Laminate type electronic component

Abstract

To provide a laminate type electronic component which has improved capacity per unit volume.SOLUTION: A laminate type electronic component 1000 includes: a body 110 having a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface which are connected to the first and second surfaces and face each other in a second direction, and a fifth surface and a six surface which are connected to the first to fourth surfaces and face each other in a third direction; a first external electrode 131 which includes a first connection part 131a arranged on the third surface, a first band part 131b extending to a part of the first surface from the first connection part, and a third band part 131c extending to a part of the second surface from the first connection part; a second external electrode 132 which includes a second connection part 132a, a second band part 132b and a fourth band part 132c; an insulation layer 151 which is arranged on the first and second connection parts, is arranged so as to cover the second, third and fourth band parts, and contains an oxide containing Ba; a first plating layer 141 on the first band part; and a second plating layer 142 on the second band part.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Such multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to mount. As various electronic devices such as computers and mobile devices become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] Furthermore, as industry interest in automotive electronic components has increased in recent years, multilayer ceramic capacitors are also required to have high reliability characteristics for use in automobiles and infotainment systems.

[0005] To miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to form the internal electrodes and dielectric layers thinly and increase the number of layers. This requires minimizing the volume of parts that do not affect capacitance formation and increasing the effective volume fraction necessary to achieve the desired capacitance.

[0006] Furthermore, in order to mount as many components as possible within the limited area of ​​the circuit board, it is necessary to minimize the mounting space.

[0007] Furthermore, as multilayer ceramic capacitors become smaller and their capacitance increases, the margin thickness decreases, making them more susceptible to external moisture and plating solution penetration, which can compromise their reliability. Therefore, there is a need for methods to protect multilayer ceramic capacitors from external moisture and plating solution penetration. [Overview of the project] [Problems that the invention aims to solve]

[0008] One of the various objectives of the present invention is to provide a stacked electronic component with improved capacity per unit volume.

[0009] One of the various objectives of the present invention is to provide a multilayer electronic component with improved reliability.

[0010] One of the various objectives of the present invention is to provide a stacked electronic component that can minimize the mounting space.

[0011] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0012] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately arranged with respect to the dielectric layer, and comprises a body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a part of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface; an insulating layer disposed on the first and second connection portions and containing an oxide containing Ba; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion.

[0013] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, and comprises a body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction, and a first connecting portion disposed on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface. The device may include a first external electrode including a band portion, a second external electrode including a second connecting portion disposed on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a fourth band portion extending from the second connecting portion to a part of the second surface, an insulating layer disposed on the first and second connecting portions and disposed to cover the second surface and the third and fourth band portions, and containing an oxide containing Ba, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion.

[0014] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, and first and second internal electrodes alternately arranged sandwiching the dielectric layer, and first and second surfaces facing in a first direction, a third and a fourth surface connected to the first and second surfaces and facing in a second direction, and a fifth and a sixth surface connected to the first to fourth surfaces and facing in a third direction, a main body including the same, a first connection portion disposed on the third surface, and a first external electrode including a first band portion extending from the first connection portion to a part of the first surface, a second connection portion disposed on the fourth surface, and a second external electrode including a second band portion extending from the second connection portion to a part of the first surface, an insulating layer disposed on the second surface and extending on the first and second connection portions and including an oxide containing Ba, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion, and the first and second external electrodes can be disposed below an extension line of the second surface.

Effects of the Invention

[0015] One of the various effects of the present invention is that by disposing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, the capacitance per unit volume of the multilayer electronic component is improved and the reliability is improved.

[0016] One of the various effects of the present invention is that the mounting space of the multilayer electronic component is minimized.

[0017] One of the various effects of the present invention is that by including an oxide containing Ba in the insulating layer, the moisture resistance reliability is improved and the generation and propagation of cracks are suppressed.

[0018] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining specific embodiments of the present invention.

Brief Description of the Drawings

[0019] [Figure 1] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 2] It is a perspective view schematically showing the main body of the multilayer electronic component of FIG. 1. [Figure 3] It is a cross-sectional view taken along the line I-I' of FIG. 1. [Figure 4] It is an exploded perspective view schematically showing the disassembled main body of FIG. 2. [Figure 5] It is a perspective view schematically showing the substrate on which the multilayer electronic component of FIG. 1 is mounted. [Figure 6] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 7] It is a cross-sectional view taken along the line II-II' of FIG. 6. [Figure 8] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 9] It is a cross-sectional view taken along the line III-III' of FIG. 8. [Figure 10] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 11] It is a cross-sectional view taken along the line IV-IV' of FIG. 10. [Figure 12] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 13] It is a cross-sectional view taken along the line V-V' of FIG. 12. [Figure 14] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 15] It is a cross-sectional view taken along the line VI-VI' of FIG. 14. [Figure 16] It is a view showing a modified example of FIG. 14. [Figure 17] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 18] It is a cross-sectional view taken along the line VII-VII' of FIG. 17. [Figure 19] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 20] It is a cross-sectional view taken along the line XIV-XIV' of FIG. 19. [Figure 21] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 22] This is a cross-sectional view along the line VIII-VIII' in Figure 21. [Figure 23] This figure shows a modified version of Figure 21. [Figure 24] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 25] This is a cross-sectional view along the line IX-IX' in Figure 24. [Figure 26] This figure shows a modified version of Figure 24. [Figure 27] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 28] This is a cross-sectional view along the line X-X' in Figure 27. [Figure 29] This figure shows a modified version of Figure 27. [Figure 30] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 31] This is a cross-sectional view along the line XI-XI' in Figure 30. [Figure 32] This figure shows a modified example of Figure 30. [Figure 33] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 34] This is a cross-sectional view along the line XII-XII' in Figure 33. [Figure 35] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 36] Figure 35 is a cross-sectional view along the line XIII-XIII'. [Figure 37] This figure shows a modified example of Figure 35. [Figure 38] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 39] This is a cross-sectional view along the line XV-XV' in Figure 38. [Figure 40]This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 41] This is a cross-sectional view along the line XVI-XVI' in Figure 40. [Figure 42] This is a magnified view of the K1 region in Figure 40. [Modes for carrying out the invention]

[0020] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various different forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of ordinary skill. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0021] In the drawings, parts unrelated to the explanation have been omitted in order to clearly illustrate the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Furthermore, components having the same function within the scope of the same concept will be described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, it does not mean that other components are excluded, but rather that other components may be further included, unless otherwise stated.

[0022] In drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0023] Figure 1 is a schematic perspective view showing a stacked electronic component according to one embodiment of the present invention.

[0024] Figure 2 is a schematic perspective view showing the main body of the stacked electronic component shown in Figure 1.

[0025] Figure 3 is a cross-sectional view along the line I-I' in Figure 1.

[0026] Figure 4 is an exploded perspective view showing the main body of Figure 2 disassembled.

[0027] Figure 5 is a schematic perspective view showing a substrate on which the multilayer electronic components shown in Figure 1 are mounted.

[0028] A stacked electronic component 1000 according to one embodiment of the present invention will be described below with reference to Figures 1 to 5.

[0029] A stacked electronic component 1000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 including first and second surfaces 1 and 2 facing in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in a third direction, and a first connection portion 131a located on the third surface, and from the first connection portion The device may include a first external electrode 131 including a first band portion 131b extending to a part of the first surface, a second external electrode 132 including a second connecting portion 132a disposed on the fourth surface and a second band portion 132b extending from the second connecting portion to a part of the first surface, an insulating layer 151 disposed on the first and second connecting portions and containing an oxide containing Ba, a first plating layer 141 disposed on the first band portion 131b, and a second plating layer 142 disposed on the second band portion 132b.

[0030] The main body 110 has dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0031] The specific shape of the main body 110 is not particularly limited, but as shown in the figure, the main body 110 may have a hexahedral shape or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 may not have a hexahedral shape made up of perfectly straight lines, but may have a substantially hexahedral shape.

[0032] The main body 110 may have first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in the third direction.

[0033] In one embodiment, the main body 110 includes a first-to-third corner connecting the first surface and the third surface, a first-to-fourth corner connecting the first surface and the fourth surface, a second-to-third corner connecting the second surface and the third surface, and a second-to-fourth corner connecting the second surface and the fourth surface. The first-to-third corner and the second-to-third corner have a form that contracts towards the center of the main body in the first direction as they approach the third surface, and the first-to-fourth corner and the second-to-fourth corner can have a form that contracts towards the center of the main body in the first direction as they approach the fourth surface.

[0034] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference occurs due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to fifth surfaces and / or the corners connecting the second surface with the third to fifth surfaces may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded in a separate process, so that the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces have a rounded shape.

[0035] The above-mentioned corners may include the 1st-3rd corner connecting the 1st and 3rd faces, the 1st-4th corner connecting the 1st and 4th faces, the 2nd-3rd corner connecting the 2nd and 3rd faces, and the 2nd-4th corner connecting the 2nd and 4th faces. Furthermore, the above-mentioned corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. The 1st to 6th faces of the main body 110 can be considered to be approximately flat surfaces, and the non-flat areas can be considered corners. Hereinafter, the extensions of each face may mean lines extending from the flat parts of each face.

[0036] Here, of the external electrodes 131 and 132, the area located on the corner of the main body 110 can be designated as the corner portion, the areas located on the third and fourth surfaces of the main body 110 can be designated as the connecting portion, and the areas located on the first and second surfaces of the main body 110 can be designated as the band portion.

[0037] On the other hand, in order to suppress the step caused by the internal electrodes 121 and 122, if, after lamination, the internal electrodes are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portion connecting the first surface with the fifth and sixth surfaces, and the portion connecting the second surface with the fifth and sixth surfaces, do not need to have a contracted form.

