Temperature sensor

JP1823944SActive Publication Date: 2026-04-09MITSUBISHI MATERIALS CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-09-24
Publication Date
2026-04-09

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Abstract

This product is a temperature sensor used in batteries, automotive-related devices, and the like. As shown in the reference perspective view and reference cross-sectional view showing the inside of the temperature sensor, it comprises a strip-shaped FPC (flexible printed circuit board) with a silicon sheet attached to its upper surface, a thermistor element installed beneath the silicon sheet and on the tip of the FPC and sealed with a dome-shaped resin, a copper foil formed on the bottom surface of the tip of the FPC, a pair of lead wires connected to the base end of the FPC, a heat-shrinkable tube covering the connection between the pair of lead wires and the FPC, and a resin case that houses the base end of the FPC together with the heat-shrinkable tube, with the FPC extending downwards through a bending hole.
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