Laminate-type electronic component

Abstract

To provide a laminate-type electronic component which can increase in a capacity per unit volume and reliability, and minimize a mounting space.SOLUTION: A laminate-type electronic component comprises: a main body including dielectric layers, and first and second internal electrodes; a first external electrode including a first connection part disposed on the third face of the main body, and a first band part extending from the first connection part to part of the first face; a second external electrode including a second connection part disposed on the fourth face, and a second band part extending from the second connection part to part of the first face; an insulation layer; a first plating layer; and a second plating layer. The plating layer is disposed so as to extend to part of tops of the first and second connection parts. The following relation is satisfied: H1>H2, where H1 is an average size from the first face to an internal electrode of the first and second internal electrodes, which is located the closest to the first face in a first direction, and H2 is an average size from an extension line of the first face to an end of the plating layer disposed over the first and second connection parts in the first direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Such multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to implement. As various electronic devices such as computers and mobile devices become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] Furthermore, with the recent increase in industry interest in automotive electronic components, multilayer ceramic capacitors are also being used in automobiles and infotainment systems, and therefore high reliability characteristics are required.

[0005] To miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to form the internal electrodes and dielectric layers thinly and increase the number of layers. This requires minimizing the volume of parts that do not affect capacitance formation and increasing the effective volume fraction necessary to achieve the required capacitance.

[0006] Furthermore, in order to mount as many components as possible within the limited area of ​​the circuit board, it is necessary to minimize the mounting space.

[0007] Furthermore, as multilayer ceramic capacitors become smaller and their capacitance increases, the margin thickness decreases, making it easier for moisture or plating solutions to penetrate from the outside, which can weaken their reliability. Therefore, there is a need for a method to protect multilayer ceramic capacitors from the penetration of moisture or plating solutions from the outside. [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] One of several objectives of the present invention is to provide a stacked electronic component with improved capacity per unit volume.

[0009] One of the several objectives of the present invention is to provide a stacked electronic component with improved reliability.

[0010] One of the several objectives of the present invention is to provide a stacked electronic component that can minimize the mounting space.

[0011] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0012] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer in between, a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, a first external electrode including a first connecting portion arranged on the third surface and a first band portion extending from the first connecting portion to a part of the first surface, a second external electrode including a second connecting portion arranged on the fourth surface and a second band portion extending from the second connecting portion to a part of the first surface, and the second The material includes an insulating layer disposed on a surface and extending to a portion of the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion, wherein the insulating layer contains a polymer resin, and the plating layers extend to a portion of the first and second connection portions, and when H1 is the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes, and H2 is the average size in the first direction from the extension line of the first surface to the edge of the plating layer disposed on the first and second connection portions, the condition H1 > H2 can be satisfied.

[0013] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer interposed therebetween, and has a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface facing each other in a second direction and connected to the first and second surfaces, and a fifth surface and a sixth surface facing each other in a third direction and connected to the first to fourth surfaces. The multilayer electronic component further includes a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a part of the first surface, a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface, an insulating layer disposed on the second surface and extending to a part of the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer contains a polymer resin, the plating layers extend to a part of the first and second connection portions, and when an average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and an average size in the first direction from an extension line of the first surface to an end of the plating layer disposed on the first and second connection portions is H2, H1 < H2 can be satisfied.

[0014] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer interposed therebetween, and has a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface facing each other in a second direction and connected to the first and second surfaces, and a fifth surface and a sixth surface facing each other in a third direction and connected to the first to fourth surfaces. The multilayer electronic component further includes a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a part of the first surface, a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface, an insulating layer disposed so as to entirely cover the second surface and extending to a part of the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer can contain a polymer resin.

[0015] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer in between, and comprises a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode including a first connection portion arranged on the third surface and a first band portion extending from the first connection portion to a part of the first surface; a second external electrode including a second connection portion arranged on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface; an insulating layer extending to a part of the first and second connection portions; a first plating layer arranged on the first band portion; and a second plating layer arranged on the second band portion, wherein the first and second external electrodes are arranged below the extension line of the second surface, and the insulating layer may include a polymer resin. [Effects of the Invention]

[0016] One of the various effects of the present invention is that by placing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, the reliability of the multilayer electronic component is improved while increasing the capacitance per unit volume.

[0017] One of the various effects of this invention is that it minimizes the mounting space for stacked electronic components.

[0018] One of the various effects of this invention is that the inclusion of a polymer resin in the insulating layer suppresses the occurrence of cracks.

[0019] However, the diverse yet significant advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0020] [Figure 1] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 2]It is a perspective view schematically showing the main body of the multilayer electronic component of FIG. 1. [Figure 3] It is a cross-sectional view taken along the line I-I' of FIG. 1. [Figure 4] It is an exploded perspective view schematically showing the main body of FIG. 2 disassembled. [Figure 5] It is a perspective view schematically showing the substrate on which the multilayer electronic component of FIG. 1 is mounted. [Figure 6] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 7] It is a cross-sectional view taken along the line II-II' of FIG. 6. [Figure 8] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 9] It is a cross-sectional view taken along the line III-III' of FIG. 8. [Figure 10] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 11] It is a cross-sectional view taken along the line IV-IV' of FIG. 10. [Figure 12] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 13] It is a cross-sectional view taken along the line V-V' of FIG. 12. [Figure 14] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 15] It is a cross-sectional view taken along the line VI-VI' of FIG. 14. [Figure 16] It shows a modified example of FIG. 14. [Figure 17] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 18] It is a cross-sectional view taken along the line VII-VII' of FIG. 17. [Figure 19] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 20] It is a cross-sectional view taken along the line VIII-VIII' of FIG. 19. [Figure 21] This shows a modified version of Figure 19. [Figure 22] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 23] This is a cross-sectional view along the line IX-IX' in Figure 22. [Figure 24] This shows a modified version of Figure 22. [Figure 25] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 26] This is a cross-sectional view along the line X-X' in Figure 25. [Figure 27] This shows a modified version of Figure 25. [Figure 28] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 29] This is a cross-sectional view along the line XI-XI' in Figure 28. [Figure 30] This shows a modified version of Figure 28. [Figure 31] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 32] This is a cross-sectional view along the line XII-XII' in Figure 31. [Figure 33] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 34] This is a cross-sectional view along the line XIII-XIII' in Figure 33. [Figure 35] This shows a modified version of Figure 33. [Figure 36] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 37] This is a cross-sectional view along the line XIV-XIV' in Figure 36. [Figure 38] This is a magnified view of the K1 region in Figure 36. [Modes for carrying out the invention]

[0021] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0022] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are shown arbitrarily for the convenience of explanation; therefore, the present invention is not necessarily limited by the illustrations. Also, components that have the same function within the scope of the same idea are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, unless otherwise stated to the contrary, it does not mean that other components are excluded, but rather that other components may be further included.

[0023] In drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0024] Figure 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention; Figure 2 is a schematic perspective view of the main body of the stacked electronic component in Figure 1; Figure 3 is a cross-sectional view along the line I-I' in Figure 1; Figure 4 is an exploded perspective view of the main body in Figure 2; and Figure 5 is a schematic perspective view of a substrate on which the stacked electronic component in Figure 1 is mounted.

[0025] A stacked electronic component 1000 according to one embodiment of the present invention will be described below with reference to Figures 1 to 5.

[0026] A stacked electronic component 1000 according to one embodiment of the present invention includes a dielectric layer 111, first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, a body 110 including first and second surfaces 1 and 2 facing in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in a third direction, and a first connecting portion 131a located on the third surface and a first connecting portion extending from the first connecting portion to a part of the first surface The device includes a first external electrode 131 including a band portion 131b, a second external electrode 132 including a second connecting portion 132a disposed on the fourth surface and a second band portion 132b extending from the second connecting portion to a part of the first surface, an insulating layer 151 disposed on the second surface and extending to a part of the first and second connecting portions, a first plating layer 141 disposed on the first band portion 131b and a second plating layer 142 disposed on the second band portion 132b, wherein the insulating layer may contain a polymer resin.

[0027] The main body 110 has dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0028] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be hexahedral or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 may not be a perfectly straight hexahedron, but may be substantially hexahedral.

[0029] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0030] In one embodiment, the main body 110 includes a first-to-third corner connecting the first and third surfaces, a first-to-fourth corner connecting the first and fourth surfaces, a second-to-third corner connecting the second and third surfaces, and a second-to-fourth corner connecting the second and fourth surfaces. The first-to-third corner and the second-to-third corner have a shape that contracts towards the center of the main body in the first direction as they approach the third surface, and the first-to-fourth corner and the second-to-fourth corner can have a shape that contracts towards the center of the main body in the first direction as they approach the fourth surface.

[0031] As margin regions where internal electrodes 121 and 122 are not placed overlap on the dielectric layer 111, steps are generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to fifth surfaces and / or the second surface with the third to fifth surfaces may have a form that is contracted toward the center of the body 110 in the first direction with respect to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center of the body 110 in the first direction with respect to the first or second surface. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces.

