Substrate holding device, substrate manufacturing device, and substrate manufacturing method

Abstract

To provide a substrate holding device that can prevent defects from occurring on a substrate.SOLUTION: A substrate holding device 1 includes a holding roller 51 and a fluid blowing device 60 that blows pressurized fluid onto a bevel portion B held by the holding roller 51.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a substrate holding device, a substrate manufacturing device, and a substrate manufacturing method. [Background technology]

[0002] In 3D packaging technology, which stacks and integrates multiple substrates, the device surfaces of multiple substrates are bonded together, and then the non-device surface of one of the substrates is ground. The substrates have a rounded or chamfered shape (beveled portion) on their periphery.

[0003] Therefore, when the bevel portion becomes thin due to grinding, a sharp edge (knife edge portion) is formed, which may result in defects such as cracks and chips. Therefore, in the bevel fill technology, the gaps between the bevel portions in the laminated substrate are filled with a filler, which supports the knife edge portion and prevents the occurrence of defects. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-38834 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, if air bubbles are mixed in the filler applied to the gaps between the beveled portions, the air bubbles (i.e., cavities) inside the filler may cause defects in the substrate. More specifically, when a grinding load is applied to the knife edge portion, the filler may not be able to fully support the knife edge portion in the cavity portion, and as a result, defects such as cracks and chips may occur in the substrate. Therefore, it is important to remove the air bubbles mixed in the filler from the viewpoint of preventing defects from occurring in the substrate.

[0006] In addition, it is also important to remove foreign matter (e.g., liquid, particles, etc.) attached to the bevel portion of the substrate in order to prevent defects from occurring in the substrate. Not only in the case of the laminated substrate described above, but also in the case of a general substrate (i.e., a substrate that is not laminated), if foreign matter is attached to the bevel portion of the substrate, the substrate may be contaminated, which may result in defects in the substrate.

[0007] Thus, keeping the bevel portion of the substrate clean, including removing any air bubbles mixed in the filler and removing any foreign matter from the bevel portion, is important from the standpoint of preventing defects from occurring in the substrate.

[0008] SUMMARY OF THE PRESENT DISCLOSURE In view of the above, an object of the present invention is to provide a substrate holding device, a substrate manufacturing apparatus, and a substrate manufacturing method that are capable of preventing defects from occurring in a substrate. [Means for solving the problem]

[0009] In one aspect, a substrate holding device is provided, comprising: a holding roller that holds a bevel portion of a substrate while rotating the substrate; and a fluid blowing device that is connected to the holding roller and blows pressurized fluid onto the bevel portion held by the holding roller.

[0010] In one embodiment, the fluid blowing device includes a fluid supply line coupled to a blowing port formed in the holding roller, and a fluid supply device connected to the fluid supply line. In one embodiment, the substrate holding device includes a clamp device that moves a first clamping portion and a second clamping portion of the holding roller, the first clamping portion and the second clamping portion clamping the bevel portion, closer to or farther away from each other. In one embodiment, the substrate holding device includes a roller moving device that moves the holding roller between a contact position in contact with the bevel portion and a spaced position away from the bevel portion.

[0011] In one embodiment, a substrate manufacturing apparatus for manufacturing a laminated substrate formed by bonding a first substrate and a second substrate is provided, the substrate manufacturing apparatus includes a holding roller for holding and rotating the laminated substrate, a fluid blowing device connected to the holding roller for blowing a pressurized fluid into a gap in the laminated substrate held by the holding roller, and an application device for applying a filler into the gap.

[0012] In one embodiment, the fluid blowing device includes a fluid supply line coupled to a blowing port formed in the holding roller, and a fluid supply device connected to the fluid supply line. In one embodiment, the substrate manufacturing apparatus includes a clamping device that moves a first clamping portion and a second clamping portion of the holding roller, the first clamping portion and the second clamping portion clamping the bevel portion of the laminated substrate, closer to or farther away from each other. In one embodiment, the substrate manufacturing apparatus includes a roller moving device that moves the support roller between a contact position in contact with a bevel portion of the laminated substrate and a spaced position spaced from the bevel portion.

