Supply device and film forming device

Abstract

To provide a supply device which is suppressed from supplying a prescribed amount or more of electronic components so as to improve productivity, and a film forming device.SOLUTION: A supply device 2 according to an embodiment comprises: a chute 220 having a plurality of chute holes 222 through which electronic components C having one end and the other end can be passed one by one; a mask 240, overlapped with the chute 220, which has mask holes 242 into which the electronic components C are inserted through the chute holes 222 and which cover portions of the electronic components C; a cradle 250 on which the mask 240 is held and which the one end of the electronic component C inserted into the mask hole 242 contacts; a moving mechanism 270 that relatively moves the chute 220 and the mask 240 so that an axis Axs of the chute hole 222 and an axis Axm of the mask hole 242 are deviated, in a state where the other end of the electronic component C inserted into the mask hole 242 does not interfere with the chute 220; and a removing mechanism 280 that removes the electronic component C other than the electronic component C inserted into the mask hole 242 from the chute 220, in a state where the axis Axs of the chute hole 222 and the axis Axm of the mask hole 242 are deviated.SELECTED DRAWING: Figure 12

Description

[Technical Field]

[0001] The present invention relates to a supply device and a film forming device. [Background technology]

[0002] Currently, chip-type electronic components with external electrodes formed on both ends are widely used in various electronic circuits. For example, chip capacitors are formed by dividing a block of laminated dielectric sheets with internal electrodes into individual rectangular parallelepiped pieces. External electrodes are formed from a conductive material that covers both side surfaces of the rectangular parallelepiped element and is connected to the internal electrodes.

[0003] As shown in Patent Document 1, a method of forming external electrodes involves holding an electronic component by inserting one end of the electronic component into a holding hole in a holding plate so that the other end is exposed, and then applying a conductive paste to the exposed end to form an external electrode. In this case, the electronic components are supplied onto an alignment plate and inserted one by one into a plurality of alignment holes formed in the alignment plate, and while their position is changed by the alignment holes, they are guided and dropped into the holding holes in the holding plate and inserted into the holding holes.

[0004] In this case, the electronic components supplied to the alignment plate are not always dropped into the holding holes. Therefore, in order to increase the probability that the electronic components supplied to the alignment plate will be dropped into the holding holes through the alignment holes, a number of electronic components greater than the number of holding holes is placed on the alignment plate. For example, a large number of electronic components stored in a chip hopper are taken out and supplied onto the alignment plate in a number greater than the number of holding holes. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 09-232113 Summary of the Invention [Problem to be solved by the invention]

[0006] However, if more than the predetermined amount of electronic components are fed into the alignment plate, i.e., if the number of electronic components fed exceeds the number of holding holes, some electronic components that did not fit into the holding holes (electronic components not held by the holding plate) remain on the alignment plate. In particular, electronic components that fit into the alignment holes may be placed directly above electronic components already in the holding holes. When the alignment plate is then detached from the holding plate, the electronic components remaining in the alignment holes, and even the electronic components remaining on the alignment plate, may fall through the alignment holes and land on the holding plate or on electronic components properly held on the holding plate, interfering with the subsequent process of applying conductive material. Therefore, if a larger number of electronic components than the number of holding holes is fed, a process of recovering the electronic components that did not fit into the holding holes is required. However, if the electronic components that did not fit into the holding holes are recovered using a recovery means such as a suction means, the electronic components that fit into the holding holes may also be recovered, requiring a process of resupplying them, which may reduce productivity. To prevent this, the electronic components that did not fit into the holding holes may be recovered one by one by hand, which requires a long recovery time and reduces productivity. Furthermore, since the electronic components being supplied are small chip-like components used in various electronic circuits, if any electronic components that do not fit into the holding holes fall from the holding plate to the bottom of the supply device, they will be difficult to find and retrieve. In this way, if the number of electronic components supplied exceeds the number of holding holes, it will be difficult to retrieve the electronic components that do not fit into the holding holes, and productivity will decrease.

[0007] The present invention has been proposed to solve the problems of the prior art as described above, and its object is to provide a supply device and a film forming device that suppress the supply of electronic components in an amount greater than a predetermined amount, thereby improving productivity. [Means for solving the problem]

[0008] In order to achieve the above object, the supply device of the embodiment includes a chute having a plurality of chute holes through which electronic components having one end and the other end can pass one by one; a mask on which the chutes are stacked and into which the electronic components are inserted through the chute holes, the mask having mask holes that cover part of the electronic components; a receiving stand that holds the mask and to which one end of the electronic component inserted into the mask hole contacts; a moving mechanism that moves the chute and the mask relative to each other so that the axis of the chute hole and the axis of the mask hole are misaligned while the other end of the electronic component inserted into the mask hole does not interfere with the chute; and a removal mechanism that removes the electronic components other than the electronic component inserted into the mask hole from the chute while the axis of the chute hole and the axis of the mask hole are misaligned.

[0009] Moreover, a film forming apparatus according to an embodiment includes the supply device and a film forming processing unit that forms a film on the electronic component. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a supply device and a film forming apparatus that can suppress the supply of electronic components in an amount exceeding a predetermined amount and improve productivity. [Brief explanation of the drawings]

[0011] [Figure 1] 1A is a perspective view of an electronic component to be supplied in an embodiment, FIG. 1B is a cross-sectional view thereof, and FIG. 1C is a perspective view showing the state in which the electronic component is inserted into a mask hole. [Figure 2] 1 is a simplified configuration diagram showing a film forming apparatus according to an embodiment; [Figure 3] 1A is a plan view showing a supply device according to an embodiment, and FIG. 1B is a partially cross-sectional side view showing the supply device according to an embodiment. [Figure 4] 4A is a partially sectional side view showing the electronic component of FIG. 3 when it is accommodated, and FIG. 4B is a partially sectional side view showing the electronic component of FIG. 3 when it is supplied. [Figure 5] FIG. 1A is a plan view showing the chute, and FIG. 1B is a cross-sectional view taken along the line AA. [Figure 6] 1A is a plan view showing a mask, and FIG. 1B is a cross-sectional view taken along the line BB. [Figure 7]1A is a plan view showing the receiving base, and FIG. 1B is a cross-sectional view taken along the line CC. [Figure 8] 1A is a cross-sectional view showing a standby state of the mask, and FIG. 1B is a cross-sectional view showing a state in which the mask is attached to the chute. [Figure 9] 1A is a cross-sectional view showing a state in which the suction part is positioned on the mask, and FIG. 1B is a cross-sectional view showing a state in which the electronic component has been dropped. [Figure 10] 1A is a cross-sectional view showing a state in which the mask is separated from the chute, and FIG. 1B is a cross-sectional view showing a state in which the chute is shifted horizontally. [Figure 11] 10A is a cross-sectional view showing a state in which an excess electronic component has been sucked up, and FIG. 10B is a cross-sectional view showing a state in which the pusher has been lowered and the receiving base 250 has been held in the holding hole. [Figure 12] 10A to 10C are explanatory diagrams showing a procedure for supplying electronic components to a mask. [Figure 13] FIG. 10 is an explanatory diagram showing a procedure for inverting a mask. [Figure 14] 10 is an explanatory diagram showing a modified example in which the gap adjusting section is a lifting member. FIG. [Figure 15] 10 is an explanatory diagram showing a modified example in which a spacer is used as the interval adjusting portion. FIG. [Figure 16] FIG. 10 is an explanatory diagram showing a modified example in which a gap adjusting unit is not used. DETAILED DESCRIPTION OF THE INVENTION

[0012] An embodiment of the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings.

[0013] [Electronic Components] As shown in FIG. 1A, the electronic component C formed according to this embodiment is a chip-shaped electronic component C having electrodes E made of a conductive material formed on both ends. In this way, the electronic component C has one end and the other end on which the electrodes E are formed. For example, elements such as capacitors, resistors, coils, and inductors are included in the electronic component C. The electronic component C has a rectangular parallelepiped, cubic, or thin-plate shape, and the electrodes E are formed in close contact with each other so as to cover an area including a pair of opposing side surfaces in a box-like shape. The area where the electrodes E are formed is referred to as the electrode formation area R.

[0014] FIG. 1B is a cross-sectional view of a multilayer ceramic capacitor formed by laminating dielectric sheets on which internal electrodes En are formed, where the electronic component C is a multilayer ceramic capacitor. A pair of electrodes E formed on the outer surface of the electronic component C has a multilayer structure in which multiple layers of conductive material are stacked, and are electrically connected to the internal electrodes En of the electronic component C. In this embodiment, a copper (Cu) seed layer for the electrodes E is formed on a titanium (Ti) base layer for improving adhesion. Then, using the seed layer as a seed, copper (Cu) is deposited on the electrode formation region R by electroplating, thereby completing the electronic component C on which the electrodes E are formed. Because the base layer and seed layer also become part of the electrodes E, the formation of these layers will hereinafter be referred to as "forming the electrodes E" in the description of this embodiment.

