Temperature sensor
JP1823944SActive Publication Date: 2026-04-09MITSUBISHI MATERIALS CORP
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2025-09-24
- Publication Date
- 2026-04-09
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Abstract
This product is a temperature sensor used in batteries, automotive-related devices, and the like. As shown in the reference perspective view and reference cross-sectional view showing the inside of the temperature sensor, it comprises a strip-shaped FPC (flexible printed circuit board) with a silicon sheet attached to its upper surface, a thermistor element installed beneath the silicon sheet and on the tip of the FPC and sealed with a dome-shaped resin, a copper foil formed on the bottom surface of the tip of the FPC, a pair of lead wires connected to the base end of the FPC, a heat-shrinkable tube covering the connection between the pair of lead wires and the FPC, and a resin case that houses the base end of the FPC together with the heat-shrinkable tube, with the FPC extending downwards through a bending hole.
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