[0038] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0039] According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, etc. can be used. The above barium titanate-based material may contain BaTiO3-based ceramic powder. Examples of the above ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0040] In addition, the raw material for forming the dielectric layer 111 can be added with various ceramic additives, organic solvents, binders, dispersants, etc. to the powder such as barium titanate (BaTiO3) according to the purpose of the present invention.

[0041] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited.

[0042] However, generally, when the dielectric layer is formed thinly with a thickness of less than 0.6 μm, especially when the average thickness of the dielectric layer is 0.35 μm or less, the reliability may decrease.

[0043] According to one embodiment of the present invention, by disposing an insulating layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, etc., and improve the reliability. Therefore, even when the average thickness td of the dielectric layer 111 is 0.35 μm or less, excellent reliability can be ensured.

[0044] Therefore, when the average thickness td of the dielectric layer 111 is 0.35 μm or less, the reliability improvement effect according to the present invention becomes more pronounced.

[0045] The average thickness td of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111 placed between the first and second internal electrodes 121 and 122.

[0046] The average thickness td of the dielectric layer 111 can be measured by scanning the cross-section of the main body 110 in the length and thickness direction LT with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average value can be measured by measuring the thickness at 30 equally spaced points along the length of a single dielectric layer in the scanned image. These 30 equally spaced points can be specified by the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 dielectric layers and measuring the average value, the average thickness of the dielectric layers can be further generalized.

[0047] The main body 110 may include a capacitance forming portion Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged opposite each other with a dielectric layer 111 in between, and cover portions 112 and 113 which are formed on the upper and lower parts of the capacitance forming portion Ac in a first direction.

[0048] Furthermore, the capacitance-forming portion Ac is the part that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0049] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume-forming portion Ac in the first direction, and a lower cover portion 113 positioned below the volume-forming portion Ac in the first direction.

[0050] The upper cover portion 112 and the lower cover portion 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0051] The upper cover portion 112 and the lower cover portion 113 do not include internal electrodes and may contain the same material as the dielectric layer 111.

[0052] In other words, the upper cover portion 112 and the lower cover portion 113 may contain a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0053] On the other hand, the average thickness tc of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the stacked electronic component, the average thickness tc of the cover portions 112 and 113 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the insulating layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average thickness tc of the cover portions 112 and 113 is 15 μm or less, excellent reliability can be ensured.

[0054] The average thickness tc of the cover portions 112 and 113 represents the size in the first direction and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0055] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0056] The margin portions 114 and 115 may include a first margin portion 114 positioned on the fifth surface 5 of the main body 110 and a second margin portion 115 positioned on the sixth surface 6 of the main body 110. That is, the margin portions 114 and 115 can be positioned on both end surfaces in the width direction of the main body 110.

[0057] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first and second internal electrodes 121 and 122 and the body 110 in a cross-section obtained by cutting the body 110 in the width-thickness WT direction.

[0058] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0059] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet, excluding the portion that forms the margin portion, to form internal electrodes.

[0060] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after lamination, the internal electrodes can be cut so that they are exposed from the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115.

[0061] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the insulating layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average width of the margin portions 114 and 115 is 15 μm or less, excellent reliability can be ensured.

[0062] The average width of the margin portions 114 and 115 represents the average size of the margin portions 114 and 115 in the third direction, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the volume forming portion Ac.

[0063] The internal electrodes 121 and 122 may be stacked alternately with the dielectric layer 111.

[0064] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are arranged alternately opposite each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed from the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0065] Referring to Figure 3, the first internal electrode 121 is separated from the fourth surface 4 and exposed from the third surface 3, and the second internal electrode 122 is separated from the third surface 3 and exposed from the fourth surface 4. The first external electrode 131 is positioned on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 is positioned on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0066] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but rather to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but rather to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a predetermined distance from the fourth surface 4, and the second internal electrode 122 can be formed at a predetermined distance from the third surface 3.

[0067] Here, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by the dielectric layer 111 placed in between.

[0068] The main body 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0069] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0070] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following on a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. While screen printing and gravure printing can be used as printing methods for the conductive paste for internal electrodes, the present invention is not limited to these methods.

[0071] On the other hand, the average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited.

[0072] However, generally speaking, when the internal electrodes were formed thinly with a thickness of less than 0.6 μm, especially when the average thickness of the internal electrodes was 0.35 μm or less, there was a risk of reduced reliability.

[0073] According to one embodiment of the present invention, by arranging an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of plating solution, thereby improving reliability. As a result, even when the average thickness te of the internal electrodes 121 and 122 is 0.35 μm or less, excellent reliability can be ensured.

[0074] Therefore, when the average thickness te of the internal electrodes 121 and 122 is 0.35 μm or less, the effects of the present invention become more pronounced, and miniaturization and increased capacitance of the stacked electronic component can be achieved more easily.

[0075] The average thickness te of the internal electrodes 121 and 122 can mean the average thickness of one internal electrode 121 or 122.

[0076] The average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-section of the main body 110 in the length and thickness direction LT with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average value can be measured by measuring the thickness at 30 equally spaced points along the length of one internal electrode in the scanned image. These 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes, the average thickness of the internal electrodes can be further generalized.

[0077] External electrodes 131 and 132 can be arranged on the third and fourth surfaces 3 and 4 of the main body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0078] The external electrodes 131 and 132 may include a first external electrode 131 which includes a first connecting portion 131a located on the third surface and a first band portion 131b extending from the first connecting portion to a part of the first surface, and a second external electrode 132 which includes a second connecting portion 132a located on the fourth surface and a second band portion 132b extending from the second connecting portion to a part of the first surface. The first connecting portion 131a may be connected to the first internal electrode 121 on the third surface, and the second connecting portion 132a may be connected to the second internal electrode 122 on the fourth surface.

[0079] Furthermore, the first external electrode 131 may include a third band portion 131c extending from the first connection portion 131a to a part of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connection portion 132a to a part of the second surface. In addition, the first external electrode 131 may include a side band portion extending from the first connection portion 131a to a part of the fifth and sixth surfaces, and the second external electrode 132 may include a side band portion extending from the second connection portion 132a to a part of the fifth and sixth surfaces.

[0080] However, the third band section, the fourth band section, and the side band section are not essential components in the present invention. The first and second external electrodes 131 and 132 do not have to be placed on the second surface, nor do they have to be placed on the fifth and sixth surfaces. By not placing the first and second external electrodes 131 and 132 on the second surface, the first and second external electrodes 131 and 132 can be placed below the extension line of the second surface of the main body. In addition, the first and second connecting sections 131a and 132a may be placed away from the fifth and sixth surfaces, and the first and second connecting sections 131a and 132a may be placed away from the second surface. Furthermore, the first and second band sections 131b and 132b may also be placed away from the fifth and sixth surfaces.

[0081] On the other hand, when the first and second external electrodes 131 and 132 include the third and fourth band portions 131c and 132c, it is indicated that an insulating layer is placed on the third and fourth band portions 131c and 132c, but this is not limited to this, and a plating layer may be placed on the third and fourth band portions 131c and 132c to improve the convenience of mounting. Also, the first and second external electrodes 131 and 132 may include the third and fourth band portions 131c and 132c but not the side band portions, in which case the first and second connecting portions 131a and 132a, and the first to fourth band portions 131b, 132b, 131c, and 132c may be separated from the fifth and sixth surfaces.

[0082] In this embodiment, a structure is described in which the stacked electronic component 1000 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0083] On the other hand, the external electrodes 131 and 132 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties and structural stability, and may even have a multilayer structure.

[0084] The external electrodes 131 and 132 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0085] Furthermore, the external electrodes 131 and 132 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. In addition, the external electrodes 131 and 132 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0086] The conductive metal included in the external electrodes 131 and 132 can be any material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 131 and 132 may contain one or more of Ni and Ni alloys. This can further improve connectivity with the internal electrodes 121 and 122 which contain Ni.

[0087] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a.

[0088] Since the first and second connection parts 131a and 132a are connected to the internal electrodes 121 and 122, they can become pathways for the penetration of plating solution during the plating process or for the penetration of moisture during actual use. In the present invention, since an insulating layer 151 is placed on the connection parts 131a and 132a, it is possible to prevent the penetration of moisture from the outside or the penetration of plating solution.

[0089] The insulating layer 151 can be positioned in contact with the first and second plating layers 141 and 142. Here, the insulating layer 151 may be positioned to cover a portion of the edges of the first and second plating layers 141 and 142, or the first and second plating layers 141 and 142 may be positioned to cover a portion of the edges of the insulating layer 151.

[0090] The insulating layer 151 is placed on the first and second connection portions 131a and 132a and can be positioned to cover the second surface and the third and fourth band portions 131c and 132c. Here, the insulating layer 151 may be positioned to cover the area of ​​the second surface where the third and fourth band portions 131c and 132c are not located, and the third and fourth band portions 131c and 132c. Therefore, by covering the area where the ends of the third and fourth band portions 131c and 132c and the main body 110 are in contact with the insulating layer 151, thereby blocking the moisture penetration path, the moisture resistance reliability can be further improved.

[0091] The insulating layer 151 can be positioned on the second surface and extend to the first and second connection portions 131a and 132a. Alternatively, if the external electrodes 131 and 132 are not positioned on the second surface, the insulating layer can be positioned to cover the entire second surface. On the other hand, the insulating layer 151 does not necessarily have to be positioned on the second surface; it may not be positioned on part or all of the second surface, and the insulating layer may be separated into two parts and positioned on the first and second connection portions 131a and 132a respectively. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension line of the second surface. Furthermore, even if the insulating layer is not positioned on the second surface, it can extend from the first and second connection portions 131a and 132a to the fifth and sixth surfaces to form a single insulating layer.

[0092] Furthermore, the insulating layer 151 can be positioned to cover the first and second side band portions, as well as parts of the fifth and sixth surfaces. In this case, the parts of the fifth and sixth surfaces not covered by the insulating layer 151 can be exposed to the outside.