[0015] In the following description, the line passing through the centers of the pair of side surfaces covered by the electrode E is referred to as the axis Axc of the electronic component C. In this embodiment, for example, the electronic component C may be an extremely small one having a length in the direction of the axis Axc of 0.6 mm, a length of the electrode E in the direction of the axis Axc of 0.2 mm, and a rectangular cross section of the electrode E perpendicular to the axis Axc of the electrode E measuring 0.3 mm × 0.3 mm. However, the present invention is applicable to both smaller and larger electronic components C.

[0016] [overview] As shown in FIG. 2, the film forming apparatus 1 of this embodiment includes a supply device 2, a film forming processing unit 3, and a control device 4. As shown in FIG. 1(C), the supply device 2 inserts an electronic component C into a mask hole 242, thereby supplying the electronic component C to the film forming processing unit 3 in a state in which the area other than one electrode formation area R is masked. The film forming processing unit 3 forms a film of electrode material in the unmasked, exposed electrode formation area R. In the following description, the horizontal alignment direction of the supply device 2 and the film forming processing unit 3 is defined as the X direction, the horizontal direction perpendicular to this is defined as the Y direction, and the vertical direction is defined as the Z direction. The electronic component C is inserted into the mask hole 242 so that the axis Axc is along the Z direction. As will be described later, the mask hole 242 is provided in the mask 240.

[0017] [Feeding device] As shown in Figures 3(A), (B), 4(A), and (B), the supply device 2 has a storage section 210, a chute 220, a vibration mechanism 230, a mask 240, a receiving table 250, a spacing adjustment section 260, a moving mechanism 270, a removal mechanism 280, and a conveying mechanism 290.

[0018] (Storage section) The accommodation unit 210 accommodates a plurality of electronic components C before the electrodes E are formed, i.e., before film formation. The accommodation unit 210 includes a container 211 and a support stand 212. The container 211 is a box-shaped body with an open top, and has a horizontal inner bottom with a plurality of recessed compartments 211a. The compartments 211a are arranged in a matrix, and each compartment 211a accommodates a plurality of electronic components C that have been previously placed. A portion of the inner surface of the container 211 is an inclined surface 211b that slopes toward the inner bottom, so that electronic components C placed from the upper edge of the container 211 slide down toward the inner bottom. The support stand 212 is a stand that supports the container 211 in a horizontal direction, and is installed on the installation surface of the supply device 2 by four legs 212a, as shown in FIG. 3(B).

[0019] (Shoot) The chute 220 guides the electronic components C transferred from the storage section 210 to each of the mask holes 242. As shown in FIGS. 5(A) and 5(B), the chute 220 has a plate 221, chute holes 222, and partition walls 223. The plate 221 is a rectangular plate. The chute holes 222 are multiple holes through which the electronic components C can pass one by one. Each chute hole 222 penetrates the surface of the plate 221 in a direction perpendicular to the surface and guides the passing electronic components C to the mask holes 242. The chute holes 222 have a rectangular trapezoidal shape that widens toward the side where the electronic components C are inserted, i.e., the upper end, to make it easier for the electronic components C to enter. Note that a straight line in the Z direction that passes through the center of the chute hole 222 is defined as an axis Axs.

[0020] Partition walls 223 are erected in a grid pattern on the surface of plate body 221. A plurality of rectangular areas surrounded by partition walls 223 form a plurality of compartments 225 arranged in a matrix. A plurality of chute holes 222 are formed in a matrix within each compartment 225. In other words, partition walls 223 include a plurality of chute holes 222 and form compartments 225 to which electronic components C are supplied. The position of each compartment 225 corresponds one-to-one to the position of each compartment 211a in accommodation section 210.

[0021] Because the interior of the chute 220 is divided into multiple compartments 225 by partitions 223, even if the chute 220 vibrates as described below when guiding the electronic components C to the mask holes 242, the electronic components C supplied to each compartment 225 are prevented from moving to other compartments 225 by the partitions 223, and enter the chute holes 222 in the respective compartments 225. Therefore, when the chute 220 vibrates, it is possible to prevent the electronic components C from moving to other areas and becoming unevenly distributed.

[0022] Furthermore, since a large amount of electronic components C are supplied and aligned at once, the plate 221 of the chute 220 has a large area, which may cause bending, distortion, or other problems. If bending, bending, or distortion occurs, the electronic components C may move unevenly to a specific part of the plate 221, preventing them from being supplied evenly to the mask holes 242. The partition wall 223, which is provided across the area of ​​the plate 221 where the electronic components C are supplied, functions as a beam, increasing the strength of the plate 221 and preventing bending, bending, or distortion.

[0023] Furthermore, the position of each compartment 225 of the chute 220 corresponds one-to-one to the position of each compartment 211a of the storage unit 210. Then, by previously allocating a fixed amount of electronic components C to each compartment 211a of the storage unit 210 and storing them, and then suctioning the stored electronic components C according to each compartment 211a and moving them to the corresponding compartment 225 of the chute 220, it is possible to allocate the electronic components C evenly within the surface of the chute 220.

[0024] (vibration mechanism) The vibration mechanism 230 vibrates the chute 220 and the mask 240 (described later) to encourage the insertion of the electronic components C into the mask holes 242. As shown in FIGS. 3A and 3B, the vibration mechanism 230 includes a vibration table 231 and a base 232. The vibration table 231 is a horizontal plate-like body. The base 232 is installed on the installation surface of the supply device 2 and supports the vibration table 231 at a position offset from the chute 220 in the X direction. In other words, the base 232 is installed alongside the transport mechanism 290 (described later). One end of the vibration table 231 overlaps with the mask 240 transported by the transport mechanism 290 in a plan view, and the other end is supported by the base 232. A receiving hole 231b into which the mask 240 and a receiving table 250 (described later) are inserted is provided in the portion of the vibration table 231 where the mask 240 transported by the transport mechanism 290 overlaps in a plan view. The chute 220 is supported horizontally on the vibration table 231 so as to be positioned above the receiving hole 231b.

[0025] The vibration table 231 is provided so that it can vibrate by operating an oscillator built into the base 232. This causes the vibration table 231 and the chute 220 supported by the vibration table 231 to vibrate. This vibration is then transmitted to the mask 240 and receiving table 250 in contact with the chute 220, causing them to vibrate. The oscillator may be, for example, an electromagnetic coil, a motor, or a piezoelectric element. The vibration direction and vibration strength can be set as appropriate.

[0026] (mask) As shown in FIGS. 6A and 6B, the mask 240 includes a plate 241, mask holes 242, restriction holes 243, and beams 244. The plate 241 is a circular, plate-like member. The mask holes 242 are multiple holes into which electronic components C are inserted one by one through chute holes 222 of the chute 220 placed on the mask 240, covering a portion of the electronic components C. Each mask hole 242 penetrates the surface of the plate 241 in a direction perpendicular to the surface and has a prismatic shape such that the axis Axc of the inserted electronic component C is aligned vertically. A vertical line passing through the center of the mask hole 242 is defined as the axis Axm. The length of the mask hole 242 in the axis Axm direction is shorter than the length of the electronic component C in the axis Axc direction. More specifically, the length of the mask hole 242 in the axis Axm direction is the same as the length of the electronic component C in the axis Axc direction other than one electrode formation region R. That is, the length of the mask hole 242 in the direction of the axis Axm is the same as the length of the non-sputtered region of the electronic component C in the direction of the axis Axc (see FIG. 1(C)).

[0027] The size of the cross section of the mask hole 242 perpendicular to the axis Axm should be such that the electronic component C can fall under its own weight and be inserted with the axis Axc aligned vertically. In other words, the inner diameter of the mask hole 242 is large enough to allow the electronic component C to pass through, and the cross section of the mask hole 242 perpendicular to the axis Axm is slightly larger than the cross section of the electronic component C perpendicular to the axis Axc, but smaller than the size that would cause the axis Axc to be inserted at an angle relative to the vertical. However, the size is set larger than the size that requires press-fitting.

[0028] Furthermore, when forming electrode E by sputtering as described below, it is preferable that the size of the cross section perpendicular to the axis Axm of mask hole 242 is smaller than the size of the film forming material that enters through the gap formed between mask hole 242 and electronic component C.

[0029] In this embodiment, the mask holes 242 cover the other regions of the inserted electronic component C when the lower end of the electronic component C comes into contact with the receiving base 250, leaving only the electrode formation region R on the upper end exposed (see FIG. 1(C)). A plurality of mask holes 242 are provided in a matrix within a plurality of compartments 245 arranged in a matrix. The position of each compartment 245 coincides with the position of the compartment 225 of the chute 220 that is placed over it, and the position of the mask holes 242 in each compartment 245 coincides with the position of the chute holes 222 in each compartment 225. In other words, the axis Axm of the mask hole 242 coincides with the axis Axs of the chute holes 222, and the openings at the lower ends of the mask holes 242 and the openings at the upper ends of the chute holes 222 coincide without any misalignment in the horizontal directions (X, Y directions, and θ direction), allowing the electronic component C to pass through.