[0032] The above-mentioned corners may include the 1st-3rd corner connecting the 1st and 3rd faces, the 1st-4th corner connecting the 1st and 4th faces, the 2nd-3rd corner connecting the 2nd and 3rd faces, and the 2nd-4th corner connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. The 1st to 6th faces of the main body 110 can be generally flat, and any non-flat areas can be considered corners. Hereinafter, the extension of each face may mean a line extended from the flat portion of each face.

[0033] In this case, the regions of the external electrodes 131 and 132 located on the corners of the main body 110 can be designated as corner portions, the regions located on the third and fourth surfaces of the main body 110 can be designated as connecting portions, and the regions located on the first and second surfaces of the main body can be designated as band portions.

[0034] On the other hand, in order to suppress the step caused by the internal electrodes 121 and 122, if the internal electrodes are cut after lamination so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portion connecting the first surface with the fifth and sixth surfaces, and the portion connecting the second surface with the fifth and sixth surfaces, may not have a contracted form.

[0035] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0036] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. As an example of the ceramic powder, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-dissolved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0037] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw material for forming the dielectric layer 111, such as powder of barium titanate (BaTiO3), according to the purpose of the present invention.

[0038] On the other hand, the average thickness td of the dielectric layer is not particularly limited.

[0039] However, generally when the dielectric layer is formed thinly with a thickness of less than 0.6 μm, especially when the thickness of the dielectric layer is 0.35 μm or less, there is a risk of reduced reliability.

[0040] According to an embodiment of the present invention, by disposing an insulating layer containing a polymer resin on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, it is possible to prevent moisture penetration from the outside, penetration of the plating solution, etc., and improve reliability. Therefore, excellent reliability can be ensured even when the average thickness td of the dielectric layer 111 is 0.35 μm or less.

[0041] Therefore, the reliability improvement effect according to the present invention can be more pronounced when the average thickness td of the dielectric layer 111 is 0.35 μm or less.

[0042] The average thickness td of the dielectric layer 111 can refer to the average thickness of the dielectric layer 111 that is placed between the first and second internal electrodes 121 and 122.

[0043] The average thickness of the dielectric layer 111 can be measured by scanning an image of the cross-section of the main body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one dielectric layer can be measured at 30 equally spaced points along its length from the scanned image, and the average value can be calculated. These 30 equally spaced points can be specified by the capacitance formation section Ac. Furthermore, by extending this average value measurement to 10 dielectric layers and measuring the average values, the average thickness of the dielectric layers can be further generalized.

[0044] The main body 110 may include a capacitance forming section Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged to face each other with a dielectric layer 111 in between, and cover sections 112 and 113 which are formed on the upper and lower parts of the capacitance forming section Ac in the first direction.

[0045] Furthermore, the capacitance-forming portion Ac is a part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0046] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume-forming portion Ac in the first direction and a lower cover portion 113 positioned below the volume-forming portion Ac in the first direction.

[0047] The upper cover portion 112 and the lower cover portion 113 described above can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0048] The upper cover portion 112 and the lower cover portion 113 described above do not include internal electrodes and may contain the same material as the dielectric layer 111.

[0049] In other words, the upper cover portion 112 and the lower cover portion 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0050] On the other hand, the average thickness of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacity of the stacked electronic component, the average thickness tc of the cover portions 112 and 113 can be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging an insulating layer containing a polymer resin on the connection portion of the external electrode and arranging a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average thickness tc of the cover portions 112 and 113 is 15 μm or less, excellent reliability can be ensured.

[0051] The average thickness tc of the cover portions 112 and 113 can represent the average size in the first direction, and can be the average value of the first-direction sizes of the cover portions 112 and 113 measured at five equally spaced points on the upper or lower part of the volume-forming portion Ac.

[0052] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0053] The margin portions 114 and 115 may include the margin portion 114 located on the fifth surface 5 and the margin portion 115 located on the sixth surface 6 of the main body 110. That is, the margin portions 114 and 115 can be located on both end surfaces in the width direction of the main body 110.

[0054] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first and second internal electrodes 121 and 122 and the body 110 in a cross-section of the main body 110 cut in the width-thickness (WT) direction.

[0055] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0056] The margin portions 114 and 115 can be formed by applying a conductive paste to the ceramic green sheet and forming internal electrodes, except where the margin portions are formed.

[0057] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after lamination the internal electrodes are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115.

[0058] On the other hand, the average width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average width of the margin portions 114 and 115 can be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging an insulating layer containing a polymer resin on the connection portion of the external electrode and arranging a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average width of the margin portions 114 and 115 is 0.35 μm or less, excellent reliability can be ensured.

[0059] The average width of the margin portions 114 and 115 can represent the average size in the third direction, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the volume forming portion Ac.

[0060] The internal electrodes 121 and 122 are stacked alternately with the dielectric layer 111.

[0061] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are arranged alternately facing each other with the dielectric layer 111 constituting the main body 110 in between, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0062] Referring to Figure 3, the first internal electrode 121 can be separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0063] In other words, the first internal electrode 121 is connected to the first external electrode 131 but not to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 but not to the first external electrode 131. Therefore, the first internal electrode 121 can be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance apart on the third surface 3.

[0064] In this case, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by the dielectric layer 111 placed in between them.

[0065] The main body 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0066] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0067] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following on a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The printing method for the conductive paste for internal electrodes can be screen printing or gravure printing, and the present invention is not limited to these methods.

[0068] On the other hand, the average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited.

[0069] However, when the internal electrode is formed thinly with a thickness of less than 0.6 μm, especially when the thickness of the internal electrode is 0.35 μm or less, reliability may be reduced.

[0070] According to one embodiment of the present invention, by placing an insulating layer containing a polymer resin on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of plating solution, thereby improving reliability. This ensures excellent reliability even when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less.

[0071] Therefore, when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, the effects of the present invention become more pronounced, and miniaturization and increased capacitance of the stacked electronic component can be achieved more easily.

[0072] The average thickness of the internal electrodes 121 and 122 can be measured by scanning an image of the cross-section of the main body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one internal electrode can be measured at 30 equally spaced points in the length direction from the scanned image, and the average value can be calculated. These 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes and measuring the average value, the average thickness of the internal electrodes can be further generalized.

[0073] External electrodes 131 and 132 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0074] The external electrodes 131 and 132 may include a first external electrode 131 which includes a first connecting portion 131a located on the third surface and a first band portion 131b extending from the first connecting portion to a part of the first surface, and a second external electrode 132 which includes a second connecting portion 132a located on the fourth surface and a second band portion 132b extending from the second connecting portion to a part of the first surface. The first connecting portion 131a can be connected to the first internal electrode 121 on the third surface, and the second connecting portion 132a can be connected to the second internal electrode 122 on the fourth surface.

[0075] Furthermore, the first external electrode 131 may include a third band portion 131c extending from the first connection portion 131a to a part of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connection portion 132a to a part of the second surface. In addition, the first external electrode 131 may include side band portions extending from the first connection portion 131a to parts of the fifth and sixth surfaces, and the second external electrode 132 may include side band portions extending from the second connection portion 132a to parts of the fifth and sixth surfaces.

[0076] However, the third, fourth, and side band portions may not be essential components of the present invention. The first and second external electrodes 131 and 132 may not be positioned on the second surface, nor on the fifth and sixth surfaces. By not positioning the first and second external electrodes 131 and 132 on the second surface, they can be positioned below the extension of the second surface of the main body. Furthermore, the first and second connecting portions 131a and 132a can be positioned at a distance from the fifth and sixth surfaces, and the first and second connecting portions 131a and 132a can be positioned at a distance from the second surface. Also, the first and second band portions 131b and 132b can be positioned at a distance from the fifth and sixth surfaces.

[0077] On the other hand, when the first and second external electrodes 131 and 132 include the third and fourth band portions 131c and 132c, the diagram shows that an insulating layer is placed on the third and fourth band portions 131c and 132c. However, the diagram is not limited to this, and a plating layer can be placed on the third and fourth band portions 131c and 132c to improve ease of mounting. Furthermore, the first and second external electrodes 131 and 132 may include the third and fourth band portions 131c and 132c but not the side band portions. In this case, the first and second connecting portions 131a and 132a, and the first to fourth band portions 131a, 132b, 131c, and 132c may be separated from the fifth and sixth surfaces.

[0078] In this embodiment, a structure is described in which the stacked electronic component 1000 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be changed depending on the form of the internal electrodes 121 and 122 or other purposes.

[0079] On the other hand, the external electrodes 131 and 132 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0080] The external electrodes 131 and 132 can be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0081] Furthermore, the external electrodes 131 and 132 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. In addition, the external electrodes 131 and 132 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0082] The conductive metal included in the external electrodes 131 and 132 can be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 131 and 132 can include one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121 and 122 which contain Ni.

[0083] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a.

