Device

Abstract

To provide a device with a novel structure that can be thinned.SOLUTION: A device 10 includes a first sealing member 20, a second sealing member 30, a first circuit member 40, and a second circuit member 50. The first sealing member 20 includes a first film 22 made of a film as a base, and a conductive part 266 made of a conductor. The device 10 includes a sealed space 18. The sealed space 18 is surrounded by the first sealing member 20 and the second sealing member 30, and is blocked from the outside of the device 10. The first circuit member 40 and the second circuit member 50 are sealed inside the sealed space 18. A first contact 48 of the first circuit member 40 and a second contact 58 of the second circuit member 50 are in contact with each other as being pressed against each other. The second circuit member 50 includes a connection electrode 59. The conductive part 266 is in contact with the connection electrode 59 inside the sealed space 18 and is exposed to the outside of the device 10.SELECTED DRAWING: Figure 5

Description

Technical Field

[0007] , ,

[0001] The present invention relates to a device including a circuit member sealed by a film.

Background Art

[0002] For example, Patent Document 1 discloses a device that can be thinned.

[0003] Referring to FIG. 17, Patent Document 1 discloses a semiconductor chip-embedded module (device) 90. The device 90 includes a thermosetting resin composition (sealing resin) 92 and a circuit member 94 including a semiconductor chip 96 and a wiring pattern 98. The sealing resin 92 is formed so as to embed the circuit member 94 therein. Thereafter, the surface of the sealing resin 92 is polished, whereby the device 90 is thinned.

Prior Art Documents

Patent Documents

[0008] The present invention provides a second device, which is the first device, The first film has a main opening formed therein. The main opening penetrates the first film, The conductive portion is blocking the main opening. We provide devices.

[0009] The present invention provides a third device, which is the first device, The first sealing member comprises a sub-member in addition to the first film, The first film has a main opening formed therein. The main opening penetrates the first film, The aforementioned sub-member comprises a fixed portion and a conductive portion, The aforementioned sub-member has a sub-opening formed therein. The aforementioned secondary opening penetrates the fixed portion, The conductive portion blocks the secondary opening. The fixed part located around the auxiliary opening is fixed to the first film over the entire circumference. Provide a device.

[0010] As a fourth device, the present invention is a third device, The first film has an outer surface, The outer surface is located outside the sealed space, The fixed part of the auxiliary member is fixed to the outer surface. Provide a device.

[0011] As a fifth device, the present invention is a third device, The first film has an inner surface, The inner surface is located inside the sealed space, The fixed part of the auxiliary member is fixed to the inner surface. Provide a device.

[0012] As a sixth device, the present invention is any one of the third to fifth devices, The fixed part of the auxiliary member is made of a film. Provide a device.

[0013] As a seventh device, the present invention is any one of the first to sixth devices, The second sealing member is provided based on a second film made of a film. Provide a device.

[0014] As an eighth device, the present invention is A device including a first sealing member, a second sealing member, a first circuit member, and a second circuit member, The first sealing member is provided based on a first film made of a film and includes a conductive gel. A sealed space is formed in the device. The sealed space is surrounded by the first sealing member and the second sealing member, and is isolated from the outside of the device. The first circuit member and the second circuit member are sealed inside the sealed space. The first circuit member is equipped with a first contact, The aforementioned second circuit member is equipped with a second contact, The first contact and the second contact are pressed against each other and in contact within the sealed space. At least one of the first circuit member and the second circuit member is provided with a connecting electrode. The conductive gel has conductive portions, The conductive portion is in contact with the connecting electrode inside the sealed space and is partially exposed to the outside of the device. We provide devices. [Effects of the Invention]

[0015] In the device of the present invention, the first sealing member and the second sealing member are stacked on top of each other with the first circuit member and the second circuit member (hereinafter simply referred to as "circuit member") sandwiched between them. The first sealing member is formed on a film base. Furthermore, each circuit member has no structural constraints except that it is equipped with contacts and connecting electrodes. That is, the circuit member of the present invention has a simple structure and can be formed from various materials. For example, the circuit member may be an insulating film on which a conductive pattern having contacts and connecting electrodes is formed. In this case, the overall thickness of the device can be made extremely thin. In other words, the present invention can provide a new device that can be made thinner. [Brief explanation of the drawing]

[0016] [Figure 1] This is a perspective view showing a device according to an embodiment of the present invention. The contour of the hidden main opening of the first film and the boundary of the contact area formed between the first sealing member and the second sealing member are shown with dashed lines. [Figure 2]Figure 1 is a perspective view showing the device with the first sealing member removed. The contour of the hidden main opening of the first film and the boundary of the contact area are drawn with dashed lines. [Figure 3] This is a top view showing the first sealing member of the device in Figure 1. The outline of the hidden main opening of the first film is drawn with a dashed line. [Figure 4] This is a bottom view showing the first sealing member of Figure 3. The hidden outlines of the auxiliary member and air valve are shown with dashed lines. [Figure 5] Figure 1 is a schematic cross-sectional view of the device along the VV line. This figure is intended to schematically represent the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. [Figure 6] Figure 1 is an exploded perspective view showing the device. A portion of the first film (outlined by the dashed line) and a portion of the second film (outlined by the dashed line) are shown in magnified detail. [Figure 7] Figure 6 is an exploded perspective view showing the air valve of the device. The air valve is open. [Figure 8] This is a side view showing the device in Figure 1 during the manufacturing process. [Figure 9] This is a schematic cross-sectional view of the device in the manufacturing process shown in Figure 1, along the VV line. This figure is intended to schematically represent the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. A side view of the vacuuming equipment is also shown. [Figure 10] This is a cross-sectional view showing a modified version of the device in Figure 5. This figure is for schematic purposes only to illustrate the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. [Figure 11] This is a cross-sectional view showing another modified example of the device shown in Figure 5. This figure is for schematic purposes only to illustrate the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. [Figure 12] Figure 11 is a top view showing the first sealing member of the device. The hidden contours of the sub-members are drawn with dashed lines. [Figure 13]Figure 12 is a bottom view showing the first sealing member. The hidden outline of the main opening and the hidden outline of the air valve of the first film are shown with dashed lines. [Figure 14] This is a perspective view showing a modified version of the device in Figure 1. The boundary of the contact area formed between the first sealing member and the second sealing member is shown with a dashed line. [Figure 15] Figure 14 is a schematic cross-sectional view of the device along the line XV-XV. This figure is intended to schematically represent the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. [Figure 16] This is a perspective view showing another modified version of the device in Figure 1. The contour of the hidden main opening of the first film and the boundary of the contact area formed between the first sealing member and the second sealing member are shown with dashed lines. [Figure 17] This is a cross-sectional view showing the device described in Patent Document 1. [Modes for carrying out the invention]