[0030] The restriction hole 243 is a through-hole into which a restriction portion 253 of the receiving table 250, which will be described later, is inserted to align the mask 240 with the receiving table 250 and prevent misalignment. The restriction hole 243 in this embodiment has a cylindrical shape corresponding to the shape of the restriction portion 253. The beam portion 244 is a thin plate that is fixed to the underside of the plate body 241 so that the area other than the section 245 is thick, and that increases the strength of the plate body 241 and prevents bending and distortion.

[0031] (receiving base) The receiving table 250 holds the mask 240 and is a table with which one end of the electronic component C inserted into the mask hole 242 comes into contact. In this embodiment, the electronic component C is inserted vertically into the mask hole 242, so that one end of the electronic component C that comes into contact with the receiving table 250 is downward, and the other end opposite thereto is upward. In the following description, one end of the electronic component C and the corresponding end of the mask hole 242 are referred to as the lower end, and the other end of the electronic component C and the corresponding end of the mask hole 242 are referred to as the upper end, but the orientation of the electronic component C and the mask hole 242 is not limited to this. Furthermore, both ends of the electronic component C can be one end (lower end) and the other end (upper end).

[0032] 7(A) and (B), the receiving base 250 has a plate 251, a support portion 252, and a restricting portion 253. The plate 251 is a circular plate-like member having the same diameter as the mask 240. The support portion 252 is a rectangular plate-like member fixed to one surface of the plate 251. The support portion 252 is provided at a position that closes the lower end of the mask hole 242 in each compartment 245 when the mask 240 is placed on the receiving base 250. The support portion 252 is provided at a position that does not overlap the beam portion 244 of the mask 240.

[0033] The restricting portion 253 is a cylindrical pin. The restricting portion 253 is provided at a position corresponding to the restricting hole 243 of the mask 240, and by being inserted into the restricting hole 243, the position of the receiving base 250 and the mask 240 is aligned and positional deviation is prevented.

[0034] (Space adjustment part) The gap adjustment unit 260 (see FIG. 3(B)) adjusts the gap between the opposing surfaces of the chute 220 and the mask 240. Specifically, as will be described later, the gap between the chute 220 and the mask 240 is adjusted to a position where the mask 240 contacts the chute 220 (first position), a position where the chute 220 and the mask 240 are moved horizontally relative to each other (second position), and a position where the mask 240 and the receiving base 250 are held in the holding holes 292a (third position). In other words, the gap adjustment unit 260 of this embodiment is an elevation mechanism that raises and lowers the receiving base 250 and the mask 240 between the first position, the second position, and the third position.

[0035] The first position is a position where an electronic component C is inserted from the chute 220 into the mask 240 by vibration (see Figure 9), the second position is a position where the mask 240 is separated from the chute 220 by a distance Dz and the upper end of the electronic component C inserted into the mask 240 does not interfere with the chute 220 (a position where the chute 220 and the mask 240 can move horizontally relative to each other) (see Figure 10), and the third position is a position where the chute 220 and the mask 240 are separated and waiting (see Figure 11(B)).

[0036] In addition, in order to prevent the upper end of the electronic component C from interfering with the chute 220 at the second position described above, when the spacing adjustment unit 260 moves the chute 220 and the mask 240 relatively in the vertical direction (Z direction, the direction of the axis Axs of the chute hole 222), the movement distance (spacing Dz) is equal to or greater than the length of the electrode formation region R in the direction of the axis Axc and equal to or less than the length of the electronic component C in the direction of the axis Axc (see Figures 10(A) and 12(D)).

[0037] The electrode formation region R is the region where the electrodes E are formed, and is therefore formed corresponding to a pair of two poles. Therefore, a region separating the positive and negative electrodes of the two electrodes E is required between the pair of electrode formation regions R. Therefore, the electrode formation region R is a region that leaves a gap to achieve such pole separation. For example, one electrode E can be formed only on the bottom surface F (see FIG. 1(C)), with a gap provided at the corner where the side surface and surface F connect, and the rest of the area can be the other electrode E. In other words, the distance Dz does not exceed the length of the electronic component C in the axial direction Axc, based on the film formation region (electrode formation region R). Taking into account positioning errors during movement, it is preferable to set the distance Dz as close as possible to the length of the electrode formation region R in the axial direction Axc. It is preferable that the distance Dz be a distance that prevents the electronic component C accommodated in the mask hole 242 from being sucked in from above.

[0038] The gap adjusting unit 260 has a pusher 261 and a drive source 262. The pusher 261 has a mounting table 261a on which the receiving table 250 is mounted, and a shaft 261b that supports the mounting table 261a. The drive source 262 is a motor that raises and lowers the shaft 261b.

[0039] (moving mechanism) The movement mechanism 270 is a mechanism that moves the chute 220 and the mask 240 relatively in the horizontal direction so that the axis Axs of the chute hole 222 and the axis Axm of the mask hole 242 are misaligned while the upper ends of the electronic components C do not interfere with the chute 220 (see FIGS. 10(B) and 12(E)). The movement mechanism 270 of this embodiment is provided between the mounting table 261a and the shaft 261b, and moves the mounting table 261a to move the receiving table 250 and the mask 240 in the X direction. The movement mechanism 270 can be, for example, an air cylinder.

[0040] To enable such movement, a support 261c, a guide 261d, and a movable body 261e are further provided between the mounting base 261a and the shaft 261b (see FIGS. 8 to 11). The support 261c is a plate-like member connected to the shaft 261b so as to face the mounting base 261a. The guide 261d is a rod-like member fixed on the support 261c so as to extend in the X direction. The movable body 261e is a member having a recess that is fitted into the guide 261d so as to be slidable. The recessed portion of the movable body 261e is fitted into the guide 261d, and the portion opposite the recessed portion is fixed to the mounting base 261a.

[0041] The air cylinder, which is the movement mechanism 270, is fixed to a position on the support portion 261c where it can press the movable body 261e. When the movement mechanism 270 presses the movable body 261e, the movable body 261e and the mounting table 261a connected thereto move along the guide 261d. For example, the movement mechanism 270 moves the movement distance Dx that is approximately half the horizontal length of the mask hole 242, thereby misaligning the axis Axs of the chute hole 222 with the axis Axm of the mask hole 242.

[0042] (removal mechanism) The removal mechanism 280 is a mechanism that removes electronic components C other than the electronic components C inserted into the mask holes 242 from the chute 220. As shown in FIGS. 3(A), (B), 4(A), and (B), the removal mechanism 280 includes a pickup mechanism 281 and a guide mechanism 282.

[0043] The pickup mechanism 281 is a mechanism that picks up an electronic component C from the storage unit 210 or the chute 220. The pickup mechanism 281 has a moving body 283, a suction unit 284, and an adhesive force imparting unit 285. The moving body 283 moves between the storage unit 210 and the chute 220. The moving body 283 has a shape of a prism on top of a flared truncated pyramid, and is a base member on which the suction unit 284 and the adhesive force imparting unit 285 are mounted. The moving body 283 is provided so as to be movable between the storage unit 210 and the chute 220 by a guide mechanism 282.

[0044] The suction unit 284 is a unit for suctioning the electronic component C in order to pick up the electronic component C. The suction unit 284 has an suction plate 284a, a support plate 284b, and a support column 284c. The suction plate 284a is a member onto which the electronic component C is suctioned. The suction plate 284a is a rectangular plate-like body arranged at a position corresponding to each compartment 225 of the chute 220, and suctions the electronic component C by application of magnetic force from an suction force application unit 285 (described later). The size of the horizontal surface of the suction plate 284a is smaller than the area surrounded by the partition wall 223 so that the suction plate 284a can approach the chute hole 222 of each compartment 225. The position of each suction plate 284a also corresponds to each compartment 211a of the container 211.

[0045] The support plate 284b is a rectangular plate-like body to which the attraction plate 284a is attached. The support plate 284b is large enough to cover the entire area in which the chute hole 222 of the chute 220 is formed. The attraction plate 284a and the support plate 284b are formed to a thickness that allows magnetic force to pass through. The material of the attraction plate 284a and the support plate 284b is not particularly limited and may be metal or non-metal such as resin. For example, stainless steel is used for the attraction plate 284a and the support plate 284b. The support pillar 284c is a pillar that fixes the support plate 284b to the movable body 283. The upper end of the support pillar 284c is fixed to the bottom of the movable body 283 and the lower end is fixed to the support plate 284b. As a result, the support plate 284b is supported horizontally at a distance from the bottom surface of the movable body 283.

[0046] The attraction force imparting unit 285 imparts an attraction force to the attraction plate 284a. The attraction force imparting unit 285 imparts a magnetic force to the surface of the attraction plate 284a facing the accommodation unit 210 via the support plate 284b, for attracting the electronic component C. The attraction force imparting unit 285 includes a magnetic member 285a, a holding plate 285b, and a contact / separation mechanism 285c. The magnetic member 285a is, for example, a permanent magnet. The size of the horizontal surface of the magnetic member 285a is approximately the same as that of the attraction plate 284a. The holding plate 285b is approximately the same size as the support plate 284b of the attraction unit 284 and is disposed between the support plate 284b and the bottom of the movable body 283. The magnetic members 285a are attached to the holding plate 285b at positions corresponding to the attraction plates 284a, with the support plate 284b sandwiched between them.