[0084] Since the first and second connection parts 131a and 132a are connected to the internal electrodes 121 and 122, they serve as pathways for the penetration of plating solution during the plating process or for moisture penetration during actual use. In this invention, since an insulating layer 151 is placed on the connection parts 131a and 132a, it is possible to prevent the penetration of moisture or plating solution from the outside.

[0085] The insulating layer 151 can be positioned in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 may be in contact with the first and second plating layers 141 and 142 in a manner that partially covers their edges, or the first and second plating layers 141 and 142 may be in contact with the insulating layer 151 in a manner that partially covers their edges.

[0086] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a and positioned to cover the second surface and the third and fourth band portions 131c and 132c. In this case, the insulating layer 151 can be positioned to cover the area of ​​the second surface where the third and fourth band portions 131c and 132c are not located, and the third and fourth band portions 131c and 132c themselves. This allows the insulating layer 151 to cover the area where the ends of the third and fourth band portions 131c and 132c are in contact with the main body 110, thereby blocking the moisture penetration path and further improving moisture resistance reliability.

[0087] The insulating layer 151 can be positioned on the second surface and extend to the first and second connection portions 131a and 132a. Alternatively, if the external electrodes 131 and 132 are not positioned on the second surface, the insulating layer can be positioned to completely cover the second surface. On the other hand, the insulating layer 151 does not necessarily have to be positioned on the second surface; it may be positioned on only part or all of the second surface, and the insulating layer may be separated into two parts and positioned on the first and second connection portions 131a and 132a, respectively. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension of the second surface. Furthermore, even if the insulating layer is not positioned on the second surface, it can extend over the first and second connection portions 131a and 132a to form a single insulating layer on the fifth and sixth surfaces.

[0088] Furthermore, the insulating layer 151 can be positioned to cover the first and second side band portions, and parts of the fifth and sixth surfaces. In this case, parts of the fifth and sixth surfaces not covered by the insulating layer 151 can be exposed to the outside.

[0089] Furthermore, the insulating layer 151 can be arranged to cover the first and second side band portions, the fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, improving moisture resistance reliability, and the connection portions 131a and 132a are not directly exposed to the outside, improving the reliability of the laminated electronic component 1000. More specifically, the insulating layer can cover the first and second side band portions, and cover all areas of the fifth and sixth surfaces except for the areas where the first and second side band portions are formed.

[0090] The insulating layer 151 can prevent the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the insulating layer 151 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside.

[0091] The insulating layer 151 may contain a polymer resin.

[0092] Conventionally, glass-based materials were generally used for the insulating layer. However, due to the characteristics of the glass series, excessive aggregation occurred during sintering, making it difficult to form a uniform film. Furthermore, the heat required during the sintering process generated stress within the main body, potentially causing cracks or delamination. In addition, when using an insulating layer containing glass-based materials, a method was employed in which the insulating layer containing the glass-based material was fired after the external electrodes. However, during the firing process of the insulating layer, there was a risk of radial cracks occurring as the metallic material of the external electrodes diffused into the internal electrodes. Moreover, because the glass series generally has hard properties, there was a risk of it breaking even with small impacts.

[0093] This invention aims to solve the problems associated with glass-based insulating layers by applying a polymer resin instead of a glass-based insulating layer. Polymer resins offer superior impact resistance compared to glass-based materials and can be cured at low temperatures, thus suppressing cracks caused by thermal shrinkage and radial cracks caused by metal diffusion. Furthermore, polymer resins offer significant advantages over glass-based materials in terms of cost and supply.

[0094] There is no particular limit to the type of polymer resin. For example, the polymer resin can be one or more selected from epoxy resins, acrylic resins, ethyl cellulose, etc.

[0095] The polymer resin content in the insulating layer 151 can be 10 wt% or more. If the polymer resin content is less than 10 wt%, it may be vulnerable to external impacts. On the other hand, there is no particular upper limit to the polymer resin content in the insulating layer 151, and the insulating layer 151 can consist of polymer resin after removing impurities.

[0096] In one embodiment, the insulating layer 151 may contain, in addition to the polymer resin, one or more ceramic additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. Since the ceramic additive has excellent bonding strength with the dielectric material contained in the main body 110 and the glass contained in the external electrodes 131 and 132, it can improve the bonding strength between the main body 110 and the external electrodes 131 and 132.

[0097] In this case, the ceramic additive content can be 10 wt% or less (excluding 0 wt%). If the ceramic additive content exceeds 10 wt%, the multilayer electronic component may be vulnerable to external impacts and have reduced strength.

[0098] The method for forming the insulating layer 151 is not particularly limited. For example, after forming external electrodes 131 and 132 on the main body 110, the insulating layer 151 can be formed by printing a polymer resin, transferring a polymer resin made from a sheet, or dipping it in a paste containing a polymer resin. Alternatively, the insulating layer 151 can be formed by applying one or more of the above methods.

[0099] In one embodiment, the insulating layer 151 is arranged in direct contact with the first and second external electrodes 131 and 132, and the first and second external electrodes 131 and 132 may include conductive metal and glass. As a result, the plating layers 141 and 142 may not be placed in the area of ​​the outer surface of the first and second external electrodes 131 and 132 where the insulating layer 151 is located, thereby effectively suppressing erosion of the external electrodes by the plating solution.

[0100] In this case, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is placed on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is placed on the second external electrode 132. By forming the insulating layer 151 first before forming the plating layers 141 and 142 on the external electrodes 131 and 132, the penetration of the plating solution during the plating layer formation process can be suppressed more reliably. By forming the insulating layer before the plating layer, the plating layers 141 and 142 can have a configuration that covers the end of the insulating layer 151.

[0101] The first and second plating layers 141 and 142 can be placed on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 can improve mounting characteristics, and by placing the plating layers 141 and 142 on the band portions 131b and 132b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 141 and 142 can be in contact with the first surface, and the other end can be in contact with the insulating layer 151.

[0102] The types of plating layers 141 and 142 are not particularly limited and can be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and can be formed in multiple layers.

[0103] To give a more specific example for the plating layers 141 and 142, the plating layers 141 and 142 can be Ni plating layers or Sn plating layers, and can be in a configuration in which the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band portions 131b and 132b.

[0104] In one embodiment, the first and second plating layers 141 and 142 can be arranged to extend so as to partially cover the first and second connection portions 131a and 132a, respectively. When H1 is the average size in the first direction from the first internal electrodes 121 and 122 to the internal electrode closest to the first surface 1, and H2 is the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connection portions 131a and 132a, it is possible to satisfy H1 > H2. This makes it possible to suppress the penetration of the plating solution into the internal electrodes during the plating process and improve reliability. Furthermore, when mounting the multilayer electronic component on a substrate, it is possible to prevent the formation of excessive solder fillets and minimize the mounting space.

[0105] H1 and H2 can be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the average of values ​​measured at the point in each cross-section where the internal electrode closest to the first surface 1 is connected to the external electrode, and H2 can be the average of values ​​measured with reference to the edge of the plating layer in contact with the external electrode, and the extension line of the first surface used as a reference when measuring H1 and H2 can be the same.

[0106] In one embodiment, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is located on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0107] In one embodiment, the insulating layer 151 can be positioned to cover the end of the first plating layer 141 that is located on the first external electrode 131, and the insulating layer 151 can be positioned to cover the end of the second plating layer 142 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0108] In one embodiment, when the average size of the main body 110 in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0109] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, leakage current may occur between the first band portion 131b and the second band portion 132b under high voltage current, and the first band portion 131b and the second band portion 132b may become electrically connected due to plating diffusion during the plating process.

[0110] B1, B2, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0111] Referring to Figure 5, which shows a mounting substrate 1100 on which a multilayer electronic component 1000 is mounted, the plating layers 141 and 142 of the multilayer electronic component 1000 can be joined by electrode pads 181 and 182 and solder 191 and 192 placed on the substrate 180.

[0112] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0113] There is no particular limit to the size of the 1000 multilayer electronic component.

[0114] However, in order to achieve both miniaturization and high capacitance simultaneously, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, the effects of the present invention on improving reliability and capacitance per unit volume can be more pronounced in a stacked electronic component 1000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0115] Therefore, considering manufacturing tolerances, external electrode size, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 1000 refers to the second-direction size of the stacked electronic component 1000, and the width of the stacked electronic component 1000 refers to the third-direction size of the stacked electronic component 1000.

[0116] Figure 6 is a schematic perspective view of a stacked electronic component 1001 according to one embodiment of the present invention, and Figure 7 is a cross-sectional view along the line II-II' in Figure 6.

[0117] Referring to Figures 6 and 7, in the stacked electronic component 1001 according to one embodiment of the present invention, the first and second plating layers 141-1 and 142-1 can be positioned below the extension line of the first surface. This minimizes the height of the solder during mounting and minimizes the mounting space.

[0118] Furthermore, the insulating layer 151-1 can be positioned to extend below the extension line of the first surface and be in contact with the first and second plating layers 141-1 and 142-1.