[0017] Referring to Figure 1, the device 10 according to an embodiment of the present invention is an independent electronic device. More specifically, the device 10 can operate independently without being physically attached to other electronic devices (not shown). For example, the device 10 can be attached near a subject's heart to measure the subject's electrocardiogram and transmit the measurement results to other electronic devices. That is, the device 10 can be used as an electronic device to measure biological information such as electrocardiograms. However, the present invention is not limited thereto and can be applied to devices with various functions.

[0018] Referring to Figure 2 in conjunction with Figure 1, the device 10 of this embodiment comprises a circuit structure 12 and a sealing member 14. The circuit structure 12 is a component that enables the device 10 to function as an electronic device. For example, the circuit structure 12 has an electronic circuit (not shown) for receiving electrical signals (hereinafter referred to as "biometric signals") resulting from the subject's electrocardiogram, an electronic circuit (not shown) for measuring the electrocardiogram based on the acquired biometric signals, and an electronic circuit (not shown) for transmitting the measurement results to another electronic device (not shown). The sealing member 14 houses the entire circuit structure 12 inside and protects the circuit structure 12 from the external environment. That is, the circuit structure 12 is sealed inside the sealing member 14.

[0019] The circuit structure 12 of this embodiment comprises a first circuit member 40 and a second circuit member 50. The sealing member 14 of this embodiment comprises a first sealing member 20 and a second sealing member 30. That is, the device 10 comprises the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50. Referring to Figure 8 in conjunction with Figures 1 and 2, the four members of the device 10 (first sealing member 20, second sealing member 30, first circuit member 40, and second circuit member 50) are stacked in the vertical direction (Z direction) and assembled as a single device 10. The device 10 of this embodiment comprises only the four members described above. However, the present invention is not limited thereto, and the device 10 may further comprise other members in addition to the four members described above.

[0020] The following describes each component of the device 10 in this embodiment.

[0021] Referring to Figure 6, the first sealing member 20 of this embodiment is formed on a base of a first film 22, which is an insulating film. In other words, the first sealing member 20 is equipped with a first film 22 made of film as its base. The first film 22 of this embodiment is a thin rectangular sheet and is flexible. The thickness of the first film 22 is, for example, about 0.01 to 0.5 mm. The first film 22 extends parallel to a horizontal plane (sheet surface: XY plane) perpendicular to the Z direction. The first film 22 has a periphery 229 in the XY plane.

[0022] Referring to Figures 3 and 4, the first film 22 has an outer surface 232 and an inner surface 234. The outer surface 232 is the top surface (+Z side) of the first film 22. The inner surface 234 is the bottom surface (-Z side) of the first film 22.

[0023] The first film 22 of this embodiment comprises two layers: a molten layer 146 that melts upon heating and a non-molten layer 148 that does not melt upon heating. The molten layer 146 is located below the non-molten layer 148. For example, the molten layer 146 is made of polyethylene, and the non-molten layer 148 is made of nylon. This structure allows the molten layer 146 to be fused to the molten layer of another component while maintaining the non-molten layer 148. However, the present invention is not limited thereto. For example, the first film 22 may comprise only one non-molten layer 148, or it may comprise three or more layers.

[0024] The first film 22 has a main opening 244 and a valve opening 248 formed therein. In this embodiment, the main opening 244 and the valve opening 248 each have a small circular shape in the XY plane and penetrate the first film 22 in the Z direction. The diameter of the main opening 244 is, for example, 0.5 mm or less. Such a main opening 244 and valve opening 248 can each be formed by a method such as laser irradiation. However, the present invention is not limited thereto. For example, the shape and size of the main opening 244 and valve opening 248 in the XY plane are not particularly limited.

[0025] Referring to Figures 1 and 6, the first sealing member 20 of this embodiment includes, in addition to the first film 22, a sub-member 26 and an air valve 28.

[0026] The auxiliary member 26 in this embodiment is a thin, circular sheet and is flexible. The auxiliary member 26 comprises a thin adherent portion 262 made of a resin such as polyethylene terephthalate (PET) or polyurethane (PU), and a thin conductive portion 266 made of a conductor such as metal. That is, the first sealing member 20 comprises an adherent portion 262 made of a film and a thin conductive portion 266.

[0027] The thickness of the fixed portion 262 and the conductive portion 266 in this embodiment is, for example, about 0.01 to 0.5 mm. A sub-opening 264 is formed in the sub-member 26. The sub-opening 264 has a small circular shape in the XY plane. The diameter of the sub-opening 264 is, for example, 0.5 mm or less. The sub-opening 264 penetrates the fixed portion 262 in the Z direction. However, the sub-opening 264 is completely filled by the conductive portion 266. In other words, the conductive portion 266 extends seamlessly across the entire sub-opening 264 in the XY plane, blocking the sub-opening 264. The conductive portion 266 is also exposed upward (+Z direction) and downward (-Z direction). That is, the sub-member 26 is formed to be electrically conductive in the Z direction.

[0028] The sub-member 26 of this embodiment can be manufactured, for example, as follows. First, a film with a thickness of about 0.01 to 0.5 mm is made from a resin such as PET or PU. Next, a sub-opening 264 with a diameter of 0.5 mm or less is formed in the film by a method such as laser irradiation. As a result, a fixed portion 262 is formed. Next, conductive paste is filled into the sub-opening 264 from one side of the film using an appropriate mask and doctor blade. Next, the film is heated to harden the conductive paste. Next, conductive paste is filled into the sub-opening 264 from the other side of the film using an appropriate mask and doctor blade. Next, the film is heated to harden the conductive paste. Through the two heating steps described above, a conductive portion 266 is formed from the conductive paste.