[0013] In one embodiment, the fluid ejection device includes a heater that heats the fluid to be ejected onto the bevel portion of the laminated substrate. In one embodiment, the application device includes a spray nozzle that sprays pressurized fluid onto the filler that is supplied to a supply nozzle that supplies the filler toward the gap.

[0014] In one embodiment, a method for manufacturing a laminated substrate formed by bonding a first substrate and a second substrate is provided, the method including the steps of rotating the laminated substrate while holding the laminated substrate with a holding roller, applying a filler to gaps in the laminated substrate, and spraying a pressurized fluid into the gaps using a device connected to the holding roller.

[0015] In one embodiment, the step of blowing out the pressurized fluid includes the step of blowing out the pressurized fluid from a blowing port formed in the support roller. In one embodiment, the substrate manufacturing method includes a step of moving a first clamping portion and a second clamping portion of the holding roller, the first clamping portion and the second clamping portion clamping the bevel portion of the laminated substrate, closer to or farther away from each other. In one aspect, the substrate manufacturing method includes a step of moving the support roller between a contact position in contact with a bevel portion of the laminated substrate and a spaced position spaced from the bevel portion.

[0016] In one aspect, the substrate manufacturing method includes a step of heating a fluid to be sprayed onto a bevel portion of the laminated substrate. In one aspect, the substrate manufacturing method includes injecting a pressurized fluid onto filler material supplied to a supply nozzle that supplies the filler material toward the gap. Effect of the Invention

[0017] The fluid blowing device can keep the bevel portion of the substrate clean by blowing pressurized fluid onto the bevel portion of the substrate, thereby preventing defects from occurring on the substrate. [Brief description of the drawings]

[0018] [Figure 1] 1(a) and 1(b) are enlarged cross-sectional views showing the peripheral portion of a wafer, which is an example of a substrate. [Diagram 2] FIG. 2(a) is a schematic diagram showing an example of a laminated wafer formed by bonding two wafers, and FIG. 2(b) is a schematic diagram showing the laminated wafer after the second wafer shown in FIG. 2(a) has been ground (thinned). [Diagram 3] FIG. 1 illustrates an embodiment of a substrate manufacturing apparatus. [Figure 4] FIG. 2 illustrates an embodiment of a substrate holding device. [Diagram 5] 5(a) and 5(b) are diagrams showing how pressurized fluid is injected into the gap between stacked wafers. [Figure 6] 1A to 1C are diagrams illustrating a stacking process of stacked wafers. [Figure 7] FIG. 2 is a diagram showing a clamping device that clamps stacked wafers with holding rollers. [Figure 8] FIG. 13 shows another embodiment of the fluid ejection device. [Figure 9] FIG. 13 is a diagram showing another embodiment of the coating device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] 1(a) and 1(b) are enlarged cross-sectional views showing the peripheral portion of a wafer, which is an example of a substrate. More specifically, FIG. 1(a) is a cross-sectional view of a so-called straight type wafer, and FIG. 1(b) is a cross-sectional view of a so-called round type wafer. In the wafer W in FIG. 1(a), the bevel portion is the outermost peripheral surface (indicated by the symbol B) of the wafer W, which is composed of an upper inclined portion (upper bevel portion) P, a lower inclined portion (lower bevel portion) Q, and a side portion (apex) R.

[0020] In the wafer W of FIG. 1(b), the bevel portion is a portion (indicated by the symbol B) having a curved cross section that constitutes the outermost peripheral surface of the wafer W. The top edge portion E1 is a flat portion that is located radially inward from the bevel portion B and radially outward from the region D where devices are formed. The top edge portion E1 may also include the region where devices are formed. The bottom edge portion E2 is a flat portion that is located on the opposite side to the top edge portion E1 and radially inward from the bevel portion B. The top edge portion E1 and bottom edge portion E2 are sometimes collectively referred to as near edge portions.

[0021] Fig. 2(a) is a schematic diagram showing an example of a laminated wafer in which two wafers are bonded together, and Fig. 2(b) is a schematic diagram showing the laminated wafer after the second wafer shown in Fig. 2(a) has been ground (thinned). The laminated wafer Ws shown in Fig. 2(a) is manufactured by bonding the rounded first wafer W1 and second wafer W2 shown in Fig. 1(b).