[0047] The contact / separation mechanism 285c attracts and releases the electronic component C by moving the magnetic member 285a and the attraction plate 284a relative to each other. In this embodiment, the contact / separation mechanism 285c is provided at the bottom of the moving body 283 and supports the magnetic member 285a so that it can be raised and lowered. An air cylinder, for example, is used as the contact / separation mechanism 285c. The contact / separation mechanism 285c supports the holding plate 285b in a horizontal direction and lowers the magnetic member 285a to contact the support plate 284b, thereby applying a magnetic attraction force to the attraction plate 284a via the support plate 284b. The contact / separation mechanism 285c also lifts the magnetic member 285a to separate it from the support plate 284b, thereby eliminating the magnetic attraction force of the attraction plate 284a.

[0048] The guide mechanism 282 moves the moving body 283 between the storage unit 210 and the chute 220. The guide mechanism 282 includes a support column 286, an arm 287, and a guide column 288. The support column 286 is a pair of rectangular column members erected on the support base 212 of the storage unit 210. The arm 287 is a horizontal rectangular column member supported by the support column 286 and extends from a position above the container 211 to a position above the storage hole 231b of the vibration table 231. The guide column 288 is a biaxial movement mechanism combining linear guides in the X and Z directions, and is provided on the arm 287. The guide column 288 supports the moving body 283 via a slider. This allows the guide mechanism 282 to transfer the electronic component C sucked by the suction column 284 between the storage unit 210 and the chute 220.

[0049] (Transport mechanism) 3(A) and 3(B), the transport mechanism 290 is a mechanism that transports the mask 240, in which electronic components C are inserted into the mask holes 242, between the supply device 2 and the film formation processing unit 3. The transport mechanism 290 of this embodiment has a rotary table 292 that is rotated intermittently by a motor 291. The rotary table 292 has a plurality of holding holes 292a, which are through-holes, formed at equal intervals. The receiving table 250 is held by the holding holes 292a.

[0050] A step is formed on the inner edge of the holding hole 292a to hold the receiving table 250 on which the mask 240 is placed (see FIGS. 8(A) and 8(B)). Every time the turntable 292 stops due to intermittent rotation, the holding hole 292a comes to a position directly below the accommodation hole 231b of the vibration table 231. The pusher 261 of the distance adjustment unit 260 moves the receiving table 250 on which the mask 240 is placed between the holding hole 292a and the accommodation hole 231b of the turntable 292.

[0051] [Film forming processing section] The film formation processing unit 3 is an apparatus that uses plasma to form a film on the portion of the electronic component C exposed through the mask hole 242, i.e., the electrode formation region R. As shown in FIG. 2, the film formation processing unit 3 has a chamber 31, a transfer unit 32, a pre-processing unit 33, and film formation units 34 and 35. The chamber 31 is a container that can be evacuated by an exhaust unit 311. The exhaust unit 311 has piping and an exhaust circuit (not shown) connected to an exhaust port. The transfer unit 32 has a rotary table 321, a drive source 322, a sealant 323, and a pusher 324.

[0052] The rotary table 321 is a circular table that intermittently rotates the receiving table 250 that has been carried into the chamber 31 to move it to each section, such as the pre-processing section 33, the film formation sections 34 and 35, and a load lock section (described later). The sealant 323 is a member that seals each section and isolates it from the chamber 31. The receiving table 250 is placed on the sealant 323, which is held in holding holes provided at equal intervals in the rotary table 321. The pusher 324 raises and lowers the sealant 323 at positions corresponding to each section of the film formation processing section 3.

[0053] Although not shown, the film forming processing unit 3 has a loading / unloading unit that loads and unloads the receiving table 250 carrying the mask 240 into and out of the chamber 31, and a load lock unit that enables the loading / unloading unit to load and unload the receiving table 250 carrying the mask 240 into and out of the chamber 31 while maintaining the vacuum inside the chamber 31.

[0054] The pretreatment unit 33 uses plasma to perform surface treatment on the electrode formation region R. The surface treatment is, for example, an ion bombardment process in which ions generated in a process gas by the plasma clean the surface of the electrode formation region R. The pretreatment unit 33 is provided on the ceiling side of the chamber 31, is sealed by a raised sealing body 323, and has a treatment chamber 331 in which surface treatment is performed on the electrode formation region R exposed from the mask 240.

[0055] The film forming units 34 and 35 perform a film forming process by sputtering on the electrode formation region R of the electronic component C. Sputtering is a process in which a film forming material is knocked out from targets 342 and 352 by ions generated in a sputtering gas by plasma and deposited on the surface of the electrode formation region R. The film forming units 34 and 35 have film forming chambers 341 and 351 that are provided on the ceiling side of the chamber 31 and sealed by a raised sealing body 323, and in which a film forming process is performed on the electrode formation region R exposed from the mask 240.

[0056] The film forming chambers 341, 351 are provided with targets 342, 352 containing film forming material. The targets 342, 352 are members formed from the film forming material that is deposited on the electronic component C by sputtering to form a film. The targets 342, 352 are held by a backing plate (not shown) and connected to a power supply via electrodes. For example, Ti is used as the film forming material for the base layer, and Cu, Au, Ag, etc. are used as the seed layer for the electrode E. However, various materials can be used as long as they can be used to form a film by sputtering. In this embodiment, the base layer is formed in the film forming unit 34, and the seed layer for the electrode E is formed in the film forming unit 35. For example, titanium (Ti) is used as the material for the base layer, and copper (Cu) is used as the material for the seed layer for the electrode E.

[0057] In this embodiment, two film forming units 34 and 35 are provided to form two layers, an underlayer and a seed layer, but if an underlayer is not required, only one film forming unit may be provided. Also, if additional layers need to be formed, two or more film forming units may be provided.

[0058] [Control device] The control device 4 is a device that controls each part of the film forming apparatus 1 (see FIG. 2). This control device 4 can be configured, for example, by a computer that operates according to a predetermined program. The control contents of the control device 4 are programmed and executed by a processing device such as a PLC (Programmable Logic Controller) or a CPU (Central Processing Unit).

[0059] For example, using the above-mentioned program, the control device 4 controls the vibration of the vibration table 231 by the vibration mechanism 230, the raising and lowering of the receiving table 250 and the mask 240 by the spacing adjustment unit 260, the movement of the chute 220 by the moving mechanism 270, the loading and removal of the electronic component C by the removal mechanism 280, the transportation of the receiving table 250 by the conveying mechanism 290, the loading and unloading of the receiving table 250 into and out of the chamber 31 by the loading and unloading unit, plasma processing by the pre-processing unit 33, film formation processing by the film formation unit 35, and the transportation of the receiving table 250 by the conveying unit 32.

[0060] [Operation] The process of forming a film on electronic components C using the film forming apparatus 1 according to the present embodiment as described above will be described with reference to the explanatory diagrams of FIGS. 8 to 13 in addition to the above-described FIGS. 1 to 7. Note that, as a premise for the description, as shown in FIG. 4(A), a plurality of electronic components C are previously loaded into the container 211 of the accommodation unit 210, and a plurality of electronic components C are accommodated in each compartment 211a. The number of electronic components C accommodated in each compartment 211a is greater than the number of chute holes 222 in each compartment 225 of the chute 220 and the number of mask holes 242 in each compartment 245 of the mask 240. Furthermore, the positions of the electronic components C accommodated in each compartment 211a may be leveled so as to be nearly uniform within each compartment 211a by leveling with a flat plate or the like.

[0061] As shown in FIG. 8(A), a receiving table 250 carrying a mask 240 is placed on the placing table 261a of the pusher 261. At this time, the restricting portions 253 of the receiving table 250 are inserted into the restricting holes 243 of the mask 240, thereby aligning the mask 240 with the receiving table 250 and preventing misalignment. Then, as shown in FIG. 8(B), the placing table 261a is raised by the pusher 261, thereby setting the mask 240 in a first position where it contacts the lower surface of the chute 220. At this time, the lower end of the chute hole 222 and the upper end of the mask hole 242 coincide with each other. At this time, the overlapping area of ​​the chute hole 222 and the mask hole 242 is larger than the area of ​​a surface F (see FIG. 1(c)) in a direction perpendicular to the axis Axc of the electronic component C.

[0062] (Supply operation) First, a description will be given of the supply operation of electronic components C. As shown in Fig. 4(A), guide mechanism 282 moves movable body 283 of pickup mechanism 281 horizontally to position it above container 211. At this time, contact / separation mechanism 285c lowers holding plate 285b, causing magnetic member 285a to contact support plate 284b, and magnetic attraction force acts on attraction plate 284a via support plate 284b.