[0029] The sub-member 26 of this embodiment is manufactured as described above and has the structure described above. However, the present invention is not limited thereto. For example, the conductive portion 266 may be formed by a plating method or by an inkjet method. The conductive portion 266 may be formed by laminating a metal foil to the upper or lower surface of the fixed portion 262 so as to cover the entire sub-opening 264. The conductive portion 266 may partially protrude downward. Furthermore, the shape and size of the sub-member 26 are not particularly limited.

[0030] In this embodiment, the diameter of the main opening 244 of the first film 22 is smaller than the diameter of the fixed portion 262 of the sub-member 26, and larger than the diameter of the conductive portion 266 of the sub-member 26. In this embodiment, the fixed portion 262 is fixed to the outer surface 232 so as to surround the main opening 244 in the XY plane. In other words, the fixed portion 262 located around the sub-opening 264 is fixed to the first film 22 around the entire circumference of the main opening 244. The fixed portion 262 is in close contact with the outer surface 232 and seals the edge of the main opening 244 around its entire circumference in the XY plane. That is, the sub-member 26 completely blocks the main opening 244 and blocks the flow of air through the main opening 244.

[0031] In this embodiment, the part to be fixed 262 is fixed to the outer surface 232 of the first film 22 by a fixing member such as an adhesive. However, the present invention is not limited thereto. For example, referring to Figure 6, the first film 22 may further have a molten layer (not shown) on top of the non-molten layer 148. The part to be fixed 262 may have a molten layer (not shown) and a non-molten layer (not shown). The molten layer of the part to be fixed 262 may be located in a lower layer of the part to be fixed 262. According to the above-described modification, the part to be fixed 262 can be fixed to the outer surface 232 of the first film 22 by heat welding the molten layer of the part to be fixed 262 and the molten layer of the first film 22.

[0032] Referring to Figures 3 and 4, the outer edge of the fixed portion 262 in this embodiment is located outside the main opening 244 in the XY plane. On the other hand, the inner edge of the fixed portion 262 in the XY plane is located inside the main opening 244 in the XY plane. That is, the conductive portion 266 in this embodiment is located inside the main opening 244 in the XY plane. The conductive portion 266, arranged in this manner, can move up and down while partially elastically deforming the fixed portion 262. In particular, when the fixed portion 262 is made of PU, the fixed portion 262 is easily elastically deformed. However, the present invention is not limited thereto. For example, the relative sizes of the fixed portion 262, the main opening 244, and the conductive portion 266 in the XY plane can be changed in various ways as needed.

[0033] Referring to Figures 6 and 7, the air valve 28 of this embodiment comprises a shielding portion 282 made of a thin insulating film and a base portion 286 made of an insulator. As shown in Figure 7, a through hole 288 is formed in the base portion 286. The through hole 288 penetrates the base portion 286 in the Z direction. Five valves 284 and five notches 285 corresponding to each valve 284 are formed in the shielding portion 282. Each of the notches 285 penetrates the shielding portion 282 in the Z direction. The valves 284 and notches 285 are located inside the outer circumference of the shielding portion 282 in the XY plane.

[0034] Referring to Figure 7 in conjunction with Figure 6, the shielding portion 282 is bonded and fixed to the upper surface of the base portion 286. In particular, the outer circumference of the shielding portion 282 in the XY plane is firmly in contact with the upper surface of the base portion 286 all around. On the other hand, the inner side of the outer circumference of the shielding portion 282 in the XY plane can be separated from the upper surface of the base portion 286. That is, an air passage can be formed between each of the notches 285 and the through holes 288. The lower surface of the base portion 286 is bonded and fixed to the first film 22 such that the through holes 288 connect to the valve opening 248 of the first film 22.

[0035] Referring to Figure 1 in conjunction with Figure 7, the air valve 28 can transition between an open state (shown in Figure 7) where each of the valves 284 is away from its corresponding notch 285, and a closed state (shown in Figure 1) where each of the valves 284 completely blocks its corresponding notch 285. When the air valve 28 is in the open state, an air passage is formed between the inside and outside of the device 10 via the air valve 28. On the other hand, when the air valve 28 is in the closed state, the inside of the device 10 is completely isolated from the outside of the device 10.

[0036] As will be described later, the air valve 28 is used to evacuate the inside of the device 10 when manufacturing the device 10. The air valve 28 in this embodiment has a structure suitable for this application. However, the present invention is not limited thereto. For example, the structure of the air valve 28 is not particularly limited as long as it can be used to remove air from inside the device 10. Alternatively, the inside of the device 10 may be evacuated without providing the air valve 28. In other words, the air valve 28 may be provided only as needed.

[0037] Referring to Figure 6, the second sealing member 30 of this embodiment is formed on a base of a second film 32, which is an insulating film. In other words, the second sealing member 30 is equipped with a second film 32 made of film as its base. The second film 32 of this embodiment is formed from the same material as the first film 22 and has the same structure as the first film 22. For example, the second film 32 is a thin rectangular sheet and is flexible. The second film 32 extends parallel to the XY plane. The second film 32 has a periphery 329 in the XY plane. However, the present invention is not limited thereto. For example, the second sealing member 30 may be equipped with a rigid (i.e., rigid and resistant to bending) circuit board as its base instead of the second film 32.

[0038] The second film 32 (or rigid circuit board) of this embodiment, like the first film 22, comprises two layers: a molten layer 146 that melts upon heating and a non-molten layer 148 that does not melt upon heating. The molten layer 146 is located on top of the non-molten layer 148. This structure allows the two molten layers 146 to be heat-welded to each other while maintaining the non-molten layers 148 of the first film 22 and the second film 32. However, the present invention is not limited thereto, and each of the first film 22 and the second film 32 may have a structure corresponding to the manufacturing method of the device 10. For example, the first film 22 and the second film 32 may be fixed to each other by a fixing member such as an adhesive. In this case, each of the first film 22 and the second film 32 may have only one layer of the non-molten layer 148. On the other hand, each of the first film 22 and the second film 32 may have three or more layers.