[0022] As shown in Fig. 2(b), when the second wafer W2 is thinned, a knife edge portion NE is formed on the peripheral portion of the second wafer W2. This knife edge portion NE is easily chipped by physical contact, which may result in defects such as cracks and chips in the stacked wafers Ws. Therefore, the knife edge portion NE is effectively protected by applying a filler between the first wafer W1 and the second wafer W2 of the stacked wafers Ws and curing the filler.

[0023] However, if air bubbles are mixed in the filler, there is a risk that defects such as cracks and chips will occur in the knife edge portion NE. It is important to remove the air bubbles mixed in the filler from the viewpoint of preventing defects from occurring in the laminated wafers Ws.

[0024] As described above, it is also important to remove foreign matter (e.g., liquid, particles, etc.) adhering to the bevel portion B of the wafer W in order to prevent defects from occurring in the wafer W. Hereinafter, a substrate manufacturing apparatus capable of preventing defects from occurring in the wafer W (including stacked wafers Ws) will be described with reference to the drawings.

[0025] 3 is a diagram showing an embodiment of a substrate manufacturing apparatus. The substrate manufacturing apparatus is an apparatus for manufacturing (i.e., processing) a laminated wafer Ws formed by bonding a first wafer W1 and a second wafer W2 together. Therefore, the substrate manufacturing apparatus may be called a substrate processing apparatus.

[0026] The substrate manufacturing apparatus includes a substrate holding device 1 that holds stacked wafers Ws, and an application device 2 that applies filler F to the gap between the bevel portion B of the first wafer W1 and the bevel portion B of the second wafer W2 (i.e., the gap between the stacked wafers Ws).

[0027] The coating device 2 is disposed above the stacked wafers Ws held vertically. More specifically, the stacked wafers Ws are held with their planes perpendicular to the horizontal plane. In other words, the stacked wafers Ws are held in an upright position. The coating device 2 includes a supply nozzle 4 that supplies the filler F toward the gaps between the stacked wafers Ws, and a support arm 3 that supports the supply nozzle 4.

[0028] Fig. 4 is a diagram showing one embodiment of a substrate holding device. As shown in Fig. 4, the substrate holding device 1 includes a holding roller 51 that rotates the stacked wafers Ws while holding the peripheral portion of the stacked wafers Ws, and a fluid blowing device 60 that is connected to the holding roller 51 and blows a pressurized fluid onto the peripheral portion of the stacked wafers Ws held by the holding roller 51.

[0029] The pressurized fluid is a fluid to which kinetic energy has been imparted. In this embodiment, the pressurized fluid refers to a gas pressurized to a pressure required to remove air bubbles from the filling material F.

[0030] Holding the peripheral portion of the stacked wafers Ws with the holding rollers 51 can prevent foreign matter from adhering to the front (and back) surfaces of the stacked wafers Ws. In the embodiment shown in Fig. 4, the substrate holding device 1 includes four holding rollers 51, but the number of holding rollers 51 is not limited to this embodiment as long as it is capable of holding the stacked wafers Ws. In this embodiment, the substrate holding device 1 holds the stacked wafers Ws in the vertical direction, but it may hold them in the horizontal direction.

[0031] As shown in FIG. 4, each holding roller 51 includes a first clamping portion 53A and a second clamping portion 53B for clamping the peripheral portion of the stacked wafers Ws, and a shaft portion 54 disposed between the first clamping portion 53A and the second clamping portion 53B.

[0032] The substrate holding device 1 includes a roller rotation device 70 that rotates the holding rollers 51. The roller rotation device 70 includes a connection rod 71 connected to the holding rollers 51 (more specifically, the first clamping unit 53A (or the second clamping unit 53B)), and a motor 72 that rotates the connection rod 71.