[0119] Figure 8 is a schematic perspective view of a stacked electronic component 1002 according to one embodiment of the present invention, and Figure 9 is a cross-sectional view along the line III-III' in Figure 8.

[0120] Referring to Figures 8 and 9, the stacked electronic component 1002 according to one embodiment of the present invention may further include an additional insulating layer 161 disposed on the first surface 1 and positioned between the first band portion 131b and the second band portion 132b. This makes it possible to prevent leakage currents and the like that may occur between the first band portion 131b and the second band portion 132b under high voltage current.

[0121] The type of additional insulating layer 161 is not particularly limited. For example, it can contain a polymer resin, similar to the insulating layer 151. For example, the polymer resin can be one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc. In addition, the additional insulating layer 161 can contain one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc., in addition to the polymer resin. This can improve the bonding strength with the main body or external electrodes. On the other hand, the additional insulating layer 161 and the insulating layer 151 do not need to be formed from the same material and can be formed from different materials.

[0122] Figure 10 is a schematic perspective view of a stacked electronic component 1003 according to one embodiment of the present invention, and Figure 11 is a cross-sectional view along the line IV-IV' in Figure 10.

[0123] Referring to FIGS. 10 and 11, in a stacked electronic component 1003 according to an embodiment, the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2. When H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0124] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0125] H1, H2, and T can be values obtained by averaging the values measured in a cross-section (L-T cross-section) obtained by cutting the main body 110 at five points having equal intervals in the third direction in the first and second directions. H1 can be a value obtained by averaging the values measured at the point where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross-section, and H2 can be a value obtained by averaging the values measured based on the end of the plating layer in contact with the external electrode in each cross-section. The extension line of the first surface used as a reference during the measurement of H1 and H2 can be the same. Also, T can be an average value after measuring the maximum size in the first direction of the main body 110 in each cross-section.

[0126] FIG. 12 is a perspective view schematically showing a stacked electronic component 1004 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along the line V-V' of FIG. 12.

[0127] Referring to FIGS. 12 and 13, in a stacked electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 can be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 can be longer than the average length B4 of the fourth band portion 132c-4. As a result, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0128] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0129] At this time, when the average size of the main body 110 in the second direction is L, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0130] B1, B2, B3, B4, and L can be values obtained by averaging the values measured in a cross-section (L-T cross-section) obtained by cutting the main body in the first and second directions at five points having equal intervals in the third direction.

[0131] In addition, the first external electrode 131-4 can include a first side surface band portion extending from the first connection portion 131a-4 to a part of the fifth and sixth surfaces, and the second external electrode 132-4 can include a second side surface band portion extending from the second connection portion 132a-4 to a part of the fifth and sixth surfaces. At this time, the second direction size of the first and second side surface band portions can gradually increase as it approaches the first surface. That is, the first and second side surface band portions can be arranged in a tapered shape or a trapezoidal shape.

[0132] Furthermore, when B3 is the average size in the second direction from the extension of the third surface to the end of the third band portion 141c-4, B4 is the average size in the second direction from the extension of the fourth surface to the end of the fourth band portion 142c-4, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This makes it possible to minimize the volume occupied by the external electrodes and increase the capacity per unit volume of the stacked electronic component 1004.

[0133] The above G1 and G2 can be defined as follows: In a cross-section obtained by cutting the main body from the center in the third direction in the first and second directions, G1 is the average value of the second-direction size measured for any five second internal electrodes located in the center of the first direction, with the distance to the third surface being measured; and G2 is the average value of the second-direction size measured for any five first internal electrodes located in the center of the first direction, with the distance to the fourth surface being measured.

[0134] Furthermore, the method can be further generalized by determining G1 and G2 from cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​as G1 and G2.

[0135] However, the present invention is not intended to be limited to B3≦G1 and B4≦G2, and a case satisfying B3≧G1 and B4≧G2 can also be included in one embodiment of the present invention. Therefore, in one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3≧G1 and B4≧G2 can be satisfied.

[0136] In one embodiment, when B1 is the average size in the second direction from the extension line of the third surface E3 to the end of the first band portion, and B2 is the average size in the second direction from the extension line of the fourth surface to the end of the second band portion, B1≧G1 and B2≧G2 can be satisfied. This makes it possible to improve the bonding strength of the multilayer electronic component 1004 to the substrate 180.

[0137] Figure 14 is a schematic perspective view of a stacked electronic component 1005 according to one embodiment of the present invention, and Figure 15 is a cross-sectional view along the line VI-VI' in Figure 14.

[0138] Referring to Figures 14 and 15, the first and second external electrodes 131-5 and 312-5 of the stacked electronic component 1005 according to one embodiment of the present invention may not be arranged on the second surface, but rather on the third, fourth, and first surfaces, forming an L-shape. That is, the first and second external electrodes 131-5 and 132-5 may be arranged below the extension of the second surface.

[0139] The first external electrode 131-5 may include a first connection portion 131a-5 located on the third surface 3 and a first band portion 131b-5 extending from the first connection portion 131a-5 to a part of the first surface 1. The second external electrode 132-5 may include a second connection portion 132a-5 located on the fourth surface 4 and a second band portion 132b-5 extending from the second connection portion 132a-5 to a part of the first surface 1. The external electrodes 131-5 and 132-5 may not be located on the second surface 2, and the insulating layer 151-5 may be arranged to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby improving the capacitance per unit volume of the multilayer electronic component 1005.

[0140] A first plating layer 141-5 is placed on the first band portion 131b-5, and a second plating layer 142-5 is placed on the second band portion 132b-5. The first and second plating layers 141-5 and 142-5 can extend to a portion of the first and second connecting portions 132a-5 and 132b-5.

[0141] At this time, the external electrodes 131-5 and 132-5 may not be arranged on the fifth and sixth surfaces 5 and 6. That is, the external electrodes 131-5 and 132-5 may have a form arranged only on the third, fourth, and first surfaces.

[0142] When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 arranged on the first and second connection portions 131a-5 and 132a-5 is H2, H1 < H2 can be satisfied. Thereby, the area contacting the solder during mounting can be increased to improve the fixing strength, and an increase in the ESR (Equivalent Series Resistance) due to an increase in the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5 can be suppressed.

[0143] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0144] Also, the first and second plating layers 141-5 and 142-5 can be arranged to cover a part of the insulating layer 151-1 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged to cover the ends of the insulating layer 151-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened to improve the reliability of the multilayer electronic component 1005.

[0145] Furthermore, the insulating layer 151-5 can be positioned so as to cover a portion of the first and second plating layers 141-5 and 142-5 on its third and fourth surfaces. That is, the insulating layer 151-5 can be positioned so as to cover the edges of the plating layers 141-5 and 142-5 on its third and fourth surfaces. This strengthens the bonding force between the insulating layer 151-5 and the plating layers 141-5 and 142-5, thereby improving the reliability of the multilayer electronic component 1005.

[0146] Figure 16 shows a modified example of Figure 14. Referring to Figure 16, in a modified example 1006 of the stacked electronic component 1005 according to one embodiment of the present invention, a first additional electrode layer 134 can be arranged between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 can be arranged between the second connection portion 132a-6 and the fourth surface. The first additional electrode layer 134 can be arranged within a range that does not deviate from the third surface, and the second additional electrode layer 135 can be arranged within a range that does not deviate from the fourth surface. The first and second additional electrode layers 134 and 135 can improve the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131-6 and 132-6, and can play a role in improving the mechanical coupling force of the external electrodes 131-6 and 132-6 by providing excellent coupling force with the external electrodes 131-6 and 132-6.

[0147] The first and second external electrodes 131-6 and 132-6 may have an L-shape in which the first and second external electrodes are not positioned on the second surface.

[0148] The first external electrode 131-6 may include a first connecting portion 131a-6 disposed on the first additional electrode layer 134 and a first band portion 131b-6 extending from the first connecting portion 131a-6 to a part of the first surface 1, and the second external electrode 132-6 may include a second connecting portion 132a-6 disposed on the second additional electrode layer 135 and a second band portion 132b-6 extending from the second connecting portion 132a-6 to a part of the first surface 1.

[0149] On the other hand, the first and second additional electrode layers 131-6 and 132-6 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, the first and second additional electrode layers 131-6 and 132-6 can be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin. In addition, the first and second additional electrode layers 131-6 and 132-6 can be formed by transferring a sheet containing conductive metal onto the main body.

[0150] The conductive metals included in the first and second additional electrode layers 131-6 and 132-6 can be materials with excellent electrical conductivity, and are not particularly limited. For example, the conductive metals can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the first and second additional electrode layers 131-6 and 132-6 can contain one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121 and 122 containing Ni.

[0151] Figure 17 is a schematic perspective view of a stacked electronic component 1007 according to one embodiment of the present invention, and Figure 18 is a cross-sectional view along the line VII-VII' in Figure 17.