[0039] Referring to Figures 2 and 6, the second sealing member 30 of this embodiment includes an additional film 38 made of an insulating film, in addition to the second film 32. The additional film 38 has an uneven surface 382. As will be described later, the uneven surface 382 is provided to maintain a passage through which air can pass when the inside of the device 10 is evacuated. Specifically, the additional film 38 has a number of protrusions 384 formed thereon. Each of the protrusions 384 is a deformable projection that protrudes upward. The protrusions 384 are formed uniformly and continuously across the entire additional film 38 in the XY plane. Due to the structure described above, a passage through which air can pass is formed between two adjacent protrusions 384. The shape and size of the protrusions 384 are not particularly limited, as long as a passage through which air can pass is formed.

[0040] Referring to Figure 1 in conjunction with Figure 2, the first film 22 and the second film 32 in this embodiment are superimposed on each other such that the positions of their periphery 229 and periphery 329 coincide in the XY plane. However, the present invention is not limited thereto. For example, the size of the first film 22 and the size of the second film 32 in the XY plane may be different. The shapes of the first film 22 and the second film 32 are not limited to rectangles and can be deformed as needed.

[0041] Referring to Figure 6, the first circuit member 40 of this embodiment comprises a first base body 42 and a first conductor pattern 44. The first base body 42 of this embodiment is a thin rectangular sheet made of insulating film and is flexible. The first base body 42 extends parallel to the XY plane. The first conductor pattern 44 is formed on the first base body 42. Specifically, the first conductor pattern 44 is made of a conductor such as copper and is formed on the lower surface of the first base body 42 by a formation method such as silver ink printing or etching.

[0042] The second circuit member 50 of this embodiment includes a second base 52 and a second conductor pattern 54. The second base 52 of this embodiment is a thin rectangular sheet made of insulating film and is flexible. The second base 52 extends parallel to the XY plane. The second conductor pattern 54 is formed on the second base 52. Specifically, the second conductor pattern 54 is made of a conductor such as copper and is formed on the upper surface of the second base 52 by a formation method such as silver ink printing or etching.

[0043] The first circuit member 40 and the second circuit member 50 of this embodiment each have the structure described above. However, the present invention is not limited thereto. For example, each of the first circuit member 40 and the second circuit member 50 may be provided with one or more electronic components. One of the first circuit member 40 and the second circuit member 50 may be a single electronic component. Each of the first substrate 42 and the second substrate 52 may be a rigid circuit board. As long as each of the first conductor pattern 44 and the second conductor pattern 54 is formed from a conductor, the method of forming each of the first conductor pattern 44 and the second conductor pattern 54 is not particularly limited.

[0044] The first conductor pattern 44 of this embodiment has a first contact 48. The second conductor pattern 54 of this embodiment has a second contact 58 and a connecting electrode 59. That is, the first circuit member 40 is equipped with a first contact 48, and the second circuit member 50 is equipped with a second contact 58 and a connecting electrode 59. Referring to Figures 2 and 5, in the assembled device 10, the first contact 48 and the second contact 58 are in contact with each other. Referring to Figure 5, in the assembled device 10, the connecting electrode 59 and the conductive portion 266 are in contact with each other. That is, the first conductor pattern 44 and the second conductor pattern 54 are electrically connected to each other and can be electrically connected to the outside of the device 10 via the conductive portion 266.

[0045] The first conductor pattern 44 and the second conductor pattern 54 shown in Figure 6 are abstract conductor patterns for the purpose of simply explaining the present invention and do not have any specific function. That is, even if the illustrated first contact 48 and the second contact 58 are in contact with each other, the device 10 does not function as an electronic device. On the other hand, the actual first conductor pattern 44 and the second conductor pattern 54 have, for example, an electronic circuit (not shown) that can measure the electrocardiogram of a subject. Referring to Figure 1, this electronic circuit can acquire biosignals resulting from the subject's electrocardiogram from the conductive part 266.

[0046] Referring to Figure 2, according to this embodiment, the number of first contacts 48 and second contacts 58 is 1 each. Also, the number of connecting electrodes 59 and conductive portions 266 is 1 each. However, the present invention is not limited thereto. For example, the number of first contacts 48 and second contacts 58 may be 2 or more. Also, the number of connecting electrodes 59 and conductive portions 266 may be 2 or more each. In the assembled device 10, the first contacts 48 only need to be in contact with the second contacts 58, and the connecting electrodes 59 only need to be in contact with the conductive portions 266.

[0047] The device 10 of this embodiment will be described in more detail below.

[0048] Referring to Figures 1 and 2, the first film 22 of this embodiment has a first inner portion 222 and a first outer portion 224. The first outer portion 224 of this embodiment has a first sealing portion 226 and a first contact portion 228. The first inner portion 222 is located inside the first outer portion 224 in the XY plane. In other words, the first outer portion 224 is the portion of the first film 22 that surrounds the first inner portion 222.

[0049] Referring to Figure 2, the second film 32 of this embodiment has a second inner portion 322 and a second outer portion 324. The second outer portion 324 of this embodiment has a second sealing portion 326 and a second contact portion 328. The second inner portion 322 is located inside the second outer portion 324 in the XY plane. In other words, the second outer portion 324 is the part of the second film 32 that surrounds the second inner portion 322.

[0050] Referring to Figures 1 and 2, the first inner portion 222 of the first film 22 and the second inner portion 322 of the second film 32 are the parts that house the circuit structure 12 in the device 10 and are separated from each other. On the other hand, the first seal portion 226 and the second seal portion 326 in this embodiment are connected to each other to form a seal mark 16. According to this embodiment, the first seal portion 226 and the second seal portion 326 are connected to each other by thermal sealing. That is, the seal mark 16 in this embodiment is the mark left when the first seal portion 226 and the second seal portion 326 are welded to each other by heating. However, the present invention is not limited thereto, and the first seal portion 226 and the second seal portion 326 can be connected by various methods such as high frequency, ultrasonic, laser, and adhesive.

[0051] In this embodiment, the seal mark 16 is formed around the entire circumference of the first seal portion 226 and the second seal portion 326. The seal mark 16 surrounds the first contact portion 228 and the second contact portion 328 around their entire circumference in the XY plane. However, the present invention is not limited thereto, and the seal mark 16 may be formed in the necessary locations depending on the manufacturing method of the device 10. For example, the seal mark 16 may be formed partially or not formed at all.