[0093] Furthermore, the insulating layer 151 may be arranged to cover the entirety of the first and second side band portions, as well as the fifth and sixth surfaces. In this case, the fifth and sixth surfaces are not exposed to the outside, thus improving moisture resistance reliability, and the connection portions 131a and 132a are also not directly exposed to the outside, thus improving the reliability of the laminated electronic component 1000. More specifically, the insulating layer may cover the entirety of the first and second side band portions, and cover the entirety of the fifth and sixth surfaces except for the areas where the first and second side band portions are formed.

[0094] The insulating layer 151 plays a role in preventing the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the insulating layer 151 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside.

[0095] The insulating layer 151 may contain an oxide containing Ba.

[0096] Conventionally, glass-based materials were generally used for the insulating layer. However, due to the properties of glass, it would harden too much during sintering, making it difficult to form a uniform film. Furthermore, the heat required during the sintering process could generate stress within the main body, leading to cracks and delamination. In addition, when using an insulating layer containing glass-based materials, the method involved firing the insulating layer containing the glass-based material after firing the external electrodes. However, during the firing process of the insulating layer, there was a risk of radial cracks occurring due to the diffusion of the metallic material from the external electrodes into the internal electrodes. Moreover, because glass-based materials are generally hard, they could break even with small impacts.

[0097] This invention solves the problems of glass-based insulating layers by applying an oxide containing Ba instead of a glass-based material to the insulating layer. The oxide containing Ba not only has insulating properties but also has superior impact resistance compared to glass-based materials. Furthermore, the oxide containing Ba has hygroscopic properties that adsorb moisture and gas, so it adsorbs moisture and gas flowing in from the outside and plays a role in blocking moisture and gas from penetrating into the first and second connection parts 131a and 132a and the main body 110. Moreover, if moisture or gas penetrates into the first and second connection parts 131a and 132a and the main body 110 through other routes, it plays a role in guiding the moisture and gas back to the outside.

[0098] Therefore, by applying an oxide containing Ba instead of a glass-based material to the insulating layer, moisture resistance reliability can be further improved, and cracks due to thermal shrinkage and radial cracks due to metal diffusion can be suppressed.

[0099] The method for forming the insulating layer 151 is not particularly limited.

[0100] For example, after forming external electrodes 131 and 132 on the main body 100, an insulating layer 151 containing an oxide containing Ba may be formed using atomic layer deposition (ALD). That is, the insulating layer 151 may be formed by the above atomic layer deposition method, thereby enabling the formation of a thin and uniform insulating layer 151. The precursors used to form the insulating layer by the above atomic layer deposition method are Ba(C5H7O2)2 and Ba(C 11 H 19 O2)2, Ba(C5HF6O2)2, Ba(C 10 H 10 F7O2)2Sr(C 10 H 10 F7O2)2, Ba(C 11 H 19The material may be selected from the group consisting of O2)-CH3(OCH2CH2)4OCH3 and combinations thereof, but is not limited thereto. Furthermore, the above atomic layer deposition method may be carried out in a temperature range of approximately 60°C to approximately 200°C, but is not limited thereto.

[0101] The type of Ba-containing oxide included in the insulating layer 151 is not particularly limited, but may be, for example, BaO.

[0102] In one embodiment, the insulating layer 151 may have a molar ratio of Ba to the total number of moles of other elements excluding oxygen of 0.95 or more. That is, the insulating layer 151 may consist of an oxide that substantially contains Ba, excluding elements detected as impurities. Here, the oxide containing Ba may be BaO. This further improves the effect of suppressing cracks due to thermal shrinkage, radial cracks due to metal diffusion, and the effect of improving moisture resistance reliability.

[0103] Here, the composition of the insulating layer 151 may be calculated from images observed using SEM-EDS (Scanning Electron Microscope-Energy Dispersive X-ray Spectroscopy). Specifically, the multilayer electronic component may be polished to the center in the width direction (third direction) to expose the cross-sections in the length direction and thickness direction (LT cross-section), and then the number of moles of each element contained in the insulating layer may be measured using EDS in the central region of the region obtained by dividing the insulating layer into five equal parts in the thickness direction, and the number of moles of element Ba relative to the total number of moles of other elements excluding oxygen may be calculated.

[0104] In one embodiment, the average thickness t2 of the insulating layer 151 may be 50 nm or more and 3 μm or less. When the average thickness t2 of the insulating layer 151 is 50 nm or more, the moisture permeability of the insulating layer is 0 mg / m 2 This is [day], which improves moisture resistance reliability.

[0105] If the average thickness t2 of the insulating layer 151 is less than 50 nm, there is a risk that the effects of suppressing cracks due to thermal shrinkage, radial cracks due to metal diffusion, etc., and improving moisture resistance reliability may not be sufficiently ensured, and the moisture permeability of the insulating layer may be 0 mg / [m 2 This can exceed [day]. On the other hand, if the average thickness t2 of the insulating layer 151 exceeds 3 μm, the formation time of the insulating layer may be too long, which could increase the overall size of the multilayer electronic component and reduce the capacitance per unit volume.

[0106] The average thickness t2 of the insulating layer 151 may be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a and 132a. More specifically, it may be the average of the thickness values ​​of the insulating layer measured at the center point in the first direction of the first and second connection portions 131a and 132a, two points separated by 5 μm in the first direction from the center point in the first direction, and two points separated by 10 μm in the first direction.

[0107] In one embodiment, a cover layer containing an insulating material may be further included, disposed on the insulating layer 151. The insulating material included in the cover layer is not particularly limited, and the cover layer may contain an insulating material and have electrically insulating properties. A more detailed explanation will follow later.

[0108] In one embodiment, the insulating layer 151 is arranged in direct contact with the first and second external electrodes 131 and 132, and the first and second external electrodes 131 and 132 may include conductive metal and glass. By doing so, the plating layers 141 and 142 are not placed in the area of ​​the outer surface of the first and second external electrodes 131 and 132 where the insulating layer 151 is placed, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0109] Here, the first plating layer 141 may be positioned to cover the end of the insulating layer 151 placed on the first external electrode 131, and the second plating layer 142 may be positioned to cover the end of the insulating layer 151 placed on the second external electrode 132. By forming the insulating layer 151 first before forming the plating layers 141 and 142 on the external electrodes 131 and 132, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layers 141 and 142 can have a configuration that covers the end of the insulating layer 151.

[0110] The first and second plating layers 141 and 142 can be placed on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 play a role in improving mounting characteristics, and by placing the plating layers 141 and 142 on the band portions 131b and 132b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. The first and second plating layers 141 and 142 may have one end in contact with the first surface and the other end in contact with the insulating layer 151.

[0111] The plating layers 141 and 142 are not particularly limited in type and may be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and may also be formed in multiple layers.

[0112] As a more specific example of the plating layers 141 and 142, the plating layers 141 and 142 may be Ni plating layers or Sn plating layers, and may be in a form in which the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band portions 131b and 132b.

[0113] In one embodiment, the first and second plating layers 141 and 142 can be arranged to extend so as to cover a portion of the first and second connecting portions 131a and 132a, respectively. When H1 is the average size in the first direction from the first and second internal electrodes 121 and 122 to the internal electrode closest to the first surface 1, and H2 is the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connecting portions 131a and 132a, it is possible to satisfy H1 > H2 (or H1 ≥ H2). This suppresses the penetration of the plating solution into the internal electrodes during the plating process and improves reliability.

[0114] H1 and H2 can be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the average of values ​​measured at the point where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross-section, and H2 can be the average of values ​​measured with reference to the edge of the plating layer in contact with the external electrode in each cross-section, and the extension line of the first surface that serves as the reference when measuring H1 and H2 can be the same.

[0115] In one embodiment, the first plating layer 141 may be positioned to cover the edge of the insulating layer 151 placed on the first external electrode 131, and the second plating layer 142 may be positioned to cover the edge of the insulating layer 151 placed on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0116] In one embodiment, the insulating layer 151 can be positioned to cover the edge of the first plating layer 141 placed on the first external electrode 131, and the insulating layer 151 can be positioned to cover the edge of the second plating layer 142 placed on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0117] In one embodiment, when the average size of the main body 110 in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0118] If B1 / L and B2 / L are less than 0.2, it is difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 131b and the second band portion 132b under high voltage current, and there is a risk of the first band portion 131b and the second band portion 132b becoming electrically connected due to the bleeding of the plating during the plating process.

[0119] B1, B2, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0120] Referring to Figure 5, which shows a mounting substrate 1100 on which a multilayer electronic component 1000 is mounted, the plating layers 141 and 142 of the multilayer electronic component 1000 may be joined to electrode pads 181 and 182 placed on the substrate 180 by solder 191 and 192.

[0121] On the other hand, if the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and if the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0122] There is no particular limit to the size of the 1000 multilayer electronic component.

[0123] However, in order to achieve both miniaturization and high capacity simultaneously, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, the improvement in reliability and capacity per unit volume according to the present invention becomes more pronounced in a stacked electronic component 1000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0124] Therefore, considering manufacturing tolerances, the size of external electrodes, etc., the reliability improvement effect according to the present invention becomes more pronounced when the length of the stacked electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 1000 may mean the maximum size of the stacked electronic component 1000 in the second direction, and the width of the stacked electronic component 1000 may mean the maximum size of the stacked electronic component 1000 in the third direction.

[0125] Figure 6 is a schematic perspective view showing a stacked electronic component 1001 according to one embodiment of the present invention, and Figure 7 is a cross-sectional view along the line II-II' in Figure 6.

[0126] Referring to Figures 6 and 7, in one embodiment of the present invention, the stacked electronic component 1001 has the first and second plating layers 141-1 and 142-1 positioned below the extension line of the first surface. This minimizes the height of the solder during mounting and minimizes the mounting space.

