifice 19 is provided with a nozzle 20 fitted with a seal 21, to establish a fluid connection with the second cooling device 50 (see [Fig. 6] for example). The seal 21 may be a separate seal or made in any other way.

[0079] The inlet and outlet ports will not be differentiated in the description (and bear the reference 19), because there is a symmetry of construction.

[0080] In the example described, the first cooling device 10 and the second cooling device 50 are of similar construction, namely with a heat transfer fluid channel 16 formed by plates.

[0081] The second cooling device 50 thus comprises a stack of plates with, like the first cooling device 10: - a solid end plate 52 defining the thermal contact face 51 of the second cooling device 50, - a solid end plate 53 opposite the solid end plate 52, - two stacked channel plates 54 defining a fluid channel 57.

[0082] The solid end plates 52, 53 and the channel plates 54 are made, for example, of metal, for example, aluminum. These plates may have undergone one or more cuts to give them their final shape.

[0083] The solid end plates 52, 53 and the channel plates 54 are brazed together.

[0084] The heat transfer fluid circulation channel 16 of the first cooling device 10 and the circulation channel 57 of the second cooling device 50 have a generally straight shape. These channels 16 and 57 may have a substantially rectangular cross-section.

[0085] Thus the heat transfer fluid circulates in a substantially straight line between a fluid inlet and a fluid outlet, of reference 19, in particular by making a single pass within the cooling device.

[0086] Alternatively, the first or second cooling device 10, 50 may each include one or more channels configured to make the heat transfer fluid perform a multitude of passes within the cooling device.

[0087] The first cooling device 10 and the second cooling device 50 are configured to be fluidly connected to each other.

[0088] The first cooling device 10 has a fluid outlet orifice 19 connectable to a fluid inlet orifice 59 of the second cooling device 50 and the second cooling device 50 has a fluid outlet orifice connectable to a fluid inlet orifice of the first cooling device 10, as illustrated in [Fig.6].

[0089] Thus the heat transfer fluid which enters through the supply port of the second cooling device 10 is distributed between the channel 16 of the first cooling device 10 and the channel 57 of the second cooling device 50. These two channels 16 and 57 join at their outlet to allow the heat transfer fluid to be evacuated towards the discharge port on the second cooling device 50.

[0090] In other words, the heat transfer fluid is subdivided into two flows to evacuate heat on the two opposite faces 81 and 82 of each electronic power module 80.

[0091] The second cooling device 50 has nozzles 70 to be connected to fluid connections of the inverter.

[0092] In the case where the two cooling devices are of the plate type with a heat transfer channel, the fact that the fluid is used to cool the two opposite faces 81 and 82 of the electronic module 80 makes it possible to remove a large amount of heat produced by this power electronic module 80.

[0093] The ports to be connected between the first cooling device 10 and the second cooling device 50 are connectable by a "cylinder in cylinder" type connection.

[0094] The fluid fitting 20 or nozzle 20, is placed between the first and second cooling devices 10 and 50.

[0095] This fitting 20 can be made of metal. It is called a "spigot" in English.

[0096] The connection port 19 of one of the cooling devices is of the male type and the other connection port on the other cooling device is of the female type.

[0097] The heat transfer fluid circulation channel 16 is configured to receive a disturbance element 24 for the flow of heat transfer fluid within the channel 16, as illustrated in Fig. 5.

[0098] This disturbance element 24 makes it possible to create disturbances in the flow and to increase the heat exchange coefficient.

[0099] The flow disturbance element 24 comprises a corrugated structure made of metal (from a sheet, for example). The corrugated structure may include orifices or windows to create more turbulence in the flow.

[0100] Alternatively, the disturbance element is formed by one or more reliefs on channel 16.

[0101] A thermal interface material (for example, in English, "gap filler" or paste) thermal or thermal grease or a film) is present between the face of the power electronic module 80 and the thermal contact face 11 and 12 of the first cooling device 10 and the second cooling device 50.

[0102] The three power electronic modules 80 are arranged in a row, sandwiched between the first cooling device 10 and the second cooling device 50.

[0103] The electronic assembly 1 includes a support 60 configured to receive the power electronic modules 80.

[0104] This support 60 is configured to be sandwiched between the first cooling device 10 and the second cooling device 50.

[0105] The support 60, made of metal or plastic, includes several seats 61 for receiving respectively the power electronic modules 80. On [Fig.4], one of the three seats 61 is left free (in the absence of a power electronic module 80) for clarity in the description.

[0106] The support 60 has a frame shape, with parallel bars 69, defining the different seats 61.

[0107] The support 60 has several tabs 62 configured to bear on the first cooling device 10 and the second cooling device 50.

[0108] These legs 62 are configured to maintain along the Z axis (perpendicular to the plane of the plates), the stack formed by the first cooling device 10, the support 60 with the power electronic modules 80, and the second cooling device 50.