[0152] Referring to Figures 17 and 18, the average thickness t1 of the first and second plating layers 141-6 and 142-6 of the multilayer electronic component 1007 according to one embodiment of the present invention can be thinner than the average thickness t2 of the insulating layer 151-6.

[0153] The insulating layer 151-6 plays a role in preventing the penetration of moisture or plating solution from the outside, but its weak connectivity with the plating layers 141-6 and 142-6 can cause delamination of the plating layers 141-6 and 142-6. When the plating layers are delaminated, the adhesion strength to the substrate 180 may decrease. Here, delamination of the plating layers 141-6 and 142-6 can mean that the plating layers are partially peeled off or physically separated from the external electrodes 131-5 and 132-5. Due to the weak connectivity between the plating layers and the insulating layer, the gap at the interface between the insulating layer and the plating layer may widen, increasing the possibility of foreign matter penetration, making it more brittle to external impacts and increasing the likelihood of delamination.

[0154] According to one embodiment of the present invention, the average thickness t1 of the plating layer can be made thinner than the average thickness t2 of the insulating layer, thereby reducing the contact area between the plating layer and the insulating layer. This suppresses the occurrence of delamination and improves the adhesion strength of the multilayer electronic component 1000 to the substrate 180.

[0155] The average thickness t1 of the first and second plating layers 141-6 and 142-6 can be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5 or the first and second band portions 131b-5 and 132b-5, and the average thickness t2 of the insulating layer 151-6 can be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5.

[0156] Figure 19 is a schematic perspective view of a stacked electronic component 2000 according to one embodiment of the present invention, and Figure 20 is a cross-sectional view along the line VIII-VIII' in Figure 19.

[0157] Hereinafter, with reference to Figures 19 and 20, a stacked electronic component 2000 according to one embodiment of the present invention will be described in detail. However, any content that overlaps with the above description may be omitted to avoid redundant explanation.

[0158] A stacked electronic component 2000 according to one embodiment of the present invention includes a dielectric layer 111, first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, a body 110 including first and second surfaces 1 and 2 facing in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in the third direction, and a first connecting electrode 231a arranged on the third surface and a first band electrode arranged on the first surface and connected to the first connecting electrode The device includes a first external electrode 231 including an electrode 231b, a second external electrode 232 including a second connecting electrode 232a disposed on the fourth surface and a second band electrode 232b disposed on the first surface and connected to the second connecting electrode, a first insulating layer 251 disposed on the first connecting electrode, a second insulating layer 252 disposed on the second connecting electrode, a first plating layer 241 disposed on the first band electrode, and a second plating layer 242 disposed on the second band electrode, wherein the first and second insulating layers may contain polymer resins.

[0159] The first connecting electrode 231a can be positioned on the third surface 3 and connected to the first internal electrode 121, and the second connecting electrode 231b can be positioned on the fourth surface 4 and connected to the second internal electrode 121. In addition, a first insulating layer 251 can be positioned on the first connecting electrode 231a', and a second insulating layer 252 can be positioned on the second connecting electrode 232a.

[0160] Conventionally, when forming external electrodes, a paste containing a conductive metal was mainly used, and the exposed surface of the main body's internal electrodes was dipped into the paste. However, external electrodes formed by the dipping method may have excessive thickness in the central part in the thickness direction. Furthermore, even without this problem of thickness imbalance of external electrodes by the dipping method, since the internal electrodes are exposed on the third and fourth surfaces of the main body, the external electrodes placed on the third and fourth surfaces were formed to have a thickness of a certain level or more in order to suppress the penetration of moisture and plating solution through the external electrodes.

[0161] On the other hand, in the present invention, since insulating layers 251 and 252 are arranged on the connecting electrodes 231a and 232a, sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is reduced.

[0162] The first and second connecting electrodes 231a and 232a can be configured to correspond to the third and fourth surfaces, respectively, and the surfaces of the first and second connecting electrodes 231a and 232a facing the main body 110 can have the same area as the third and fourth surfaces of the main body 110, respectively. The first and second connecting electrodes 231a and 232a can be positioned within a range that does not deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a can be positioned so as not to extend to the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the main body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a can be positioned spaced apart from the fifth and sixth surfaces. This makes it possible to minimize the volume occupied by the external electrodes while ensuring sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232, thereby increasing the capacity per unit volume of the stacked electronic component 2000.

[0163] From this perspective, the first and second connecting electrodes 231a and 232a can be arranged at a distance from the second surface 2. That is, since the external electrodes 231 and 232 are not arranged on the second surface, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacity per unit volume of the stacked electronic component 2000 can be further increased.

[0164] However, the connecting electrodes 231a and 232a may include corner portions that extend to and are positioned on the corners of the main body 110. That is, in one embodiment, the first connecting electrode includes a corner portion that extends and is positioned on the first to third corners and the second to third corners, and the second connecting electrode may include a corner portion that extends and is positioned on the first to fourth corners and the second to fourth corners.

[0165] Furthermore, the connecting electrodes 231a and 232a can have a uniform and thin thickness compared to the external electrodes formed by the conventional dipping method.

[0166] The method for forming the connecting electrodes 231a and 232a is not particularly limited, but they can be formed, for example, by transferring sheets containing a conductive metal, an organic substance such as a binder, to the third and fourth surfaces.

[0167] The thickness of the connecting electrodes 231a and 232a is not particularly limited, but can be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a and 232a can mean the maximum thickness, and can also mean the second directional size of the connecting electrodes 231a and 232a.

[0168] In one embodiment, the first and second connecting electrodes 231a and 232a may contain the same metal as the metal contained in the internal electrodes 121 and 122, as well as glass. By including the same metal as the metal contained in the internal electrodes 121 and 122, the electrical connectivity with the internal electrodes 121 and 122 can be improved, and by including glass in the first and second connecting electrodes 231a and 232a, the bonding strength with the main body 110 and / or insulating layers 251 and 252 can be improved. In this case, the same metal as the metal contained in the internal electrodes 121 and 122 may be Ni.

[0169] The first and second insulating layers 251 and 252 are positioned on the first and second connecting electrodes 231a and 232a, respectively, and can serve to prevent the formation of a plating layer on the first and second connecting electrodes 231a and 232a. In addition, the first and second insulating layers 251 and 252 can improve sealing characteristics and minimize the penetration of moisture, plating solution, etc., from the outside.

[0170] The first and second insulating layers 251 and 252 may contain a polymer resin. The type of polymer resin is not particularly limited. For example, the polymer resin can be one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc. In one embodiment, the insulating layers 251 and 252 may contain, in addition to the polymer resin, one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. This can improve the bonding strength with the main body or external electrodes.

[0171] The method for forming the insulating layers 251 and 252 is not particularly limited, but for example, they can be formed by applying a paste containing a polymer resin or by transferring a sheet containing a polymer resin onto the connecting electrodes 231a and 232a.

[0172] The average thickness of the insulating layers 251 and 252 is not particularly limited, but can be, for example, 3 to 30 μm. Here, the average thickness of the insulating layers 251 and 252 can be said to mean the average size of the insulating layers 251 and 252 in the second direction.

[0173] The first and second band electrodes 231b and 232b can be positioned on the first surface 1 of the main body 110. The first and second band electrodes 231b and 232b can be electrically connected to the first and second internal electrodes 121 and 122, respectively, by contacting the first and second connecting electrodes 231a and 232a.

[0174] Conventional dipping methods for forming external electrodes have the problem that they are formed thickly on the third and fourth surfaces and extend partially to the first, second, fifth, and sixth surfaces, making it difficult to secure a high effective volume ratio.

[0175] On the other hand, according to one embodiment of the present invention, by arranging the first and second connecting electrodes 231a and 232a on the surface where the internal electrodes are exposed, and the first and second band electrodes 231b and 232b on the surface that is mounted on the substrate, a high effective volume ratio can be secured.

[0176] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 2000 can be horizontally mounted on the substrate so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0177] The first and second band electrodes 231b and 232b can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. For example, the first and second band electrodes 231 and 232b can be firing electrodes containing conductive metal and glass, and can be formed by applying a paste containing conductive metal and glass to the first surface of the main body, but are not limited to this, and can be a plated layer in which conductive metal is plated onto the first surface of the main body.

[0178] The conductive metals included in the first and second band electrodes 231b and 232b can be materials with excellent electrical conductivity and are not particularly limited. For example, the conductive metals can be one or more of nickel (Ni), copper (Cu), and their alloys, and may include the same metals as those included in the internal electrodes 121 and 122.

[0179] On the other hand, in one embodiment, the first external electrode 231 further includes a third band electrode (not shown) disposed on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) disposed on the second surface 2 and connected to the second connecting electrode 232a.

[0180] In one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≦G1, B2≧G2, and B4≦G2 can be satisfied. This minimizes the volume occupied by the external electrodes, increases the capacity per unit volume of the stacked electronic component 2000, and increases the contact area with solder during mounting, thereby improving the bonding strength.