[0127] Furthermore, the insulating layer 151-1 can be positioned to extend below the extension line of the first surface and in contact with the first and second plating layers 141-1 and 142-1.

[0128] Figure 8 is a schematic perspective view showing a stacked electronic component 1002 according to one embodiment of the present invention, and Figure 9 is a cross-sectional view along the line III-III' in Figure 8.

[0129] Referring to FIGS. 8 and 9, a stacked electronic component 1002 according to an embodiment of the present invention is disposed on the first surface 1 and may further include an additional insulating layer 161 disposed between the first band portion 131b and the second band portion 132b. By doing so, it is possible to prevent leakage current and the like that may occur between the first band portion 131b and the second band portion 132b under a high voltage current.

[0130] The type of the additional insulating layer 161 does not need to be particularly limited. For example, the additional insulating layer 161 may include an oxide containing Ba, may contain BaO, or may be BaO, similar to the insulating layer 151. However, the additional insulating layer 161 and the insulating layer 151 do not need to be limited to the same material and may be formed of different materials. For example, it may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may include glass.

[0131] FIG. 10 is a perspective view schematically showing a stacked electronic component 1003 according to an embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along the line IV-IV' of FIG. 10.

[0132] Referring to FIGS. 10 and 11, for a stacked electronic component 1003 according to an embodiment of the present invention, when the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2, H1 < H2 can be satisfied. Thereby, the area contacting the solder during mounting can be increased, and the fixing strength can be improved.

[0133] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0134] H1, H2, and T can be the values obtained by averaging the values measured in the cross-section (L-T cross-section) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the value obtained by averaging the values measured at the points where the internal electrode closest to the first surface 1 in each cross-section is connected to the external electrode. H2 can be the value obtained by averaging the values measured based on the end of the plating layer contacting the external electrode in each cross-section. The extension lines of the first surface serving as the reference during the measurement of H1 and H2 can be the same. Also, T can be the value obtained by averaging the values after measuring the maximum size of the main body 110 in the first direction in each cross-section.

[0135] FIG. 12 is a perspective view schematically showing a multilayer electronic component 1004 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along the line V-V' of FIG. 12.

[0136] Referring to FIGS. 12 and 13, in a multilayer electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 can be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 can be longer than the average length B4 of the fourth band portion 132c-4. Thereby, the area contacting the solder during mounting can be increased, and the fixing strength can be improved.

[0137] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0138] Here, when the average size of the main body 110 in the second direction is L, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0139] B1, B2, B3, B4, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0140] Furthermore, the first external electrode 131-4 includes a first side band portion extending from the first connecting portion 131a-4 to a part of the fifth and sixth surfaces, and the second external electrode 132-4 includes a second side band portion extending from the second connecting portion 132a-4 to a part of the fifth and sixth surfaces. Here, the size of the first and second side band portions in the second direction can gradually increase as they approach the first surface. That is, the first and second side band portions may be arranged in a tapered or trapezoidal shape.

[0141] Furthermore, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion 131c-4, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion 132c-4, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes and increases the capacity per unit volume of the stacked electronic component 1004.

[0142] The above G1 and G2 can be defined as follows: G1 is the average size in the second direction of the region separated to the third surface, measured for any five second internal electrodes located in the center of the third direction, in a cross-section obtained by cutting the main body in the first and second directions at the center of the third direction; and G2 is the average size in the second direction of the region separated to the fourth surface, measured for any five first internal electrodes located in the center of the first direction.

[0143] Furthermore, the method can be further generalized by determining G1 and G2 in cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​to obtain G1 and G2.

[0144] However, there is no intention to limit the present invention to B3≦G1 and B4≦G2, and the present invention can also include cases where B3≧G1 and B4≧G2 are satisfied. Therefore, in one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3≧G1 and B4≧G2 can be satisfied.

[0145] In one embodiment, when the average size in the second direction from the extension line E3 of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line E4 of the fourth surface to the end of the second band portion is B2, it is possible to satisfy B1≧G1 and B2≧G2. This makes it possible to improve the bonding strength between the multilayer electronic component 1004 and the substrate 180.

[0146] Figure 14 is a schematic perspective view showing a stacked electronic component 1005 according to one embodiment of the present invention, and Figure 15 is a cross-sectional view along the line VI-VI' in Figure 14.

[0147] Referring to Figures 14 and 15, the first and second external electrodes 131-5 and 132-5 of the stacked electronic component 1005 according to one embodiment of the present invention may not be arranged on the second surface, but rather on the third, fourth, and first surfaces, forming an L-shape. That is, the first and second external electrodes 131-5 and 132-5 may be arranged below the extension of the second surface.

[0148] The first external electrode 131-5 includes a first connection portion 131a-5 located on the third surface 3, and a first band portion 131b-5 extending from the first connection portion 131a-5 to a part of the first surface 1. The second external electrode 132-5 includes a second connection portion 132a-5 located on the fourth surface 4, and a second band portion 132b-5 extending from the second connection portion 132a-5 to a part of the first surface 1. The external electrodes 131-5 and 132-5 may not be located on the second surface 2, and the insulating layer 151-5 may be arranged to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby improving the capacitance per unit volume of the multilayer electronic component 1005. However, the insulating layer 151-5 is not limited to covering the entire second surface 2. The insulating layer may not cover part or all of the second surface 2, but may be separated and cover the first and second connection portions 131a-5 and 132a-5, respectively.

[0149] A first plating layer 141-5 is placed on the first band portion 131b-5, and a second plating layer 142-5 is placed on the second band portion 132b-5. The first and second plating layers 141-5 and 142-5 can extend to a portion of the first and second connecting portions 132a-5 and 132b-5.

[0150] Here, the external electrodes 131-5 and 132-5 do not necessarily have to be placed on the fifth and sixth surfaces 5 and 6. In other words, there may be a configuration in which the external electrodes 131-5 and 132-5 are placed only on the third, fourth, and first surfaces.

[0151] Let the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 be H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 arranged on the first and second connection portions 131a-5 and 132a-5 be H2. When this is the case, H1 < H2 can be satisfied. As a result, it is possible to increase the area in contact with solder during mounting to improve the fixing strength, and it is possible to increase the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5 to suppress an increase in ESR (Equivalent Series Resistance).

[0152] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0153] Also, the first and second plating layers 141-5 and 142-5 can be arranged so as to cover a part of the insulating layer 151-5 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged so as to cover the ends of the insulating layer 151-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0154] Also, the insulating layer 151-5 can be arranged so as to cover a part of the first and second plating layers 141-5 and 142-5 on the third and fourth surfaces. That is, the insulating layer 151-5 can be arranged so as to cover the ends of the plating layers 141-5 and 142-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0155] Figure 16 shows a modified example of Figure 14. Referring to Figure 16, in a modified example (1006) of the stacked electronic component 1005 according to one embodiment of the present invention, a first additional electrode layer 134 may be arranged between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 may be arranged between the second connection portion 132a-6 and the fourth surface. The first additional electrode layer 134 may be arranged within a range that does not deviate from the third surface, and the second additional electrode layer 135 may be arranged within a range that does not deviate from the fourth surface. The first and second additional electrode layers 134 and 135 can improve the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131-6 and 132-6, and can play a role in improving the mechanical bonding force of the external electrodes 131-6 and 132-6 by having excellent bonding strength with the external electrodes 131-6 and 132-6.

[0156] The first and second external electrodes 131-6 and 132-6 may have an L-shape in which the first and second external electrodes are not positioned on the second surface.

[0157] The first external electrode 131-6 may include a first connecting portion 131a-6 disposed on the first additional electrode layer 134, and a first band portion 131b-6 extending from the first connecting portion 131a-6 to a part of the first surface 1. The second external electrode 132-6 may include a second connecting portion 132a-6 disposed on the second additional electrode layer 135, and a second band portion 132b-6 extending from the second connecting portion 132a-6 to a part of the first surface 1.

[0158] On the other hand, the first and second additional electrode layers 131-6 and 132-6 may be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties and structural stability. Furthermore, the first and second additional electrode layers 131-6 and 132-6 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin. In addition, the first and second additional electrode layers 131-6 and 132-6 may be formed by transferring a sheet containing conductive metal onto the main body.

[0159] The conductive metals included in the first and second additional electrode layers 131-6 and 132-6 can be materials with excellent electrical conductivity, but are not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. The first and second additional electrode layers 131-6 and 132-6 preferably contain one or more of Ni and Ni alloys, which can further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0160] Figure 17 is a schematic perspective view showing a stacked electronic component 1007 according to one embodiment of the present invention, and Figure 18 is a cross-sectional view along the line VII-VII' in Figure 17.

[0161] Referring to Figures 17 and 18, the stacked electronic component 1007 according to one embodiment of the present invention can have a configuration in which the average thickness t1 of the first and second plating layers 141-6 and 142-6 is thinner than the average thickness t2 of the insulating layer 151-6.

[0162] The insulating layer 151-6 plays a role in preventing the penetration of moisture and plating solution from the outside, but its weak connectivity with the plating layers 141-6 and 142-6 can cause delamination of the plating layers 141-6 and 142-6. If delamination occurs in the plating layers, the adhesion strength to the substrate 180 may decrease. Here, delamination of the plating layers 141-6 and 142-6 means that the plating layers partially peel off or are physically separated from the external electrodes 131-5 and 132-5. Due to the weak connectivity between the plating layers and the insulating layer, there is a higher possibility of gaps forming at the interface between the insulating layer and the plating layer, or of foreign matter penetrating, making it more vulnerable to external impacts and increasing the likelihood of delamination.

[0163] According to one embodiment of the present invention, by making the average thickness t1 of the plating layer thinner than the average thickness t2 of the insulating layer, the contact area between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength between the multilayer electronic component 1007 and the substrate 180.