[0063] Next, the guide mechanism 282 causes the moving body 283 of the pickup mechanism 281 to descend, causing each of the suction plates 284a to approach each of the sections 211a of the container 211. As a result, each of the suction plates 284a magnetically attracts and holds a plurality of electronic components C. Then, the guide mechanism 282 causes the moving body 283 of the pickup mechanism 281 to ascend, and the electronic components C are picked up from the container 211. Thereafter, the moving body 283 is moved horizontally by the guide mechanism 282 and positioned above the chute 220. Furthermore, as shown in FIGS. 4(B), 9(A), and 12(A), the moving body 283 descends, causing the suction plates 284a to approach each of the sections 225 of the chute 220.

[0064] 9(B) and 12(B), the contact / separation mechanism 285c raises the holding plate 285b, and the magnetic member 285a separates from the support plate 284b, thereby releasing the magnetic force acting on each attraction plate 284a. As a result, the electronic components C attracted to each attraction plate 284a fall into each compartment 225 of the chute 220. Then, the guide mechanism 282 raises the moving body 283, and the attraction plate 284a retracts from each compartment 225 of the chute 220. In this manner, the electronic components C are supplied to the chute 220. Thereafter, the contact / separation mechanism 285c lowers the holding plate 285b, and the magnetic member 285a contacts the support plate 284b, thereby restoring each attraction plate 284a to a state in which a magnetic force acts on it.

[0065] Then, vibration mechanism 230 vibrates vibration table 231, thereby vibrating chute 220, mask 240, and receiving table 250. Then, as shown in Fig. 12(C), electronic components C accommodated in each compartment 225 of chute 220 enter chute hole 222 one by one from the upper end side, and while passing through chute hole 222, are guided so that axis Axc is vertical, and fall into mask hole 242.

[0066] The lower end of the electronic component C placed in the mask hole 242 comes into contact with the support portion 252 of the receiving table 250, so that only the electrode formation region R on the upper end side is exposed from the mask hole 242. However, the electrode formation region R exposed from the mask hole 242 is placed inside the chute hole 222. There may also be cases where the electronic component C placed in the chute hole 222 is placed on top of the electronic component C placed in the mask hole 242.

[0067] 10(A) and 12(D), the spacing adjustment unit 260 lowers the mounting table 261a, thereby separating the mask 240 from the lower surface of the chute 220 to the second position. The spacing Dz at this time is set to be equal to the height of the electrode formation region R exposed through the mask hole 242. As a result, the boundary between the electronic component C inserted in the chute hole 222 and the electronic component C inserted in the mask hole 242 becomes flush with the lower surface of the chute 220, and the chute 220 becomes movable in the horizontal direction.

[0068] 10(B) and 12(E), the moving mechanism 270 moves the receiving table 250 on which the mask 240 is placed by a movement distance Dx in the X direction. This movement distance Dx is approximately half the horizontal length of the mask hole 242. By misaligning the axis Axs of the chute hole 222 from the axis Axm of the mask hole 242 in this way, the electronic component C that has entered the chute hole 222 is prevented from falling by the electronic component C that has entered the mask hole 242, and the vertical movement of the electronic component C that has entered the mask hole 242 is restricted by the bottom surface of the chute 220.

[0069] It should be noted that movement distance Dx is not limited to a distance approximately half the horizontal length of mask hole 242. It is sufficient that electronic component C is prevented from falling out of chute hole 222 and that the vertical movement of electronic component C inserted in mask hole 242 is restricted, and that the distance is such that electronic component C is moved to a position where the area of ​​the surface where chute hole 222 and mask hole 242 overlap is smaller than the area of ​​surface F in a direction perpendicular to axis Axc of electronic component C so that electronic component C cannot move between chute hole 222 and mask hole 242.

[0070] In this state, as shown in FIGS. 11(A) and 12(F), the guide mechanism 282 moves the movable body 283 above the chute 220 and then lowers it, causing the suction plates 284a to descend and approach each compartment 225 of the chute 220. As a result, each suction plate 284a magnetically attracts and holds the electronic components C in each compartment 225. At this time, the magnetic force acts not only on the electronic components C that have entered the chute holes 222 but also on the electronic components C that have entered the mask holes 242. However, the electronic components C that have entered the mask holes 242 are not attracted because their movement is restricted as described above. The guide mechanism 282 then raises the movable body 283, and the electronic components C are picked up and removed from the chute 220. Thereafter, the movable body 283 is moved horizontally by the guide mechanism 282 to move horizontally above the container 211. Furthermore, the moving body 283 descends, and the adsorption plates 284a approach each of the compartments 211a of the container 211 (see FIGS. 4(B) and (A)).

[0071] Thereafter, the contact / separation mechanism 285c raises the holding plate 285b, and the magnetic member 285a separates from the support plate 284b, thereby releasing the magnetic force acting on each attraction plate 284a. As a result, the electronic components C attracted to each attraction plate 284a fall into the respective compartments 211a of the container 211. Furthermore, the guide mechanism 282 raises the movable body 283, causing the attraction plates 284a to retract from the respective compartments 211a of the container 211. In this manner, the electronic components C are removed from the chute 220.

[0072] 11(B) and 12(G), the mounting table 261a of the pusher 261 is lowered, whereby the receiving table 250 on which the mask 240 is placed is lowered to a third position where the receiving table 250 is held in the holding holes 292a of the rotary table 292. As a result, the mask 240 with the electronic components C inserted into the mask holes 242 is supplied to the rotary table 292 together with the receiving table 250. The moving mechanism 270 returns the receiving table 250 on which the mask 240 is placed to its initial position.

[0073] Then, the pusher 261 moves down to move away from the receiving pedestal 250 and the rotary table 292. Furthermore, as the rotary table 292 rotates intermittently, the receiving pedestal 250 held in the holding hole 292a comes to a position where it can be carried in by the carry-in / carry-out unit, and the carry-in / carry-out unit carries the receiving pedestal 250 into the chamber 31 via the load lock unit and mounts it on the sealing body 323 on the rotary table 321.

[0074] 2, the rotary table 321 transports the receiving table 250 to the pre-treatment unit 33, and the pusher 324 raises the sealing body 323, thereby sealing the receiving table 250 carrying the mask 240 into which the electronic component C is inserted while accommodating it in the treatment chamber 331. In the treatment chamber 331, the electrode formation regions R of the electronic component C exposed through the mask holes 242 are subjected to surface treatment.

[0075] Furthermore, the turntable 321 transports the receiving table 250 to the film forming section 34 and the film forming section 35 in that order, and similarly to the above, the seal 323 is raised by the pusher 324 to seal the chamber, and film formation is performed in the electrode formation region R in the film forming chambers 341 and 351. In this embodiment, a titanium film is formed in the film forming section 34, and a copper film is formed in the film forming section 35.

[0076] Thereafter, the rotary table 321 transports the receiving pedestal 250 to the load / unload position, and the load / unload unit transports the receiving pedestal 250 out of the chamber 31 via the load lock unit. The transported receiving pedestal 250 is held in the holding hole 292a of the rotary table 292.

[0077] Next, the electronic component C is inverted to form a film on the electrode formation region R opposite to the electrode formation region R on which the film was formed on the electronic component C. The mask 240 and the receiving table 250, into which the electronic component C with the film formed on the electrode formation region R has been inserted, are transported by the rotary table 292 to a predetermined position for inversion. At this predetermined position, a separately prepared receiving table 250 is placed on the mask 240 on the receiving table 250 positioned at the predetermined position, as shown in FIG. 13(A), and then the mask 240 is inverted as shown in FIG. 13(B). Note that the restricting portions 253 of the newly placed receiving table 250 fit into the restricting holes 243 of the mask 240, thereby aligning the mask 240 and preventing misalignment. Furthermore, the restricting portions 253 of the two receiving tables 250 come into contact with each other, thereby defining the distance between the two receiving tables 250.

[0078] The distance between the two overlapping receiving pedestals 250 is set to be equal to or slightly larger than the axial length of the electronic component C. The two receiving pedestals 250 have the same shape and size. Therefore, the restricting portions 253 of each receiving pedestal 250 have the same protrusion amount. Furthermore, the supporting portions 252 of each receiving pedestal 250 have the same protrusion amount. Therefore, twice the difference in the protrusion amount between the restricting portions 253 and the supporting portions 252 is set to be equal to or slightly larger than the axial length of the electronic component C. In other words, the difference in the protrusion amount between the restricting portions 253 and the supporting portions 252 is set to be half the length set to be equal to or slightly larger than the axial length of the electronic component C. Furthermore, the thickness of the plate body 241 of the mask 240 is thicker than the difference in the protrusion amount between the restricting portions 253 and the supporting portions 252 but thinner than twice the difference in the protrusion amount between the restricting portions 253 and the supporting portions 252. When the mask 240 is placed on the supporting portions 252, the thickness is set so that the electrode formation region R of the electronic component C is exposed. Because of this dimensional relationship, the restricting portion 253 of one of the receiving tables 250 can be inserted into the restricting hole 243 provided in the plate 241 of the mask 240 placed on the other receiving table 250. Even if the two overlapping receiving tables 250 are inverted together (turned upside down), the electrode formation region R of the other end of the electronic component C, one end of which is in contact with the other receiving table 250, will be exposed to the same amount as before inversion.