[0181] However, the present invention is not intended to be limited to B1≧G1, B3≦G1, B2≧G2, and B4≦G2, and a case satisfying B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can also be included in one embodiment of the present invention. Therefore, in one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can be satisfied. This allows either the first or second surface to be used as the mounting surface, thereby improving ease of implementation.

[0182] The first and second plating layers 241 and 242 can be placed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 play a role in improving mounting characteristics. The types of the first and second plating layers 241 and 242 are not particularly limited and can be plating layers containing one or more of Ni, Sn, Pd and their alloys, and can be formed in multiple layers.

[0183] To give a more specific example for the first and second plating layers 241 and 242, the first and second plating layers 241 and 242 can be Ni plating layers or Sn plating layers, and the Ni plating layer and the Sn plating layer can be formed sequentially on the first and second band electrodes 231b and 232b.

[0184] In one embodiment, the first and second plating layers 241 and 242 can be arranged to extend so as to partially cover the first and second connecting electrodes 231a and 232a, respectively.

[0185] When H1 is the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122, and H2 is the average size in the first direction from the extension of the first surface 1 to the edges of the first and second plating layers 241 and 242 placed on the first and second connecting electrodes 231a and 232a, it is possible to satisfy H1 > H2. This makes it possible to suppress the penetration of the plating solution into the internal electrodes during the plating process and improve reliability.

[0186] In one embodiment, the first and second insulating layers 251 and 252 are arranged to be in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and glass. As a result, the plating layers 241 and 242 may not be placed in the areas of the outer surface of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are located, thereby effectively preventing corrosion of the external electrodes by the plating solution.

[0187] In one embodiment, the first plating layer 241 can be positioned to cover the end of the first insulating layer 251 that is located on the first external electrode 231, and the second plating layer 242 can be positioned to cover the end of the second insulating layer 252 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layers 251, 252 and the plating layers 241, 242, thereby improving the reliability of the multilayer electronic component 2000. Furthermore, by forming the first and second insulating layers 251, 252 before forming the plating layers 241, 242 on the external electrodes 231, 232, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layers before the plating layers, the plating layers 241, 242 can have a configuration that covers the ends of the insulating layers 251, 252.

[0188] In one embodiment, the first insulating layer 251 can be positioned to cover the edge of the first plating layer 241 that is located on the first external electrode 231, and the second insulating layer 252 can be positioned to cover the edge of the second plating layer 242 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layer 251 and the plating layers 241 and 242, thereby improving the reliability of the multilayer electronic component 2000.

[0189] Figure 21 shows a modified example of Figure 19. Referring to Figure 21, in a modified example 2001 of a stacked electronic component 2000 according to one embodiment of the present invention, the first and second insulating layers 251-1 and 252-1 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, thereby being connected to a single insulating layer 253-1. In this case, the connected first and second insulating layers 253-1 can be arranged to cover a portion of the fifth and sixth surfaces.

[0190] Figure 22 is a schematic perspective view of a stacked electronic component 2002 according to one embodiment of the present invention, and Figure 23 is a cross-sectional view along the line IX-IX' in Figure 22.

[0191] Referring to Figures 22 and 23, in the stacked electronic component 2002 according to one embodiment of the present invention, the first and second plating layers 241-2 and 242-2 can be positioned below the extension line of the first surface. This makes it possible to minimize the height of the solder during mounting and to minimize the mounting space.

[0192] Furthermore, the first and second insulating layers 251-2 and 252-2 can be arranged to extend below the extension line of the first surface and in contact with the first and second plating layers 241-2 and 242-2.

[0193] Figure 24 shows a modified example of Figure 22. Referring to Figure 24, in a modified example 2003 of the stacked electronic component 2002 according to one embodiment of the present invention, the first and second insulating layers 251-3 and 252-3 can be connected to a single insulating layer 253-3 by extending to the fifth and sixth surfaces 5 and 6 and connecting them to each other. In this case, the connected first and second insulating layers 253-3 can be arranged to cover the entirety of the fifth and sixth surfaces.

[0194] Figure 25 is a schematic perspective view of a stacked electronic component 2004 according to one embodiment of the present invention, and Figure 26 is a cross-sectional view along the line X-X' in Figure 25.

[0195] Referring to Figures 25 and 26, the stacked electronic component 2004 according to one embodiment of the present invention may further include an additional insulating layer 261 disposed on the first surface 1 and positioned between the first band electrode 231b and the second band electrode 232b. This makes it possible to prevent leakage currents and the like that that may occur between the first band electrode 231b and the second band electrode 232b under high voltage current.

[0196] The type of additional insulating layer 261 is not particularly limited. For example, it can contain a polymer resin, similar to insulating layers 251-2 and 252-2. For example, the polymer resin can be one or more selected from epoxy resin, acrylic resin, EC (Ethyl Cellulose), etc. In addition, the additional insulating layer 161 can contain one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc., in addition to the polymer resin. This can improve the bonding strength with the main body or external electrodes. On the other hand, the additional insulating layer 261 and insulating layers 251-2 and 252-2 do not need to be formed from the same material and can be formed from different materials.

[0197] FIG. 27 shows a modified example of FIG. 25. Referring to FIG. 27, a modified example 2005 of the stacked electronic component 2004 according to an embodiment of the present invention can be connected to a single insulating layer 253-5 by the first and second insulating layers 251-5 and 252-5 extending to the fifth and sixth surfaces 5 and 6 and being connected to each other.

[0198] FIG. 28 is a perspective view schematically showing a stacked electronic component 2006 according to an embodiment of the present invention, and FIG. 29 is a cross-sectional view taken along line XI-XI' of FIG. 28.

[0199] Referring to FIGS. 28 and 29, a stacked electronic component 2006 according to an embodiment includes a first insulating layer 251-6 disposed on the first connection electrode 231a and a second insulating layer 252-6 disposed on the second connection electrode 232a. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 241-6 and 242-6 disposed on the first and second connection electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area contacting the solder during mounting can be increased to improve the fixing strength.

[0200] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because if H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0201] FIG. 30 shows a modified example of FIG. 28. Referring to FIG. 30, a modified example 2007 of the stacked electronic component 2006 according to an embodiment of the present invention can be connected to a single insulating layer 253-7 by the first and second insulating layers 251-7 and 252-7 extending to the fifth and sixth surfaces 5 and 6 and being connected to each other.

[0202] Figure 31 is a schematic perspective view of a stacked electronic component 2008 according to one embodiment of the present invention, and Figure 32 is a cross-sectional view along the line XII-XII' in Figure 31.

[0203] Referring to Figures 31 and 32, in one embodiment of the present invention, the stacked electronic component 2008 can be connected to a single insulating layer 253-8 by having the first and second insulating layers 251-8 and 252-8 extend to the second, fifth, and sixth surfaces 2, 5, and 6 and connect to each other. As shown in Figure 33, the insulating layer 253-8 can be configured to completely cover the second surface, or to partially cover the fifth and sixth surfaces.

[0204] Figure 33 is a schematic perspective view of a stacked electronic component 2009 according to one embodiment of the present invention, and Figure 34 is a cross-sectional view along the line XIII-XIII' in Figure 33.

[0205] Referring to Figures 35 and 36, the average thickness t1' of the first and second plating layers 241-9 and 242-9 of the stacked electronic component 2009 according to one embodiment of the present invention can be thinner than the average thickness t2' of the first and second insulating layers 251-9 and 252-9.

[0206] According to one embodiment of the present invention, the average thickness t1' of the first and second plating layers 241-9 and 242-9 can be made thinner than the average thickness t2' of the first and second insulating layers 251-9 and 252-9 to reduce the contact area between the plating layer and the insulating layer, thereby suppressing the occurrence of delamination and improving the adhesion strength of the multilayer electronic component 2009 to the substrate 180.

[0207] The average thickness t1' of the first and second plating layers 241-9 and 242-9 can be the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a or the first and second band electrodes 231b and 232b, and the average thickness t2' of the insulating layers 251-9 and 252-9 can be the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a.

[0208] Figure 35 shows a modified example of Figure 33. Referring to Figure 35, a modified example 2010 of the stacked electronic component 2009 according to one embodiment of the present invention is such that the first and second insulating layers 251-10 and 252-10 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, thereby connecting to a single insulating layer 253-10.

[0209] Figure 36 is a schematic perspective view of a stacked electronic component 3000 according to one embodiment of the present invention, Figure 37 is a cross-sectional view along the line XIV-XIV' in Figure 36, and Figure 38 is an enlarged view of the K1 region in Figure 36.

[0210] Referring to Figures 36 to 38, a stacked electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, a body 110 including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, a first connecting portion 331a arranged on the third surface of the body, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion extending from the first connecting portion to the corner connecting the second and third surfaces of the body The device includes a first external electrode 331 including a portion 331c, a second external electrode 332 including a second connecting portion 332a disposed on the fourth surface of the main body, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second and fourth surfaces of the main body, an insulating layer 351 disposed on the first and second connecting portions 331a and 332a and disposed to cover the second surface, the first and second corner portions, a first plating layer 341 disposed on the first band portion, and a second plating layer 342 disposed on the second band portion, wherein the insulating layer may contain a polymer resin.