[0164] The average thickness t1 of the first and second plating layers 141-6 and 142-6 can be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5 or the first and second band portions 131b-5 and 132b-5, and the average thickness t2 of the insulating layer 151-6 can be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5.

[0165] Figure 19 is a schematic perspective view showing a stacked electronic component 1008 according to one embodiment of the present invention, and Figure 20 is a cross-sectional view along the line XIV-XIV' in Figure 19.

[0166] Referring to Figures 19 and 20, a cover layer 171 containing an insulating material may be placed on the insulating layer 151-7 of the stacked electronic component 1008 according to one embodiment.

[0167] As described above, the Ba-containing oxide in the insulating layer 151-7 has hygroscopic properties that adsorb moisture and gases, and therefore adsorbs moisture and gases flowing in from the outside, playing a role in blocking moisture and gases from penetrating into the first and second connection parts 131a and 132a and the main body 110. In addition, if moisture or gases penetrate into the first and second connection parts 131a and 132a and the main body 110 through other routes, it plays a role in guiding the moisture and gases back to the outside. However, since it basically acts as a desiccant, if an excessive amount of moisture or gas penetrates, sufficient moisture resistance reliability may not be ensured. Therefore, by placing a cover layer 171 containing an insulating material on the insulating layer 151-7, it is possible to prevent moisture from penetrating the insulating layer 151-7 from the outside and to more reliably improve moisture resistance reliability. Furthermore, even if a crack occurs in the cover layer 171, the insulating layer 151-7 plays a role in preventing the crack from propagating into the first and second connection parts 131a, 132a and the main body 110, thereby suppressing the occurrence of cracks.

[0168] The insulating material included in the cover layer 171 is not particularly limited, and the cover layer 171 may contain an insulating material and have electrically insulating properties. For example, the cover layer 171 may contain one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may also contain glass.

[0169] In one embodiment, the material contained in the cover layer 171 may be glass. When the cover layer 171 contains glass, it may cause cracks to occur, but as described above, the insulating layer 151-7 suppresses the propagation of cracks into the first and second connection parts 131a, 132a and the main body 110, thus suppressing the occurrence of cracks. Therefore, when the material contained in the cover layer 171 is glass, the crack suppression effect of the insulating layer 151-7 of the present invention becomes more pronounced. More specifically, the material constituting the cover layer 171 is preferably a glass material with excellent resistance to plating solutions, in which the mole fraction of Si is 20 mol% or more and 65 mol% or less.

[0170] In one embodiment, the substance contained in the cover layer 171 may be one or more selected from epoxy resin, acrylic resin, and ethyl cellulose. This prevents moisture from penetrating the insulating layer 151-7 from the outside, thereby more reliably improving moisture resistance reliability.

[0171] Figure 21 is a schematic perspective view showing a stacked electronic component 2000 according to one embodiment of the present invention. Figure 22 is a cross-sectional view along the line VIII-VIII' in Figure 21.

[0172] Hereinafter, with reference to Figures 21 and 22, a stacked electronic component 2000 according to one embodiment of the present invention will be described in detail. However, to avoid redundant explanations, content that overlaps with what has been described above will be omitted.

[0173] A stacked electronic component 2000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 including first and second surfaces 1 and 2 facing in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in a third direction, a first connecting electrode 231a arranged on the third surface, and a first band electrode 2 arranged on the first surface and connected to the first connecting electrode. The device includes a first external electrode 231 including 31b, a second external electrode 232 including a second connecting electrode 232a disposed on the fourth surface and a second band electrode 232b disposed on the first surface and connected to the second connecting electrode, a first insulating layer 251 disposed on the first connecting electrode, a second insulating layer 252 disposed on the second connecting electrode, a first plating layer 241 disposed on the first band electrode, and a second plating layer 242 disposed on the second band electrode, wherein the first and second insulating layers 251 and 252 may contain an oxide containing Ba.

[0174] The first connecting electrode 231a may be positioned on the third surface 3 and connected to the first internal electrode 121, and the second connecting electrode 231b may be positioned on the fourth surface 4 and connected to the second internal electrode 122. Furthermore, a first insulating layer 251 may be positioned on the first connecting electrode 231a, and a second insulating layer 252 may be positioned on the second connecting electrode 232a.

[0175] Conventionally, when forming external electrodes, the main method used was to use a paste containing a conductive metal and dip the exposed surface of the main body's internal electrodes into the paste. However, external electrodes formed by the dipping method sometimes had excessive thickness in the center in the thickness direction. Furthermore, even without this problem of thickness unevenness in external electrodes formed by the dipping method, since the internal electrodes are exposed from the third and fourth surfaces of the main body, the external electrodes placed on the third and fourth surfaces were formed to be of a certain thickness or more in order to suppress the penetration of moisture and plating solution through the external electrodes.

[0176] In contrast, in the present invention, since insulating layers 251 and 252 are arranged on the connecting electrodes 231a and 232a, sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is reduced.

[0177] The first and second connecting electrodes 231a and 232a can be configured to correspond to the third and fourth surfaces, respectively, and the surfaces of the first and second connecting electrodes 231a and 232a facing the main body 110 can have the same area as the third and fourth surfaces of the main body 110, respectively. The first and second connecting electrodes 231a and 232a can be positioned within a range that does not deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a can be positioned so as not to extend to the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the main body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a can be positioned spaced apart from the fifth and sixth surfaces. This makes it possible to increase the capacity per unit volume of the stacked electronic component 2000 by minimizing the volume occupied by the external electrodes while ensuring sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232.

[0178] From this perspective, the first and second connecting electrodes 231a and 232a can be arranged at a distance from the second surface 2. That is, by not arranging the external electrodes 231 and 232 on the second surface, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacity per unit volume of the stacked electronic component 2000 can be further increased.

[0179] However, the connecting electrodes 231a and 232a may include corner portions that extend to and are positioned on the corners of the main body 110. That is, in one embodiment, the first connecting electrode includes a corner portion that extends and is positioned on the first to third corners and the second to third corners, and the second connecting electrode may include a corner portion that extends and is positioned on the first to fourth corners and the second to fourth corners.

[0180] Furthermore, the connecting electrodes 231a and 232a can have a uniform and thin thickness compared to external electrodes formed by the conventional dipping method.

[0181] The method for forming the connecting electrodes 231a and 232a is not particularly limited. For example, they may be formed by transferring sheets containing a conductive metal, an organic substance such as a binder, to the third and fourth surfaces.

[0182] The thickness of the connecting electrodes 231a and 232a is not particularly limited, but can be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a and 232a refers to the maximum thickness and can also refer to the size of the connecting electrodes 231a and 232a in the second direction.

[0183] In one embodiment, the first and second connecting electrodes 231a and 232a may contain the same metal and glass as the metal contained in the internal electrodes 121 and 122. By including the same metal as the metal contained in the internal electrodes 121 and 122, the electrical connectivity with the internal electrodes 121 and 122 can be improved, and by including glass in the first and second connecting electrodes 231a and 232a, the bonding strength with the main body 110 and / or insulating layers 251 and 252 can be improved. Here, the same metal as the metal contained in the internal electrodes 121 and 122 may be Ni.

[0184] The first and second insulating layers 251 and 252 are positioned on the first and second connecting electrodes 231a and 232a, respectively, and serve to prevent the formation of a plating layer on the first and second connecting electrodes 231a and 232a. In addition, the first and second insulating layers 251 and 252 improve sealing properties and minimize the penetration of moisture, plating solution, etc., from the outside.

[0185] The first and second insulating layers 251 and 252 may contain an oxide containing Ba. By applying an oxide containing Ba instead of a glass-based material to the first and second insulating layers 251 and 252, moisture resistance reliability can be further improved, and cracks due to thermal shrinkage and radial cracks due to metal diffusion can be suppressed.

[0186] The first and second band electrodes 231b and 232b may be arranged on the first surface 1 of the main body 110. The first and second band electrodes 231b and 232b can be electrically connected to the first and second internal electrodes 121 and 122, respectively, by contacting the first and second connecting electrodes 231a and 232a.

[0187] External electrodes formed by conventional dipping methods are formed thickly on the third and fourth surfaces, and partially extend to the first, second, fifth, and sixth surfaces, which presents a problem in that it is difficult to secure a high effective volume ratio.

[0188] In contrast, according to one embodiment of the present invention, by arranging the first and second connecting electrodes 231a and 232a on the surface where the internal electrodes are exposed, and the first and second band electrodes 231b and 232b on the surface that is mounted on the substrate, a high effective volume ratio can be secured.

[0189] On the other hand, if the internal electrodes 121 and 122 are stacked in the first direction, the stacked electronic component 2000 can be horizontally mounted on the substrate so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and if the internal electrodes 121 and 122 are stacked in the third direction, the stacked electronic component may be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0190] The first and second band electrodes 231b and 232b may be formed using any electrically conductive material such as metal, and the specific material can be determined by considering electrical properties and structural stability. For example, the first and second band electrodes 231 and 232b may be firing electrodes containing conductive metal and glass, or they may be formed by applying a paste containing conductive metal and glass to the first surface of the main body, but are not limited to these, and may also be a plated layer in which conductive metal is plated onto the first surface of the main body.

[0191] The conductive metals included in the first and second band electrodes 231b and 232b can be materials with excellent electrical conductivity, but are not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof, and may also include the same metals as those included in the internal electrodes 121 and 122.

[0192] On the other hand, in one embodiment, the first external electrode 231 further includes a third band electrode (not shown) arranged on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) arranged on the second surface 2 and connected to the second connecting electrode 232a.

[0193] In one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≦G1, B2≧G2, and B4≦G2 can be satisfied. This minimizes the volume occupied by the external electrodes, increases the capacity per unit volume of the stacked electronic component 2000, and increases the area in contact with the solder during mounting, thereby improving the bonding strength.

