Apparatus and method

Abstract

A method of packaging semiconductor die, the method comprising: placing the first of a set of semiconductor die at the respective first of a set of placements; and providing a first package, having a first structure, comprising ink jetting (i.e. binder jet printing, powder bed and inkjet printing and / or drop-on-powder printing) comprising: providing a first layer of a first powder comprising a first material (e.g. copper powder); forming a first part having a first electrical conductivity comprising selectively jetting the first layer using a first ink formulation; and forming a second part having a second electrical conductivity comprising selectively jetting the first layer using a second ink formulation. Also disclosed is a packaged semiconductor die produced by this method. The first ink formulation may oxidise the first material upon contact and / or heating. The second ink formulation may reduce the first material upon contact and / or heating.

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