[0109] The first cooling device 10 and the second cooling device 50 have a plurality of ears 65 configured for maintaining the stack formed by the first cooling device 10, the support 60 with the power electronic modules 80, and the second cooling device 50.

[0110] The support 60 is made in one piece.

[0111] Each ear 65 has a hole to allow the passage of a screw 66, for example, to secure the assembly. Each screw 66 fits into a threaded column 109 of the base 102, as illustrated in [Fig. 1]. Thus, the base 102 comprises a plurality of threaded columns 109 to receive the multitude of screws 66.

[0112] The power electronic module 80 has electrical connection tabs 84, in particular in the form of a plate or busbar, and each electrical connection tab 84 protrudes on a side wall 85 of the electronic assembly 2.

[0113] The electronic module 80 may have connection tabs on two parallel sides of the electronic assembly 1.

[0114] The supply port 19 or the heat transfer fluid discharge port on the first cooling device 10 are on a face opposite to the thermal contact face 11.

[0115] One of the cooling devices 10 or 50 is placed in thermal contact with another electronic component (for example a capacitor) which dissipates heat, against a face opposite to the power electronic module 80.

[0116] The cooling devices 10 or 50 also allow the heat in the busbars 84 to be cooled, and via these busbars 84, the DC Link capacitor 103.

[0117] In another embodiment of the invention, the second cooling device 50 is a heat sink, in particular formed by a block of material, for example, aluminum. In this case, no heat transfer fluid circulates within this second cooling device 50, and heat is dissipated primarily by conduction through the material of this second cooling device 50.

Claims

Demands

1. Electronic assembly (1), in particular configured to be integrated into an inverter (100), the electronic assembly (1) comprising: - a first cooling device (10) having plates configured to form at least one circulation channel (16) for a heat transfer fluid, one of the plates defining a thermal contact face (11), - a second cooling device (50) having a thermal contact face (51), - a power electronic module (80) having a first face (81) and a second face (82), in particular parallel to each other, the first face (81) of the power electronic module (80) being in thermal contact with the thermal contact face (11) of the first cooling device (10) and the second face (82) of the power electronic module (80) being in thermal contact with the thermal contact face (51) of the second cooling device (50).

2. Electronic assembly (1) according to the preceding claim, wherein the first cooling device (10) comprises a solid end plate (12) forming the thermal contact face (11) and, opposite, another solid end plate (14), and, between these two solid end plates, is disposed at least one channel plate (15), the channel plate being perforated so as to form the channel for circulating heat transfer fluid.

3. Electronic assembly according to any one of the preceding claims, wherein the second cooling device (50) comprises plates configured to form at least one circulation channel for a heat transfer fluid, one of the plates defining a thermal contact face (51).

4. Electronic assembly (1) according to the preceding claim, wherein the first cooling device (10) and the second cooling device (50) are configured to be fluidly connected to each other.

5. Electronic assembly (1) according to the preceding claim, wherein the first cooling device (10) has a fluid outlet port (19) connectable to an inlet port of fluid of the second cooling device (50) and the second cooling device (50) has a fluid outlet port that can be connected to a fluid inlet port of the first cooling device (10).

6. Electronic assembly (1) according to claim 1, wherein the second cooling device (50) is a heat sink, in particular formed by a block of material, for example of aluminum.

7. Electronic assembly (1) according to any one of the preceding claims, wherein the heat transfer fluid circulation channel (16) is configured to receive a flow disturbance element (24) for the heat transfer fluid within the channel, the flow disturbance element comprising in particular a corrugated structure.

8. Electronic assembly (1) according to any one of the preceding claims, wherein the electronic assembly (1) may comprise two or three or more power electronic modules, in particular arranged in a row, sandwiched between the first cooling device (10) and the second cooling device (50).

9. Electronic assembly (1) according to any one of the preceding claims, wherein the electronic assembly (1) comprises a support (60) configured to receive the power electronic module(s), this support for the power electronic module(s) being configured to be sandwiched between the first cooling device (10) and the second cooling device (50).

10. Electronic assembly (1) according to the preceding claim, wherein the support (60) has a frame shape defining different seats.

11. Electronic assembly (1) according to the preceding claim, wherein the support has one or more tabs (62) configured to bear on the first cooling device (10) and the second cooling device (50), these tabs are in particular configured to maintain along the Z axis, the stack formed by the first cooling device (10), the support with the power electronic module(s), and the second cooling device (50).

12. Electronic assembly (1) according to any one of the preceding claims, wherein the first cooling device (10) and / or the second cooling device (50) has an ear (65), in particular a plurality of ears configured for maintaining the stack, each ear having in particular a hole to allow the passage of a screw, for example, to fix the assembly.

13. Electronic assembly (1) according to any one of the preceding claims, wherein one of the cooling devices is placed in thermal contact with another heat-dissipating electronic component, against a face opposite to the power electronic module (80).

14. Inverter (100) comprising an electronic assembly (1) according to any one of the preceding claims.

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