[0052] Referring to Figure 5, as will be described later, after connecting the first seal portion 226 and the second seal portion 326 to each other, the inside of the device 10 is evacuated. According to this embodiment, during evacuation, the first contact portion 228 and the second contact portion 328 come into contact with each other in the contact area 17 due to the pressure difference. As a result, a sealed space 18 is formed in the device 10. The sealed space 18 is surrounded by the first inner portion 222 and the second inner portion 322. In this embodiment, the contact area 17 seamlessly surrounds the first inner portion 222 and the second inner portion 322 around the entire circumference in the XY plane. However, the present invention is not limited thereto, and the contact area 17 may be formed in the necessary locations depending on the manufacturing method of the device 10. For example, the contact area 17 may be partially formed or not formed at all.

[0053] As described above, the sealed space 18 is surrounded by the first sealing member 20 and the second sealing member 30, and is isolated from the outside of the device 10. According to this embodiment, the first seal portion 226 and the second seal portion 326 are firmly connected to each other. In addition, the contact area 17 is located inside the seal trace 16 in the XY plane, blocking the airflow between the inside and outside of the sealed space 18. That is, the air pressure inside the sealed space 18 is maintained at a low pressure, lower than atmospheric pressure.

[0054] The first circuit member 40 and the second circuit member 50 are sealed inside the sealed space 18, which is maintained at the low pressure described above. The first contact 48 and the second contact 58 are pressed against each other and in contact inside the sealed space 18. More specifically, a contact force is generated between the first contact 48 and the second contact 58 due to the pressure difference between the inside and outside of the sealed space 18. The first contact 48 and the second contact 58 are pressed against each other due to this pressure difference, thereby ensuring that contact between the first contact 48 and the second contact 58 is reliably maintained.

[0055] To summarize the above description, in the device 10 of this embodiment, the first sealing member 20 and the second sealing member 30 are stacked so as to be in contact with each other, with the first circuit member 40 and the second circuit member 50 (hereinafter simply referred to as "circuit member") in between. Each of the first sealing member 20 and the second sealing member 30 in this embodiment is formed on a film base.

[0056] Furthermore, each circuit member has no structural constraints except that it is equipped with a contact (first contact 48 or second contact 58) and a connecting electrode 59. In other words, the circuit members of this embodiment have a simple structure and can be formed from various materials. For example, the circuit member may be an insulating film on which a conductor pattern (first conductor pattern 44 or second conductor pattern 54) having a contact and a connecting electrode 59 is formed. In this case, the overall thickness of the device 10 can be made extremely thin. In other words, according to this embodiment, a new device 10 that can be made thinner can be provided.

[0057] According to this embodiment, the airtightness of the sealed space 18 can be reliably maintained by the connection between the first seal portion 226 and the second seal portion 326, and by the contact between the first contact portion 228 and the second contact portion 328. However, the present invention is not limited to this embodiment. For example, the first seal portion 226 and the second seal portion 326 may partially surround the first contact portion 228 and the second contact portion 328 in the XY plane. Also, the first seal portion 226 and the second seal portion 326 may partially surround the first inner portion 222 and the second inner portion 322 in the XY plane.

[0058] According to this embodiment, the first circuit member 40 and the second circuit member 50 can be easily removed from the sealed space 18 by cutting off the first seal portion 226 and the second seal portion 326. In other words, according to this embodiment, the members can be easily separated, recovered, and reused.

[0059] According to this embodiment, the conductive portion 266 is in contact with the connecting electrode 59 inside the sealed space 18 and is partially exposed to the outside of the device 10. Specifically, the outer surface 232 of the first film 22 is located outside the sealed space 18. The fixed portion 262 of the sub-member 26 is fixed to the outer surface 232 arranged in this manner. The conductive portion 266 and the connecting electrode 59 are pressed against each other due to the pressure difference between the inside and outside of the sealed space 18, thereby ensuring that contact between the conductive portion 266 and the connecting electrode 59 is reliably maintained.

[0060] If such conductive portion 266 is not provided, the electronic circuits (not shown) formed on the first conductor pattern 44 and the second conductor pattern 54 would need to acquire the subject's biological signals without contacting the subject (i.e., in a non-contact manner). However, accurately acquiring weak biological signals in a non-contact manner is difficult. On the other hand, according to this embodiment, biological signals can be reliably acquired by bringing the conductive portion 266 into contact with the subject's skin.

[0061] Preferably, the first sealing member 20 and the second sealing member 30 each have high oxygen barrier properties. More specifically, it is preferable that the first film 22 and the second film 32 (or a rigid circuit board) each have a layer made of a material with high oxygen barrier properties (high oxygen barrier material). This layer structure can reduce oxidation of the metal components of the circuit structure 12.

[0062] For example, the high oxygen barrier material may be linear low-density polyethylene (LLDPE). More specifically, the high oxygen barrier material may be PET / Al / PE, which is a laminate of polyethylene terephthalate, aluminum, and polyethylene; ON / PE, which is a laminate of biaxially oriented nylon and polyethylene; PET / EVOH / PE, which is a laminate of polyethylene terephthalate, polyvinyl chloride, and polyethylene; or it may be formed by laminating a transparent high-barrier film with polyethylene. The transparent high-barrier film may be SiOx-deposited PET (polyethylene terephthalate) or aluminum oxide-deposited PET (polyethylene terephthalate).

[0063] In this embodiment, it is preferable that the first sealing member 20 and the second sealing member 30 each have high water vapor barrier properties in addition to high oxygen barrier properties. More specifically, it is preferable that the first film 22 and the second film 32 (or a rigid circuit board) each have a layer made of a material having high water vapor barrier properties (high water vapor barrier material). This layer structure allows the circuit structure 12 to be waterproofed. For example, the high water vapor barrier material may be a material obtained by coating a sheet of ON / PE, OPP (biaxially oriented polypropylene), PET, etc. with PVDC (polyvinylidene chloride).