[0033] The fluid blowing device 60 includes a fluid supply line 61 connected to a blowing port 52 formed on the outer circumferential surface of the shaft portion 54, a fluid supply device 62 connected to the fluid supply line 61, and an on-off valve 63 for opening and closing the fluid supply line 61. In the embodiment shown in FIG. 4, a plurality of blowing ports 52 are formed, but at least one blowing port 52 may be formed. The blowing port 52 is formed on the outer circumferential surface of the shaft portion 54 of the holding roller 51. Therefore, when the holding roller 51 holds the stacked wafers Ws, the blowing port 52 faces the gaps in the stacked wafers Ws.

[0034] As long as the pressurized fluid can be supplied to the gaps between the stacked wafers Ws, the outlet 52 does not necessarily have to be formed in the shaft portion 54. In one embodiment, the fluid blowing device 60 may include the outlet 52 formed in at least one of the clamping portions 53A and 53B.

[0035] The substrate manufacturing apparatus includes a control device 40 (see FIG. 3) that controls the operation of the roller rotation device 70. The control device 40 is electrically connected to the roller rotation device 70 and configured to rotate the holding roller 51 via the roller rotation device 70. When the holding roller 51 rotates with the stacked wafers Ws held by it, the stacked wafers Ws rotate together with the holding roller 51.

[0036] The control device 40 is configured to control the operation of the fluid blowing device 60. When the control device 40 drives the fluid supply device 62 with the on-off valve 63 open, the pressurized fluid is blown out from the blowing port 52 through the fluid supply line 61.

[0037] The control device 40 is configured to control the operation of the coating device 2. The control device 40 operates the roller rotation device 70 to rotate the stacked wafers Ws via the holding roller 51, and operates the coating device 2 to supply the filler F from above the stacked wafers Ws via the supply nozzle 4. By supplying the filler F while rotating the stacked wafers Ws, the gaps between the stacked wafers Ws are filled with the filler F over the entire circumference of the stacked wafers Ws.

[0038] In the embodiment shown in Figures 3 and 4, the substrate holding device 1 is equipped with a roller moving device 80 that moves the holding roller 51 between a contact position where the holding roller 51 contacts the peripheral portion of the stacked wafers Ws and a separation position where the holding roller 51 is separated from the peripheral portion of the stacked wafers Ws.

[0039] In one embodiment, the roller moving device 80 may include a linear actuator coupled to the roller rotating device 70. The roller moving device 80 is configured to move the holding roller 51 via the roller rotating device 70. The components of the roller moving device 80 are not particularly limited as long as they can move the holding roller 51 between the contact position and the separated position. In one embodiment, the roller moving device 80 may be a combination of a ball screw and a linear guide.

[0040] When the stacked wafers Ws transported to the substrate holding device 1 by a transport device (not shown) are held by the holding rollers 51, the roller moving device 80 moves the holding rollers 51 to a contact position. Thereafter, the fluid blowing device 60 removes air bubbles from the filler F applied to the gaps between the stacked wafers Ws. After removing the air bubbles, the roller moving device 80 moves the holding rollers 51 to a separating position when separating the stacked wafers Ws from the holding rollers 51. Thereafter, the stacked wafers Ws are transported to a post-processing module by a transport device (not shown).

[0041] 5(a) and 5(b) are diagrams illustrating how pressurized fluid is sprayed into the gaps between the stacked wafers. As shown in Fig. 5(a), the pressurized fluid is sprayed from the holding roller 51 onto the filler F on the gaps between the stacked wafers Ws, whereby the filler F is compressed.

[0042] As shown in FIG. 5(b), the air bubbles mixed in the filler F are compressed together with the filler F, and eventually become small enough that they do not adversely affect the knife edge portion NE. The size of the air bubbles reduced by the injection of the pressurized fluid does not return to their original size. In this way, the fluid blowing device 60 can remove the air bubbles from the filler F applied to the gaps between the stacked wafers Ws.

[0043] According to this embodiment, the fluid blowing device 60 can remove air bubbles from the filler F applied to the gaps between the stacked wafers Ws. Therefore, the substrate manufacturing apparatus can prevent defects such as cracks and chips from occurring in the knife edge portion NE due to air bubbles mixed in the filler F.