[0194] However, the present invention is not intended to be limited to B1≧G1, B3≦G1, B2≧G2, and B4≦G2, and cases satisfying B1≧G1, B3≧G1, B2≧G2, and B4≧G2 may also be included as one embodiment of the present invention. Therefore, in one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can be satisfied. As a result, either the first or second surface can be used as the mounting surface, improving the convenience of mounting.

[0195] The first and second plating layers 241 and 242 can be placed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 play a role in improving mounting characteristics. The first and second plating layers 241 and 242 are not particularly limited in type and may be plating layers containing one or more of Ni, Sn, Pd and their alloys, or may be formed in multiple layers.

[0196] As a more specific example of the first and second plating layers 241 and 242, the first and second plating layers 241 and 242 can be Ni plating layers or Sn plating layers, and can be in a configuration in which the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band electrodes 231b and 232b.

[0197] In one embodiment, the first and second plating layers 241 and 242 can be arranged to extend and cover a portion of the first and second connecting electrodes 231a and 232a, respectively.

[0198] When H1 is the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122, and H2 is the average size in the first direction from the extension of the first surface 1 to the ends of the first and second plating layers 241 and 242 placed on the first and second connecting electrodes 231a and 232a, the condition H1 > H2 (or H1 ≥ H2) can be satisfied. This suppresses the penetration of the plating solution into the internal electrodes during the plating process and improves reliability.

[0199] In one embodiment, the first and second insulating layers 251 and 252 are arranged to be in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and glass. By doing so, the plating layers 241 and 242 are not arranged in the areas of the outer surface of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are arranged, thereby effectively preventing corrosion of the external electrodes by the plating solution.

[0200] In one embodiment, the first plating layer 241 may be positioned to cover the edge of the first insulating layer 251 placed on the first external electrode 231, and the second plating layer 242 may be positioned to cover the edge of the second insulating layer 252 placed on the second external electrode 232. This strengthens the bonding force between the insulating layers 251, 252 and the plating layers 241, 242, improving the reliability of the multilayer electronic component 2000. Furthermore, by forming the first and second insulating layers 251, 252 before forming the plating layers 241, 242 on the external electrodes 231, 232, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layers before the plating layers, the plating layers 241, 242 can have a configuration that covers the edges of the insulating layers 251, 252.

[0201] In one embodiment, the first insulating layer 251 can be positioned to cover the edge of the first plating layer 241 placed on the first external electrode 231, and the second insulating layer 252 can be positioned to cover the edge of the second plating layer 242 placed on the second external electrode 232. This strengthens the bonding force between the insulating layer 251 and the plating layers 241 and 242, thereby improving the reliability of the multilayer electronic component 2000.

[0202] Figure 23 shows a modified example of Figure 21. Referring to Figure 23, in a modified example (2001) of a multilayer electronic component 2000 according to one embodiment of the present invention, the first and second insulating layers 251-1 and 252-1 can be connected to a single insulating layer 253-1 by extending to the fifth and sixth surfaces 5 and 6 and connecting them to each other. Here, the connected first and second insulating layers 253-1 may be arranged to cover a portion of the fifth and sixth surfaces.

[0203] Figure 24 is a schematic perspective view showing a stacked electronic component 2002 according to one embodiment of the present invention. Figure 25 is a cross-sectional view along the line IX-IX' in Figure 24.

[0204] Referring to Figures 24 and 25, in the stacked electronic component 2002 according to one embodiment of the present invention, the first and second plating layers 241-2 and 242-2 may be positioned below the extension line of the first surface. This minimizes the height of the solder during mounting and minimizes the mounting space.

[0205] Furthermore, the first and second insulating layers 251-2 and 252-2 may be arranged to extend below the extension line of the first surface and in contact with the first and second plating layers 241-2 and 242-2.

[0206] Figure 26 shows a modified example of Figure 24. Referring to Figure 26, a modified example (2003) of the stacked electronic component 2002 according to one embodiment of the present invention is such that the first and second insulating layers 251-3 and 252-3 can be connected to a single insulating layer 253-3 by extending to the fifth and sixth surfaces 5 and 6 and connecting them to each other. Here, the connected first and second insulating layers 253-3 may be arranged to cover the entirety of the fifth and sixth surfaces.

[0207] Figure 27 is a schematic perspective view showing a stacked electronic component 2004 according to one embodiment of the present invention. Figure 28 is a cross-sectional view along the line X-X' in Figure 27.

[0208] Referring to Figures 27 and 28, the stacked electronic component 2004 according to one embodiment of the present invention may further include an additional insulating layer 261 disposed on the first surface 1 and positioned between the first band electrode 231b and the second band electrode 232b. This prevents leakage currents and the like that may occur between the first band electrode 231b and the second band electrode 232b under high voltage current.

[0209] The type of additional insulating layer 261 is not particularly limited. For example, the additional insulating layer 261 may contain an oxide containing Ba, BaO, or BaO, similar to the first and second insulating layers 251-2 and 252-2. However, the additional insulating layer 261 and the first and second insulating layers 251-2 and 252-2 do not need to be made of the same material and may be formed from different materials. For example, it may contain one or more materials selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or it may contain glass.

[0210] Figure 29 shows a modified example of Figure 27. Referring to Figure 29, a modified example (2005) of a stacked electronic component 2004 according to one embodiment of the present invention can be connected to a single insulating layer 253-5 by having the first and second insulating layers 251-5 and 252-5 extend to the fifth and sixth surfaces 5 and 6 and connect to each other.

[0211] FIG. 30 is a perspective view schematically showing a stacked electronic component 2006 according to an embodiment of the present invention. FIG. 31 is a cross-sectional view taken along line XI-XI' of FIG. 30.

[0212] Referring to FIGS. 30 and 31, a stacked electronic component 2006 according to an embodiment of the present invention includes a first insulating layer 251-6 disposed on a first connection electrode 231a and a second insulating layer 252-6 disposed on a second connection electrode 232a. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 241-6 and 242-6 disposed on the first and second connection electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area contacting the solder during mounting can be increased, and the fixing strength can be improved.

[0213] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is equal to or greater than T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0214] FIG. 32 is a view showing a modification of FIG. 30. Referring to FIG. 32, in a modification (2007) of the stacked electronic component 2006 according to an embodiment of the present invention, the first and second insulating layers 251-7 and 252-7 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected to one insulating layer 253-7.

[0215] FIG. 33 is a perspective view schematically showing a stacked electronic component 2008 according to an embodiment of the present invention. FIG. 34 is a cross-sectional view taken along line XII-XII' of FIG. 33.

[0216] Referring to Figures 33 and 34, a stacked electronic component 2008 according to one embodiment of the present invention can be connected to a single insulating layer 253-8 by having the first and second insulating layers 251-8 and 252-8 extend to the second, fifth, and sixth surfaces 2, 5, and 6 and be connected to each other. As shown in Figure 33, the insulating layer 253-8 can be configured to completely cover the second surface, or to partially cover the fifth and sixth surfaces.

[0217] Figure 35 is a schematic perspective view showing a stacked electronic component 2009 according to one embodiment of the present invention. Figure 36 is a cross-sectional view along the line XIII-XIII' in Figure 35.

[0218] Referring to Figures 35 and 36, the stacked electronic component 2009 according to one embodiment of the present invention can have a configuration in which the average thickness t1' of the first and second plating layers 241-9, 242-9 is thinner than the average thickness t2' of the first and second insulating layers 251-9, 252-9.

[0219] According to one embodiment of the present invention, by making the average thickness t1' of the first and second plating layers 241-9 and 242-9 thinner than the average thickness t2' of the first and second insulating layers 251-9 and 252-9, the area in contact between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength between the multilayer electronic component 2009 and the substrate 180.

[0220] The average thickness t1' of the first and second plating layers 241-9 and 242-9 can be the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a or the first and second band electrodes 231b and 232b, and the average thickness t2' of the insulating layers 251-9 and 252-9 can be the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a.

[0221] Figure 37 shows a modified example of Figure 35. Referring to Figure 37, a modified example (2010) of a stacked electronic component 2009 according to one embodiment of the present invention can be connected to a single insulating layer 253-10 by having the first and second insulating layers 251-10 and 252-10 extend to the fifth and sixth surfaces 5 and 6 and connect to each other.

[0222] Figure 38 is a schematic perspective view of a stacked electronic component 2011 according to one embodiment of the present invention. Figure 39 is a cross-sectional view along the line XV-XV' in Figure 38.

[0223] Referring to Figures 38 and 39, first and second cover layers 271 and 272 containing insulating material can be arranged on the first and second insulating layers 251-11 and 252-11 of a stacked electronic component 2011 according to one embodiment.

[0224] As described above, by placing cover layers 271 and 272 containing insulating material on the insulating layers 251-11 and 252-11, moisture can be prevented from penetrating the insulating layers 251-11 and 252-11 from the outside, thereby more reliably improving moisture resistance reliability. Furthermore, even if cracks occur in the cover layers 271 and 272, the insulating layers 251-11 and 252-11 play a role in preventing the cracks from propagating into the first and second connecting electrodes 231a and 232a and the main body 110, thereby suppressing the occurrence of cracks.

[0225] The insulating material contained in the cover layers 271 and 272 is not particularly limited, and the cover layers 271 and 272 may contain an insulating material and have electrically insulating properties. For example, the cover layers 271 and 272 may contain one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may also contain glass.

[0226] In one embodiment, the material contained in the cover layers 271 and 272 may be glass. When the cover layers 271 and 272 contain glass, it may cause cracks to occur, but as described above, the insulating layers 251-11 and 252-11 suppress the propagation of cracks into the first and second connecting electrodes 231a and 232a and the main body 110, thus suppressing the occurrence of cracks. Therefore, when the material contained in the cover layers 271 and 272 is glass, the crack suppression effect of the insulating layers 251-11 and 252-11 of the present invention becomes more pronounced. More specifically, the material constituting the cover layers 271 and 272 is preferably a glass material with excellent resistance to plating solutions, and in which the mole fraction of Si is 20 mol% or more and 65 mol% or less.