[0064] Each of the first sealing member 20 and the second sealing member 30 may have various barrier properties, such as nitrogen barrier properties, in addition to high oxygen barrier properties and high water vapor barrier properties. That is, it is preferable that each of the first sealing member 20 and the second sealing member 30 has high barrier properties according to the application.

[0065] The device 10 of this embodiment (see Figure 1) is manufactured through four steps: a preparation step, a placement step, a sealing step, and a vacuuming step. However, the present invention is not limited thereto, and the manufacturing method of the device 10 can be modified as needed. An example of the manufacturing method of the device 10 of this embodiment will be described below.

[0066] Referring to Figure 8, first, in the preparation step, the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50 are prepared.

[0067] Next, in the arrangement step, the first sealing member 20, the first circuit member 40, the second circuit member 50, and the second sealing member 30 are stacked on top of each other in this order from top to bottom along the Z direction. At this time, the first circuit member 40 and the second circuit member 50 are arranged so that the first contact 48 and the second contact 58 face each other in the Z direction. Also, the conductive portion 266 and the connecting electrode 59 face each other in the Z direction. The additional film 38 is positioned in the middle of the second film 32 in the XY plane. The first circuit member 40 and the second circuit member 50 are positioned in the middle of the additional film 38 in the XY plane. Also, the first film 22 and the second film 32 are arranged so that the two molten layers 146 (see Figure 6) face each other in the Z direction.

[0068] Next, in the sealing process, the first film 22 and the second film 32 are subjected to heat sealing. Specifically, the portions of the two molten layers 146 located on the outer periphery of the first film 22 and the second film 32 in the XY plane are welded to each other by heat sealing. Referring to Figure 9, as a result of heat sealing, a device 10 having a seal mark 16 is formed. The internal space of the device 10 is surrounded by the first sealing member 20 and the second sealing member 30, and is isolated from the outside of the device 10 except for the air valve 28.

[0069] Next, in the vacuuming process, the inside of the device 10 is vacuumed. According to this embodiment, the air inside the device 10 is removed using the instrument 80 and the air valve 28. The instrument 80 in this embodiment is a syringe-type piston pump. The instrument 80 comprises a syringe 82 and a plunger 84. The lower end of the syringe 82 has an annular shape in the XY plane that corresponds to the outer circumference of the shielding portion 282 of the air valve 28.

[0070] In the vacuuming process, first, the lower end of the syringe 82 is pressed against the upper surface of the shielding portion 282. Next, the plunger 84 is pulled upward. At this time, the air valve 28 opens, and an air passage is formed between the inside of the device 10 and the inside of the syringe 82. The air inside the device 10 is drawn into the syringe 82 through the passage hole 288 and notch 285 (see Figure 7) of the air valve 28. As a result, the air pressure inside the device 10 gradually decreases. When the air pressure inside the device 10 becomes a low pressure close to a vacuum, the vacuuming by the instrument 80 is stopped.

[0071] Referring to Figure 5 in conjunction with Figure 9, when the vacuum is stopped, the valve 284 (see Figure 7) of the air valve 28 closes the notch 285 (see Figure 7) due to the pressure difference between the air pressure inside the device 10 and the atmospheric pressure, and the air valve 28 becomes closed. As a result, the air pressure inside the device 10 is maintained at a low pressure. That is, a sealed space 18 with low pressure, isolated from the outside, is formed in the device 10. The first contact 48 and the second contact 58 are pressed against each other and come into contact due to the pressure difference between the inside and outside of the sealed space 18. Similarly, the conductive part 266 and the connecting electrode 59 are pressed against each other and come into contact due to the pressure difference between the inside and outside of the sealed space 18.

[0072] During vacuuming, the first film 22 and the second film 32 easily adhere to each other, forming an adhering portion such as the contact area 17. If the additional film 38 is not provided, the adhering portion between the first film 22 and the second film 32 is also likely to form inside the sealed space 18. That is, the air passage between the air valve 28 and the contact area such as the first contact 48 may be blocked by the adhering portion. In this case, the air pressure in the space where the first contact 48 and the second contact 58 are located may not decrease sufficiently, and the first contact 48 and the second contact 58 may not make reliable contact. Similarly, the connecting electrode 59 and the conductive portion 266 may not make reliable contact.

[0073] On the other hand, since the additional film 38 in this embodiment is located between the first film 22 and the second film 32, it prevents direct contact between the first film 22 and the second film 32. Furthermore, since the additional film 38 has an uneven portion 382, ​​even if the first film 22 and the second film 32 come into indirect contact via the additional film 38, the air passage through the air valve 28 is maintained. As a result, the first contact 48 and the second contact 58 make reliable contact with each other. Similarly, the conductive portion 266 and the connecting electrode 59 make reliable contact with each other.

[0074] In this embodiment, the additional film 38 is an embossed film separate from the second film 32 and is placed on top of the second film 32. The uneven portion 382 is formed over the entire upper and lower surfaces of the additional film 38. However, the present invention is not limited thereto. For example, the additional film 38 may be adhered to and fixed to the upper surface of the second film 32. The uneven portion 382 only needs to be formed on the upper surface of the additional film 38. Alternatively, the second film 32 may be embossed to form the uneven portion 382 on the second film 32. In this case, the additional film 38 does not need to be provided. That is, the second sealing member 30 may consist only of the second film 32 having the uneven portion 382.

[0075] In this embodiment, the additional film 38, together with the second film 32, forms the second sealing member 30. However, the present invention is not limited thereto. For example, the additional film 38, together with the first film 22, may form the first sealing member 20. More specifically, the additional film 38 may be placed beneath the first film 22. Alternatively, the first film 22 may be embossed to form a recessed portion 382 on the first film 22. In this case, the additional film 38 does not need to be provided.

[0076] According to the manufacturing method of this embodiment, the first contact 48 and the second contact 58 make reliable contact with each other without the use of fixing members such as adhesives. Similarly, the conductive portion 266 and the connecting electrode 59 make reliable contact with each other without the use of fixing members such as adhesives. Therefore, when the device 10 is no longer needed, it can be disassembled simply by cutting off the first outer portion 224 and the second outer portion 324. In addition, the first circuit member 40 and the second circuit member 50 can be sealed inside the low-pressure sealed space 18, thereby reducing deterioration of metal members due to oxidation, etc.