[0044] According to this embodiment, the fluid blowing device 60 can remove foreign matter (e.g., liquid, particles, etc.) adhering to the bevel portion B of the wafer W, and can keep the bevel portion B clean. Therefore, the substrate manufacturing apparatus can prevent defects from occurring in the wafer W due to foreign matter adhering to the bevel portion B of the wafer W.

[0045] 6 is a diagram showing the lamination process of the laminated wafers. As shown in FIG. 6, in a state where the wafer W1 and the wafer W3 (W4, W5) are bonded together, the back surface of the wafer W3 (W4, W5) is ground (thinned) to perform a grinding process. By repeating such a grinding process and stacking the wafer W3 (W4, W5) on the wafer W1, the thickness of the laminated wafer Ws in the thickness direction increases.

[0046] Fig. 7 is a diagram showing a clamp device that clamps stacked wafers with holding rollers. In the embodiment shown in Fig. 7, the roller rotation device 70 is not shown. As shown in Fig. 7, the substrate holding device 1 includes a clamp device 90 that moves the first clamping portion 53A and the second clamping portion 53B of the holding roller 51 closer to or farther away from each other. The clamp device 90 includes a first clamp actuator 56A connected to the first clamping portion 53A and a second clamp actuator 56B connected to the second clamping portion 53B.

[0047] Each of the clamp actuators 56A, 56B is configured to move each of the clamping portions 53A, 53B in the axial direction of the shaft portion 54. Each of the clamp actuators 56A, 56B is, for example, a piston rod. The control device 40 is configured to control the operation of each of the clamp actuators 56A, 56B.

[0048] The control device 40 can move the clamping units 53A and 53B in directions to move them closer to or farther away from each other by operating the clamp actuators 56A and 56B, respectively. With this configuration, the clamp device 90 can clamp stacked wafers Ws having various thicknesses.

[0049] 7, the blowing outlet 52 is formed on each of the inclined surfaces of the clamping parts 53A and 53B. In one embodiment, the blowing outlet 52 may be formed on the shaft part 54. In this embodiment as well, the blowing outlet 52 faces the gaps of the stacked wafers Ws, so that the fluid blowing device 60 can remove air bubbles from the filler F applied onto the gaps of the stacked wafers Ws.

[0050] Filler F is known to have the property of being hardened by heating. When using such a filler F, in order to effectively protect the knife edge portion NE, it is desirable to remove air bubbles from the filler F, and then supply high-temperature gas (i.e., a temperature required to harden the filler F) to the filler F to heat the filler F. The temperature required to harden the filler F is, in other words, the hardening temperature.

[0051] Therefore, the fluid blowing device 60 may be configured to supply a heated fluid heated to a curing temperature or higher from at least one of the multiple holding rollers 51. For example, the fluid blowing device 60 may include a heater 67 connected to the fluid supply line 61 (see FIG. 7).

[0052] The heated fluid, which is heated to the curing temperature or higher by passing the fluid flowing through the fluid supply line 61 through the heater 67, is blown out from the blowing port 52 of the holding roller 51 and cures the filler F applied onto the gaps between the stacked wafers Ws. In one embodiment, a pressurized fluid pressurized to a pressure required to remove air bubbles from the filler F may be heated to the curing temperature or higher, and the heated pressurized fluid may be supplied. With this configuration, the fluid blowing device 60 can remove air bubbles and cure the filler F.

[0053] In the embodiment shown in FIG. 3, four holding rollers 51 are arranged. Hereinafter, the holding roller 51 arranged downstream of the coating device 2 in the rotation direction of the stacked wafers Ws and adjacent to the coating device 2 is referred to as the first holding roller 51. The holding roller 51 arranged downstream of the first holding roller 51 in the rotation direction of the stacked wafers Ws and adjacent to the first holding roller 51 is referred to as the second holding roller 51. The holding roller 51 arranged downstream of the second holding roller 51 in the rotation direction of the stacked wafers Ws and adjacent to the second holding roller 51 is referred to as the third holding roller 51. The holding roller 51 arranged downstream of the third holding roller 51 in the rotation direction of the stacked wafers Ws and adjacent to the third holding roller 51 is referred to as the fourth holding roller 51.

