Wearable device main unit

JP1827450SActive Publication Date: 2026-05-21TAIWAN ASIA SEMICONDUCTOR CORPORATION
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
TAIWAN ASIA SEMICONDUCTOR CORPORATION
Filing Date
2026-01-19
Publication Date
2026-05-21

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Abstract

This item is the main body of a wearable device, which comprises a sensor module composed of multiple arc-shaped photodiodes arranged in a ring.
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