[0077] Referring to Figure 9, according to the manufacturing method of this embodiment, vacuuming can be easily performed using a simple device 80. Vacuuming with the device 80 can be performed repeatedly. For example, even if the air pressure in the sealed space 18 rises when the device 10 is in use, vacuuming can be performed again using the device 80. As a result, the contact force between the first contact 48 and the second contact 58 can be maintained when the device 10 is in use, and the contact force between the conductive portion 266 and the connecting electrode 59 can be maintained. However, the present invention is not limited thereto, and the manufacturing method of the device 10 can be modified as needed.

[0078] For example, the structure of the apparatus 80 is not particularly limited as long as it can create a vacuum. Alternatively, instead of using the illustrated apparatus 80, a nozzle may be inserted into the device 10 and the vacuum may be created by the nozzle. In this case, it is not necessary to provide an air valve 28. Alternatively, sealing and vacuuming may be performed using a commercially available tabletop vacuum packaging machine (not shown). Furthermore, referring to Figure 8, the components of the device 10 may be placed in a vacuum chamber (not shown) and vacuumed while heat sealing is performed. In this case, it is not necessary to provide an additional film 38. Also, it is not necessary to provide uneven surfaces 382 on other components. However, from the viewpoint of easily manufacturing the device 10, it is preferable to use a commercially available simple apparatus such as the apparatus 80 (see Figure 9).

[0079] In the manufacturing method of this embodiment, the auxiliary member 26 is fixed to the first film 22 during the preparation step. However, the present invention is not limited thereto. For example, the auxiliary member 26 may be fixed to the first film 22 by heat welding after the vacuuming step is completed. However, the manufacturing method of this embodiment is preferred from the viewpoint of reliably vacuuming the inside of the device 10.

[0080] In addition to the modifications already described, this embodiment can be further modified in various ways, as described below.

[0081] Comparing Figure 10 with Figure 5, the device 10A according to the first modification has the same second sealing member 30 as device 10. On the other hand, device 10A has a first sealing member 20A, a first circuit member 40A, and a second circuit member 50A that are different from the first sealing member 20, first circuit member 40, and second circuit member 50 of device 10.

[0082] The first sealing member 20A includes a first film 22A similar to the first film 22, and also includes the same sub-member 26 and air valve 28 as the first sealing member 20. The first film 22A has a main opening 244A similar to the main opening 244. However, the main opening 244A is located above the first circuit member 40A.

[0083] The second circuit member 50A has the same structure as the second circuit member 50, except that it does not have a connecting electrode 59. On the other hand, the first circuit member 40A has a connecting electrode 49A. Specifically, the first circuit member 40A comprises a first base body 42A and a first conductor pattern 44A. The first base body 42A has via holes that penetrate vertically through it. The connecting electrode 49A is formed on the upper surface of the first base body 42A and is connected to the first conductor pattern 44A on the lower surface via the via holes. The sub-member 26 is fixed to the outer surface 232 of the first film 22A so as to block the main opening 244A. The conductive portion 266 of the sub-member 26 is in contact with the connecting electrode 49A of the first conductor pattern 44A instead of the connecting electrode 59 of the second conductor pattern 54.

[0084] Aside from the differences mentioned above, device 10A has a similar structure to device 10 and functions in the same way as device 10. In other words, this modification also provides the same effects as the embodiment described above.

[0085] As can be understood from the above explanation, the first circuit member 40A may be provided with a connecting electrode 49A, and the second circuit member 50 may be provided with a connecting electrode 59. Alternatively, the first circuit member 40A may be provided with a connecting electrode 49A, and the second circuit member 50 may be provided with a connecting electrode 59. In other words, it is sufficient that at least one of the first circuit member and the second circuit member is provided with a connecting electrode.

[0086] Comparing Figure 11 with Figure 5, the device 10B according to the second modification comprises the same second sealing member 30, first circuit member 40, and second circuit member 50 as device 10. On the other hand, device 10B comprises a first sealing member 20B that is different from the first sealing member 20 of device 10. The first sealing member 20B comprises the same first film 22, sub-member 26, and air valve 28 as the first sealing member 20. However, the inner surface 234 of the first film 22 is located inside the sealed space 18. The fixed portion 262 of the sub-member 26 is fixed to the inner surface 234, which is arranged in this manner, by a fixing member such as an adhesive.

[0087] Except for the differences described above, device 10B has a similar structure to device 10 and functions similarly to device 10. For example, referring to Figures 11 to 13, the fixed portion 262 located around the sub-opening 264 is fixed to the first film 22 around the entire circumference of the main opening 244. The conductive portion 266 is in contact with the connecting electrode 59 inside the sealed space 18 and is partially exposed to the outside of device 10. The conductive portion 266 and the connecting electrode 59 are pressed against each other due to the pressure difference between the inside and outside of the sealed space 18, thereby ensuring that contact between the conductive portion 266 and the connecting electrode 59 is maintained. In other words, this modified version also provides the same effects as the embodiment described above and the first modified version.

[0088] In this modified example, the portion to be fixed 262 may comprise a molten layer (not shown) and a non-molten layer (not shown). The molten layer of the portion to be fixed 262 may be located on the upper layer of the portion to be fixed 262. In this case, the portion to be fixed 262 may be heat-welded to the molten layer 146 (see Figure 6) of the first film 22.

[0089] Comparing Figures 14 and 15 with Figures 1 and 5, the device 10C according to the third modification comprises the same second sealing member 30, first circuit member 40, and second circuit member 50 as device 10. On the other hand, device 10C comprises a first sealing member 20C that is different from the first sealing member 20 of device 10. The first sealing member 20C comprises the same first film 22 and air valve 28 as the first sealing member 20. On the other hand, the first sealing member 20C does not have a sub-member 26. The first sealing member 20C has a conductive portion 246C instead of the conductive portion 266 of the sub-member 26.

[0090] The conductive portion 246C, like the conductive portion 266, is made of a conductor such as metal and is formed in the same manner as the conductive portion 266. The conductive portion 246C blocks the main opening 244 of the first film 22. The conductive portion 246C extends across the entire main opening 244 in the XY plane and completely blocks the main opening 244. In other words, the conductive portion 246C blocks the flow of air through the main opening 244.