[0054] In this case, the fluid blowing device 60 supplies unheated pressurized fluid from each of the first and second holding rollers 51 to remove air bubbles from the filler F, and supplies heated fluid from the third and fourth holding rollers 51 to harden the filler F from which the air bubbles have been removed. With this configuration, the filler F can be hardened immediately after air bubbles are removed from the filler F applied to the gaps of the stacked wafers Ws. Therefore, application of the filler F, removal of air bubbles, and hardening of the filler F can be performed in a short time, and as a result, the process time of the stacked wafers Ws can be shortened. In one embodiment, the heated fluid supplied from the third and fourth holding rollers 51 may be pressurized to a pressure required to remove air bubbles from the filler F.

[0055] Fig. 8 is a diagram showing another embodiment of the fluid blowing device. In the embodiment shown in Fig. 8, the fluid blowing device 60 is configured to switch between an unheated pressurized fluid and a heated fluid (pressurized fluid or unpressurized fluid). The fluid blowing device 60 includes a bypass line 66 branched off from a fluid supply line 61, a switching valve 65 connected to the fluid supply line 61 and the bypass line 66, and a heater 67 connected to the bypass line 66. The fluid blowing device 60 configured in this manner is connected to at least one of the multiple holding rollers 51.

[0056] The fluid blowing device 60 is configured to heat the fluid to be blown onto the peripheral portion of the laminated wafers Ws through a heater 67. The control device 40 is configured to control the operation of the fluid blowing device 60. The control device 40 operates the switching valve 65 to open the fluid supply line 61 and close the bypass line 66. With this operation, the fluid supplied from the fluid supply device 62 is supplied from the blowing port 52 without being heated.

[0057] The control device 40 switches the switching valve 65 to open the bypass line 66 and close the upstream side of the fluid supply line 61 (i.e., the fluid supply line 61 between the switching valve 65 and the fluid supply device 62). By such an operation, the fluid supplied from the fluid supply device 62 is heated by the heater 67, and the heated pressurized fluid is supplied from the outlet 52.

[0058] Fig. 9 is a diagram showing another embodiment of the coating device. As shown in Fig. 9, the coating device 2 may include a syringe body 20 filled with a filler F, an introduction part 21 that introduces the filler F in the syringe body 20 to a supply nozzle 4 through a support arm 3, a rod 22 that pushes out the filler F in the introduction part 21 to the supply nozzle 4, and an injection nozzle 23 that injects a pressurized fluid (e.g., nitrogen gas) into the filler in the syringe body 20.

[0059] There may be cases where air bubbles have already been mixed into the filler F inside the syringe body 20. Therefore, in the embodiment shown in Fig. 9, the injection nozzle 23 is configured to inject a pressurized fluid into the filler F supplied to the supply nozzle 4 (i.e., the filler F inside the syringe body 20) to remove air bubbles from the filler F before it is applied to the gaps between the stacked wafers Ws.

[0060] The control device 40 is configured to be able to control the operation of the injection nozzle 23. More specifically, the control device 40 is electrically connected to a fluid supply source (not shown) that supplies pressurized fluid through the injection nozzle 23. By injecting the pressurized fluid from the injection nozzle 23, air bubbles mixed in the filler F inside the syringe body 20 are compressed together with the filler F, and eventually become small enough that they do not adversely affect the knife edge portion NE (see FIGS. 5(a) and 5(b)).

[0061] In the above-described embodiment, an embodiment in which a substrate manufacturing apparatus including a substrate holding device 1 is applied to stacked wafers Ws has been described, but the substrate manufacturing apparatus according to this embodiment is applicable not only to stacked wafers Ws but also to general wafers W (i.e., non-stacked wafers). The stacked wafers Ws in this embodiment correspond to the wafer W, and the peripheral portion of the stacked wafers Ws corresponds to the bevel portion B of the wafer W. Therefore, the bevel portion B of the wafer W refers to the peripheral portion of the stacked wafers Ws.