[0211] In one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the first corner portion 331c, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion 332c, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes 331 and 332 and increases the capacity per unit volume of the stacked electronic component 3000.

[0212] In this case, if B1 is the average size in the second direction from the extension line of the third surface to the end of the first band portion 331b, and B2 is the average size in the second direction from the extension line of the fourth surface to the end of the second band portion 332b, then B1≧G1 and B3≧G2 can be satisfied. This increases the area in contact with the solder during mounting, thereby improving the bonding strength.

[0213] A stacked electronic component 3000 according to one embodiment may include a body 110 comprising a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, and having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction. The body 110 of the stacked electronic component 3000 may have the same configuration as the body 110 of the stacked electronic component 1000, except that, as described later, the end of the first or second surface of the body has a contracted shape.

[0214] External electrodes 331 and 332 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 331 and 332 may include first and second external electrodes 331 and 332, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0215] The external electrodes 331 and 332 may include a first external electrode 331 which includes a first connecting portion 331a located on the third surface, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second and third surfaces; and a second external electrode 132 which includes a second connecting portion 332a located on the fourth surface, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to the corner connecting the second and fourth surfaces. The first connecting portion 331a can be connected to the first internal electrode 121 on the third surface, and the second connecting portion 332a can be connected to the second internal electrode 122 on the fourth surface.

[0216] In one embodiment, the first and second connecting portions 331a and 332a can be arranged at a distance from the fifth and sixth surfaces. This minimizes the specific gravity occupied by the external electrodes 331 and 332, thereby further miniaturizing the stacked electronic component 3000.

[0217] As margin regions where internal electrodes 121 and 122 are not placed overlap on the dielectric layer 111, steps are generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to fifth surfaces and / or the second surface with the third to fifth surfaces may have a form that is contracted toward the center of the body 110 in the first direction with respect to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center of the body 110 in the first direction with respect to the first or second surface. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces.

[0218] The above-mentioned corners may include the 1st-3rd corner C1-3 connecting the 1st and 3rd faces, the 1st-4th corner C1-4 connecting the 1st and 4th faces, the 2nd-3rd corner C2-3 connecting the 2nd and 3rd faces, and the 2nd-4th corner C2-4 connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. However, in order to suppress the step caused by the internal electrodes 121 and 122, if the internal electrodes are cut after lamination so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portion connecting the first surface with the fifth and sixth surfaces, and the portion connecting the second surface with the fifth and sixth surfaces, may not have a contracted form.

[0219] On the other hand, the first to sixth surfaces of the main body 110 can be generally flat, and any non-flat areas can be considered as corners. In addition, the areas of the external electrodes 131 and 132 that are located on the corners can be considered as corner sections.

[0220] From this perspective, the first and second corner portions 331c and 332c can be positioned below the extension line E2 of the second surface, and the first and second corner portions 331c and 332c can be positioned at a distance from the second surface. That is, by not positioning the external electrodes 331 and 332 on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, and the capacity per unit volume of the stacked electronic component 3000 can be further increased. In addition, the first corner portion 331c can be positioned on a part of the second-third corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c can be positioned on a part of the second-fourth corner C2-4 connecting the fourth surface and the second surface.

[0221] The extension line E2 of the second face can be defined as follows:

[0222] In the length-thickness cross-section (LT cross-section) obtained by cutting the stacked electronic component 3000 in the center in the width direction, seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction with equal intervals in the length direction from the third face to the fourth face. The straight line passing through the point where P2 meets the second face and the point where P4 meets the second face can be defined as the extension line E2 of the second face.

[0223] On the other hand, the external electrodes 331 and 332 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0224] The external electrodes 331 and 332 can be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0225] Furthermore, the external electrodes 331 and 332 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. Additionally, the external electrodes 331 and 332 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0226] The conductive metals included in the external electrodes 331 and 332 can be materials with excellent electrical conductivity, and are not particularly limited. For example, the conductive metals can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 331 and 332 can include one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121 and 122 which contain Ni.

[0227] The insulating layer 351 can be placed on the first and second connection portions 331a and 332a.

[0228] Since the first and second connection portions 331a and 332a are connected to the internal electrodes 121 and 122, they can become pathways for the penetration of plating solution during the plating process or for moisture penetration during actual use. In the present invention, since an insulating layer 351 is placed on the connection portions 331a and 332a, it is possible to prevent the penetration of moisture or plating solution from the outside.

[0229] The insulating layer 351 can be positioned in contact with the first and second plating layers 341 and 342. In this case, the insulating layer 351 may be in contact with the first and second plating layers 341 and 342 in a manner that partially covers their edges, or the first and second plating layers 341 and 342 may be in contact with the insulating layer 351 in a manner that partially covers their edges.

[0230] The insulating layer 351 can be positioned on the first and second connection portions 331a and 332a and cover the second surface and the first and second corner portions 331c and 332c. Furthermore, by covering the area where the ends of the first and second corner portions 331c and 332c and the main body 110 are in contact with each other, the moisture resistance reliability can be further improved by blocking the moisture penetration path.

[0231] The insulating layer 351 can be positioned on the second surface and extend to the first and second connection portions 331a and 332a. Alternatively, if the external electrodes 331 and 332 are not positioned on the second surface, the insulating layer can be positioned to cover the entire second surface. On the other hand, the insulating layer 351 does not necessarily have to be positioned on the second surface; it may not be positioned on part or all of the second surface, and the insulating layer may be separated into two parts, each positioned on the first and second connection portions 331a and 332a. However, even in this case, the insulating layer can be positioned to cover the entire first and second corner portions 331c and 332c. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension of the second surface. Furthermore, even if the insulating layer is not positioned on the second surface, it can extend from the first and second connection portions 331a and 332a to the fifth and sixth surfaces, forming a single insulating layer.

[0232] In one embodiment, the insulating layer 351 can be arranged to cover a portion of the fifth and sixth surfaces to improve reliability. In this case, the portion of the fifth and sixth surfaces not covered by the insulating layer can be exposed to the outside.

[0233] Furthermore, the insulating layer 351 can be positioned to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, further improving moisture resistance reliability.

[0234] The insulating layer 351 can prevent the formation of plating layers 341 and 342 on the external electrodes 331 and 332 on which the insulating layer 351 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside. The components, composition, average thickness, and effects of the insulating layer 351 are the same as those of the insulating layers 151, 251, 252, and 253 included in the multilayer electronic components 1000 and 2000 and their various embodiments, so a detailed explanation of these is omitted.

[0235] The first and second plating layers 341 and 342 can be placed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 can improve mounting characteristics, and by placing the plating layers 341 and 342 on the band portions 331b and 332b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 341 and 342 can be in contact with the first surface, and the other end can be in contact with the insulating layer 351.

[0236] The types of plating layers 341 and 342 are not particularly limited and can be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and can be formed in multiple layers.

[0237] To give a more specific example for the plating layers 341 and 342, the plating layers 341 and 342 can be Ni plating layers or Sn plating layers, and can be in a configuration in which the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band portions 331b and 332b.

[0238] In one embodiment, the insulating layer 351 is arranged in direct contact with the first and second external electrodes 331 and 332, and the first and second external electrodes 331 and 332 may include conductive metal and glass. As a result, the plating layers 341 and 342 may not be placed in the area of ​​the outer surface of the first and second external electrodes 331 and 332 where the insulating layer 351 is located, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0239] In one embodiment, the first plating layer 341 can be positioned to cover the end of the insulating layer 351 that is placed on the first external electrode 331, and the second plating layer 342 can be positioned to cover the end of the insulating layer 351 that is placed on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the insulating layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layers 341 and 342 can have a configuration that covers the end of the insulating layer 351.

[0240] In one embodiment, the insulating layer 351 can be positioned to cover the end of the first plating layer 341 that is located on the first external electrode 331, and the insulating layer 351 can be positioned to cover the end of the second plating layer 342 that is located on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000.

[0241] In one embodiment, the first and second plating layers 341 and 342 can be arranged to extend so as to partially cover the first and second connection portions 331a and 332a, respectively. Among the first and second internal electrodes 121 and 122, when the average size in the first direction to the internal electrode closest to the first surface 1 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connection portions 131a and 132a is H2, H1 > H2 can be satisfied. Thereby, it is possible to suppress the penetration of the plating solution into the internal electrode during the plating process and improve the reliability.