[0091] Except for the differences mentioned above, device 10C has a similar structure to device 10 and functions similarly to device 10. For example, referring to Figure 15, the conductive portion 246C is in contact with the connecting electrode 59 inside the sealed space 18 and is partially exposed to the outside of device 10. The conductive portion 246C and the connecting electrode 59 are pressed against each other due to the pressure difference between the inside and outside of the sealed space 18, thereby ensuring that contact between the conductive portion 246C and the connecting electrode 59 is maintained. In other words, this modified version also provides the same effects as the embodiments, the first modified version and the second modified version described above.

[0092] This embodiment can be modified in various ways in addition to the modifications already described.

[0093] For example, referring to Figure 6, the periphery 229 of the first film 22 and the periphery 329 of the second film 32 may be connected to each other at the rear end (-X side end) in the front-to-back direction (X direction). In other words, each of the first film 22 and the second film 32 may be part of a single folded planar sheet. Alternatively, the periphery 229 of the first film 22 and the periphery 329 of the second film 32 may be connected to each other except at the rear end. In other words, each of the first film 22 and the second film 32 may be part of a single bag-shaped sheet.

[0094] A retractable zipper may be provided at the rear end of the bag-shaped sheet described above. In this case, after closing the zipper and creating a vacuum, the first film 22 and the second film 32 may be heat-sealed at the portion located in front of the air valve 28 (+X side). After heat sealing, the portion where the air valve 28 is provided may be cut off.

[0095] The first circuit member 40 may be an integral part of the first sealing member 20, and the second circuit member 50 may be an integral part of the second sealing member 30. For example, the first base body 42 may be bonded and fixed to the lower surface of the first film 22, and the first conductor pattern 44 may be formed on the lower surface of the first film 22. The second circuit member 50 may also be provided on the additional film 38. For example, the second base body 52 may be bonded and fixed to the upper surface of the additional film 38, and the second conductor pattern 54 may be formed on the upper surface of the additional film 38. Furthermore, if the second sealing member 30 does not include the additional film 38, the second base body 52 may be bonded and fixed to the upper surface of the second film 32, and the second conductor pattern 54 may be formed on the upper surface of the second film 32.

[0096] Referring to Figure 16 in conjunction with Figures 9 to 11, as mentioned above, the method for forming the conductive portion 266 of the sub-member 26 is not particularly limited. For example, the sub-member 26 may be a conductive gel 26D (see device 10D in Figure 16). In other words, the first sealing members 20, 20A, and 20B may be equipped with a conductive gel 26D instead of the sub-member 26. The conductive gel 26D is conductive, flexible, and adhesive, making it suitable for direct application to the human body. Furthermore, when using the conductive gel 26D, it is not necessary to form a sub-opening 264. The portion of the conductive gel 26D that covers the main openings 244 and 244A functions as the conductive portion 266, and the portion of the conductive gel 26D that is fixed to the first films 22 and 22A functions as the fixed portion 262. That is, the conductive gel 26D, like the sub-member 26, is equipped with a fixed portion 262 and a conductive portion 266, and functions in the same way as the sub-member 26. [Explanation of symbols]

[0097] 10, 10A, 10B, 10C, 10D devices 12 Circuit structure 14 Sealing member 146 Molten layer 148 Non-melted layer 16. Sticker residue 17 Contact area 18 Sealed space 20,20A,20B,20C 1st sealing member 22,22A First film 222 1st inner part 224 First outer part 226 First seal section 228 1st contact part 229 Periphery 232 External surface 234 Inner surface 244,244A Main opening 246C Continuity part 248 Valve opening 26 Sub-members 26D conductive gel 262 Fixed part 264 Auxiliary opening 266 Conductive section 28 Air valve 282 Shielding part 284 valves 285 Notches 286 base 288 Passing hole 30 Second sealing member 32 Film No. 2 322 Second inner part 324 Second outer part 326 Second seal section 328 2nd contact part 329 Periphery 38 Additional film 382 Uneven part 384 Protrusion 40,40A First circuit component 42,42A 1st base 44,44A First conductor pattern 48 First contact point 49A Connecting electrode 50, 50A Second circuit component 52 Second Substrate 54 Second Conductor Pattern 58 Second contact point 59 Connecting electrodes 80 devices 82 syringes 84 Plungers

Claims

1. A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, the first sealing member includes a first film as a base and a conductive portion made of a conductor; The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed inside the sealed space, the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are pressed against each other and in contact with each other inside the sealed space, At least one of the first circuit member and the second circuit member includes a connection electrode; The conductive portion is in contact with the connection electrode inside the sealed space and is partially exposed to the outside of the device. device.

2. 10. The device of claim 1, The first film has a main opening formed therein, the main opening extends through the first film; The conductive portion closes the main opening. device.

3. 10. The device of claim 1, the first sealing member includes a sub-member in addition to the first film, The first film has a main opening formed therein, the main opening extends through the first film; the sub-member includes a fixed portion and the conductive portion, The secondary member has a secondary opening formed therein, the secondary opening penetrates the fixed portion, the conductive portion closes the sub-opening, The fixed portion located around the sub-opening is fixed to the first film over the entire periphery. device.

4. 4. The device of claim 3, the first film has an outer surface; The outer surface is located outside the sealed space, The fixed portion of the secondary member is fixed to the outer surface. device.

5. 4. The device of claim 3, the first film has an inner surface; The inner surface is located inside the sealed space, The fixed portion of the secondary member is fixed to the inner surface. device.

6. A device according to any one of claims 3 to 5, The fixed portion of the sub-member is made of a film. device.

7. A device according to any one of claims 1 to 6, The second sealing member has a second film as a base. device.

8. A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, the first sealing member includes a first film as a base and a conductive gel; The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed inside the sealed space, the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are pressed against each other and in contact with each other inside the sealed space, At least one of the first circuit member and the second circuit member includes a connection electrode; The conductive gel has a conductive portion, The conductive portion is in contact with the connection electrode inside the sealed space and is partially exposed to the outside of the device. device.

Images