[0062] The above-described embodiments have been described for the purpose of enabling a person having ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments are naturally possible for a person skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope according to the technical idea defined by the claims. [Explanation of symbols]

[0063] 1 Substrate holding device 2 Coating equipment 3 Support Arm 4 Supply Nozzle 20 Syringe body 21 Introduction 22 Rod 23 Injection nozzle 40 Control device 51 Retaining roller 52 Air Outlet 53A 1st clamping part 53B Second clamping part 54 Shaft 56A 1st clamp actuator 56B Second clamp actuator 60 Fluid blowing device 61 Fluid supply line 62 Fluid supply device 63 On-off valve 65 Switching valve 66 Bypass Line 67 Heater 70 Roller rotation device 71 Connecting rod 72 Motor 80 Roller moving device 90 Clamping device

Claims

1. a holding roller that rotates the substrate while holding a bevel portion of the substrate; a fluid blowing device connected to the holding roller and configured to blow a pressurized fluid onto the bevel portion held by the holding roller.

2. The fluid ejection device is a fluid supply line connected to an outlet formed in the holding roller; The substrate-holding device of claim 1 , further comprising: a fluid supply device connected to the fluid supply line.

3. The substrate holding device according to claim 1 , further comprising a clamping device that moves a first clamping portion and a second clamping portion of the holding roller, the first clamping portion and the second clamping portion clamping the bevel portion, closer to or farther apart from each other.

4. The substrate holding device according to claim 1 , further comprising a roller moving device that moves the holding roller between a contact position where the holding roller contacts the bevel portion and a spaced position where the holding roller is spaced from the bevel portion.

5. A substrate manufacturing apparatus for manufacturing a laminated substrate formed by bonding a first substrate and a second substrate, a holding roller that holds the laminated substrate and rotates the laminated substrate; a fluid blowing device connected to the holding roller and configured to blow a pressurized fluid into a gap between the laminated substrates held by the holding roller; and an application device that applies a filler to the gap.

6. The fluid ejection device is a fluid supply line connected to an outlet formed in the holding roller; The substrate manufacturing apparatus according to claim 5 , further comprising: a fluid supply device connected to the fluid supply line.

7. The substrate manufacturing apparatus according to claim 5, further comprising a clamping device that moves a first clamping portion and a second clamping portion of the holding roller, which clamp the bevel portion of the laminated substrate, closer to or farther apart from each other.

8. The substrate manufacturing apparatus according to claim 5, further comprising a roller moving device that moves the holding roller between a contact position where the holding roller contacts the bevel portion of the laminated substrate and a separation position where the holding roller is separated from the bevel portion.

9. The substrate manufacturing apparatus according to claim 5 , wherein the fluid ejection device includes a heater that heats the fluid to be ejected onto the bevel portion of the laminated substrate.

10. The substrate manufacturing apparatus according to claim 5 , wherein the coating device includes a supply nozzle that supplies the filler toward the gap and a spray nozzle that sprays a pressurized fluid onto the filler that is supplied to the supply nozzle.

11. A substrate manufacturing method for manufacturing a laminated substrate formed by bonding a first substrate and a second substrate, rotating the laminated substrate while holding the laminated substrate with a holding roller; applying a filler to the gaps in the laminated substrate; and blowing the pressurized fluid into the gap using a fluid blowing device connected to the holding roller and configured to blow the pressurized fluid into the gap.

12. The substrate manufacturing method according to claim 11 , wherein the step of blowing out the pressurized fluid includes the step of blowing out the pressurized fluid from a blowout port formed in the holding roller.

13. The substrate manufacturing method according to claim 11 , further comprising the step of moving a first clamping portion and a second clamping portion of the holding roller, the first clamping portion and the second clamping portion clamping the bevel portion of the laminated substrate, closer to or farther apart from each other.

14. The substrate manufacturing method according to claim 11 , further comprising the step of moving the holding roller between a contact position where the holding roller contacts the bevel portion of the laminated substrate and a spaced position where the holding roller is spaced from the bevel portion.

15. The substrate manufacturing method according to claim 11 , further comprising the step of heating a fluid to be sprayed onto the bevel portion of the laminated substrate.

16. The substrate manufacturing method according to claim 11 , further comprising the step of injecting a pressurized fluid into the filler material supplied to a supply nozzle that supplies the filler material toward the gap.

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