[0079] This inversion also inverts the mask 240, causing the mask 240 to descend and come into contact with the now lower receiving table 250. As a result, the electrode formation regions R of the electronic component C opposite the film-formed side are exposed from the upper ends of the mask holes 242. Then, as shown in FIG. 13(C), the now upper receiving table 250 is removed. In this state, the receiving table 250 is carried into the chamber 31 of the film-formation processing unit 3, as described above, and film formation processing is performed on the exposed electrode formation regions R. As a result, electrodes E are formed in the electrode formation regions R on both ends of the electronic component C. The receiving table 250 can be placed on top of or removed by an operator or by a robot or the like.

[0080] [effect] (1) The supply device 2 of this embodiment includes a chute 220 having a plurality of chute holes 222 through which electronic components C having one end and the other end can pass one by one; a mask 240 on which the chutes 220 are stacked, into which electronic components C are inserted through the chute holes 222 and which has mask holes 242 that cover a portion of the electronic components C; a receiving table 250 that holds the mask 240 and to which one end of the electronic components C inserted into the mask holes 242 contacts; a moving mechanism 270 that moves the chute 220 and the mask 240 relative to each other so that the axis Axs of the chute holes 222 and the axis Axm of the mask holes 242 are misaligned while the other end of the electronic components C inserted into the mask holes 242 does not interfere with the chute 220; and a removal mechanism 280 that removes electronic components C other than the electronic components C inserted into the mask holes 242 from the chute 220 while the axis Axs of the chute holes 222 and the axis Axm of the mask holes 242 are misaligned. The apparatus also includes a film-forming processing unit 3 that forms a film on the electronic components C supplied by the supply device 2.

[0081] This makes it possible to suppress the supply of more than a predetermined amount of electronic components C and improve productivity in the supply device 2 and the film forming device 1. Specifically, even when electronic components C are inserted in the mask holes 242, the horizontal relative movement of the chute 220 and the mask 240 makes it possible to restrict the movement of the electronic components C inserted in the mask holes 242 by the portions (underside) of the chute 220 other than the chute holes 222, and also to prevent unnecessary electronic components C from falling from the chute holes 222 and being supplied onto the mask 240.

[0082] In other words, when the chute hole 222 and the mask hole 242 are aligned, an electronic component C is inserted into the mask hole 242 through the chute hole 222, but the chute hole 222 and the mask hole 242 are misaligned due to the horizontal relative movement of the chute 220 and the mask 240, preventing the subsequent electronic component C from being inserted. Furthermore, the movement of the electronic component C inserted into the mask hole 242 is restricted, so it is not sucked out through the chute hole 222. Therefore, only the electronic components C that are not inserted into the mask hole 242 and remain in the chute 220 and the chute hole 222 can be removed by the removal mechanism 280. This makes it possible to prevent more than a predetermined amount of electronic components C from being supplied to the mask 240 when the chute 220 is detached from the mask 240.

[0083] More specifically, when inserting electronic components C into the mask holes 242, more electronic components C than the number of mask holes 242 are supplied to the chute 220 in order to increase the insertion rate. Naturally, this results in some electronic components C not fitting into the mask holes 242 and remaining. The remaining electronic components C remain on the chute 220. At this time, electronic components C may also be present in the chute holes 222 at the locations where electronic components C have been inserted into the mask holes 242. Such electronic components C present in the chute holes 222 may fall from the chute 220 and scatter on the mask 240 when the mask 240 is separated from the chute 220. Furthermore, electronic components C remaining on the chute 220 may fall from the chute 220 through the chute holes 222 and scatter on the mask 240. Such electronic components C that fall onto the mask 240 may be scattered within the film forming apparatus 1, causing malfunctions or interfering with film formation.

[0084] Therefore, it is necessary to remove the excess electronic components C present in the chute holes 222 before the mask 240 is separated from the chute 220. If suction or adsorption is performed for this removal, the electronic components C inserted in the mask holes 242 may also be removed, lowering the insertion rate and decreasing productivity.

[0085] In the supply device 2 of this embodiment, the movement mechanism 270 shifts the chute 220 and the mask 240, so that when the removal mechanism 280 sucks (adsorbs) electronic components C that have fallen onto the chute 220 or into the chute holes 222, the electronic components C inserted into the mask holes 242 are not sucked out through the chute holes 222 because they are shifted from the holes in the chute 220. In other words, the movement of the electronic components C in the mask holes 242 is restricted. Therefore, the electronic components C inserted into the mask holes 242 remain inserted, and the removal mechanism 280 can reliably remove only the unnecessary electronic components C other than the electronic components C inserted into the mask holes 242. This prevents electronic components C from scattering on the mask 240 without reducing productivity, and prevents the unnecessary electronic components C from causing malfunctions or interfering with film formation.

[0086] (2) The supply device 2 has a gap adjustment unit 260 that adjusts the gap between the opposing surfaces of the chute 220 and the mask 240 to prevent the other ends of the electronic components C from interfering with the chute 220. Therefore, the upper ends of the electronic components C can be prevented from interfering with the chute 220 by the same action as the action of removing the chute 220 from the mask 240.

[0087] More specifically, when electronic component C is inserted into mask hole 242, a portion (one end) of electronic component C is covered by mask hole 242, and the other end (electrode formation region R) is exposed. In order to insert electronic component C into mask hole 242 through chute hole 222, it is better for chute hole 222 and mask hole 242 to be in contact with each other. Naturally, then, electronic component C inserted into mask hole 242 has its electrode formation region R remaining in chute hole 222. In this state, chute hole 222 and mask hole 242 cannot be displaced from each other. If an attempt is made to remove electronic component C using removal mechanism 280 without displacing chute hole 222 and mask hole 242 from each other, the electronic component C inserted into mask hole 242 will also be removed.

[0088] In this embodiment, the gap adjusting unit 260 adjusts the gap between the opposing surfaces of the chute 220 and the mask 240, thereby preventing the upper ends of the electronic components C from interfering with the chute 220. Therefore, when removing the electronic components C, the chute holes 222 and the mask holes 242 can be shifted, which restricts the movement of the electronic components C and prevents the electronic components C inserted into the mask holes 242 from being removed through the chute holes 222, thereby not reducing productivity.

[0089] (3) When the distance adjustment unit 260 moves the chute 220 and the mask 240 relative to each other in the direction of the axis Axs of the chute hole 222, the distance Dz between the chute 220 and the mask 240 is equal to or greater than the length in the direction of the axis Axc of the electrode formation region R of the electronic component C inserted into the mask hole 242, and is equal to or less than the length in the direction of the axis Axc of the electronic component C. Therefore, by moving the chute hole 222 a small distance, the chute hole 222 and the mask hole 242 can be shifted so that the upper end of the electronic component C does not interfere with the chute 220, while a portion of the electronic component C is exposed from the mask hole 242 to form the electrode E.

[0090] (4) The removal mechanism 280 has a suction portion 284 that sucks and holds the electronic components C. Therefore, the electronic components C remaining in the chute 220 and the chute holes 222 can be sucked and held and removed.

[0091] (5) The suction unit 284 has an suction plate 284a onto which the electronic component C is suctioned, and an suction force imparting unit 285 that imparts suction force to the suction plate 284a. The suction force imparting unit 285 has a magnetic member 285a and a contact / separation mechanism 285c that attracts and releases the electronic component C by moving the magnetic member 285a and the suction plate 284a relative to each other.

[0092] Therefore, by moving the magnetic member 285a relative to the attraction plate 284a, it is possible to instantly switch between attraction and release of electronic components C across the entire surface of the chute 220 and across multiple compartments 211a of the storage section 210, and with a simple configuration, it is possible to reduce bias in the attraction position and drop position of the electronic components C.

[0093] (6) The supply device 2 has a storage section 210 that stores a plurality of electronic components C, and the removal mechanism 280 has a guide mechanism 282 that transfers the electronic components C between the storage section 210 and the chute 220. Therefore, the supply and removal of the electronic components C can be performed by a common mechanism.

[0094] [Variations] The present embodiment may also be modified as follows.

[0095] (1) The moving mechanism 270 may be any mechanism that moves the mask 240 and the receiving table 250 relative to the chute 220. In the above-described embodiment, the moving mechanism 270 is provided in the distance adjustment unit 260 and moves the mask 240 and the receiving table 250. However, the moving mechanism 270 may be configured to move the chute 220. In this case, the chute 220 is supported on the vibration table 231 of the vibration mechanism 230 so as to be relatively movable. The moving mechanism 270 is provided between the vibration table 231 and the chute 220. The moving mechanism 270 may be, for example, an air cylinder, and moves the chute 220 relative to the vibration table 231, thereby moving the chute 220 in the X direction. This allows the chute 220 to be configured to move relative to the mask 240.