[0227] In one embodiment, the substances contained in the cover layers 271 and 272 may be one or more selected from epoxy resin, acrylic resin, and ethyl cellulose. This prevents moisture from penetrating the insulating layers 251-11 and 252-11 from the outside, thereby more reliably improving moisture resistance reliability.

[0228] Figure 40 is a schematic perspective view of a stacked electronic component 3000 according to one embodiment of the present invention. Figure 41 is a cross-sectional view along the line XVI-XVI' in Figure 40. Figure 42 is an enlarged view of region K1 in Figure 40.

[0229] Referring to Figures 40 to 42, a stacked electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction, a first connecting portion 331a located on the third surface of the body, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 3 extending from the first connecting portion to the corner connecting the second and third surfaces of the body. The device includes a first external electrode 331 including 31c, a second external electrode 332 including a second connecting portion 332a disposed on the fourth surface of the main body, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second and fourth surfaces of the main body, an insulating layer 351 disposed on the first and second connecting portions 331a, 332a and disposed to cover the second surface and the first and second corner portions, a first plating layer 341 disposed on the first band portion, and a second plating layer 342 disposed on the second band portion, wherein the insulating layer 351 may contain an oxide containing Ba.

[0230] In one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the first corner portion 331c, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion 332c, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes 331 and 332 and increases the capacity per unit volume of the stacked electronic component 3000.

[0231] Here, if we let B1 be the average size in the second direction from the extension line of the third surface to the end of the first band portion 331b, and B2 be the average size in the second direction from the extension line of the fourth surface to the end of the second band portion 332b, then B1≧G1 and B3≧G2 can be satisfied. This increases the area in contact with the solder during mounting and improves the bonding strength.

[0232] A stacked electronic component 3000 according to one embodiment may include a body 110 that includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and has first and second faces facing in a first direction, third and fourth faces connected to the first and second faces and facing in a second direction, and fifth and sixth faces connected to the first to fourth faces and facing in a third direction. The body 110 of the stacked electronic component 3000 may have the same configuration as the body 110 of the stacked electronic component 1000, except that the end of the first or second face of the body 110 is contracted, as will be described later.

[0233] External electrodes 331 and 332 can be arranged on the third and fourth surfaces 3 and 4 of the main body 110. The external electrodes 331 and 332 may include a first external electrode 331 arranged on the third surface 3 of the main body 110 and connected to a first internal electrode 121, and a second external electrode 332 arranged on the fourth surface 4 of the main body 110 and connected to a second internal electrode 122.

[0234] The external electrodes 331 and 332 may include a first external electrode 331 which includes a first connecting portion 331a located on the third surface, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second surface and the third surface, and a second external electrode 332 which includes a second connecting portion 332a located on the fourth surface, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to the corner connecting the second surface and the fourth surface. The first connecting portion 331a may be connected to the first internal electrode 121 on the third surface, and the second connecting portion 332a may be connected to the second internal electrode 122 on the fourth surface.

[0235] In one embodiment, the first and second connecting portions 331a and 332a can be arranged at a distance from the fifth and sixth surfaces. This minimizes the specific gravity occupied by the external electrodes 331 and 332, making the multilayer electronic component 3000 smaller.

[0236] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference occurs due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to fifth surfaces and / or the corners connecting the second surface with the third to fifth surfaces may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded in a separate process, so that the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces have a rounded shape.

[0237] The above-mentioned corners may include the 1st-3rd corner C1-3 connecting the 1st and 3rd faces, the 1st-4th corner C1-4 connecting the 1st and 4th faces, the 2nd-3rd corner C2-3 connecting the 2nd and 3rd faces, and the 2nd-4th corner C2-4 connecting the 2nd and 4th faces. Furthermore, the above-mentioned corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. However, in order to suppress the step caused by the internal electrodes 121 and 122, if, after lamination, the internal electrodes are cut so that they are exposed from the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114 and 115, then the portions connecting the first surface with the fifth and sixth surfaces, and the portions connecting the second surface with the fifth and sixth surfaces, may not have a contracted form.

[0238] On the other hand, the first to sixth surfaces of the main body 110 are almost flat, and the non-flat areas can be considered as corners. In addition, the areas of the external electrodes 331 and 332 that are located on the corners can be considered as corner sections.

[0239] From this perspective, the first and second corner portions 331c and 332c can be positioned below the extension line E2 of the second surface, and the first and second corner portions 331c and 332c can be positioned away from the second surface. That is, by not positioning the external electrodes 331 and 332 on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, and the capacity per unit volume of the stacked electronic component 3000 can be further increased. In addition, the first corner portion 331c may be positioned on a part of the second-third corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c may be positioned on a part of the second-fourth corner C2-4 connecting the fourth surface and the second surface.

[0240] The extension line E2 of the second face can be defined as follows:

[0241] In the length-thickness cross-section (LT cross-section) obtained by cutting the stacked electronic component 3000 in the center in the width direction, when seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction with equal spacing in the length direction from the third face to the fourth face, the straight line passing through the point where P2 intersects the second face and the point where P4 intersects the second face can be defined as the extension line E2 of the second face.

[0242] On the other hand, the external electrodes 331 and 332 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties and structural stability, and may even have a multilayer structure.

[0243] The external electrodes 331 and 332 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0244] Furthermore, the external electrodes 331 and 332 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. In addition, the external electrodes 331 and 332 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0245] The conductive metal included in the external electrodes 331 and 332 can be any material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. The external electrodes 331 and 332 preferably contain one or more of Ni and Ni alloys, which can further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0246] The insulating layer 351 can be placed on the first and second connection portions 331a and 332a.

[0247] The first and second connection portions 331a and 332a are connected to the internal electrodes 121 and 122, and therefore can become pathways for the penetration of plating solution during the plating process or for the penetration of moisture during actual use. In the present invention, since an insulating layer 351 is placed on the connection portions 331a and 332a, it is possible to prevent the penetration of moisture from the outside or the penetration of plating solution.

[0248] The insulating layer 351 can be positioned in contact with the first and second plating layers 341 and 342. Here, the insulating layer 351 may be in contact with the first and second plating layers 341 and 342 in a manner that covers a portion of their edges, or the first and second plating layers 341 and 342 may be in contact with the insulating layer 351 in a manner that covers a portion of its edges.

[0249] The insulating layer 351 can be placed on the first and second connection portions 331a and 332a and positioned to cover the second surface and the first and second corner portions 331c and 332c. Furthermore, by having the insulating layer 351 cover the areas where the ends of the first and second corner portions 331c and 332c and the main body 110 are in contact, thereby blocking moisture penetration paths, the moisture resistance reliability can be further improved.

[0250] The insulating layer 351 can be positioned on the second surface and extend to the first and second connection portions 331a and 332a. Alternatively, if the external electrodes 331 and 332 are not positioned on the second surface, the insulating layer can be positioned to cover the entire second surface. On the other hand, the insulating layer 351 does not necessarily have to be positioned on the second surface; it may not be positioned on part or all of the second surface, and the insulating layer may be separated into two parts and positioned on the first and second connection portions 331a and 332a respectively. However, even in this case, the insulating layer can be positioned to cover the entire first and second corner portions 331c and 332c. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension line of the second surface. Furthermore, the insulating layer may not be positioned on the second surface at all, but may extend from the first and second connection portions 331a and 332a to the fifth and sixth surfaces, forming a single insulating layer.

[0251] In one embodiment, the insulating layer 351 is arranged to cover a portion of the fifth and sixth surfaces, thereby improving reliability. In this case, the portion of the fifth and sixth surfaces not covered by the insulating layer can be exposed to the outside.

[0252] Furthermore, the insulating layer 351 can be positioned to cover the entirety of the fifth and sixth surfaces. In this case, since the fifth and sixth surfaces are not exposed to the outside, moisture resistance reliability can be further improved.

[0253] The insulating layer 351 serves to prevent the formation of plating layers 341 and 342 on the external electrodes 331 and 332 on which the insulating layer 351 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside. The components, composition, average thickness, and effects of the insulating layer 351 are the same as those of the insulating layers 151, 251, 252, and 253 included in the multilayer electronic components 1000, 2000 or various embodiments thereof, so a detailed explanation of these is omitted.

[0254] The first and second plating layers 341 and 342 can be placed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 play a role in improving mounting characteristics, and by placing the plating layers 341 and 342 on the band portions 331b and 332b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. The first and second plating layers 341 and 342 can have one end in contact with the first surface and the other end in contact with the insulating layer 351.

[0255] The plating layers 341 and 342 are not particularly limited in type and may be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and may also be formed in multiple layers.

[0256] As a more specific example of the plating layers 341 and 342, the plating layers 341 and 342 may be Ni plating layers or Sn plating layers, and may be in a form in which the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band portions 331b and 332b.

[0257] In one embodiment, the first plating layer 341 can be positioned to cover the edge of the insulating layer 351 placed on the first external electrode 331, and the second plating layer 342 can be positioned to cover the edge of the insulating layer 351 placed on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the insulating layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layers 341 and 342 can have a configuration that covers the edge of the insulating layer 351.

[0258] In one embodiment, the insulating layer 351 can be positioned to cover the edge of the first plating layer 341 placed on the first external electrode 331, and the insulating layer 351 can be positioned to cover the edge of the second plating layer 342 placed on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000.