[0242] In one embodiment, among the first and second internal electrodes 121 and 122 from the first surface, when the average size in the first direction to the internal electrode closest to the first surface is H1, and the average size in the first direction from the extension line of the first surface to the ends of the plating layers 341 and 342 arranged on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, it is possible to increase the area in contact with the solder during mounting and improve the adhesion strength. More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0243] In one embodiment, the first and second plating layers 341 and 342 can be arranged below the extension line of the first surface. Thereby, it is possible to minimize the height of the solder during mounting and minimize the mounting space. Further, the insulating layer 351 can be arranged to extend below the extension line of the first surface and contact the first and second plating layers 341 and 342.

[0244] In one embodiment, when the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0245] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, leakage current may occur between the first band portion 331b and the second band portion 332b under high voltage current, and the first band portion 331b and the second band portion 332b may become electrically connected during the plating process due to plating diffusion, etc.

[0246] In one embodiment, an additional insulating layer may be further included, which is disposed on the first surface and between the first band portion 331b and the second band portion 332b. This makes it possible to prevent leakage currents and the like that may occur between the first band electrode 331b and the second band electrode 332b under high voltage current.

[0247] The type of additional insulating layer is not particularly limited. For example, the additional insulating layer may contain a polymer resin, similar to the insulating layer 351. For example, the polymer resin may be one or more selected from epoxy resin, acrylic resin, EC (Ethyl Cellulose), etc. In addition, the additional insulating layer may contain one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc., in addition to the polymer resin. This can improve the bonding strength with the main body or external electrodes. On the other hand, the additional insulating layer and the insulating layer 351 do not need to be formed from the same material; they can be formed from different materials.

[0248] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b can be longer than the average length B3 of the first corner portion 331c, and the average length of the second band portion can be longer than the average length B4 of the second corner portion 332. Thereby, the area contacting the solder during mounting can be increased to improve the fixing strength.

[0249] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0250] In one embodiment, the average thickness of the first and second plating layers 341 and 342 can be thinner than the average thickness of the insulating layer 351.

[0251] The insulating layer 351 serves to prevent the penetration of moisture or plating solution from the outside, but the connectivity with the plating layers 341 and 342 is weak, which may cause delamination of the plating layers. When the plating layer is delaminated, the fixing strength with the substrate may decrease. Here, the delamination of the plating layer can mean that the plating layer is partially peeled off or physically separated from the external electrodes 331 and 332. Since the connectivity between the plating layer and the insulating layer is weak, the gap at the interface between the insulating layer and the plating layer is likely to widen or foreign substances may penetrate, making it vulnerable to external impacts and increasing the likelihood of delamination.

[0252] According to one embodiment of the present invention, the average thickness of the plating layer can be made thinner than the average thickness of the insulating layer, thereby reducing the contact area between the plating layer and the insulating layer. This suppresses the occurrence of delamination and improves the adhesion strength with the multilayer electronic component 3000.

[0253] There is no particular limit to the size of the 3000 multilayer electronic component.

[0254] However, in order to achieve both miniaturization and high capacity simultaneously, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, the effects of the present invention on improving reliability and capacity per unit volume can be more pronounced in stacked electronic components 3000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0255] Therefore, considering manufacturing tolerances, external electrode size, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 3000 can mean the maximum size of the stacked electronic component 3000 in the second direction, and the width of the stacked electronic component 3000 can mean the maximum size of the stacked electronic component 3000 in the third direction.

[0256] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0257] Furthermore, the expression "one embodiment" used in this disclosure does not mean that each embodiment is identical to another, but is provided to highlight the distinct and unique features of each embodiment. However, the present embodiments are not excluded from being realized in combination with features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or is inconsistent with that matter.

[0258] The terms used in this disclosure are used solely to describe one embodiment and are not intended to limit the disclosure. Where otherwise clearly, singular expressions include plural expressions. [Explanation of Symbols]

[0259] 1000, 2000, 3000 Stacked Electronic Components 1100 Mounting board 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 131, 231, 331 1st external electrode 132, 232, 332 2nd external electrode 134, 135 Additional electrode layer 141, 142, 241, 242, 341, 342 Plating layer 151, 251, 252, 253, 351 Insulating layer 161, 261 Additional insulating layer 180 circuit boards 181, 182 Electrode Pads 191, 192 solder

Claims

1. A laminated electronic component comprising a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer interposed therebetween, a main body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction, a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a part of the first surface, a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface, an insulating layer including a first insulating layer disposed on the first connection portion and a second insulating layer disposed on the second connection portion, a plating layer including a first plating layer disposed on the first band portion and extending to the first insulating layer, and a second plating layer disposed on the second band portion and extending to the second insulating layer, wherein the insulating layer contains a polymer resin and contains one or more selected from TiO₂, BaTiO₃, Al₂O₃, SiO₂, and BaO.

2. The laminated electronic component according to Claim 1, wherein the polymer resin is one or more selected from an epoxy resin, an acrylic resin, and ethyl cellulose.

3. When the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and the average size in the first direction from the extension line of the first surface to the ends of the plating layers disposed on the first and second connection portions is H2, the laminated electronic component according to Claim 1, wherein H1 > H2 is satisfied.

4. When the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and the average size in the first direction from the extension line of the first surface to the ends of the plating layers disposed on the first and second connection portions is H2, the laminated electronic component according to Claim 1, wherein H1 < H2 is satisfied.

5. When the average size in the first direction of the main body is T, the laminated electronic component according to Claim 4, wherein H2 < T / 2 is satisfied.

6. The laminated electronic component according to Claim 1, wherein the plating layer is disposed below the extension line of the first surface.

7. When the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, The multilayer electronic component according to claim 1, satisfying 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.

4.

8. The multilayer electronic component according to claim 1, further comprising an additional insulating layer disposed on the first surface and disposed between the first band portion and the second band portion.

9. The multilayer electronic component according to claim 1, wherein the average thickness of the dielectric layer is 0.35 μm or less.

10. The multilayer electronic component according to claim 1, wherein the average thicknesses of the first and second internal electrodes are each 0.35 μm or less.

11. The main body includes a capacitance forming portion including first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and cover portions disposed on both end surfaces of the capacitance forming portion in the first direction. The multilayer electronic component according to claim 1, wherein the average size of the cover portion in the first direction is 15 μm or less.

12. The multilayer electronic component according to claim 1, wherein the average thickness of the plating layer is thinner than the average thickness of the region of the insulating layer disposed on the first and second connection portions.

13. The first plating layer is disposed so as to cover the end of the first insulating layer close to the first surface, and the second plating layer is disposed so as to cover the end of the second insulating layer close to the first surface. The multilayer electronic component according to claim 1.

14. The first insulating layer is disposed so as to cover the end disposed on the first external electrode of the first plating layer, and the second insulating layer is disposed so as to cover the end disposed on the second external electrode of the second plating layer. The multilayer electronic component according to claim 1.

15. The first external electrode includes a first side surface band portion extending from the first connection portion to a part of the fifth and sixth surfaces.

16. The second external electrode includes a second side surface band portion extending from the second connection portion to a part of the fifth and sixth surfaces. The multilayer electronic component according to claim 1, wherein the second direction sizes of the first and second side surface band portions increase as they approach the first surface.

16. The first and second external electrodes are disposed spaced apart from the fifth and sixth surfaces. The multilayer electronic component according to claim 1.

17. The first and second external electrodes are arranged so as to be separated from the second surface. The multilayer electronic component according to Claim 1.

18. The first and second insulating layers extend to the second surface and are connected to each other. The multilayer electronic component according to Claim 1.

19. The first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other. The multilayer electronic component according to Claim 1.

20. The insulating layer is not disposed on the second, fifth, and sixth surfaces. The multilayer electronic component according to Claim 1.

21. The first external electrode includes a third band portion extending from the first connection portion to a part of the second surface, the second external electrode includes a fourth band portion extending from the second connection portion to a part of the second surface. The multilayer electronic component according to Claim 1.

22. The main body includes a first - 3 corner connecting the first surface and the third surface, a first - 4 corner connecting the first surface and the fourth surface, a second - 3 corner connecting the second surface and the third surface, and a second - 4 corner connecting the second surface and the fourth surface, the first - 3 corner and the second - 3 corner have a form that contracts toward the center of the main body in the first direction as they approach the third surface, the first - 4 corner and the second - 4 corner have a form that contracts toward the center of the main body in the first direction as they approach the fourth surface, the first external electrode includes a first corner portion extending from the first connection portion and disposed on the first - 3 corner and the second - 3 corner, the second external electrode includes a second corner portion extending from the second connection portion and disposed on the first - 4 corner and the second - 4 corner. The multilayer electronic component according to Claim 1.

23. When the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, the multilayer electronic component according to Claim 22, which satisfies B3 ≤ G1 and B4 ≤ G2.

24. The first external electrode includes a first connection electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connection electrode. The multilayer electronic component according to claim 1, wherein the second external electrode includes a second connection electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connection electrode. **Claim 25**: The first external electrode further includes a third band electrode disposed on the second surface and connected to the first connection electrode. The multilayer electronic component according to claim 24, wherein the second external electrode further includes a fourth band electrode disposed on the second surface and connected to the second connection electrode.

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