[0096] The modified example shown in Figure 14 below is an example in which the chute 220 is moved, and Figures 15 and 16 are examples in which the mask 240 is moved. However, in these modified examples, either or both of the chute 220 and the mask 240 may be moved.

[0097] (2) In the above-described embodiment, the gap adjuster 260 raises the receiving table 250 carrying the mask 240 above the turntable 292 relative to the chute 220 supported by the vibration table 231, bringing the mask 240 into contact with the chute 220 (see FIG. 10 ). In the modified example shown in FIG. 14 , the mask 240 is raised independently of the receiving table 250. As a result, in the above-described embodiment, when an electronic component C is inserted into the mask hole 242, the electronic component C protrudes into the chute hole 222. Therefore, in this state, the chute 220 and the mask 240 cannot be shifted. For this reason, the electronic component C is lowered by the amount of this protrusion, i.e., the electrode formation region R (distance Dz), until the upper end of the electronic component C does not interfere with the chute 220 in the horizontal direction, and then the chute 220 and the mask 240 are shifted. In contrast, in the modified example shown in FIG. 14 , when the electronic component C is inserted into the mask hole 242, the electronic component C does not protrude into the chute hole 222. Therefore, since the upper end of the electronic component C does not interfere with the chute 220 in the horizontal direction, the chute 220 and the mask 240 can be shifted without lowering the electronic component C, thereby shortening the takt time.

[0098] 14, the gap adjustment unit 500 that moves the chute 220 and the mask 240 relatively in the direction of approaching or separating them (Z direction) on the pusher 261 may be configured by a drive unit 510 and an elevating member 520. The drive unit 510 is provided inside the pusher 261 and is raised and lowered by a drive source such as a cylinder (not shown). The elevating member 520 passes through the receiving table 250 and is driven by the drive unit 510.

[0099] The lifting member 520 supports the mask 240 and is raised and lowered by the drive unit 510, thereby moving the mask 240 between an elevated position where it contacts the chute 220 and a lower position where it contacts the support portion 252 of the receiving table 250. In this embodiment, the lifting member 520 is, for example, a rod-shaped pin. When the mask 240 is in the elevated position, the boundary between the electronic component C inserted in the chute hole 222 and the electronic component C inserted in the mask hole 242 is flush with the lower surface of the chute 220, thereby enabling the chute 220 to move horizontally. At this time, a distance Dv is provided between the support portion 252 of the receiving table 250 and the mask 240, the distance Dv being equal to the height of the exposed electrode formation region R of the electronic component C. While FIG. 14 illustrates a single compartment 225 on the chute 220, the chute 220 may have multiple compartments 225, as in the above-described embodiment.

[0100] In this case, as shown in Figure 14(A), with the mask 240 in the raised position, an electronic component C is placed in the compartment 225 of the chute 220 as described above, and the electronic component C is inserted into the mask hole 242 via the chute hole 222 by vibration.

[0101] In this state, as shown in Figure 14(B), chute 220 is moved in the X direction by movement mechanism 270. This movement distance Dx is the same as above. By misaligning axis Axs of chute hole 222 and axis Axm of mask hole 242 in this way, electronic components C entering chute hole 222 are prevented from falling by electronic components C entering mask hole 242, and the vertical movement of electronic components C entering mask hole 242 is restricted by the bottom surface of chute 220.

[0102] 14(C), guide mechanism 282 moves movable body 283 above chute 220 and then lowers it, causing suction plate 284a to descend and approach compartment 225 of chute 220. Then, suction plate 284a magnetically attracts and holds electronic components C in compartment 225. At this time, electronic components C that have entered chute holes 222 are also likely to be attracted to suction plate 284a, but electronic components C that have entered mask holes 242 are not attracted because their vertical movement is restricted as described above. Electronic components C attracted and held by suction plate 284a are returned to container 211 in the same manner as described above. In this manner, excess electronic components C are removed from chute 220.

[0103] Next, as shown in FIG. 14(D), the mounting base 261a of the pusher 261 descends, thereby lowering the receiving base 250 on which the mask 240 is placed, and the receiving base 250 is held in the holding holes 292a of the rotary table 292 (see FIG. 11(B)). As a result, the mask 240 with the electronic components C inserted into the mask holes 242 remains on the receiving base 250. Furthermore, as shown in FIG. 14(E), the lifting member 520 is lowered by the driving unit 510, thereby bringing the mask 240 to a lowered position where it contacts the support parts 252 of the receiving base 250. As a result, the electrode formation regions R of the electronic components C are exposed through the mask holes 242. Furthermore, as shown in FIG. 14(F), the pusher 261 descends, thereby retracting from the receiving base 250 and the rotary table 292. The subsequent operations are the same as those described above.

[0104] (3) Furthermore, as shown in Fig. 15, the gap adjustment unit 600 may be configured by a spacer inserted between the receiving table 250 and the mask 240. This gap adjustment unit 600 is inserted and ejected between the receiving table 250 and the mask 240 manually by an operator or by a drive mechanism (not shown). When the gap adjustment unit 600 is inserted, the mask 240 is in a raised position in contact with the chute 220, and when the gap adjustment unit 600 is not inserted, the mask 240 is in a lowered position in contact with the support portion 252 of the receiving table 250.

[0105] When the gap adjusting unit 600 is inserted, the upper surface of the electronic component C inserted in the mask hole 242 is flush with the lower surface of the chute 220, so that the upper end of the electronic component C does not interfere with the chute 220 in the horizontal direction, allowing the chute 220 to move horizontally. At this time, a gap Dv equal to the height of the exposed electrode formation region R of the electronic component C is provided between the support portion 252 of the receiving table 250 and the mask 240. While FIG. 15 shows the chute 220 having one compartment 225, the chute 220 may have multiple compartments 225, as in the above embodiment. In other words, in the present invention, the compartment 225 of the chute 220, the corresponding compartment 211a of the storage unit 210, and the corresponding compartment 245 of the mask 240 may each be one or multiple.

[0106] In this case, as shown in Figure 15(A), with the mask 240 in the raised position, an electronic component C is placed in the compartment 225 of the chute 220 as described above, and the electronic component C is inserted into the mask hole 242 via the chute hole 222 by vibration.

[0107] 15(B), the receiving table 250 and the mask 240 are moved in the X direction by the movement mechanism 270. This movement distance Dx is the same as above. By misaligning the axis Axs of the chute hole 222 and the axis Axm of the mask hole 242 in this manner, the electronic components C that have entered the chute hole 222 are prevented from falling by the electronic components C that have entered the mask hole 242, and the vertical movement of the electronic components C that have entered the mask hole 242 is restricted by the bottom surface of the chute 220.

[0108] 15(C), guide mechanism 282 moves movable body 283 above chute 220 and then lowers it, causing suction plate 284a to lower and approach compartment 225 of chute 220. Then, suction plate 284a magnetically attracts and holds electronic components C in compartment 225. At this time, electronic components C that have entered chute holes 222 are also attracted and held by suction plate 284a, but electronic components C that have entered mask holes 242 are not attracted because their movement is restricted as described above. Electronic components C held by suction plate 284a are returned to container 211 in the same manner as described above.

[0109] 15(D), the mounting base 261a of the pusher 261 descends, whereby the receiving base 250 on which the mask 240 is placed descends, and the receiving base 250 is held in the holding holes 292a of the rotary table 292 (see FIG. 11(B)). As a result, the mask 240 with the electronic components C inserted into the mask holes 242 remains on the receiving base 250. Furthermore, the pusher 261 descends, whereby it retracts from the receiving base 250 and the rotary table 292.

[0110] 15(E), the gap adjusting portion 600 is removed, thereby lowering the mask 240 to a lowered position where the mask 240 contacts the support portion 252 of the receiving table 250. This exposes the electrode formation region R of the electronic component C through the mask hole 242. The subsequent operations are the same as those in the above embodiment.

[0111] 15 , when electronic components C are inserted into mask holes 242, the electronic components C do not protrude into chute holes 222. Therefore, the upper ends of the electronic components C do not interfere with chute 220 in the horizontal direction, and the chute 220 and mask 240 can be shifted without lowering the electronic components C, thereby reducing the takt time.

[0112] (4) Furthermore, as shown in Fig. 16, both ends of the mask hole 242 may be enlarged. For example, enlarged portions 242a are provided at both ends of the mask hole 242 so as to form step-like enlarged sections. The enlarged sections 242a may have an inclined tapered surface, but because they are minute holes, it is easier to form the steps by etching. The length of the mask hole 242 in the direction of the axis Axm is the same as the length of the electronic component C in the direction of the axis Axc.

[0113] 16(A), electronic components C are loaded into compartment 225 of chute 220 in the same manner as above, and are inserted into mask holes 242 by vibration via chute holes 222. At this time, the upper surface of electronic component C inserted into mask holes 242 is flush with the lower surface of chute 220, so that the upper end of electronic component C does not interfere with chute 220, and chute 220 can move horizontally.