[0259] In one embodiment, the first and second plating layers 341 and 342 can be arranged to extend so as to cover a part of the first and second connection portions 331a and 332a, respectively. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 341 and 342 arranged on the first and second connection portions 331a and 332a is H2, H1 > H2 (or H1 ≥ H2) can be satisfied. Thereby, it is possible to suppress the plating solution from penetrating into the internal electrode during the plating process and improve the reliability.

[0260] In one embodiment, when the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface to the ends of the plating layers 341 and 342 arranged on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the adhesion strength can be improved. More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0261] In one embodiment, the first and second plating layers 341 and 342 can be arranged below the extension line of the first surface. Thereby, the height of the solder during mounting can be minimized, and the mounting space can be minimized. Also, the insulating layer 351 can be arranged to extend below the extension line of the first surface and contact the first and second plating layers 341 and 342.

[0262] In one embodiment, when the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0263] When B1 / L and B2 / L are less than 0.2, it is difficult to ensure sufficient adhesion strength. On the other hand, when B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 331b and the second band portion 332b under high voltage current, and the first band portion 331b and the second band portion 332b may be electrically connected due to plating bleeding during the plating process.

[0264] In one embodiment, an additional insulating layer disposed on the first surface and disposed between the first band portion 331b and the second band portion 332b may be further included. By doing so, leakage current and the like that may occur between the first band portion 331b and the second band portion 332b under high voltage current can be prevented.

[0265] The type of the additional insulating layer does not need to be particularly limited. For example, the additional insulating layer may include an oxide containing Ba, similar to the insulating layer 351. However, the additional insulating layer and the insulating layer 351 do not need to be limited to the same material and may be formed of different materials. For example, it may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may include glass.

[0266] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b can be longer than the average length B3 of the first corner portion 331c, and the average length B2 of the second band portion 332b can be longer than the average length B4 of the second corner portion 332. Thereby, the area contacting the solder during mounting can be increased, and the fixing strength can be improved.

[0267] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0268] In one embodiment, the average thicknesses of the first and second plating layers 341 and 342 can be thinner than the average thickness of the insulating layer 351.

[0269] The insulating layer 351 plays a role in preventing the penetration of moisture from the outside and the penetration of the plating solution. However, since the connectivity with the plating layers 341 and 342 is weak, it can cause delamination of the plating layer. When delamination occurs in the plating layer, the fixing strength with the substrate can decrease. Here, delamination of the plating layer means that the plating layer is partially peeled off or physically separated from the external electrodes 331 and 332. Since the connectivity between the plating layer and the insulating layer is weak, there is a high possibility that gaps occur or foreign substances penetrate at the interface between the insulating layer and the plating layer, making it vulnerable to external impacts and increasing the possibility of delamination.

[0270] According to one embodiment of the present invention, by making the average thickness of the plating layer thinner than the average thickness of the insulating layer, the contact area between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength between the multilayer electronic component 3000 and the substrate.

[0271] There is no particular limit to the size of the 3000 multilayer electronic component.

[0272] However, in order to achieve both miniaturization and high capacity simultaneously, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, the improvement in reliability and capacity per unit volume according to the present invention becomes more pronounced in stacked electronic components 3000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0273] Therefore, considering manufacturing tolerances, the size of external electrodes, etc., the reliability improvement effect according to the present invention becomes more pronounced when the length of the stacked electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 3000 refers to the maximum size of the stacked electronic component 3000 in the second direction, and the width of the stacked electronic component 3000 refers to the maximum size of the stacked electronic component 3000 in the third direction.

[0274] Although embodiments of the present invention have been described in detail above, the present invention is not limited to the embodiments and accompanying drawings, but is limited by the claims attached. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0275] It should be noted that the expression "one embodiment" used in this invention does not mean that each embodiment is the same as another, but is provided to emphasize and describe the unique and distinct features of each embodiment. However, the above-presented embodiment does not preclude its realization in combination with the features of other embodiments. For example, a matter described in a particular embodiment can be understood as a description according to another embodiment, even if it is not described in another embodiment, as long as there is no description in the other embodiment that contradicts or contradicts that matter.

[0276] The terms used in this invention are used solely to describe one embodiment and are not intended to limit the invention. Here, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of symbols]

[0277] 1000, 2000, 3000 Stacked Electronic Components 1100 Mounting board 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 131, 231, 331 1st external electrode 132, 232, 332 2nd external electrode 134, 135 Additional electrode layer 141, 142, 241, 242, 341, 342 Plating layer 151, 251, 252, 253, 351 Insulating layer 161, 261 Additional insulating layer 171, 271, 272 Cover layer 180 circuit boards 181, 182 Electrode Pads 191, 192 Handa

Claims

1. A multilayer electronic component including a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer therebetween, and a main body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction. A first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a part of the first surface. A second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a part of the first surface. An insulating layer including a first insulating layer disposed on the first connection portion and a second insulating layer disposed on the second connection portion. A plating layer including a first plating layer disposed on the first band portion and a second plating layer disposed on the second band portion. The multilayer electronic component, wherein the insulating layer contains BaO.

2. The multilayer electronic component according to Claim 1, wherein the molar number of Ba element with respect to the total molar number of the elements other than oxygen among the elements constituting the insulating layer is 0.95 or more.

3. The multilayer electronic component according to Claim 1, wherein the average thickness of the insulating layer is 50 nm or more and 3 μm or less.

4. The multilayer electronic component according to Claim 1, further including a cover layer disposed on the insulating layer and containing an insulating substance.

5. The multilayer electronic component according to Claim 4, wherein the insulating substance contained in the cover layer is glass.

6. The multilayer electronic component according to Claim 4, wherein the insulating substance contained in the cover layer is one or more selected from epoxy resin, acrylic resin, and ethyl cellulose.

7. The multilayer electronic component according to Claim 1, when the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and the average size in the first direction from the extension line of the first surface to the end portions of the plating layers disposed on the first and second connection portions is H2, H1 > H2 is satisfied.

8. The multilayer electronic component according to Claim 1, when the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and the average size in the first direction from the extension line of the first surface to the end portions of the plating layers disposed on the first and second connection portions is H2, H1 < H2 is satisfied. When the average size of the main body in the first direction is T, The multilayer electronic component according to claim 8, wherein H2 < T / 2 is satisfied.

10. The multilayer electronic component according to claim 1, wherein the first and second plating layers are disposed below the extension line of the first surface.

11. When the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, The multilayer electronic component according to claim 1, which satisfies 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.

4.

12. The multilayer electronic component according to claim 1, further including an additional insulating layer disposed on the first surface and between the first band portion and the second band portion.

13. The multilayer electronic component according to claim 1, wherein the average thickness of the dielectric layer is 0.35 μm or less.

14. The multilayer electronic component according to claim 1, wherein the average thicknesses of the first and second internal electrodes are each 0.35 μm or less.

15. Including a capacitance forming portion including first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and a cover portion disposed on both end surfaces of the capacitance forming portion in the first direction, The multilayer electronic component according to claim 1, wherein the average size of the cover portion in the first direction is 15 μm or less.

16. The multilayer electronic component according to claim 1, wherein the average thicknesses of the first and second plating layers are thinner than the average thickness of the insulating layer.

17. The first plating layer is disposed so as to cover an end portion close to the first surface of the first insulating layer, and the second plating layer is disposed so as to cover an end portion close to the first surface of the second insulating layer. The multilayer electronic component according to claim 1.

18. The first insulating layer is disposed so as to cover an end portion disposed on the first external electrode of the first plating layer, and the second insulating layer is disposed so as to cover an end portion disposed on the second external electrode of the second plating layer. The multilayer electronic component according to claim 1.

19. The first external electrode includes a first side surface band portion extending from the first connection portion to a part of the fifth and sixth surfaces, The second external electrode includes a second side surface band portion extending from the second connection portion to a part of the fifth and sixth surfaces. The laminated electronic component according to claim 1, wherein the sizes of the first and second side band portions in the second direction increase as they approach the first surface.

20. The laminated electronic component according to claim 1, wherein the first and second external electrodes are arranged at a distance from the fifth and sixth surfaces.

21. The laminated electronic component according to claim 1, wherein the first and second external electrodes are arranged at a distance from the second surface.

22. The laminated electronic component according to claim 1, wherein the first and second insulating layers extend to the second surface and are connected to each other.

23. The laminated electronic component according to claim 1, wherein the first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other.

24. The laminated electronic component according to claim 1, wherein the insulating layer is not arranged on the second, fifth, and sixth surfaces.

25. The first external electrode includes a third band portion extending from the first connection portion to a part of the second surface, The laminated electronic component according to claim 1, wherein the second external electrode includes a fourth band portion extending from the second connection portion to a part of the second surface.

26. The main body includes a first - 3 corner connecting the first surface and the third surface, a first - 4 corner connecting the first surface and the fourth surface, a second - 3 corner connecting the second surface and the third surface, and a second - 4 corner connecting the second surface and the fourth surface, The first - 3 corner and the second - 3 corner have a form that contracts toward the center of the main body in the first direction as they approach the third surface, and the first - 4 corner and the second - 4 corner have a form that contracts toward the center of the main body in the first direction as they approach the fourth surface. The laminated electronic component according to claim 1, wherein the first external electrode includes a first corner portion extending from the first connection portion and arranged on the first - 3 corner and the second - 3 corner, and the second external electrode includes a second corner portion extending from the second connection portion and arranged on the first - 4 corner and the second - 4 corner.

27. When the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, The multilayer electronic component according to claim 26, satisfying B3 ≤ G1 and B4 ≤ G2.

28. The first external electrode includes a first connection electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connection electrode. The second external electrode includes a second connection electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connection electrode. The multilayer electronic component according to claim 1.

29. The first external electrode is disposed on the second surface and further includes a third band electrode connected to the first connection electrode. The second external electrode is disposed on the second surface and further includes a fourth band electrode connected to the second connection electrode. The multilayer electronic component according to claim 28.

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