[0114] 16(B), the receiving table 250 and the mask 240 are moved in the X direction by the movement mechanism 270. This movement distance Dx is the same as above. By misaligning the axis Axs of the chute hole 222 and the axis Axm of the mask hole 242 in this manner, the electronic components C that have entered the chute hole 222 are prevented from falling by the electronic components C that have entered the mask hole 242, and the vertical movement of the electronic components C that have entered the mask hole 242 is restricted by the bottom surface of the chute 220.

[0115] 16(C), guide mechanism 282 moves movable body 283 above chute 220 and then lowers it, causing suction plate 284a to descend and approach compartment 225 of chute 220. Then, suction plate 284a magnetically attracts and holds electronic components C in compartment 225. At this time, electronic components C that have entered chute holes 222 are also attracted and held by suction plate 284a, but electronic components C that have entered mask holes 242 are not attracted because their movement in the vertical direction is restricted as described above. Electronic components C held by suction plate 284a are returned to container 211 and removed in the same manner as described above.

[0116] Next, as shown in FIG. 16(D), the mounting base 261a of the pusher 261 descends, causing the receiving base 250 on which the mask 240 is placed to descend and be held in the holding holes 292a of the turntable 292 (see FIG. 11(B)). As a result, the mask 240 with the electronic component C inserted into the mask hole 242 remains on the receiving base 250. Furthermore, as the pusher 261 descends, it retracts from the receiving base 250 and the turntable 292. As a result, the electrode formation region R of the electronic component C becomes exposed in the enlarged portion 242a. The subsequent operation is the same as the above-described embodiment. Note that, since the electrode formation region R is exposed in the enlarged portion 252a, film formation becomes possible.

[0117] 16, when an electronic component C is inserted into a mask hole 242, the electronic component C does not protrude into the chute hole 222. Therefore, the upper end of the electronic component C does not interfere with the chute 220 in the horizontal direction, and the chute 220 and the mask 240 can be shifted without lowering the electronic component C, thereby shortening the takt time. Furthermore, the simple configuration allows for low equipment costs.

[0118] (5) In the above embodiment, the magnetic member 285a of the attraction force imparting unit 285 is a permanent magnet, but an electromagnet may also be used. In this case, there is no need to provide a mechanism for moving the magnetic member 285a toward or away from the magnet, and the magnetic attraction force can be switched on or off by turning on or off the current. Furthermore, even if the magnetic member 285a is an electromagnet, it may be combined with a mechanism for moving the magnetic member 285a toward or away from the magnet. Even in this case, the mechanism for moving the magnetic member 285a toward or away from the magnet can reliably block the influence of the magnetic force, and even a small and lightweight electronic component C can be reliably released from the attraction and holding.

[0119] The suction unit may have a suction port that sucks and holds the electronic component C by negative pressure, and a suction pipe that supplies negative pressure to the suction port. In this case, the suction force applying unit is connected to the suction pipe as a negative pressure generating circuit that applies suction force by negative pressure. This allows electronic components C that are difficult to attract by magnetic force to be attracted and held by negative pressure, and the suction is released by stopping the negative pressure, allowing the electronic component C to be supplied. The opening area of ​​the suction port is equal to or smaller than the area of ​​the smallest surface of the electronic component C. The suction port may be a number of holes formed in the suction plate, or the suction port may be covered with a breathable porous material. This makes it possible to reduce the size of the suction port and prevent the electronic component C from being sucked into the suction pipe.

[0120] (6) The film formation processing unit 3 is not limited to a device that forms a film by sputtering. It may be a device that forms the electrode E by applying a conductive material to the electrode formation region R exposed through the mask hole 242 of the mask 240, or a device that forms the electrode E by immersing the electrode formation region R in a conductive material.

[0121] It is sufficient that there is at least one compartment 225 in the chute 220. That is, there may be one or more. It is sufficient that there is at least one compartment 245 in the mask 240 and one compartment 211a in the storage section 210. That is, there may be one or more.

[0122] (7) The receiving base 250 may have a flat surface without the support portion 252. Also, the mask 240 may have only the plate body 241 without the beam portion 244 and have a flat surface. The receiving base 250 and the mask 240 may be fixed or formed integrally. The restricting portion 253 may be a member such as the pin described above or may be a wall surrounding the mask 240.

[0123] (8) The electrode formation region R may be a region at least at one end of the electronic component C, as long as it is a region electrically connected to the internal electrode En on the outer surface of the electronic component C. For example, the electrode formation region R may be a region at both ends or only one end of the electronic component C in the direction of the axis Axc. In other words, the film formation processing unit 3 may be capable of forming a film on at least one end of the electronic component C.

[0124] Furthermore, the electrode formation region R may be any part of the electronic component C, and may be, for example, a box-shaped region including the surface F of the electronic component C in the axis Axc direction, or may be only the surface F of the electronic component C in the axis Axc direction (see FIG. 1). In other words, the mask hole 242 may cover only a part of the electronic component C, and in particular may cover part or all of the side surface (surface along the axis Axc) of the electronic component C. When the mask hole 242 covers the entire side surface of the electronic component C, the electronic component C is held in the mask hole 242 with only the surface F perpendicular to the axis Axc exposed.

[0125] [Other embodiments] Although the embodiments of the present invention and modifications of each part have been described above, these embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be embodied in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. These embodiments and modifications are included within the scope and spirit of the invention, and are also included in the invention described in the claims. [Explanation of symbols]

[0126] 1 Film deposition equipment 2 Feeding device 3. Film forming processing section 4. Control device 31 Chamber 32 Conveyor 33 Pretreatment section 34, 35 Film forming section 210 Storage unit 211 Container Section 211a 211b Slope 212 Support stand 212a Legs 220 shots 221 Plate 222 Shooting hole 223 Bulkhead 225 plots 230 Vibration mechanism 231 Shaking Table 231b Receiving hole 232 Foundation 240 Mask 241 Plate 242 Mask hole 243 Restriction hole 244 Beam section 245 plots 250 cradles 251 Plate 252 Support part 253 Regulatory Department 260, 500, 600 interval adjustment section 261 Pusher 261a Mounting table 261b shaft 261c Support part 261d Guide 261e Movable body 262 Power Source 270 Moving mechanism 280 Removal mechanism 281 Pickup mechanism 282 Guidance mechanism 283 Mobile 284 Adsorption part 284a Suction plate 284b Support plate 284c strut 285 Adsorption force applying part 285a Magnetic members 285b Holding plate 285c Approach / separation mechanism 286 Pillar section 287 Arm 288 Guide section 290 Conveying mechanism 291 Motor 292 Rotating Table 292a Retaining hole 311 Exhaust section 321 Rotating Table 322 Power Source 323 Sealing body 324 Pusher 331 Processing Room 341, 351 Deposition chamber 342, 352 targets

Claims

1. a chute having a plurality of chute holes through which electronic components having one end and the other end can pass one by one; a mask having a mask hole on which the chute is placed, into which the electronic component is inserted through the chute hole, and which covers a part of the electronic component; a receiving base that holds the mask and that contacts one end of the electronic component inserted into the mask hole; a moving mechanism that moves the chute and the mask relatively so that the chute hole and the mask hole at least partially overlap and the axis of the chute hole and the axis of the mask hole are misaligned, in a state where the other end of the electronic component inserted into the mask hole does not interfere with the chute; a removal mechanism that removes, from the chute, the electronic components other than the electronic components inserted into the mask holes while the axes of the chute holes and the mask holes are misaligned; A feeding device having:

2. 2. The supply device according to claim 1, further comprising a gap adjusting section for adjusting the gap between the opposing surfaces of the chute and the mask, thereby preventing the other end of the electronic component from interfering with the chute.

3. 3. The supply device according to claim 2, wherein the distance between the chute and the mask when the distance adjustment unit moves the chute and the mask relative to each other in the axial direction of the chute hole is equal to or greater than the axial length of the electrode formation region of the electronic component inserted into the mask hole and equal to or less than the axial length of the electronic component.

4. 2. The supplying device according to claim 1, wherein both ends of the mask hole are enlarged.

5. 2. The supply device according to claim 1, wherein the removal mechanism has a suction portion that sucks and holds the electronic component.

6. The adsorption unit is an adsorption plate onto which the electronic component is adsorbed; an adsorption force imparting unit that imparts an adsorption force to the adsorption plate; and 6. The supply device according to claim 5, wherein the attraction force applying section has a magnetic member and a contact / separation mechanism that attracts and releases the electronic component by moving the magnetic member and the attraction plate relative to each other.

7. a housing portion that houses a plurality of the electronic components; 2. The supply device according to claim 1, wherein the removal mechanism includes a guide mechanism for transferring the electronic components between the storage section and the chute.

8. A supply device according to any one of claims 1 to 7; a film forming processing unit that forms a film on the electronic component; A film forming apparatus comprising:

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